JP2007066691A - Assembling substrate of display device, and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an assembling substrate of a display device for preventing organic light emitting element from damages caused by moisture or out gas during a heat treatment, and also to provide its manufacturing method. <P>SOLUTION: In an OLED (organic EL display), a translucent circuit board 10a, an optical wavelength conversion layer 20a, an inorganic covering film layer 40a, and an organic light-emitting element 50a are included, while the optical wavelength conversion layer is formed in the translucent circuit board, and the inorganic covering film layer covers the optical wavelength conversion layer, the organic light-emitting element is arranged at an inorganic covering film layer 40a, and the translucent circuit board is formed with glass, quartz, or plastic materials. The inorganic covering film layer has a thickness ranging from 1 μm to 50 μm which is perfectly sufficient for preventing moisture or out gas in the optical wavelength conversion layer from spreading to the organic light-emitting element in the heat treatment, and the inorganic covering film layer has a multiple-layered structure, and the organic light-emitting element is easily formed on the flat surface of the inorganic covering film layer, while the optical wavelength conversion layer has a combination of a color filter (CF) layer, a color conversion medium (CCM) layer or a color filter layer, and a color conversion medium layer. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an assembly substrate for a display device and a method for manufacturing the same for preventing damage to an organic light emitting element due to moisture or outgas in heat treatment from 100 ° C. to 260 ° C.

  FIG. 1 is a cross-sectional view of a prior art OLED. In the conventional OLED, the glass substrate 10, the optical wavelength conversion layer 20 and the black matrix 30 alternately formed on the glass substrate 10, the organic coating layer 40 formed on the optical wavelength conversion layer 20, and the organic coating layer 40 are formed. And the organic light emitting device 50 assembled to the inorganic barrier layer 45.

  In addition, an inorganic barrier layer 45 is formed on the organic coating layer 40 in order to prevent damage to the organic light emitting element 50 due to moisture or outgas from the optical wavelength conversion layer 20 and the organic coating layer 40 in the heat treatment.

  After forming the organic coating layer 40 on the optical wavelength conversion layer 20, it is necessary to clean the surface of the organic coating layer 40, but moisture or outgas is easily absorbed in the opening of the organic coating layer 40 in the cleaning process, Moisture or outgas evaporates by other treatments and easily affects the organic light emitting element 50. Since the organic coating layer 40 is an organic material, moisture or outgas is easily generated from the organic coating layer 40, and organic light emission. The element 50 is likely to be damaged or affected.

  The present invention relates to an assembly substrate for a display device and a method for manufacturing the assembly substrate. In the assembly substrate, an inorganic barrier layer is formed on an optical wavelength conversion layer or an inorganic coating layer, and moisture or The organic light emitting device is prevented from being damaged by outgas, and the optical wavelength conversion layer is prevented from being damaged by the cleaning treatment before the inorganic coating layer is formed.

  Furthermore, in the present invention, since the inorganic coating layer produced by the inorganic material is provided, the structure of the inorganic coating layer is very simple, and the inorganic coating is difficult to absorb moisture or outgas, thereby the inorganic coating layer. The layer can prevent damage to the organic light emitting device due to moisture or outgas generated from the transparent substrate.

  The assembly substrate according to one aspect of the present invention includes a transparent substrate, an optical wavelength conversion layer, and an inorganic coating layer. The optical wavelength conversion layer is formed on the transparent substrate, and the inorganic coating layer is the optical wavelength conversion layer. The assembly substrate is used to support the organic light emitting device, and the assembly substrate and the organic light emitting device are assembled together to form a display device.

  Further, in the assembly substrate, an inorganic barrier layer is formed on the optical wavelength conversion layer or the inorganic coating layer in order to prevent damage to the organic light emitting element due to moisture or outgas generated from the optical wavelength conversion layer in the heat treatment.

  As another aspect of the present invention, the method for manufacturing an assembly substrate includes providing a transparent substrate, forming an optical wavelength conversion layer on the transparent substrate, and coating an inorganic coating layer on the optical wavelength conversion layer.

  Furthermore, the manufacturing method of the assembly substrate includes the formation of an inorganic barrier layer with an optical wavelength conversion layer or an inorganic coating layer. Further, after the inorganic barrier layer is formed on the optical wavelength conversion layer, the organic light-emitting element is made inorganic. In addition to being able to be assembled with the barrier layer to form a display device, the manufacturing method of the assembly substrate includes a planarization treatment after covering the optical wavelength conversion layer or the inorganic barrier layer with the inorganic coating layer.

  The foregoing general description and the following detailed description are exemplary and are provided to provide a further understanding of the invention. Other advantages and features of the invention are described below. It will be apparent from the description, drawings, and claims.

  FIG. 2 is a cross-sectional view of the OLED (organic EL display) of Example 1 of the present invention. The OLED 1a includes a transparent substrate 10a, an optical wavelength conversion layer 20a, an inorganic coating layer 40a, and an organic light emitting element 50a. The optical wavelength conversion layer 20a is formed on the transparent substrate 10a, the inorganic coating layer 40a covers the optical wavelength conversion layer 20a, the organic light emitting element 50a is disposed on the inorganic coating layer 40a, and the transparent substrate 10a is made of glass or quartz. Alternatively, the transparent substrate 10a has an active matrix or simple matrix system such as a TFT (thin film transistor), and the organic light emitting element 50a is an OLED (organic light emitting diode) or PLED (polymer light emitting diode). ).

  Furthermore, the inorganic coating layer 40a is made of silicon oxide, silicon nitride, silicon oxynitride, silicon carbide, titanium oxide, titanium nitride, zirconium oxide, zirconium nitride, aluminum oxide, aluminum nitride, tin oxide, indium oxide, lead oxide, boron oxide. , Calcium oxide, SiOxCiHj, SiNyCiHj, SiOxNyCiHj, and the inorganic coating layer 40a prevents moisture or outgas from spreading to the organic light emitting device 50a in the heat treatment. The inorganic coating layer 40a has a multilayer structure, and the organic light emitting element 50a is easily formed on the flat surface of the inorganic coating layer 40a. The optical wavelength conversion layer 20a has a thickness of 1 μm to 50 μm. Color filter (CF) layer, color conversion medium (CCM) layer, or a combination of a color filter layer and a color conversion medium layer, and the organic light emitting device 50a can be white or blue, and further, inorganic to ensure the display effect of the OLED. The coating layer 40a has a transmittance exceeding 80%.

  FIG. 3 is a cross-sectional view of the OLED 1b according to the second embodiment of the present invention. The OLED 1b according to the second embodiment of the present invention prevents damage to the organic light emitting device 50b due to moisture or outgas in the optical wavelength conversion layer 20b. In order to prevent damage to the wavelength conversion layer 20b, the inorganic barrier layer 35b can be formed on the optical wavelength conversion layer 20b by CVD (chemical vapor deposition) or PVD (physical vapor deposition).

  FIG. 4 is a cross-sectional view of the OLED 1c of Example 3 of the present invention. In addition to forming the inorganic barrier layer 35c on the optical wavelength conversion layer 20c, the inorganic barrier layer 45c is formed on the inorganic coating layer 40c by the CVD or PVD method. The inorganic barrier layers 35c and 40c can not only prevent damage to the organic light emitting device 50c due to moisture or outgas in the optical wavelength conversion layer 20c, but also can be used to form transparent electrodes by an etching solution in device pattern creation. Although damage can also be prevented, the inorganic barrier layer (35b, 35c, or 45c) is thinner than the barrier layer 45 of the prior art, in other words, the thickness of the inorganic barrier layer (35b, 35c, or 45c) is 500 × 10-10 m to 5000 × 10 −10 m have the same effect as the prior art, and the inorganic barrier layer (35b, 35c or 45c) can be a multilayer structure.

  5A to 5C are three cross-sectional views of manufacturing the OLED according to the first embodiment of the present invention, and FIG. 6 is a flowchart of the manufacturing method of the assembled substrate according to the first embodiment of the present invention. In this manufacturing method, the formation of the optical wavelength conversion layer 20a on the glass substrate or the bright substrate 10a (S100) with the TFT array and the transparent substrate 10a (S102) is provided, and the pattern of the optical wavelength conversion layer 20a is a black matrix. 30a, and the optical wavelength conversion layer 20a is covered with the inorganic coating layer 40a (S104). Furthermore, the inorganic coating layer 40a is made of silicon oxide, silicon nitride, silicon oxynitride, silicon carbide, titanium oxide, titanium nitride. , Zirconium oxide, zirconium nitride, aluminum oxide, aluminum nitride, tin oxide, indium oxide, lead oxide, The inorganic coating layer 40a is formed by a material selected from the group including boron oxide, calcium oxide, SiOxCiHj, SiNyCiHj, and SiOxNyCiHj, and can be formed by a CVD, PVD, or SOG (spin-on-glass) method. The inorganic coating layer 40a has a multilayer structure, and the method further includes assembling the organic light emitting device 50a with the inorganic coating layer 40a.

  Further, the inorganic coating layer 40a has a thickness of 1 μm to 50 μm, and the inorganic coating layer 40a covers the optical wavelength conversion layer at a temperature from 20 ° C. to 300 ° C. and a pressure from 0.0005 Torr to 1 atm.

  The method also includes the formation of an inorganic barrier layer with an optical wavelength conversion layer or an inorganic coating layer, and further, an inorganic barrier layer is formed to form a display device after the inorganic barrier layer is formed on the optical wavelength conversion layer. An organic light emitting device can be assembled in the layer, and the method includes a planarization treatment after covering the optical wavelength conversion layer or the inorganic barrier layer with the inorganic coating layer.

  In summary, the inorganic barrier layer (35b, 35c, or 45c) can damage the organic light emitting device (50a, 50b, or 50c) due to moisture or outgas from the optical wavelength conversion layer (20a, 20b, or 20c) in the heat treatment. It is provided to prevent damage to the optical wavelength conversion layer (20a, 20b, or 20c) due to the cleaning treatment after the formation of the inorganic coating layer (40a, 40b, or 40c).

  Furthermore, since the inorganic coating layer (40a, 40b, or 40c) is made of an inorganic material, the structure of the inorganic coating layer (40a, 40b, or 40c) is very simple, and the inorganic coating layer (40a, 40b, 40c, Or 40c) hardly absorbs moisture or outgas, so that the inorganic coating layer (40a, 40b, or 40c) is an organic light-emitting device (moisture or outgas generated from the transparent substrate (10a, 10b, or 10c)). Damage to 50a, 50b, or 50c) can be prevented.

  Although the present invention has been described with reference to some of the best embodiments, the present invention is not limited thereto, and various replacements and modifications have been proposed in the above description, and the ordinary skill of this technology is described. All such substitutions and modifications are intended to be included within the scope of the appended claims as defined by the appended claims.

The various objects and advantages of the present invention can be better understood when combined with the following accompanying drawings when reading the detailed description.
Cross-sectional view of conventional OLED OLED sectional view of Example 1 of the present invention OLED sectional view of Example 2 of the present invention OLED sectional view of Example 3 of the present invention Sectional drawing of OLED manufacture of Example 1 of this invention Sectional drawing of OLED manufacture of Example 1 of this invention Sectional drawing of OLED manufacture of Example 1 of this invention 1 is a flowchart of a method for manufacturing an assembly board according to a first embodiment of the present invention.

Explanation of symbols

1 OLED
DESCRIPTION OF SYMBOLS 10 Board | substrate 20 Optical wavelength conversion layer 30 Black matrix 40 Coating layer 45 Barrier layer 50 Organic light emitting element 1a, 1b, 1c OLED
10a, 10b, 10c Substrate 30a, 30b, 30c Black matrix 20a, 20b, 20c Optical wavelength conversion layer 35b, 35c Inorganic barrier layer 45c Inorganic barrier layer 40a, 40b, 40c Inorganic coating layer 50a, 50b, 50c Organic light emitting device

Claims (20)

It is composed of a transparent substrate, an optical wavelength conversion layer formed on the transparent substrate, and an inorganic coating layer covering the optical wavelength conversion layer. The organic light-emitting element is supported and assembled with the organic light-emitting element to form a display device. Assembled board. 2. The assembly substrate according to claim 1, wherein the inorganic coating layer has a thickness of 1 μm to 50 μm. 2. The assembly substrate according to claim 1, wherein an inorganic barrier layer is formed on the optical wavelength conversion layer. 2. The assembly substrate according to claim 1, wherein an inorganic barrier layer is formed on the inorganic coating layer. 5. The assembly substrate according to claim 4, wherein the inorganic barrier layer has a thickness of 500 × 10 ⁻¹⁰ m to 5000 × 10 ⁻¹⁰ m. The assembly substrate according to claim 4, wherein the inorganic barrier layer has a multilayer structure. Inorganic coating layer is silicon oxide, silicon nitride, silicon oxynitride, silicon carbide, titanium oxide, titanium nitride, zirconium oxide, zirconium nitride, aluminum oxide, aluminum nitride, tin oxide, indium oxide, lead oxide, boron oxide, calcium oxide, 2. The assembly substrate according to claim 1, wherein the assembly substrate is made of a material selected from a group including SiOxCiHj, SiNyCiHj, and SiOxNyCiHj. 2. The assembly substrate according to claim 1, wherein the optical wavelength conversion layer is a color filter layer, a color conversion medium layer, or a combination of a color filter layer and a color conversion medium layer. The assembly substrate according to claim 1, wherein the inorganic coating layer has a multilayer structure. 2. The assembly substrate according to claim 1, wherein the organic light emitting element is an OLED (organic light emitting diode) or a PLED (polymer light emitting diode), and the transparent substrate is made of glass, quartz, or a plastic material. A method for producing an assembled substrate, comprising: providing a transparent substrate; forming an optical wavelength conversion layer on the transparent substrate; and covering the inorganic coating layer on the optical wavelength conversion layer. 12. The assembly substrate according to claim 11, wherein the inorganic coating layer has a thickness of 1 μm to 50 μm produced by a CVD (chemical vapor deposition) PVD (physical vapor deposition) or SOG (spin on glass) method. Manufacturing method. 12. The method of manufacturing an assembled substrate according to claim 11, wherein the inorganic coating layer covers the optical wavelength conversion layer at a temperature of 20 to 300 [deg.] C. and a pressure of 0.0005 torr to 1 atm. 12. The method for manufacturing an assembly substrate according to claim 11, wherein an inorganic barrier layer is formed on the optical wavelength conversion layer. The method of manufacturing an assembly substrate according to claim 14, wherein an organic light emitting element is assembled to the inorganic barrier layer after the inorganic barrier layer is formed on the optical wavelength conversion layer. 12. The method for manufacturing an assembly substrate according to claim 11, wherein an inorganic barrier layer is formed on the inorganic coating layer. The method of manufacturing an assembly substrate according to claim 16, wherein the inorganic barrier layer has a thickness of 500 × 10 ⁻¹⁰ m to 5000 × 10 ⁻¹⁰ m. The method of manufacturing an assembly substrate according to claim 16, wherein the inorganic barrier layer or the inorganic coating layer has a multilayer structure. Inorganic coating layer is silicon oxide, silicon nitride, silicon oxynitride, silicon carbide, titanium oxide, titanium nitride, zirconium oxide, zirconium nitride, aluminum oxide, aluminum nitride, tin oxide, indium oxide, lead oxide, boron oxide, calcium oxide, 12. The method of manufacturing an assembly substrate according to claim 11, wherein the assembly substrate is made of a material selected from a group including SiOxCiHj, SiNyCiHj, and SiOxNyCiHj. 12. The method for manufacturing an assembly substrate according to claim 11, wherein the optical wavelength conversion layer is flattened after being covered with an inorganic coating layer.

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