JP2007065335A - Imaging apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an imaging apparatus having a compound-eye optical system achieving high-pixel with simple constitution without increasing parallax and also having the high degree of freedom in designing an angle of view and an f-number. <P>SOLUTION: Space between the optical axes of the respective lens parts of the compound-eye optical system is extended by inserting a parallel plate prism inclined to the respective optical axes of the compound-eye optical system between the compound-eye optical system and an imaging device equipped with a plurality of imaging areas to pick up a plurality of object images formed by the compound-eye optical system. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an imaging apparatus having a compound eye optical system.

  Conventionally, various forms have been proposed as an imaging apparatus including a compound eye optical system. The imaging apparatus disclosed in Japanese Patent Laid-Open No. 2001-078212 has a plurality of imaging units that receive a subject image with a compound eye optical system, and each of the compound eye optical system and the plurality of imaging units corresponds. The imaging unit is configured to receive the subject images of the subject at a predetermined distance at least with a predetermined amount shifted from each other, and can form a higher resolution image by synthesizing the captured image signals. it can.

  However, in the above conventional example, there is a parallax due to the compound eye optical system, and there is a problem that when the number of pixels is increased, the parallax is increased and the quality of the image is lowered.

  In view of this, the imaging apparatus disclosed in Japanese Patent Application Laid-Open No. 2002-158913 has a configuration including a reflection mirror that refracts the optical axis of an object image incident on each imaging means of the compound-eye optical system. FIG. 15 is a schematic view of the image pickup apparatus in this conventional example viewed from the subject side, and FIG. 16 is a view of the image pickup apparatus in FIG. 15 viewed from the lower surface side.

  In FIG. 15, reference numeral 1 denotes a C-MOS sensor which integrally forms an image processing circuit (not shown), and includes an R (red) light sensor 1 a, a G (green) light sensor 1 b, 1 d, and a B (blue) light sensor 1 c. have. Corresponding to these four sensors, imaging lenses 2a, 2b, 2d, and 2c are provided, respectively. In this embodiment, the center positions of the imaging lenses 2a to 2d and the sensors 1a to 1d are separated by a predetermined distance. That is, as shown in FIG. 15, the optical paths shown in the vectors (A) to (D) are bent, and this corresponds to the distance d between the imaging lenses 2a and 2b and the imaging lenses 2c and 2d. The imaging lenses 2a to 2d and the sensors 1a to 1d are arranged so that the distance D between the sensors 1a and 1b and the sensors 1c and 1d to be increased.

  As shown in FIG. 16, the subject light incident on the G sensor 1b is collected by a lens 2b integrally formed with a color filter (not shown) and formed on the sensor 1b through mirrors 5 and 6. Because it is. This makes it possible to establish the relationship between light collection and imaging in a state where the optical axis of the lens 2b and the central axis of the G sensor 1b are shifted outward by (D−d) / 2.

  Similarly, the light beam that passes through the lens 2c passes through a color filter (not shown) and is then reflected by the mirrors 3 and 4 to be imaged on the B sensor 1c with the optical axis shifted outward by the same (D−d) / 2. The

  By the way, the subject image formed by these imaging lenses 2a to 2d is a pixel shifting technique for sampling a position shifted by 0.5 pixels in a subject at a predetermined distance when sampled on the optical sensors 1a to 1d. Is used. The arrangement of the color filters as described above makes it possible to take an image similar to a known Bayer arrangement.

  In this way, while the distance D between the sensors 1b and 1c is increased as the number of pixels is increased, the distance d between the imaging lenses 2b and 2c that form an image on each pixel can be reduced. By bending the optical path of the imaging lenses 2a to 2d sideways, the thickness between the imaging lenses 2a to 2d and the sensors 1a to 1d (from the lens 2b to the sensor 1b) with respect to the focal length of the imaging lenses 2a to 2d. Therefore, it is possible to keep the parallax determined by the distance between the lenses small and to increase the number of pixels for imaging.

For example, Patent Document 1 and Patent Document 2 can be cited as conventional examples.
JP 2001-78212 A JP 2002-158923 A

  However, the conventional example has the following problems.

  (1) In order to insert a mirror between the optical system and the image sensor, it is necessary to increase the focal length, and a sufficient field angle for photographing cannot be obtained.

  (2) Further, in order to place the mirror in a limited space between the optical system and the image sensor, it is necessary to reduce the beam diameter, and in this case, an F number sufficient for photographing cannot be obtained.

  The present invention has been made to solve such problems, and achieves an increase in the number of pixels with a simple configuration without increasing parallax, and has a high degree of freedom in designing the angle of view and the F number. The purpose is to provide. Furthermore, it is possible to realize a configuration that takes into consideration the manufacturing process, a reduction in size and cost reduction by an efficient layout of the image sensor.

  In order to solve the above-described problems, the present invention includes a compound eye optical system and an image sensor including a plurality of imaging regions that capture a plurality of object images formed by the compound eye optical system, and is obtained from the image sensor. In an imaging apparatus that forms a single image by combining a plurality of imaging signals corresponding to a plurality of object images, between the compound eye optical system and the imaging element, an inclination with respect to each optical axis of the compound eye optical system A parallel plate optical member is inserted to change the parallax in at least one direction of the compound eye optical system.

  Therefore, it is possible to realize a high pixel count in an imaging apparatus including a compound eye optical system without being restricted by the focal length and the F number.

  The plurality of imaging regions are provided separately from each other, and the one direction is made to coincide with the longitudinal direction of the imaging region. Therefore, it is possible to reduce the size and cost by an efficient layout of the image sensor.

  The optical member may also serve as a packaging member for sealing the image sensor from outside air. Therefore, the number of pixels can be increased, and the degree of freedom in the manufacturing process is increased.

  Furthermore, a peripheral circuit of the image sensor is provided in an area between the plurality of image areas. Therefore, it is possible to reduce the size and cost by an efficient layout of the image sensor.

  As described above, the present invention includes a compound eye optical system, and an image sensor including a plurality of imaging regions that capture a plurality of object images formed by the compound eye optical system, and the plurality of image elements obtained from the image sensor. In an imaging apparatus that forms a single image by combining a plurality of imaging signals corresponding to an object image, parallel tilted with respect to each optical axis of the compound-eye optical system between the compound-eye optical system and the imaging element A flat optical member is inserted to change the parallax in at least one direction of the compound eye optical system.

  Therefore, it was possible to realize a high pixel count in an imaging apparatus equipped with a compound eye optical system without being restricted by the focal length and F number.

  In addition, the plurality of imaging regions are provided apart from each other, and the one direction coincides with the longitudinal direction of the imaging region. Therefore, it is possible to reduce the size and cost by an efficient layout of the image sensor.

  The optical member also serves as a packaging member for sealing the image pickup device from the outside air. Therefore, the number of pixels can be increased, and the degree of freedom in the manufacturing process can be increased.

  Furthermore, a peripheral circuit of the image sensor is provided in an area between the plurality of image areas. Therefore, it is possible to reduce the size and cost by an efficient layout of the image sensor.

(First embodiment)
1 to 3 show an image pickup apparatus according to a first embodiment of the present invention, and FIG. 1 is a schematic view of the image pickup apparatus viewed from the side.

  In FIG. 1, reference numeral 100 denotes an image pickup element composed of a C-MOS sensor, 101 denotes a compound eye lens, and a light-shielding diaphragm layer 102 having a plurality of openings on the incident surface side is formed by means such as metal film deposition.

  FIG. 2 is a view of the image pickup device 100 in FIG. 1 as viewed from the compound eye lens 101 side, and includes four image pickup regions 100a, 100b, 100c, and 100d. A color filter (not shown) is formed in each pixel in the imaging regions 100a to 100d. The color filters 100a and 100d are green, 100b is blue, and 100c has a spectral transmittance mainly including blue. . In addition, an image sensor peripheral circuit portion 103 such as an AD conversion circuit, a timing generation circuit, and a power supply circuit is formed in the peripheral portion. In the figure, points A, B, C, and D represent the center points of the imaging regions 100a, 100b, 100c, and 100d, and accordingly, the imaging regions 100a, 100b, 100c, and 100d are respectively line segments AB (CD) in the horizontal direction. However, they are arranged in the vertical direction so as to be separated from each other by a line segment AC (BD), and have a rectangular array that is long in the horizontal direction as indicated by dotted lines in the figure.

  3A and 3B are views of the compound eye lens 101 in FIG. 1 viewed from the image sensor 100 side and the subject side. The compound eye lens 101 includes four lens portions 101a, 101b, 101c, and 101d having spherical or aspherical shapes corresponding to the imaging regions 100a to 100d. The light-shielding diaphragm layer 102 is formed on the entire object side of the compound eye lens 101, and similarly has four openings 102a, 102b, 102c, and 102d. Note that an infrared cut filter layer (not shown) is coated in the vicinity of the openings 102a to 102d so that the wavelength of light that has passed through the openings 102a to 102d removes infrared components that adversely affect imaging. It has become. In the figure, points La, Lb, Lc, and Ld represent the optical axes of the lens portions 101a, 101b, 101c, and 101d, and are in a rectangular array as represented by dotted lines in the figure. 1 corresponds to a horizontal cross section in FIG. 2 or FIGS. 3A and 3B, and includes imaging regions 100a and 100b, lens portions 101a and 101b, openings 102a and 102b, optical axes La and Lb. However, since the cross sections in the imaging regions 100c and 100d have the same configuration, the illustration is omitted.

  As described above, the present embodiment has a configuration including four imaging regions and four imaging optical systems. In this embodiment, since the imaging areas 100a to 100d are arranged on a rectangular array adjacent to each other, optical crosstalk occurs in which the light flux that has passed through the aperture 102a is mixed into the imaging area 102d. . Therefore, a color filter layer (not shown) having a spectral transmittance similar to that of the color filters of the imaging regions 100a to 100d is also formed in each of the openings 102a to 102d. Therefore, the wavelength of the light that has passed through the opening 102a is a green component, and even if mixed in the imaging region 100b having the adjacent blue color filter, the light already has only a green component, so no crosstalk occurs. In this way, optical crosstalk is completely prevented.

  Returning to FIG. 1, reference numeral 104 denotes a prism having a parallel plate formed in a V shape, which plays a role of changing the parallax in the horizontal direction, and has a shape bent on the V shape by an inclination angle θ. Here, the light beam incident on the parallel plate optical member is shifted depending on the incident angle, the refractive index, and the thickness, and the angle of the emitted light beam has the same characteristic as that of the incident light beam.

  FIG. 4 is a diagram showing light refraction by the parallel plate. At this time, the angle θ1 formed between the light beam incident on the parallel flat plate and the light beam exiting is equal. If the refractive index of the parallel flat plate optical member is n and the thickness is t as shown in FIG. It can be represented by the following formula (1).

d = ((n−1) / n) × t × Sin θ1 (1)
It is apparent from FIG. 4 that θ1 is equal to the inclination angle θ of the prism 4 in FIG.

  In this embodiment, this characteristic is utilized, and the distance between the optical axes La and Lb (line segment LaLb or LcLd) in FIGS. 3A and 3B is substantially equal to the distance between line segments AB (CD) in FIG. Shift the light so that it expands. Accordingly, in FIG. 1, the optical axes La and Lb of the lens portions 101a and 101b are shifted in the horizontal direction depending on the inclination angle θ, thickness t, and refractive index n of the prism 104, and are substantially center points A and B on the imaging regions 100a and 100b. It has come to intersect with. Strictly speaking, the optical axes La and Lb do not intersect with the center points A and B on the image sensor 100. This is because the pixel shift technique is used in this embodiment as well as in the conventional Japanese Patent Application Laid-Open No. 2001-078212. Hereinafter, the case where pixel shift is used will be described in detail.

  In order to achieve pixel shifting, assuming that the pixel pitch of the image sensor 100 is PP, the center point interval AB (CD) in the horizontal direction of the image pickup region is Sh, and the center point interval AC (BD) in the vertical direction is Sv. The horizontal interval Ih and the vertical interval Iv of the subject image formed on the region are expressed by the following equations (2) and (3).

Ih = Sh−0.5 × PP (2)
Iv = Sv−0.5 × PP (3)
As shown in FIGS. 3A and 3B, when the horizontal optical axis interval LaLb (LcLd) in the compound eye lens 101 is Lh and the vertical optical axis interval LaLc (LbLd) is Lv, each optical axis interval is set. Lh and Lv are expressed by the following equations (4) and (5).

Lh = Ih−2 × d−ΔLh (4)
Lv = Iv−ΔLv (5)
Here, ΔLh and ΔLv are optical axis interval correction amounts for shifting the pixel with respect to a subject at a finite distance, and are 0 when performing pixel shifting with respect to a subject at infinity. Since the apparatus is designed for a subject with a finite distance, the optical axis distances Lh and Lv are preferably corrected. In this embodiment, pixels are shifted from each other in the four imaging regions 100a to 100d, so that an image equivalent to a known Bayer array can be obtained. Note that a method for generating a Bayer array image from four imaging regions is disclosed in Japanese Patent Laid-Open No. 2002-209226, and thus detailed description thereof is omitted.

  As described above, in this embodiment, the horizontal optical axis interval Lh in the compound eye lens 101 is expanded to Ih on the image sensor 100 due to the light beam shift of the prism 104. In general, since the captured image has a horizontally or vertically long rectangular shape, as the number of pixels increases, the imaging area interval Sh in the long side direction of the imaging areas 100a to 100d increases particularly as shown in FIG. However, in this embodiment, the substantial parallax is reduced by the light beam shift. Therefore, an increase in parallax can be prevented even when the number of pixels is increased, and high-resolution color can be obtained by performing various processing such as image composition on an image captured in each of the imaging regions 100a to 100d by an image processing device (not shown). An image can be obtained. In addition, a free imaging apparatus can be designed without being constrained by conditions such as increasing the focal length as in the conventional example, or darkening the F-number to narrow the luminous flux. Furthermore, as shown in FIG. 2, the layout of the imaging regions 100a to 100d on the imaging device 100 can also be efficiently arranged adjacent to the rectangular imaging region. Made possible. Furthermore, by downsizing the image sensor, the number of image sensors 100 that can be formed on one wafer can be increased, which is advantageous from the viewpoint of cost reduction.

  Note that, with respect to the light beam that forms an image particularly in the peripheral portion of each of the imaging regions 100a to 100d, aberration is caused by inserting the inclined prism 104 into the optical path. Since this aberration is not an axially symmetric aberration about the optical axes La to Ld, it is better to perform an optical design including a lens portion and a prism without significantly degrading the image quality of the color image at the time of image synthesis. Further, the parallel plate prism 104 may be formed of a free-form surface to correct such aberration.

  Finally, in this embodiment, the light beam is shifted by the prism 104 in the horizontal direction of the image sensor 100 in FIG. 2, but it is also possible in the vertical direction, and it is also possible to shift both in the horizontal and vertical directions simultaneously. FIG. 5 is a schematic perspective view showing an example of the prism used at this time. Each of the four parallel plates is inclined toward the center. By using such a prism, it is possible to realize a simultaneous light beam shift in the horizontal and vertical directions.

(Second embodiment)
The second embodiment is a modification of the first embodiment, and an inclined prism also serves as a packaging member of the image sensor, and a higher quality image can be obtained by aligning the horizontal and vertical parallaxes. I made it.

  FIG. 6 is a schematic view of the imaging apparatus as viewed from the side. In FIG. 6, the wiring board 105 is electrically bonded on the image sensor 100 by gold bumps (not shown) formed on the electrode pads (not shown) of the image sensor 100, and further held on the wiring board 105. A member 106 is arranged, and three of them are packed with an adhesive sealant 107. A prism 104 is disposed above the holding member 106 and is similarly packed with an adhesive sealant 107. The compound eye lens 101 is bonded and fixed to the uppermost surface side of the holding member via the adhesive layer 108.

  Thus, in this embodiment, the imaging region of the imaging device 100 is completely sealed by the prism 104, the wiring board 105, the holding member 106, and the adhesive sealant 107. Therefore, in the manufacturing process, the assembly up to the imaging device 100, the wiring board 105, the holding member 106, and the prism 104 is performed in a clean room, and the assembly process of the compound eye lens 101 has an effect of adding flexibility not limited to the clean room. .

  On the other hand, a light-shielding stop 109 having an opening is provided on the upper surface side of the prism 104 and plays a role of preventing optical crosstalk. Similarly, the holding member 106 also includes a partition wall 106a at the center.

  FIG. 7 is a diagram of the imaging device 100 according to the second embodiment as viewed from the upper surface side. The imaging regions 100a to 100d are formed across a shaded region 110 where pixels for receiving light are not formed. Therefore, as shown in FIG. 6, it is possible to form a partition wall 106a above the shaded area 110. Here, since FIG. 6 is a schematic diagram in the horizontal direction in FIG. 7, the vertical direction is not shown, but a partition wall is similarly provided in the vertical direction and is formed on the shaded area 110 in FIG. 7. Therefore, the horizontal and vertical partition walls have a cross shape when viewed from the compound eye lens 101 side as shown in FIG. At this time, it is preferable that the hatched area 110 has a minimum dimension in which a partition wall can be disposed on the upper part. By doing so, the size of the image sensor 100 can be reduced, and the cost can be reduced.

  FIG. 8 is a diagram illustrating a state in which the wiring substrate 105 is disposed on the upper surface of the image sensor 100, and is a diagram seen from the compound eye lens 101 side in FIG. In the wiring board 105, an opening 105a for guiding the light beam to the imaging regions 100a to 100d is formed. The wiring board is provided with wiring (not shown) for taking out an imaging signal, and the imaging signal can be sent to an image processing apparatus (not shown).

  9 is a view of the light-shielding stop 109 in FIG. 6 as viewed from the compound eye lens 100 side, and includes four openings 109a, 109b, 109c, and 109d corresponding to the imaging regions 100a to 100d and the lens portions 101a to 101d. The light-shielding diaphragm 109 is formed of a metal thin plate or the like, and is subjected to a plating process for preventing reflection. In addition, bending is performed along the shape of the upper surface of the prism 4. In this embodiment, the optical crosstalk is prevented by the partition 106 a and the light-shielding stop 109 of the holding member 106. Therefore, since it is not necessary to form a color filter layer in the opening of the light-shielding diaphragm layer 102, there is an effect of cost reduction, and since there is only one color filter layer, the light transmittance can be remarkably improved and the sensitivity is high. An imaging device can be realized.

  FIG. 10 is a view of the compound eye lens 101 in FIG. 1 as viewed from the image sensor 100 side. Also in the second embodiment, the lens portions 101a to 101d are formed in a rectangular array, but Lh = Lv, that is, formed in a square array. Then, the optical axis interval Lh in the horizontal direction is enlarged by the prism 104, and a subject image is formed by shifting the pixels on the imaging regions 100a to 100d provided separated by Sh. Here, in this embodiment, Lh = Lv, and the parallax in the horizontal and vertical directions is constant. This effect will be described with reference to FIG.

  FIG. 11 is a graph showing the subject distance in the compound eye lens and the amount of image movement on the image sensor at that time. The horizontal axis represents the subject distance, and the vertical axis represents the amount of image movement. The point E on the vertical axis is the case where the movement amount of the image of just 0.5 pixels, that is, the shift of 0.5 pixels is established. Then, if the movement amount of the image of ± 0.25 pixels around the point E, that is, the range in which the pixel shift effect is effective up to the points F and G in the figure, the subject distance corresponding to the point F as is apparent from the figure The object distance corresponding to the point H and the point G is infinite, and as a result, an object distance greater than or equal to the point H becomes a range that can be photographed. A solid line 111 represents the amount of image movement in the present embodiment. In this embodiment, the horizontal and vertical optical axis intervals are set to Lh = Lv as shown in FIG. Is represented by this solid line 111. A dotted line 112 represents the amount of image movement in the horizontal direction when the solid line 111 in the case of Lh> Lv as the amount of movement of the image in the vertical direction as in the first embodiment. In this case, the moving amount of the image is larger than the solid line 111 as the subject distance approaches the closest side. Therefore, when photographing on the close side, a difference occurs in the horizontal and vertical resolutions of the composite image. Therefore, it is necessary to limit the object distance that can be photographed on the close side. However, in this embodiment, since the optical axis interval Lh = Lv is set so that the movement amounts of the images in the horizontal and vertical directions are uniform, it is possible to photograph well up to the closest side.

  In this embodiment, the prism 104, the holding member 106, and the wiring board 105 are packed with the adhesive sealant 107 as the package member of the image sensor 100. However, the holding member 106 may be omitted. This is a well-known configuration of the image sensor 100 package, and is disclosed in Japanese Patent No. 3207319. However, when applied to the present invention, the distance between the image areas is increased so that optical crosstalk does not occur. It is necessary to take measures.

(Third embodiment)
The third embodiment is a modification of the above-described embodiment, and realizes downsizing and cost reduction of the image sensor by improving the layout of the image sensor.

  FIG. 12 is a schematic view of the image pickup apparatus according to the third embodiment as viewed from the side. In this figure, a peripheral circuit unit 103 of the image sensor 100 is provided in an area between two image areas 100 a and 100 b of the image sensor 100.

  FIG. 13 is a diagram of the image sensor 100 according to the third embodiment as viewed from the compound eye lens 101 side. A peripheral circuit unit 103 is provided between the imaging regions in the horizontal direction of the four imaging regions 100a to 100d. Therefore, since the shaded area 110 in the second embodiment can be effectively used, the area of the image sensor 100 can be reduced. Since a large number of image pickup devices 100 are formed on one wafer and diced into one image pickup device, reducing the area has a tremendous effect not only in reducing the size of the image pickup apparatus but also in terms of cost reduction. There is.

  In this embodiment, since the peripheral circuit unit 103 is provided between the imaging regions, the horizontal imaging region interval is increased as compared with the first and second embodiments. Therefore, the inclination angle and thickness of the prism 104 shown in FIG. 12 are increased, and the light beam shift amount is increased. As in the second embodiment, the parallax of the compound eye lens 101 is equal in both horizontal and vertical directions so that a high-quality image can be obtained.

  In FIG. 12, the partition wall of the holding member 106 is not provided between the two imaging regions 100 a and 100 b, that is, above the peripheral circuit unit 103. This is because the imaging regions 100a and 100b are arranged sufficiently apart from each other, and optical crosstalk can be prevented only by the light-shielding diaphragm 109 provided on the upper surface of the prism 104. In the vertical direction of each of the imaging regions 100a to 100d in FIG. 13, a partition is provided on the holding member 106 (not shown) as in the second embodiment.

(Fourth embodiment)
The fourth embodiment is a modification of the above embodiment and is an example in which the prism 104 is divided into two parts.

  FIG. 14 is a schematic view of the image pickup apparatus according to the fourth embodiment viewed from the side. In this figure, the prism that performs light beam shifting is divided into 104a and 104b. The adjustment members 113a and 113b are in contact with the end portions of the prisms 104a and 104b. The adjusting members 113a and 113b are configured to be able to advance and retract in the direction of the arrow shown in the drawing. If the adjusting members 113a and 113b are pushed into the holding member 106, the inclination angle of the prisms 104a and 104b is increased. Conversely, if the adjustment members 113a and 113b are pulled outward, the inclination angle of the prisms 104a and 104b is reduced. That is, the inclination angle of the prisms 104a and 104b can be finely adjusted. After the adjustment by the adjusting members 113a and 113b is completed, the periphery of the adjusting members 113a and 113b is bonded and fixed by the adhesive sealing material 107, and as a result, the image sensor 100 is sealed and sealed from the outside air.

  Here, when performing pixel shifting, the object image interval on the image sensor 100 is determined by the interval between the lens portions 101a to 101d of the compound eye lens 101 and the inclination angle of the prism 104. It is necessary to make it. However, according to the configuration of the present embodiment, the adjustment members 113a and 113b are advanced and retracted, and the subject image formed on the image sensor 100 is sampled at a position shifted by 0.5 pixels in each of the imaging regions 100a to 100d. The pixel shift can be easily performed by adjusting as described above. Therefore, since it is not necessary to manage the interval between the lens portions 101a to 101d and the inclination angles of the prisms 104a and 104b with high accuracy, the assembly yield can be greatly improved.

It is the schematic diagram which looked at the imaging device from the side. It is the figure which looked at the image sensor 100 in FIG. 1 from the compound eye lens 101 side. (A) It is the figure which looked at the compound eye lens 101 in FIG. 1 from the image pick-up element 100 side. FIG. 2B is a view of the compound eye lens 101 in FIG. 1 viewed from the subject side. It is a figure showing refraction of light by a parallel plate. It is a schematic perspective view which shows the prism which implement | achieves a horizontal and vertical simultaneous light beam shift. It is the schematic diagram which looked at the imaging device in the 2nd example from the side. It is the figure which looked at the image sensor 100 in FIG. 6 from the upper surface side. 2 is a diagram illustrating a state in which a wiring substrate 105 is disposed on the upper surface of the image sensor 100. FIG. It is the figure which looked at the light-shielding stop 109 in FIG. 6 from the compound-eye lens 100 side. It is the figure which looked at the compound eye lens 101 in FIG. 1 from the image pick-up element 100 side. It is a graph showing the object distance in a compound eye lens and the movement amount of the image on an image pick-up element. It is the schematic diagram which looked at the imaging device in the 3rd example from the side. It is the figure which looked at the image sensor 100 in FIG. 12 from the compound eye lens 101 side. It is the schematic diagram which looked at the imaging device in the 4th example from the side. It is the schematic diagram which looked at the imaging device in a prior art example from the photographic subject side. It is the figure schematic diagram which looked at the imaging device in FIG. 15 from the lower surface side.

Explanation of symbols

DESCRIPTION OF SYMBOLS 100 Image pick-up element 101 Compound eye lens 102 Light-shielding diaphragm layer 103 Peripheral circuit part 104 Prism 105 Wiring board 106 Holding member 109 Light-shielding diaphragm 113 Adjustment member

Claims (4)

  A compound eye optical system, and an image sensor including a plurality of image areas for capturing a plurality of object images formed by the compound eye optical system, and a plurality of imaging signals corresponding to the plurality of object images obtained from the image sensor In the imaging apparatus that forms a single image by inserting a parallel plate optical member inclined with respect to each optical axis of the compound eye optical system, between the compound eye optical system and the image sensor, An imaging apparatus characterized by changing parallax in at least one direction of a compound eye optical system.   2. The imaging apparatus according to claim 1, wherein the plurality of imaging regions are arranged close to each other, and the one direction coincides with a longitudinal direction of the imaging region.   2. The image pickup apparatus according to claim 1, wherein the optical member also serves as a packaging member for sealing the image pickup element from outside air.   2. The imaging apparatus according to claim 1, wherein the plurality of imaging regions are provided apart from each other, and a peripheral circuit of the imaging element is provided in a region between the plurality of imaging regions.

Images