JP2007063441A - Polishing composition - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a polishing composition capable of suitably using a material to be polished which is made of a synthetic resin in polishing applications. <P>SOLUTION: The polishing composition comprises a compound represented by general formula of the figure [wherein X is a residue of a polyether polyol derived from a compound having an active hydrogen atom and an alkylene oxide and containing 20-90 mass% oxyethylene group in the polyether chain; m is an integer of 2-8 equal to the number of hydroxy group contained in the polyether polyol of one molecule; Y and Z are each a lower alcohol residue in which addition polymerization of ethylene oxide or propylene oxide is carried out, an alkyl group or an alkylene group; n is an integer of ≥3] and has a pH of 3-8. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a polishing composition for use in polishing a polishing object made of a synthetic resin such as a plastic lens.

Patent Document 1 discloses a polishing composition that contains alumina, poly (oxyethylene-oxypropylene) glyceryl ether, aluminum nitrate and water and is used for polishing a polishing object made of a synthetic resin. Yes. However, the polishing composition of Patent Document 1 has a problem that it takes time to process the polishing waste liquid because of high BOD (biological oxygen demand) and COD (chemical oxygen demand).
JP 2004-300347 A

  Accordingly, an object of the present invention is to provide a polishing composition that can be more suitably used in an application for polishing an object to be polished made of synthetic resin.

  In order to achieve the above object, the invention described in claim 1 is a polishing composition used in an application for polishing an object to be polished made of synthetic resin, which has the general formula:

で表される化合物（Ｘは活性水素原子を有する化合物とアルキレンオキサイドとから誘導されるポリエーテルポリオール（ただし、ポリエーテル鎖中にオキシエチレン基を２０〜９０質量％含む）の残基を表し、ｍは１分子の前記ポリエーテルポリオールに含まれる水酸基の数に等しい２〜８の整数を表し、Ｙ及びＺはそれぞれエチレンオキサイド又はプロピレンオキサイドが付加重合した低級アルコール残基、アルキル基又はアルキレン基を表し、ｎは３以上の整数を表す。）を含有してｐＨが３〜８である研磨用組成物を提供する。

(X represents a residue of a polyether polyol derived from a compound having an active hydrogen atom and an alkylene oxide (provided that 20 to 90% by mass of an oxyethylene group is contained in the polyether chain); m represents an integer of 2 to 8, which is equal to the number of hydroxyl groups contained in one molecule of the polyether polyol, and Y and Z are respectively a lower alcohol residue, an alkyl group or an alkylene group obtained by addition polymerization of ethylene oxide or propylene oxide. And n represents an integer of 3 or more), and a polishing composition having a pH of 3 to 8 is provided.

  The invention according to claim 2 is selected from a compound obtained by reacting polyalkylene oxide with methane hydrocarbon, glycerin, 1,2,3-trimethoxypropane, diethyl ether or methyl acetate and polyalkylene oxide. The polishing composition according to claim 1, further comprising at least one compound.

  Invention of Claim 3 provides the polishing composition of Claim 1 or 2 which further contains an abrasive grain.

  ADVANTAGE OF THE INVENTION According to this invention, the polishing composition which can be used more suitably in the use which grind | polishes the grinding | polishing target object made from a synthetic resin is provided.

Hereinafter, a first embodiment of the present invention will be described.
The polishing composition of the first embodiment is produced by mixing compound A, abrasive grains, and water, which will be described later, so that the pH is 3 to 8, and is substantially composed of compound A, abrasive grains, and water. Become. This polishing composition is used for polishing a polishing object made of a synthetic resin such as a plastic lens.

  The polishing composition of the first embodiment has a pH of 3-8. When the pH of the polishing composition is lower than 3, corrosion of the polishing machine is likely to occur. When the polishing composition is higher than 8, the ability of the polishing composition to polish a polishing object made of synthetic resin may be insufficient. In addition, the redispersibility of the polishing composition tends to decrease. However, since the polishing composition of the first embodiment has a pH of 3 to 8, the polishing object made of a synthetic resin can be suitably polished without causing corrosion of the polishing machine. However, even if the polishing composition is within the range of 3 to 8, corrosion of the polishing machine tends to occur as the pH of the polishing composition is lowered. It is preferable that pH of polishing composition of embodiment is 5 or more. In order to obtain particularly good redispersibility, the polishing composition of the first embodiment preferably has a pH of 7 or less.

  The compound A contained in the polishing composition of the first embodiment is a polyurethane-based polymer surfactant represented by the following general formula (1). Compound A has an action of suppressing polishing dust and pad scraps from adhering to abrasive grains and objects to be polished, and through suppressing adhesion of polishing scraps and pad scraps to abrasive grains and objects to be polished. The ability of the polishing composition to polish a polishing object made of synthetic resin is improved.

一般式（１）において、Ｘは、活性水素原子を有する化合物とアルキレンオキサイドとから誘導されるポリエーテルポリオールの残基を表す。ただし、前記ポリエーテルポリオールのポリエーテル鎖中にはオキシエチレン基が２０〜９０質量％含まれる。ｍは、１分子の前記ポリエーテルポリオールに含まれる水酸基の数に等しい２〜８の整数を表す。Ｙ及びＺはそれぞれ、エチレンオキサイド又はプロピレンオキサイドが付加重合した低級アルコール残基、アルキル基又はアルキレン基を表す。ｎは３以上の整数を表す。

In the general formula (1), X represents a residue of a polyether polyol derived from a compound having an active hydrogen atom and an alkylene oxide. However, 20 to 90% by mass of oxyethylene groups are contained in the polyether chain of the polyether polyol. m represents an integer of 2 to 8 equal to the number of hydroxyl groups contained in one molecule of the polyether polyol. Y and Z each represent a lower alcohol residue, an alkyl group or an alkylene group obtained by addition polymerization of ethylene oxide or propylene oxide. n represents an integer of 3 or more.

  Specific examples of compound A include the BERMODOL PUR series from AKZO NOBEL, the Adecanol UH series from Asahi Denka Kogyo Co., Ltd., and the primal series from Rohm and Haas.

  When the content of compound A in the polishing composition is less than 0.005% by mass, more specifically, less than 0.02% by mass, the polishing composition for polishing a synthetic resin polishing object The ability of things is not improved so much. Therefore, in order to obtain a higher polishing rate, the content of Compound A in the polishing composition is preferably 0.005% by mass or more, and more preferably 0.02% by mass or more. On the other hand, when the content of the compound A in the polishing composition is more than 10% by mass, more specifically, when it is more than 3% by mass, the BOD and COD become high, so that it takes time to process the polishing waste liquid. Take it. Therefore, from the viewpoint of BOD and COD, the content of Compound A in the polishing composition is preferably 10% by mass or less, more preferably 3% by mass or less.

  When the average molecular weight of the compound A contained in the polishing composition is less than 2000, more specifically, less than 5000, the ability of the polishing composition to polish a polishing object made of synthetic resin is not so improved. . Therefore, in order to obtain a higher polishing rate, the average molecular weight of the compound A contained in the polishing composition is preferably 2000 or more, more preferably 5000 or more. On the other hand, when the average molecular weight of the compound A contained in the polishing composition is larger than 50000, more specifically when it is larger than 20000, the polishing composition may be easily foamed. Therefore, the average molecular weight of the compound A contained in the polishing composition is preferably 50000 or less, more preferably 20000 or less.

  The abrasive grains play a role of mechanically polishing the object to be polished, and contribute to improving the ability of the polishing composition to polish the object to be polished made of synthetic resin. The abrasive grains contained in the polishing composition of the first embodiment may be alumina such as α-alumina, δ-alumina, θ-alumina, κ-alumina and amorphous alumina, or silica, zirconia. Other than alumina such as ceria and titania. However, in order to obtain a higher polishing rate, alumina is preferable, and α-alumina is more preferable among them.

  When the content of abrasive grains in the polishing composition is less than 3% by mass, more specifically less than 5% by mass, more specifically less than 10% by mass, the object to be polished made of synthetic resin The ability of the polishing composition to polish an object is not significantly improved. Therefore, in order to obtain a higher polishing rate, the content of abrasive grains in the polishing composition is preferably 3% by mass or more, more preferably 5% by mass or more, and most preferably 10% by mass or more. is there. On the other hand, when the content of the abrasive grains in the polishing composition is more than 30% by mass, more specifically more than 25% by mass, more specifically more than 20% by mass, the polishing composition Therefore, the amount of the polishing composition that adheres to the object to be polished and is taken out after polishing increases, resulting in poor economic efficiency. Therefore, from the viewpoint of economy, the content of abrasive grains in the polishing composition is preferably 30% by mass or less, more preferably 25% by mass or less, and most preferably 20% by mass or less.

  Abrasive grains having an average particle diameter of less than 0.015 μm have little ability to polish a synthetic resin polishing object. Therefore, in order to obtain a high polishing rate, the average particle diameter of the abrasive grains contained in the polishing composition is preferably 0.015 μm or more. On the other hand, when the average particle size of the abrasive grains is larger than 12 μm, the surface quality of the polished object after polishing may be reduced due to an increase in surface roughness or generation of scratches. Therefore, in order to maintain the surface quality of the object to be polished after polishing, it is preferable that the average particle diameter of the abrasive grains contained in the polishing composition is 12 μm or less.

  Alumina having an average particle diameter of less than 0.5 μm, more specifically, alumina having an average particle diameter of less than 0.6 μm, more specifically, alumina having an average particle diameter of less than 0.7 μm is a polishing object made of synthetic resin. The ability to polish is not so high. Therefore, when the abrasive grains contained in the polishing composition are alumina, in order to obtain a higher polishing rate, the average particle diameter of the alumina is preferably 0.5 μm or more, more preferably 0.6 μm. As described above, it is most preferably 0.7 μm or more. On the other hand, when the average particle diameter of alumina contained in the polishing composition as abrasive grains is larger than 8 μm, more specifically larger than 4 μm, more specifically larger than 2 μm, the surface roughness increases. The surface quality of the polished object after polishing may be deteriorated due to generation of scratches. Therefore, when the abrasive grains contained in the polishing composition are alumina, the average particle diameter of the alumina is preferably 8 μm or less in order to improve the surface quality of the object to be polished after polishing. Is 4 μm or less, most preferably 2 μm or less.

According to the first embodiment, the following advantages can be obtained.
-Compound A (compound represented by General formula (1)) has the effect | action which suppresses that polishing waste and pad waste adhere to an abrasive grain or a grinding | polishing target object. Therefore, according to the polishing composition of the first embodiment containing compound A, the polishing target made of synthetic resin is not hindered by the adhesion of polishing scraps and pad scraps to the abrasive grains and polishing target. Can be polished at a high polishing rate. Compound A can suppress the adhesion of polishing scraps and pad scraps to abrasive grains and objects to be polished because compound A acts on the surface of polishing scraps and pad scraps to disperse polishing scraps and pad scraps. This is considered to improve the performance.

  The compound A contained in the polishing composition of the first embodiment has an effect of improving the polishing ability of the polishing composition as compared with the compound B described later including poly (oxyethylene-oxypropylene) glyceryl ether. Is strong. This is because Compound B improves the polishing ability of the polishing composition through moderately increasing the viscosity of the polishing composition, whereas Compound A improves the polishing scraps and pad scraps on abrasive grains and polishing objects. It is considered that the polishing ability of the polishing composition is improved through the suppression of adhesion, and is caused by the difference in the mechanism of action. Therefore, the polishing composition of the first embodiment has an ability to polish a polishing object made of synthetic resin at a high polishing rate even if the content of compound A in the polishing composition is relatively small. Therefore, according to the present embodiment, a polishing composition that has a low BOD and COD and can be easily treated with a polishing waste liquid as compared with a conventional polishing composition containing poly (oxyethylene-oxypropylene) glyceryl ether is provided. can do.

-Since the polishing composition of 1st Embodiment has pH 3-8, it can grind | polish the grinding | polishing target object made from a synthetic resin suitably, without causing corrosion of a grinding machine.
Next, a second embodiment of the present invention will be described.

  The polishing composition of the second embodiment is produced by mixing Compound A, Compound B, which will be described later, abrasive grains, and water so that the pH is 3 to 8, and the compounds A, B, abrasive grains and Consists essentially of water. That is, the polishing composition of the second embodiment is different from the polishing composition of the first embodiment in that it further contains compound B. The polishing composition of the second embodiment is also used for polishing a polishing object made of synthetic resin such as a plastic lens.

  As with the polishing composition of the first embodiment, the pH of the polishing composition of the second embodiment is essential to be 3 to 8 in order to achieve suitable polishing of a synthetic resin polishing object. It is. In addition, the pH of the polishing composition of the second embodiment is preferably 5 or more in order to more reliably prevent corrosion of the polishing machine, and in order to obtain particularly good redispersibility, the second embodiment The polishing composition preferably has a pH of 7 or less.

  In order to further improve the polishing rate, the compound B contained in the polishing composition of the second embodiment is obtained by using polyalkylene oxide as methane hydrocarbon, glycerin, 1,2,3-trimethoxypropane, diethyl ether or methyl acetate. Or a polyalkylene oxide such as propylene glycol. The polyalkylene oxide can undergo a dealkylation reaction or a dealcoholization reaction with methane hydrocarbon, glycerin, 1,2,3-trimethoxypropane, diethyl ether and methyl acetate. Specific examples of the compound obtained by reacting polyalkylene oxide with methane hydrocarbon and the like include poly (oxyethylene-oxypropylene) glyceryl ether, polyoxyalkylene monobutyl ether and the like.

  The polyalkylene oxide to be reacted with methane hydrocarbon or the like is preferably polyethylene oxide, polypropylene oxide, or a copolymer of ethylene oxide and propylene oxide. When these polyalkylene oxides are used, it is less likely to cause an excessive increase in the viscosity of the polishing composition as compared with the case where other polyalkylene oxides are used.

  Among the methane hydrocarbon, glycerin, 1,2,3-trimethoxypropane, diethyl ether and methyl acetate, the compound to be reacted with the polyalkylene oxide is preferably glycerin. When glycerin is used, it is less likely to cause an excessive increase in the viscosity of the polishing composition than when other compounds are used.

  When the content of Compound B in the polishing composition is less than 1% by mass, more specifically, when it is less than 3% by mass, the polishing rate is not significantly improved. Therefore, in order to obtain a higher polishing rate, the content of Compound B in the polishing composition is preferably 1% by mass or more, more preferably 3% by mass or more. On the other hand, when the content of the compound B in the polishing composition is more than 30% by mass, more specifically, when the content is more than 20% by mass, the viscosity of the polishing composition is increased, so that the polishing object is polished after polishing. The amount of the polishing composition that adheres to an object and is taken out increases, resulting in poor economic efficiency. Therefore, from the viewpoint of economy, the content of Compound B in the polishing composition is preferably 30% by mass or less, more preferably 20% by mass or less.

  When the average molecular weight of Compound B contained in the polishing composition is less than 50, the polishing rate is not improved so much. Therefore, in order to obtain a higher polishing rate, the average molecular weight of Compound B in the polishing composition is preferably 50 or more. On the other hand, when the average molecular weight of Compound B contained in the polishing composition is larger than 10,000, more specifically, when it is larger than 5000, the polishing composition has a high viscosity and adheres to the object to be polished after polishing. As a result, the amount of the polishing composition taken out increases, resulting in poor economic efficiency. Therefore, from the economical viewpoint, the average molecular weight of the compound B contained in the polishing composition is preferably 10,000 or less, more preferably 5000 or less.

According to the second embodiment, the following advantages can be obtained.
-The polishing composition of 2nd Embodiment has the capability to grind | polish the grinding | polishing target object made from a synthetic resin at a high polishing rate. This is because the action of compound B suppresses the adhesion of abrasive and pad scraps to abrasive grains and objects to be polished, and the action of compound B contained in the polishing composition of the second embodiment. This is considered to be because the viscosity of the polishing composition increases moderately, and as a result, the polishing composition is easily held by the polishing pad during polishing. In particular, when abrasive grains are contained as in the polishing composition of the second embodiment, the dispersibility of the abrasive grains is improved by the action of compound A, and the abrasive grains held on the polishing pad during polishing are improved. The amount increases, and as a result, the polishing rate is greatly improved.

  The polishing composition according to the second embodiment improves the ability of the polishing composition to polish a polishing object made of synthetic resin by suppressing the adhesion of polishing scraps and pad scraps to abrasive grains and polishing targets. Containing compound A which can be Therefore, even if the content of the compound B is relatively small, it has an ability to polish a synthetic resin polishing object at a high polishing rate. Therefore, according to the present embodiment, it is possible to provide a polishing composition that has a lower BOD and COD than conventional polishing compositions and can easily treat the polishing waste liquid.

-Since the polishing composition of 2nd Embodiment is pH 3-8, it can grind | polish the grinding | polishing target object made from a synthetic resin suitably, without causing corrosion of a polisher.
The embodiment may be modified as follows.

In each polishing composition of the first and second embodiments, two or more types of compound A may be contained.
-Two or more types of compounds B may be contained in the polishing composition of the second embodiment.

-Each polishing composition of the first and second embodiments may contain two or more kinds of abrasive grains.
-You may omit the abrasive grain contained in each polishing composition of 1st and 2nd embodiment. Even in this case, it is possible to ensure the ability of the polishing composition to polish the polishing object made of synthetic resin by the action of the compound A and the compound B. However, in order to obtain a higher polishing rate, the polishing composition preferably contains abrasive grains.

  -You may add pH adjusters, such as an inorganic acid, an organic acid, the metal salt of an inorganic acid, or the metal salt of an organic acid, to each polishing composition of 1st and 2nd embodiment as needed. The inorganic acid may be any of nitric acid, sulfuric acid and hydrochloric acid, and the organic acid may be any of oxalic acid, lactic acid, acetic acid, formic acid, citric acid, tartaric acid, malic acid, gluconic acid, glycolic acid and malonic acid. May be. The metal salt may be any of aluminum salt, nickel salt, lithium salt, magnesium salt, sodium salt and potassium salt. However, even if it is a case where a pH adjuster is added, it is essential that the pH of each polishing composition of 1st and 2nd embodiment is 3-8.

  -You may add antifoamers, such as a silicone type antifoamer, an ether type antifoamer, and an alcohol type antifoamer, to each polishing composition of 1st and 2nd embodiment as needed. The antifoaming agent added to the polishing composition preferably has a strong foam suppressing action in order to suppress foaming of the polishing composition, and preferably has a strong foam breaking action in order to destroy the generated foam. . The content of the antifoaming agent in the polishing composition is preferably 1% by mass or less, more preferably 0.1% by mass or less.

-You may add colloidal particles, such as colloidal silica, and celluloses, such as a hydroxyethyl cellulose, to each polishing composition of 1st and 2nd embodiment as needed.
-Each polishing composition of 1st and 2nd embodiment may be prepared by diluting the undiluted | stock solution of polishing composition at the time of use. In this case, it is advantageous in terms of storage and transportation. In addition, the preferable range of content of compound A, B in the polishing composition in description of each embodiment, and an abrasive grain is a thing about content in the polishing composition at the time of use.

Next, examples and comparative examples of the present invention will be described.
Examples 1 to 17 and compounds A, B, α-alumina, and silicone-based antifoaming agent were appropriately mixed with water, and a pH adjusting agent was mixed as necessary so that the pH became a desired value. Polishing compositions of Comparative Examples 1 to 7 were prepared. Table 1 shows the details of the compounds A, B, α-alumina and the pH adjusting agent in each polishing composition, and the pH of each polishing composition. In addition, content of the silicone type antifoamer in each polishing composition is 0.7 mass%.

  Plastic lenses were polished under the polishing conditions shown in Table 2 using the polishing compositions of Examples 1 to 17 and Comparative Examples 1 to 7. The result of measuring the difference in weight of the plastic lens before and after polishing is shown in the “Polishing rate” column of Table 1.

  200 cc of each of the polishing compositions of Examples 1 to 17 and Comparative Examples 1 to 7 was put into a beaker, and a brass plate having a length of 2 cm, a width of 2 cm, and a thickness of 0.5 mm was put therein and allowed to stand for 48 hours. . Thereafter, the brass plate was taken out and washed with water, and then the presence or absence of corrosion on the surface of the brass plate was visually observed. Based on the results of the observation, the results of the evaluation of the strength of the corrosive action of each polishing composition are shown in the “Corrosive” column of Table 1. In the same column, ◎ indicates that no clouding or blackening due to corrosion was observed, ○ indicates that clouding was observed but no blackening was observed, and △ indicates that blackening was observed. Show.

  500 cc of each polishing composition of Examples 1 to 17 and Comparative Examples 1 to 7 was placed in a 1 L capacity plastic container and allowed to stand for 1 month. Thereafter, the time until the abrasive grains staying at the bottom of the container began to collapse when the plastic container was slowly laid down was measured. The results of evaluating the redispersibility of each polishing composition based on the measurement results are shown in the “Redispersibility” column of Table 1. In the same column, ◎ indicates that the time until the abrasive grains began to break was within 10 seconds, ○ indicates that the time was longer than 10 seconds but within 30 seconds, and △ was longer than 30 seconds. Indicates that it was long.

表１の“化合物Ａ”欄において、“Ａ１”は平均分子量が１００００で粘度が３００００ｃｐｓの一般式（１）で表される化合物を表し、“Ａ２”は平均分子量が８０００で粘度が６０００ｃｐｓの一般式（１）で表される化合物を表す。なお、化合物Ａの粘度は、ＢＨ型回転粘度計を用いて、化合物Ａの３０質量％水溶液の粘度を２５℃で測定したときに得られる値である。表１の“化合物Ｂ”欄において、“Ｂ１”はプロピレングリコールを表し、“Ｂ２”は平均分子量が約２８００のポリ（オキシエチレン−オキシプロピレン）グリセリルエーテルを表し、“Ｂ３”は平均分子量が約２３００のポリオキシアルキレンモノブチルエーテルを表し、“Ｂ４”は平均分子量が約３７５０のポリオキシアルキレンモノブチルエーテルを表す。表１の“ｐＨ調整剤”欄において、“Ｃ１”は硝酸アルミニウムを表し、“Ｃ２”は塩化アルミニウムを表し、“Ｃ３”は水酸化カリウムを表し、“Ｃ４”は水酸化ナトリウムを表し、“Ｃ５”硝酸を表し、“Ｃ６”は塩酸を表す。表１の“α−アルミナ”欄に示す各研磨用組成物中のα−アルミナの平均粒子径は、電気抵抗法（Coulter Counter法）により測定した。

In the “Compound A” column of Table 1, “A1” represents a compound represented by the general formula (1) having an average molecular weight of 10,000 and a viscosity of 30000 cps, and “A2” represents a general compound having an average molecular weight of 8000 and a viscosity of 6000 cps. The compound represented by Formula (1) is represented. The viscosity of compound A is a value obtained when the viscosity of a 30% by mass aqueous solution of compound A is measured at 25 ° C. using a BH type rotational viscometer. In the “Compound B” column of Table 1, “B1” represents propylene glycol, “B2” represents poly (oxyethylene-oxypropylene) glyceryl ether having an average molecular weight of about 2800, and “B3” has an average molecular weight of about 2800. 2300 represents a polyoxyalkylene monobutyl ether, and “B4” represents a polyoxyalkylene monobutyl ether having an average molecular weight of about 3750. In the “pH adjuster” column of Table 1, “C1” represents aluminum nitrate, “C2” represents aluminum chloride, “C3” represents potassium hydroxide, “C4” represents sodium hydroxide, “ “C5” represents nitric acid, and “C6” represents hydrochloric acid. The average particle diameter of α-alumina in each polishing composition shown in the “α-alumina” column of Table 1 was measured by an electric resistance method (Coulter Counter method).

  As shown in Table 1, in the polishing compositions of Examples 1 to 17, practically satisfactory results were obtained with respect to the polishing rate, corrosivity, and redispersibility. On the other hand, in the polishing compositions of Comparative Examples 1, 2, 4, 6, and 7 having a pH lower than 3, practically satisfactory results were not obtained with respect to the corrosivity. Further, in the polishing compositions of Comparative Examples 3 and 5 having a pH higher than 8, practically satisfactory results were not obtained with respect to the polishing rate and redispersibility.

The technical idea that can be grasped from the embodiment will be described below.
-The polyalkylene oxide to be reacted with methane hydrocarbon, glycerin, 1,2,3-trimethoxypropane, diethyl ether or methyl acetate is polyethylene oxide, polypropylene oxide or a copolymer of ethylene oxide and propylene oxide. The polishing composition according to claim 2. According to this, there is little possibility of causing the excessive increase in the viscosity of the polishing composition.

  -Polishing composition as described in any one of Claims 1-3 whose pH is 5-7. According to this, corrosion of the polishing machine can be prevented more reliably, and better redispersibility can be obtained.

The polishing composition according to claim 3, wherein the abrasive grains contain alumina. According to this, the polishing ability of the polishing composition is improved.
The polishing composition according to claim 3, wherein the abrasive grains include α-alumina. According to this, the polishing ability of the polishing composition is improved.

  -Polishing method which grind | polishes the grinding | polishing target object made from a synthetic resin using the polishing composition as described in any one of Claims 1-3. According to this, the grinding | polishing method which can grind | polish the grinding | polishing target object made from a synthetic resin suitably is provided.

  -Polishing product obtained through the process of grind | polishing the grinding | polishing target object made from a synthetic resin using the polishing composition as described in any one of Claims 1-3. According to this, a suitably polished abrasive product is provided.

Claims (3)

A polishing composition used for polishing a polishing object made of synthetic resin,
General formula:

(X represents a residue of a polyether polyol derived from a compound having an active hydrogen atom and an alkylene oxide (provided that 20 to 90% by mass of an oxyethylene group is contained in the polyether chain); m represents an integer of 2 to 8 which is equal to the number of hydroxyl groups contained in one molecule of the polyether polyol, and Y and Z are respectively a lower alcohol residue, an alkyl group or an alkylene group obtained by addition polymerization of ethylene oxide or propylene oxide. And n represents an integer of 3 or more.) A polishing composition having a pH of 3 to 8.   It further contains at least one compound selected from a compound obtained by reacting polyalkylene oxide with methane hydrocarbon, glycerin, 1,2,3-trimethoxypropane, diethyl ether or methyl acetate and polyalkylene oxide. The polishing composition according to claim 1.   The polishing composition according to claim 1 or 2, further comprising abrasive grains.