JP2007051353A - Method for producing decorated product by using partial multi-coating technique - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for easily producing a decorated product showing an excellently decorated appearance, by using a partial multi-coating technique. <P>SOLUTION: The method for producing the decorated product by using the partial multi-coating technique comprises the steps of: forming a resist layer 12 by printing a resist ink of an organic solvent peeled type or an alkali peeled type, on a substrate 11; forming a multi-coating layer 13 on the substrate 11 with a vapor deposition technique; subsequently making an organic solvent or an aqueous alkaline solution act on a position of the resist layer 12, permeate the multi-coating layer 13, and dissolve the resist layer 12; then peeling the multi-coating layer 13 at the position in which the resist layer 12 has existed, by brushing, and exposing the substrate 11 in the part; subsequently forming a masking layer 15 on the multi-coating layer 13; forming a plated layer on the part in which the resist layer 12 has been peeled off, to make it as a decorated section 14; and then peeling the masking layer 15. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a method for producing a decorative product by partial multi-coating, which is used as a decorative product such as a name plate and a pendant, and provides an excellent decorative feeling by a multi-coating layer and a plating layer.

  Conventionally, as this type of decoration (decoration) product, for example, a product obtained by a partial plating method is known (see, for example, Patent Document 1). This method of obtaining a decorative product includes a step of forming a resist film on a surface portion of an article on which a plating film is not formed, and a surface portion of the article not covered with the resist film using a roughening solution. And a step of forming a plating film only on the roughened surface by performing a plating process after removing the resist film.

Moreover, the manufacturing method of another decoration product is also known (for example, refer patent document 1). That is, a gold strike plating layer is formed on the surface of a decorative member made of stainless steel by electroplating, and a printing pattern such as letters is formed with a plating resist, and then a silver plating layer is laminated on the surface other than the printing pattern. Thereafter, the printed pattern is peeled and removed, and the gold plating layer is further peeled to form a black chrome plating layer and the like, and then the silver plating layer is peeled off and the gold plating layer is further peeled off. In this way, a decorative product having two colors of stainless steel and black letters is obtained.
JP 2000-204480 A (2nd and 5th pages) JP-A-5-40182 (Pages 2 and 3)

  However, the decorated products described in the above-mentioned conventional patent documents 1 and 2 are merely constituted by a material surface and a plated surface, and thus are monotonous and lack a decorative feeling. By the way, in the field of optical products, optical equipment, etc., multi-coating (multi-layer coating, multi-coating) is applied mainly for the purpose of preventing reflection. In this case, due to light refraction and reflection, the light interferes and looks like a rainbow of seven colors, and a novel appearance is obtained. By using such a multi-coat, the decoration can be enhanced, but the multi-coat is composed of a plurality of layers, and it is necessary to repeat the vapor deposition etc. a plurality of times to form a laminate. Application was complicated and difficult in production.

  The present invention has been made paying attention to such problems existing in the prior art. The purpose of the invention is to provide a method for producing a decorated product by partial multi-coating that can easily produce a decorated product having a good decorative feeling.

  In order to achieve the above object, a method for producing a decorated product by partial multi-coating according to the invention described in claim 1 is characterized in that a resist layer is formed by printing a resist ink of an organic solvent peeling type or an alkali peeling type on a substrate. Then, a multi-coating layer is formed on the substrate including the resist layer by vapor deposition, and then the organic solvent or alkali is allowed to act on the position of the resist layer so that the multi-coating layer is permeated. The multi-coat layer is peeled off, and the decorative portion is formed by exposing the substrate of that portion.

  According to a second aspect of the present invention, there is provided a method for producing a decorated product by partial multi-coating. In the first aspect of the invention, the resist layer is peeled off by applying the organic solvent or alkali to the resist layer and then brushing the resist layer. The multi-coat layer at the position where the scum was present is peeled off.

  The method for producing a decorated product by partial multi-coating according to claim 3 is the method according to claim 1 or 2, wherein the resist layer and the multi-coating layer thereon are peeled off by the organic solvent or alkali. After that, a masking layer is formed on the multi-coating layer, and the peeled resist layer is plated to form a plating layer as a decorative portion, and then the masking layer is peeled off. .

According to the present invention, the following effects can be exhibited.
In the method for producing a decorated product by partial multi-coating according to the first aspect of the present invention, the resist layer is formed by printing an organic solvent peeling type or alkali peeling type resist ink on a substrate. Thereafter, a multi-coat layer is formed on the substrate including the resist layer by vapor deposition. Next, an organic solvent or an alkali is allowed to act on the position of the resist layer so that the multi-coat layer penetrates to peel off the resist layer and the multi-coat layer thereon, and the substrate is exposed to form a decorative portion.

  That is, fine holes sufficient for the organic solvent or alkali to permeate are formed in the multicoat layer formed by the vapor deposition method. Using this, when an organic solvent or alkali is allowed to act on the position of the resist layer, the organic solvent or alkali reaches the resist layer through the fine holes of the multi-coat layer and dissolves the resist layer. The multi-coat layer is peeled off. For this reason, the decorative product obtained is composed of a multi-coating layer shining in rainbow colors, and a decorative part formed by removing the resist layer and the multi-coating layer thereon to expose the substrate. Therefore, it is possible to easily produce a decorative product having a good decorative feeling.

  In the method for producing a decorative product by partial multi-coating according to claim 2, the resist layer is peeled off by the action of the organic solvent or alkali, and then the multi-layer at the position where the resist layer was present by brushing is performed. The coat layer is peeled off. For this reason, in addition to the effect of the invention according to claim 1, the multi-coat layer at the position where the resist layer was present can be easily and sufficiently peeled off.

  In the method for producing a decorated product by partial multi-coating according to claim 3, a masking layer is formed on the multi-coating layer after peeling off the resist layer and the multi-coating layer thereon by the organic solvent or alkali. The resist layer thus peeled is plated to form a plating layer as a decorative portion, and then the masking layer is peeled off. For this reason, in addition to the effect of the invention according to claim 1 or claim 2, it is possible to obtain a decorative feeling due to metallic luster based on the plated layer.

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments that are considered to be the best of the present invention will be described below in detail with reference to the drawings.
(First embodiment)
Drawing 1 (a)-(f) is an explanatory view which shows a manufacturing process of decoration product 10 of this 1st embodiment in order. In each of the cross-sectional views of FIGS. 1B, 1D, and 1F, the thicknesses of the substrate, the resist layer, and the multi-coat layer are exaggerated and drawn for easy understanding.

  As shown in FIGS. 1A and 1B, a resist layer 12 is formed on a square substrate 11 so as to draw a letter A by screen printing using a resist ink. As a material constituting the substrate 11, in addition to metals such as stainless steel, aluminum, aluminum alloy, titanium, copper and iron, resins such as acrylic resin, polycarbonate resin, polyvinyl chloride resin, polyester resin, ABS resin, nylon resin, etc. Is also used. The thickness of the board | substrate 11 is about 0.1-3 mm normally, and many patterns, such as a hairline, may be formed in the surface.

  The resist ink is of an organic solvent peeling type or an alkali peeling type. Examples of the organic solvent-peelable resist ink include tar-based thermoplastic resins (manufactured by Taiyo Ink Manufacturing Co., Ltd., M-85K), and thermoplastic resins such as silicone-modified acrylic resins, such as thinner, benzene, It can be peeled off with an organic solvent such as toluene. The thinner is an organic solvent mixed solution containing toluene as a main component and containing xylene and ethyl acetate. Examples of the alkali-peelable resist ink include copolymer thermoplastic resins (manufactured by Taiyo Ink Manufacturing Co., Ltd., MA-830), copolymer thermoplastic resins such as styrene-maleic acid copolymer, and the like. It can be peeled off with an aqueous solution of sodium carbonate (for example, 5% aqueous solution), an aqueous solution of potassium carbonate, or the like. When a resin is used as the substrate 11, it may be dissolved by an organic solvent. Therefore, it is preferable to use an alkali peeling type resist ink.

  The thickness of the resist layer 12 is usually 5 to 100 μm. When the thickness is less than 5 μm, it becomes difficult to form the letter A, and it is easy to peel off and it is difficult to maintain the shape. When the thickness exceeds 100 μm, the multi-coat layer described later becomes a resist layer. It is not preferable because a step is easily generated between the portion provided with 12 and the portion not provided.

Next, as shown in FIGS. 1C and 1D, the evaporation substance is heated and evaporated by a vacuum evaporation apparatus on the substrate 11 and the resist 12 layer to form an evaporation layer. Thereafter, a plurality of vapor deposition layers are formed in the same manner, and the multicoat layer 13 is formed by laminating these vapor deposition layers. This multi-coat layer is shown in gray in FIG. The multi-coat layer 13 is preferably composed of 3 to 7 vapor deposition layers. Based on such a multi-coat layer 13, it is possible to improve a decorative feeling due to a change in color tone. The evaporating substance forming each deposited layer includes magnesium fluoride (MgF ₂ ), silicon dioxide (SiO ₂ ), alumina (Al ₂ O ₃ ), titanium dioxide (TiO ₂ ), zirconium dioxide (ZrO ₂ ), zinc sulfide. (ZnS) or the like is used. The pressure for forming the vapor deposition layer is usually 10 ⁻² to 10 ⁻⁴ Pa. Moreover, the thickness of each vapor deposition layer is preferably set to 100 to 160 nm.

  Subsequently, as shown in FIGS. 1E and 1F, an organic solvent or alkali (alkaline aqueous solution) is allowed to act on the multicoat layer 13 so that the organic solvent or alkali penetrates (permeates) the multicoat layer 13. ) To reach the resist layer 12, and the resist layer 12 is dissolved and removed. In this case, either a method of immersing the substrate 11 in an organic solvent or an aqueous alkaline solution or a method of coating the multi-coat layer 13 with an organic solvent or an aqueous alkaline solution may be used. As a result, the resist layer 12 disappears, and the multicoat layer 13 on the resist layer 12 floats above the substrate 11 and is easily peeled off. When the multi-coat layer 13 is extremely thin, it is peeled off together with the resist layer 12.

  Thereafter, by brushing the surface of the multi-coat layer 13, the multi-coat layer 13 located on the removed resist layer 12 is easily peeled off by the physical force of brushing. The physical force of this brushing changes according to the thickness of the remaining multi-coat layer 13 and is adjusted so as to increase as the multi-coat layer 13 becomes thicker. On the other hand, since the multi-coat layer 13 in other portions on the substrate 11 is in close contact with the substrate 11, it is not peeled off. And the part from which the resist layer 12 and the multi-coat layer 13 on it were removed becomes the decoration part 14 by exposing the substrate 11.

Thus, the decoration product 10 by the partial multi-coat comprised by the decoration part 14 showing the character of A in which the multi-coat layer 13 is not provided, and the multi-coat layer 13 provided in the other part. Is manufactured.
(Second Embodiment)
Next, a second embodiment of the present invention will be described with reference to FIGS. In the second embodiment, description of the same parts as those of the first embodiment is omitted, and different parts will be mainly described.

  In the second embodiment, the letter of the decorative portion 14 is B, and the same operation as in the first embodiment is performed until the resist layer 12 is peeled off and removed. That is, FIGS. 1A and 1B correspond to FIGS. 2A and 2B, FIGS. 1C and 1D correspond to FIGS. 2C and 2D, and FIG. (E) and (f) correspond to FIGS. 2 (e) and (f). As shown in FIGS. 2 (e) and 2 (f), the portion of the letter B exposes the substrate 11 to become the exposed portion 16, and the multi-coat layer 13 is formed in the other portions. The portion of the multi-coat layer 13 is shown in light gray in FIG.

  As shown in FIGS. 2G and 2H, a masking layer 15 is formed on the multi-coat layer 13 with the same resist ink as in the first embodiment. The masking layer 15 is shown in intermediate gray in FIG. Thereafter, as shown in FIGS. 2 (i) and 2 (j), electroplating is performed on the exposed portion 16 of the substrate 11 to form a plated layer as the decorative portion 14. As a plating bath for electroplating, a copper sulfate plating bath, a watt bath (nickel plating bath), or the like is used.

The copper sulfate plating bath is composed of copper sulfate (150 to 200 g / l), sulfuric acid (40 to 60 g / l), a brightener (a trace amount), and the like. Then, a copper plating layer having a thickness of 20 to 70 μm is formed by performing electroplating at room temperature at a current density of 1 to 4 A / dm ² and an energization time of 30 to 90 minutes. The watt bath is composed of nickel sulfate (200 to 250 g / l), nickel chloride (40 to 50 g / l), boric acid (35 to 45 g / l), brightener (trace amount), and the like. Then, a nickel plating layer having a thickness of 1 to 10 μm is formed by performing electroplating at a current density of 1 to 10 A / dm ² and an energization time of 1 to 10 minutes at 45 to 55 ° C. These plated layers are shown in dark gray (letter B) in FIG. Further, as the plating, it is possible to appropriately select a glossy plating, a matte plating, or the like according to a desired decorative feeling.

The electrolytic plating can be performed by, for example, the following four steps (a) to (d).
(A) Substrate plating step The substrate 11 is immersed in an electrolytic solution composed of hydrochloric acid (HCl) and nickel chloride (NiCl ₂ ), and nickel plating is performed by energization. By this base plating process, a base plating layer having a thickness of about 0.1 to 0.2 μm is formed on the substrate 11.
(B) Copper plating step The substrate 11 on which the base plating is performed is immersed in an electrolytic solution made of copper sulfate (CuSO ₄ ) and sulfuric acid, and a copper plating treatment is performed, whereby a thickness of 40 to 80 μm is formed on the base plating layer. The copper plating layer is formed thick.
(C) Nickel plating step The substrate 11 subjected to copper plating is immersed in an electrolytic solution made of nickel chloride, nickel sulfate (NiSO ₄ ) and boric acid (H ₃ BO ₃ ), and nickel plating is performed. By this nickel plating, a nickel plating layer having a thickness of about 2 to 3 μm is formed on the copper plating layer.
(D) Gold Plating Step As an electrolytic solution, an aqueous solution of potassium cyanide gallate “K [Au (CN) ₄ ]”, a bath solution containing cobalt, and a replenisher solution containing cobalt is also used. By this gold plating treatment, a gold plating layer having a thickness of about 0.1 μm is formed on the nickel plating layer.

  Finally, as shown in FIGS. 2 (k) and (l), the masking layer is removed with an organic solvent or an alkaline aqueous solution. In this way, a decorated product 10 with a partial multi-coat composed of the plated layer representing the letter B as the decorative portion 14 and the other multi-coat layer 13 is obtained.

  Now, the operation of the present embodiment will be described. After, for example, a thinner peeling type resist ink is printed on the substrate 11 to form the resist layer 12, the multi-coat layer 13 is formed by vapor deposition, and then the substrate 11 is formed. Immerse in thinner. The multi-coat layer 13 formed by the vapor deposition method is a porous body in which many fine holes are formed. For this reason, the thinner penetrates the fine holes of the multi-coat layer 13 to reach the resist layer 12 and dissolves the resist layer 12. Thereafter, by brushing, the multi-coat layer 13 located on the resist layer 12 is peeled off by a physical force, and the substrate 11 is exposed to form the decorative portion 14. In this way, the decorated product 10 by partial multi-coating is manufactured.

  In the obtained decorative product 10, the multi-coat layer 13 shines in rainbow colors due to light reflection and interference, and at the same time, the exposed substrate 11 exhibits a metallic color made of stainless steel, and the contrast between them makes a novel decorative feeling. Brewed.

According to the embodiment described in detail above, the following effects are exhibited.
-In the manufacturing method of the decorative product 10 by the partial multicoat in this embodiment, the resist layer 12 is formed by printing the organic solvent peeling type or alkali peeling type resist ink on the board | substrate 11. FIG. Thereafter, a multicoat layer 13 is formed on the substrate 11 including the resist layer 12 by vapor deposition. Next, an organic solvent or alkali is allowed to act on the position of the resist layer 12 to penetrate the multi-coat layer 13 to peel off the resist layer 12 and the multi-coat layer 13 on the resist layer 12, thereby exposing the substrate 11 of the portion and decorating the portion. 14 is formed.

  That is, in the multi-coat layer 13 formed by the vapor deposition method, fine holes sufficient to allow the organic solvent or alkali to permeate are formed. When this is utilized and an organic solvent or alkali is allowed to act on the position of the resist layer 12, the organic solvent or alkali reaches the resist layer 12 through the fine holes of the multi-coat layer 13 and dissolves the resist layer 12. For this reason, the decorative product includes a multi-coat layer 13 shining in rainbow, and a decorative portion 14 formed by removing the multi-coat layer 13 and the resist layer 12 and exposing the substrate 11. Therefore, it is possible to easily manufacture the decorative product 10 having an excellent decorative feeling.

  -The resist layer is peeled off by the action of the organic solvent or alkali, followed by brushing to peel off the multi-coat layer 13 at the position where the resist layer 12 was present. Therefore, the multi-coat layer 13 at the position where the resist layer 12 was present can be easily and sufficiently peeled off.

  -After the resist layer 12 and the multi-coat layer 13 formed thereon are peeled off by the organic solvent or alkali, a masking layer 15 is formed on the multi-coat layer 13 and the exposed resist layer 12 is plated and decorated. A plating layer as the portion 14 is formed, and then the masking layer 15 is peeled off. Therefore, the decoration feeling by the metallic luster based on the plating layer can be obtained.

  -The decorative product 10 of this embodiment can be used as a nameplate, a pendant, a nameplate, a sticker, a panel, a sticker for sticking, and the like.

Hereinafter, the embodiment will be described more specifically with reference to examples.
Example 1
According to 1st Embodiment shown to Fig.1 (a)-(f), the decoration product 10 by the partial multicoat which represents the character of A on the board | substrate 11 was manufactured. That is, as shown in FIGS. 1 (a) and 1 (b), an organic solvent peeling type resist ink [manufactured by Taiyo Ink Manufacturing Co., Ltd., M-85K] is formed on a stainless steel substrate 11 having a square plate shape. The resist layer 12 was formed so as to represent the letter A by screen printing. The substrate 11 is 0.4 mm thick and has a number of hairlines formed on the surface. The thickness of the resist layer 12 was 20 μm.

Next, as shown in FIGS. 1C and 1D, magnesium fluoride (MgF ₂ ) is used as the evaporation substance on the substrate 11 and the resist layer 12 at a pressure of 10 ⁻³ Pa with a vacuum deposition apparatus. The first vapor deposition layer was formed by heating and evaporation. Similarly, the second evaporation layer, the third evaporation layer, and the fourth evaporation layer are formed by replacing the evaporation substance with silicon dioxide (SiO ₂ ), alumina (Al ₂ O ₃ ), and titanium dioxide (TiO ₂ ). did. The thickness of these vapor deposition layers was 130 nm, respectively.

  Next, as shown in FIGS. 1E and 1F, by immersing the substrate 11 in a thinner as an organic solvent, the thinner penetrates the multi-coat layer 13 and reaches the resist layer 12, and the resist layer 12 was dissolved and removed. Thereafter, the surface of the multicoat layer 13 was lightly brushed, whereby the multicoat layer 13 located on the removed resist layer 12 was easily peeled off by the physical force of brushing. On the other hand, the multi-coat layer 13 in other portions on the substrate 11 was in close contact with the substrate 11. And the stainless steel which is the board | substrate 11 was exposed in the part from which the resist layer 12 and the multicoat layer 13 on it were removed, and the decoration part 14 was formed.

  Thus, the decoration product 10 by the partial multi-coat comprised by the decoration part 14 showing the character of A in which the multi-coat layer 13 is not provided, and the multi-coat layer 13 provided in the other part. Manufactured. The decorative product 10 thus obtained has a metallic luster made of stainless steel and a novel hairline in the decorative portion 14, and the multi-coat layer 13 has a multi-layer structure, so it looks like a rainbow of seven colors due to light reflection and interference. It had a different appearance depending on the direction, was able to obtain a novel appearance, and exhibited an excellent decorative feeling.

Further, in forming the multi-coat layer 13, the vapor deposition method is not partially repeated, but a method of removing a necessary portion after applying it to the entire surface of the substrate 11 is adopted. Could be manufactured.
(Example 2)
According to 2nd Embodiment shown to Fig.2 (a)-(l), the decoration product 10 by the partial multi-coat showing the letter B on the board | substrate 11 was manufactured. In this Example 2, the substrate 11 is exposed at the portion of the letter B, and it is the same as the Example 1 until the multi-coat layer 13 is formed at the other portions. That is, as shown in FIGS. 2A and 2B, a resist layer 12 was formed on the substrate 11. Subsequently, as shown in FIGS. 2C and 2D, a multicoat layer 13 was formed on the entire surface of the substrate 11. Next, as shown in FIGS. 2E and 2F, the resist layer 12 and the multi-coat layer 13 thereon were peeled off and removed with an organic solvent.

Thereafter, as shown in FIGS. 2G and 2H, a masking layer 15 was formed on the multi-coat layer 13 with the same resist ink as in Example 1. Next, as shown in FIGS. 2I and 2J, electroplating was performed on the exposed portion 16 of the substrate 11 to form a copper plating layer. A copper sulfate plating bath was used as the plating bath. That is, the composition of the copper sulfate plating bath was copper sulfate (170 g / l), sulfuric acid (50 g / l), and a matting agent (amount by a conventional method). Then, a copper plating layer having a thickness of 50 μm was formed by performing electroplating at room temperature at a current density of 3 A / dm ² and an energization time of 60 minutes.

  Finally, as shown in FIGS. 2 (k) and 2 (l), the masking layer 15 was removed with a thinner. Thus, the decorative product 10 by the partial multicoat comprised by the plating layer showing the character B as the decoration part 14 and the other multicoat layer 13 was obtained. The obtained decorative product 10 has a golden appearance by the copper plating layer in the decorative portion 14 and an appearance by matting of the metal surface, and the multi-coat layer 13 has the same appearance as in Example 1 and has a novel appearance. It was possible to show an excellent decoration feeling. Further, in forming the multi-coat layer 13, the decorative product 10 can be easily manufactured because a method of removing a necessary portion after applying to the entire surface of the substrate 11 as in Example 1 was adopted. did it.

It should be noted that the embodiment described above can be modified and embodied as follows.
-The decoration part 14 can also be comprised with characters other than A and B, and also a symbol, a figure, a pattern, etc.

-Coloring, a pattern, etc. can also be formed in the part of the peeled resist layer 12 by printing, painting, or the like.
The multi-coat layer 13 can be configured to provide a hard coat layer to improve strength, or to provide a light interference layer to interfere light.

Next, the technical idea that can be grasped from the embodiment will be described below.
The method for producing a decorated product by partial multi-coating according to claim 3, wherein the plating layer is configured to be thicker than the multi-coating layer. According to this manufacturing method, in addition to the effect of the invention according to claim 3, the plating layer appears to be raised, and the decoration feeling can be further improved.

  The said multi-coat layer is formed in 3-7 layers, The manufacturing method of the decorating product by the partial multi-coat as described in any one of Claims 1-3 characterized by the above-mentioned. According to this manufacturing method, in addition to the effects of the invention according to any one of claims 1 to 3, it is possible to improve a decorative feeling due to a change in color tone based on the multi-coat layer.

(A)-(f) is a figure which shows the manufacturing process of the decoration product of 1st Embodiment in order, Comprising: (a) is a top view which shows the state which formed the resist layer on the board | substrate, (b) is ( FIG. 3A is a cross-sectional view taken along line 1b-1b, FIG. 3C is a plan view showing a state in which a multi-coat layer is formed, FIG. 4D is a cross-sectional view taken along line 1d-1d in FIG. The top view which shows the state which peeled and formed the decoration part, (f) is the 1f-1f sectional view taken on the line of (e). (A)-(l) is a figure which shows the manufacturing process of the decorative product of 2nd Embodiment in order, Comprising: (a) is a top view which shows the state which formed the resist layer on the board | substrate, (b) is ( 2A is a cross-sectional view taken along the line 2b-2b in FIG. 2A, FIG. 2C is a plan view showing a state where the multi-coat layer is formed, FIG. 2D is a cross-sectional view taken along the line 2d-2d in FIG. (F) is a cross-sectional view taken along line 2f-2f in (e), (g) is a plan view showing a state in which a masking layer is formed on the multicoat layer, (H) is a cross-sectional view taken along line 2h-2h of (g), (i) is a plan view showing a state where a plating layer is formed on a portion where the resist layer is peeled off, and a decorative portion is formed, and (j) is (i) 2j-2j line sectional view, (k) is a plan view showing a state where the masking layer is peeled off, (l) is a sectional view taken along the line 2l-2l of (k).

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10 ... Decorated product, 11 ... Board | substrate, 12 ... Resist layer, 13 ... Multi-coat layer, 14 ... Decoration part, 15 ... Masking layer.

Claims (3)

After forming a resist layer by printing an organic solvent peeling type or alkali peeling type resist ink on the substrate, a multi-coat layer is formed on the substrate including the resist layer by vapor deposition, and then the resist layer Partial multi-coating characterized in that an organic solvent or alkali is allowed to act on the position to infiltrate the multi-coating layer to peel off the resist layer and the multi-coating layer on top of the multi-coating layer to expose the portion of the substrate and form a decorative part. A method for manufacturing decorated products. The partial multi-coat according to claim 1, wherein the resist layer is peeled off by the action of the organic solvent or alkali, and then the multi-coat layer at the position where the resist layer was present is peeled off by brushing. A method for producing decorative products. After peeling off the resist layer and the multi-coat layer on the organic solvent or alkali, a masking layer is formed on the multi-coat layer, and the peeled resist layer is plated to form a plating layer as a decorative portion. The method for producing a decorated product by partial multi-coating according to claim 1, wherein the masking layer is peeled off after the formation.

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