JP2007051337A5 - - Google Patents

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Publication number
JP2007051337A5
JP2007051337A5 JP2005237505A JP2005237505A JP2007051337A5 JP 2007051337 A5 JP2007051337 A5 JP 2007051337A5 JP 2005237505 A JP2005237505 A JP 2005237505A JP 2005237505 A JP2005237505 A JP 2005237505A JP 2007051337 A5 JP2007051337 A5 JP 2007051337A5
Authority
JP
Japan
Prior art keywords
target
backing plate
sputtering
sputter
target assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2005237505A
Other languages
Japanese (ja)
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JP2007051337A (en
Filing date
Publication date
Application filed filed Critical
Priority to JP2005237505A priority Critical patent/JP2007051337A/en
Priority claimed from JP2005237505A external-priority patent/JP2007051337A/en
Priority to TW95125492A priority patent/TWI393797B/en
Priority to CN 200610111086 priority patent/CN1916231A/en
Publication of JP2007051337A publication Critical patent/JP2007051337A/en
Publication of JP2007051337A5 publication Critical patent/JP2007051337A5/ja
Pending legal-status Critical Current

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Description

上記課題を解決するために、請求項１記載のスパッタ電極は、スパッタリング用のターゲットと、このターゲットのスパッタ面の背面側にボンディング材を介して接合されたバッキングプレートとを有するターゲット組立体を備え、このターゲット組立体を、バッキングプレートのターゲットより外側に延出した部分を介してスパッタ電極本体に取付自在であるスパッタ電極であって、前記バッキングプレートのスパッタ電極本体への取付箇所がそれぞれ位置する水平面に対し直交する方向に沿って、ターゲット組立体の中央領域に引張力または押圧力のいずれか一方を加える反り矯正手段を設けたことを特徴とする。

In order to solve the above problems, a sputtering electrode according to claim 1 includes a target assembly including a sputtering target and a backing plate bonded to the back side of the sputtering surface of the target via a bonding material. , the target assembly, a sputter electrode via a portion extending outward from the target backing plate is freely mounted on the sputter electrode body, located attachment points each to sputter electrodes main body of the backing plate A warp correcting means for applying either a tensile force or a pressing force is provided in the central region of the target assembly along a direction perpendicular to the horizontal plane.

Claims (1)

スパッタリング用のターゲットと、このターゲットのスパッタ面の背面側にボンディング材を介して接合されたバッキングプレートとを有するターゲット組立体を備え、このターゲット組立体を、バッキングプレートのターゲットより外側に延出した部分を介してスパッタ電極本体に取付自在であるスパッタ電極であって、前記バッキングプレートのスパッタ電極本体への取付箇所がそれぞれ位置する水平面に対し直交する方向に沿って、ターゲット組立体の中央領域に引張力または押圧力のいずれか一方を加える反り矯正手段を設けたことを特徴とするスパッタ電極。 A target assembly having a sputtering target and a backing plate joined via a bonding material to the back side of the sputtering surface of the target is provided, and the target assembly is extended outside the target of the backing plate. a sputtering electrode is freely attached to the sputter electrode body via a portion, along the direction in which the mounting portion of the sputter electrodes body of the backing plate is perpendicular to a horizontal plane located respectively, the central region of the target assembly A sputter electrode characterized in that a warp correcting means for applying either a tensile force or a pressing force is provided.
JP2005237505A 2005-08-18 2005-08-18 Sputtering electrode and sputtering apparatus provided with the sputtering electrode Pending JP2007051337A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2005237505A JP2007051337A (en) 2005-08-18 2005-08-18 Sputtering electrode and sputtering apparatus provided with the sputtering electrode
TW95125492A TWI393797B (en) 2005-08-18 2006-07-12 Sputtering electrodes and sputtering devices with sputtering electrodes
CN 200610111086 CN1916231A (en) 2005-08-18 2006-08-18 Sputtering electrode and sputtering device possessing sputtering electrode

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005237505A JP2007051337A (en) 2005-08-18 2005-08-18 Sputtering electrode and sputtering apparatus provided with the sputtering electrode

Publications (2)

Publication Number Publication Date
JP2007051337A JP2007051337A (en) 2007-03-01
JP2007051337A5 true JP2007051337A5 (en) 2008-08-14

Family

ID=37737294

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005237505A Pending JP2007051337A (en) 2005-08-18 2005-08-18 Sputtering electrode and sputtering apparatus provided with the sputtering electrode

Country Status (3)

Country Link
JP (1) JP2007051337A (en)
CN (1) CN1916231A (en)
TW (1) TWI393797B (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201009101A (en) * 2008-06-17 2010-03-01 Shincron Co Ltd Bias sputtering apparatus
JP5734612B2 (en) * 2010-10-04 2015-06-17 株式会社アルバック Cathode unit and deposition system
JP5726633B2 (en) * 2011-05-20 2015-06-03 株式会社アルバック Target device
CN104690487A (en) * 2013-12-09 2015-06-10 有研亿金新材料股份有限公司 Method for adhesively connecting target and backboard
KR20210016189A (en) * 2019-08-01 2021-02-15 삼성디스플레이 주식회사 Sputtering apparatus and sputtering method using the same

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4879017A (en) * 1988-11-29 1989-11-07 Dae Ryung Vacumm Co. Ltd. Multi-rod type magnetron sputtering apparatus
KR940008020B1 (en) * 1988-12-21 1994-08-31 가부시끼가이샤 도시바 Target for sputtering apparatus and manufacturing method the same
WO1992018663A1 (en) * 1991-04-19 1992-10-29 Surface Solutions, Incorporated Method and apparatus for linear magnetron sputtering
JP2555004B2 (en) * 1993-12-30 1996-11-20 アネルバ株式会社 Sputtering equipment
EP0824760A1 (en) * 1995-05-11 1998-02-25 Materials Research Corporation Sputtering apparatus with isolated coolant and sputtering target therefor
JPH111770A (en) * 1997-06-06 1999-01-06 Anelva Corp Sputtering apparatus and sputtering method
JP3390338B2 (en) * 1998-02-02 2003-03-24 鹿児島日本電気株式会社 Target electrode for sputtering equipment
WO2000028104A1 (en) * 1998-11-06 2000-05-18 Scivac Sputtering apparatus and process for high rate coatings
JP4717186B2 (en) * 2000-07-25 2011-07-06 株式会社アルバック Sputtering equipment
JP2004143535A (en) * 2002-10-24 2004-05-20 Bridgestone Corp Method for depositing carbon thin film
JP4246547B2 (en) * 2003-05-23 2009-04-02 株式会社アルバック Sputtering apparatus and sputtering method

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