JP2007047597A - Light emitting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To evade pressure to a substrate when a light emitting device which uses a solid-state light emitting element as a light source is fixed with a fixing screw. <P>SOLUTION: The light emitting device is equipped with an LED 1 as the light source, a substrate 2 on which the LED 1 is mounted, and a resin molding 3 formed by molding the LED 1 and substrate 2 with a resin material. The resin molding 3 is provided with one or a plurality of screw insertion holes 4 for screwing the resin molding 3, a recessed part which is made hollow toward the center of the substrate 2 is formed at an end of the substrate 2, and the insertion holes 4 and recessed part 5 are so arranged that the head of the fixing screw does not overlap the substrate in the fastening direction of the fixing screw, thereby preventing pressure from being applied to the substrate by the head of the fixing screw. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a light emitting device using a solid light emitting element as a light source.

  One of the typical advertising means using conventional lighting is a neon sign. Neon signs can be dynamically displayed with various changes by electrically controlling the timing of lighting and flashing when displaying advertisements with multiple characters arranged, but they are not easy to manufacture. In addition, production costs, capital investment, and power costs are high.

  Thus, a light-emitting device that can easily produce advertisements that are rich in changes due to lighting such as neon signs and that can reduce power consumption is provided (see Patent Document 1). In this light emitting device, a plurality of light sources using light emitting diodes (hereinafter referred to as LEDs) as light emitting elements are connected in series with a plurality of lead wires, for example, as illumination of characters on advertising billboards. is there.

The bean light source is a bullet-type LED filled with a translucent resin with improved light diffusivity, such as by kneading a fine powder such as silica into a transparent or translucent small container whose two opposing sides form a trapezoid. Is molded and sealed with a resin molded body. A plurality of the bean light sources are connected in series with a lead wire, and an electrical connector is attached to one end of the lead wire to form a chain. Thus, the light-emitting device formed in the chain shape is used for, for example, an advertisement display in which a plurality of characters are arranged like a neon sign.
JP 2003-84694 A

  By the way, although the above conventional light emitting device uses a bullet-type LED as an LED, a light emitting device using a surface-mounted LED is conceivable. In this case, the surface-mounted LED is surface-mounted on a substrate, the light-emitting device formed by molding the substrate and the surface-mounted LED with a resin material, and sealing with a resin forming body, as a unit, the mounting member A lighting device such as the neon sign is configured by attaching a plurality of light emitting devices.

  In the light emitting device using the surface-mounted LED, both the resin molded body and the substrate are provided with screw insertion holes for inserting a fixing screw for fixing the light emitting device to the mounting member. When attaching to the screw, the fixing screw is inserted into the screw insertion hole and fastened to fix. However, since the resin molded body is soft, the pressure from the head of the fixing screw is applied to the substrate through the resin molded body by tightening the fixing screw, and the electronic components and electronic components mounted on the substrate are There is a problem in that it affects the solder to be fixed and causes failure.

  The present invention has been made in view of the above points, and it is an object of the present invention to prevent pressure applied to a substrate by a fixing screw when the light-emitting device is fixed to the mounting member with the fixing screw.

  In order to achieve the above object, a first aspect of the present invention is a solid light emitting element that serves as a light source, a substrate on which the solid light emitting element is mounted, and a resin molded body obtained by molding the solid light emitting element and the substrate with a resin material; The resin molded body is provided with one or a plurality of screw insertion holes through which a fixing screw for fixing the resin molded body is inserted, and the substrate has a substrate at an end portion of the substrate. One or a plurality of recesses that are recessed toward the center of the fixing screw are formed, and the screw insertion hole and the recess are arranged so that the head of the fixing screw and the substrate do not overlap in the tightening direction of the fixing screw.

  According to a second aspect of the present invention, in the first aspect of the present invention, the resin molded body is provided with one or a plurality of step portions formed thinner than other portions, and the step portion is provided with a screw insertion hole. ing.

  According to the first aspect of the present invention, the concave portion that is depressed toward the center of the substrate is provided at the end of the substrate, and the screw insertion hole and the substrate are arranged so that the head of the fixing screw and the substrate do not overlap in the tightening direction of the fixing screw. Since the concave portion is arranged, even if the fixing screw is inserted into the screw insertion hole, the head of the fixing screw does not overlap the substrate in the tightening direction of the fixing screw, so that it is possible to prevent pressure from being applied to the substrate by screwing. .

  According to the second aspect of the present invention, in the resin molded body, the step portion having a thickness smaller than that of the other portion is formed, and the screw insertion hole is provided in the step portion. Since the head of the fixing screw does not protrude in the thickness direction of the resin molded body, it is possible to prevent the light emission of the LED from being hindered by the head of the fixing screw, and to increase the light emission efficiency.

  Hereinafter, an embodiment of the present invention will be described with reference to FIG. This embodiment is a light-emitting device using a solid-state light-emitting element, and is formed by molding a solid-state light-emitting element as a light source, a substrate 2 on which the solid-state light-emitting element is mounted, and the solid-state light-emitting element and the substrate 2 by using a resin material. And a resin molded body 3.

  The solid state light emitting device emits light by applying a DC voltage in a specified direction. In the present embodiment, a surface mount type LED 1 is used. However, the LED 1 is not limited as long as it is a solid light emitting element, and for example, an organic EL element or the like may be used. The LED 1 is mounted on the land of the substrate 2 on which the land and the conductor pattern are printed by soldering by reflow soldering or the like. Further, an acrylic plate 7 having high light diffusibility is placed on the light emitting surface of the LED 1 in order to increase the light emission efficiency.

  The resin molded body 3 is formed in a substantially rectangular parallelepiped shape by molding the LED 1 and the substrate 2 using a resin material such as an epoxy resin. In addition, a substantially circular light extraction hole 3 b for extracting light emitted from the LED 1 to the outside of the resin molded body 3 is provided on a surface facing the light emitting surface of the LED 1. In FIG. 1A, a pair of corner portions located on the diagonal line of the resin molded body 3 are formed with step portions 6 that are thinner than the other portions. Screw insertion holes 4 for inserting a fixing screw (not shown) for fixing the body 3 to an attachment member (not shown) are provided. In order to attach the light emitting device to the attachment member, the resin molded body 3 is fixed to the attachment member by inserting a fixing screw into each screw insertion hole 4 and a hole (not shown) provided in the attachment member and screwing it. . The step portion 6 has a thickness such that when the fixing screw is inserted, the head of the fixing screw does not protrude above the upper surface of the resin molded body 3 in FIG. 1B, that is, above the light extraction hole 3b. Is formed.

  The board | substrate 2 is formed in flat form using ceramic etc., for example, and the land and the conductor pattern are printed on the surface. In FIG. 1C, a pair of corners located on the diagonal line of the substrate 2 is provided with a recess 5 that is recessed toward the center of the substrate 2. In FIG. 1 (a), the one-dot broken line A surrounding the screw insertion hole 4 shows the outer shape of the head of the fixing screw, and the recess 5 is arranged so as not to overlap the one-dot broken line A (the head of the fixing screw). Has been. In addition, also in a pair of corner | angular part located on the diagonal of the acrylic board 7 mounted on the light emission surface of LED1, the recessed part 5 depressed toward the center of the acrylic board 7 is each provided. The concave portions 5 of these acrylic plates 7 are also arranged so as not to overlap with the one-dot broken line a.

  With the configuration described above, even if the fixing screw is inserted into the screw insertion hole 4, the head of the fixing screw does not overlap the substrate 2 and the acrylic plate 7 in the tightening direction of the fixing screw. It can prevent that a pressure is applied to the board | substrate 2 and the acrylic board 7 by a part. Further, since the head of the fixing screw does not protrude above the light extraction hole 3b when the light emitting device is screwed, it is possible to prevent the light emission of the LED 1 from being hindered by the head of the fixing screw. Efficiency can be increased.

It is a figure which shows the light-emitting device of embodiment of this invention, (a) is a top view, (b) is a side view, (c) is a figure which shows the structure of a board | substrate.

Explanation of symbols

1 LED (solid state light emitting device)
2 Substrate 3 Resin molding 4 Screw insertion hole 5 Recess 6 Step

Claims (2)

  A light emitting device including a solid light emitting element as a light source, a substrate on which the solid light emitting element is mounted, and a resin molded body obtained by molding the solid light emitting element and the substrate with a resin material, One or a plurality of screw insertion holes through which fixing screws for fixing the resin molded body are inserted are provided, and one or a plurality of recesses that are recessed toward the center of the substrate are formed in the substrate. A light-emitting device characterized in that a screw insertion hole and a recess are arranged so that the head of the fixing screw and the substrate do not overlap in the tightening direction of the fixing screw.   2. The light emitting device according to claim 1, wherein the resin molded body is provided with one or a plurality of step portions formed thinner than other portions, and the step portion is provided with a screw insertion hole.

Images