JP2007045017A - Liquid ejection head and liquid ejection device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a liquid ejection head and device in which the deterioration of droplet delivery property is suppressed. <P>SOLUTION: The liquid ejection head comprises a passage forming substrate 10 in which a pressure generation chamber 12 communicating with a nozzle opening for ejecting the droplet is provided, a pressure generation means which is provided in the area corresponding to the pressure generation chamber 12 of one side of the passage forming substrate 10 through a diaphragm (elastic membrane 50) and makes a pressure change generated in the pressure generation chamber 12 and a joining substrate (nozzle plate 20 in Fig. 3) which is adhered to other side of the passage forming substrate 10 with an adhesive. Concerning the liquid ejection head, the edge shape of a corner 12a on the side of the joining substrate of the pressure generation chamber 12 is formed with at least either one of a radius of curvature of 19 μm or more, or an obtuse angle. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a liquid ejecting head and a liquid ejecting apparatus that eject liquid droplets, and in particular, a part of a pressure generation chamber communicating with a nozzle opening that ejects ink droplets is configured by a vibration plate, and the piezoelectric plate is interposed through the vibration plate. The present invention relates to an ink jet recording head and an ink jet recording apparatus in which an element is provided and ink droplets are ejected by displacement of a piezoelectric element.

  A part of the pressure generation chamber communicating with the nozzle opening for discharging ink droplets is constituted by a vibration plate, and the vibration plate is deformed by a piezoelectric element to pressurize the ink in the pressure generation chamber to discharge ink droplets from the nozzle opening. Two types of ink jet recording heads have been put into practical use: those using a longitudinal vibration mode piezoelectric actuator that extends and contracts in the axial direction of the piezoelectric element, and those using a flexural vibration mode piezoelectric actuator. As an example of using an actuator in a flexural vibration mode, for example, a uniform piezoelectric material layer is formed over the entire surface of the diaphragm by a film forming technique, and this piezoelectric material layer is formed into a pressure generating chamber by a lithography method. A device in which a piezoelectric element is formed so as to be cut into a corresponding shape and independent for each pressure generating chamber is known.

  Such an ink jet recording head has a structure in which, for example, a flow path forming substrate in which a pressure generating chamber is formed and a nozzle plate provided with a plurality of nozzle openings for ejecting ink droplets are bonded with an adhesive. Have.

  For this reason, when the flow path forming substrate and the nozzle plate are bonded together with an adhesive, there is a problem that the adhesive flows out from the bonding region between the two into the pressure generating chamber and adversely affects ink ejection. For example, when a pressure generation chamber is formed by anisotropic etching using a silicon single crystal substrate having a crystal plane orientation (110) as a flow path formation substrate, both longitudinal ends of the pressure generation chamber face the pressure generation chamber. Formed with an inclined surface. In addition, sharply sharp corners are formed at the end of the inclined surface on the nozzle plate side. For this reason, a phenomenon occurs in which the adhesive flows out from the corners to the diaphragm of the pressure generation chamber through the outer edge of the inclined surface, and the adhesive adheres to the diaphragm, thereby inhibiting the deformation of the diaphragm. As a result, there is a problem in that the ink ejection characteristics deteriorate.

  Therefore, for example, a groove that partially communicates with the pressure generating chamber is formed on the joint surface of the flow path forming substrate with the nozzle plate, and the adhesive flows out into the groove so that the adhesive does not flow into the pressure generating chamber. Such a liquid jet head has been proposed (see Patent Document 1). However, since the groove communicates with the pressure generating chamber, there is a problem that bubbles are likely to be accumulated in the groove and the bubbles cannot be removed from the nozzle openings. In addition, since the portion where the groove is formed is also a flow path for the ink supplied into the pressure generating chamber, there is a problem that the ink flow is hindered and the ink ejection characteristics are deteriorated. Such a problem exists not only in an ink jet recording head that ejects ink droplets, but also in other liquid ejecting heads that eject droplets other than ink.

JP 2003-127360 A (page 4, FIGS. 1-2)

  In view of the circumstances described above, it is an object of the present invention to provide a liquid ejecting head and a liquid ejecting apparatus in which a drop in droplet discharge characteristics is suppressed.

According to a first aspect of the present invention for solving the above-described problems, a flow path forming substrate provided with a pressure generating chamber communicating with a nozzle opening for ejecting droplets, and the pressure generation on one surface side of the flow path forming substrate are provided. A pressure generating means that is provided in a region corresponding to the chamber through a vibration plate to cause a pressure change in the pressure generating chamber; and a bonding substrate that is bonded to the other surface of the flow path forming substrate by an adhesive. An edge shape of a corner portion of the pressure generating chamber on the bonding substrate side is formed with at least one of a curvature radius of 19 μm or more or an obtuse angle.
In the first aspect, since the edge shape of the corner of the pressure generating chamber is formed with at least one of a predetermined radius of curvature or an obtuse angle, pressure is generated from the adhesion region between the flow path forming substrate and the bonding substrate. The flow of the adhesive into the chamber is effectively suppressed by the corner of the pressure generation chamber, and the adhesive is effectively suppressed from adhering to the diaphragm. Therefore, a drop in the droplet discharge characteristics of the head is suppressed, and the reliability of the head is improved.

According to a second aspect of the present invention, in the first aspect, the edge shape of the corner of the pressure generating chamber is formed with a radius of curvature that is half the width of the pressure generating chamber. Located in the jet head.
In the second aspect, since the entire end portion of the pressure generation chamber is curved with a predetermined curvature, the flow of the adhesive from the adhesion region between the flow path forming substrate and the bonding substrate into the pressure generation chamber is further improved. Effectively suppressed.

According to a third aspect of the present invention, in the liquid jet head according to the first or second aspect, the pressure generation chamber is formed by dry etching the flow path forming substrate. .
In the third aspect, at least the corners of the pressure generating chamber can be processed into a desired shape with high accuracy.

According to a fourth aspect of the present invention, in the liquid jet head according to any one of the first to third aspects, the bonding substrate is a nozzle plate provided with the nozzle openings.
In the fourth aspect, the liquid ejecting head in which the nozzle opening is provided in the region facing the diaphragm of the pressure generating chamber is realized.

A fifth aspect of the present invention is a liquid ejecting apparatus including the liquid ejecting head according to any one of the first to fourth aspects.
In the fifth aspect, a liquid ejecting apparatus that suppresses a drop in droplet discharge characteristics is realized.

Hereinafter, the present invention will be described in detail based on embodiments.
(Embodiment 1)
FIG. 1 is an exploded perspective view showing an ink jet recording head according to the present embodiment, and FIG. 2 is a plan view and a cross-sectional view taken along line AA ′ of FIG. In this embodiment, the flow path forming substrate 10 is composed of a silicon single crystal substrate having a crystal plane orientation (110). As shown in the figure, the flow path forming substrate 10 includes a plurality of pressure generating chambers partitioned by partition walls 11. 12 are juxtaposed in the width direction. Further, a communication portion 13 is formed in a region outside the longitudinal direction of the pressure generation chamber 12 of the flow path forming substrate 10, and the communication portion 13 and each pressure generation chamber 12 are provided for each pressure generation chamber 12. Communication is made via a path 14. The communication unit 13 constitutes a part of the reservoir 100 that communicates with a reservoir unit 32 of the protective substrate 30 described later and serves as a common ink chamber for the pressure generation chambers 12. The ink supply path 14 is formed with a narrower width than the pressure generation chamber 12, and maintains a constant flow path resistance of ink flowing into the pressure generation chamber 12 from the communication portion 13. The pressure generating chambers 12 and the like are formed by dry etching, as will be described in detail later.

As the thickness of the flow path forming substrate 10 on which such a pressure generation chamber 12 and the like are formed, it is preferable to select an optimum thickness in accordance with the density at which the pressure generation chamber 12 is disposed. For example, when the pressure generating chambers 12 are arranged at about 180 (180 dpi) per inch, the thickness of the flow path forming substrate 10 is preferably about 180 to 280 μm, more preferably about 220 μm. is there. For example, when the pressure generating chambers 12 are arranged at a relatively high density of about 360 dpi, the thickness of the flow path forming substrate 10 is preferably 100 μm or less. This is because the arrangement density can be increased while maintaining the rigidity of the partition wall 11 between the adjacent pressure generation chambers 12.
In this embodiment, since the arrangement density of the pressure generating chambers 12 is about 360 dpi, the thickness of the flow path forming substrate 10 is about 70 μm.

  An elastic film 50 having a thickness of 0.5 to 2 μm made of silicon dioxide is previously formed on one surface of the flow path forming substrate 10 by thermal oxidation. On the elastic film 50 on the surface of the flow path forming substrate 10, an insulator film 55 having a thickness of, for example, about 0.4 μm is formed. On the insulator film 55, as a pressure generating means for causing a pressure change in the pressure generating chamber 12, a lower electrode film 60 having a thickness of, for example, about 0.2 μm, and a thickness of, for example, about 1. A piezoelectric element 300 including a piezoelectric layer 70 having a thickness of 0 μm and an upper electrode film 80 having a thickness of, for example, about 0.05 μm is formed. Further, a lead electrode 90 is connected to the upper electrode film 80 of each piezoelectric element 300, and a voltage is selectively applied to each piezoelectric element 300 via the lead electrode 90. .

  On the other hand, on the opening surface side of the flow path forming substrate 10 opposite to the elastic film 50 side, a bonding member bonded to the flow path forming substrate 10 is provided on the side opposite to the ink supply path 14 of each pressure generating chamber 12. A nozzle plate 20 having a nozzle opening 21 communicating with the vicinity of the end is bonded by an adhesive 35.

  Here, with reference to FIG. 3, the pressure generation chamber 12 formed in the flow path forming substrate 10 will be specifically described. FIG. 3 is an enlarged view of a main part of the pressure generating chamber, FIG. 3 (a) is a top view, and FIG. 3 (b) is a cross-sectional view along BB ′. As shown in FIGS. 3A and 3B, the pressure generating chamber 12 has an elongated shape. Further, the nozzle plate 20 is bonded to the surface of the flow path forming substrate 10 opposite to the vibration plate (elastic film 50) side by an adhesive 35, whereby the pressure generating chamber 12 is blocked by the nozzle plate 20. It is peeling. In this embodiment, the edge shape of the corner 12a, which is the end of the pressure generating chamber 12 on one end side in the longitudinal direction (left side in the figure), more specifically, the corner 12a on the nozzle plate 20 side is the pressure shape. It is formed with a radius of curvature that is half the width of the generation chamber 12.

  Further, in the present embodiment, the wall surface on one end side in the longitudinal direction of the pressure generating chamber 12 extends along the edge shape of the corner portion 12a on the nozzle plate 20 side of the pressure generating chamber 12 until it reaches the elastic film 50. The elastic membrane 50 is erected in a substantially vertical direction. That is, the wall surface on the one end side in the longitudinal direction of the pressure generation chamber 12 has a curved shape with a radius of curvature that is half the width of the pressure generation chamber 12.

  Thus, in this embodiment, since the corner 12a of the pressure generating chamber 12 is curved with a predetermined radius of curvature, the edge of the pressure generating chamber 12 on the nozzle plate 20 side of the adhesive 35 is The movement is restricted (regulated), and the flow of the adhesive 35 from the adhesion region between the flow path forming substrate 10 and the nozzle plate 20 into the pressure generation chamber 12 can be effectively suppressed. For this reason, it can suppress effectively that the adhesive agent 35 adheres to a diaphragm (elastic film 50), and the deformation | transformation (displacement) of a diaphragm becomes difficult to be inhibited by the adhesive agent 35. In particular, in the present embodiment, the corner 12a of the pressure generating chamber 12 is curved with a predetermined radius of curvature until reaching the elastic film 50, so that the adhesive 35 is more effectively suppressed from adhering to the elastic film. can do. As a result, it is possible to suppress a drop in ink ejection characteristics of the head, and to improve the reliability of the head.

  In the present embodiment, the wall surface at one end in the longitudinal direction of the pressure generation chamber 12 is erected in a substantially vertical direction with respect to the elastic film 50. However, the present invention is of course not limited to this, for example, the nozzle plate of the pressure generation chamber Even when a wall surface (inclined surface) that is inclined at a predetermined angle from the corner on the side toward the elastic film, the adhesive flows out into the pressure generating chamber only at the nozzle plate side corner of the pressure generating chamber. Since it can fully stop, it can suppress effectively that an adhesive agent adheres to an elastic membrane.

  Further, in the present embodiment, the nozzle plate 20 is illustrated as a bonding member bonded to the flow path forming substrate 10, and the edge shape of the corner 12 a of the pressure generation chamber 12 is a radius of curvature that is half the width of the pressure generation chamber. Of course, the present invention is not limited to this. In the present invention, when the bonding substrate is bonded to the flow path forming substrate with an adhesive, the edge shape of the corner on the bonding substrate side of the pressure generating chamber is at least half the width dimension of the pressure generating chamber (for example, the pressure generating chamber When the width dimension is 38 μm, it is preferably formed with at least one of a radius of curvature of 19 μm or more and an obtuse angle.

  Here, FIG. 4 illustrates a modification of the pressure generation chamber. For example, as shown in FIG. 4A, the edge shape of the corner 12a of the pressure generating chamber 12A may be a shape in which one vertex is an obtuse angle. Moreover, as shown in FIG.4 (b), it is good also considering the edge shape of the corner 12a of the pressure generation chamber 12B as the shape where two vertexes became an obtuse angle. Further, as shown in FIG. 4C, the edge shape of the corner 12a of the pressure generating chamber 12C may be a shape having a predetermined curvature radius in which one apex is an obtuse angle and the apex is curved. Furthermore, as shown in FIG. 4D, the edge shape of the corner 12a of the pressure generating chamber 12D may be a shape having a predetermined radius of curvature with one apex having an acute angle and the apex being curved. In addition, in the shape of these FIG.4 (c) and FIG.4 (d), about the curvature radius of a vertex, you may make it smaller than half of the width dimension of a pressure generation chamber, for example, may be more than half, In any case, it is only necessary that the pressure generating chambers 12C and 12D have a curvature that does not flow out of the adhesive.

  On the surface on the piezoelectric element 300 side of the flow path forming substrate 10 in which such a pressure generating chamber 12 is formed, a protective substrate 30 having a piezoelectric element holding portion 31 in a region facing the piezoelectric element 300 is interposed via an adhesive 35. Are joined. Since the piezoelectric element 300 is formed in the piezoelectric element holding part 31, it is protected in a state hardly affected by the external environment. In addition, as for the piezoelectric element holding | maintenance part 31, the space may be sealed and does not need to be sealed. The protective substrate 30 is formed with a reservoir portion 32 that constitutes the reservoir 100 in communication with the communication portion 13 of the flow path forming substrate 10.

  Further, a driving IC 200 for driving the piezoelectric element 300 is mounted on the protective substrate 30. The leading end portion of each lead electrode 90 drawn from each piezoelectric element 300 to the outside of the piezoelectric element holding portion 31 is electrically connected to the drive IC 200 via the drive wiring 210.

  In addition, a compliance substrate 40 including a sealing film 41 and a fixing plate 42 is bonded onto the protective substrate 30 to seal the reservoir portion 32. The region of the fixing plate 42 that faces the reservoir portion 32 is an opening 43 that is completely removed in the thickness direction, and the reservoir portion 32 is actually only a flexible sealing film 41. It is sealed with.

  In such an ink jet recording head according to the present embodiment, ink is taken in from an external ink supply unit (not shown), filled with ink from the reservoir 100 to the nozzle opening 21, and then subjected to pressure according to a recording signal from the driving IC 200. By applying a voltage between each of the lower electrode film 60 and the upper electrode film 80 corresponding to the generation chamber 12 to bend and deform the piezoelectric element 300 and the diaphragm, the pressure in each pressure generation chamber 12 is increased. Ink is ejected from the opening 21.

  Hereinafter, a method for manufacturing such an ink jet recording head will be described with reference to FIGS. 5 to 7 are cross-sectional views in the longitudinal direction of the pressure generating chamber showing the method for manufacturing the ink jet recording head.

  First, as shown in FIG. 5A, a channel forming substrate wafer 110 which is a silicon wafer is thermally oxidized in a diffusion furnace at about 1100 ° C., and a silicon oxide film 51 constituting an elastic film 50 is formed on the surface thereof. To do. In the present embodiment, as the flow path forming substrate wafer 110, a relatively thick and highly rigid silicon wafer having a thickness of about 625 μm is used.

Next, as shown in FIG. 5B, an insulator film 55 made of zirconium oxide is formed on the elastic film 50 (silicon oxide film 51). Specifically, after a zirconium (Zr) layer is formed on the elastic film 50 (silicon oxide film 51) by, for example, a sputtering method, the zirconium layer is thermally oxidized in a diffusion furnace at 500 to 1200 ° C., for example. Thus, the insulator film 55 made of zirconium oxide (ZrO ₂ ) is formed.

  Next, as shown in FIG. 5C, for example, platinum and iridium are laminated on the insulator film 55 to form the lower electrode film 60, and then the lower electrode film 60 is patterned into a predetermined shape. Next, as shown in FIG. 5 (d), a piezoelectric layer 70 made of, for example, lead zirconate titanate (PZT) and an upper electrode film 80 made of, for example, iridium are connected to a wafer 110 for flow path forming substrate. The piezoelectric element 300 is formed by patterning the piezoelectric layer 70 and the upper electrode film 80 in regions facing the pressure generation chambers 12. Next, as shown in FIG. 6A, lead electrodes 90 are formed. Specifically, for example, a wiring layer 95 made of, for example, gold (Au) or the like is formed on the entire surface, and the wiring layer 95 is patterned to form the lead electrode 90 drawn from each piezoelectric element 300.

  Next, as shown in FIG. 6B, the protective substrate wafer 130 is bonded onto the flow path forming substrate wafer 110 with an adhesive 35. After the protective substrate wafer 130 is bonded to the flow path forming substrate wafer 110 in this way, the flow path forming substrate wafer 110 is polished to a certain thickness as shown in FIG. A predetermined thickness is formed by wet etching with hydrofluoric acid.

  Then, as shown in FIG. 7, the pressure generating chamber 12, the communication unit 13, and the ink supply path are dry-etched through the mask film (not shown) until the elastic film 50 is exposed. 14 etc. are formed in a predetermined shape. In the present embodiment, with respect to the pressure generation chamber 12, the longitudinal end of the pressure generation chamber 12, that is, the edge shape of the corner 12 a opposite to the ink supply path 14 side is set to the width dimension of the pressure generation chamber 12. It was formed with a half radius of curvature. After forming the pressure generating chamber 12 and the like in this way, the reservoir 100 is formed by allowing the communication portion 13 and the reservoir portion 32 to communicate with each other through the elastic film 50 and the insulator film 55.

  Although not shown, after that, the driving IC 200 is mounted on the protective substrate wafer 130 via a wiring pattern (not shown), and the driving IC 200 and the lead electrode 90 are connected by the driving wiring 210. Furthermore, unnecessary portions of the outer peripheral edge portions of the flow path forming substrate wafer 110 and the protective substrate wafer 130 are removed by cutting, for example, by dicing.

  Then, an adhesive 35 is applied to the surface of the flow path forming substrate wafer 110 opposite to the protective substrate wafer 130, and the nozzle plate 20 in which the nozzle openings 21 are formed is joined from above (FIG. 7). reference). In this embodiment, as described above, the edge shape of the corner 12a of the pressure generating chamber is formed with a predetermined radius of curvature, so that the nozzle plate 20 is attached to the flow path forming substrate 10 with the adhesive 35. When adhering by the above, the movement of the adhesive 35 is restricted at the corner 12a (edge) of the pressure generating chamber, and the pressure generating chamber 12 is moved from the bonding area between the flow path forming substrate 10 and the nozzle plate 20 to each other. It is possible to effectively suppress the adhesive 35 from flowing out. As a result, it is possible to effectively prevent the adhesive 35 from adhering to the diaphragm (elastic film 50), to suppress a decrease in ink ejection characteristics of the head, and to improve the reliability of the head. it can.

  In practice, the compliance substrate 40 is bonded to the protective substrate wafer 130, and the flow path forming substrate wafer 110 or the like is divided into a single chip size flow path forming substrate 10 or the like as shown in FIG. Thus, an ink jet recording head having the structure described above is manufactured.

(Other embodiments)
As mentioned above, although this invention was demonstrated in detail based on Embodiment 1, this invention is not limited to Embodiment 1 mentioned above. For example, in Embodiment 1 described above, the nozzle plate 20 having the nozzle openings 21 is bonded to the flow path forming substrate 10, but of course not limited to this, for example, although not shown, pressure is generated on the flow path forming substrate. A nozzle opening communicating with the chamber may be provided, and the bonding substrate may be bonded to the flow path forming substrate with an adhesive so as to close the pressure generating chamber.

  Further, such a liquid ejecting head of the present invention constitutes a part of a recording head unit including an ink flow path communicating with an ink cartridge or the like, and is mounted on the liquid ejecting apparatus. FIG. 8 is a schematic diagram illustrating an example of the liquid ejecting apparatus.

  As shown in FIG. 8, in the recording head units 1A and 1B having the liquid ejecting head, cartridges 2A and 2B constituting the ink supply means are detachably provided, and the carriage 3 on which the recording head units 1A and 1B are mounted is provided. A carriage shaft 5 attached to the apparatus main body 4 is provided so as to be movable in the axial direction. The recording head units 1A and 1B, for example, are configured to eject a black ink composition and a color ink composition, respectively.

  The driving force of the driving motor 6 is transmitted to the carriage 3 via a plurality of gears and timing belt 7 (not shown), so that the carriage 3 on which the recording head units 1A and 1B are mounted is moved along the carriage shaft 5. The On the other hand, the apparatus body 4 is provided with a platen 8 along the carriage shaft 5, and a recording sheet S which is a recording medium such as paper fed by a paper feed roller (not shown) is conveyed onto the platen 8. It is like that.

  Here, in the above-described embodiment, the liquid ejecting head has been described as an example of the liquid ejecting head of the present invention, but the basic configuration of the liquid ejecting head is not limited to the above-described configuration. The present invention is intended for a wide range of liquid ejecting heads, for example, various recording heads used in image recording apparatuses such as printers, color material ejecting heads used in the manufacture of color filters such as liquid crystal displays, The present invention can also be applied to electrode material ejecting heads used for forming electrodes such as organic EL displays and FEDs (surface emitting displays), bioorganic matter ejecting heads used for biochip manufacturing, and the like.

  Needless to say, a liquid ejecting apparatus including such a liquid ejecting head is not particularly limited. In addition, the present invention can be applied not only to an actuator device mounted as pressure generating means on such a liquid jet head but also to an actuator device mounted on any device. For example, the actuator device can be applied to a sensor or the like in addition to the head described above.

FIG. 2 is an exploded perspective view illustrating the ink jet recording head according to the first embodiment. FIG. 2 is a plan view and an AA ′ cross-sectional view of the ink jet recording head according to the first embodiment. The principal part enlarged view of the pressure generation chamber of Embodiment 1. FIG. Schematic which shows the modification of the pressure generation chamber of Embodiment 1. FIG. FIG. 3 is a cross-sectional view illustrating a manufacturing process of the ink jet recording head according to the first embodiment. FIG. 3 is a cross-sectional view illustrating a manufacturing process of the ink jet recording head according to the first embodiment. FIG. 3 is a cross-sectional view showing a manufacturing process of the ink jet recording head of Embodiment 1. Schematic of the liquid ejecting apparatus according to another embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Flow path formation board | substrate, 12 Pressure generation chamber, 13 Communication part, 14 Ink supply path, 20 Nozzle plate, 21 Nozzle opening, 30 Protection board, 31 Reservoir part, 32 Piezoelectric element holding part, 40 Compliance board, 50 Elastic film, 55 Insulator film, 60 Lower electrode film, 70 Piezoelectric layer, 80 Upper electrode film, 90 Lead electrode, 100 Reservoir, 300 Piezoelectric element

Claims (5)

A flow path forming substrate provided with a pressure generating chamber communicating with a nozzle opening for ejecting liquid droplets, and a region corresponding to the pressure generating chamber on one side of the flow path forming substrate is provided via a diaphragm. Pressure generating means for causing a pressure change in the pressure generating chamber, and a bonding substrate bonded to the other surface of the flow path forming substrate by an adhesive, and at a corner of the pressure generating chamber on the bonding substrate side. The liquid ejecting head is characterized in that the edge shape is formed by at least one of a radius of curvature of 19 μm or more and an obtuse angle. The liquid ejecting head according to claim 1, wherein an edge shape of a corner portion of the pressure generating chamber is formed with a radius of curvature that is half of a width dimension of the pressure generating chamber. 3. The liquid ejecting head according to claim 1, wherein the pressure generating chamber is formed by dry etching the flow path forming substrate. The liquid ejecting head according to claim 1, wherein the bonding substrate is a nozzle plate provided with the nozzle openings. A liquid ejecting apparatus comprising the liquid ejecting head according to claim 1.

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