JP2007044703A - Component mounting tool - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a component mounting tool capable of preventing the position of a component from being deviated when releasing a holding means from the component, easily and reliably performing a series of mounting operations by a single hand, and enhancing the component mounting efficiency and the component mounting positional accuracy. <P>SOLUTION: The component mounting tool 1 has a holding means (an iron tip 20) for holding a component. When mounting the component held by the iron tip 20 on a mounting surface, a component holding means 30 for holding the component while the component is pressed against the mounting surface is equipped. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

The present invention relates to a component mounting tool, and more particularly to a component mounting tool provided with a clamping means for clamping a component.

A component mounting board that has been mounted on a printed circuit board and passed through a mounting line for circuit connection with solder or the like is usually inspected for mounting status and soldering status of each component by visual inspection or visual inspection machine. The In this inspection, when a soldering failure, a component displacement, or the like is detected, a repair operation is performed to reattach a component with a poor mounting to a normal position.

FIGS. 7A to 7D are views for explaining the mounting operation at the time of repairing a chip component using a conventional component mounting tool. When a chip component repair operation is performed, a component mounting tool 100 in which two tips 20 are attached to a main body 101 serving as a grip so as to be opened and closed is used. The tip 20 has a built-in heater so that the solder can be heated to a temperature at which the solder can be melted, and has a soldering iron function.

When performing the repair work, first, the chip component 50 in which the positional deviation or the like is detected is sandwiched between the heated iron tips 20, the solidified solder is melted, and then the chip component 50 is removed from the substrate 60. Next, the solder remaining on the land 61 on which the chip component 50 is mounted is removed, and new solder 62 is applied.

Next, the mounting operation is started. First, the chip component 50 is sandwiched between the heated tip 20 (FIG. 7A).
)) With the chip component 50 held, the chip component 50 is placed on the land 61 and the solder 62 on the land 61 is melted by the heat transmitted from the tip 20 (FIG. 7B). Thereafter, the tip 20 is opened, the tip 20 is separated from the chip component 50 (FIG. 7C), and the solder 6
2 is solidified and the repair work of the chip component 50 is completed.

However, when the tip 20 is separated from the chip component 50 in the above repair work (
7 (c)), when the operation of separating both the tips 20 from the chip component 50 is not performed at the same time, as shown in FIG. 7 (d), the chip component 50 is placed in a desired mounting position (land 61). There is a problem that it is difficult to mount the chip component 50 with high positional accuracy.
Particularly in recent years, the miniaturization of parts has progressed, and there are more cases where small parts of several millimeters square or even 1 mm square or less are mounted. The smaller the parts are, the more difficult the repair work by the conventional part mounting tool 100 becomes. It was a factor that lowered work efficiency.

Further, Patent Document 1 below discloses a soldering iron that performs soldering work by pressing an electric wire with a pressing member when the electric wire is soldered to a circuit board. The former has only a function of pressing the electric wire, and before soldering the electric wire to the circuit board, an extra step of temporarily fixing the electric wire to the circuit board with a double-sided adhesive tape or the like is necessary.
JP-A-8-215837

Means for solving the problems and their effects

The present invention has been made in view of the above problems, and when separating the clamping means from the component, the position of the component can be prevented from being shifted, and a series of mounting operations can be easily and reliably performed with one hand. It is an object of the present invention to provide a component mounting tool that can be performed and can improve the work efficiency and positional accuracy of component mounting.

In order to achieve the above object, a component mounting tool (1) according to the present invention is a component mounting tool provided with a clamping means for clamping a component, and when the component clamped by the clamping means is mounted on a mounting surface. The component holding means for holding the component in a state of being pressed against the mounting surface is provided.

According to the component mounting tool (1), when the component clamped by the clamping unit is mounted on the mounting surface, the component holding unit holds the component in a state of being pressed against the mounting surface. The component can be separated from the clamping unit while the component is pressed against the mounting surface by the component holding unit, and an inappropriate operation is performed such as when the clamping unit is not separated from the component at the same time. Even if it is a small part that is difficult to attach, it can be attached with high positional accuracy without shifting the part. In addition, a series of operations for mounting the components without shifting can be easily performed with one hand, and the work efficiency of component mounting can be improved.

In the component mounting tool (2) according to the present invention, in the component mounting tool (1), the clamping means is attached to a main body having an opening / closing mechanism of the clamping means, and the component holding means is arranged at one end side. The other end side is comprised by the elastic support member attached to the main-body part and extended to the position near the front-end | tip part of the said clamping means, It is characterized by the above-mentioned.

According to the component mounting tool (2), the component holding means is composed of an elastic support member having one end attached to the main body and the other end extended to a position near the tip of the clamping means. Therefore, in the normal operation of sandwiching the component with the clamping means and placing it on the mounting surface, the component is pressed against the mounting surface with an appropriate force using the elasticity of the elastic support member. The component mounting tool (1) can be separated from the clamping means while the component is pressed against the mounting surface at the other end of the elastic support member.
And substantially the same effect can be obtained. The elastic support member can be formed of a member such as a metal having elasticity due to bending, which is processed into a thin plate shape or a rod shape.

The component mounting tool (3) according to the present invention is characterized in that, in the component mounting tool (2), the elastic support member is slidably mounted in the axial direction of the clamping means.

According to the component mounting tool (3), since the elastic support member is slidably attached in the axial direction of the clamping means, the elastic support member is attached in the axial direction (tip direction) of the clamping means.
The other end side of the elastic support member can be surely pressed against the component by sliding it on the other end side of the elastic support member, and the clamping is performed while the component is pressed against the mounting surface on the other end side of the elastic support member. The operation of separating the component from the means can be performed more reliably, and the component mounting tool (1
) And substantially the same effect can be obtained. In addition, the arrangement position of the other end of the elastic support member can be adjusted according to the size (height) of the component, the convenience of the operator, and the like.

The component mounting tool (4) according to the present invention is characterized in that, in the component mounting tool (2) or (3), the other end side of the elastic support member has a curved shape in a side view.

According to the component mounting tool (4), since the other end side of the elastic support member has a curved shape in a side view, the other end side of the elastic support member is not damaged with respect to the surface of the component. Can be pressed against.

In the component mounting tool (5) according to the present invention, in the component mounting tool (1), the clamping means is attached to a main body having an opening / closing mechanism of the clamping means, and the component holding means is arranged at one end side. It is configured to include a support portion attached to the main body portion and having the other end side extended to a position near the tip end portion of the clamping means, and a component abutting portion attached to the other end side of the support portion. It is characterized by.

According to the component mounting tool (5), the component holding means has one end side attached to the main body portion and the other end side extended to a position near the tip end portion of the clamping means, And a component abutting portion mounted on the other end side, so that when the component clamped by the clamping means is attached to the mounting surface, the component mounting portion mounted on the other end side of the support portion By contact
The component can be reliably held in a state of being pressed against the mounting surface, and the mounting operation of separating the component from the clamping means can be reliably performed while the component is being held. An effect similar to that of the tool (1) can be obtained.

In addition, the component mounting tool (6) according to the present invention is characterized in that, in the component mounting tool (5), the component contact portion has a shape that contacts the upper surface and at least one side surface of the component. .

According to the component mounting tool (6), since the component abutting portion is in contact with the upper surface and at least one side surface of the component, the upper surface and at least one side surface of the component are brought into contact with the component abutting portion. It can hold | maintain simultaneously by a part, and the position shift prevention effect of the said component can be heightened further.

The component mounting tool (7) according to the present invention is the component mounting tool (5) or (6), wherein the component contact portion is provided and an elastic member is disposed on the contact surface with the component. It is characterized by being.

According to the component mounting tool (7), since the elastic member is disposed on the contact surface of the component contact portion with the component, the component is mounted using the elasticity of the elastic member. It can hold | maintain in the state pressed against the surface by moderate force, and can improve the position shift prevention effect of the said components. Examples of the elastic member include heat-resistant silicone rubber (for example, heat-resistant temperature 450
℃, etc.), heat-resistant plastics, elastomers, etc. can be used, and the shape can be not only a plate shape but also a spherical shape, etc., and its size (thickness, diameter, etc.) can be adjusted By doing so, it can set so that appropriate elasticity may be acquired.

The component mounting tool (8) according to the present invention is the component mounting tool (5) to (7), wherein the component contact portion is tiltably mounted on the other end side of the support portion. It is characterized by being.

According to the component mounting tool (8), since the component contact portion is tiltably mounted on the other end side of the support portion, it depends on the use angle when the component is clamped by the clamping means. Thus, the component abutting portion can be tilted, and the component can be held in a state in which the component is reliably pressed against the mounting surface.

Moreover, the component mounting tool (9) according to the present invention is such that, in any of the component mounting tools (5) to (8), the support portion is mounted so as to be slidable in the axial direction of the clamping means. It is characterized by.

According to the component mounting tool (9), since the support portion is slidably attached in the axial direction of the clamping means, the support portion is slid in the axial direction (tip direction) of the clamping means. By doing so, the component abutting portion can be reliably pressed against the component, and the operation of separating the component from the clamping means can be ensured while the component abutting portion is pressed against the mounting surface. The effect similar to the said component attachment tool (1) can be acquired.
In addition, the arrangement position of the component contact portion can be adjusted in accordance with the size (height) of the component, the convenience of the operator, and the like.

Further, the component mounting tool (10) according to the present invention is the component mounting tool (10) according to any one of the component mounting tools (5) to (9), wherein the support portion receives a pressing force from the component contact portion and expands and contracts. It is characterized by being configured to generate a repulsive force against the pressing force.

According to the component mounting tool (10), the support portion is configured to expand and contract in response to a pressing force from the component contact portion, and a repulsive force is generated against the pressing force. By the operation of pressing the contact portion against the component, the component can be pressed against the mounting surface with an appropriate force, and the component can be held in a more stable state.

In addition, the component mounting tool (11) according to the present invention is configured such that, in any of the component mounting tools (1) to (10), the tip of the clamping means is heated to a temperature at which the solder can be melted. It is characterized by being.

According to the component mounting tool (11), since the tip of the clamping means is configured to be heated to a temperature at which the solder can be melted, the component is sandwiched by the heated clamping means, and the component The solder applied to the mounting surface is melted by the heat from the clamping means while the component is pressed against the mounting surface by the elastic support member or the component abutting portion. In addition, while maintaining the pressed state of the part, the part can be separated from the clamping unit, and a series of mounting operations of solidifying the solder and mounting the part can be performed reliably, and the part can be removed from the clamping unit. It is possible to prevent the position of the component from being displaced at the time of separation, and it is possible to attach a component that is difficult to solder, such as a small component, with high positional accuracy. Further, the series of operations for soldering without shifting the components can be easily performed with one hand, and can be used as a soldering iron that improves the efficiency of repair work of surface-mounted components.

Embodiments of a component mounting tool according to the present invention will be described below with reference to the drawings. FIG. 1 is a diagram schematically showing a component mounting tool according to Embodiment (1), where (a) is a plan view and (b).
Shows a side view.

The component mounting tool 1 includes a main body portion 10 formed of a resinous housing having insulation and heat resistance, two tips (clamping means) 20 attached to one end side of the main body portion 10, and one end. Side is body part 1
The component holding means 30 is composed of an elastic support member that is fixed to 0 and whose other end extends to a position near the tip of the tip 20.

The main body unit 10 is equipped with an opening / closing mechanism (not shown) using, for example, a spring member for opening and closing the tip 20, and an opening / closing operation unit 11 provided on a side surface of the main body unit 10 is provided. Hand (finger)
By pushing in, both the tips 20 are brought close (closed) so that the parts can be clamped at the tip of the tip 20. The shape of the main body 10 is not limited to the shape shown in FIG. 1, and may be any shape that has a mechanism for opening and closing the tip 20.

The tip 20 has a built-in heater (not shown).
0 is connected to a power cord 12 extending from the other end side to the outside, and a heater is driven by power feeding from the power cord 12 so that the tip 20 can melt solder (for example, 200 ° C.).
The heating is controlled so as to be ˜400 ° C.). The tip 20 can be appropriately replaced in accordance with the size, shape, etc. of the parts to be sandwiched.

Further, the component holding means 30 constituted by an elastic support member (for example, a metal leaf spring).
Is disposed in the middle of the tip 20 in plan view, and is one end side of the component holding means 30 (the main body 10 side).
Is fixed by being fitted into a groove 13 formed in the main body 10.
On the other end side (tip 20 side), there is a curved surface portion 30a formed in a curved shape when viewed from the side, and when the component is clamped by the tip 20, the curved surface shape on the other end side is provided. The part 30a is configured to contact the upper surface of the component. The horizontal width of the component holding means 30 is designed to be smaller than the horizontal width of the component to be sandwiched.

Moreover, the attachment method to the main-body part 10 of the component holding means 30 should just be a method which can fix the one end side of the component holding means 30, and it is not the method of fitting in the groove part 13 formed in the main-body part 10, and fixing. For example, a fixing member such as a screw or a fixing method using an adhesive or the like may be employed.

Next, a chip component mounting operation using the component mounting tool 1 according to the embodiment (1) will be described. FIGS. 2A to 2D are views for explaining a mounting operation when repairing a chip component using the component mounting tool 1 according to the embodiment (1).

First, the chip component 50 is sandwiched between the heated tip 20 (FIG. 2A). At this time, the curved surface shape portion 30 a of the component holding means 30 comes into contact with the upper surface of the chip component 50. Next, the chip component 50 is placed on the land 61 while the chip component 50 is sandwiched by the tip 20, and the solder 62 on the land 61 is melted by the heat transmitted from the tip 20 (see FIG. 2 (b
)). At this time, the curved surface shape portion 30a of the component holding means 30 is in contact with the upper surface of the chip component 50, and when the tip 20 is moved in the direction in which the tip 20 stands (arrow direction in the figure), the spring elasticity of the component holding means 30 is used. Thus, the chip component 50 can be pressed against the substrate 60 (attachment surface) by the curved surface portion 30a.

After the solder 62 is melted, the tip 20 is moved in the standing direction, the tip 20 is opened while the chip component 50 is pressed against the substrate 60 by the curved surface portion 30a, and the tip 20 is moved to the chip. The chip part 50 is kept pressed against the substrate 60 by the curved shape portion 30a until the solder 62 is solidified until it is separated from the component 50 (FIG. 2C). While pulling up in the direction, the curved surface portion 30a is separated from the chip component 50 (FIG. 2 (d)).
The repair of the chip component 50 is finished.

According to the component mounting tool 1 according to the above embodiment (1), when the chip component 50 sandwiched by the tip 20 having the melting function of the solder 62 is attached to the substrate 60, the chip component 50 is attached to the substrate 60. An elastic support member having a component holding means 30 for holding in a pressed state, wherein the component holding means 30 has one end fixed to the main body 10 and the other end extended to a position near the tip of the tip 20. In the normal operation flow in which the chip component 50 is sandwiched between the tip 20 and placed on the substrate 60 and soldered, that is, without any special operation, the component is held. By utilizing the spring elasticity of the elastic support member constituting the means 30, the chip part 50 can be held in a state of being pressed against the substrate 60 with an appropriate force. The curved part 30a of the part holding means 30 allows the chip part to be held. 50 Remain pressed against the substrate 60, it can be from soldering tip 20 separating the chip component 50.

Therefore, even if the tip part 20 is not separated from the tip part 20 at the same time, even if it is improperly operated or a small part that is difficult to attach, the chip part 50 is attached with high positional accuracy without being displaced. Can do. A series of operations for soldering the chip component 50 without shifting can be easily and reliably performed with one hand, and can be used as a soldering iron that improves the efficiency of the mounting operation of the surface-mounted component and the mounting position accuracy.
In addition, the component holding means 30 can be pressed against the chip component 50 without damaging the surface of the chip component 50 by the curved shape portion 30 a of the component holding means 30.

FIG. 3 is a diagram schematically illustrating a component mounting tool according to Embodiment (2), where (a) is a plan view and (b) is a side view. However, components having the same functions as those of the component mounting tool 1 according to the embodiment (1) shown in FIG.

Component mounting tool 1 according to embodiment (1) and component mounting tool 1A according to embodiment (2)
With, the configuration of the component holding means and the mounting structure to the main body of the component holding means are different,
In the component mounting tool 1A according to the embodiment (2), the component holding means 30A is slidably mounted at one end side to the main body portion 10A, and the other end side is extended to a position near the tip end portion of the tip 20. The support part 31 and the component contact part 32 attached to the other end side of the support part 31 in a tiltable manner are included.

The support portion 31 constituting the component holding means 30A is made of, for example, a thin rod-shaped metal member, and is disposed in the middle of the tip 20 in plan view. On the mounting surface of the support portion 31 in the main body portion 10A, a guide groove 1 having a concave shape having a width substantially equal to that of the support portion 31 of the component holding means 30A.
4 is formed, and the support portion 31 of the component holding means 30A is fitted into the guide groove 14. And, using the protruding sliding operation part 31a provided on the support part 31 of the component holding means 30A,
The component holding means 30 </ b> A can be slid along the guide groove 14 in the axial direction of the tip 20. It should be noted that the guide groove 14 of the main body 10A is anti-slip processed, and has a structure in which the component holding means 30A cannot be slid unless a certain force is applied. The component holding means 30 </ b> A cannot be slid with a force sufficient to press the component with the portion 32.

The component contact portion 32 is configured by a metal plate member having a substantially L shape in side view, and the tip 20
In such a state that the component holding means 30A is slid downward (to the tip end side of the tip 20) while the component is sandwiched between the components, the component contact portion 32 can be brought into contact with the upper surface and one side surface of the component. It is configured. The connecting portion between the other end side of the support portion 31 and the component abutting portion 32 is such that the main body portion 10A is a component with the tip 20 with the other end of the support portion 31 (the tip end side of the tip 20) as a fulcrum. It is structured to be able to tilt forward and backward while being held.

Next, a chip component mounting operation using the component mounting tool 1A according to the embodiment (2) will be described. FIGS. 4A to 4D are views for explaining the mounting work at the time of repairing a chip component using the component mounting tool 1A according to the embodiment (2).

First, the chip component 50 is sandwiched between the heated tip 20 and the chip component 50 is sandwiched between the tip 20 and the chip component 50 is placed on the land 61, and heat transmitted from the tip 20. Then, the solder 62 on the land 61 is melted (FIG. 4A). At this time, the component contact portion 32 of the component holding means 30 </ b> A is located above the chip component 50.

After melting the solder 62, the sliding operation portion 3 provided on the support portion 31 of the component holding means 30A.
The component holding means 30A is slid downward by operating 1a, and the component contact portion 32 is moved to the chip component 5
The chip component 50 is pressed against the substrate 60 by the component contact portion 32 in contact with the 0 upper surface and 1 side surface (FIG. 4B).

Thereafter, while holding the chip component 50 pressed against the substrate 60 at the component contact portion 32, the tip 20 is opened, and the tip 20 is separated from the chip component 50 (FIG. 4C), and soldering is performed. 62
The component contact portion 32 holds the state where the chip component 50 is pressed against the substrate 60 until the component 62 is solidified. After the solder 62 is solidified, the component contact portion 32 is moved upward while the main body 10A is pulled upward. Apart from 50 (FIG. 4 (d)), the repair of the chip component 50 is completed.

According to the component mounting tool 1A according to the above embodiment (2), the component holding means 30A is slidably mounted at one end side to the main body portion 10A, and the other end side extends to a position near the tip end portion of the tip 20. Since it is configured to include a support portion 31 provided and a component abutting portion 32 having a substantially L shape in side view and attached to the other end side of the support portion 31 in a tiltable manner, When the clamped chip component 50 is attached to the substrate 60, the component holding means 30A is slid downward to support the support 3
The chip contact 50 can be securely held while being pressed against the substrate 60 by the component abutting portion 32 mounted on the other end side of the tip 1, and the tip 20 is held while the chip component 50 is held.
The mounting operation of separating the chip component 50 from the center can be performed reliably.

Therefore, even if the tip part 20 is not separated from the tip part 50 at the same time, even if it is improperly operated or a small part that is difficult to attach, the chip part 50 is attached with good positional accuracy without being displaced. Can do. A series of operations for soldering the chip component 50 without shifting can be easily performed with one hand, and can be used as a soldering iron that improves the efficiency of repair work of the surface-mounted component.

In addition, since the component contact portion 32 is composed of a plate member having a substantially L shape in side view, the upper surface and one side surface of the chip component 50 can be simultaneously held by the component contact portion 32,
The effect of preventing displacement of the chip component 50 can be further enhanced.

In addition, since the component contact portion 32 is tiltably attached to the other end side of the support portion 31, the component contact portion 32 depends on the use angle when the chip component 50 is clamped by the tip 20. Can be tilted, and the chip component 50 can be held in a state of being pressed firmly against the substrate 60.

In the component mounting tool 1A according to the above embodiment (2), the component abutting portion 32 of the component holding means 30A is a flat plate member having a substantially L shape in side view so as to abut on the component upper surface and at least one side surface. Although it is configured, it may have a shape other than a substantially L shape in side view, for example, a U shape, and an elastic member (for example, heat-resistant silicone rubber, (Heat resistant plastic, elastomer, etc.) may be provided. According to such a configuration, using the elasticity of the elastic member, it is possible to hold the component in a state where it is pressed against the mounting surface with an appropriate force,
The effect of preventing the displacement of the parts can be enhanced. The shape of the elastic member can be not only a flat plate shape but also a shape having a spherical surface (for example, a hemispherical shape). By adjusting the size (thickness and diameter), etc., an appropriate elastic force can be obtained. Can be obtained.

Moreover, in the component attachment tool 1 which concerns on the said embodiment (1), although the one end side of the component holding means 30 which consists of an elastic support member is comprised by the main-body part 10, it is comprised in another embodiment. The component holding means 30 may be slidably attached to the main body 10 as in the component attachment tool 1A according to the above embodiment (2). In addition, it is good also as a structure which provides the stopper function which can fix the component holding means 30 in the position slid arbitrarily. According to such a configuration, the height position of the curved surface portion 30a can be finely adjusted according to the size (height) of the part, the convenience of the operator, and the like, and the work efficiency can be further enhanced.

FIG. 5 is a diagram schematically showing a component mounting tool according to Embodiment (3), where (a) shows a plan view and (b) shows a side view. However, components having the same functions as those of the component mounting tool 1 according to the embodiment (1) shown in FIG.

Component mounting tool 1 according to embodiment (1) and component mounting tool 1B according to embodiment (3)
And the structure of the component holding means is different, and the component mounting tool 1B according to the embodiment (3)
Then, the component holding means 30 </ b> B is tiltable to the support portion 33 having one end fixed to the main body portion 10 </ b> B and the other end extending to a position near the tip of the tip 20, and the other end of the support 33. It is configured to include a mounted component contact portion 34.

The support portion 33 constituting the component holding means 30B has a structure in which a first rod portion 33a and a second rod portion 33b are connected via a coil spring 33c, and one end side of the support portion 33 is a main body portion. 10 is fixed to the groove 15 formed in the groove 10, and the other end side (tip 20 side) of the support portion 33 is a component contact made of a substantially flat metal plate member. The part 34 is mounted so as to be freely tilted.

A coil spring 33c is interposed in the connecting portion between the first rod portion 33a and the second rod portion 33b constituting the support portion 33, and the second rod portion 33b is connected to the component abutting portion 34. When the coil spring 33c is moved upward in response to the pressing force, the coil spring 33c is contracted to generate a repulsive force that pushes back the second bar portion 33b. In addition, when the component is sandwiched by the tip 20, the component contact portion 34 is designed to contact the upper surface of the component. The connecting portion between the other end side of the support portion 33 and the component abutting portion 34 is moved back and forth with the other end of the support portion 33 serving as a fulcrum and the main body portion 10B sandwiched by the tip 20. It has a tiltable structure.

Next, a chip component mounting operation using the component mounting tool 1B according to the embodiment (3) will be described. FIGS. 6A to 6D are diagrams for explaining a chip component repairing operation using the component mounting tool 1B according to the embodiment (3).

First, the chip component 50 is sandwiched between the heated tip 20 (FIG. 6A). At this time, the component contact portion 34 of the component holding means 30B contacts the upper surface of the chip component 50, and the second rod portion 33b
In response to the pressing force from the component abutting portion 34, the coil spring 33c moves upward, and a repulsive force is generated to push back the second rod portion 33b.

Next, the chip component 50 is placed in the land 6 while the chip component 50 is sandwiched by the tip 20.
The solder 62 on the land 61 is melted by the heat transmitted from the tip 20 (FIG. 6).
(B)). At this time, the component contact portion 34 of the component holding means 30B is in contact with the upper surface of the chip component 50. When the tip 20 is moved in the direction in which the tip 20 stands (in the direction of the arrow in the figure), the second rod portion 33b further It moves upward, the amount of contraction of the coil spring 33c increases, the repulsive force to push back the second bar portion 33b increases, and the chip component 50 can be reliably pressed against the substrate 60 by the component contact portion 34. It is like that.

After the solder 62 is melted, the tip 20 is moved in the standing direction, and the tip 20 is opened in a state where the chip component 50 is pressed against the substrate 60 by the component abutting portion 34, and the tip 20 is moved. The chip component 50 is separated from the chip component 50 (FIG. 6C), and the state where the chip component 50 is pressed against the substrate 60 is held by the component contact portion 34 until the solder 62 is solidified. The coil spring 33c is released from the contraction while the component abutting portion 34 is moved upward.
Apart from 0 (FIG. 6D), the repair of the chip component 50 is completed.

According to the component mounting tool 1B according to the embodiment (3), the support portion 33 of the component holding means 30B expands and contracts by receiving the pressing force from the component contact portion 34, and a repulsive force is generated against the pressing force. Since it is configured as described above, by the operation of pressing the component contact portion 34 against the chip component 50,
The chip component 50 can be pressed against the substrate 60 with an appropriate force, and the substantially same effect as the component mounting tool 1 according to the above embodiment (1) can be obtained, and the chip component 50 is held in a more stable state. It becomes possible.

In the component mounting tool 1B according to the embodiment (3), the first rod portion 33a and the second rod portion 33b are connected via the coil spring 33c as the support portion 33 constituting the component holding means 30B. In another embodiment, the case where the structure having the above-described structure is adopted, the coil spring 33c may be disposed outside the first bar portion 33a, or an elastic member other than the coil spring 33c may be used. Good.

It is the figure which showed typically the component attachment tool which concerns on embodiment (1) of this invention, (a) is a top view, (b) is a side view. (A)-(d) is a figure for demonstrating the attachment operation | work at the time of repair of the chip components by the component attachment tool which concerns on embodiment (1). It is the figure which showed typically the component attachment tool which concerns on embodiment (2), (a) is a top view, (b) is a side view. (A)-(d) is a figure for demonstrating the attachment operation | work at the time of repair of the chip components by the component attachment tool which concerns on embodiment (2). It is the figure which showed typically the component attachment tool which concerns on embodiment (3), (a) is a top view, (b) is a side view. (A)-(d) is a figure for demonstrating the attachment operation | work at the time of repair of the chip components by the component attachment tool which concerns on embodiment (3). (A)-(d) is a figure for demonstrating the attachment operation | work at the time of repair of the chip components by the conventional component attachment tool.

Explanation of symbols

1, 1A, 1B Component mounting tool 10, 10A, 10B
20 Tip (clamping means)
30, 30A, 30B Component holding means

Claims (11)

A component mounting tool having a clamping means for clamping a component,
A component mounting tool, comprising: component holding means for holding the component pressed against the mounting surface when mounting the component clamped by the clamping unit on the mounting surface. The clamping means is attached to a main body having an opening / closing mechanism for the clamping means,
2. The component according to claim 1, wherein the component holding means is composed of an elastic support member having one end attached to the main body and the other end extended to a position near the tip of the clamping means. Mounting tool. The component mounting tool according to claim 2, wherein the elastic support member is slidably attached in the axial direction of the clamping means. The other end side of the elastic support member has a curved shape when viewed from the side.
Or the component attachment tool of Claim 3. The clamping means is attached to a main body having an opening / closing mechanism for the clamping means,
The component holding means has one end attached to the main body and the other end extended to a position near the tip of the clamping means;
The component mounting tool according to claim 1, further comprising a component abutting portion mounted on the other end side of the support portion. 6. The component mounting tool according to claim 5, wherein the component abutting portion has a shape that abuts on an upper surface and at least one side surface of the component. The component mounting tool according to claim 5 or 6, wherein the component contact portion is provided with an elastic member on a contact surface with the component. The component mounting tool according to any one of claims 5 to 7, wherein the component contact portion is attached to the other end side of the support portion so as to be tiltable. The component mounting tool according to any one of claims 5 to 8, wherein the support portion is slidably attached in an axial direction of the clamping means. The structure according to any one of claims 5 to 9, wherein the support portion is configured to expand and contract in response to a pressing force from the component contact portion, and to generate a repulsive force against the pressing force. The component mounting tool described. The component mounting tool according to any one of claims 1 to 10, wherein a tip portion of the clamping means is configured to be heated to a temperature at which solder can be melted.

Images