JP2007039712A5 - - Google Patents

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Publication number
JP2007039712A5
JP2007039712A5 JP2005222436A JP2005222436A JP2007039712A5 JP 2007039712 A5 JP2007039712 A5 JP 2007039712A5 JP 2005222436 A JP2005222436 A JP 2005222436A JP 2005222436 A JP2005222436 A JP 2005222436A JP 2007039712 A5 JP2007039712 A5 JP 2007039712A5
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JP
Japan
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JP2005222436A
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Japanese (ja)
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JP2007039712A (en
JP4789535B2 (en
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Priority to JP2005222436A priority Critical patent/JP4789535B2/en
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Publication of JP2007039712A5 publication Critical patent/JP2007039712A5/ja
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JP2005222436A 2005-08-01 2005-08-01 Sputtering apparatus, film forming method Active JP4789535B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005222436A JP4789535B2 (en) 2005-08-01 2005-08-01 Sputtering apparatus, film forming method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005222436A JP4789535B2 (en) 2005-08-01 2005-08-01 Sputtering apparatus, film forming method

Publications (3)

Publication Number Publication Date
JP2007039712A JP2007039712A (en) 2007-02-15
JP2007039712A5 true JP2007039712A5 (en) 2008-05-01
JP4789535B2 JP4789535B2 (en) 2011-10-12

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Family Applications (1)

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JP2005222436A Active JP4789535B2 (en) 2005-08-01 2005-08-01 Sputtering apparatus, film forming method

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JP (1) JP4789535B2 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2298032A4 (en) * 2008-05-06 2012-06-20 Agency Science Tech & Res An electrically conducting structure for a light transmissible device
US8663431B2 (en) 2008-05-15 2014-03-04 Yamaguchi University Sputtering system for depositing thin film and method for depositing thin film
KR20110042217A (en) * 2008-10-16 2011-04-25 가부시키가이샤 아루박 Sputtering apparatus, method for forming thin film, and method for manufacturing field effect transistor
WO2013099084A1 (en) 2011-12-28 2013-07-04 パナソニック株式会社 Method of manufacturing organic el element
KR101504541B1 (en) * 2013-03-29 2015-03-20 삼한박막진공 주식회사 In-Line Sputtering Apparatus for Uniform Deposition
JP6309353B2 (en) * 2014-06-06 2018-04-11 株式会社Ｓｃｒｅｅｎホールディングス Sputtering apparatus and sputtering method
KR20200036065A (en) * 2016-03-30 2020-04-06 케이힌 람테크 가부시키가이샤 Sputtering cathode, sputtering apparatus and manufacturing method of film forming element
CN113151792B (en) * 2021-03-26 2023-01-03 洛阳理工学院 Magnet part, magnetron sputtering cathode and magnetron sputtering device for coating flexible wire

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6176673A (en) * 1984-09-21 1986-04-19 Fujitsu Ltd Sputtering method
JPS61272374A (en) * 1985-05-28 1986-12-02 Nec Corp Sputtering device
JPH01298154A (en) * 1988-05-26 1989-12-01 Kikuo Tominaga Opposed target-type planar magnetron sputtering device
JPH0288766A (en) * 1988-09-26 1990-03-28 Hitachi Ltd Electrode, device, and method for sputtering
JPH02131547U (en) * 1989-03-29 1990-11-01
JP2660951B2 (en) * 1992-12-25 1997-10-08 アネルバ株式会社 Sputtering equipment
JP3514488B2 (en) * 1993-06-30 2004-03-31 株式会社アルバック Magnetron sputtering method and apparatus
JP2003239069A (en) * 2002-02-15 2003-08-27 Ulvac Japan Ltd Method and system for manufacturing thin film
JP2003346559A (en) * 2002-05-24 2003-12-05 Okura Ind Co Ltd Transparent conductive film, and forming method thereof

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