JP2007035972A5 - - Google Patents

Claims (4)

On the metal layer, main mercapto group, a sulfonic acid group, and the wiring, characterized in that an insulating layer over at least including wiring substrate adhesion layer containing triazine skeleton represented by the following structural formula (1) substrate.
However, in the structural formula (1), X represents at least one of NR ₂ and SA. R represents a hydrogen atom, a methyl group, an ethyl group, a propyl group, or a phenyl group, and A represents at least one of a hydrogen atom, a Li atom, a Na atom, a K atom, an Rb atom, and a Cs atom. Represents. Adhesion layer wiring board, the wiring board according to claim 1 comprising surface treated with a coupling agent. A method for manufacturing a wiring board according to claim 1, wherein a wiring forming step for forming wiring, an adhesion layer forming step for forming an adhesion layer for wiring substrate on the wiring, and the wiring A method for manufacturing a wiring board, comprising: an insulating layer forming step of forming an insulating layer on an adhesion layer for a substrate. The adhesion layer forming step includes a solution containing at least one of a compound containing at least a mercapto group and a sulfonic acid group, and an alkali metal salt thereof, and a solution containing at least a compound having a triazine skeleton represented by the following structural formula (1) The method for manufacturing a wiring board according to claim 3, wherein a wiring board adhesion layer is formed by treating the wiring surface using

However, in said structural formula (1), X is NR. ₂ And at least one of SA. R represents a hydrogen atom, a methyl group, an ethyl group, a propyl group, or a phenyl group, and A represents at least one of a hydrogen atom, a Li atom, a Na atom, a K atom, an Rb atom, and a Cs atom. Represents.