JP2007035933A - Mounting structure for circuit component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To improve assembling properties of a circuit component to be mounted to a cabinet separatly from a board. <P>SOLUTION: Guide holes 9 are bored in a case 5b as a part of a connector 5 that is integrally fixed to a board 4, and the guide holes 9 enable the leads 6a of FETs 6 fixed to an end plate member 3 different from the board 4 to be inserted into the corresponding insertion holes 4b of the board 4. Furthermore, tapered holes 9a are bored in the side of the case 5b opposite to the direction in which the leads 6a penetrate. For instance, when two or more elements are fixed to the cabinet, the leads of the elements can be kept in a state in which they are positioned by the corresponding guide holes. By this setup, the extension ends of the leads can be aligned with the lead insertion holes of the board 4, so that an assembly of inserting the extension ends of the leads into the lead insertion holes of the board 4 can be easily carried out. The guide holes are formed of a part of the connector 5, so that an assembly operation can be easily carried out by guiding the leads with the guide holes without preparing additional components. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a circuit component mounting structure.

Conventionally, when a drive circuit including a power element is provided integrally with a casing, a power element (such as an FET) that generates a large amount of heat is directly attached to the casing to promote heat dissipation, and the lead of the power element is connected to the casing. There is one that is bent to the opposite side of the body and connected to the substrate (for example, see Patent Document 1).
Japanese Utility Model Publication No. 2-52393

  However, in the thing of the said patent document 1, it aims at ensuring the mounting space of a power element by mounting a power element using the recessed part formed in the housing | casing which accommodates a board | substrate, The positioning property for connecting the lead to the substrate is not particularly considered. Therefore, not only the assembling property is bad, but there is a problem that the assembling property is further deteriorated when a plurality of power elements are arranged.

  In order to solve such a problem and to improve the assemblability in the mounting structure of the circuit component in which the element is mounted on a housing separate from the substrate, an electric circuit is provided in the present invention. A plurality of elements for electrically connecting the electric circuit and the element by inserting a lead of the element into the substrate. A circuit component mounting structure provided with lead insertion holes, wherein the leads of the elements are aligned one by one in the plurality of lead insertion holes between the element attached to the housing and the substrate. Accordingly, a lead guide member having a plurality of guide holes for supporting the lead of the element in a penetrating state is provided, and the lead guide member is made of a part of a circuit component.

  In particular, it is preferable that a tapered hole portion is formed on a side of the guide hole facing the direction in which the lead penetrates. The lead guide member may be formed in a case portion of a connector coupled to the substrate to connect the electric circuit and an external circuit, and the electric circuit and the external circuit in the connector. It is preferable that a terminal member for connecting the terminal is integrated with the case portion, and an end portion on the connection side to the electric circuit protrudes from the case portion to the substrate side. The lead guide member may be smaller than a region where the element is disposed in a plan view as viewed in the lead penetration direction.

  As described above, according to the present invention, since the leads of the elements attached to the housing are passed through the guide holes provided in the lead guide member, each lead is mounted on the substrate when, for example, a plurality of elements are attached to the housing. Each lead in a state of being extended to the side away from the housing for connection to the housing can be positioned by the corresponding guide hole. Thereby, the extended end of each lead can be aligned with the plurality of lead insertion holes of the board, and the assembly work of inserting the extended ends of the plurality of leads into the plurality of lead insertion holes of the board can be easily performed. Can do. Since the lead guide member is formed of a part of the circuit component, the lead can be guided and a simple assembly operation can be performed without preparing a separate component.

  In particular, by forming a tapered hole portion on the lead side before penetrating the guide hole, the extended end of the lead can be guided by the tapered hole portion even if the position of the extended end of the lead is slightly shifted. Therefore, it is not necessary to increase the accuracy of the guide holes provided in the lead guide member, and the cost increase due to the provision of the lead guide member can be suppressed.

  In addition, by forming a lead guide member in the case portion of the connector for connecting the electric circuit and the external circuit, the connector as a functional component required for connecting the electric circuit provided on the board and the external circuit The lead guide member can be provided using the above. In particular, when the connector is a molded product, it can be formed by changing only a part of the mold, and the mold cost can be suppressed. Also, for example, by assembling the element to the housing and providing the concave and convex shape for positioning the connector assembled integrally with the substrate, the connector is positioned by assembling the connector to the housing. Simultaneously with the assembly, the lead can be passed through the guide hole, which facilitates the assembly operation. Furthermore, since the terminal member for connection with the external circuit provided in the connector is formed so as to protrude from the case portion of the connector to the board side, the protruding portion of the terminal member is arranged on the board side when the connector is assembled to the board. Can be inserted through the corresponding connection insertion holes, thereby enabling positioning of the connector with respect to the board.

  In addition, since the lead guide member is smaller than the area where the element is arranged in a plan view as viewed in the lead penetration direction, the position of the element can be confirmed in the work of penetrating the lead, and the work is facilitated. Can do.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a cutaway side view of an essential part showing an entire electromechanical motor device to which the present invention is applied. The motor device shown in the figure has a structure in which a motor unit 1 and a drive circuit unit 2 provided on the right side in the drawing which is the rear end side of the motor unit 1 are integrally provided in a case of the motor device. .

  The motor unit 1 may be composed of, for example, a known brushless motor. The motor shaft 1a is provided with a rotor 1b. The rotor 1b is surrounded by a stator core 1c and a coil 1d. An end plate member 3 as a housing is attached to an open end surface on the rear end side of the cylindrical stator case 1e in the motor portion 1a. The end plate member 3 has a concave shape facing the motor portion 1 side, and the drive circuit portion 2 is received in the concave portion.

  As shown in FIG. 2, the drive circuit unit 2 in the illustrated example includes a substrate 4, a connector 5 as a lead guide member assembled to the substrate 4, and an inner surface (a concave bottom surface) of the end plate member 3. FET 6 as an element attached to the. A circuit pattern and electrical components (such as a capacitor and a resistor) are integrally provided on the substrate 4. An electric circuit included in the substrate 4 is constituted by these circuit patterns and electric components.

  Further, the connector 5 is for electrically connecting the substrate 4 and the coil 1d as shown in FIG. 1, and has a female connector portion 5a connected to the coil and the connector 1d, and a connector portion 5a. And a case portion 5b that is bent and extended in an L shape, and is integrally formed of a synthetic resin material. Further, the connector 5 is provided with a terminal member 7 which is integrally formed by molding and has a U-shape, and one end portion 7a of the terminal member 7 is exposed in the concave portion of the connector portion 5a, and is connected to an electric circuit. The other end portion 7b as a side end portion protrudes from the case portion 5b in parallel with the one end portion 7a.

  The FET 6 is used as a power element in the illustrated example, and the FET 6 is attached to the end plate member 3 with screws as shown in FIG. By doing so, the end plate member 3 can be used as a heat radiating member that radiates heat generated by the FET 6 during driving. In the illustrated example, six FETs 6 are arranged on the end plate member 3 in two rows in the upper and lower stages in FIGS. In addition, three leads 6 a are provided for each FET 6, and each lead 6 a is bent in a direction orthogonal to and away from the FET mounting surface (the bottom surface of the recessed shape) of the end plate member 3. . For bending the lead 6a, for example, the lead 6a can be bent at a right angle with a jig or the like in advance with reference to the attachment surface of the FET 6 to the end plate member 3.

  Further, a coupler 8 connected to an external control device is attached to the outer surface of the end plate member 3, and a terminal 8a of the coupler 8 penetrates the end plate member 3 and protrudes inward of the motor device. Is provided. The terminal 8a and the leads 6a are parallel to each other.

  The board 4 is provided with insertion holes 4a, 4b, and 4c at predetermined positions through which the other end portion 7b of the terminal member 7 of the connector 7, the lead 6a, and the terminal 8a are inserted. The case portion 5b of the connector 5 is provided with a guide hole 9 at a position corresponding to the arrangement of the insertion hole 4b corresponding to each lead 6a, as well shown in FIG. Further, a thermistor (not shown) is attached to the terminal member 3, and a guide hole 10 for the thermistor is provided in the case portion 5b at a position corresponding to the lead of the thermistor. In FIG. 3, only a part of the reference numerals of the guide holes 9 are given and the others are omitted. However, as shown in FIG. 3, there are a total of 18 guide holes 9 in the illustrated example.

  An assembling procedure of the drive circuit unit 2 configured as described above will be described below. First, as described above, a plurality (six) of FETs 6 are attached to the end plate member 3 with screws. Next, the connector 5 is assembled to the end plate member 3 so as to cover the attached FET 6, and fixed with screws 11. At this time, the FET lead 6 a passes through the guide hole 9 a provided in the connector 5. Then, the lead 6a protruding from the guide hole 9a is inserted into the insertion holes 4a to 4c of the substrate 4 and soldered to each.

  As shown in FIG. 4, the relationship between the distance d1 between the connector portion 5a and the other end 7b and the distance d2 between the end edge of the board 4 and the insertion hole 4a is assembling the connector 5 and the board 4. In this case, it is preferable to set the other end 7b to be inserted into the insertion hole 4a while the edge of the substrate 4 is guided by the connector portion 5a. Thereby, the insertion work to the insertion hole 4a of the other end part 7b becomes easy.

  Further, even when the other end portion 7b and the insertion hole 4a in the assembled state are displaced in the direction along the main surface of the substrate 4, the guide holes 9 provided in the connector 5 and the substrate 4 are provided. By setting the sizes of the guide hole 9 and the insertion hole 4b so that the insertion holes 4b can be aligned with each other, the guide hole 9 and the insertion hole 4b are assembled by assembling the connector 5 and the substrate 4 together. Are aligned.

  Then, as shown in FIG. 5, the connector 5 integrated with the substrate 4 is assembled to the end plate member 3. As shown in FIG. 3, the connector 5 is provided with ears 5c on both sides, and the ears 5c are provided with holes 5d through which screws 11 to be screwed to the end plate member 3 are inserted. . The connector 5 is attached to a predetermined position by screwing the screw 11 into, for example, a screw hole provided in the island portion 3a formed at a corresponding position of the end plate member 3.

  In addition, the case portion 5b of the connector 5 is made smaller than a region 12 (two-dot chain line in FIG. 3) 12 in which the FET 6 is disposed in a plan view as viewed from the lead-through direction of the lead 6a. Since 6 is not completely hidden by the connector 5, the attachment operation can be performed while checking the position of the FET 6.

  At this time, the lead 6a of the FET 6 is inserted into the corresponding insertion hole 4b of the substrate 4. However, as described above, when the number of the leads 6a is large, the leads 6a are previously aligned with a jig or the like. However, it is difficult to insert all the leads 6a into the respective insertion holes 4b as they are.

  As shown in the figure, a tapered hole portion 9a is formed on the side of the case portion 5b facing the direction (arrow A) of the guide hole 9 through the lead 6a. As a result, even if there is some variation in the position of the tip of each lead 6a, the tip of the lead 6a is guided by the tapered hole 9a, and the lead 6a is inserted into the guide hole 9 provided with a predetermined positioning accuracy. Can be made. Therefore, the lead 6a can be inserted into the insertion hole 4b only by attaching the connector 5 to the end plate member 3 and without specially aligning the lead 6a with the insertion hole 4b.

  In the end plate member 3 where the connector 5 is attached, a positioning projection 13 is formed in accordance with a part of the outer shape of the connector 5 shown in FIG. 3 (in the illustrated example, the constricted portion of the case portion 5b). By attaching the connector 5, positioning in the direction along the main surface of the substrate 4 can be performed. Thereby, the positioning of the guide hole 9 (taper hole portion 9a) with respect to the lead 6a can be performed with high accuracy. Further, the terminal 8a of the coupler 8 is also positioned in the corresponding insertion hole 4c of the substrate 4, and the terminal 8a can be inserted into the insertion hole 4c at the same time when the connector 5 is attached. The terminal 8a is then soldered to the substrate 4.

  In the circuit component mounting structure configured as described above, when the FET 6 as the power element is attached to the end plate member 3 as a heat sink, the lead 6a is connected in the connecting operation between the lead 6a and the substrate 4. It is suitable for the thing which performs the operation | work which inserts through the insertion hole 4b of the board | substrate 4. FIG.

  If the lead 6a is to be directly inserted into the insertion hole 4b, the alignment is difficult. In particular, in recent small-sized and high-density devices, the board mounting space is very narrow, and in such a case, it is difficult to align the lead of the element. Further, in the case of a plurality of elements, that is, those provided with a large number of leads, alignment becomes even more difficult.

  On the other hand, by guiding the lead 6a to the insertion hole 4a of the substrate 4 through the guide hole 9 provided in the case portion 5b of the connector 5 as a support member, for example, the diameter of the guide hole 9 is larger than that of the insertion hole 4b. Thus, the lead 6a can be easily inserted into the guide hole 9. Further, by providing the tapered hole portion 9a as shown in the drawing, the insertion is further facilitated, and an error corresponding to the size of the opening area of the tapered hole portion 9a is allowed in the alignment position accuracy of the tip portion of the lead 6a. Therefore, the prior work of aligning the leads 6a can be simplified.

  Further, as in the illustrated example, this structure is simply added to a part of the connector 5 (case portion 5b) as a functional component necessary for the apparatus without preparing a support member having the guide hole 9 as a separate member. It can be made into a form. Thereby, since the said effect can be show | played without requiring another component, the cost increase can be suppressed. In addition, since the applied component is a relatively small circuit component called the connector 5, the handling is easy, and if it is a connector 6 made of a synthetic resin, only the molding is required and the mold cost can be suppressed.

  In the illustrated example, the electromechanically integrated motor device is shown. However, the housing to which the element is attached is not limited to the end plate member of the motor in the illustrated example, and can be applied to various circuit component mounting structures. . For example, the power element is attached to a part of the case of the control unit, the board is attached to the case via a leg member, and the lead of the power element is connected to the corresponding part of the board in the same manner as in the illustrated example. May be.

  The circuit component mounting structure according to the present invention can position and connect the lead of an element provided in a housing separate from the substrate to the substrate without using a separate component. This is useful as a mounting structure for connecting to the lead.

It is a principal part fracture side view showing the whole electromechanical integrated motor device to which the present invention was applied. It is a sectional side view which shows the decomposition | disassembly assembly point of a circuit component. It is a front view which shows a connector. It is the figure which shows the sectional side view and assembly | attachment point of the connector seen along the arrow IV line of FIG. It is a figure corresponding to FIG. 2 of the state which integrated the connector with the board | substrate.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Motor part 2 Drive circuit part 3 End plate member 4 Board | substrate, 4a * 4b * 4c Insertion hole 5 Connector, 5a Connector part, 5b Case part 6 FET (power element), 6a lead 9 Guide hole, 9a Tapered hole part

Claims (5)

While having a substrate provided with an electrical circuit, and an element attached to a housing separate from the substrate,
A circuit component mounting structure provided with a plurality of lead insertion holes for electrically connecting the electrical circuit and the element by inserting leads of the element into the substrate,
A lead guide having a plurality of guide holes through which the leads of the element are penetrated in order to align the leads of the element with the plurality of lead insertion holes one by one between the element attached to the housing and the substrate. Members are provided,
The circuit component mounting structure, wherein the lead guide member comprises a part of the circuit component.   2. The circuit component mounting structure according to claim 1, wherein a tapered hole portion is formed on a side of the guide hole facing a direction in which the lead penetrates.   3. The circuit component according to claim 1, wherein the lead guide member is formed in a case portion of a connector coupled to the substrate to connect the electric circuit and an external circuit. 4. Mounting structure.   In the connector, a terminal member for connecting the electric circuit and the external circuit is integrated in the case portion, and an end portion on the connection side to the electric circuit protrudes from the case portion to the substrate side. The circuit component mounting structure according to claim 3, wherein:   5. The circuit component mounting structure according to claim 1, wherein the lead guide member is smaller than a region where the element is disposed in a plan view as viewed in the lead penetration direction. 6.

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