JP2007035574A5 - - Google Patents
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- Publication number
- JP2007035574A5 JP2007035574A5 JP2005221026A JP2005221026A JP2007035574A5 JP 2007035574 A5 JP2007035574 A5 JP 2007035574A5 JP 2005221026 A JP2005221026 A JP 2005221026A JP 2005221026 A JP2005221026 A JP 2005221026A JP 2007035574 A5 JP2007035574 A5 JP 2007035574A5
- Authority
- JP
- Japan
- Prior art keywords
- fine particles
- particle
- conductive
- substrate
- projections
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010419 fine particle Substances 0.000 claims 4
- 239000002245 particle Substances 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
- 230000006835 compression Effects 0.000 claims 1
- 238000007906 compression Methods 0.000 claims 1
- 238000006073 displacement reaction Methods 0.000 claims 1
- 238000011084 recovery Methods 0.000 claims 1
- 239000000126 substance Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005221026A JP2007035574A (ja) | 2005-07-29 | 2005-07-29 | 導電性微粒子、異方性導電材料、及び、接続構造体 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005221026A JP2007035574A (ja) | 2005-07-29 | 2005-07-29 | 導電性微粒子、異方性導電材料、及び、接続構造体 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2007035574A JP2007035574A (ja) | 2007-02-08 |
| JP2007035574A5 true JP2007035574A5 (https=) | 2008-05-15 |
Family
ID=37794556
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005221026A Pending JP2007035574A (ja) | 2005-07-29 | 2005-07-29 | 導電性微粒子、異方性導電材料、及び、接続構造体 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2007035574A (https=) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101309993B (zh) * | 2005-11-18 | 2012-06-27 | 日立化成工业株式会社 | 粘接剂组合物、电路连接材料、连接结构及电路部件连接方法 |
| WO2011002084A1 (ja) * | 2009-07-02 | 2011-01-06 | 日立化成工業株式会社 | 導電粒子 |
| JP5245021B1 (ja) * | 2011-09-22 | 2013-07-24 | 株式会社日本触媒 | 導電性微粒子及びそれを含む異方性導電材料 |
| WO2013085039A1 (ja) * | 2011-12-08 | 2013-06-13 | 株式会社日本触媒 | 導電性微粒子及びそれを含む異方性導電材料 |
| JP6231374B2 (ja) * | 2012-12-31 | 2017-11-15 | 株式会社ドクサンハイメタル | タッチスクリーンパネル用導電粒子、およびこれを含む導電材料 |
| WO2020071271A1 (ja) * | 2018-10-03 | 2020-04-09 | デクセリアルズ株式会社 | 異方性導電フィルム、接続構造体、接続構造体の製造方法 |
| CN112740483B (zh) * | 2018-10-03 | 2023-07-14 | 迪睿合株式会社 | 各向异性导电薄膜、连接结构体、连接结构体的制备方法 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4387175B2 (ja) * | 2003-07-07 | 2009-12-16 | 積水化学工業株式会社 | 被覆導電性粒子、異方性導電材料及び導電接続構造体 |
-
2005
- 2005-07-29 JP JP2005221026A patent/JP2007035574A/ja active Pending
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