JP2007027656A - Structure of electronic apparatus housing - Google Patents
Structure of electronic apparatus housing Download PDFInfo
- Publication number
- JP2007027656A JP2007027656A JP2005211660A JP2005211660A JP2007027656A JP 2007027656 A JP2007027656 A JP 2007027656A JP 2005211660 A JP2005211660 A JP 2005211660A JP 2005211660 A JP2005211660 A JP 2005211660A JP 2007027656 A JP2007027656 A JP 2007027656A
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- Japan
- Prior art keywords
- electronic circuit
- circuit board
- metal
- boss
- screw
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Mounting Of Printed Circuit Boards And The Like (AREA)
Abstract
Description
本発明は電子回路基板等を収容する電子機器筐体に関し、詳しくは電子回路基板の固定用として内部に立設するボスの構造に関する。 The present invention relates to an electronic device housing that accommodates an electronic circuit board and the like, and more particularly, to a structure of a boss standing inside for fixing an electronic circuit board.
電子回路基板等を収容する電子機器筐体は、樹脂成形により形成されたものと、金属製のものとがある。樹脂成形品は金属製の筐体のような電磁波を遮蔽する機能を有していないため例えば図３に示すように、電子機器筐体１とその筐体カバー３との表面にメッキ等により導電膜１ａ、３ａを形成し、この導電膜１ａ、３ａを利用して電磁遮蔽を行うようにしているが、例えば電子機器筐体１に設けたボス部１１を利用して電子回路基板２をネジ６により固定すると、ネジ６の螺合によりボス部１１に設けた導電膜１ａが破損され、電子回路基板２に設けた導電膜（グランド膜）２ａとの電気接続状態が劣化するという問題があり、その対策として、電子機器筐体１に設けるボス部１１に凹部１１ａを設け、この凹部１１ａに導電性エラストマブッシュ４を挿入するようにした構造（例えば、特許文献１参照）のものがある。 Electronic device housings that house electronic circuit boards and the like include those formed by resin molding and those made of metal. Since the resin molded product does not have a function of shielding electromagnetic waves unlike a metal casing, for example, as shown in FIG. 3, the surfaces of the electronic apparatus casing 1 and the casing cover 3 are electrically conductive by plating or the like. The films 1a and 3a are formed and electromagnetic shielding is performed using the conductive films 1a and 3a. For example, the electronic circuit board 2 is screwed using the boss portion 11 provided in the electronic device casing 1. If fixed by 6, the conductive film 1 a provided on the boss portion 11 is damaged by screwing of the screw 6, and the electrical connection state with the conductive film (ground film) 2 a provided on the electronic circuit board 2 is deteriorated. As a countermeasure, there is a structure in which a recess 11a is provided in a boss portion 11 provided in the electronic device casing 1 and a conductive elastomer bush 4 is inserted into the recess 11a (see, for example, Patent Document 1).
また、電子機器筐体が金属製のものでは、例えば図４に示すように、電子機器筐体１内に金属ボス４Ａを打ち込み等の手法により立設し、電子回路基板２に設けた孔１４に取付ネジ１１を挿通させ、この取付ネジ１１を金属ボス４Ａのネジ取付穴４ａに螺合させるようになっている。 If the electronic device casing is made of metal, for example, as shown in FIG. 4, a metal boss 4A is erected in the electronic device casing 1 by a technique such as driving, and holes 14 provided in the electronic circuit board 2 are provided. A mounting screw 11 is inserted through the mounting screw 11 and screwed into the screw mounting hole 4a of the metal boss 4A.
しかしながら、金属ボス４Ａに電子回路基板２を直接ネジ止めすると（特にタッピングネジを使用する場合）、その取付ネジ１１の締め付けで金属粉が発生し、高密度設計の電子回路基板２では前記金属粉がグランド膜２ａ以外の導電膜にも付着し、電子回路がショートする恐れがある。
したがって、本発明においては上記の課題を解消可能にした電子機器筐体の構造を提供することを目的としている。
However, when the electronic circuit board 2 is directly screwed to the metal boss 4A (especially when a tapping screw is used), metal powder is generated by tightening the mounting screw 11, and in the electronic circuit board 2 having a high density design, the metal powder is generated. May adhere to conductive films other than the ground film 2a, and the electronic circuit may be short-circuited.
Accordingly, an object of the present invention is to provide an electronic device housing structure that can solve the above-described problems.
本発明は上記の課題を解決するためになされたものであり、導電性を有する電子機器筐体の内部に少なくとも一つの金属ボスを立設し、同金属ボスに電子回路基板をネジ止めする構造において、前記金属ボスに凹部または貫通孔を設け、同凹部または同貫通孔に樹脂部材を埋設し、同樹脂部材に前記電子回路基板の取付ネジを螺合させるようにしてなる構造とする。 The present invention has been made to solve the above-described problem, and has a structure in which at least one metal boss is erected inside a conductive electronic device casing and an electronic circuit board is screwed to the metal boss. The metal boss is provided with a recess or a through hole, a resin member is embedded in the recess or the through hole, and a mounting screw of the electronic circuit board is screwed into the resin member.
本発明からなる電子機器筐体の構造であれば、その筐体内に立設する金属ボスに凹部または貫通孔を設け、同凹部または同貫通孔に樹脂部材を埋設し、同樹脂部材に電子回路基板の取付ネジを螺合させるようにしているので、取付ネジの螺合による金属粉の発生はなく、電子回路をショートさせる恐れも無くなり、安全で高品質の電子機器筐体を提供できる。 If it is the structure of the electronic device housing | casing which consists of this invention, a recessed part or a through-hole is provided in the metal boss standing in the housing | casing, a resin member is embed | buried in the recessed part or the same through-hole, and an electronic circuit is provided in the resin member Since the mounting screws of the board are screwed together, there is no generation of metal powder due to the screwing of the mounting screws, and there is no possibility of short-circuiting the electronic circuit, and a safe and high-quality electronic device casing can be provided.
以下、本発明の実施の形態を、添付図面に基づいて説明する。 Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.
図１は本発明の実施の形態を示す構成斜視図、図２はその要部拡大図であり、図において、１は電子機器筐体、２は電気機器筐体１内に固定される電子回路基板、３は電子機器筐体１の開口面に被せる筐体カバーである。 FIG. 1 is a structural perspective view showing an embodiment of the present invention. FIG. 2 is an enlarged view of a main part thereof. In the figure, 1 is an electronic device casing, and 2 is an electronic circuit fixed in the electric device casing 1. A substrate 3 is a housing cover that covers the opening surface of the electronic device housing 1.
電子機器筐体１とその筐体カバー３は金属（鋼板）からなり、電子機器筐体１の内部には電子回路基板２を支持する複数の金属ボス４が立設され、筐体上部のフランジ５には筐体カバー３の取付けに利用する複数の孔６が設けられ、筐体カバー３には取付ネジ７を挿通するための複数の孔８が設けられている。 The electronic device housing 1 and its housing cover 3 are made of metal (steel plate), and a plurality of metal bosses 4 for supporting the electronic circuit board 2 are erected inside the electronic device housing 1, and a flange on the upper portion of the housing. 5 is provided with a plurality of holes 6 used for attaching the housing cover 3, and the housing cover 3 is provided with a plurality of holes 8 through which mounting screws 7 are inserted.
金属ボス４には凹部（または貫通孔）９が形成され、同凹部（または同貫通孔）９には樹脂部材１０が埋設され、その中心部には電子回路基板２の取付ネジ１１を螺合させる孔（メネジ部）１２が形成されている。また、凹部（または貫通孔）９の表面（ボス内面）には樹脂部材の食い込みを強くするための処理が施されている。また、金属ボス４は電子機器筐体１の所定位置に打ち込み加工により立設されるが、その取付状態を強くするために金属ボス４の下端部には多数の凹凸１３が形成されている。 A concave portion (or through hole) 9 is formed in the metal boss 4, a resin member 10 is embedded in the concave portion (or through hole) 9, and a mounting screw 11 of the electronic circuit board 2 is screwed into the central portion. A hole (female thread) 12 to be formed is formed. Further, the surface (the inner surface of the boss) of the recess (or the through hole) 9 is subjected to a treatment for increasing the biting of the resin member. In addition, the metal boss 4 is erected at a predetermined position of the electronic device casing 1 by a working process, and a large number of projections and depressions 13 are formed at the lower end of the metal boss 4 in order to strengthen the mounting state.
電子回路基板２の取付では、同電子回路基板２に設けた孔１４に取付ネジ１１を挿通させ、この取付ネジ１１を金属ボス４内の樹脂部材１０に形成された孔１２に螺合させることになるが、前記構成からなる電子機器筐体１であれば電子回路基板２の取付に際し金属粉が発生するようなこともなく、金属ボス４と電子回路基板２の導電膜（グランド膜）２ａとの接続状態も適度に保持されることになる。 In mounting the electronic circuit board 2, the mounting screw 11 is inserted into the hole 14 provided in the electronic circuit board 2, and the mounting screw 11 is screwed into the hole 12 formed in the resin member 10 in the metal boss 4. However, in the case of the electronic device casing 1 having the above-described configuration, metal powder is not generated when the electronic circuit board 2 is attached, and the conductive film (ground film) 2a between the metal boss 4 and the electronic circuit board 2 is provided. The connection state with is also maintained moderately.
１ 電子機器筐体
２ 電子回路基板
２ａ 導電膜（グランド膜）
３ 筐体カバー
４ 金属ボス
６ 孔
７ 取付ネジ
８ 孔
９ 凹部（または貫通孔）
１０ 樹脂部材
１１ 取付ネジ
１２、１４ 孔
１３ 凹凸
DESCRIPTION OF SYMBOLS 1 Electronic device housing | casing 2 Electronic circuit board 2a Conductive film (ground film)
3 Housing cover 4 Metal boss 6 Hole 7 Mounting screw 8 Hole 9 Recess (or through hole)
10 Resin member 11 Mounting screw 12, 14 Hole 13 Concavity and convexity
Claims (1)
In a structure in which at least one metal boss is erected inside a conductive electronic device casing and an electronic circuit board is screwed to the metal boss, the metal boss is provided with a recess or a through hole. A structure of an electronic device casing, wherein a resin member is embedded in a through hole, and a mounting screw of the electronic circuit board is screwed into the resin member.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005211660A JP4501803B2 (en) | 2005-07-21 | 2005-07-21 | Electronic equipment structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005211660A JP4501803B2 (en) | 2005-07-21 | 2005-07-21 | Electronic equipment structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2007027656A true JP2007027656A (en) | 2007-02-01 |
| JP4501803B2 JP4501803B2 (en) | 2010-07-14 |
Family
ID=37787977
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005211660A Expired - Fee Related JP4501803B2 (en) | 2005-07-21 | 2005-07-21 | Electronic equipment structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4501803B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102595842A (en) * | 2011-01-05 | 2012-07-18 | 英业达股份有限公司 | Electronic apparatus |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61196597U (en) * | 1985-04-19 | 1986-12-08 | ||
| JPS62162409U (en) * | 1986-04-04 | 1987-10-15 | ||
| JPH0589938U (en) * | 1992-05-20 | 1993-12-07 | 富士通株式会社 | Screw dropout prevention structure |
| JPH0718409U (en) * | 1993-08-24 | 1995-03-31 | 森宮電機株式会社 | Printed circuit board holding mechanism with noise absorption function |
| JPH09331181A (en) * | 1996-06-13 | 1997-12-22 | Nec Corp | Fastening structure of electronic equipment case |
| JPH10159824A (en) * | 1996-11-29 | 1998-06-16 | Nec Home Electron Ltd | Part screw stopping structure of case body |
| JP2001352184A (en) * | 2000-06-05 | 2001-12-21 | Fujitsu Ltd | Structure of printed board unit device |
| JP2003115679A (en) * | 2001-10-03 | 2003-04-18 | Matsushita Electric Ind Co Ltd | Information equipment provided with ground structure and ground plate |
-
2005
- 2005-07-21 JP JP2005211660A patent/JP4501803B2/en not_active Expired - Fee Related
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61196597U (en) * | 1985-04-19 | 1986-12-08 | ||
| JPS62162409U (en) * | 1986-04-04 | 1987-10-15 | ||
| JPH0589938U (en) * | 1992-05-20 | 1993-12-07 | 富士通株式会社 | Screw dropout prevention structure |
| JPH0718409U (en) * | 1993-08-24 | 1995-03-31 | 森宮電機株式会社 | Printed circuit board holding mechanism with noise absorption function |
| JPH09331181A (en) * | 1996-06-13 | 1997-12-22 | Nec Corp | Fastening structure of electronic equipment case |
| JPH10159824A (en) * | 1996-11-29 | 1998-06-16 | Nec Home Electron Ltd | Part screw stopping structure of case body |
| JP2001352184A (en) * | 2000-06-05 | 2001-12-21 | Fujitsu Ltd | Structure of printed board unit device |
| JP2003115679A (en) * | 2001-10-03 | 2003-04-18 | Matsushita Electric Ind Co Ltd | Information equipment provided with ground structure and ground plate |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102595842A (en) * | 2011-01-05 | 2012-07-18 | 英业达股份有限公司 | Electronic apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4501803B2 (en) | 2010-07-14 |
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