JP2007022630A - Packing method - Google Patents

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JP2007022630A
JP2007022630A JP2005211306A JP2005211306A JP2007022630A JP 2007022630 A JP2007022630 A JP 2007022630A JP 2005211306 A JP2005211306 A JP 2005211306A JP 2005211306 A JP2005211306 A JP 2005211306A JP 2007022630 A JP2007022630 A JP 2007022630A
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resistant material
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material product
packaging
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Miyuki Miyashita
美由紀 宮下
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Coorstek KK
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Toshiba Ceramics Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a packing method of a product using a heat resisting material which prevents the attachment of a particle to the surface of the product because the surface of a synthetic resin film bag is not abraded by the rustling of the product and the bag during transportation even when the product such as a ceramic product is packaged using the film. <P>SOLUTION: This packing method uses a synthetic resin film having an oxygen transmittancy of less than 20,000 ml/m<SP>2</SP>24hr MPa, a thickness of 0.05-0.15 μm and a density of 0.92-098 g/cm<SP>3</SP>for a product using a heat resisting material to be decompressed and encapsulated. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は梱包方法に係り、特に多層構造を有する合成樹脂フィルム製袋を用いて耐熱材料製品を減圧包装する梱包方法に関する。   The present invention relates to a packaging method, and more particularly to a packaging method for packaging a heat-resistant material product under reduced pressure using a synthetic resin film bag having a multilayer structure.

半導体ウェーハの熱処理に用いられるウェーハボートや炉芯管のような炭化珪素部材を用いたセラミックス製品は、国内外の半導体デバイスメーカーにおいて広く使用されている。このようなセラミックス製品は単層のポリエチレン袋で減圧二重包装後、梱包箱に入れて出荷されているが、セラミックス製品を箱詰めする際、セラミックス製品と梱包箱との間に緩衝材としてスポンジを詰めている。   Ceramic products using silicon carbide members such as wafer boats and furnace core tubes used for heat treatment of semiconductor wafers are widely used by semiconductor device manufacturers in Japan and overseas. Such ceramic products are shipped in a single-layer polyethylene bag after double-depressurized packaging in a packing box and then packed in a packing box. When packing a ceramic product, a sponge is used as a cushioning material between the ceramic product and the packing box. Stuffed.

しかし、このような包装ではセラミックス製品の表面には突起があるため、ポリエチレン袋と擦れると、ポリエチレン袋の表面が削られて、パーティクル（白色粉）がセラミックス製品表面に付着するという問題がある。ポリエチレン袋とセラミックス製品が擦れる現象は、上記のようにセラミックス製品を減圧二重包装して出荷しているが、ガスバリアー性に劣る袋を用いた場合、運搬中に袋内の減圧度が低下するため、ポリエチレン袋とセラミックス製品の密着性が低下し、この結果擦れる頻度が増すためである。   However, since the surface of the ceramic product has protrusions in such packaging, there is a problem in that when rubbing against the polyethylene bag, the surface of the polyethylene bag is scraped and particles (white powder) adhere to the surface of the ceramic product. The phenomenon of rubbing between a polyethylene bag and a ceramic product is shipped by packing the ceramic product in a reduced-pressure double package as described above. However, when a bag with poor gas barrier properties is used, the degree of vacuum in the bag decreases during transportation. Therefore, the adhesion between the polyethylene bag and the ceramic product is lowered, and as a result, the frequency of rubbing increases.

このようなパーティクルの付着問題は、長距離輸送される海外向けの製品で顕著であり、また、緩衝材がセラミックス製品を支持する接触箇所で多く発生している。   Such adhesion problem of particles is remarkable in products for overseas transported over long distances, and is frequently generated at the contact points where the cushioning material supports the ceramic product.

なお、長尺物の梱包装置に関して、特許文献１、２のような提案がなされている。
特開平１１−７１０６１号公報 特開２００２−３４７８４２号公報 In addition, the proposal like patent document 1, 2 is made regarding the packing apparatus of a long thing.
Japanese Patent Laid-Open No. 11-71061 JP 2002-347842 A

本発明は上述した事情を考慮してなされたもので、セラミックス製品等の耐熱材料製品を合成樹脂フィルム袋で包装しても、運搬中に耐熱材料製品と合成樹脂フィルム袋とが擦れて袋の表面が削られることがなく、パーティクルが耐熱材料製品表面に付着することがない耐熱材料製品の梱包方法を提供することを目的とする。   The present invention has been made in consideration of the above-described circumstances. Even if a heat-resistant material product such as a ceramic product is wrapped in a synthetic resin film bag, the heat-resistant material product and the synthetic resin film bag are rubbed during transportation. An object of the present invention is to provide a packaging method for heat-resistant material products in which the surface is not shaved and particles do not adhere to the surface of the heat-resistant material products.

上述した目的を達成するため、本発明に係る梱包方法は、酸素透過度が２０，０００ｍｌ／ｍ２・２４ｈｒ・ＭＰａ以下であって、かつ厚さが０．０５〜０．１５μｍ、密度が０．９２〜０．９８ｇ／ｃｍ３である合成樹脂フィルムによって、耐熱材料製品を減圧封入することを特徴とする。 To achieve the above object, the packing method according to the present invention, the oxygen permeability is not more than 20,000ml / m 2 · 24hr · MPa , and a thickness of 0.05 to 0.15 .mu.m, density 0 The heat-resistant material product is sealed under reduced pressure by a synthetic resin film of .92 to 0.98 g / cm 3 .

好適には、前記耐熱材料製品は、算術平均粗さＲａ２μｍ以上の表面を有するものであることを特徴とする。   Preferably, the heat-resistant material product has a surface with an arithmetic average roughness Ra of 2 μm or more.

また、好適には、前記合成樹脂フィルムは、多層構造のポリエチレン製であり、これによって二重減圧封入することを特徴とする。   Preferably, the synthetic resin film is made of polyethylene having a multi-layer structure, and is thereby double sealed under reduced pressure.

また、好適には、前記減圧封入された耐熱材料製品を梱包箱に収容するとともに、前記耐熱材料製品の当接部の外形形状に内面形状が類似し、前記梱包箱と前記耐熱材料製品間に介在する複数の第１の緩衝材によって前記耐熱材料製品を挟持しかつ、前記耐熱材料製品と前記第１の緩衝材間に第２の緩衝材を介在させることを特徴とする。   Preferably, the heat-resistant material product sealed in reduced pressure is accommodated in a packaging box, and the inner surface shape is similar to the outer shape of the contact portion of the heat-resistant material product, and between the packaging box and the heat-resistant material product. The heat-resistant material product is sandwiched by a plurality of intervening first buffer materials, and a second buffer material is interposed between the heat-resistant material product and the first buffer material.

また、好適には、前記梱包箱を、スペーサあるいは緩衝材を介して外梱包箱に収容することを特徴とする。   Preferably, the packing box is housed in an outer packing box via a spacer or a cushioning material.

本発明に係る梱包方法によれば、耐熱材料製品を合成樹脂フィルム袋で包装しても、運搬中に耐熱材料製品と合成樹脂フィルム袋とが擦れて袋の表面が削られることがなく、パーティクルが耐熱材料製品表面に付着することがない耐熱材料製品の梱包方法を提供することができる。   According to the packaging method of the present invention, even if the heat-resistant material product is packaged with a synthetic resin film bag, the heat-resistant material product and the synthetic resin film bag are not rubbed during transportation and the surface of the bag is not scraped. It is possible to provide a packaging method for a heat-resistant material product that does not adhere to the surface of the heat-resistant material product.

以下、本発明の第１実施形態に係る耐熱材料製品の梱包方法について添付図面を参照して説明する。   Hereinafter, a packaging method for a heat-resistant material product according to a first embodiment of the present invention will be described with reference to the accompanying drawings.

図１は本発明に係る第１実施形態の耐熱材料製品例えば縦型ウェーハボートの梱包方法の説明図である。   FIG. 1 is an explanatory view of a packaging method for a heat-resistant material product such as a vertical wafer boat according to the first embodiment of the present invention.

本第１実施形態に係る耐熱材料製品の梱包方法は、図１に示す本方法に用いられる梱包装置１を展開して説明すれば、耐熱材料製品である縦型ウェーハボートＢを用意し、一重包装目の合成樹脂フィルム製袋を用いて減圧一重包装し、しかる後、二重包装目の合成樹脂フィルム製袋を用いて、減圧一重包装されたウェーハボートＢを二重袋２による減圧二重包装する。   The packaging method of the heat-resistant material product according to the first embodiment will be described by developing the packaging device 1 used in the method shown in FIG. Single-vacuum packaging using the synthetic resin film bag of the packing package, and then double-vacuum double-packaging of the wafer boat B packaged by single-vacuum packaging using the synthetic resin film bag of the double packaging. Packaging.

さらに、この減圧二重包装されたウェーハボートＢの底板Ｂ１及び天板Ｂ３を第２（内側）の緩衝材５でリング状に巻いた後、第１（外側）の緩衝材４を上下から第２の緩衝材５を介して底板Ｂ１及び天板Ｂ３を挟み、梱包箱３に収容する。底板Ｂ１及び天板Ｂ３は第１の緩衝材及び第２の緩衝材で二重に緩衝支持される。 Further, after winding the bottom plate B 1 and the ceiling plate B 3 of the vacuum double wrapped wafer boat B in the second ring-shaped with a buffer material 5 (inside), the cushioning material 4 of the first (outer) vertical The bottom plate B 1 and the top plate B 3 are sandwiched through the second cushioning material 5 and accommodated in the packing box 3. Bottom plate B 1 and the top plate B 3 is buffered supported doubly by the first buffer material and the second buffer material.

さらに、ズレ防止用緩衝材７、軸方向緩衝材８を底板Ｂ１及び天板Ｂ３と梱包箱本体３ａ間に挿入し、二重包装されたウェーハボートＢを梱包箱本体３ａに固定し、梱包箱蓋３ｂを被せる。 Moreover, anti-misalignment cushioning material 7, inserted between an axial cushioning material 8 and the bottom plate B 1 and the top plate B 3 packaging box main body 3a, fixing the wafer boat B, which is double bagged in packaging box main body 3a, Cover the packaging box lid 3b.

さらに、ウェーハボートＢを収容した梱包箱３の８隅にスペーサ７を取り付けた後、外梱包箱６に収容し、外梱包箱蓋部６ｂを閉じ、シールして梱包は完了する。   Further, after the spacers 7 are attached to the eight corners of the packaging box 3 containing the wafer boat B, the spacers 7 are accommodated in the outer packaging box 6, the outer packaging box lid 6b is closed and sealed, and the packaging is completed.

本発明の梱包方法において、梱包される耐熱材料製品は、セラミックス製品の縦型ウェーハボートＢ等であり、この縦型ウェーハボートＢは、使用時炉底蓋に載置される円形の底板Ｂ１と、この底板Ｂ１から複数本延伸しウェーハが挿入載置される支持溝が多数設けられた支持柱Ｂ２と、この支持柱Ｂ２の端部が取り付けられる円形の天板Ｂ３を備え、長尺状になっている。その表面が算術平均粗さＲａ（ＪＩＳ Ｂ−０６０１（１９９４））２μｍ以上を有するものを、本梱包の対象にするのが好ましい。この表面はＣＶＤ等のコーティングによって形成された場合、あるいはサンドブラスト等の機械加工処理が施された場合、いずれの場合も含むが、本発明は特に前者の結晶成長面の場合に、有効である。 In the packing method of the present invention, the heat-resistant material product to be packed is a ceramic product vertical wafer boat B or the like, and this vertical wafer boat B is a circular bottom plate B 1 placed on the furnace bottom lid when in use. And a support column B 2 provided with a plurality of support grooves extending from the bottom plate B 1 and into which wafers are inserted and mounted, and a circular top plate B 3 to which the ends of the support column B 2 are attached. It is long. It is preferable that the surface of which has an arithmetic average roughness Ra (JIS B-0601 (1994)) of 2 μm or more be the target of the main packaging. Although this surface includes any case where it is formed by coating such as CVD, or when it is subjected to a machining process such as sandblasting, the present invention is particularly effective in the case of the former crystal growth surface.

また、合成樹脂フィルム製袋は、例えば、ポリエチレン製であるのが好ましく、ガスバリアー性及び柔軟性に優れた多層構造を有し、酸素透過度が２０，０００ｍｌ／ｍ２・２４ｈｒ・ＭＰａ以下であって、かつ厚さが０．０５〜０．１５μｍ、密度が０．９２〜０．９８ｇ／ｃｍ３である。酸素透過度が２０，０００ｍｌ／ｍ２・２４ｈｒ・ＭＰａを超えると、耐熱材料製品を合成樹脂フィルムによって減圧封入した状態が、運搬中に常圧に戻り易く、耐熱材料製品と合成樹脂フィルムとの間に隙間が生ずることで、これらが擦れて合成樹脂フィルムが削られ、パーティクルが付着し易くなる。ここで、減圧封入とは、３００ｈＰａ以下の内部圧力で封入した状態をいい、耐熱材料とは、アルミナ、炭化珪素、窒化アルミニウム、カーボン等のセラミックス材料もしくは、いずれかの複合体（コーティング品を含む）、あるいは石英等のシリカガラスである。 The synthetic resin film bag is preferably made of, for example, polyethylene, has a multilayer structure excellent in gas barrier properties and flexibility, and has an oxygen permeability of 20,000 ml / m 2 · 24 hr · MPa or less. The thickness is 0.05 to 0.15 μm and the density is 0.92 to 0.98 g / cm 3 . When the oxygen permeability exceeds 20,000 ml / m 2 · 24 hr · MPa, the state in which the heat-resistant material product is sealed under reduced pressure by the synthetic resin film easily returns to normal pressure during transportation, and the heat-resistant material product and the synthetic resin film When gaps are formed between them, they are rubbed to scrape the synthetic resin film, and particles are easily attached. Here, the reduced pressure encapsulation refers to a state of being sealed at an internal pressure of 300 hPa or less, and the heat resistant material is a ceramic material such as alumina, silicon carbide, aluminum nitride, carbon, or any composite (including a coated product). ) Or silica glass such as quartz.

また、厚さが０．１５μｍ、密度が０．９８ｇ／ｃｍ３を超えると、合成樹脂フィルムの柔軟性が劣り、例え３００ｈＰａ以下の内部圧力で減圧しても、耐熱材料製品との擦れによって、パーティクルが生じる可能性が高く、好ましくない。厚さが０．０５μｍ、密度が０．９２ｇ／ｃｍ３より小さいと、運搬中における耐熱材料製品との擦れによって、破れ等の問題を生じ易く好ましくない。 Further, when the thickness is 0.15 μm and the density exceeds 0.98 g / cm 3 , the synthetic resin film is inferior in flexibility, and even if the internal pressure is 300 hPa or less, There is a high possibility that particles are generated, which is not preferable. If the thickness is 0.05 μm and the density is less than 0.92 g / cm 3 , problems such as tearing are likely to occur due to friction with the heat-resistant material product during transportation, which is not preferable.

第１の緩衝材４は長辺が梱包箱３の幅とほぼ同じ長さを有する長方形状をなし、かつ、耐熱材料製品の当接部分例えば底板Ｂ１及び円形天板Ｂ３の外形形状の当接部分Ｂａに内面形状が類似して円弧状溝を有し、例えばウレタンフォーム（スポンジ）製で緩衝性に優れ、例えば底板Ｂ１及び円形天板Ｂ３の周方向に配置される。 The first buffer material 4 forms a rectangular shape long sides have substantially the same length as the width of the packing box 3, and the heat-resistant material product contact parts e.g. bottom plate B 1 and the outer shape of the circular top plate B 3 It has an arcuate groove inner surface shape in the contact portion Ba is similar, for example, excellent cushioning made urethane foam (sponge), is arranged, for example, in the circumferential direction of the bottom plate B 1 and a circular top plate B 3.

梱包箱３は、ダンボール製で長方形状をなし、梱包箱本体３ａと梱包箱蓋３ｂからなっている。   The packing box 3 is made of cardboard and has a rectangular shape, and is composed of a packing box body 3a and a packing box lid 3b.

外梱包箱６は、梱包箱３と同様にダンボール製で長方形状をなしており、外梱包箱本体６ａとその各辺端部に設けられた外梱包箱蓋部６ｂからなり、外梱包箱６には８隅にスペーサ７を介在させるかあるいは６面にスポンジなどの緩衝材を介在させて、梱包箱３が収容される。   The outer packing box 6 is made of corrugated cardboard and has a rectangular shape like the packing box 3, and includes an outer packing box body 6 a and outer packing box lid portions 6 b provided at the respective side edges. The packaging box 3 is accommodated by interposing spacers 7 at the eight corners or interposing a cushioning material such as sponge on the six surfaces.

第２の緩衝材５は、第１の緩衝材４よりも柔らかい部材が好ましく、気泡をシート状にした気泡シート（エアーキャップ）が最適であり、第１の緩衝材４が接触する当接部分例えば底板Ｂ１及び円形天板Ｂ３にリング状に巻かれている。なお、第２の緩衝材５は、縦型ウェーハボートＢと複数の第１の緩衝材４の挟み込みによる締め付け力を適切な寸法設計によって分散させることができ、結果、耐熱材料製品と合成樹脂フィルムのすれをより抑制することができる。 The second cushioning material 5 is preferably a softer member than the first cushioning material 4, and a bubble sheet (air cap) in which bubbles are formed into a sheet shape is optimal, and a contact portion with which the first cushioning material 4 comes into contact. is wound in a ring shape, for example, the bottom plate B 1 and a circular top plate B 3. The second cushioning material 5 can disperse the tightening force caused by sandwiching the vertical wafer boat B and the plurality of first cushioning materials 4 with an appropriate dimensional design. As a result, the heat-resistant material product and the synthetic resin film The slippage can be further suppressed.

上記のように本第１実施形態の梱包方法は、酸素透過度が２０，０００ｍｌ／ｍ２・２４ｈｒ・ＭＰａ以下であって、かつ厚さが０．０５〜０．１５μｍ、密度が０．９２〜０．９８ｇ／ｃｍ３である合成樹脂フィルムによって、耐熱材料製品を減圧封入するので、縦型ウェーハボートのような凹凸がある長尺物のセラミックス製品を梱包するのに適し、また、多層の合成樹脂フィルム袋２で減圧二重包装することにより、袋内の減圧度を保ち、さらに、例え多少減圧破壊があっても、ウェーハボートＢと合成樹脂フィルム袋２との擦れが低減される。ガスバリアー性に優れた多層合成樹脂フィルム製袋の構造とし、さらに、第１の緩衝材４が接触する底板Ｂ１及び円形天板Ｂ３に第１の緩衝材４よりも柔らかい第２の緩衝材５を巻くことにより、合成樹脂フィルム製袋２がウェーハボートＢに強く押さえつけられて擦れるのが防止され、合成樹脂フィルム製袋２の表面が削られて、そのパーティクルがウェーハボートＢ表面に付着するのが防がれる。 As described above, the packaging method of the first embodiment has an oxygen permeability of 20,000 ml / m 2 · 24 hr · MPa or less, a thickness of 0.05 to 0.15 μm, and a density of 0.92. Since the heat-resistant material product is sealed under reduced pressure by a synthetic resin film of ˜0.98 g / cm 3, it is suitable for packing a long ceramic product with unevenness like a vertical wafer boat, By carrying out the vacuum double packaging with the synthetic resin film bag 2, the degree of vacuum inside the bag is maintained, and even if there is some vacuum breakage, the friction between the wafer boat B and the synthetic resin film bag 2 is reduced. A second synthetic resin film bag structure having excellent gas barrier properties, and a second buffer that is softer than the first buffer material 4 on the bottom plate B 1 and the circular top plate B 3 that the first buffer material 4 contacts. By winding the material 5, the synthetic resin film bag 2 is strongly pressed against the wafer boat B and is prevented from rubbing, and the surface of the synthetic resin film bag 2 is shaved and the particles adhere to the surface of the wafer boat B. It is prevented from doing.

本第１実施形態の梱包方法によれば、縦型ウェーハボートを合成樹脂フィルム袋で包装しても、運搬中に縦型ウェーハボートと合成樹脂フィルム袋とが擦れて袋の表面が削ずられることがなく、パーティクルが縦型ウェーハボートに付着することがない梱包方法が実現される。   According to the packaging method of the first embodiment, even if a vertical wafer boat is packaged with a synthetic resin film bag, the vertical wafer boat and the synthetic resin film bag are rubbed during transportation to scrape the surface of the bag. And a packing method in which particles do not adhere to the vertical wafer boat is realized.

また、本発明に係る第２実施形態の縦型ウェーハボートの梱包方法について説明する。   A method for packing a vertical wafer boat according to the second embodiment of the present invention will be described.

第１実施形態は縦型ウェーハボートのように凹凸がある長尺物製品を梱包するのに適し、第１の緩衝材が接触する底板及び円形天板に内側緩衝材を巻くのに対して、本第２実施形態は炉芯管のように凹凸のない長尺物製品を梱包するのに適し、合成樹脂フィルム袋で減圧二重包装された長尺物製品全体を第２の緩衝材で包む方法である。   The first embodiment is suitable for packing a long product having irregularities such as a vertical wafer boat, whereas the inner cushioning material is wound around the bottom plate and the circular top plate with which the first cushioning material contacts, The second embodiment is suitable for packing a long product with no irregularities such as a furnace core tube, and wraps the entire long product that is double-wrapped with a synthetic resin film bag under reduced pressure. Is the method.

例えば、図２に示すように梱包装置１１を展開して説明すれば、第２実施形態の耐熱材料製品の梱包方法は、耐熱材料製品である炉芯管Ｔを用意し、減圧二重包装２する。さらに、この減圧二重包装された炉芯管Ｔ全体を第２の緩衝材１５としてのエアーキャップで包み、さらに、炉芯管Ｔの当接部分と内面形状が類似する円弧状溝を有する第１の緩衝材１４により３個所で緩衝支持し、梱包箱本体１３ａと梱包箱蓋部１３ｂからなる梱包箱１３に収容する。   For example, if the packing device 11 is developed and described as shown in FIG. 2, the packaging method of the heat resistant material product of the second embodiment is to prepare a furnace core tube T that is a heat resistant material product, To do. Further, the entire furnace core tube T, which is double-packed under reduced pressure, is wrapped with an air cap as the second buffer material 15, and further has an arc-shaped groove whose inner surface shape is similar to the contact portion of the furnace core tube T. One cushioning material 14 cushions and supports three places, and is accommodated in a packaging box 13 composed of a packaging box body 13a and a packaging box lid portion 13b.

これにより、凹凸のない長尺物の炉芯管であっても、袋内の減圧度を保ち、炉芯管と合成樹脂フィルム袋との擦れが低減され、合成樹脂フィルム製袋の表面が削られて、そのパーティクルがウェーハボート表面に付着することが防がれる。   As a result, even a long furnace core tube with no irregularities can maintain the degree of decompression in the bag, reduce friction between the furnace core tube and the synthetic resin film bag, and reduce the surface of the synthetic resin film bag. Thus, the particles are prevented from adhering to the wafer boat surface.

他の構成は図１に示す梱包装置と異ならないので、同一符号を付して説明は省略する。   Since the other configuration is not different from the packaging device shown in FIG.

目的：図１に示す本発明に係る耐熱材料製品の梱包方法により梱包されたウェーハボートを用いて、振動試験を行いウェーハボートとポリエチレンフィルム袋との間に隙間の発生、擦れた跡の発生及びウェーハボート表面のパーティクル増加量を測定し（実施例）、単層のポリエチレン袋で減圧二重包装の従来例と比較する。   Purpose: Using the wafer boat packed by the packaging method of the heat-resistant material product according to the present invention shown in FIG. 1, performing a vibration test, generating a gap between the wafer boat and the polyethylene film bag, generating a rubbing trace, and The amount of increase in particles on the surface of the wafer boat is measured (Example), and compared with the conventional example of vacuum double packaging with a single layer polyethylene bag.

フィルム特性：
実施例；フィルムの酸素透過度＝１４，４００ｍｌ／ｍ２・２４ｈｒ・Ｍａ
厚さ＝０．０８ｍｍ
従来例；フィルムの酸素透過度＝３２，６７７ｍｌ／ｍ２・２４ｈｒ・Ｍａ
厚さ＝０．０８ｍｍ Film characteristics:
Example: Oxygen permeability of film = 14,400 ml / m 2 · 24 hr · Ma
Thickness = 0.08mm
Conventional example: Oxygen permeability of film = 32,677 ml / m 2 · 24 hr · Ma
Thickness = 0.08mm

方法：ウェーハボートが収容された梱包装置を１００Ｈｚで２０時間振動させる。
結果：従来例はウェーハボートとポリエチレン袋との間に隙間が発生し、両者が擦れた跡が認められた。これに対して、実施例はウェーハボートとポリエチレン袋との間に隙間の発生が認められず、また、擦れた跡も認められなかった。 Method: A packaging device containing a wafer boat is vibrated at 100 Hz for 20 hours.
Result: In the conventional example, a gap was generated between the wafer boat and the polyethylene bag, and both were rubbed. On the other hand, in the example, no gap was observed between the wafer boat and the polyethylene bag, and no rubbing trace was observed.

さらに、図３に示すように、ウェーハボート表面のパーティクル増加量を測定した結果、実施例はパーティクル増加数が１個／ｃｍ２であったのに対して、従来例はパーティクル増加数が３．２個／ｃｍ２であり、実施例は従来例に比べて１／３以下に改善されていることがわかった。 Furthermore, as shown in FIG. 3, as a result of measuring the amount of increase in particles on the wafer boat surface, the number of particles increased in the example was 1 / cm 2 , whereas the number of particles increased in the conventional example was 3. 2 pieces / cm 2 , and it was found that the example was improved to 1/3 or less than the conventional example.

本発明の第１実施形態に係る耐熱材料製品の梱包方法の説明図。Explanatory drawing of the packaging method of the heat-resistant material product which concerns on 1st Embodiment of this invention. 本発明の第２実施形態に係る耐熱材料製品の梱包方法の説明図。Explanatory drawing of the packaging method of the heat-resistant material product which concerns on 2nd Embodiment of this invention. 本発明に係る耐熱材料製品の梱包方法を用いたパーティクル増加量測定試験の結果図。The result figure of the particle increase amount measurement test using the packaging method of the heat-resistant material product which concerns on this invention.

符号の説明Explanation of symbols

１ 耐熱材料製品の梱包装置
２ 合成樹脂フィルム製袋
３ 梱包箱
４ 第１の緩衝材
５ 第２の緩衝材
６ 外梱包箱
７ ズレ防止用緩衝材
８ 軸方向緩衝材
Ｂ 縦型ウェーハボート
Ｂａ 当接部分 DESCRIPTION OF SYMBOLS 1 Packing apparatus of heat-resistant material product 2 Synthetic-resin film bag 3 Packing box 4 1st buffer material 5 2nd buffer material 6 Outer packaging box 7 Anti-slip buffer material 8 Axial buffer material B Vertical wafer boat Ba Contact part

Claims (5)

酸素透過度が２０，０００ｍｌ／ｍ２・２４ｈｒ・ＭＰａ以下であって、かつ厚さが０．０５〜０．１５μｍ、密度が０．９２〜０．９８ｇ／ｃｍ３である合成樹脂フィルムによって、耐熱材料製品を減圧封入することを特徴とする梱包方法。 By a synthetic resin film having an oxygen permeability of 20,000 ml / m 2 · 24 hr · MPa or less, a thickness of 0.05 to 0.15 μm, and a density of 0.92 to 0.98 g / cm 3 , A packaging method characterized by sealing a heat-resistant material product under reduced pressure. 前記耐熱材料製品は算術平均粗さＲａ２μｍ以上の表面を有するものであることを特徴とする請求項１に記載の梱包方法。 The packaging method according to claim 1, wherein the heat-resistant material product has a surface with an arithmetic average roughness Ra of 2 μm or more. 前記合成樹脂フィルムは多層構造のポリエチレン製であり、これによって二重減圧封入することを特徴とする請求項１または２に記載の梱包方法。 The packaging method according to claim 1 or 2, wherein the synthetic resin film is made of polyethylene having a multilayer structure, and is sealed by double vacuum. 前記減圧封入された耐熱材料製品を梱包箱に収容するとともに、前記耐熱材料製品の当接部の外形形状に内面形状が類似し、前記梱包箱と前記耐熱材料製品間に介在する複数の第１の緩衝材によって前記耐熱材料製品を挟持しかつ、前記耐熱材料製品と前記第１の緩衝材間に第２の緩衝材を介在させることを特徴とする請求項１ないし３のいずれか１項に記載の梱包方法。 The heat-resistant material product sealed under reduced pressure is accommodated in a packaging box, and the inner surface shape is similar to the outer shape of the contact portion of the heat-resistant material product, and a plurality of first materials interposed between the packaging box and the heat-resistant material product. 4. The heat-resistant material product is sandwiched between the heat-resistant material product and a second shock-absorbing material is interposed between the heat-resistant material product and the first shock-absorbing material according to any one of claims 1 to 3. The packing method described. 前記梱包箱を、スペーサあるいは緩衝材を介して外梱包箱に収容することを特徴とする請求項４に記載の梱包方法。 The packing method according to claim 4, wherein the packing box is accommodated in an outer packing box via a spacer or a cushioning material.
JP2005211306A 2005-07-21 2005-07-21 Packing method Pending JP2007022630A (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5264389A (en) * 1975-11-20 1977-05-27 Asahi Shiyueeberu Kk Method of packing glass cloth roll
JPS6423964A (en) * 1987-07-03 1989-01-26 Hitachi Ltd Buffering packing structure
JPH04144963A (en) * 1990-10-02 1992-05-19 Toshiba Ceramics Co Ltd Silicon carbide-based composite material
JPH0692386A (en) * 1991-04-11 1994-04-05 Nippon Carbide Ind Co Inc Package with inner pressure adjusted and packaging material used therefor

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5264389A (en) * 1975-11-20 1977-05-27 Asahi Shiyueeberu Kk Method of packing glass cloth roll
JPS6423964A (en) * 1987-07-03 1989-01-26 Hitachi Ltd Buffering packing structure
JPH04144963A (en) * 1990-10-02 1992-05-19 Toshiba Ceramics Co Ltd Silicon carbide-based composite material
JPH0692386A (en) * 1991-04-11 1994-04-05 Nippon Carbide Ind Co Inc Package with inner pressure adjusted and packaging material used therefor

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