JP2007021653A - Resin bond grinding wheel and manufacturing method thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a resin bond grinding wheel and a manufacturing method thereof, elastically holding abrasive grains, having a shape maintaining function for the whole grinding wheel, and providing minute machined surface. <P>SOLUTION: In this resin bond grinding wheel, a number of granules 2 formed by solidifying a number of superabrasive grains 3 with a binder material 4 mainly composed of epoxy resin, which is thermosetting resin are solidified by thermosetting resin having a smaller elasticity than the resin for forming the granules 2. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a resin bond grindstone and a method for producing the same, and particularly to a resin bond grindstone in which superabrasive grains are granulated and a method for producing the same.

Conventionally, superabrasive grains made of diamond or cubic boron nitride (CBN) for grinding and polishing various workpieces made of hard and brittle materials such as cemented carbide, ceramics, glass and silicon, and steel materials such as high speed steel A resin bond grindstone in which is hardened with a phenol resin is used. In a general resin bond grindstone using such a phenol resin as a binder, since the elasticity in holding the abrasive grains is poor, load fluctuation from the workpiece surface cannot be absorbed, and precise surface processing is difficult. In order to give elastic force, it had to adjust with the kind and addition amount of various fillers, such as organic substance added, inorganic substance, and metallic substance. In addition, in the invention described in Patent Document 1, a liquid epoxy resin or the like is used instead of a phenol resin, and by this, the abrasive grains are solidified to have a high porosity and great elasticity, so that the workpiece is processed. It is assumed that the fine grains can be processed by the abrasive grains entering the recesses.
Japanese Patent Application Laid-Open No. 2004-174641

  However, in the thing of patent document 1, since the hardened | cured epoxy resin is equipped with big elasticity, although an abrasive grain can be hold | maintained elastically, the shape maintenance function as the whole grindstone will fall, and especially workpiece | work In the case where the shape retention of the grindstone is strongly required, such as general shape grinding such as chamfering, a sufficient finished surface cannot be obtained. For this reason, the present inventors give elasticity for holding the abrasive grains, and in order to ensure the shape maintaining function of the entire grindstone, the abrasive grains are made into a large number of granules solidified with a resin having a large elasticity. It has been found that by using a grindstone further hardened with a resin having a relatively low elasticity, the abrasive grains can be held elastically and the shape maintaining function of the entire grindstone can be provided. Furthermore, as a result of examining various resins as a binder constituting the granule, the main component is an epoxy resin that is a thermosetting resin in terms of holding abrasive grains and adhesiveness with a resin that becomes a base material that hardens the granules. It is most excellent, and if it is a thermosetting epoxy resin, the elastic force can be easily set to a predetermined size by mixing other thermosetting resins as fillers. The inventors have obtained knowledge and have reached the present invention.

  That is, the present invention has been made to solve the above-described problems of the prior art, and can hold the abrasive grains elastically and can also have a function of maintaining the shape of the entire grindstone, thereby providing a precise processed surface. An object of the present invention is to provide a resin bond grindstone that can be used and a method for producing the same.

In order to achieve such an object, the resin bond grindstone of the present invention has a large number of granules formed by solidifying a large number of superabrasive grains with a binder mainly composed of an epoxy resin that is a thermosetting resin. It is characterized by being hardened by a thermosetting resin having a smaller elasticity than the resin constituting the granules. According to this grindstone, the superabrasive grains are elastically held by the highly elastic resin constituting the granules, so that it is possible to follow the fine uneven surface of the workpiece during processing, and from the workpiece to the abrasive grains. The acting load can be absorbed by elastic deformation. At the same time, it has a function of maintaining the shape of the entire grindstone with a small elastic resin that hardens the granules. Moreover, the adhesiveness with the thermosetting resin used as the preform | base_material which solidifies granules can be improved by using resin which comprises a granule as the thermosetting epoxy resin. Further, in the present invention, since an epoxy resin is used, the elasticity of the resin as a binding material that hardens the superabrasive grains and the holding power of the abrasive grains can be obtained by mixing the epoxy resin and another thermosetting resin. It can also be set easily.

  Moreover, when the average particle diameter of the granules is 0.3 to 2 mm, the balance between the elastic force for holding the abrasive grains and the maintenance of the overall shape is achieved, and the manufacture of the grindstone is facilitated.

  Further, the manufacturing method includes a step of kneading a large number of superabrasive grains and a liquid thermosetting epoxy resin as main components, a step of extruding the kneaded material through a screen, and applying heat to the material that has passed through the screen. A step of curing to form a granule, a step of mixing the granule with a thermosetting resin whose elasticity after molding is smaller than that of the resin forming the granule, and a step of sintering and molding the mixture. When the manufacturing method includes a mixture of a large number of superabrasive grains and a liquid thermosetting epoxy resin as a main component, the mixture is extruded through a screen, and the clay-like mixture before sintering is used as a reference for the screen eyes. Granulation and sizing are performed, and heat is applied to this to form a granule, which is mixed with a thermosetting resin that should be used as a base material, fired, and molded. range It is possible to easily manufacture the granular resin bond grinding stone.

ADVANTAGE OF THE INVENTION According to this invention, the surface roughness of a workpiece can be improved and the resin bond grindstone which can improve a lifetime, and its manufacturing method can be provided.

  Hereinafter, preferred embodiments of a resin bond grindstone and a method for producing the same according to the present invention will be described in detail with reference to the drawings. FIG. 1 is a diagram showing a configuration of a resin bond grindstone according to an embodiment of the present invention. The resin bond grindstone 1 has a structure in which a large number of granules 2 and the granules 2 are hardened with a thermosetting resin such as a phenol resin as a base material 5. Each granule 2 is solidified by a binder 4 in which a large number of superabrasive grains 3 made of diamond or cubic boron nitride (CBN) are hardened mainly with a liquid epoxy resin as a thermosetting resin. The particle size of the superabrasive is preferably selected between 80 mesh and 3000 mesh depending on the application. The granule size is 0.3-2 mm. The mixing ratio of the abrasive grains is preferably 25 (6.25% by volume) to 150 (27.5% by volume) in terms of concentration including the base material 5. As the thermosetting resin which is the main component for forming the base material 5, other resins such as epoxy resin, alkyd resin, melamine resin, epoxy resin, fluororesin can be used in addition to phenol resin. It is necessary for the base material 5 to be less elastic than the binding material 4 that is formed mainly of.

Next, the manufacturing method of the resin bond grindstone 1 is demonstrated. Commonly used are superabrasive grains having a predetermined particle size of 80 mesh or less, a liquid epoxy resin that is a main component of the binder 4 and its curing agent, phenol resin powder that is another thermosetting resin, inorganic materials, metallic materials, and the like. Filler is mixed and kneaded to form clay. As a mixing ratio, when the total of the binder 4 is 100%, the liquid epoxy resin as a main component and its curing agent are 50 to 85%, and a phenol resin powder as another thermosetting resin. Etc. are 5% or less, and the remainder is filler. The kneaded material is lined with a screen of about 1 mm. As a result, a granulated product is obtained which is granulated into clay-like grains and sized to a particle size of about 1 mm. A granule can be obtained by applying a heat of about 120 ° C. to this, followed by mechanical loosening. This granule is mixed with a phenol resin powder or an epoxy resin powder which is a thermosetting resin to be the base material 5. Regarding the mixing ratio, the thermosetting resin powder to be the base material 5 is 30% by volume when the total of the materials to be the binding material 4 is 100% by volume. This mixture is placed in a mold and sintered at about 160 ° C. In this way, the resin bond grindstone 1 is obtained.
In the present embodiment as described above, in the resin bond grindstone 1, the superabrasive grains 3 are elastically held by the binding material 4 made of a highly elastic resin constituting the granules 2. In addition to being able to follow the fine uneven surface of the workpiece surface during processing, the load acting on the abrasive grains 3 from the workpiece can be absorbed by elastic deformation. At the same time, it has a function of maintaining the entire shape of the grindstone by the base material 5 made of a resin having a small elasticity for hardening the granules 2. Moreover, the adhesiveness with the thermosetting resin used as the base material 5 which solidifies the granule 2 can be improved by using resin which comprises the granule 2 as the thermosetting epoxy resin. Furthermore, since an epoxy resin is used, the elasticity of the resin as the binding material 4 that hardens the superabrasive grains 3 and the retention of the superabrasive grains 3 by mixing the epoxy resin and other thermosetting resin powders. It is also possible to easily set the force.

  The average particle size of the granules 2 is 0.3 to 2 mm. If the particle size is smaller than this, it is difficult to produce by granulating and sizing with a screen. Cannot be held sufficiently. On the other hand, if the particle size is larger than this, the granule 2 becomes relatively large with respect to the size of the resin bond grindstone 1, and the function of the base material 5 becomes too small, so that the shape of the grindstone cannot be maintained. It will be enough. Therefore, by setting the size of the granule 2 to 0.3 to 2 mm, the elastic force for holding the abrasive grains and the maintenance of the overall shape are balanced, and the manufacture of the grindstone is facilitated.

  Further, in the production of the resin bond grindstone 1, the kneaded mixture of a large number of superabrasive grains 3 and a liquid thermosetting epoxy resin as a main component is extruded through a screen, whereby the clay-like mixture before sintering is screened. With this as a standard, granulation and sizing will be performed, and by applying heat to this, it will be cured to form granules, mixed with the thermosetting resin that should be the base material, fired and molded, It becomes possible to easily manufacture a granular resin bond grindstone having a predetermined particle size range.

  In this embodiment, the phenol resin powder is added in the formation of the binder, but another thermosetting resin may be added, or a liquid epoxy resin alone may be used. Further, the mixing ratio of various materials is not limited to the above, and the heating temperature may be appropriately set according to the material.

Examples will be described below.
Example 1
In the manufacturing method of the resin bond grindstone explained in the embodiment as described above, an epoxy resin powder is used as the thermosetting resin to be the base material 5, and the mixing ratio of 600 mesh superabrasive grains is 75. Thus, a resin bond grindstone for chamfering was produced. As shown in FIG. 2, the chamfering finish processing of the liquid crystal glass G was performed with the resin bond grindstone C manufactured as described above and attached around the base metal B in the chamfering wheel A. In addition, as a comparative example, a comparison was made with a processing result using a resin bond grindstone in which superabrasive grains were hardened with a conventional phenol resin. The processing conditions were a wheel peripheral speed of 1320 m / min, a feed speed of 4.5 m / min, a cutting depth of 0.005 mm, and a cutting frequency of 150 times, which were 50 times for 3 pieces of glass. As a result, the wear of the wheel was 2 μm in Example 1 while the wear height of the conventional product was 5 μm. Further, the normal grinding resistance indicating the sharpness of the grindstone was lowered from a processing distance of about 30 m in the conventional product, whereas in Example 1, it was maintained at about 25 N even when the processing distance exceeded 40 m.
Example 2
Although it is the same as that of said Example 1, the resin bond grindstone which made the concentration degree of the abrasive grain 50 was manufactured as a grinding tool for surface processing of glass, and surface processing of the blue plate glass was performed. In addition, as a comparative example, a comparison was made with a processing result using a resin bond grindstone in which superabrasive grains were hardened with a conventional phenol resin. The processing conditions are a wheel peripheral speed of 1020 m / min, a feed speed of 300 mm / min manually, and a cutting depth of 0.05 to 0.06 mm. As a result, the surface roughness Ra (center line average roughness) of the conventional product was about 0.06 μm, while that of Example 2 was about 0.03 μm.

It is a block diagram which shows the structure of the resin bond grindstone of embodiment of this invention. It is a figure which shows the process by the resin bond grindstone of Example 1 of this invention.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Resin bond grindstone, 2 ... Granule, 3 ... Super abrasive grain, 4 ... Binding material, 5 ... Base material, A ... Wheel for chamfering, B ... Metal, C ... Resin bond grindstone, G ... Glass plate

Claims (3)

A large number of granules composed of a large number of superabrasive grains solidified by a binder mainly composed of an epoxy resin, which is a thermosetting resin,
A resin-bonded grindstone characterized in that it is hardened with a thermosetting resin having a smaller elasticity than the resin constituting the granules.   The resin bond grindstone according to claim 1, wherein an average particle diameter of the granules is 0.3 to 2 mm. Kneading a large number of superabrasive grains and a liquid thermosetting epoxy resin as main components;
Extruding the kneaded material through a screen;
A step of applying heat to the material that has passed through the screen and curing it to form granules;
A step of mixing the granules with a thermosetting resin whose elasticity after molding becomes smaller than the resin forming the granules;
A method for producing a resin bond grindstone, comprising a step of sintering and molding the mixture.

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