JP2007019417A - Light emitting diode package structure, cold cathode fluorescent lamp, and its photoluminescent material - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an LED package structure containing a carrier, an LED chip, a capsule material, and a PL material in a way that the LED chip is mounted on the carrier for light emission. <P>SOLUTION: A capsule material encapsulates an LED chip and a PL material is distributed within the capsule material. The PL material is excited by light emitted from the LED chip and is suitable for light scattering. In addition, a new PL material is provided as represented by a molecular formula "W<SB>m</SB>Mo<SB>n</SB>(Y, Ce, Tb, Gd, Sc)<SB>3+t+u</SB>(A1, Ga, T1, In, B)<SB>5+u+2v</SB>(O, S, Se)<SB>12+2t+3u+3v+3m+3n</SB>:Ce<SP>3+</SP>, Tb<SP>3+</SP>" under 0<t<5 and 0<m, n, u, v<15. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

The present invention relates to an LED (light emitting diode) package structure, and more particularly to an LED package structure featuring a glittering diffusion material.

  As LED luminous efficiency continues to improve in recent years, in the fields of fast response scanner light source, LCD (Liquid Crystal Display) backlight light source, automotive instrument panel lighting, traffic lights, general lighting equipment, etc., gradually from fluorescent lamps and incandescent lamps to LEDs Has been migrated. Compared to conventional bulbs, it has features such as compact size, durability, low voltage / current drive, damage resistance, zero heat emission during lighting, no mercury (and therefore no environmental pollution) and high luminous efficiency (energy saving) Therefore, the LED has an absolute advantage. Considering today's production technology and applicability, white LEDs are the most attention among the various illumination colors of LEDs.

  White light is light in which light of a plurality of colors is mixed. White light visible to the human eye includes light of at least two different wavelengths. For example, when blue light and yellow light are mixed, a double wavelength white light is formed, and when red light, green light and blue light are mixed, a triple wavelength white light is formed. Currently, there are three methods for creating white LEDs. The first method is a so-called triple wavelength method, in which the LED chip set includes a red LED chip, a green LED chip, and a blue LED chip. By adjusting each current passing through the three chips, uniform white light is formed. A feature of this mode is high luminous efficiency with higher production costs. The second method is a so-called dual wavelength method, in which the LED chip set includes a blue LED chip and a yellow LED chip. By adjusting the currents of the two chips, uniform white light is formed. This method is characterized by good luminous efficiency and cheaper production costs. Furthermore, in the third method, white light is formed by mixing a blue phosphor formed from a blue LED and a yellow phosphor formed from yellow light formed from excitation blue light. The features of the third mode are a simpler production process, lower luminous efficiency, and lower cost. Therefore, currently most white LEDs are made by the third method. That is, white light is formed using blue light and a yellow phosphor excited by blue light.

  FIG. 1 is a schematic view of a conventional white LED package structure. Referring to FIG. 1, the conventional white LED package structure mainly includes a package lead pin 100, a blue LED chip 102, an inner capsule material 104, and an outer capsule material 106, where the blue LED chip 102 is on the package lead pin 100. Arranged and electrically connected to the package lead pin 100 via two solder wires 108. The inner capsule material 104 includes a yellow phosphor and covers the blue LED chip 102. The outer capsule material 106 is used to cover the package lead pins 100, the blue LED chip 102, and a portion of the inner capsule material 104. The above-mentioned white LED is produced by using the blue light emitted by the blue LED chip 102 to excite the internal capsule material 104 to form a double wavelength white light mixed by blue light and yellow light. To do.

  FIG. 2 is a schematic view of another conventional white LED package structure. The main improvement of the white LED compared to FIG. 1 is an additional diffusion layer 110 applied to coat the inner capsule material 104. The diffusion layer 110 includes a transparent adhesive in which transparent fine particles or bubbles are diffused. Since the transparent fine particles or bubbles in the diffusion layer 110 repeatedly reflect the light beam, the color tone of the mixed light can be made more uniform.

  However, in order to obtain a better light mixing effect, the size and diffusion concentration of the fluorescent powder on the material 104 of the inner capsule and the transparent fine particles or bubbles in the diffusion layer 110 need to be well matched. . Since there are too many factors affecting the light mixing effect, it is practically difficult to generate and control the light mixing effect to some extent.

  To better understand the above LED package structure, US (US) patent PN 5,998,925 and ROC (Taiwan) patent PN 383508 are used as a reference.

  Thus, an object of the present invention is to provide an LED package structure and further promote its light injection effect.

  Thus, the present invention comprises a cold cathode fluorescent lamp, wherein a bright material (PL material) is used to replace the conventional fluorescent layer and diffusion layer, promoting its light injection effect.

  Thus, unlike the conventional fluorescent powder, the present invention comprises a suitable PL material for the LED package structure and the cold cathode fluorescent lamp to produce a better light injection effect.

  The present invention comprises an LED package structure mainly comprising a carrier, an LED chip, an encapsulant material, and a PL material, wherein the LED chip is arranged on a carrier that emits light and the encapsulant material is an LED chip on the carrier. Used for wrapping, the PL material is diffused into the material of the capsule, where the glitter material is excited by the light emitted from the LED chip and applied to scatter the light.

  As shown in one embodiment of the present invention, the carrier is, for example, a printed circuit board (PCB) that includes chip holding cells for LED chip arrays. The LED chip is electrically connected to the PCB.

  As shown in one embodiment of the present invention, the carrier is, for example, a package frame. The LED chip is electrically connected to the package frame via two solder wires. Moreover, the LED chip is, for example, a blue LED chip.

  As shown in one embodiment of the present invention, the capsule material includes an inner capsule material and an outer capsule material, where the inner capsule material encapsulates the LED chip and the PL material is within the inner capsule material. And the outer capsule material encapsulates the inner capsule material and a portion of the carrier.

As shown in an embodiment of the present invention, the molecular formula of the PL _{material, W m Mo n (Y,} Ce, Tb, Gd, Sc) 3 + t + u (Al, Ga, Tl, In, B) 5+ _{u + 2v} (O, S, Se) _{12 + 2t + 3u + 3v + 3m + 3n} : Ce ³⁺ , Tb ³ ₊ , where 0 <t <5 and 0 <m, n, u, v <15. Above molecular formula _{W m Mo n (Y, Ce} , Tb, Gd, Sc) 3 + t + u (Al, Ga, Tl, In, B) 5 + u + 2v (O, S, Se) 12 + 2t + _{3u + 3v + 3m + 3n} : The aforementioned PL material represented by Ce ³⁺ , Tb ³⁺ (0 <t <5 and 0 <m, n, u, v <15) is a mixture or a sintered product. Furthermore, the maximum particle size is smaller than 30μ and the average particle size is smaller than 10μ.

  As shown in one embodiment of the present invention, the PL material includes a phosphor and a diffusing material. The particle size of the fluorescent material is less than 25μ.

  The present invention further comprises an alternative cold cathode fluorescent lamp including a fluorescent lamp, a discharge gas, a PL material, and an electrode set, wherein the discharge gas is filled into the fluorescent lamp, the PL material is diffused onto the inner wall of the lamp, The electrode set includes an anode and a cathode in which an anode is arranged at one end of the light tube and a cathode is arranged at the other end.

As shown in an embodiment of the present invention, the molecular formula of the PL _{material, W m Mo n (Y,} Ce, Tb, Gd, Sc) 3 + t + u (Al, Ga, Tl, In, B) 5+ _{u + 2v} (O, S, Se) _{12 + 2t + 3u + 3v + 3m + 3n} : Ce ³⁺ , Tb ³⁺ , where 0 <t <5 and 0 <m, n, u , V <15. Molecular formula _{W m Mo n (Y, Ce} , Tb, Gd, Sc) 3 + t + u (Al, Ga, Tl, In, B) 5 + u + 2v (O, S, Se) 12 + 2t + 3u + _{3v + 3m + 3n} : The PL material represented by Ce ³⁺ , Tb ³⁺ (here, 0 <t <5 and 0 <m, n, u, v <15) is a mixture or a sintered product. Further, the PL material includes a phosphor and a diffusion material bonded with the phosphor.

The present invention also includes alternative PL materials. Molecular formula of PL _{materials, W m Mo n (Y,} Ce, Tb, Gd, Sc) 3 + t + u (Al, Ga, Tl, In, B) 5 + u + 2v (O, S, Se) 12 _{+ 2t + 3u + 3v + 3m + 3n} : can be represented by Ce ³⁺ , Tb ³⁺ , where 0 <t <5 and 0 <m, n, u, v <15. Further, the molecular formula _{W m Mo n (Y, Ce} , Tb, Gd, Sc) 3 + t + u (Al, Ga, Tl, In, B) 5 + u + 2v (O, S, Se) 12 + 2t + _{3u + 3v + 3m + 3n} : The PL material represented by Ce ³⁺ , Tb ³⁺ (0 <t <5 and 0 <m, n, u, v <15) is a mixture or a sintered product.

  In the present invention, a PL material is used instead of the conventional fluorescent layer and diffusion layer for light conversion and light mixing effect. Thus, the compatibility between the variables existing in the prior art such as the material of the fluorescent layer and the diffusion layer, the particle size and the particle distribution density is not a problem. Furthermore, the entire process for creating the LED package is effectively simplified with a lower production cost and better light mixing effect.

[Example 1]
FIG. 3 is a schematic view of an LED package structure according to a first embodiment of the present invention. According to FIG. 3, the LED package structure in the first embodiment of the present invention mainly includes a carrier 200, an LED chip 210, a capsule material 220, and a PL material 230, where the LED chip 210 is on the carrier 200. To emit light. Also, the capsule material 220 encapsulates most of the carrier 200 and the LED chip 210, and the PL material 230 is evenly distributed within the capsule material 220. The PL material layer 230 is appropriately excited by the light emitted from the LED chip 210 and scatters the light.

  In the first embodiment, the carrier 200 is, for example, a package lead pin 200 'as shown in FIG. The package lead pin 200 ′ includes a first lead pin 202 and a second lead pin 204. At the top of the first lead pin 202 is a carrier pad 206 containing a chip holding cell 208. The chip holding cell 208 has a concave shape suitable for holding the LED chip 210.

  The LED chips 210 are arranged in the chip holding cells 208 of the carrier pad 206 and emit light. In the first embodiment, the LED chip 210 is, for example, a blue LED chip. The surface of the LED chip 210 includes an electrode 212 including a cathode and an anode, where the cathode is electrically connected to the first lead pin 202 and the anode is electrically connected to the second lead pin 204 via solder wires 209a and 209b. The

The encapsulant material 220 is used to encapsulate part of the package lead pins 200 ′, LED chip 210, PL material 230 and solder wires 209a and 209b. The first lead pin 202 and the second lead pin 204 protrude from the bottom of the capsule material 220. The capsule material 220 includes an inner capsule material 222 and an outer capsule material 224, where the inner capsule material 222 encapsulates the LED chip 210 and the outer capsule material 224 includes the inner capsule material 222 and the carrier 200. Encapsulate part of

  It is noteworthy that the PL material 230 of the present invention is evenly distributed within the inner capsule material 222. The PL material 230 serves as both a prior art phosphor layer and a diffusion layer. That is, the PL material is not only excited by the light emitted from the LED chip 210 but also can scatter the light. As a result, the light emitted from the LED chip 210 and the light formed by the excited PL material 230 are more evenly mixed to achieve a better light mixing effect. The PL material 230 is not limited to application to the inner capsule material 222 of the first embodiment, but can be applied to other package structures or illumination using excited phosphors that generate light. In all these applications, good light mixing effects are achieved.

  4A and 4B are schematic diagrams representing particles of PL material. 4A and 4B, the particles of PL material 230 include phosphor 230a distributed within diffusing material 230b and diffusing material 230b that adheres to phosphor 230a. When incident light emitted from the LED chip 210 enters the PL material 230, the phosphor 230a inside the PL material 230 is excited to generate light of other wavelengths. Further, the diffusing material 230b scatters light to other particles of the PL material 230 and exhibits a good light mixing effect due to the LED package structure. In FIG. 4B, there is a transient stage 230c that includes the fluorescent material 230a. The transient stage 230 c is generated under any circumstances during the creation of the PL material 230.

In a first embodiment, the molecular formula of the PL material _{230, W m Mo n (Y,} Ce, Tb, Gd, Sc) 3 + t + u (Al, Ga, Tl, In, B) 5 + u + 2v (O, S, Se) _{12 + 2t + 3u + 3v + 3m + 3n} : represented by Ce ³⁺ , Tb ₃₊ , where 0 <t <5 and 0 <m, n, u, v <15 It is. In FIG. 4A, in order to achieve a better light mixing effect, the maximum particle size Dmax of the PL material is smaller than 30μ, its average particle size is smaller than 10μ, and the particle size Di of the phosphor is smaller than 25μ. Further, the molecular formula _{W m Mo n (Y, Ce} , Tb, Gd, Sc) 3 + t + u (Al, Ga, Tl, In, B) 5 + u + 2v (O, S, Se) 12 + 2t + _{3u + 3v + 3m + 3n} : The PL material represented by Ce ³⁺ , Tb ³⁺ (0 <t <5 and 0 <m, n, u, v <15) is a mixture or a sintered product.

  5A and 5B are schematic diagrams representing particles of an alternative PL material 230. FIG. 5A and 5B, the particles of the PL material 230 include a phosphor 230a and a diffusion material 230b. The difference between FIG. 5A and FIG. 5B is that the diffusion material 230b of the PL material 230 is distributed within the phosphor 230a. Alternative PL material 230 also achieves the same light mixing effect.

As is known to those skilled in the art, the disclosed PL material 230 is not limited to the package structure described above. In fact, the disclosed PL material 230 can also be applied to any package structure based on an excitation-phosphor mode that generates light. In order to achieve the objective, it is necessary to replace the original phosphor layer with the inner capsule material 222 and its distributed PL material 230.
[Example 2]

  6 and 7 are schematic views of a white LED package structure according to a second embodiment of the present invention. In FIG. 6, the structure of the second embodiment is the same as the structure of the first embodiment. The difference in the second embodiment is that the carrier 300 is a printed circuit board (PCB) 300 'on which packages are arranged.

  The LED package structure in the second embodiment mainly includes a PCB 300 ′, an LED chip 310, a capsule material 320 and a PL material 330. Similarly, the capsule material 320 includes an inner capsule material 322 and an outer capsule material 324, where the inner capsule material 322 encapsulates the LED chip 310 and the outer capsule material 324 is one of the PCB 300 ′. Part, LED chip 310, inner capsule material 322, PL material 330, and solder wire 314 are encapsulated. If the capsule material 320 does not include the inner capsule material 322 and includes only the outer capsule material 324, the outer capsule material 324 includes only the PL material 330.

  The LED chip 310 is arranged on the PCB 300 '. The connection pads 302 and the electrodes 312 are arranged on the PCB 300 ′ and the LED chip 310, respectively. The electrode 312 is connected to the connection pad 302 on the PCB 300 ′ via two solder wires 314 so that the PCB 300 ′ is electrically connected to the LED chip 310.

The inner capsule material 322 is arranged on the PCB 300 ′ and covers the LED chip 310 described above. The PL material 330 includes a diffusing material that is evenly distributed within the inner capsule material 322 and adhered to the phosphor. When incident light from the LED chip 310 enters the PL material 330, the phosphors there are excited and produce light with different wavelengths. The diffusing material scatters light to other particulates of the PL material, producing a better light mixing effect. In the second embodiment, the molecular formula of the PL material _{330, W m Mo n (Y,} Ce, Tb, Gd, Sc) 3 + t + u (Al, Ga, Tl, In, B) 5 + u + 2v (O, S, Se) _{12 + 2t + 3u + 3v + 3m + 3n} : represented by Ce ³⁺ , Tb ³⁺ , where 0 <t <5 and 0 <m, n, u, v <15 It is. In order to achieve a better light mixing effect, the maximum particle size Dmax of the PL material 330 is similarly less than 30μ, its average particle size is less than 10μ, and the phosphor particle size Di is less than 25μ. Further, the molecular formula _{W m Mo n (Y, Ce} , Tb, Gd, Sc) 3 + t + u (Al, Ga, Tl, In, B) 5 + u + 2v (O, S, Se) 12 + 2t + _{3u + 3v + 3m + 3n} : The PL material represented by Ce ³⁺ , Tb ³⁺ (0 <t <5 and 0 <m, n, u, v <15) is a mixture or a sintered product.

In FIG. 7, chip holding cells 304 are arranged in the PCB 300 ′ to promote the light aggregation effect of the LED package structure. The chip holding cell 304 has a concave-cup shape suitable for holding the LED chip 310. Further, the reflective film layer is plated on the sidewalls of the chip holding cell 304 as an option for increasing the light-reflection effect.
Example 3

  In the first and second embodiments of the present invention, PL material is used in the LED package structure. Furthermore, PL materials are commonly used in cold cathode fluorescent lamps to achieve better light mixing effects.

  FIG. 8 is a schematic view of a cold cathode fluorescent lamp according to a third embodiment of the present invention. In FIG. 8, a cold cathode fluorescent lamp 400 includes a light tube 410, a discharge gas (not shown), a PL material 420, and an electrode set 430, where the light tube 410 is a discharge gas such as mercury vapor and an inert gas. To be filled properly. The PL material 420 is added to the inner wall of the light tube 410. Further, the electrode set 430 includes both an anode and a cathode arranged at both ends of the light tube 410, respectively. The electrode set 430 is electrically connected to a power source (not shown).

  When a bias voltage is applied to the electrode set 430, the discharge gas in the light tube, such as mercury vapor and inert gas, is excited to an excited state and then returns to a steady state. While the discharge gas returns to a steady state, the gas emits ultraviolet light and releases energy. When the ultraviolet light emitted by the discharge gas reaches the PL material 420 on the wall surface of the light tube 410 by the mechanism described above, the PL material including the phosphor and the diffusion material that adheres to the fluorescent material emits visible light. Achieve the lighting effect. Meanwhile, the diffusing material that adheres to the phosphor scatters light that produces a better light mixing effect. The restrictions on the PL material molecular formula and the particle size are the same as those described in the first and second embodiments, and are therefore omitted.

In summary, in the LED package structure of the present invention, the aforementioned PL material is used to replace the fluorescent layer and the prior art diffusion layer. Molecular formula of PL materials _{330, W m Mo n (Y,} Ce, Tb, Gd, Sc) 3 + t + u (Al, Ga, Tl, In, B) 5 + u + 2v (O, S, Se) _{12 + 2t + 3u + 3v + 3m + 3n} : represented by Ce ³⁺ , Tb ³⁺ , where 0 <t <5 and 0 <m, n, u, v <15. The PL material is not only excited by the light emitted from the aforementioned LED chip, but also scatters the light. Thus, the light emitted from the LED chip and the light excited by the PL material are more evenly mixed to achieve a better light injection effect.

  It will be apparent to those skilled in the art that various modifications and variations can be made to the structure of the present invention without departing from the scope or spirit of the invention. In view of the foregoing, the specification and examples should be considered exemplary only, with the true scope and spirit of the invention being indicated by the appended claims and equivalents thereof.

  The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification. The drawings show specific examples of the present invention together with the description, and explain the principle of the present invention.

It is the schematic of the conventional white LED package structure. FIG. 6 is a schematic view of another conventional white LED package structure. 1 is a schematic view of a white LED package structure according to a first embodiment of the present invention. It is a schematic diagram showing PL material. It is a schematic diagram showing PL material. FIG. 6 is a schematic diagram illustrating an alternative PL material. FIG. 6 is a schematic diagram illustrating an alternative PL material. It is a schematic diagram of a white LED package structure according to a second embodiment of the present invention. It is a schematic diagram of a white LED package structure according to a second embodiment of the present invention. It is the schematic of the cold cathode fluorescent lamp by the 3rd Example of this invention.

Explanation of symbols

100 Package lead pin 102 Chip 104 Material of inner capsule 106 Material of outer capsule 108 Wire 110 Additional diffusion layer 200 Carrier 200 ′ Package lead pin 202 First lead pin 204 Second lead pin 206 Carrier pad 208 Chip holding cell 209a, 209b Wire 210 Chip 212 Electrode 220 Capsule Material 222 Inner Capsule Material 224 Outer Capsule Material 230 PL Material Layer 230a Fluorescent Material 230b Diffusion Material 230c Transient Phase 300 Carrier 302 Connection Pad 304 Chip Holding Cell 310 Chip 312 Electrode 314 Wire 320 Capsule Material 322 Inner Capsule Material Material 324 Material of external capsule 330 PL material 400 Cold cathode fluorescent lamp 410 Light tube 20 PL material 430 electrode set

Claims (21)

A carrier,
An LED chip suitable for emitting light arranged on the carrier;
A capsule material for encapsulating the LED chip on the carrier;
A glittering material distributed within the material of the capsule, wherein the glittering material is adapted to be excited by the light emitted from the LED chip and to scatter the light. Light emitting diode (LED) package structure.   2. The LED package structure according to claim 1, wherein the carrier is a printed circuit board (PCB), and the LED chip is electrically connected to the PCB.   The LED package structure of claim 2, wherein a chip holding cell is on the PCB suitable for holding the LED chip.   The LED package structure according to claim 1, wherein the carrier is a package frame electrically connected to the LED chip.   5. The LED package structure according to claim 4, further comprising two solder wires electrically connected between the LED chip and the package frame.   The LED package structure according to claim 1, wherein the LED chip is a blue LED chip. The capsule material is
A material of an inner capsule in which the glittering material for encapsulating the LED chip is distributed;
The LED package structure according to claim 1, further comprising: an inner capsule material and an outer capsule material for encapsulating a part of the carrier. Molecular formula of the luster material is, 0 <t <5 and 0 <m, n, u, v <15 _{When, W m Mo n (Y,} Ce, Tb, Gd, Sc) 3 + t + u (Al , Ga, Tl, In, B) _{5 + u + 2v} (O, S, Se) _{12 + 2t + 3u + 3v + 3m + 3n} : represented by Ce ³⁺ , Tb ³⁺ Item 2. The LED package structure according to Item 1. 0 <t <5 and 0 <m, n, when u, v of <15), the molecular formula _{W m Mo n (Y, Ce} , Tb, Gd, Sc) 3 + t + u (Al, Ga, Tl, In, B) _{5 + u + 2v} (O, S, Se) _{12 + 2t + 3u + 3v + 3m} : The glittering material represented by Ce ³⁺ , Tb ³⁺ is a mixture, The LED package structure according to claim 8. 0 <t <5 and 0 <m, n, u, v <15 When the molecular formula _{W m Mo n (Y, Ce} , Tb, Gd, Sc) 3 + t + u (Al, Ga, Tl, In , B) _{5 + u + 2v} (O, S, Se) _{12 + 2t + 3u + 3v + 3m + 3n} : the glittering material represented by Ce ³⁺ , Tb ³⁺ is a sintered product The LED package structure according to claim 8.   The LED package structure according to claim 1, wherein the glittering material has a maximum particle size smaller than 30 microns and an average particle size smaller than 10 microns.   The LED package structure according to claim 1, wherein the glittering material includes a phosphor and a diffusion material that adheres to the phosphor.   The LED package structure according to claim 12, wherein the particle size of the phosphor is smaller than 25 microns. A light tube,
A discharge gas filling the light tube;
A glittering material applied to the inner wall of the light tube;
A cold cathode fluorescent lamp, comprising: an anode disposed at one end of the light tube; and an electrode set including a cathode disposed at the other end. The molecular formula of the luster material is, 0 <t <5 and 0 <m, n, u, v <15 _{When, W m Mo n (Y,} Ce, Tb, Gd, Sc) 3 + t + u ( Al, Ga, Tl, In, B) _{5 + u + 2v} (O, S, Se) _{12 + 2t + 3u + 3v + 3m + 3n} : represented by Ce ³⁺ , Tb ³⁺ The cold cathode fluorescent lamp according to claim 14. 0 <t <5 and 0 <m, n, u, v <15 When the molecular formula _{W m Mo n (Y, Ce} , Tb, Gd, Sc) 3 + t + u (Al, Ga, Tl, In , B) _{5 + u + 2v} (O, S, Se) _{12 + 2t + 3u + 3v + 3m + 3n} : The glittering material represented by Ce ³⁺ , Tb ³⁺ is a mixture The cold cathode fluorescent lamp according to claim 15. 0 <t <5 and 0 <m, n, u, v <15 When the molecular formula _{W m Mo n (Y, Ce} , Tb, Gd, Sc) 3 + t + u (Al, Ga, Tl, In , B) _{5 + u + 2v} (O, S, Se) _{12 + 2t + 3u + 3v + 3m + 3n} : the glittering material represented by Ce ³⁺ , Tb ³⁺ is a sintered product The cold cathode fluorescent lamp according to claim 15.   The cold-cathode fluorescent lamp according to claim 14, wherein the glittering material includes a phosphor and a diffusion material that adheres to the phosphor. 0 <t <5 and 0 <m, n, u, v <15 When the molecular formula _{W m Mo n (Y, Ce} , Tb, Gd, Sc) 3 + t + u (Al, Ga, Tl, In, B) _{5 + u + 2v} (O, S, Se) _{12 + 2t + 3u + 3v + 3m + 3n} : A glittering material represented by Ce ³⁺ , Tb ³⁺ . 0 <t <5 and 0 <m, n, u, v <15 When the molecular formula _{W m Mo n (Y, Ce} , Tb, Gd, Sc) 3 + t + u (Al, Ga, Tl, In , B) _{5 + u + 2v} (O, S, Se) _{12 + 2t + 3u + 3v + 3m + 3n} : The glittering material according to claim 19 represented by Ce ³⁺ , Tb ³⁺ is a mixture A glittering material characterized in that 0 <t <5 and 0 <m, n, u, v <15 When the molecular formula _{W m Mo n (Y, Ce} , Tb, Gd, Sc) 3 + t + u (Al, Ga, Tl, In , B) _{5 + u + 2v} (O, S, Se) _{12 + 2t + 3u + 3v + 3m + 3n} : Ce ³⁺ , Tb ³⁺ A glittering material characterized by being a lignite.

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