JP2007019401A - Resin-sealed substrate and manufacturing method thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To improve the heat radiation of a surface-mounted component and a bare chip, while dispensing with the process for attaching again a heat radiating member to them. <P>SOLUTION: A lead frame 2 has holes 21. On the lead frame 2, a bare chip 31 and a surface-mounted component 32 are disposed and are connected with the lead frame 2. A heat radiator 1 for radiating heat from the lead frame 2 is so provided as to avoid the holes 21. The heat radiator 1, the bare chip 31, the surface-mounted component 32, and the lead frame 2 are so packed with a resin 5 as to seal them. However, since the resin 5 has openings 51 for exposing the holes 21 to the external, components 41-43 to be subjected to insertions can be connected additionally with the lead frame 2 wherewith the bare chip 31 or the surface-mounted component 32 has been connected already. In addition to this, when connecting with the lead frame 2 the component 41-43 to be subjected to insertions, the lead frame 2 and the heat radiator 1 have been sealed already with the resin 5. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a technique for sealing a lead frame on which surface-mounted components and bare chips are mounted using a resin.

  There has been proposed a resin-encapsulated substrate in which surface-mounted components and bare chips are mounted on a lead frame, and these are integrally molded with resin. The resin sealing board is provided with an insertion hole for inserting an insertion part having a lead wire and connected to the lead frame. However, the heat generated in the surface mount component and bare chip is not sufficient only by the release through the resin. Therefore, it is desirable to provide a heat radiator separately.

JP 2003-347509 A JP 2003-243562 A

  However, if the radiator is attached separately, the number of processes increases. SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to improve the heat radiation of a surface mount component and a bare chip while omitting a process of attaching a heat radiating member again. Still another object is to improve the moisture resistance and insulation performance of the lead wire of the insertion part.

  A first aspect of the resin-encapsulated substrate according to the present invention includes a conductive lead frame (2) having a hole (21), a bare chip (31) disposed on the lead frame, and a surface mount component (32). And the heat dissipating part, the lead frame, the bare chip or the heat dissipating part (1) for dissipating the lead frame, and the opening (51) for exposing the hole. And a resin (5) for wrapping the surface mount component.

  A second aspect of the resin-encapsulated substrate according to the present invention is the first aspect of the resin-encapsulated substrate, wherein the resin is interposed between the lead frame (2) and the heat dissipation portion (1). The resin is insulative.

The third aspect of the resin sealing substrate according to the present invention is the first aspect of the resin sealing substrate,
An insulating layer (6) interposed between the lead frame (2) and the heat dissipation part (1) is further provided.

  The 4th aspect of the resin sealing substrate concerning this invention is the 1st thru | or 3rd aspect of the resin sealing board, Comprising: The said thermal radiation part (1) is the thermal radiation which covers the thermal radiation pipe (11) and the said thermal radiation pipe It has a jacket (12).

  The 5th aspect of the resin sealing substrate concerning this invention is the 1st thru | or 3rd aspect of the resin sealing substrate, Comprising: The said thermal radiation part (1) is comprised with a thermal radiation pipe (11).

  1st aspect of the manufacturing method of the resin sealing substrate concerning this invention has the following process (a)-(c): With respect to the electroconductive lead frame (2) which has a process (a) hole (21) A step of disposing at least one of a bare chip (31) and a surface mount component (32) on the lead frame; (b) disposing the heat dissipating part (1) in the vicinity of the lead frame avoiding the hole; Step (c) A step of sealing the heat radiating portion, the lead frame, the bare chip or the surface mount component with a resin (5) having an opening (51) exposing the hole.

  A second aspect of the method for producing a resin-encapsulated substrate according to the present invention is the first aspect of the method for producing a resin-encapsulated substrate, wherein the resin has an insulating property, and in the step (c), Resin is interposed between the lead frame (2) and the heat dissipating part (1).

  A third aspect of the method for producing a resin-encapsulated substrate according to the present invention is the first aspect of the method for producing a resin-encapsulated substrate, wherein the lead frame (2) is arranged with the heat dissipating part (1). An insulating layer (6) is provided on the surface to be processed.

  According to a sixth aspect of the resin-encapsulated substrate of the present invention, there is provided a conductive lead frame (2), components (31, 32) connected to the lead frame, and connection locations between the components and the lead frame. The lead frame and the resin (5) for sealing the component are provided while having the avoided refrigerant flow path (13).

  A seventh aspect of the resin sealing substrate according to the present invention is the sixth aspect of the resin sealing substrate, wherein the component includes an insertion component (41, 42, 43) having a lead wire (40), The lead frame (2) has a hole (21) into which the lead wire is inserted, and at least an end of the hole (21) is closed by the resin (5).

  A fourth aspect of the method for producing a resin-encapsulated substrate according to the present invention includes the following steps (a) to (b): Step (a) On a conductive lead frame (2) having a hole (21) A step of connecting at least one of the bare chip (31) and the surface-mounted component (32); (b) a refrigerant flow path (a position where the bare chip or the surface-mounted component and the lead frame are connected and the hole is avoided) 13) and a step of sealing the lead frame and the bare chip or the surface-mounted component with a resin (5) having an opening (51) exposing the hole (21).

  A fifth aspect of the method for producing a resin-encapsulated substrate according to the present invention is the first to fourth aspects of the method for producing a resin-encapsulated substrate, and (d) through the opening (51). The method further includes the step of inserting the lead wire (40) of the insertion part (41, 42, 43) into the hole (21) and connecting the insertion part to the lead frame.

  A sixth aspect of the method for producing a resin-encapsulated substrate according to the present invention includes the following steps (a) to (b): (a) a bare chip on a conductive lead frame (2) having a hole (21). (31) a step of connecting at least one of the surface mount component (32); (b) inserting the lead wire (40) of the insert component (41, 42, 43) into the hole, and A step of connecting an insertion part to the lead frame; (c) a resin (5) having a refrigerant channel (13) avoiding the hole, and a connection point between the bare chip or the surface mount part and the lead frame; And sealing the lead frame and the bare chip or the surface-mounted component and the hole.

  A sixth aspect of the method for producing a resin-encapsulated substrate according to the present invention includes the following steps (a) to (e): (a) a bare chip on a conductive lead frame (2) having a hole (21). (31) Arranging at least one of the surface mount component (32); (b) a first resin having an opening (51) that exposes the hole in the surface mount component and the lead frame; 53) sealing step; (c) inserting the lead wire (40) of the insertion part (41, 42, 43) into the hole through the opening and connecting the insertion part to the lead frame. (D) disposing the heat dissipating part (1) in the vicinity of the lead frame; (e) the heat dissipating part and the lead frame sealed with the first resin and the bare chip or the surface mount component. And the opening to the second Step of sealing with fat (54).

  According to the first aspect of the resin-encapsulated substrate according to the present invention, the lead wire of the insert component is inserted into the hole through the opening, and added to the lead frame on which the surface mount component has already been arranged. Parts can be connected. In addition, since the lead frame and the heat radiating portion are already sealed with resin when the insertion part is connected, the step of attaching the heat radiating member again can be omitted.

  According to the second aspect of the resin-encapsulated substrate according to the present invention, the lead frame and the heat dissipating part are insulated with resin, so that the heat dissipating part has a metal with good heat dissipation without causing a short circuit in the lead frame. Can be adopted.

  According to the third aspect of the resin-encapsulated substrate of the present invention, by insulating the lead frame and the heat dissipating part with the insulating layer, the heat dissipating part has good heat dissipation without causing a short circuit in the lead frame. Metal can be employed. Further, when sealing with resin, it is not necessary to keep the lead frame and the heat radiating part apart, and the process is easy.

  According to the 4th aspect of the resin sealing board | substrate concerning this invention, since a thermal radiation jacket can be provided in a wide range, it is easy to radiate widely.

  According to the 5th aspect of the resin sealing board | substrate concerning this invention, material cost can be reduced compared with the case where a thermal radiation jacket is provided. In addition, the degree of freedom of the position of the hole, and hence the position of the insertion part is improved.

  According to the 1st aspect of the manufacturing method of the resin sealing substrate concerning this invention, the 1st thru | or 4th aspect of the resin sealing substrate can be manufactured. In particular, when the lead frame and the heat radiating portion are sealed with resin, the hole is exposed through the opening. Thereby, a lead wire can be inserted in a hole through the said opening, and the insertion component which has the said lead wire can be connected later. In that case, it is not necessary to attach a heat radiating member anew.

  According to the second aspect of the method for manufacturing a resin-encapsulated substrate according to the present invention, it is not necessary to separately provide a step for obtaining insulation between the heat radiation portion and the lead frame.

  According to the third aspect of the method for manufacturing a resin-encapsulated substrate according to the present invention, when sealing with resin in the step (c), it is not necessary to keep the lead frame and the heat radiating portion apart, and the process is easy. It is.

  According to the sixth aspect of the resin-encapsulated substrate of the present invention, since no heat radiating member is required, the material cost can be reduced when realizing heat dissipation of the lead frame. In addition, the degree of freedom of the position of the parts is improved.

  According to the seventh aspect of the resin-encapsulated substrate of the present invention, the moisture resistance and insulation of the lead wire of the insertion part are facilitated.

  According to the 4th aspect of the manufacturing method of the resin sealing substrate concerning this invention, the 6th aspect of the resin sealing substrate can be manufactured.

  According to the fifth aspect of the method for manufacturing a resin-encapsulated substrate according to the present invention, since the insert component can be connected later, the flexibility of the insert component is high.

  According to the 6th aspect of the manufacturing method of the resin sealing substrate concerning this invention, the 7th aspect of the resin sealing substrate can be manufactured. In particular, when the lead frame and the heat radiating portion are sealed with resin, at least the end portion of the hole is closed, so that moisture resistance and insulation of the lead wire of the insertion part are facilitated.

  According to the seventh aspect of the method for manufacturing a resin-encapsulated substrate according to the present invention, since the hole is closed at least at the end thereof, moisture prevention and insulation of the lead wire of the insertion part are facilitated. Moreover, the degree of freedom of selection of the insertion part can be obtained in the step (c) in the middle.

First embodiment.
FIG. 1 is a cross-sectional view showing a resin sealing substrate according to a first embodiment of the present invention and a structure in which insertion parts 41, 42, 43 are inserted therein.

  The conductive lead frame 2 has a hole 21, and a bare chip 31 and a surface mounting component 32 are arranged on the lead frame 2 and connected thereto. Both the bare chip 31 and the surface mount component 32 do not need to be connected to the lead frame 2, and at least one of them may be connected. A heat radiating portion 1 for radiating heat from the lead frame 2 is provided to avoid the hole 21.

  The heat dissipating part 1, the bare chip 31, the surface mount component 32, and the lead frame 2 are wrapped with resin 5 and sealed. However, the resin 5 has an opening 51 through which the hole 21 is exposed.

  The heat radiator 1 has a heat radiating pipe 11 and a heat radiating jacket 12. For example, the heat radiating pipe may have a form in which the refrigerant circulates to the outside at the end portion 11 d, or may have a form in which the end portion 11 d is closed and the refrigerant circulates in the heat radiating pipe 11.

  Thereafter, the lead wires 40 of the insertion parts 41 to 43 are inserted into the holes 21 through the openings 51. As a result, the insertion components 41 to 43 can be connected to the lead frame 2 to which the bare chip 31 or the surface mounting component 32 has already been connected. In addition, since the lead frame 2 and the heat radiating portion 1 are already sealed with the resin 5 when the insertion parts 41 to 43 are connected, the step of attaching the heat radiating member again can be omitted.

  In the present embodiment, a resin 5 is interposed between the lead frame 2 and the heat radiating portion 1. Usually, since the sealing resin 5 is insulative, the lead frame 2 and the heat radiating portion 1 are insulated by the resin 5. Therefore, a metal with good heat dissipation can be used for the heat radiating part 1 without causing a short circuit in the lead frame 2.

  Since the heat radiating section 1 is provided with not only the heat radiating pipe 11 but also the heat radiating jacket 12 and can be disposed over a wide range, it is easy to radiate heat widely.

  2 to 5 are cross-sectional views showing the method of manufacturing the resin-encapsulated substrate according to this embodiment in the order of steps. With reference to FIG. 2, a conductive lead frame 2 having holes 21 is prepared. Referring to FIG. 3, bare chip 31 and surface mount component 32 are arranged on lead frame 2 and connected.

  Referring to FIG. 4, heat radiating portion 1 is arranged in the vicinity of lead frame 2 avoiding hole 21. Referring to FIG. 5, heat radiating portion 1, lead frame 2, bare chip 31, and surface mount component 32 are sealed with resin 5. However, the resin 5 has an opening 51 through which the hole 21 is exposed.

  Thereafter, the lead wires 40 of the insertion components 41 to 43 are inserted into the holes 21 through the openings 51, and the insertion components 41 to 43 are connected to the lead frame 2. Thereby, the structure shown in FIG. 1 can be obtained. Thus, the freedom degree about selection of the insertion parts 41-43 is raised by connecting the insertion parts 41-43 later.

  As described above, the resin-encapsulated substrate according to the present embodiment can be manufactured. In particular, when the lead frame 2 and the heat radiating portion 1 are sealed with the resin 5, the hole 21 is exposed through the opening 51. Thereby, the lead wire 40 can be inserted into the hole 21 through the opening 51, and the insertion components 41 to 43 can be connected later. In that case, it is not necessary to attach a heat radiating member anew.

  Normally, the sealing resin 5 has an insulating property, and the lead frame 2 and the heat radiating portion 1 are arranged with the resin 5 interposed therebetween, so that the space between the heat radiating portion 1 and the lead frame 2 is between them. There is no need to provide a separate process for obtaining insulation.

Second embodiment.
FIG. 6 is a cross-sectional view showing a resin sealing substrate according to a second embodiment of the present invention and a structure in which insertion components 41 to 43 are inserted therein. Unlike the first embodiment, the second embodiment differs from the first embodiment in that the lead frame 2 and the heat radiating portion 1 are arranged with an insulating layer 6 interposed therebetween.

  Such a structure has an advantage in the manufacturing process. That is, when the heat radiating portion 1 and the lead frame 2 are sealed with the resin 5, it is not necessary to keep the lead frame 2 and the heat radiating portion 1 apart. This can hold the lead frame 2, the insulating layer 6, and the heat dissipation part 1 together, facilitating the manufacturing process. For example, the lead frame 2 has an insulating layer 6 on the surface where the heat dissipating part is disposed.

Third embodiment.
FIG. 7 is a cross-sectional view showing a resin-sealed substrate according to a third embodiment of the present invention and a structure in which insertion components 41 to 43 are inserted therein. Since the lead wire 40 of the insertion component 41 is hidden with respect to the resin 5 without appearing in the cross section, it is indicated by a broken line. The lead wires 40 of the insertion parts 42 and 43 appear in the cross section.

  Also in the present embodiment, as in the first embodiment, at least one of the bare chip 31 and the surface mount component 32 is arranged and connected on the lead frame 2.

  In the present embodiment, only the heat radiating pipe 11 is provided as a heat radiating portion. The heat radiating pipe 11 is disposed in the vicinity of the lead frame 2 avoiding the hole 21. FIG. 7 shows a cross section in which the opening 51 appears, and neither the resin 5 nor the heat radiating pipe 11 appears at this position. However, since these are hidden with respect to the cross section, they are indicated by broken lines. The heat radiating pipe 11 is bent and laid to the back side of the drawing.

  The resin 5 encloses and seals the heat radiating pipe 11, the bare chip 31, the surface mount component 32, and the lead frame 2. However, the resin 5 has an opening 51 through which the hole 21 is exposed.

  Thus, by disposing only the heat radiating pipe 11 without providing the heat radiating jacket, the material cost can be reduced as compared with the case where the heat radiating jacket is provided. Further, since the heat radiating pipe 11 can be bent and laid, the degree of freedom of the position of the hole 21, and hence the positions of the insertion parts 41 to 43, is improved.

  In the third embodiment, similar to the second embodiment, the case where the lead frame 2 and the heat radiating pipe 11 are disposed with the insulating layer 6 interposed therebetween is illustrated. However, as in the first embodiment, the resin 5 may be interposed between the lead frame 2 and the heat radiating pipe 11 without providing the insulating layer 6.

  The configuration shown in FIG. 7 can also be manufactured in the same manner as the method for manufacturing the resin-encapsulated substrate shown in FIGS. Of course, thereafter, the lead wires 40 of the insertion parts 41 to 43 can be inserted into the holes 21 through the openings 51 in the holes 21 of the resin-encapsulated substrate, and the insertion parts 41 to 43 can be connected to the lead frame 2. .

  In addition, as FIG. 7 shows, you may protect mechanically the vicinity of the lead wire 40 of the insertion components 41-43 by providing the resin 5 with the recessed part 52 connected to the opening 51. FIG.

Fourth embodiment.
FIG. 8: is sectional drawing which shows the structure which inserted the resin sealing board | substrate concerning the 4th Embodiment of this invention, and the insertion components 41-43 in this.

  In the present embodiment, a refrigerant flow path 13 is provided in place of the heat radiating pipe 11 used in the third embodiment. The refrigerant channel 13 has the resin 5. For example, the refrigerant flow path 13 can be regarded as a concave portion of the resin 5.

  The refrigerant flow path 13 avoids at least a connection portion between the bare chip 31 or the surface mount component 32 and the lead frame 2 and maintains insulation between the connection portion. Such avoidance can be dealt with by bending as in the case of the heat radiating pipe 11 according to the position of the component. The resin 5 wraps the lead frame 2, the bare chip 31, and the surface mount component 32 while having such a refrigerant flow path 13.

  Therefore, similar to the third embodiment, the degree of freedom of the positions of the bare chip 31 and the surface mount component 32 is improved. Further, since no heat radiating member is required, the material cost can be reduced when the heat dissipation of the lead frame 2 is realized.

  Of course, the lead frame 2 may have a hole 21 for inserting the insertion parts 41 to 43. However, in order to obtain insulation, the refrigerant flow path 13 is provided avoiding the hole 21. FIG. 8 shows a cross section in which the opening 51 appears, and neither the resin 5 nor the refrigerant flow path 13 appears at this position. However, since these are hidden with respect to the cross section, they are indicated by broken lines.

  FIG. 8 illustrates a case where a part of the refrigerant flow path 13 is bent and laid to the back side of the drawing. An end portion 11d appears on the left side, and an end portion 11e appears on the right side, and these function as an inflow end or an outflow end of the refrigerant.

  In the present embodiment, as shown in FIG. 8, the hole 21 may be exposed by the opening 51 of the resin 5, but the end of the hole 21 is blocked by the resin 5 without providing the opening 51. Also good.

  For example, a case where the bare chip 31 and the surface mount component 32 are provided on the lead frame 2 and then the insert components 41 to 43 are sealed with the resin 5 before being connected to the lead frame 2 will be described. In this case, the lead frame 2, the bare chip 31, and the surface mount component 32 are sealed with the resin 5 having the flow path 13 arranged so as to avoid the hole 21. At that time, the opening 51 is also provided in the resin 5 so that the end of the hole 21 is not blocked by the resin 5. This is because the insertion parts 41 to 43 need to be inserted into the lead frame 2 and connected to the hole 21 thereafter.

  On the other hand, it is also possible to place the bare chip 31 and the surface mount component 32 on the lead frame 2 and insert the lead wires 40 of the insertion components 41 to 43 into the holes 21 and connect them to the lead frame 2. is there. The state connected in this way is illustrated as a cross-sectional view in FIG. After that, while providing the coolant channel 13 that avoids the connection portion between the bare chip 31 and the surface mount component 32 and the lead frame 2 and the hole 21, the lead frame 2, the bare chip 31, the surface mount component 32, and the hole 42 are made of resin. 5, at least the end of the hole 21 is sealed without providing the opening 51.

  Sealing at least the end of the hole 21 with the resin in this manner is desirable from the viewpoint of moisture proofing and insulation of the insertion parts 41 to 43.

Fifth embodiment.
10 to 12 are cross-sectional views showing a method of manufacturing a resin-encapsulated substrate according to the fifth embodiment of the present invention in the order of steps.

  Referring to FIG. 10, at least one of bare chip 31 and surface mount component 32 is disposed on conductive lead frame 2 having hole 21. Then, the bare chip 31, the surface mount component 32, and the lead frame 2 are sealed with a first resin 53 having an opening 51 that exposes the hole 21.

  Referring to FIG. 11, the lead wires 40 of the insertion parts 41 to 43 are inserted into the holes 21 through the openings 51, and these are connected to the lead frame 2. When forming the 1st resin 53, you may protect mechanically the vicinity of the lead wire 40 of the insertion components 41-43 by providing the recessed part 52 connected with the opening 51. FIG.

  Thereafter, the heat dissipating part 1 is disposed in the vicinity of the lead frame 2. Then, referring to FIG. 12, lead frame 2 and bare chip 31 and surface mount component 32 sealed with first resin 53, and heat radiating portion 1 are sealed with second resin 54. At this time, the opening 51 is also sealed. For example, the recess 52 is also filled with the second resin 54 at least near the bottom.

  As a result, at least the end of the hole 21 is blocked, so that moisture proofing and insulation of the lead wires 40 of the insertion parts 41 to 43 are facilitated. And the freedom degree of selection of the insertion components 41-43 is obtained in the process in the middle.

It is sectional drawing which shows the resin sealing board | substrate and insertion component concerning the 1st Embodiment of this invention. It is sectional drawing which shows the manufacturing method of the resin sealing substrate concerning the 1st Embodiment of this invention in order of a process. It is sectional drawing which shows the manufacturing method of the resin sealing substrate concerning the 1st Embodiment of this invention in order of a process. It is sectional drawing which shows the manufacturing method of the resin sealing substrate concerning the 1st Embodiment of this invention in order of a process. It is sectional drawing which shows the manufacturing method of the resin sealing substrate concerning the 1st Embodiment of this invention in order of a process. It is sectional drawing which shows the resin sealing board | substrate and insertion component concerning the 2nd Embodiment of this invention. It is sectional drawing which shows the resin sealing board | substrate and insertion component concerning the 3rd Embodiment of this invention. It is sectional drawing which shows the resin sealing board | substrate and insert component concerning the 4th Embodiment of this invention. It is sectional drawing which shows the deformation | transformation of the 4th Embodiment of this invention. It is sectional drawing which shows the manufacturing method of the resin sealing substrate concerning the 5th Embodiment of this invention in process order. It is sectional drawing which shows the manufacturing method of the resin sealing substrate concerning the 5th Embodiment of this invention in process order. It is sectional drawing which shows the manufacturing method of the resin sealing substrate concerning the 5th Embodiment of this invention in process order.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Radiator 11 Radiation pipe 12 Radiation jacket 2 Lead frame 21 Hole 31 Bare chip 32 Surface mount component 40 Lead wire 41-43 Insertion part 5,53,54 Resin 51 Opening

Claims (14)

A conductive lead frame (2) having a hole (21);
At least one of a bare chip (31) and a surface mount component (32) disposed on the lead frame;
A heat dissipating part (1) provided to avoid the hole and dissipating heat from the lead frame;
A resin-encapsulated substrate comprising an opening (51) that exposes the hole and a resin (5) that encloses the heat dissipation part, the lead frame, the bare chip, or the surface-mounted component. The resin is interposed between the lead frame (2) and the heat dissipating part (1),
The resin-sealed substrate according to claim 1, wherein the resin has an insulating property. Insulating layer (6) interposed between the lead frame (2) and the heat dissipating part (1)
The resin-sealed substrate according to claim 1, further comprising:   The said thermal radiation part (1) is a resin sealing board | substrate as described in any one of Claim 1 thru | or 3 which has a thermal radiation pipe (11) and the thermal radiation jacket (12) which covers the said thermal radiation pipe.   The resin-sealed substrate according to any one of claims 1 to 3, wherein the heat dissipating part (1) includes a heat dissipating pipe (11). (A) A step of disposing at least one of a bare chip (31) and a surface mount component (32) on the lead frame with respect to the conductive lead frame (2) having a hole (21);
(B) arranging the heat dissipating part (1) in the vicinity of the lead frame avoiding the hole;
(C) manufacturing a resin-encapsulated substrate comprising: sealing the heat-radiating part, the lead frame, the bare chip, or the surface-mounted component with a resin (5) having an opening (51) that exposes the hole. Method.   The method of manufacturing a resin-encapsulated substrate according to claim 6, wherein the resin has an insulating property, and the resin is interposed between the lead frame (2) and the heat radiating portion (1) in the step (c).   The said lead frame (2) is a manufacturing method of the resin sealing board | substrate of Claim 6 which has an insulating layer (6) in the surface by which the said thermal radiation part (1) is arrange | positioned. A conductive lead frame (2);
Resin (5) that seals the lead frame and the components while having the components (31, 32) connected to the lead frame and the refrigerant flow path (13) that avoids the connection point between the components and the lead frame. And a resin-encapsulated substrate. The part includes an insertion part (41, 42, 43) having a lead wire (40),
The lead frame (2) has a hole (21) into which the lead wire is inserted,
The resin-sealed substrate according to claim 9, wherein at least an end of the hole (21) is closed by the resin (5). (A) connecting at least one of a bare chip (31) and a surface mount component (32) on a conductive lead frame (2) having a hole (21);
(B) Resin (5) having a connection portion between the bare chip or the surface mount component and the lead frame, a coolant channel (13) avoiding the hole, and an opening (51) exposing the hole (21) A method for manufacturing a resin-encapsulated substrate, comprising: sealing the lead frame and the bare chip or the surface-mounted component. (D) Inserting the lead wire (40) of the insertion part (41, 42, 43) into the hole (21) through the opening (51) and connecting the insertion part to the lead frame. The method for producing a resin-encapsulated substrate according to any one of claims 6 to 8 and 11, further comprising: (A) connecting at least one of a bare chip (31) and a surface mount component (32) on a conductive lead frame (2) having a hole (21);
(B) inserting the lead wire (40) of the insertion part (41, 42, 43) into the hole and connecting the insertion part to the lead frame;
(C) The lead frame and the bare chip or the surface mount in the resin (5) having a coolant flow path (13) that avoids the hole and a connection portion between the bare chip or the surface mount component and the lead frame. A method for manufacturing a resin-encapsulated substrate, comprising: sealing a component and the hole. (A) disposing at least one of a bare chip (31) and a surface mount component (32) on a conductive lead frame (2) having a hole (21);
(B) sealing the surface mount component and the lead frame with a first resin (53) having an opening (51) exposing the hole;
(C) inserting the lead wire (40) of the insertion part (41, 42, 43) into the hole through the opening and connecting the insertion part to the lead frame;
(D) arranging the heat dissipating part (1) in the vicinity of the lead frame;
(E) sealing the lead frame and the bare chip or the surface-mounted component sealed with the first resin with the first resin and the opening with a second resin (54). And manufacturing method of resin-encapsulated substrate.

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