JP2007017896A - Exposure apparatus and method for reducing contamination - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an exposure apparatus that can suppress degradation in exposure performance, and a method for reducing contamination. <P>SOLUTION: The exposure apparatus is equipped with: a spatial optical modulator having a large number of pixels two-dimensionally arranged and individually modulating the irradiating light; a light source to irradiate the spatial optical modulator with light; and an imaging optical system which includes a microlens array 54 comprising arrayed microlenses 60 condensing light from the respective pixels of the spatial optical modulator, and which directly projects an image by the light modulated by the spatial optical modulator onto an exposure surface through the microlens array 54. In this exposure apparatus, an electrode pad 55 is disposed on the surface of the microlens array 54 opposing to a photosensitive material 12, as a reducing means to reduce contamination of the microlens array 54, and a negative voltage is applied on the pad to attract positively charged suspended substances 59. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an exposure apparatus and a contamination reduction method, and more particularly, to an exposure apparatus and a contamination reduction method that perform scanning exposure using a multi-beam emitted from a spatial light modulation element installed in an exposure head.

  2. Description of the Related Art Conventionally, there has been known an image exposure apparatus that passes light modulated by a spatial light modulation element through an imaging optical system, forms an image of this light on a predetermined photosensitive material, and exposes the photosensitive material. This type of image exposure apparatus basically includes a spatial light modulation element in which a large number of pixel units that modulate irradiated light according to a control signal are two-dimensionally arranged, and the spatial light modulation element. A light source for irradiating light and an imaging optical system for forming an image of light modulated by the spatial light modulation element on a photosensitive material are provided.

  In this type of image exposure apparatus, as the spatial light modulation element, for example, an LCD (liquid crystal display element), a DMD (digital micromirror device), or the like can be suitably used. The DMD is a mirror device in which a number of rectangular micromirrors that change the angle of the reflecting surface in accordance with a control signal are two-dimensionally arranged on a semiconductor substrate such as silicon.

  In the image exposure apparatus as described above, there is often a demand for enlarging an image projected on a photosensitive material, and in that case, an enlarged imaging optical system is used as an imaging optical system. In doing so, simply passing the light that has passed through the spatial light modulation element through the magnification imaging optical system expands the luminous flux from each pixel portion of the spatial light modulation element, and the pixel size in the projected image is reduced. The image becomes larger and the sharpness of the image decreases.

  Therefore, the first imaging optical system is arranged on the optical path of the light modulated by the spatial light modulation element, and the microscopic surface corresponding to each pixel portion of the spatial light modulation element is formed on the imaging surface by the imaging optical system. A microlens array in which lenses are arranged in an array is arranged, and in the optical path of the light that has passed through the microlens array, a second connection that forms an image of the modulated light on a photosensitive material or a screen. It is considered that an image optical system is arranged and an image is enlarged and projected by the first and second imaging optical systems. In this configuration, the size of the image projected on the photosensitive material and the screen is enlarged, while the light from each pixel portion of the spatial light modulator is condensed by each microlens of the microlens array. Since the pixel size (spot size) in the image is reduced and kept small, the sharpness of the image can be kept high.

Patent Document 1 shows an example of an image exposure apparatus using a DMD as a spatial light modulation element and combining it with a microlens array.
JP 2001-305663 A

  In an image exposure apparatus combining a DMD and a microlens array, the second imaging optical system is omitted to increase exposure accuracy, and light that has passed through the microlens array is directly exposed to an exposed surface such as a photosensitive material. An apparatus has been proposed.

  However, in the case where the light passing through the microlens array is directly exposed to the photosensitive material as described above, since the microlens array and the photosensitive material are in close proximity, contaminants (for example, an organic polymer) from the photosensitive material side are formed. And the like) may adhere to the microlens array, which may reduce the amount of light exposed to the photosensitive material and degrade the exposure performance.

  In view of the above-described problems, an object of the present invention is to provide an exposure apparatus and a contamination mitigation method that can suppress deterioration of exposure performance.

  An exposure apparatus according to claim 1 of the present invention irradiates light to a spatial light modulation element in which a large number of pixel portions that respectively modulate the irradiated light are two-dimensionally arranged, and the spatial light modulation element. A light source and a microlens array in which microlenses for condensing light from each pixel portion of the spatial light modulator are arranged in an array, and an image of the light modulated by the spatial light modulator is An exposure apparatus comprising an imaging optical system that forms an image directly on an exposed surface by a microlens array, characterized by comprising a mitigation means for reducing contamination of the microlens array.

  The spatial modulation element is a two-dimensional array of a large number of pixel units that modulate light emitted from a light source, and the imaging optical system collects light from each pixel unit of the spatial light modulation element. The microlens array is configured to include an array of microlenses, and an image of light modulated by the spatial light modulator is directly formed on the surface to be exposed by the microlens array.

  In such an exposure apparatus, since the surface to be exposed is directly exposed with light from the microlens array, the microlens array and the surface to be exposed are close to each other. For this reason, contaminants from the exposed surface side may adhere to the microlens array, thereby reducing the amount of light exposed to the exposed surface and degrading the exposure performance. Contamination of the microlens array can be reduced. Therefore, deterioration of exposure performance can be suppressed and deterioration of image quality can be prevented.

  Specifically, for example, as described in claim 2, the mitigation unit is provided on at least a part of the surface of the microlens array on the exposed surface side other than the region through which the light passes. It can be set as the structure containing the provided electrode and the voltage application means which applies a predetermined voltage to the said electrode.

  With this configuration, dust charged to a polarity opposite to the polarity of the voltage applied to the electrode can be attached to the electrode provided in the microlens array, and contamination of the microlens array can be reduced. it can.

  According to a third aspect of the present invention, the mitigating means is a surface on the exposed surface side of a holding substrate that holds the microlens array on an exposure head on which the microlens array is mounted, and the light It is good also as a structure containing the electrode provided in the at least one part area | region other than the area | region through which this passes, and the voltage application means which applies a predetermined voltage to the said electrode.

  With this configuration, dust charged to a polarity opposite to the polarity of the voltage applied to the electrode can be attached to the electrode provided on the holding substrate, and contamination of the microlens array can be reduced. .

  According to a fourth aspect of the present invention, the mitigating means includes a holding substrate that holds the microlens array on an exposure head on which the microlens array is mounted, the holding substrate having a ventilation port, and the holding substrate. It is good also as a structure containing the ventilation means which controls at least one of the intake and exhaust_gas | exhaustion from a ventilation opening.

  With this configuration, the moving path of suspended matter or the like between the exposure head and the exposed surface can be controlled by sucking air into the exposure head from the air vent or exhausting it from the exposure head. Contamination of the lens array can be reduced. Note that the air sucked from the ventilation port is preferably exhausted to the outside of the exposure head.

  According to a fifth aspect of the present invention, an electrostatic adsorption filter is provided on at least a part of the surface of the holding substrate on the exposed surface side, the region through which the light passes and the region other than the ventilation port. Furthermore, it is good also as a structure provided.

  By configuring in this way, floating matter or the like between the exposure head and the surface to be exposed can be sucked into the exposure head from the air vent, and the floating matter can be attached to the electrostatic adsorption filter. Can be effectively reduced.

  The invention according to claim 6 is characterized in that the spatial modulation element is a DMD.

  Thereby, deterioration of the exposure performance with respect to the exposure beam modulated by DMD (digital micromirror device) can be suppressed.

  Thus, in the present invention, the mitigation means can be constituted by various means for controlling the movement path so that the contaminant does not move toward the microlens. The electrode may be provided in the vicinity of the microlens array.

  The contamination mitigation method according to claim 7, wherein a spatial light modulation element in which a large number of pixel units each modulating irradiated light are arranged two-dimensionally, a light source that irradiates light to the spatial light modulation element, A microlens array in which microlenses for condensing light from each pixel portion of the spatial light modulator are arranged in an array, and an image of the light modulated by the spatial light modulator is displayed in the microlens array In the contamination reduction method executed in the exposure apparatus provided with an imaging optical system that forms an image directly on the exposure surface, the processing for reducing the contamination of the microlens array is performed.

  According to the present invention, contamination of the microlens array can be reduced.

  According to an eighth aspect of the present invention, the process of reducing contamination of the microlens array is performed on at least a part of the surface of the microlens array on the exposed surface side other than the region through which the light passes. It is the process which applies a predetermined voltage to the provided electrode.

  According to the present invention, dust charged to a polarity opposite to the polarity of the voltage applied to the electrode can be attached to the electrode provided in the microlens array, and contamination of the microlens array can be reduced.

  According to a ninth aspect of the present invention, the process for reducing the contamination of the microlens array is a surface on the exposed surface side of a holding substrate that holds the microlens array on an exposure head on which the microlens array is mounted. And a process of applying a predetermined voltage to the electrodes provided in at least a part of the region other than the region through which the light passes.

  According to the present invention, dust charged to a polarity opposite to the polarity of the voltage applied to the electrode can be attached to the electrode provided on the holding substrate, and contamination of the microlens array can be reduced.

  The invention described in claim 10 is characterized in that the process of reducing contamination of the microlens array is a process of controlling a movement path of contaminants that contaminate the microlens array.

  For example, as described in claim 11, the process of controlling the movement path of the contaminant is a ventilation port provided in a holding substrate that holds the microlens array in an exposure head on which the microlens array is mounted. The process can control at least one of intake air and exhaust air.

  According to the present invention, the microlens array can control the moving path of floating substances between the exposure head and the surface to be exposed by sucking air into the exposure head from the air vent or exhausting it from the exposure head. Can be less contaminated.

  According to the exposure apparatus of the present invention, there is an effect that deterioration of exposure performance can be suppressed.

  A first embodiment of the present invention will be described with reference to the drawings.

(Configuration of exposure apparatus)
As shown in FIG. 1, an exposure apparatus 10 configured as a multi-beam exposure apparatus according to the first embodiment of the present invention is configured as a so-called flatbed type, and is a photosensitive member that is an exposure target to be exposed. A flat plate-like stage 14 that holds the material 12 on the surface is provided. Two guides 20 extending along the stage moving direction are installed on the upper surface of the thick plate-shaped installation base 18 supported by the four legs 16. The stage 14 is arranged so that the longitudinal direction thereof faces the stage moving direction, and is supported by the guide 20 so as to be reciprocally movable. The exposure apparatus 10 is provided with a drive device (not shown) for driving the stage 14 along the guide 20.

  A gate-type gate 22 is provided at the center of the installation table 18 so as to straddle the movement path of the stage 14. Each of the end portions of the gate 22 is fixed to both side surfaces of the installation base 18. A scanner 24 is provided on one side of the gate 22, and a plurality of (for example, two) detection sensors 26 for detecting the front and rear ends of the photosensitive material 12 are provided on the other side. The scanner 24 and the detection sensor 26 are respectively attached to the gate 22 and fixedly arranged above the moving path of the stage 14. The scanner 24 and the detection sensor 26 are connected to a controller 28 as control means for controlling them.

  Inside the scanner 24, as shown in FIG. 2, a plurality (nine in FIG. 2) arranged in an approximate matrix of m rows and n columns (first row 5 columns, second row 4 columns in FIG. 2). The exposure head 30 is installed.

  The exposure area 32 by the exposure head 30 is configured in, for example, a rectangular shape having a short side in the scanning direction. In this case, a strip-shaped exposed region 34 is formed for each exposure head 30 in the photosensitive material 12 in accordance with the scanning exposure moving operation.

  In addition, as shown in FIG. 2, the exposure heads 30 in each row arranged in a line are arranged at a predetermined interval (in the arrangement direction) so that the strip-shaped exposed regions 34 are arranged without gaps in the direction orthogonal to the scanning direction. The exposure area is shifted by a natural number times the long side). For this reason, for example, a portion that cannot be exposed between the exposure area 32 of the first row and the first column and the exposure area 32 of the first row and the second column can be exposed by the exposure area 32 of the second row and the first column. .

  As shown in FIG. 5, each exposure head 30 has a digital micromirror device (DMD) 36 as a spatial light modulation element that modulates an incident light beam for each pixel in accordance with image data. It has. The DMD 36 is connected to a controller (control means) 28 having data processing means and mirror drive control means.

  The data processing unit of the controller 28 generates a control signal for driving and controlling each micromirror in the region to be controlled by the DMD 36 for each exposure head 30 based on the input image data. Further, the mirror drive control means as the DMD controller controls the angle of the reflection surface of each micromirror in the DMD 36 for each exposure head 30 based on the control signal generated by the image data processing unit.

  As shown in FIG. 1, each exposure head 30 is led out from an illumination device 38, which is a light source unit that emits a multi-beam extending in one direction including an ultraviolet wavelength region as a laser beam. The bundled optical fiber 40 is connected. The illumination device 38 may be constituted by an ultraviolet lamp (UV lamp), a xenon lamp or the like that can be used as a general light source.

  Although not shown, the illuminating device 38 includes a plurality of multiplexing modules that multiplex laser beams emitted from a plurality of semiconductor laser chips and input them to the optical fiber. The optical fiber extending from each multiplexing module is a multiplexing optical fiber that propagates the combined laser beam, and a plurality of optical fibers are bundled into one to form a bundle-shaped optical fiber 40.

  Further, on the light incident side of the DMD 36 in each exposure head 30, as shown in FIG. 5, laser light (or an ultraviolet lamp (UV lamp), a xenon lamp, etc.) emitted from the connection end of the bundle-like optical fiber 40. A mirror 42 for reflecting the emitted light) toward the DMD 36 is disposed.

  As shown in FIG. 6, the DMD 36 is configured such that a micromirror 46 is supported on a SRAM cell (memory cell) 44 by a support (not shown), and a large number of pixels (pixels) are formed. (For example, 600 × 800) of micromirrors are arranged as a grid device. Each pixel is provided with a micromirror 46 supported by a support column at the top, and a material having high reflectance such as aluminum is deposited on the surface of the micromirror 46.

  A silicon gate CMOS SRAM cell 44 manufactured on a normal semiconductor memory manufacturing line is disposed directly below the micromirror 46 via a post including a hinge and a yoke (not shown). (Integrated type).

  When a digital signal is written in the SRAM cell 44 of the DMD 36, the micromirror 46 supported by the support is tilted in a range of ± α degrees (for example, ± 10 degrees) with respect to the substrate side on which the DMD 36 is disposed with the diagonal line as the center. It is done. FIG. 7A shows a state in which the micromirror 46 is tilted to + α degrees in the on state, and FIG. 7B shows a state in which the micromirror 46 is tilted to −α degrees in the off state. Therefore, by controlling the inclination of the micro mirror 46 in each pixel of the DMD 36 as shown in FIG. 6 according to the image signal, the light incident on the DMD 36 is reflected in the inclination direction of each micro mirror 46. .

  FIG. 6 shows an example of a state in which a part of the DMD 36 is enlarged and the micromirror 46 is controlled to + α degrees or −α degrees. The on / off control of each micromirror 46 is performed by the controller 28 connected to the DMD 36. For example, the light reflected by the on-state micromirror 46 is modulated into an exposure state, and the light of the DMD 36 The light enters the projection optical system (see FIG. 5) provided on the exit side. The light reflected by the micromirror 46 in the off state is modulated into a non-exposure state and is incident on a light absorber (not shown). That is, the DMD 36 enters an exposure beam generated by modulation corresponding to an image to be exposed and formed into the projection optical system.

  Further, it is preferable that the DMD 36 is disposed slightly inclined so that the short side direction forms a predetermined angle θ (for example, 0.1 ° to 0.5 °) with the scanning direction. 8A shows the scanning trajectory of the reflected light image (exposure beam) 48 by each micromirror when the DMD 36 is not tilted, and FIG. 8B shows the scanning trajectory of the exposure beam 48 when the DMD 36 is tilted. Show.

In the DMD 36, a number of micromirror arrays in which a large number (for example, 800) of micromirrors 46 are arranged along the longitudinal direction (row direction) are arranged in a short direction (for example, 600 sets). as shown in FIG. 8 (B), by inclining the DMD 36, the pitch P of the scanning lines when the pitch P ₂ is not tilted the DMD 36 of the scanning locus of the exposure beam 48 by the micromirrors 46 (scanning line) Narrower than _{1 and} can greatly improve the resolution. On the other hand, since the tilt angle of the DMD 36 is very small, the scan width W ₂ when the DMD 36 is tilted and the scan width W ₁ when the DMD 36 is not tilted are substantially the same.

  Further, substantially the same position (dot) on the same scanning line is overlapped and exposed (multiple exposure) by different micromirror rows. In this way, by performing multiple exposure, it is possible to control a minute amount of the exposure position and to realize high-definition exposure. Further, the joints between the plurality of exposure heads arranged in the scanning direction can be connected without any step by controlling a very small amount of exposure position.

  Note that the same effect can be obtained by arranging the micromirror rows in a staggered manner at a predetermined interval in the direction orthogonal to the scanning direction instead of inclining the DMD 36.

  Next, a projection optical system (imaging optical system) provided on the light reflection side of the DMD 36 in the exposure head 30 will be described. As shown in FIG. 5, the projection optical system provided on the light reflection side of the DMD 36 in each exposure head 30 projects a light source image onto the photosensitive material 12 at the position of the exposure surface corresponding to the light reflection side of the DMD 36. Optical members for exposure of the lens systems 50 and 52 and the microlens array 54 are arranged in order from the DMD 36 toward the photosensitive material 12.

  Here, the lens systems 50 and 52 are configured as magnifying optical systems, and the exposure area 32 by the light beam reflected by the DMD 36 on the photosensitive material 12 is enlarged by enlarging the cross-sectional area of the light beam reflected by the DMD 36. The area is expanded to the required size.

  As shown in FIG. 5, in the microlens array 54, a plurality of microlenses 60 corresponding to the respective micromirrors 46 of the DMD 36 that reflect the laser light irradiated from the illumination device 38 through the respective optical fibers 40 are integrated. Each microlens 60 is arranged on the optical axis of each laser beam transmitted through the lens systems 50 and 52, respectively. The microlens array 54 is formed in a rectangular flat plate shape. The photosensitive material 12 is disposed at the rear focal position (position of the exposure surface) of the microlens 60. Each lens system 50 and 52 in the projection optical system is shown as one lens in FIG. 5, but may be a combination of a plurality of lenses (for example, a convex lens and a concave lens).

  In the exposure head 30 configured as described above, since the photosensitive material 12 is directly exposed by the light condensed by each microlens 60 of the microlens array 54, the microlens array 54 and the photosensitive material 12 are exposed. The distance is short and very close. For this reason, contaminants (for example, an organic polymer) from the photosensitive material 12 side adhere to the microlens array 54, thereby reducing the amount of light exposed to the photosensitive material 12 and degrading the exposure performance. .

  Therefore, the exposure head 30 according to the present embodiment is provided with a contamination suppressing means for suppressing contamination of the microlens array 54 due to contaminants.

  Specifically, as shown in FIGS. 16A and 16B, an electrode pad 55 is provided on the surface of the microlens array 54 on the photosensitive material 12 side. The electrode pad 55 is provided in a portion where light of the microlens array 54 does not pass, that is, a region other than a region where the microlens 60 is formed.

  A DC power source 57 is connected to the electrode pad 55. The DC power source 57 applies a predetermined negative voltage to the electrode pad 55 in accordance with an instruction from the controller 28. As a result, as shown in FIG. 16B, the electrode pad 55 has a negative potential, and adsorbs a floating substance (contaminant) 59 having a positive charge near the microlens array 54. Thereby, it is possible to prevent the suspended matter 59 from adhering to the surface of the portion through which the light of the microlens array 54 passes. Therefore, the microlens array 54 can be made difficult to get dirty, and the image quality can be prevented from being deteriorated due to the deterioration of the exposure performance due to the reduction of the exposure amount. Note that the polarity of the electrode pad 55 may be changed according to the polarity of the suspended matter.

  Further, the exposure apparatus 10 is provided with light amount data measuring means for detecting the exposure amounts of a plurality of exposure beams emitted from the DMD 36 side.

  As shown in FIGS. 1 to 4, the exposure apparatus 10 has a light amount data measuring means on the upstream side in the transport direction of the stage 14 in a direction orthogonal to the scanning direction of the exposure beam irradiated from the DMD 36 (when scanning exposure is performed). The light amount data measuring device 70 for measuring the light amount distribution and the exposure amount with respect to the scanning direction may be mounted. The light amount data measuring device 70 includes a light amount data measuring device 72 and a feed operation mechanism 74 that supports the light amount data measuring device 72 so as to be movable in a direction orthogonal to the scanning direction.

  The light quantity data measuring device 72 has a slit plate (opening plate) 78 disposed on the upper surface of a rectangular box-shaped housing 76. The slit plate 78 is formed with a slit 80 (for example, an opening having a width of 1 millimeter and a length of 20 millimeters) that is a through groove having a predetermined shape.

  Further, as shown in FIG. 4, the light quantity data measuring device 72 is collected at a position directly below the opening of the slit plate 78 on the optical path of the light beam incident from the slit 80 (opening) of the slit plate 78 inside the housing 76. The optical lens 82 is disposed, the optical wavelength filter 84 is disposed directly below the condenser lens 82 as necessary, and the light receiving element 86 is disposed directly below the optical wavelength filter 84. The optical wavelength filter 84 may be disposed at any location on the optical path between the DMD 36 and the light receiving element 86.

  The light receiving element 86 can be constituted by a two-dimensional photodetector such as a commercially available PD (photodiode) or CCD (Charged Coupled Device) that is widely used in general. Further, the optical wavelength filter 84 is used to match the spectral sensitivity characteristic of the photosensitive material 12 or to match the optical wavelength characteristic of the light beam emitted from the illumination device 38 serving as a light source.

  In the light quantity data measuring device 72 configured in this way, the light beam that has passed through the slit 80 enters the condenser lens 82, enters the optical wavelength filter 84 on the optical path collected by the condenser lens 82, and is predetermined. The light beam having the wavelength passes through the optical wavelength filter 84 and is collected and received on the light receiving element 86. The light receiving element 86 is configured to transmit a measured value of the received light amount to the controller 28.

  This light quantity data measuring device 72 is in a state in which the surface of the slit plate (opening plate) 78 coincides with the exposure surface position of the photosensitive material 12 placed on the stage 14 (the same as the exposure surface position of the photosensitive material 12). To be arranged). As described above, when the slit plate (opening plate) 78 of the light quantity data measuring device 72 is arranged so as to coincide with the exposure surface position of the photosensitive material 12, the state of the actual exposure processing on the photosensitive material 12 is almost the same. In an approximate state that does not change, it is possible to measure the light amount data related to the light amount distribution and the exposure amount with respect to the direction orthogonal to the scanning direction in the exposure beam irradiated from the DMD 36 side.

  As shown in FIG. 3, the feed operation mechanism 74 that supports the light quantity data measuring device 72 configured in this manner so as to be movable in a direction orthogonal to the scanning direction is arranged along the transport direction (scanning direction) on the stage 14. A pair of guide rails 88 and 90 and a feed mechanism 92 are provided between support plates 94 and 96 fixed so as to protrude from both ends of the upstream edge portion.

  In the pair of guide rails 88 and 90, the surface of the slit plate 78 coincides with the position of the exposure surface, and the light quantity data measuring device 72 has a slit (opening) 80 formed in the slit plate 78. The light quantity data measuring device 72 is mounted so as to be slidable in parallel in a state where the longitudinal direction is oriented in a direction orthogonal to the scanning direction.

  The feed mechanism 92 can be constituted by, for example, a screw feed mechanism. By controlling the rotational drive of the screw shaft by the feed motor 98, the light quantity data measurement in which the driven screw component screwed into the screw shaft is fixed. The device 72 is configured so that it can be precisely fed by a required feed amount in a direction orthogonal to the scanning direction, or can be fed at a constant and accurate feed speed. The feeding mechanism 92 may be constituted by other generally used precision feeding means.

  Further, a beam position detecting means for detecting the position of each beam irradiated by the exposure head 30 is arranged on the downstream side in the transport direction of the stage 14.

  As shown in FIGS. 1 and 12, the beam position detection means includes a slit plate 71 integrally attached to the downstream edge along the conveying direction (scanning direction) of the stage 14, and the slit plate 71. On the back side, there is a photo sensor 73 installed corresponding to each slit.

  This slit plate 71 forms a light-shielding thin chrome film (chrome mask, emulsion mask) on a rectangular long plate-like quartz glass plate having the entire length in the width direction of the stage 14, and a plurality of predetermined positions of this chrome film. In addition, etching is performed on the chromium film of the “<” shape that opens in the X-axis direction so that each laser beam can pass through (for example, the slit is patterned by masking the chromium film and the slit portion of the chromium film is etched with an etching solution). The slit 75 for detection formed by removing by the process of eluting is formed.

  The slit plate 71 configured as described above is made of quartz glass, so that an error due to a temperature change is not likely to occur, and the beam position can be detected with high accuracy by using a light shielding thin chrome film.

  As shown in FIG. 13, the “<”-shaped detection slit 75 has a linear first slit portion 75 a having a predetermined length positioned on the upstream side in the transport direction and a predetermined position positioned on the downstream side in the transport direction. A straight second slit portion 75b having a length is formed in a shape in which each end portion is connected at a right angle. That is, the first slit portion 75a and the second slit portion 75b are orthogonal to each other, and the first slit portion 75a has an angle of 135 degrees and the second slit portion 75b has an angle of 45 degrees with respect to the Y axis (running direction). Configure to have. In the present embodiment, the scanning direction is taken as the Y axis, and the direction orthogonal to this (the arrangement direction of the exposure heads 30) is taken as the X axis.

  Although the first slit portion 75a and the second slit portion 75b in the detection slit 75 are formed so as to form an angle of 45 degrees with respect to the scanning direction, the first slit portion 75a If the second slit portion 75b is inclined with respect to the pixel arrangement of the exposure head 30 and at the same time inclined with respect to the scanning direction, that is, the stage moving direction (a state in which they are not parallel to each other), scanning is performed. You may set the angle with respect to a direction arbitrarily. A diffraction grating may be used instead of the detection slit 75.

  A photosensor 73 (which may be a CCD, a CMOS, a photodetector, or the like) that detects light from the exposure head 30 is disposed at each predetermined position directly below each detection slit 75.

  Next, the detection of the beam position using the detection slit 75 will be specifically described.

  First, in the exposure apparatus 10, means for specifying the position actually irradiated on the exposure surface when one specific pixel Z1 that is a pixel to be measured is turned on using the detection slit 75 will be described. To do.

  In this case, the controller 28 moves the stage 14 to position the predetermined detection slit 75 for the predetermined exposure head 30 of the slit plate 71 below the exposure head unit.

  Next, the controller 28 performs control so that only the specific pixel Z1 in the predetermined DMD 36 is turned on (lighted state).

  Furthermore, the controller 28 controls the movement of the stage 14 so that the detection slit 75 becomes a required position on the exposure area 32 (for example, a position to be the origin) as shown by a solid line in FIG. Move. At this time, the controller 28 recognizes the intersection of the first slit portion 75a and the second slit portion 75b as (X0, Y0) and stores it in the memory. In FIG. 15A, the direction that rotates counterclockwise from the Y-axis is a positive angle.

  Next, as shown in FIG. 15A, the controller 28 controls the movement of the stage 14 to start moving the detection slit 75 rightward along the Y axis toward FIG. 15A. Let Then, as illustrated in FIG. 15B, the controller 28 causes the light from the lit specific pixel Z1 to pass through the first slit at the position indicated by the imaginary line on the right side in FIG. 15A. The stage 14 is stopped when it is detected by the photosensor 73 that has passed through the part 75a. The controller 28 recognizes the intersection of the first slit portion 75a and the second slit portion 75b at this time as (X0, Y11) and stores it in the memory.

  Next, the controller 28 operates the stage 14 to start moving the detection slit 75 to the left along the Y axis toward FIG. Then, the controller 28 detects the light from the specific pixel Z1 that is lit as illustrated in FIG. 15B at the position indicated by the left imaginary line toward FIG. When it is detected that the light is transmitted through 75a and detected by the photosensor 73, the stage 14 is stopped. The controller 28 recognizes the intersection of the first slit portion 75a and the second slit portion 75b at this time as (X0, Y12) and stores it in the memory.

  Next, the controller 28 reads out the coordinates (X0, Y11) and (X0, Y12) stored in the memory, obtains the coordinates of the specific pixel Z1, and performs an operation according to the following formula to identify the actual position. . Here, if the coordinates of the specific pixel Z1 are (X1, Y1), X1 = X0 + (Y11−Y12) / 2 and Y1 = (Y11 + Y12) / 2.

  In the case where the detection slit 75 having the second slit portion 75b intersecting with the first slit portion 75a and the photosensor 73 are used in combination as described above, the photosensor 73 is connected to the first slit portion 75a or the first slit portion 75a. Only a predetermined range of light passing through the second slit portion 75b is detected. Therefore, the photosensor 73 can be a commercially available inexpensive one without using a fine and special configuration for detecting the light amount in a narrow range corresponding to the first slit portion 75a or the second slit portion 75b.

  Next, in this exposure apparatus 10, the optical magnification in the X-axis direction and the Y-axis direction in the exposure area (entire exposure area) 32 in which an image can be projected on the exposure surface by one exposure head 30, the exposure head 30 (exposure area). ), And means for detecting information relating to the position of the exposure point, such as the amount of movement in the X-axis direction and Y-axis direction from the reference position of the exposure head 30.

  In order to detect information related to the exposure point position of the exposure area 32 as the entire exposure area, the exposure apparatus 10 has a plurality of exposure areas 32 in the present embodiment, as shown in FIG. The detection slit 75 is configured to detect the position at the same time.

  For this reason, in the exposure area 32 by one exposure head 30, a plurality of pixels to be measured that are dispersed and scattered on the average in the exposure area to be measured are set. In this embodiment, five sets of pixels to be measured are set. The plurality of pixels to be measured are set at target positions with respect to the center of the exposure area 32. In the exposure area 32 shown in FIG. 13, two sets are set symmetrically with respect to a set of pixels to be measured Zc1, Zc2, and Zc3 (one set of three pixels to be measured here) arranged at the center position in the longitudinal direction. A pair of pixels to be measured Za1, Za2, Za3, Zb1, Zb2, and Zb3 and a Zd1, Zd2, Zd3, Ze1, Ze2, and Ze3 pairs are set.

  As shown in FIG. 13, the slit plate 71 is provided with five detection slits 75A, 74B, 74C, 74D, and 74E at positions corresponding to the respective sets of pixels to be measured so that they can be detected.

  Further, in order to facilitate calculation when adjusting the processing error between the five detection slits 75A, 74B, 74C, 74D and 74E formed in the slit plate 71 in advance, the first slit portion 75a and the second slit portion The relationship of the relative coordinate position of the intersection with 75b is obtained. For example, in the slit plate 71 shown in FIG. 14, when the coordinates (X1, Y1) of the first detection slit 75A are used as the reference, the coordinates of the second detection slit 75B are (X1 + l1, Y1), The coordinates of the slit 75C are (X1 + l1 + l2, Y1), the coordinates of the fourth detection slit 75D are (X1 + l1 + l2 + l3, Y1 + m1), and the fifth detection slit 75E (X1 + l1 + l2 + l3 + l4, Y1).

  Next, when the controller 28 detects information related to the exposure point position in the exposure area 32 based on the above-described conditions, the controller 28 controls the DMD 36 so that a predetermined group of measured pixels (Za1, Za2,. (Za3, Zb1, Zb2, Zb3, Zc1, Zc2, Zc3, Zd1, Zd2, Zd3, Ze1, Ze2, Ze3) are turned on, and the stage 14 provided with the slit plate 71 is moved directly below each exposure head 30. For each of the pixels to be measured, coordinates are obtained using the corresponding detection slits 75A, 74B, 74C, 74D, and 74E. At that time, the predetermined group of pixels to be measured may be individually turned on, or all of them may be detected as being turned on.

  Next, a procedure for measuring the light amount of the exposure beam emitted from the DMD 36 using the light amount data measuring means provided in the exposure apparatus 10 will be described.

  When the light amount data measuring means measures the light amount distribution and the exposure amount in the exposure apparatus 10, the controller 28 controls the first column of the DMD 36 that is symmetric to the measurement in the exposure apparatus 10 (for example, toward FIG. 1). The operation of sequentially turning on each column from the first column (from the first column located on the initial position side of the light quantity data measuring device 72) to the left side, the direction orthogonal to the scanning direction of the DMD 36, is performed.

  Before starting the control of the DMD 36, the controller 28 turns on the micromirrors 46 in the first row of the DMD 36 (lights on) and turns off the other micromirrors 46 so that the exposure beam is irradiated. The feed operation mechanism 74 is driven and controlled so that the light quantity data measuring device 72 is moved to the initial position so that the central portion of the slit 80 corresponds to a predetermined position on the exposure surface. Note that the position information of the scanning region exposed in the first row in the predetermined DMD 36 can be obtained from each beam position detected by the beam position detecting means.

  When the controller 28 is ready by moving the light quantity data measuring device 72 to the initial position, the controller 28 starts the measurement process of the light quantity data, and only the first row of micromirrors 46 of the DMD 36 to be measured is turned on ( And the exposure amount of the scanning area corresponding to only the first row of micromirrors 46 is measured, and then only the second row of micromirrors 46 of the DMD 36 is turned on (lit). Let At the same time, the controller 28 drives and controls the feed operation mechanism 74 so that the scanning area on the exposure surface exposed by the micromirrors 46 in the second row of the DMD 36 is located at the central portion of the slit 80 to control the light amount. The data measuring device 72 is controlled to move. Then, the exposure amount of the scanning region corresponding to the second row of micromirrors 46 is measured.

  The controller 28 sequentially repeats the above-described series of control operations from the first row of micromirrors 46 to the last row of micromirrors 46, so that the light quantity distribution in one DMD 36 to be measured The exposure value is measured, and the measurement value of the light amount data is stored for performing shading adjustment and exposure amount adjustment for uniformizing the light amount distribution of the exposure beam emitted from the one DMD 36 that is the measurement target. .

  In this way, when the light quantity of a certain group of micromirrors 46 corresponding to the exposure scanning direction is measured using the slit 80, the DMD 36 of the exposure head 30 is turned on as shown in FIG. A plurality of predetermined exposure beams 48 emitted from the group of micromirrors 46 in one row pass through the central portion in the longitudinal direction of the slit 80, are collected by the condenser lens 82, and the exposure beams 48 that have passed through the optical wavelength filter 84 are obtained. The light is received by the light receiving element 86 and the amount of light is measured.

  At this time, the stray light emitted from the DMD 36 other than the one row of the micromirrors 46 in the on state is reflected by a plane portion other than the slit (opening) 80 of the slit plate 78. That is, the slit plate 78 blocks light (other exposure beam or stray light) that is not subject to measurement of light amount data. For this reason, stray light is not received by the light receiving element 86 as shown by a three-dot chain line in FIG.

  Therefore, when the measurement value of the light amount data is performed using the slit plate 78 provided with the slit 80 in this way, the influence of the stray light is eliminated, and the light is emitted from the micromirrors 46 in a predetermined row that is turned on. It is possible to measure the light amount data in the scanning area in accordance with the actual exposure state by the predetermined plurality of exposure beams.

  Further, when the light amount distribution of the DMD 36 changes in a smooth curve, instead of measuring with one row (one line) of micromirrors 46 in the DMD 36 being turned on, a predetermined number of rows (multiple lines) of micromirrors are measured. The mirror 46 group may be turned on at the same time so that all of these exposure beams pass through the slit 80, and light amount data related to the DMD 36 may be measured in the same manner as described above. Further, in such a case, a single row or a plurality of rows of micromirrors 46 are simultaneously turned on in a scattered state with a plurality of rows spaced apart, and all these exposure beams pass through the slits 80. In the same manner as described above, light amount data related to the DMD 36 may be measured. It should be noted that the width of the slit 80 may be configured to be adjustable according to the width of the exposure beam passing through the slit 80 on the optical path.

  At the same time, when measuring the light quantity data of the single-row or multiple-row micromirrors 46 group, the light quantity of each micromirror 46 from the first row to the last row is set to a single row or a plurality of rows. By measuring the data, each light amount data of each micromirror 46 in a predetermined row in a predetermined column or each light amount data in a plurality of groups of micromirrors 46 in a predetermined plurality of rows may be measured.

  Further, when measuring light amount data corresponding to each micromirror 46 in a predetermined row in a predetermined column, a through-hole through which only the light beam emitted from each micromirror 46 in the predetermined row in the predetermined column passes through the slit plate 78. The slit plate 78 may be measured by moving the slit plate 78 in the X and Y directions on the exposure surface shown in FIG. Alternatively, although not shown, a slit plate in which a slit in the direction orthogonal to the longitudinal direction of the slit 80 of the slit plate 78 is laid on the slit plate 78 so as to be movable, and a region where the slit 80 transmits the light beam is formed. You may comprise so that a change adjustment is possible.

  By measuring the amount of light on the exposed surface of the exposure beam emitted from the DMD 36 in this way, it is possible to determine whether or not the amount of contaminants has adhered to the microlens array 54 and the amount of light has decreased.

  In the above-described measurement, it is desirable to measure the slit 80 of the slit plate 78 by aligning the slit 80 in the direction in which the row of micromirrors 46 to be measured is directed. For example, when the longitudinal direction of the slit 80 is aligned with the scanning exposure direction, or the longitudinal direction of the slit 80 is aligned with the direction in which the DMD 36 is inclined (FIG. 8B), or when one pixel is subjected to multiple exposure with the inclined DMD 36 In addition, it is desirable that the longitudinal direction of the slit 80 is aligned with the direction of the row corresponding to the plurality of micromirrors 46 that multiple-expose one pixel.

  Further, as shown in FIG. 11, in the measurement of the light amount data using the slit 80, the width of the slit 80 is set, for example, by a predetermined plurality of exposure beams 48 irradiated from a group of micromirrors 46 to be measured. It is also possible to make the measurement so that the exposure beam 48 irradiated from the other micromirrors 46 in the DMD 36 is reflected by the slit plate 78 so that the light receiving element 86 does not receive light by setting it narrowly so that it can pass.

  Further, in this exposure apparatus 10, as shown in FIG. 10, for example, after the measurement of the light amount data for the DMD 36 at the upper left in the figure, the DMD 36 on the upper right side is measured in the figure, and all the upper stages are measured. When the measurement of the light amount data of the DMD 36 is finished, the stage 14 is moved and moved to the lower left DMD 36 toward the figure to measure the light amount data, and then moved to the lower right side toward the figure to move to the lower right side and all the lower stages are moved. The DMD 36 is operated to measure the light amount data.

(Exposure device operation)
Next, the basic operation of the exposure apparatus 10 configured as described above will be described.

  When the power of the exposure apparatus 10 is turned on, the controller 28 controls the DC power supply 57 so that a negative predetermined voltage is applied. As a result, the electrode pad 55 provided on the microlens array 54 has a negative potential.

  In each exposure head 30 of the scanner 24, the illuminating device 38, which is a fiber array light source, condenses by collimating a laser beam such as ultraviolet light emitted in a divergent light state from each of the laser light emitting elements with a collimator lens. Condensed by the lens, incident from the incident end face of the core of the multimode optical fiber, propagated in the optical fiber, combined with one laser beam at the laser output unit, and coupled to the output end of the multimode optical fiber The light is emitted from the optical fiber 40.

  In the exposure apparatus 10, image data corresponding to the exposure pattern is input to the controller 28 connected to the DMD 36 and temporarily stored in a memory in the controller 28. This image data is data representing the density of each pixel constituting the image by binary values (whether or not dots are recorded).

  The stage 14 having the photosensitive material 12 adsorbed on the surface is moved at a constant speed from the upstream side to the downstream side in the transport direction along the guide 20 by a driving device (not shown). When the leading edge of the photosensitive material 12 is detected by the detection sensor 26 attached to the gate 22 as the stage 14 passes under the gate 22, the image data stored in the memory is sequentially read out for a plurality of lines. A control signal is generated for each exposure head 30 based on the image data read by the data processing unit (CPU).

  Then, the DMD 36 drive control unit of the controller 28 sets the micromirror of the spatial light modulator (DMD) 36 for each exposure head 30 based on the control signal in which the shading adjustment for uniformizing the light amount distribution and the exposure amount adjustment are performed. Each is on / off controlled.

  When the spatial light modulator (DMD) 36 is irradiated with laser light from the illumination device 38, the laser light reflected when the micromirrors of the DMD 36 are in the on state is reflected by the corresponding microlenses 60 of the microlens array 54. An image is formed on the exposed surface of the photosensitive material 12. In this manner, the laser light emitted from the illumination device 38 is turned on / off for each pixel, and the photosensitive material 12 is exposed in a pixel unit (exposure area) that is approximately the same number as the number of used pixels of the DMD 36.

  Further, when the photosensitive material 12 is moved at a constant speed together with the stage 14, the photosensitive material 12 is scanned in the direction opposite to the stage moving direction by the scanner 24, and a strip-shaped exposed region 34 is formed for each exposure head 30. As a result, an image with high exposure quality is formed.

  That is, an image is formed by irradiating the exposure surface of the photosensitive material 12 with an exposure beam generated by modulation corresponding to an image to be exposed and formed by the DMD 36.

  As described above, since the electrode pad 55 provided in the microlens array 54 has a negative potential, contaminants such as a positively charged floating substance existing in the vicinity thereof are adsorbed by the electrode pad 55. . For this reason, the microlens array 54 is less likely to become dirty, and a reduction in exposure amount due to contaminants can be prevented.

  When the scanning of the photosensitive material 12 by the scanner 24 is completed and the rear end of the photosensitive material 12 is detected by the detection sensor 26, the stage 14 is on the most upstream side in the transport direction along the guide 20 by a driving device (not shown). It returns to the origin, and is moved again along the guide 20 from the upstream side in the transport direction to the downstream side at a constant speed.

  The application of the predetermined voltage to the electrode pad 55 may always be performed while the power of the exposure apparatus 10 is turned on as described above. However, in this exposure apparatus 10, each exposure beam or a plurality of them are applied. The amount of light can be measured for each exposure beam, for example, when the amount of light is periodically measured for each exposure beam or for each of a plurality of exposure beams, and the measured value is equal to or less than a predetermined threshold value, the electrode A predetermined voltage may be applied to the pad 55. In this case, the threshold value is set to a value at which it is possible to determine that there is a possibility that the exposure performance is deteriorated and the image quality is deteriorated when the measured value is equal to or less than the measured value. That is, the deterioration state of the exposure performance is measured from the light amount of the exposure beam.

  In addition, the electrode pad 55 is not provided on the entire surface of the microlens array 54 other than the microlens 60. A divided electrode pad divided for each of a plurality of microlenses 60 (for example, each microlens 60 for one row) may be provided, and a predetermined voltage may be individually applied to each divided electrode pad. As a result, a predetermined voltage can be applied only to the divided electrode pads in the region where the amount of light is reduced, and fine control can be performed.

  In the exposure apparatus 10 according to the present embodiment, a DMD is used as a spatial light modulation element used in the exposure head 30. For example, a micro electro mechanical systems (SMEM) type spatial light modulation element (SLM) is used. ), A reflection grating type grating light valve element (GLV element, manufactured by Silicon Light Machine Co., Ltd.), which is configured by arranging a plurality of gratings in one direction, and details of the GLV element are disclosed in US Pat. No. 5,311,360. The optical element that modulates the transmitted light by the electro-optic effect (PLZT element), or a transmissive spatial modulation element such as a liquid crystal light shutter (FLC), etc. A spatial light modulation element can be used in place of the DMD.

  Note that MEMS is a general term for a microsystem in which micro-sized sensors, actuators, and control circuits are integrated by micromachining technology based on an IC manufacturing process.

  Next, a first modification of the contamination suppressing means will be described.

  As shown in FIG. 17A, the exposure head 30 according to the first modification has a configuration in which a holding substrate 30B for holding a microlens array 54 is fixed in a cylindrical housing 30A. Yes. An electrode pad 55 is provided on the surface of the holding substrate 30B on the photosensitive material 12 side, and a DC power source 57 is connected thereto.

  When a negative predetermined voltage is applied to the electrode pad 55 by the DC power source 57, the electrode pad 55 becomes a negative potential, and the floating substance 59 charged with a positive charge is adsorbed by the electrode pad 55. As a result, it is possible to prevent the suspended matter 59 from adhering to the microlens array 54 and to prevent the microlens array 54 from becoming dirty, and to prevent the exposure amount from decreasing. For this reason, it is possible to suppress deterioration in image quality due to a decrease in exposure performance.

  Next, a second modification of the contamination suppression unit will be described.

  As shown in FIG. 18A, the exposure head 30 according to the second modification has a configuration in which a plurality of ventilation openings 30C (six in FIG. 18A) are provided in the holding substrate 30B. As shown in FIG. 5B, a ventilation pipe 30D is provided in the vicinity of the ventilation opening 30C. An intake fan 30E is provided at the end of the ventilation pipe 30D opposite to the ventilation port 30C. The intake fan 30E is driven by an instruction from the controller 28. The ventilation pipe 30 </ b> D has a configuration that is taken out of the exposure head 30, for example, and the intake fan 30 </ b> E is provided outside the exposure head 30.

  In the exposure apparatus configured as described above, the controller 28 drives the intake fan 30E during operation of the apparatus. As a result, the suspended matter 59 present in the vicinity of the microlens array 54 is sucked and discharged to the outside of the exposure head 30 through the ventilation port 30C and the ventilation pipe 30D. As a result, it is possible to prevent the suspended matter 59 from adhering to the microlens array 54 and to prevent the microlens array 54 from becoming dirty, and to prevent the exposure amount from decreasing. For this reason, it is possible to suppress deterioration in image quality due to a decrease in exposure performance.

  Next, a third modification of the contamination suppression unit will be described.

  As shown in FIGS. 19A and 19B, the exposure head 30 according to the third modification has a configuration in which an electrostatic adsorption filter 61 is provided on the surface of the holding substrate 30B on the photosensitive material 12 side. . The rest of the configuration is the same as that of the exposure head shown in FIGS. 18 (A) and 18 (B).

  As the electrostatic adsorption filter 61, for example, an electret filter can be used. In this electret filter, the material fibers of the filter are converted into electrets, that is, they are thermally and electrically processed so that the electric polarization is maintained semi-permanently even when no electric field exists outside.

  In the present embodiment, as shown in FIG. 19B, the electrostatic adsorption filter 61 is negatively charged. For this reason, the suspended matter 59 existing in the vicinity of the microlens array 54 is adsorbed by the electrostatic adsorption filter 61 or sucked by the drive of the intake fan 30E and passes through the ventilation port 30C and the ventilation pipe 30D, and the exposure head 30. Or discharged outside. As a result, it is possible to prevent the suspended matter 59 from adhering to the microlens array 54 and to prevent the microlens array 54 from becoming dirty, and to prevent the exposure amount from decreasing. For this reason, it is possible to suppress deterioration in image quality due to a decrease in exposure performance. Further, the amount of floating material 59 scattered outside the exposure head 30 can be reduced.

  As shown in FIG. 36 (B), for example, an exhaust fan 30F is provided in place of the intake fan 30E at the end of the left ventilation pipe 30D on the opposite side to the ventilation port 30C side as shown in FIG. Also good. In this case, by operating the exhaust fan 30F, the air from the left ventilation pipe 30D in the figure is exhausted from the left ventilation port 30C to the photosensitive material 12 side, and floating air is generated by driving the intake fan 30E. 59 is sucked through the right vent 30C and the vent pipe 30D. In this way, the exhaust gas is exhausted from one of the vent holes 30C and sucked from the other vent hole 30C, thereby controlling the movement path of the contaminants and preventing the contaminants from adhering to the microlens array.

  Also, as shown in FIG. 37 (B), the exhaust fan 30F may be used. In this case, when at least one of these exhaust fans 30F is driven, the wind from the ventilation pipe 30D is exhausted from the ventilation opening 30C to the photosensitive material 12 side. Thereby, the movement path | route of a contaminant is controlled and it can prevent that a contaminant adheres to a microlens array.

  Note that the configuration combining the intake and exhaust shown in FIG. 36B and the configuration including only the exhaust shown in FIG. 37B can also be applied to the configuration shown in FIG.

(Second Embodiment)
Next, a second embodiment of the present invention will be described.

  As shown in FIG. 20, the exposure apparatus according to this embodiment includes a cleaning apparatus 100 for cleaning the microlens array 54 with UV (ultraviolet) light. This point is the exposure described in the first embodiment. Different from the device 10. Since other configurations are basically the same as those of the first embodiment, detailed description thereof is omitted.

  As shown in FIG. 20, the cleaning apparatus 100 has a cleaning unit 104 and a lamp on a stage 102 supported so as to be able to reciprocate in the stage movement direction (A direction in FIG. 20) on the guide 20 like the stage 14. A power supply 106 is provided. The stage 102 is driven by a driving device (not shown) controlled by the controller 28. Further, the cleaning unit 104 can be reciprocated in the vertical direction (in the direction of arrow B in the figure) in FIG.

  As shown in FIG. 21, the cleaning unit 104 includes excimer UV lamps 110 </ b> A and 110 </ b> B that emit excimer UV light (wavelength: 172 nm). The excimer UV lamps 110A and 110B are cylindrical lamps whose longitudinal direction is a direction orthogonal to the stage moving direction, as shown in FIG. Semi-cylindrical reflectors 112A and 112B are provided below the excimer UV lamps 110A and 110B so as to cover them. 21 and 22, the cleaning unit 104 has an internal structure.

  As shown in FIG. 22, the excimer UV lamps 110 </ b> A and 110 </ b> B are connected to a lamp lighting power source 106 controlled by the controller 28, and receive excimer UV light upon receiving power supply from the lamp lighting power source 106.

  By irradiating the excimer UV light to the microlens array 54, the organic matter adhering to the surface of the microlens array 54 is decomposed, vaporized and removed, so that the microlens array 54 can be cleaned in a non-contact manner.

  Further, as shown in FIG. 23, a circular opening 113 is provided on the upper surface of the housing of the cleaning unit 104 so as to correspond to the position of each exposure head 30. A cylindrical shield 114 is provided to cover a part of the side. When the microlens array 54 is cleaned, the cleaning unit 104 is moved upward by the vertical driving device 108 so that the lower part of the exposure head 30 is covered by the shield 114 as shown in FIG. Excimer UV light is irradiated to the microlens array 54 by the lamps 110A and 110B.

  Further, as shown in FIGS. 21 and 22, two sets of an ozone filter 116 and an exhaust fan 118 are provided on the bottom surface in the cleaning unit 104. The exhaust fan 118 is driven by the control of the controller 28 and exhausts the air in the cleaning unit 104 to the outside. At this time, since ozone generated in the cleaning unit 104 is absorbed by the ozone filter 116, it is possible to prevent the ozone from being dispersed to the outside.

  Further, as shown in FIG. 22, two openings 120 for supplying the mixed gas into the cleaning unit 104 are provided on the side surface of the housing of the cleaning unit 104. As shown, the supply pipe 122 is connected.

  A mixed gas temperature adjusting unit 124 is connected to the supply pipe 122, and a nitrogen / oxygen mixed adjusting unit 126 is connected to the mixed gas temperature adjusting unit 124.

  Nitrogen and oxygen are supplied from a nitrogen cylinder and an oxygen cylinder (not shown) to the nitrogen / oxygen mixture adjusting unit 126, and these are mixed at a predetermined ratio and supplied to the mixed gas temperature adjusting unit 124. In the mixed gas temperature adjusting unit 124, the mixed gas is adjusted so as to be in a predetermined appropriate temperature range and is supplied into the cleaning unit 104 via the supply pipe 122 in order to suppress the temperature rise of the microlens array 54 to be cleaned. Supply.

  The reason why the mixed gas is supplied into the cleaning unit 104 in this way is that excimer UV light is strongly attenuated by oxygen and the cleaning ability may be lowered. As in the present embodiment, by supplying a mixed gas mixed with nitrogen into the cleaning unit 104, the attenuation of the excimer UV light can be suppressed, and the deterioration of the cleaning capability can be suppressed.

  When the microlens array 54 is cleaned by the cleaning apparatus 100 configured as described above, the stage 14 is first retracted, and the stage 102 is moved so that each shield 114 is positioned directly below each exposure head 30. Then, the cleaning unit 104 is driven upward by the vertical drive device 108 so that the lower side of the exposure head 30 is covered by the shield 114.

  In this state, nitrogen and oxygen are mixed at a predetermined ratio and a mixed gas adjusted to a temperature within a predetermined temperature range is supplied into the cleaning unit 104 and the exhaust fan 118 is driven to air in the cleaning unit 104. Is discharged to the outside. Then, excimer UV light is irradiated to each microlens array 54 by the excimer UV lamps 110A and 110B. Thereby, the microlens array 54 can be cleaned satisfactorily. Since ozone in the cleaning unit 104 is absorbed by the ozone filter 116, it is prevented that ozone is dispersed outside.

  The microlens array 54 may be periodically cleaned. For example, the light amount of each microlens array 54 is measured by the light amount measuring unit described in the first embodiment, and the measured light amount is equal to or less than a predetermined value. This may be performed when the microlens array 54 is present. In this case, the predetermined value is set to such a value that it can be determined that there is a high risk that the exposure performance is reduced and the image quality is deteriorated when the light amount is less than or equal to this value.

  In the present embodiment, the plurality of microlens arrays 54 are cleaned with one excimer UV lamp, but an excimer UV lamp may be provided for each microlens array. In this case, each microlens array can be individually cleaned.

(Third embodiment)
Next, a third embodiment of the present invention will be described. In the present embodiment, the case where the photosensitive material 12 is a printed circuit board will be described.

  The configuration of the exposure apparatus is basically the same as that of the above embodiment, but in this embodiment, the slit 80 of the light quantity data measuring device 70 includes two types of slits having different widths. Although slits having different widths may be provided separately, a configuration in which the width of the slits can be made variable may be employed.

  In the present embodiment, deterioration of the beam quality due to microlens contamination or the like is monitored, and a micromirror 46 to be turned on among the plurality of micromirrors 46 forming one pixel of the image is assigned (mapped) based on the result. ) Will be described.

  In the exposure apparatus according to the present embodiment, for one pixel (minimum image) of the image, the mapping resolution is, for example, 100 to 1000 times as an area ratio, and 100 to 1000 micromirrors 46 are assigned to each pixel. However, when an ideal beam quality is obtained, the number of micromirrors 46 required per pixel is smaller than this, and there is some redundancy. Therefore, by performing mapping using this redundancy, even when the microlens is contaminated and its beam quality deteriorates, it is possible to suppress the deterioration of the overall exposure performance and prevent the deterioration of the image quality. .

  Further, for example, as shown in FIG. 26, the light quantity of the laser beam L guided to the substrate F through each micromirror 46 constituting the DMD 36 is reflected by each DMD 36 in the direction of the arrow x that is the arrangement direction of the exposure heads 30. And shading due to factors such as the optical system and the like. In such a shading state, as shown in FIG. 33, when an image is exposed and recorded on the substrate F using a laser beam L with a small combined light amount reflected by a plurality of micromirrors 46, there is a large combined light amount. In the case where an image is exposed and recorded on the substrate F using the laser beam L, the width W1 and the width W2 in the direction of the arrow x of the image are different if the threshold value at which the substrate F as a photosensitive material is exposed to a predetermined state is th. Will occur. Furthermore, the installation state of the exposure head 30 and the illumination device 38 that introduces the laser beam L into the exposure head 30 and the amount of light of the laser beam L vary with time. Further, as described above, the light amount of the laser beam L applied to the substrate F varies with time due to contamination of the microlens array 54 and the like.

  In the present embodiment, in consideration of the above-described variation factors, the number of micromirrors 46 used for forming one pixel on the substrate F is set and controlled using mask data, and the mask data is set at a desired time. 34, the width W1 in the arrow x direction of the image formed in consideration of the final peeling process of the substrate F is controlled so as to be constant regardless of the position, as shown in FIG.

  FIG. 24 is a functional block diagram of the controller 28 of the exposure apparatus 10 having a function for performing such control.

  The controller 28 includes an image data input unit 170 that inputs image data to be recorded on the substrate F, a frame memory 172 that stores the input two-dimensional image data, and image data stored in the frame memory 172. A resolution converter 174 that converts the resolution to a high resolution according to the size and arrangement of the micromirrors 46 of the DMD 36 constituting the exposure head 30, and output data that assigns the converted image data to the micromirrors 46 as output data. A calculation unit 176, an output data correction unit 178 that corrects output data according to mask data, and a DMD controller 142 that controls the DMD 36 according to the corrected output data.

  A test data memory 180 that stores test data is connected to the resolution conversion unit 174. The test data is data for exposing and recording a test pattern on the substrate F and creating mask data based on the test pattern.

  The output data correction unit 178 is connected to a mask data memory 182 that stores mask data. The mask data is data that designates the micromirror 46 that is always turned off, and is set by the mask data setting unit 186.

  The mask data setting unit 186 includes a light amount / line width table memory 187 for storing a data table indicating the relationship between the light amount change amount of the laser beam L and the line width change amount of the test pattern due to the light amount change, and the beam of the laser beam L. Based on the light quantity of the laser beam L detected by the beam diameter / line width table memory 189 storing the data table indicating the relationship between the diameter change amount and the line width change amount of the test pattern due to the beam diameter change, and the light quantity data measuring device 72. A light amount shading data calculation unit 188 for calculating light amount shading data, a light amount shading data memory 191 for storing light amount shading data calculated by the light amount shading data calculation unit 188, and a beam for calculating the beam diameter shading data of the laser beam L. Diameter shading And over data calculating unit 193 is connected.

  The beam diameter shading data calculation unit 193 calculates the beam diameter of the laser beam L and beam diameter shading data from the laser beam L detected by the photosensor 73 disposed on the stage 14. The beam diameter shading data calculated by the beam diameter shading data calculation unit 193 is stored in the beam diameter shading data memory 195. The beam diameter shading data stored in the beam diameter shading data memory 195 is supplied to the mask data setting unit 186.

  The controller 28 of this embodiment is basically configured as described above. Next, a mask data setting procedure will be described based on the flowchart shown in FIG.

  First, the stage 14 is moved to dispose the slit plate 71 and the photo sensor 73 below the exposure head 30, and then the exposure head 30 is driven to direct the laser beam L to the photo sensor 73 via the slit 75 of the slit plate 71. Irradiate (step S1).

  The photo sensor 73 moves the stage 14 in the direction of the arrow y, and when the laser beam L passes through one of the two slit pieces constituting the slit 75 and when the laser beam L passes through the other slit piece. The laser beam L is detected. The detection signal of the laser beam L is supplied to the beam diameter shading data calculation unit 193, and the beam diameter of the laser beam L is measured from this detection signal (step S2).

  As the stage 14 moves in the direction of arrow y, the beam diameter of the laser beam L from each micromirror 46 of the DMD 36 constituting the exposure head 30 is measured, and the distribution of these beam diameters in the direction of arrow x is beam diameter shading. Calculated as data (step S3). The calculated beam diameter shading data is stored in the beam diameter shading data memory 195 (step S4).

  Next, the stage 14 is moved, and the light amount data measuring device 72 is disposed below the exposure head 30. The light amount data measuring device 72 measures the light amount of the laser beam L output from the exposure head 30 while moving in the arrow x direction shown in FIG. 1, and supplies the light amount to the light amount shading data calculation unit 188 (step S5). The light amount shading data calculation unit 188 calculates the distribution of the measured light amount in the arrow x direction as light amount shading data (step S6). The calculated light amount shading data is stored in the light amount shading data memory 191 (step S7).

  On the other hand, the light amount shading data calculated by the light amount shading data calculation unit 188 is supplied to the mask data setting unit 186. The mask data setting unit 186 creates initial mask data for making the light amount E (x) of the laser beam L at each position x of the substrate F constant based on the supplied light amount shading data, and a mask data memory 182. (Step S8). The initial mask data includes, for example, some of the plurality of micromirrors 46 that form one pixel of the image at each position x of the substrate F so that the shading of the light amount shown in FIG. Is set as data to be fixed in the OFF state. In FIG. 27, the micromirror 46 set to the OFF state by the initial mask data is indicated by a black circle.

  After setting the initial mask data, the stage 14 is moved to place the substrate F under the exposure head 30, and the exposure head 30 is driven based on the test data (step S9).

  The resolution conversion unit 174 reads the test data from the test data memory 180, converts the test data into a resolution corresponding to each micromirror 46 constituting the DMD 36, and then supplies the test data to the output data calculation unit 176. The output data calculation unit 176 supplies the test data to the output data correction unit 178 as test output data that is an on / off signal of each micromirror 46. The output data correction unit 178 forcibly turns off the test output data of the micromirror 46 corresponding to the position of the initial mask data supplied from the mask data memory 182, and then outputs the test output data to the DMD controller 142.

  The DMD controller 142 irradiates the substrate F with the laser beam L from the illumination device 38 by controlling each micromirror 46 constituting the DMD 36 according to the test output data corrected by the initial mask data, thereby irradiating the substrate F with the test pattern. Exposure recording is performed (step S10). Since this test pattern is formed according to the test output data corrected by the initial mask data, it is a pattern in which the influence of the light amount shading of the laser beam L is eliminated.

  The substrate F on which the test pattern is exposed and recorded is subjected to a development process, an etching process, and a resist peeling process, thereby generating the substrate F on which the test pattern remains (step S11). For example, as shown in FIG. 28, this test pattern is a line pattern 90 having a large number of linear structures formed with a line width W (x) at each position x in the arrow x direction.

  Therefore, each line width W (x) of the line pattern 90 formed on the substrate F is measured (step S12), and each line width W (x) can be set to the minimum line width Wmin from the measurement result. A light amount correction amount ΔE (x) is calculated (step S13). FIG. 29 shows the relationship between each position x in the arrow x direction and the measured line width W (x). FIG. 30 shows the relationship between the light amount change amount ΔE of the laser beam L applied to the substrate F and the accompanying line width change amount ΔW. The relationship between the light amount change amount ΔE and the line width change amount ΔW is obtained in advance by experiments or the like and stored in the light amount / line width table memory 87. The light amount correction amount ΔE (x) is a light amount change that can obtain a line width change amount ΔW with the measured line width W (x) as the minimum line width Wmin using the relationship shown in FIGS. Calculated as an amount ΔE (see FIG. 31).

  The mask data setting unit 186 sets the mask data by adjusting the initial mask data set in step S8 based on the calculated light quantity correction amount ΔE (x) (step S14). In this case, the mask data is data that determines the micromirror 46 that is fixed to the OFF state among the plurality of micromirrors 46 that form one pixel of the image at each position x of the substrate F according to the light amount correction amount ΔE (x). Set as The set mask data is stored in the mask data memory 182 instead of the initial mask data.

The mask data includes, for example, a ratio of the light amount correction amount ΔE (x) to the light amount E (x) (see FIG. 7) when the output data is corrected using the initial mask data, and a plurality of pixels forming one pixel. Using the number N of micromirrors 46, the number n of micromirrors 46 to be fixed in the off state
n = N · ΔEi / Ei
And n micromirrors 46 out of N may be set in an off state.

  After setting the mask data as described above, exposure recording processing of a desired wiring pattern on the substrate F is performed (step S15).

  Therefore, image data relating to a desired wiring pattern is input from the image data input unit 170. The input image data is stored in the frame memory 172 and then supplied to the resolution conversion unit 174, converted to a resolution corresponding to the resolution of the DMD 36, and supplied to the output data calculation unit 176. The output data calculation unit 176 calculates output data which is an on / off signal of the micromirror 46 constituting the DMD 36 from the image data whose resolution has been converted, and supplies this output data to the output data correction unit 178.

  The output data correction unit 178 reads the mask data from the mask data memory 182, corrects the on / off state of each micromirror 46 set as output data with the mask data, and supplies the corrected output data to the DMD controller 142. .

  The DMD controller 142 drives the DMD 36 based on the corrected output data, and controls each micromirror 46 on and off. The laser beam L output from the illumination device 38 and introduced into each exposure head 30 via the optical fiber 40 enters the DMD 36 via the mirror 42. The laser beam L selectively reflected in a desired direction by each micromirror 46 constituting the DMD 36 is enlarged by the lens systems 50 and 52, adjusted to a predetermined diameter via the microlens array 54, and then the substrate. Guided to F. The stage 14 moves along the guide, and a desired wiring pattern is exposed and recorded on the substrate F by a plurality of exposure heads 30 arranged in a direction orthogonal to the moving direction of the stage 14.

  The substrate F on which the wiring pattern is exposed and recorded is removed from the exposure apparatus 10 and then subjected to development processing, etching processing, and peeling processing. In this case, since the light amount of the laser beam L applied to the substrate F is adjusted in consideration of the final processing steps up to the peeling process based on the mask data, a highly accurate wiring pattern having a desired line width is obtained. be able to.

  By the way, in the configuration in which the light from the microlens array 54 is directly exposed to the substrate F as described above, the distance between the microlens array 54 and the substrate F is very short. For this reason, if contaminants from the substrate F side adhere to the microlens array 54 and the power of the laser beam L fluctuates, the wiring pattern cannot be formed with high accuracy. In order to deal with such contamination of the microlens array 54 over time, it is necessary to make adjustments at a predetermined time.

  In the present embodiment, the adjustment process for the temporal contamination of the microlens array 54 can be easily and automatically performed by correcting the mask data.

  Therefore, when a mask data correction process is instructed by a user instruction or when the exposure apparatus 10 is started up (step S16), first, as shown in FIG. The slit 80A having a width through which the 48 passes is moved to the lower part of the exposure head 30, and the light quantity of the entire exposure beam 48 passing through the slit 80A is measured. Since the position of each exposure beam 48 can be detected by the beam position detecting means described in the first embodiment, the movement control of the slit 80A can be performed based on the detected beam position.

  Then, the slit 80A is moved in the X direction by the width of the slit 80A, and the amount of light of all the exposure beams 48 that pass through the slit 80A is measured again. This is performed for all the X directions (step S17). That is, the exposure area in the X direction is divided into a plurality of areas, and the amount of light is measured for each divided area.

  Next, for each divided region, the measured light quantity is compared with a predetermined first threshold value to determine whether or not the measured light quantity is equal to or less than the first threshold value. It is determined whether or not the lens 60 is contaminated (step S18). The first threshold value is set to a value at which it can be determined that at least a part of the microlens 60 in the measurement range is contaminated when the measured light quantity is equal to or smaller than this value.

  If there is a divided range where it can be determined that the microlens 60 is contaminated, as shown in FIG. 35B, a slit 80B having a width through which the exposure beam 48 for one row passes through the divided region. , And the light quantity of all the exposure beams 48 in the row is measured. Next, the slit 80B is moved in the X direction by the width of the slit 80B, and similarly, the amount of light of all the exposure beams 48 in the row is measured. This is performed for all the divided ranges. Then, for each column, the measured light amount is compared with the second threshold value, and it is determined whether or not the measured light amount is equal to or less than the second threshold value. Specify (step S19). The first threshold value is set to a value at which it can be determined that at least a part of the microlens 60 in the measurement range is contaminated when the measured light quantity is equal to or smaller than this value.

  Then, the slits 75 in the specified row are moved to the lower part of the exposure head 30, and the beam diameter of the exposure beam 48 in that row is measured in the same manner as in step S2 (step S20).

  Information on the light amount and beam diameter measured for the contaminated region (row) is output to the mask data setting unit 186.

  The mask data setting unit 186 includes information such as the light amount and beam diameter measured for the contaminated area, the beam diameter shading data at the previous measurement stored in the beam diameter shading data memory 195, and the light amount shading data memory. The amount of change in the line width W (x) (line width change amount ΔW (x)) of the line pattern 90 shown in FIG. 26 is calculated using the light quantity shading data at the previous measurement stored in 191. (Step S21).

  That is, as the factors that change the line width W (x) of the line pattern 90, the light amount change amount ΔE (x) of the laser beam L and the beam diameter change amount ΔF (x) of the laser beam L are considered. The relationship between the light amount change amount ΔE (x) and the line width change amount ΔW (x) is stored in advance in the light amount / line width table memory 187 (see FIG. 30). The relationship between the beam diameter change amount ΔF (x) and the line width change amount ΔW (x) is stored in advance in the beam diameter / line width table memory 189 (see FIG. 32).

Therefore, assuming that the line width change amount with respect to the light amount change amount ΔE (x) is ΔW1 (x) and the line width change amount with respect to the beam diameter change amount is ΔW2 (x), the light amount change amount ΔE (x) and the beam diameter change amount. The line width change amount ΔW (x) due to ΔF (x) is
ΔW (x) = ΔW1 (x) + ΔW2 (x)
= F (ΔE (x)) + g (ΔF (x))
It becomes. Note that f is a function representing the relationship between the line width change amount ΔW1 (x) and the light amount change amount ΔE (x), and is a table stored in the light amount / line width table memory 187, for example. Further, g is a function representing the relationship between the line width change amount ΔW2 (x) and the beam diameter change amount ΔF (x), and is a table stored in the beam diameter / line width table memory 89, for example.

The mask data setting unit 186 uses the table stored in the light amount / line width table memory 187 to calculate the light amount correction amount ΔEcor (x) for correcting the line width change amount ΔW (x).
ΔEcor (x) = f−1 (ΔW (x))
(Step S22).

  Next, the mask data setting unit 186 corrects the current mask data stored in the mask data memory 182 based on the calculated light amount correction amount ΔEcor (x), as in step S14 (step S23). . The corrected mask data is stored in the mask data memory 182, and exposure recording of a desired image is performed using the new mask data (step S15).

  In this case, it is considered that changes with time in development processing, etching processing, and peeling processing after exposure are small as compared to changes with time in the state of the exposure apparatus 10. Therefore, without repeating the troublesome work of setting the mask line data 90 shown in FIG. 28 and setting the mask data, only by a simple process of correcting the mask data by measuring the light quantity and beam diameter of the laser beam L, A desired wiring pattern can be continuously formed with high accuracy.

  As the image recording characteristic value indicating the change with time of the state of the exposure apparatus 10, the focal position of the laser beam L with respect to the substrate F may be used instead of the beam diameter. Further, the positional deviation of the exposure position of the laser beam L with respect to the substrate F over time may be detected as an image recording characteristic value, and the mask data may be corrected based on the detected value.

  In the above embodiment, the mask data is corrected based on the measured data. However, when the contamination deterioration exceeds the specified amount, the cleaning process is performed, the contamination state is measured again, and the mask data is obtained. It is also possible to modify.

  The exposure apparatus 10 described above is, for example, exposure of a dry film resist (DFR) in a manufacturing process of a multilayer printed wiring board (PWB) and color in a manufacturing process of a liquid crystal display (LCD). It can be suitably used for applications such as filter formation, DFR exposure in TFT manufacturing processes, and DFR exposure in plasma display panel (PDP) manufacturing processes. The present invention can be similarly applied to a drawing apparatus provided with an ink jet recording head. Furthermore, the present invention can be applied to an exposure apparatus in the printing field and the photographic field.

1 is an overall schematic perspective view of an exposure apparatus according to a first embodiment of a multi-beam exposure apparatus of the present invention. FIG. 3 is a perspective view showing a portion exposed to the photosensitive material by each exposure head of the scanner provided in the exposure apparatus according to the first embodiment of the present invention. It is a perspective view which takes out and shows the part of the light quantity data measuring apparatus with which the stage was mounted | worn in the exposure apparatus which concerns on 1st Embodiment of this invention. It is a schematic block diagram which takes out and shows the part of the light quantity data measuring device of the light quantity data measuring device in the exposure apparatus which concerns on 1st Embodiment of this invention. It is a schematic block diagram of the optical system regarding the exposure head of the exposure apparatus which concerns on 1st Embodiment of this invention. It is a principal part enlarged view which shows the structure of DMD used for the exposure apparatus which concerns on 1st Embodiment of this invention. (A) And (B) is explanatory drawing for demonstrating operation | movement of DMD used for the exposure apparatus which concerns on 1st Embodiment of this invention. (A) is a principal part top view which shows the scanning locus | trajectory of the reflected light image (exposure beam) by each micromirror in the exposure apparatus which concerns on 1st Embodiment of this invention when DMD is not inclined, (B) is DMD. It is a principal part top view which shows the scanning trace of the exposure beam at the time of tilting. It is explanatory drawing which shows the state which detects the light quantity of the pixel currently lighted using the slit in the exposure apparatus which concerns on 1st Embodiment of this invention. It is explanatory drawing which shows the state which detects light quantity distribution and exposure amount by the light quantity data measurement apparatus in the exposure apparatus which concerns on 1st Embodiment of this invention. It is explanatory drawing which shows the outline of the state which detects the light quantity of the pixel currently lighted using the slit in the exposure apparatus which concerns on 1st Embodiment of this invention. It is a top view of a stage. It is explanatory drawing which shows the state which detects the specific pixel currently lighted predetermined two or more using the some slit for a detection. It is explanatory drawing which shows an example of the relative positional relationship of the some slit for a detection formed on the slit board. (A) is explanatory drawing which shows the state which detects the position of the specific pixel currently lighted using the slit for a detection, (B) is a signal when a photo sensor detects the lighted specific pixel. It is explanatory drawing shown. (A) is a top view of the electrode pad provided in a micro lens array, (B) is sectional drawing of the micro lens array 54 in which the electrode pad was provided. (A) is a plan view of the inside of the exposure head in a state where an electrode pad is provided on a substrate that holds the microlens array on the exposure head, and (B) is a sectional view of (A). (A) is a plan view of the inside of the exposure head in a state in which a ventilation hole is provided in a substrate for holding the microlens array on the exposure head, and (B) is a sectional view of (A). (A) is a plan view of the inside of the exposure head in a state in which a ventilation hole and an electrostatic adsorption filter are provided on a substrate that holds the microlens array on the exposure head, and (B) is a sectional view of (A). It is a side view which shows the external appearance of a washing | cleaning apparatus. It is a figure which shows the inside of the washing | cleaning unit in the state in which the exposure head was covered with the shield of the washing | cleaning unit. It is a figure which shows the inside of the washing | cleaning unit seen from the left side surface of FIG. It is a top view of the upper part of a washing unit. It is a control circuit block diagram in the exposure apparatus of this embodiment. It is a flowchart of the process which produces the mask data in the exposure apparatus of this embodiment. FIG. 5 is an explanatory diagram of a relationship between a recording position and light amount shading in the exposure apparatus of the present embodiment. It is explanatory drawing of DMD which comprises an exposure head, and the mask data set to it. It is explanatory drawing of the line pattern exposed and recorded on the board | substrate by the exposure apparatus of this embodiment. It is explanatory drawing of the relationship between the position of a line pattern, and the measured line width. FIG. 5 is an explanatory diagram of a relationship between a light amount change amount of a laser beam irradiated on a substrate and a line width change amount associated therewith. It is explanatory drawing of the relationship between the position of a board | substrate, and light quantity correction amount. It is a relation explanatory view of the amount of change of the beam diameter of a laser beam with which a substrate is irradiated, and the amount of change of line width accompanying it. It is explanatory drawing of the line | wire width recorded when not correcting light quantity shading. It is explanatory drawing of the line | wire width recorded when the light quantity shading was correct | amended. It is a figure for demonstrating the movement of the slit in the case of specifying a contamination area | region. (A) is a plan view of the inside of the exposure head in a state in which a ventilation hole and an electrostatic adsorption filter are provided on a substrate that holds the microlens array on the exposure head, and (B) is a sectional view of (A). (A) is a plan view of the inside of the exposure head in a state in which a ventilation hole and an electrostatic adsorption filter are provided on a substrate that holds the microlens array on the exposure head, and (B) is a sectional view of (A).

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Exposure apparatus 12 Photosensitive material 14 Stage 28 Controller 30 Exposure head 38 Illumination apparatus 46 Micro mirror 48 Exposure beam 54 Micro lens array 55 Electrode pad 61 Electrostatic adsorption filter 60 Micro lens 70 Light quantity data measurement apparatus 71 Slit plate 100 Cleaning apparatus

Claims (11)

A spatial light modulation element in which a large number of pixel units each modulating the irradiated light are arranged two-dimensionally, a light source that irradiates light to the spatial light modulation element, and each pixel part of the spatial light modulation element Including a microlens array in which microlenses for condensing each light are arranged in an array, and an image formed by the light modulated by the spatial light modulator is directly formed on the exposed surface by the microlens array. In an exposure apparatus comprising an imaging optical system,
An exposure apparatus comprising a reducing means for reducing contamination of the microlens array.   The mitigation means is an electrode provided on at least a part of the surface of the microlens array on the exposed surface side other than the region through which the light passes, and a voltage for applying a predetermined voltage to the electrode The exposure apparatus according to claim 1, further comprising an applying unit.   The mitigation means is a surface on the exposed surface side of a holding substrate that holds the microlens array on an exposure head on which the microlens array is mounted, and is at least a partial region other than the region through which the light passes The exposure apparatus according to claim 1, further comprising: an electrode provided on the electrode, and voltage applying means for applying a predetermined voltage to the electrode.   The reduction means includes at least one of a holding substrate that holds the microlens array on an exposure head on which the microlens array is mounted and is provided with a ventilation port, and intake air and exhaust air from the ventilation port. The exposure apparatus according to claim 1, further comprising a ventilation means for controlling.   5. The electrostatic adsorption filter is further provided on at least a part of a region on the exposed surface side of the holding substrate other than the region through which the light passes and the vent hole. The exposure apparatus described.   The exposure apparatus according to claim 1, wherein the spatial modulation element is a DMD. A spatial light modulation element in which a large number of pixel units each modulating the irradiated light are arranged two-dimensionally, a light source that irradiates light to the spatial light modulation element, and each pixel part of the spatial light modulation element Including a microlens array in which microlenses for condensing each light are arranged in an array, and an image formed by the light modulated by the spatial light modulator is directly formed on the exposed surface by the microlens array. In a contamination reduction method executed in an exposure apparatus including an imaging optical system,
A method of reducing contamination, comprising performing a process of reducing contamination of the microlens array.   The process of reducing contamination of the microlens array is performed by applying a predetermined voltage to the electrodes provided on at least a part of the surface of the microlens array on the exposed surface side other than the region through which the light passes. The contamination reducing method according to claim 7, wherein the contamination is applied.   The process of reducing contamination of the microlens array is a surface on the exposed surface side of a holding substrate that holds the microlens array on an exposure head on which the microlens array is mounted, and the region through which the light passes The contamination reducing method according to claim 7, wherein the process is a process of applying a predetermined voltage to an electrode provided in at least a part of the region other than.   The contamination reducing method according to claim 7, wherein the process of reducing contamination of the microlens array is a process of controlling a movement path of contaminants that contaminate the microlens array.   The process of controlling the movement path of the contaminant is a process of controlling at least one of intake and exhaust from a vent hole provided on a holding substrate that holds the microlens array in an exposure head on which the microlens array is mounted. The contamination reducing method according to claim 10, wherein:

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