JP2007017799A

JP2007017799A - Display panel and its manufacturing method

Info

Publication number: JP2007017799A
Application number: JP2005200686A
Authority: JP
Inventors: Noriyuki Dairoku; 範行大録
Original assignee: Hitachi Ltd
Current assignee: Hitachi Ltd
Priority date: 2005-07-08
Filing date: 2005-07-08
Publication date: 2007-01-25

Abstract

<P>PROBLEM TO BE SOLVED: To provide technique of sticking together a front substrate and a back substrate in an appropriate position in a display panel constituted by sticking together both the substrates across a frame held therebetween. <P>SOLUTION: The sticking together of the front substrate and the back substrate is performed while the warpage and distortion of the frame are straightened by pressing down the frame. For this purpose, the frame is formed with the areas (for example, where the corners of the frame are provided with recesses) for pressing down the frame to the front substrate or the back substrate. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、前面基板と背面基板とを枠を挟んで貼り合わせてなる平面型の表示パネルに関する。 The present invention relates to a flat display panel in which a front substrate and a rear substrate are bonded to each other with a frame interposed therebetween.

特許文献１には、電界放出画像表示装置（ＦｉｅｌｄＥｍｉｓｓｉｏｎＤｉｓｐｌａｙ）に用いられる表示パネル（ＦＥＤパネル）が記載されている。この表示パネルは、前面基板（アノード基板）と背面基板（カソード基板）とを枠を挟んで貼りあわせた構造となっている。背面基板（カソード基板）には、電子源が所定の位置に配置されている。前面基板（アノード基板）には、電子源から放出される電子により発光する蛍光体が配置されている。画像の表示は、電子源から放出される電子が、対応する蛍光体に適切に入射することで達成される。 Patent Document 1 describes a display panel (FED panel) used in a field emission image display device (Field Emission Display). This display panel has a structure in which a front substrate (anode substrate) and a rear substrate (cathode substrate) are bonded together with a frame interposed therebetween. On the rear substrate (cathode substrate), an electron source is disposed at a predetermined position. A phosphor that emits light by electrons emitted from an electron source is disposed on the front substrate (anode substrate). The display of an image is achieved when electrons emitted from the electron source are appropriately incident on the corresponding phosphor.

特開２０００−３２３０７２号公報JP 2000-323072 A

大型の表示パネルには、大きな枠が使用されるが、大きな枠は、反りや歪みが生じ易い。枠が沿っていたり、歪んでいたりすると、前面基板と背面基板とを適切な位置で重ね合わせるのが困難となる。その結果、電子源から放射された電子が、本来入射すべき蛍光体に入射せず、隣の蛍光体に入射するなどして、鮮明な画像の表示ができなくなる。特許文献１の技術では、幅広の枠を設けているが、十分な精度を得るためには、高精度の枠部品が必要となる。 A large frame is used for a large display panel, but the large frame is likely to be warped or distorted. If the frame is along or distorted, it becomes difficult to overlap the front substrate and the rear substrate at appropriate positions. As a result, the electrons emitted from the electron source do not enter the phosphor that should be incident, but enter the adjacent phosphor, and a clear image cannot be displayed. In the technique of Patent Document 1, a wide frame is provided. However, in order to obtain sufficient accuracy, a highly accurate frame part is required.

本発明の目的は、前面基板と背面基板とを枠を挟んで貼り合わせてなる表示パネルにおいて、簡易な方法で、両基板を適切な位置で貼り合わせる技術を提供することにある。 An object of the present invention is to provide a technique for bonding two substrates at an appropriate position by a simple method in a display panel in which a front substrate and a rear substrate are bonded together with a frame interposed therebetween.

上記課題を解決すべく、本発明の表示パネルの製造方法は、前面基板と背面基板との貼り合わせの際に、枠を治具により押さえながら行う。 In order to solve the above problems, the display panel manufacturing method of the present invention is performed while pressing the frame with a jig when the front substrate and the rear substrate are bonded together.

そのため、前記枠には、前記前面基板と前記背面基板とを当該枠を挟んで貼り合わせる工程において当該枠を前記前面基板又は前記背面基板に押さえつけるための部位が形成されている。
また、前記枠には、当該枠の他の部分の厚さより薄い部位が形成されていてもよい。
また、前記枠には、当該枠の外方向に開口された窪みがあってもよい。
また、前記枠の四隅の厚さは、当該枠の他の部分の厚さより薄いようにしてもよい。 Therefore, the frame is formed with a portion for pressing the frame against the front substrate or the back substrate in the step of bonding the front substrate and the back substrate with the frame interposed therebetween.
The frame may be formed with a portion thinner than the thickness of the other part of the frame.
Moreover, the said frame may have a hollow opened to the outer direction of the said frame.
Further, the thickness of the four corners of the frame may be thinner than the thickness of the other part of the frame.

例えば、本発明の前面基板と背面基板とを枠を挟んで貼り合わせてなる表示パネルの製造方法は、前記枠に、当該枠の他の部分の厚さより薄い部位が形成されており、前記枠を前記前面基板又は前記背面基板に配置する際、当該枠の前記部位を用いて、前記前面基板又は前記背面基板に押さえつける。 For example, in the method for manufacturing a display panel in which the front substrate and the rear substrate are bonded to each other with a frame interposed therebetween, a portion thinner than the thickness of the other part of the frame is formed on the frame. Is placed on the front substrate or the back substrate, the portion of the frame is used to press against the front substrate or the back substrate.

以下に、本発明の一実施形態が適用された表示パネルの製造方法について説明する。本実施形態では、ＦＥＤ（ＦｉｅｌｄＥｍｉｓｓｉｏｎＤｉｓｐｌａｙ）用の表示パネルの製造方法を例にとり説明する。製造される表示パネルは、図２（２）に示すように、前面基板（アノード基板）４０と背面基板（カソード基板）５０とが、ガラス枠３０を挟んで対向した構成となる。 Below, the manufacturing method of the display panel to which one Embodiment of this invention was applied is demonstrated. In the present embodiment, a method for manufacturing a display panel for FED (Field Emission Display) will be described as an example. As shown in FIG. 2B, the manufactured display panel has a configuration in which a front substrate (anode substrate) 40 and a back substrate (cathode substrate) 50 face each other with the glass frame 30 interposed therebetween.

アノード基板４０は、透明性のあるガラス板等で構成されている。アノード基板４０の一方の面にはブラックマトリックス、蛍光体及びアノード電極が形成されており、形成面がカソード基板５０の配線形成面と向かい合うように配置されている。 The anode substrate 40 is made of a transparent glass plate or the like. A black matrix, a phosphor, and an anode electrode are formed on one surface of the anode substrate 40, and the formation surface is disposed so as to face the wiring formation surface of the cathode substrate 50.

カソード基板５０には、ガラス等の絶縁性の基板上に、信号線と走査線とが交差して配置されている。画像を表示する際は、信号線の末端は、外部回路の信号線駆動回路と接続されることになる。また、走査線の末端は、外部回路の走査線駆動回路と接続されることになる。 In the cathode substrate 50, a signal line and a scanning line are arranged so as to intersect each other on an insulating substrate such as glass. When displaying an image, the end of the signal line is connected to a signal line driving circuit of an external circuit. Further, the end of the scanning line is connected to a scanning line driving circuit of an external circuit.

電子源（冷陰極電子源）は、信号線と走査線とが交差する位置に設けられている。電子源は、スピント型電子源、表面伝導型電子源（Surface-conduction Electron-emitter）、カーボンナノチューブ型電子源等の電界放出型電子源と、金属―絶縁体―金属を積層したＭＩＭ（Ｍｅｔａｌ−Ｉｎｓｕｌａｔｏｒ−Ｍｅｔａｌ）型電子源、金属―絶縁体―半導体電極を積層したＭＩＳ（Ｍｅｔａｌ−Ｉｎｓｕｌａｔｏｒ−Ｓｅｍｉｃｏｎｄｕｃｔｏｒ）型電子源等のホットエレクトロン型電子源とに大別されるが、いずれの電子源を設けてもよい。例えば、ＭＩＭ型電子源については、特開平１０−１５３９７９号公報、特開２００４−１１１０５３等に開示されているが、これらのＭＩＭ型電子源が配置されていてもよい。 The electron source (cold cathode electron source) is provided at a position where the signal line and the scanning line intersect. The electron source is a field emission electron source such as a Spindt-type electron source, a surface-conduction electron source, or a carbon nanotube type electron source, and a metal-insulator-metal laminated MIM (Metal- Insulator-Metal (electron source) type, and MIS (Metal-Insulator-Semiconductor) type electron source with metal-insulator-semiconductor electrodes stacked, but is divided into hot electron type electron sources. May be. For example, although MIM type electron sources are disclosed in Japanese Patent Laid-Open Nos. 10-153793, 2004-111053, etc., these MIM type electron sources may be arranged.

このような表示パネルの製造方法を、図１〜図３を参照して説明する。まず、図１を参照して、ガラス枠３０の製造工程について説明する。 A method for manufacturing such a display panel will be described with reference to FIGS. First, with reference to FIG. 1, the manufacturing process of the glass frame 30 is demonstrated.

まず、図１（１）に示すように、細長い角柱のガラスを表示パネルの縦横の長さに合わせて切断する。 First, as shown in FIG. 1A, a long and narrow prismatic glass is cut according to the vertical and horizontal lengths of the display panel.

つぎに、ガラス部材１０の、枠組したときに四隅に相当する部分に、カッターやヤスリで削ることにより、凹部（窪み）２０を設ける。 Next, the recessed part (dent) 20 is provided in the part corresponding to four corners when the glass member 10 is framed by cutting with a cutter or a file.

こうして得た４本のガラス部材１０を、加熱により溶解するガラスフリットを接着剤に用いて接合し、枠の形に組み合わせる。なお、ガラスフリットは、後の工程で行う封着の温度で軟化するものの、枠の形状は保てるも程度のものを用いる。 The four glass members 10 thus obtained are joined using a glass frit that is melted by heating as an adhesive, and combined into a frame shape. Although the glass frit is softened at the temperature of sealing performed in a later step, a glass frit having a size that can maintain the shape of the frame is used.

こうして、図１（２）に示すようなガラス枠３０が完成する。すなわち、ガラス枠３０の四隅には、凹部（窪み）２０が形成されている。いかえれば、ガラス枠３０の外四隅の同一平面に、他の部分より薄い部分がある。 In this way, a glass frame 30 as shown in FIG. 1 (2) is completed. That is, recesses (dents) 20 are formed at the four corners of the glass frame 30. In other words, in the same plane at the outer four corners of the glass frame 30, there are portions thinner than the other portions.

次に、図２及び図３を参照して、前面基板（アノード基板）４０と背面基板（カソード基板）５０とを、ガラス枠３０を挟んで貼り合わせる工程について説明する。 Next, a process of bonding the front substrate (anode substrate) 40 and the rear substrate (cathode substrate) 50 with the glass frame 30 interposed therebetween will be described with reference to FIGS.

まず、アノード基板４０をアノード電極の形成面を上にして配置する。次に、ガラス枠３０を、アノード基板４０上の所定の位置に配置する。このとき、ガラス枠３０の凹部２０が上を向くように配置する。なお、ガラス枠３０の、アノード基板４０とカソード基板５０との接着部分には、ガラスフリットが塗布してある。 First, the anode substrate 40 is arranged with the anode electrode formation surface facing up. Next, the glass frame 30 is disposed at a predetermined position on the anode substrate 40. At this time, it arrange | positions so that the recessed part 20 of the glass frame 30 may face upward. Note that glass frit is applied to the bonding portion of the glass frame 30 between the anode substrate 40 and the cathode substrate 50.

次に、図３（１）に示すように、４本の押さえ棒（治具）７０をガラス枠３０の四隅の凹部２０にそれぞれ当て、位置決めしたのち、さらに下方向（図中、点線矢印方向）に力を加えることにより、ガラス枠３０をアノード基板４０に押さえ付ける。なお、押さえ棒７０の先端は、凹部２０に嵌合する形状となっている。 Next, as shown in FIG. 3 (1), four pressing rods (jigs) 70 are respectively placed on the four corner recesses 20 of the glass frame 30 and positioned, and then further downward (in the direction of the dotted arrow in the figure). ) To press the glass frame 30 against the anode substrate 40. Note that the tip of the presser bar 70 has a shape that fits into the recess 20.

次に、図３（２）に示すように、押さえ棒７０によりガラス枠３０を押さえ付けたまま、カソード基板５０をガラス枠３０の上から所定位置に配置し押さえる。さらに、図３（３）に示すように、クリップ７５により、アノード基板４０とカソード基板５０とを挟み込み固定する。 Next, as shown in FIG. 3 (2), the cathode substrate 50 is placed at a predetermined position from above the glass frame 30 and pressed while the glass frame 30 is pressed by the pressing rod 70. Further, as shown in FIG. 3 (3), the anode substrate 40 and the cathode substrate 50 are sandwiched and fixed by the clip 75.

次に、図３（４）に示すように、押さえ棒７０を抜き取る。その後、加熱によりガラスフリットを溶解して、両基板４０、５０とガラス枠３０との間を接着する。こうして、内部の圧力が１０^−５Ｐａ程度に維持できるように封着された表示パネルが完成する。 Next, as shown in FIG. 3 (4), the holding bar 70 is extracted. Thereafter, the glass frit is melted by heating, and the substrates 40 and 50 and the glass frame 30 are bonded to each other. In this way, a display panel sealed so that the internal pressure can be maintained at about 10 ⁻⁵ Pa is completed.

以上、本発明の一実施形態について説明した。 The embodiment of the present invention has been described above.

本実施形態によれば、４本の棒状の部材を高温フリットで相互に接合するので、従来の枠ガラスのように予めガラス基材が溶けるほどの高温でプレス融着する必要がなく、大口径の枠も容易かつ廉価に構成できる。 According to this embodiment, the four rod-shaped members are joined to each other with a high-temperature frit, so there is no need to press-fuse at a high temperature enough to melt the glass substrate in advance as in the conventional frame glass, and the large diameter The frame can be configured easily and inexpensively.

また、図３（１）に示すように、元のガラス枠３０に反りや歪みがある場合でも、図３（２）に示すように、変形を矯正し、ガラス枠３０をアノード基板４０の所定位置からずれることなく配置させることができる。また、カソード基板５０を重ねるときにも、ガラス枠３０に反りや歪みがないために、カソード基板５０を、ずれることなく所定位置に配置することができる。 Further, as shown in FIG. 3 (1), even when the original glass frame 30 is warped or distorted, as shown in FIG. 3 (2), the deformation is corrected and the glass frame 30 is fixed to the anode substrate 40. It can arrange | position without shifting | deviating from a position. Further, when the cathode substrates 50 are stacked, the cathode frame 50 can be disposed at a predetermined position without being displaced because the glass frame 30 is not warped or distorted.

なお、上記実施形態では、前面基板（アノード基板）の上に枠を載せて押さえつけた後、背面基板（カソード基板）を重ねるようにしたが、この順番は逆でもよい。すなわち、背面基板（カソード基板）の上に枠を載せて押さえつけた後、前面基板（アノード基板）を重ねるようにしてもよい。 In the above embodiment, the frame is placed on the front substrate (anode substrate) and pressed, and then the rear substrate (cathode substrate) is stacked. However, this order may be reversed. That is, a front substrate (anode substrate) may be stacked after a frame is placed on the rear substrate (cathode substrate) and pressed.

また、前記枠は、表示パネルと熱膨張率を近接したガラス材料やアルミナを主体とするセラミックに例示される無機素材を用いることができる。 Moreover, the said frame can use the inorganic raw material illustrated by the ceramic which mainly has the glass material close | similar to the display panel and the thermal expansion coefficient, and the alumina.

本発明は、上記実施形態に限られない。上記実施形態は、本発明の要旨の範囲で様々な変形が可能である。 The present invention is not limited to the above embodiment. The above embodiment can be variously modified within the scope of the gist of the present invention.

本発明では、枠に、前面基板と背面基板とを枠を挟んで貼り合わせる際に押さえるための部位が存在していればよい。いいかえれば、両基板を重ねたときに、基板と枠の間に、治具（押さえ棒）を差し込むための隙間ができていればよい。すなわち、その部位の厚さが他の部位より少し薄ければよい。または、枠の外方向に開口された窪みがあればよい。そして、このような条件を満足すれば、その部位の形状、その数、その位置に制限はない。 In the present invention, it is only necessary that the frame has a portion for pressing when the front substrate and the rear substrate are bonded to each other with the frame interposed therebetween. In other words, it is only necessary that a gap for inserting a jig (presser bar) is formed between the substrate and the frame when the two substrates are stacked. That is, the thickness of the part should just be a little thinner than another part. Or what is necessary is just the hollow opened to the outer direction of the frame. And if such conditions are satisfied, there are no restrictions on the shape, number, and position of the parts.

例えば、ガラス枠３０に設けた凹部２０は、四隅以外に設けてもよい。図４は、ガラス枠３０の辺上に、複数の凹部２１を設けた例を示す。かかる場合、図５（３）に示すように、ガラス枠３０を押さえ付ける工程において、押さえ棒７０を、四隅の凹部２０に加えて、ガラス枠３０の辺上に設けた凹部２１に対しても当て位置決めする。さらに、押さえ棒７０により下方向に力を加える。このように、ガラス枠３０を押さえるための部位を、四隅だけでなく、枠の辺上にも設ければ、ガラス枠３０の反りや歪みをより確実に矯正できる。したがって、アノード基板４０とカソード基板５０とを適切な位置で確実に配置できる。 For example, you may provide the recessed part 20 provided in the glass frame 30 other than four corners. FIG. 4 shows an example in which a plurality of recesses 21 are provided on the side of the glass frame 30. In this case, as shown in FIG. 5 (3), in the step of pressing the glass frame 30, in addition to the recesses 20 at the four corners, the pressing rod 70 is also applied to the recesses 21 provided on the sides of the glass frame 30. Position the contact. Further, a force is applied downward by the presser bar 70. In this way, if the portions for holding the glass frame 30 are provided not only at the four corners but also on the sides of the frame, the warp and distortion of the glass frame 30 can be corrected more reliably. Therefore, the anode substrate 40 and the cathode substrate 50 can be reliably arranged at appropriate positions.

また、図６及び図７に示すように、押さえ棒７０を当てるための部位は、曲面を持った丸い窪み２２であってもよい。図６では、円弧が枠内部の方向にあり、図７では、円弧が下方向にある。角を少なくすることにより、凹部を加工するときや、押さえ棒７０で押さえるときの「欠け」を防止できる。特に円弧状にするのが好ましく、半円に至らない程度（円弧見込み角１２０度以下）とすることで、応力集中を避け、加工が容易となる。例えば、規定半径の砥石で加工することができる。 Moreover, as shown in FIG.6 and FIG.7, the site | part for applying the holding | maintenance stick | rod 70 may be the round hollow 22 with a curved surface. In FIG. 6, the arc is in the direction inside the frame, and in FIG. 7, the arc is in the downward direction. By reducing the corners, it is possible to prevent “chips” when processing the recesses or pressing with the presser bar 70. In particular, it is preferable to use an arc shape, and by setting it to an extent that does not reach a semicircle (arc prospective angle of 120 degrees or less), stress concentration is avoided and processing becomes easy. For example, it can be processed with a grindstone having a specified radius.

図７に示すように、円弧方向が下にくるようにすると、押さえ棒７０で枠を下方向に押し付けた場合に、調芯機能が期待できる。 As shown in FIG. 7, when the arc direction is downward, an alignment function can be expected when the frame is pressed downward by the presser bar 70.

また、図８に示すように、押さえ棒７０を当てるための部位は、枠の角を取った構造であってもよい。すなわち、ガラス部材の、枠の四隅に該当する部分の面取りの際、上下で非対称に面取りするようにする。押さえ棒７０を当てる部位が、このような形状をしていても、位置精度の向上の効果と、平行四辺形に歪んだ枠を方形に近く補正する機能は期待できる。 Further, as shown in FIG. 8, the portion for applying the presser bar 70 may have a structure in which the corners of the frame are taken. That is, when chamfering the portions corresponding to the four corners of the frame of the glass member, the chamfers are asymmetrical in the vertical direction. Even if the portion to which the presser bar 70 is applied has such a shape, the effect of improving the positional accuracy and the function of correcting the frame distorted into a parallelogram close to a square can be expected.

また、図７で示したように、下方向に円弧状の凹部２３がある場合、押さえ棒７０の接触面も、その丸みに合わせて嵌合するように、丸い方がよい。また、図９に示すように、凹部２３の幅より、小さい幅のものがよい。押さえ棒７０の幅が凹部２３の幅より大きいと、図１０に示すように、接触部分７５で「欠け」の原因となる。「欠け」は、亀裂の原因となるので、好ましくない。 Further, as shown in FIG. 7, when there is an arcuate recess 23 in the downward direction, the contact surface of the presser bar 70 is preferably round so as to fit in accordance with the roundness. Moreover, as shown in FIG. 9, the thing of the width smaller than the width | variety of the recessed part 23 is good. If the width of the presser bar 70 is larger than the width of the recess 23, as shown in FIG. The “chip” is not preferable because it causes a crack.

また、表示パネルの内部を適切な真空度に保つためには、図１１に示すように、アノード基板４０及びカソード基板５０と枠３０との接着部分の幅Ｄが、十分確保されることが重要である。枠３０に凹部２０、２１を設けると、その幅Ｄが減少するので、その部分の封着の信頼性が低下する。この点、枠３０の四隅では本来幅が広いので、枠の角に凹部２０を設けた場合でも、幅Ｄが十分確保でき、封着の信頼性に影響が少ない。また、かかる観点から、図１１に示すように、内部の配線（走査線や信号線）の引出し線８０が通過していない部分に凹部２１設けるのが好ましい。 Further, in order to keep the inside of the display panel at an appropriate degree of vacuum, it is important that the width D of the bonded portion between the anode substrate 40 and the cathode substrate 50 and the frame 30 is sufficiently secured as shown in FIG. It is. When the recesses 20 and 21 are provided in the frame 30, the width D is reduced, so that the reliability of sealing of the portion is lowered. In this respect, since the width is inherently wide at the four corners of the frame 30, even when the recess 20 is provided at the corner of the frame, the width D can be sufficiently secured, and the reliability of sealing is less affected. From this point of view, as shown in FIG. 11, it is preferable to provide the recess 21 in a portion where the lead line 80 of the internal wiring (scanning line or signal line) does not pass.

また、枠に設ける凹部の形成方法に制限はない。カッターや砥石により形成してもよいし、鋳型により当初から形成させてもよい。例えば、凹部の形状を有した鋳型に溶解したガラスを流し込み、枠の成形時に最初から凹部を形成させる。 Moreover, there is no restriction | limiting in the formation method of the recessed part provided in a frame. You may form with a cutter or a grindstone, and may form from the beginning with a casting_mold | template. For example, molten glass is poured into a mold having a concave shape, and the concave portion is formed from the beginning when the frame is formed.

また、上記実施形態では、ＦＥＤパネルの製造方法を例にとって説明したが、これに限定されない。本発明は、背前面基板と面基板とを枠を介して対向させてなる平面型の表示パネルの製造方法に適用できる。例えば、プラズマディスプレイ、液晶ディスプレイ（ＬＣＤ）、有機蛍光体表示装置（ＯＬＥＤ）などの製造においても適用可能である。 Moreover, although the said embodiment demonstrated the manufacturing method of the FED panel as an example, it is not limited to this. The present invention can be applied to a method for manufacturing a flat display panel in which a back front substrate and a surface substrate are opposed to each other through a frame. For example, the present invention can be applied to manufacture of a plasma display, a liquid crystal display (LCD), an organic phosphor display device (OLED), and the like.

図１は、ガラス枠の製造工程を示す図。FIG. 1 is a view showing a glass frame manufacturing process. 図２は、前面基板と背面基板を貼り合わせる工程を示す図。FIG. 2 is a diagram illustrating a process of bonding a front substrate and a rear substrate. 図３は、前面基板と背面基板を貼り合わせる工程を示す図。FIG. 3 is a diagram illustrating a process of bonding a front substrate and a rear substrate. 図４は、ガラス枠の製造工程を示す図。FIG. 4 is a diagram showing a glass frame manufacturing process. 図５は、前面基板と背面基板を貼り合わせる工程を示す図。FIG. 5 is a diagram illustrating a process of bonding the front substrate and the rear substrate. 図６は、凹部の形状を示す図。FIG. 6 is a diagram illustrating the shape of a recess. 図７は、凹部の形状を示す図。FIG. 7 is a diagram showing the shape of a recess. 図８は、凹部の形状を示す図。FIG. 8 is a diagram showing the shape of a recess. 図９は、押さえ棒の形状を示す図。FIG. 9 is a diagram showing the shape of the presser bar. 図１０は、押さえ棒の形状を示す図。FIG. 10 is a diagram showing the shape of the presser bar. 図１１は、凹部の位置を説明するための図。FIG. 11 is a diagram for explaining the positions of the recesses.

Explanation of symbols

１０…ガラス部材、２０、２１、２２、２３、２４…凹部、３０…ガラス枠、
４０…アノード基板
５０…カソード基板
７０…押さえ棒（治具）
８０…走査線・信号線の引出し線 DESCRIPTION OF SYMBOLS 10 ... Glass member, 20, 21, 22, 23, 24 ... Recessed part, 30 ... Glass frame,
40 ... Anode substrate 50 ... Cathode substrate 70 ... Presser bar (jig)
80 ... Lead lines for scanning lines and signal lines

Claims

A display panel in which a front substrate and a rear substrate are bonded together with a frame interposed therebetween,
In the frame,
A display panel, wherein a portion for pressing the frame against the front substrate or the back substrate is formed in the step of bonding the front substrate and the back substrate across the frame.

A display panel in which a front substrate and a rear substrate are bonded together with a frame interposed therebetween,
In the frame,
A display panel characterized in that a part thinner than the thickness of the other part of the frame is formed.

A display panel in which a front substrate and a rear substrate are bonded together with a frame interposed therebetween,
In the frame,
A display panel characterized by having a dent opened outward of the frame.

A display panel in which a front substrate and a rear substrate are bonded together with a frame interposed therebetween,
The thickness of the four corners of the said frame is thinner than the thickness of the other part of the said frame. The display panel characterized by the above-mentioned.

In claim 2,
The site is
A display panel characterized in that it is formed in a portion where there is no lead line of the wiring.

A method of manufacturing a display panel in which a front substrate and a rear substrate are bonded together with a frame interposed therebetween,
In the frame, a portion thinner than the thickness of the other part of the frame is formed,
A method of manufacturing a display panel, comprising: pressing the frame against the front substrate or the back substrate using the portion of the frame when the frame is disposed on the front substrate or the back substrate.