JP2007016127A - Epoxy adhesive composition and bonding method - Google Patents
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Abstract
Description
本発明は、半田などの酸化膜を表面に有する金属を接合する用途に用いられるエポキシ系接着剤組成物及び接合方法に関し、より詳細には、フラックスを用いることなく半田などを確実に接合することを可能とするエポキシ系接着剤組成物及び接合方法に関する。 The present invention relates to an epoxy adhesive composition and a joining method used for joining a metal having an oxide film on the surface, such as solder, and more particularly to reliably joining solder or the like without using a flux. The present invention relates to an epoxy-based adhesive composition and a bonding method.
従来、電子部品を基板に実装するに際し、高密度実装を果たすために、半田ボールや半田バンプが用いられている。すなわち、電子部品素子の下面に複数の半田バンプを形成しておき、半田バンプを実装基板上の電極に当接させるように、電子部品素子を実装基板上に搭載する。この状態で半導体装半田バンプを加熱し、半田バンプを溶融させ、溶融半田を固化することにより、電子部品素子が実装基板上に実装されている。 Conventionally, when mounting electronic components on a substrate, solder balls and solder bumps are used to achieve high-density mounting. That is, a plurality of solder bumps are formed on the lower surface of the electronic component element, and the electronic component element is mounted on the mounting substrate so that the solder bumps are in contact with the electrodes on the mounting substrate. In this state, the semiconductor device solder bump is heated, the solder bump is melted, and the molten solder is solidified, whereby the electronic component element is mounted on the mounting substrate.
もっとも、半田バンプによる接合部分は、電子部品素子と実装基板上との間の面積の一部であるため、接合強度を高めるため、並びに信頼性を高めるために、電子部品素子の下面の半田バンプによる接合される部分以外の部分が、エポキシ系接着剤などの熱硬化型の接着剤により実装基板に接合されている。この接着剤は、半田バンプによる接合後に電子部品素子と実装基板との隙間に注入され、硬化されたり、あるいは予め実装基板と部品素子との間に上記接着剤を介在させ、半田バンプにより硬化前の接着剤を押し退け、半田バンプを実装基板上の電極に当接させた状態で加熱し、半田バンプによる接合と、接着剤による熱硬化による接合とを果たす方法などが用いられていた。 However, since the joint portion by the solder bump is a part of the area between the electronic component element and the mounting substrate, the solder bump on the lower surface of the electronic component element is increased in order to increase the bonding strength and the reliability. Portions other than the portion to be bonded are bonded to the mounting substrate by a thermosetting adhesive such as an epoxy adhesive. This adhesive is injected into the gap between the electronic component element and the mounting substrate after bonding by the solder bump and cured, or the adhesive is interposed between the mounting substrate and the component element in advance, and before the curing by the solder bump. A method is used in which the adhesive is pushed away and heated in a state where the solder bumps are in contact with the electrodes on the mounting substrate to perform bonding by the solder bumps and thermal curing by the adhesive.
ところで、上記半田バンプは、通常、表面に酸化膜を有する。この酸化膜が存在すると、加熱した際の溶融半田の濡れ拡がり性が悪化し、電子部品素子を実装基板上の電極に確実に接合し、かつ十分な接合強度を得ることが困難である。そこで、通常、接合に先立ち、酸性のフラックスを半田バンプ表面に塗布し、酸化膜が除去されていた。しかしながら、酸性のフラックスが残存すると、電極が経時により腐食するおそれがあるため、酸化膜除去後には、フラックスを洗浄していた。そのため、煩雑な洗浄工程を実施しなければならなかった。 Incidentally, the solder bump usually has an oxide film on the surface. When this oxide film is present, the wet-spreading property of the molten solder when heated is deteriorated, and it is difficult to reliably bond the electronic component element to the electrode on the mounting substrate and obtain a sufficient bonding strength. Therefore, normally, prior to bonding, an acidic flux is applied to the surface of the solder bump, and the oxide film is removed. However, if the acidic flux remains, the electrode may corrode over time, so the flux was washed after the oxide film was removed. Therefore, a complicated cleaning process has to be performed.
他方、下記の特許文献１には、半田バンプが形成された電子部品を実装基板に搭載するためのエポキシ系接着剤として、フラックスとして機能する有機酸よりなる活性剤を含有するエポキシ系接着剤が開示されている。ここでは、エポキシ系接着剤中に、カルボン酸のような有機酸よりなる活性剤が含有されているので、接着剤を半田バンプに塗布し、半田バンプの溶融硬化により電子部品を実装基板上の電極に接合するとともに、半田バンプに押し退けられている接着剤により電子部品素子を実装基板上に接合している。そして、上記活性剤が半田バンプに予め接着剤されて酸化被膜が除去されることになるため、接合が確実に行われ、フラックスの使用を省略することが可能とされている。
しかしながら、特許文献１に記載のエポキシ系接着剤では、接着剤中に有機酸が含有されているため、酸化皮膜は除去されるものの、接着剤硬化物中に有機酸が残存することとなる。そのため、長期間使用していると、硬化物中の有機酸により、電極が腐食したりし、信頼性が低下するおそれがあった。 However, in the epoxy adhesive described in Patent Document 1, since an organic acid is contained in the adhesive, the oxide film is removed, but the organic acid remains in the cured adhesive. For this reason, when used for a long period of time, the organic acid in the cured product may corrode the electrode, which may reduce reliability.
本発明の目的は、上述した従来技術の現状に鑑み、フラックスを用いることなく、酸化皮膜を有する金属の酸化皮膜を除去しつつ、該金属を接合することを可能とするエポキシ系接着剤組成物及び接合方法を提供することにある。 An object of the present invention is to provide an epoxy-based adhesive composition capable of bonding a metal while removing the oxide film of the metal having an oxide film without using a flux in view of the current state of the prior art described above. And providing a joining method.
本発明に係るエポキシ系接着剤組成物は、酸化膜を表面に有する金属の接合に用いられるエポキシ系接着剤組成物であって、エポキシ樹脂と、水溶性を有しない有機酸とを含み、硬化前のｐＨが５より小さく、硬化後のｐＨが６〜８の範囲にあり、ＤＳＣによる発熱量から求められた硬化の際の反応比率が９０％以上であることを特徴とする。 The epoxy adhesive composition according to the present invention is an epoxy adhesive composition used for joining a metal having an oxide film on its surface, and includes an epoxy resin and an organic acid that does not have water solubility, and is cured. The previous pH is less than 5, the pH after curing is in the range of 6 to 8, and the reaction ratio at the time of curing obtained from the calorific value by DSC is 90% or more.
本発明に係るエポキシ系接着剤組成物のある特定の局面では、前記水溶性を有しない有機酸が酸無水物である。 On the specific situation with the epoxy adhesive composition which concerns on this invention, the said organic acid which does not have water solubility is an acid anhydride.
本発明に係るエポキシ系接着剤組成物の他の特定の局面では、前記エポキシ基に対し、前記酸無水物が０．３〜０．９当量比の範囲で含まれている。 In another specific aspect of the epoxy adhesive composition according to the present invention, the acid anhydride is included in a range of 0.3 to 0.9 equivalent ratio with respect to the epoxy group.
本発明に係る接合方法は、本発明のエポキシ系接着剤組成物を用いて、酸化皮膜を有する金属を接合することを特徴とする。 The joining method according to the present invention is characterized by joining a metal having an oxide film using the epoxy adhesive composition of the present invention.
また、上記酸化皮膜を有する金属が半田である場合には、半田表面の酸化皮膜が上記エポキシ系接着剤組成物中の有機酸により除去される。 When the metal having the oxide film is solder, the oxide film on the solder surface is removed by the organic acid in the epoxy adhesive composition.
本発明に係る接合方法のさらに他の特定の局面では、前記酸化膜を表面に有する金属が、電子部品に固着された半田バンプであり、半田バンプに前記エポキシ系接着剤組成物エポキシを接触させた後に、半田バンプを加熱により溶融し、しかる後硬化させることにより、電子部品が半田バンプにより部材に接合される。 In still another specific aspect of the joining method according to the present invention, the metal having the oxide film on the surface thereof is a solder bump fixed to an electronic component, and the epoxy adhesive composition epoxy is brought into contact with the solder bump. After that, the solder bump is melted by heating and then cured, whereby the electronic component is joined to the member by the solder bump.
本発明に係るエポキシ系接着剤組成物は、酸化膜を表面に有する金属の接合に用いられる。この場合、酸化膜を表面に有する金属は特に限定されず、例えば、前述した半田バンプなどの半田、あるいはＣｕ、Ａｌなどが挙げられる。また、本発明に係るエポキシ系接着剤組成物は、上記酸化膜を表面に有する金属をエポキシ系接着剤の接着力により直接接合してもよいが、例えば酸化物を表面に有する金属を溶融し、硬化し、金属の接合力を利用する場合には、エポキシ系接着剤組成物は、金属による接合力を補助するように作用する。 The epoxy adhesive composition according to the present invention is used for joining metals having an oxide film on the surface. In this case, the metal having an oxide film on the surface is not particularly limited, and examples thereof include solder such as the solder bump described above, Cu, Al, and the like. In addition, the epoxy adhesive composition according to the present invention may directly bond the metal having the oxide film on the surface by the adhesive force of the epoxy adhesive. For example, it melts the metal having the oxide on the surface. In the case of curing and utilizing the bonding force of metal, the epoxy adhesive composition acts to assist the bonding force of the metal.
すなわち、本発明において、「酸化膜を表面に有する金属の接合に用いられる」なる表現は、エポキシ系接着剤による接着だけでなく、金属自体の接合力を利用した場合におい、補助的にエポキシ系接着剤組成物が接着作用を発現する場合をも含むものとする。このような補助的にエポキシ系接着剤組成物の接着力が発現する場合とは、半田バンプによる電子部品素子の電極への接合用途などが挙げられる。このような特定の用途における接合方法自体は後ほど詳述することとする。 In other words, in the present invention, the expression “used for bonding a metal having an oxide film on its surface” is not limited to bonding with an epoxy adhesive, but also when using the bonding force of the metal itself, and an auxiliary epoxy type. The case where the adhesive composition exhibits an adhesive action is also included. Examples of the case where the adhesive strength of the epoxy adhesive composition is developed in an auxiliary manner include a use for joining an electronic component element to an electrode by a solder bump. The bonding method itself in such a specific application will be described in detail later.
上記エポキシ系接着剤組成物は、接着成分として、エポキシ樹脂を含む。エポキシ樹脂としては特に限定されず、ビスフェノールＡ型エポキシ樹脂、ビスフェノールＦ型エポキシ樹脂、グリシジル型エポキシ樹脂、フェノールノボラック型エポキシ樹脂などの様々な種類のエポキシ樹脂を挙げることができる。 The said epoxy-type adhesive composition contains an epoxy resin as an adhesive component. The epoxy resin is not particularly limited, and examples thereof include various types of epoxy resins such as bisphenol A type epoxy resin, bisphenol F type epoxy resin, glycidyl type epoxy resin, and phenol novolac type epoxy resin.
また、本発明に係るエポキシ系接着剤組成物は、好ましくは、エポキシ樹脂を硬化させる硬化剤を含有する。このような硬化剤としては、特に限定されず、従来よりエポキシ樹脂の硬化剤としては汎用されている、フェノール系硬化剤、ポリアミノアミド系硬化剤、酸及び酸無水物系硬化剤、イミダゾール系硬化剤などが挙げられる。 The epoxy adhesive composition according to the present invention preferably contains a curing agent that cures the epoxy resin. Such a curing agent is not particularly limited, and is conventionally used as a curing agent for epoxy resins, phenolic curing agent, polyaminoamide curing agent, acid and acid anhydride curing agent, imidazole curing. Agents and the like.
なお、上述したように、本発明においては、必須成分として、水溶性を有しない有機酸が含有されている。水溶性を有しない有機酸が、エポキシ樹脂の硬化剤として作用していてもよい。 In addition, as mentioned above, in this invention, the organic acid which does not have water solubility is contained as an essential component. An organic acid that does not have water solubility may act as a curing agent for the epoxy resin.
上記水溶性を有しない有機酸としては、例えば、有機系の酸無水物が挙げられ、このような有機系の酸無水物としては、トリアルキルテトラヒドロ無水フタル酸などの酸無水物、あるいはフェノールなどの水溶性を有しない弱酸性の有機酸が挙げられる。上記水溶性を有しない有機酸が配合されており、それによって本発明のエポキシ系接着剤組成物は、硬化前のｐＨが５よりも小さくされている。従って、上記水溶性を有しない有機酸は、硬化前のエポキシ樹脂組成物のｐＨが５より小さくなるようにその種類及び含有割合が好ましくは選ばれる。 Examples of the organic acid having no water solubility include organic acid anhydrides. Examples of such organic acid anhydrides include acid anhydrides such as trialkyltetrahydrophthalic anhydride, phenols, and the like. And weakly acidic organic acids having no water solubility. The organic acid which does not have the said water solubility is mix | blended, and, as for the epoxy-type adhesive composition of this invention, pH before hardening is made smaller than five. Accordingly, the type and content of the organic acid having no water solubility are preferably selected so that the pH of the epoxy resin composition before curing is less than 5.
また、本発明に係るエポキシ系接着剤組成物は、硬化前のｐＨが５よりも小さく、酸性であるため、酸化膜を表面に有する金属に接触されると、酸化膜を除去する作用を発現する。よって、酸化膜を表面に有する金属の接合に際し、予め本発明に係るエポキシ系接着剤組成物を該金属の表面に接触させることにより、酸化膜を除去でき、該金属の接合を確実に行うことができる。 In addition, since the epoxy adhesive composition according to the present invention has an acidic pH lower than 5 and is acidic, it exhibits an action of removing the oxide film when contacted with a metal having an oxide film on the surface. To do. Therefore, when joining a metal having an oxide film on the surface, the oxide film can be removed by bringing the epoxy adhesive composition according to the present invention into contact with the surface of the metal in advance, and the metal is reliably joined. Can do.
他方、本発明に係るエポキシ系接着剤組成物は、硬化後のｐＨは６〜８の範囲にある。従って、硬化後には、強い酸性条件下による接着作用は発現しないため、経時により、接着剤硬化物として接触する金属材料などの腐食が生じ難い。 On the other hand, the epoxy adhesive composition according to the present invention has a pH after curing in the range of 6-8. Therefore, after curing, an adhesive action under strong acidic conditions does not appear, and corrosion of a metal material or the like that comes in contact as a cured adhesive is less likely to occur over time.
また、本発明に係るエポキシ系接着剤組成物では、ＤＳＣ（示差操作型熱量計）による発熱量から求められた硬化の際の反応率が９０％以上である。この反応率が９０％未満では、水溶性を有しない有機酸の反応による消費が十分でなく、接着剤硬化物と接触している電極などの金属が経時による腐食するおそれがある。好ましくは、上記反応比率は９５％以上である。 Moreover, in the epoxy-type adhesive composition which concerns on this invention, the reaction rate in the case of hardening calculated | required from the emitted-heat amount by DSC (differential operation type calorimeter) is 90% or more. If the reaction rate is less than 90%, consumption due to the reaction of an organic acid that does not have water solubility is not sufficient, and a metal such as an electrode that is in contact with the cured adhesive may corrode over time. Preferably, the reaction ratio is 95% or more.
上記水溶性を有しない有機酸とは、好ましくは、上記酸無水物が用いられ、その場合、より好ましくは、エポキシ基に対し、酸無水物が０．３〜０．９当量比の範囲で含まれる。０．３当量比未満では、酸化膜を除去する効果が十分でないことがあり、０．９当量比を超えると、酸無水物が硬化後に残存し、反応比率が十分に低くならず、経時により電極等の他の金属の腐食を引き起こすおそれがある。 As the organic acid having no water solubility, the acid anhydride is preferably used. In this case, the acid anhydride is more preferably within a range of 0.3 to 0.9 equivalent ratio to the epoxy group. included. If the ratio is less than 0.3 equivalents, the effect of removing the oxide film may not be sufficient. If the ratio exceeds 0.9 equivalents, the acid anhydride remains after curing, and the reaction ratio is not sufficiently low. It may cause corrosion of other metals such as electrodes.
より好ましくは、上記酸無水物の配合割合は、０．５〜０．８５当量比である。 More preferably, the blending ratio of the acid anhydride is 0.5 to 0.85 equivalent ratio.
本発明に係るエポキシ系接着剤組成物では、上記硬化剤の他、本発明の課題達成を阻害しない範囲で、他の硬化促進剤、様々な添加剤を添加することができる。このような硬化促進剤としては、イミダゾール等などが挙げられ、添加剤としては、シランカップリング剤などを挙げることができる。 In the epoxy adhesive composition according to the present invention, in addition to the above curing agent, other curing accelerators and various additives can be added as long as the object of the present invention is not impaired. Examples of such curing accelerators include imidazole and the like, and examples of additives include silane coupling agents.
本発明に係る接合方法は、本発明エポキシ系接着剤組成物を用いて、酸化被膜を有する金属を接合することを特徴とする。 The bonding method according to the present invention is characterized in that a metal having an oxide film is bonded using the epoxy adhesive composition of the present invention.
この場合、本発明のある特定の局面では、酸化被膜を有する金属として半田が用いられる。半田は、前述したように、通常表面に酸化被膜を有する。そして、酸化被膜が存在すると、溶融されたとしても、半田の濡れ性が十分でなくなり、半田による接合を確実に行い得ないことがある。これに対して、本発明に係るエポキシ系接着剤を半田に予め接触させた場合には、半田表面の酸化被膜が除去されることになる。従って、半田を加熱により溶融した場合、濡れ性が高められ、該半田の溶融・硬化により、接合すべき部材同士が確実に接合され、しかも、該部材同士が本発明のエポキシ系接着剤組成物の硬化物によっても接合され、接合すべき部材同士の接合強度が効果的に高められる。 In this case, in a specific aspect of the present invention, solder is used as the metal having an oxide film. As described above, the solder usually has an oxide film on the surface. If an oxide film is present, even if it is melted, the solder wettability may not be sufficient, and soldering may not be performed reliably. On the other hand, when the epoxy adhesive according to the present invention is previously brought into contact with the solder, the oxide film on the solder surface is removed. Accordingly, when the solder is melted by heating, the wettability is improved, and the members to be joined are reliably joined by melting and curing of the solder, and the members are bonded to each other by the epoxy adhesive composition of the present invention. It is joined also by the hardened | cured material of, and the joining strength of the members which should be joined is raised effectively.
特に、本発明では、電子部品素子を実装基板上に搭載する用途に、本発明の接合方法を効果的に用いることができる。この接合方法では、電子部品素子の下面に予め半田バンプが形成されている。そして、実装基板上に本発明に係るエポキシ系接着剤組成物を塗布し、しかる後、該エポキシ系接着剤組成物を押し退けるように半田バンプ側から電子部品素子を実装基板上に搭載する。エポキシ系接着剤組成物に接触し、かつ該エポキシ系接着剤組成物を押し退けつつ半田バンプが実装基板上の電極に当接される。従って、半田バンプ表面の酸化被膜が確実にエポキシ系接着剤組成物中の有機酸の作用により除去される。 In particular, in the present invention, the bonding method of the present invention can be effectively used for applications in which electronic component elements are mounted on a mounting substrate. In this joining method, solder bumps are formed in advance on the lower surface of the electronic component element. Then, the epoxy adhesive composition according to the present invention is applied on the mounting substrate, and then the electronic component element is mounted on the mounting substrate from the solder bump side so as to push away the epoxy adhesive composition. The solder bumps are brought into contact with the electrodes on the mounting substrate while being in contact with the epoxy adhesive composition and pushing away the epoxy adhesive composition. Therefore, the oxide film on the surface of the solder bump is reliably removed by the action of the organic acid in the epoxy adhesive composition.
そして、加熱により、半田バンプを溶融し、固化し、半田による接合を果たす。この場合、半田の濡れ性が高められ、半田による接合が確実に行われる。 Then, the solder bumps are melted and solidified by heating, and the solder is joined. In this case, the wettability of the solder is improved, and the joining by the solder is surely performed.
また、上記エポキシ系接着剤組成物が硬化されると、該エポキシ系接着剤組成物の接着力によっても、上記電子部品素子と実装基板とが強固に接合されることになる。 In addition, when the epoxy adhesive composition is cured, the electronic component element and the mounting substrate are firmly bonded also by the adhesive force of the epoxy adhesive composition.
なお、エポキシ系接着剤組成物の硬化は、半田バンプの溶融加熱に際しての熱による熱硬化を利用してもよく、半田による接合とは別途エポキシ系接着剤組成物を熱硬化させるように加熱を行ってもよく、あるいは光硬化などを利用してエポキシ系接着剤組成物を硬化させてもよい。 The epoxy adhesive composition may be cured by using heat curing by heat at the time of melting and heating the solder bumps, and heating is performed so that the epoxy adhesive composition is thermally cured separately from the solder bonding. The epoxy adhesive composition may be cured using photocuring or the like.
よって、上記電子部品素子としては、半導体素子などの様々な電子部品素子を挙げるとこができる。 Therefore, examples of the electronic component element include various electronic component elements such as semiconductor elements.
なお、半田バンプ以外のＣｕバンプなどの酸化被膜を表面に有する他の金属バンプを用いた接合方法にも本発明のエポキシ系接着剤組成物を用いることができる。 The epoxy adhesive composition of the present invention can also be used in a bonding method using other metal bumps having an oxide film on the surface such as Cu bumps other than solder bumps.
さらに、金属バンプに限らず、バンプ以外の金属材料であって、表面に酸化被膜を有する部分の他の部材との接合にも、本発明に係るエポキシ系接着剤組成物を効果的に用いることができる。 Furthermore, the epoxy adhesive composition according to the present invention is effectively used not only for metal bumps but also for joining with other members of metal materials other than bumps and having an oxide film on the surface. Can do.
本発明に係るエポキシ系接着剤組成物では、エポキシ樹脂と、水溶性を有しない有機酸とを含み、硬化前のｐＨが５より小さく、硬化後のｐＨが６〜８の範囲にあり、ＤＳＣによる発熱量から求められた反応比率が９０％以上であるため、硬化前には、酸化膜を表面に有する金属と接触されると、該酸化膜を確実に除去することができる。従って、該酸化膜を表面に有する金属の接合を確実に行うことができる。他方、硬化後には、ｐＨは６〜８の範囲にあるため、経時により硬化物に接触している金属が腐食し難い。特に、上記反応比率が９０％以上であるため、有機酸が十分に消費されて、硬化が行われているので、長期間高温・高湿度下に放置された場合であっても、硬化物に接触している金属等の腐食が生じ難い。 The epoxy adhesive composition according to the present invention includes an epoxy resin and an organic acid that does not have water solubility, has a pH before curing of less than 5, and a pH after curing in the range of 6 to 8, DSC Since the reaction ratio obtained from the amount of heat generated by is 90% or more, the oxide film can be surely removed when it comes into contact with the metal having the oxide film on the surface before curing. Therefore, the metal having the oxide film on the surface can be reliably bonded. On the other hand, since the pH is in the range of 6 to 8 after curing, the metal in contact with the cured product is less likely to corrode over time. In particular, since the reaction ratio is 90% or more, the organic acid is sufficiently consumed and curing is performed, so that even when left in a high temperature and high humidity for a long time, Corrosion of metal in contact is difficult to occur.
水溶性を有しない有機酸が酸無水物である場合には、酸化被膜を有する金属の酸化被膜を確実に除去することができるとともに、硬化後には、酸無水物が容易に分解し、酸無水物による金属の腐食等を効果的に防止することができる。特に、酸無水物が、エポキシ基に対し、０．３〜０．９当量比の範囲で含有されている場合には、酸化膜を確実に除去することができるとともに、硬化物に接触している金属の経時による腐食をより確実に防止することができる。 When the organic acid that does not have water solubility is an acid anhydride, the metal oxide film having an oxide film can be reliably removed, and after curing, the acid anhydride is easily decomposed and the acid anhydride is decomposed. It is possible to effectively prevent metal corrosion caused by objects. In particular, when the acid anhydride is contained in the range of 0.3 to 0.9 equivalent ratio with respect to the epoxy group, the oxide film can be surely removed and the cured product is brought into contact with the cured product. It is possible to more reliably prevent the corrosion of the metal being aged over time.
よって、エポキシ系接着剤組成物を用いた本発明の接合方法では、酸化膜を表面に有する金属に該エポキシ系接着剤組成物を接触させた後に、酸化被膜を確実に除去して接合を確実に行うことができるとともに、経時による金属等の腐食が生じ難い。 Therefore, in the joining method of the present invention using the epoxy adhesive composition, after the epoxy adhesive composition is brought into contact with the metal having the oxide film on the surface, the oxide film is surely removed to ensure the joining. In addition, it is difficult to cause corrosion of metals and the like over time.
また、酸化被膜を表面に有する金属が半田である場合、半田は通常酸化膜を表面に有するので、本発明に係る接合方法の場合では、上記エポキシ系接着剤組成物中の有機酸の作用により酸化膜が確実に除去されるので、半田による接合に際しての半田の濡れ性を効果的に高めることができる。よって、半田による接合を確実に行うことができる。 Further, when the metal having an oxide film on the surface is a solder, the solder usually has an oxide film on the surface. Therefore, in the case of the joining method according to the present invention, the action of the organic acid in the epoxy adhesive composition is used. Since the oxide film is reliably removed, the wettability of the solder at the time of joining with the solder can be effectively enhanced. Therefore, joining with solder can be performed reliably.
特に、酸化膜を表面に有する金属が、電子部品に付着された半田バンプであり、電子部品を半田バンプに本発明のエポキシ系接着剤組成物を用いて接合する場合には、該半田バンプの酸化膜が確実に除去され、半田バンプによる接合が確実に行われる。しかも、本発明に係るエポキシ系接着剤組成物の硬化物により、電子部品が実装基板の電極等に確実に接合される。 In particular, the metal having an oxide film on the surface is a solder bump attached to an electronic component, and when the electronic component is bonded to the solder bump using the epoxy adhesive composition of the present invention, The oxide film is surely removed, and bonding by solder bumps is reliably performed. And the electronic component is reliably joined to the electrode etc. of a mounting board | substrate with the hardened | cured material of the epoxy-type adhesive composition which concerns on this invention.
以下、本発明の具体的な実施例を説明することにより、本発明を明らかにする。なお、本発明は以下の実施例に限定されるものではない。 Hereinafter, the present invention will be clarified by describing specific examples of the present invention. In addition, this invention is not limited to a following example.
（使用した材料）
（１）エポキシ化合物
エポキシ基含有アクリルポリマー：日本油脂社製、品番：ＣＰ−３０、重量平均分子量１００００、エポキシ当量５００
ジシクロペンタジエン型エポキシ化合物：大日本インキ社製、品番：ＨＰ７２００
ナフタレン型エポキシ：大日本インキ社製、品番：ＨＰ４０３２Ｄ
（２）硬化剤
トリアルキルテトラヒドロ無水フタル酸：ＪＥＲ社製、品番：ＹＨ−３０７
フェノール系硬化剤：ＪＥＲ社製、品番：ＰＲ−ＨＦ−３
ジシアンジアミド系硬化剤：旭電化社製、品番：ＥＨ３６３６ＡＳ
（３）硬化促進剤
イミダゾール系硬化剤：四国化成工業社製、品番：２ＭＡＯＫ
イミダゾール系硬化剤：四国化成工業社製、品番：２Ｅ４ＭＺ
カルボン酸イミダゾール硬化剤：四国化成社製、品番：２ＰＺ−ＣＮＳ
マイクロカプセル型潜在性硬化剤：旭化成社製、品番：ＨＸ３７４８
（４）フラックス
ロジン：荒川化学社製、品番：アビチエン酸
（５）シランカップリング剤
アミノシランカップリング剤：チッソ社製、品番：Ｓ３２０
(Materials used)
(1) Epoxy compound Epoxy group-containing acrylic polymer: manufactured by NOF Corporation, product number: CP-30, weight average molecular weight 10,000, epoxy equivalent 500
Dicyclopentadiene type epoxy compound: manufactured by Dainippon Ink Co., Ltd., product number: HP7200
Naphthalene type epoxy: manufactured by Dainippon Ink, product number: HP4032D
(2) Curing agent Trialkyltetrahydrophthalic anhydride: manufactured by JER, product number: YH-307
Phenol-based curing agent: manufactured by JER, product number: PR-HF-3
Dicyandiamide-based curing agent: manufactured by Asahi Denka Co., Ltd., product number: EH3636AS
(3) Curing accelerator Imidazole-based curing agent: manufactured by Shikoku Kasei Kogyo Co., Ltd., product number: 2MAOK
Imidazole-based curing agent: manufactured by Shikoku Kasei Kogyo Co., Ltd., product number: 2E4MZ
Carboxylic acid imidazole curing agent: manufactured by Shikoku Kasei Co., Ltd., product number: 2PZ-CNS
Microcapsule type latent curing agent: manufactured by Asahi Kasei Corporation, product number: HX3748
(4) Flux Rosin: manufactured by Arakawa Chemical Co., product number: abitienic acid (5) Silane coupling agent Aminosilane coupling agent: manufactured by Chisso Co., product number: S320
（実施例１）
下記の表１に示すように、エポキシ樹脂として、エポキシ樹脂Ａ（エポキシ基含有アクリルポリマー、日本油脂社製、品番：ＣＰ−３０）４０重量部と、ジシクロペンタジエン型エポキシ樹脂（大日本インキ社製、品番：ＨＰ７２００）２０重量部と、ナフタレン型エポキシ樹脂（大日本インキ社製、品番：ＨＰ４０３２Ｄ）７６重量部と、硬化剤としてトリアルキルテトラヒドロ無水フタル酸（ＪＥＲ社製、品番：ＹＨ−３０７）６０重量部と、硬化促進剤としてイミダゾール（四国化成社製、品番：２ＭＡＯＫ）４重量部と、シランカップリング剤（チッソ社製、アミノシランカップリング剤、品番：Ｓ３２０）２重量部とを含む組成物を混練し、エポキシ系接着剤組成物を用意した。
Example 1
As shown in Table 1 below, as an epoxy resin, epoxy resin A (epoxy group-containing acrylic polymer, manufactured by Nippon Oil & Fats Co., Ltd., product number: CP-30) 40 parts by weight and dicyclopentadiene type epoxy resin (Dainippon Ink Co., Ltd.) Product, product number: HP7200), 20 parts by weight of a naphthalene type epoxy resin (manufactured by Dainippon Ink and product number: HP4032D), and trialkyltetrahydrophthalic anhydride (manufactured by JER, product number: YH-307) as a curing agent. ) 60 parts by weight, 4 parts by weight of imidazole (manufactured by Shikoku Chemicals, product number: 2MAOK) as a curing accelerator, and 2 parts by weight of a silane coupling agent (manufactured by Chisso, aminosilane coupling agent, product number: S320) The composition was kneaded to prepare an epoxy adhesive composition.
上記エポキシ系接着剤組成物１ｇをガラス瓶に入れ、該ガラス瓶中にイオン交換水１０ｍｌを入れ、室温で一昼夜浸透した。しかる後、ガラス瓶中の液体をｐＨをｐＨメータにて測定した。 1 g of the above epoxy adhesive composition was put in a glass bottle, 10 ml of ion-exchanged water was put in the glass bottle and permeated at room temperature all day and night. Thereafter, the pH of the liquid in the glass bottle was measured with a pH meter.
次に、上記のようにして用意したエポキシ系接着剤組成物を別途１７０℃のオーブンに３０分間養生し、熱硬化し、硬化物サンプルを得た。この硬化物サンプルを凍結粉砕手法により粉砕し、フッ化エチレン樹脂からなる加圧容器中に粉砕された硬化物１ｇを投入し、イオン交換水１０ｍｌを入れ、１２０℃のオーブンで加熱しつつ、２４時間浸透した。しかる後、放冷し、硬化前のｐＨを測定した方法と同様にして硬化後のｐＨを測定した。 Next, the epoxy adhesive composition prepared as described above was separately cured in an oven at 170 ° C. for 30 minutes and thermally cured to obtain a cured product sample. This cured product sample was pulverized by a freeze pulverization method, 1 g of the pulverized cured product was put into a pressurized container made of a fluoroethylene resin, 10 ml of ion-exchanged water was added, and the sample was heated in an oven at 120 ° C. while being heated. Time penetrated. Thereafter, it was allowed to cool, and the pH after curing was measured in the same manner as the method for measuring the pH before curing.
上記エポキシ系接着剤組成物を３℃／分の昇温速度で−４０℃＋２５０℃の温度領域でＤＳＣにより測定を行った。発熱ピークは１００〜２００℃の範囲に現れるので、そのピークの面積を求めた。さらに、１７０℃のオーブン中で３０分間エポキシ系接着剤組成物を加熱養生し、同様にして、ＤＳＣによる発熱ピーク面積を測定した。加熱反応前の発熱ピークから求められた面積と、オーブン中で加熱養生した後の面積との比率を測定し、ＤＳＣで測定された発熱ピークによる反応比率を計算した。 The epoxy adhesive composition was measured by DSC in the temperature range of −40 ° C. + 250 ° C. at a temperature rising rate of 3 ° C./min. Since the exothermic peak appears in the range of 100 to 200 ° C., the area of the peak was determined. Further, the epoxy adhesive composition was heated and cured in an oven at 170 ° C. for 30 minutes, and the exothermic peak area by DSC was measured in the same manner. The ratio between the area obtained from the exothermic peak before the heating reaction and the area after heat curing in the oven was measured, and the reaction ratio due to the exothermic peak measured by DSC was calculated.
他方、上記エポキシ系接着剤組成物を用い、電子部品チップを実装基板（ガラスエポキシからなる基板であって、基板表面に金メッキにより電極が形成されている）に実装した。より具体的には、１７２本の半田バンプが下面に高密度に形成されている１ｃｍ角の電子部品チップを用意し、上記基板上にエポキシ系接着剤組成物を十分電極を覆う程度塗布し、上記電子部品チップを搭載し、２６０℃及び２０秒の条件で加熱し、接合した。接合後に、電子部品チップ側と実装基板側との導通抵抗値すなわち半田バンプによる接合部分の導通抵抗に相当する導通抵抗値を測定した。併せて、Ｘ線透過装置により、上記半田バンプの接合部分における半田の濡れ性を写真により評価した。 On the other hand, the electronic component chip was mounted on a mounting substrate (a substrate made of glass epoxy, with electrodes formed by gold plating on the surface of the substrate) using the epoxy adhesive composition. More specifically, a 1 cm square electronic component chip in which 172 solder bumps are formed on the lower surface with high density is prepared, and an epoxy adhesive composition is applied on the substrate so as to sufficiently cover the electrodes, The electronic component chip was mounted, and heated and bonded under the conditions of 260 ° C. and 20 seconds. After joining, the conduction resistance value between the electronic component chip side and the mounting substrate side, that is, the conduction resistance value corresponding to the conduction resistance of the joined portion by the solder bump was measured. At the same time, the wettability of the solder at the joint portion of the solder bump was evaluated by a photograph using an X-ray transmission device.
また、別途、ポリイミドフィルム上に、Ｌ／Ｓ比（ラインアンドスペース比）３０μｍ／３０μｍとなるようにくし形配線電極をフォトレジスト法により形成した。このくし型配線電極上に、エポキシ系接着剤組成物を約１０μｍの厚みとなるように塗布し、さらに表面を無アルカリガラスで被覆し、ホットプレート上で２００℃の温度で１分間加熱し、養生硬化した。しかる後、くし型配線電極の一方電位に接続される側の端部と、他方電位に接続される側の端部との間に、５Ｖの電圧を印加し、１２０℃及び相対湿度８５％の環境の中で１００時間放置した。この高温高湿度放置試験終了後に、絶縁抵抗値を測定した。高温高湿度放置試験前の絶縁抵抗値からの絶縁抵抗値の変化を求めるとともに、光学的に観察し、くし型電極表面の良・不良を評価した。 Separately, a comb wiring electrode was formed on a polyimide film by a photoresist method so as to have an L / S ratio (line and space ratio) of 30 μm / 30 μm. On this comb-type wiring electrode, an epoxy adhesive composition was applied to a thickness of about 10 μm, the surface was further coated with alkali-free glass, and heated on a hot plate at a temperature of 200 ° C. for 1 minute, Cured and cured. Thereafter, a voltage of 5 V is applied between the end of the comb-shaped wiring electrode connected to one potential and the end connected to the other potential, and the temperature is 120 ° C. and the relative humidity is 85%. Left in the environment for 100 hours. The insulation resistance value was measured after the high temperature and high humidity standing test. A change in the insulation resistance value from the insulation resistance value before the high-temperature and high-humidity standing test was obtained, and optical observation was performed to evaluate the quality of the comb electrode surface.
結果を下記の表１に示す。 The results are shown in Table 1 below.
（実施例２〜４及び比較例１〜６）
使用したエポキシ樹脂及び硬化剤の種類及び配合割合を下記の表１に示すように変更したことを除いては、実施例１と同様にしてエポキシ系接着剤組成物を作製し、同様にして評価した。結果を下記の表１に示す。
(Examples 2 to 4 and Comparative Examples 1 to 6)
An epoxy adhesive composition was prepared in the same manner as in Example 1 except that the type and blending ratio of the epoxy resin and curing agent used were changed as shown in Table 1 below, and evaluated in the same manner. did. The results are shown in Table 1 below.
表１から明らかなように、比較例１〜６では、水溶性を有しない有機酸が配合されていないため、高温高湿度放置試験後において、電極の銅が腐食しており、特に比較例１では、陽極の銅も腐食していた。これに対し、実施例１〜４では、高温高湿度下に放置された後においても、電極の腐食はみられず、また絶縁抵抗値も１０10Ωであった。 As is apparent from Table 1, in Comparative Examples 1 to 6, since an organic acid that does not have water solubility is not blended, the copper of the electrode is corroded after the high temperature and high humidity standing test. Then, the copper of the anode was also corroded. On the other hand, in Examples 1 to 4, the electrode was not corroded even after being left under high temperature and high humidity, and the insulation resistance value was 10 10 Ω.
一方、比較例１〜４では、高温高湿度放置試験終了後の絶縁抵抗値が１０4Ωまたは１０5Ωと低下していた。また、比較例４では、半田接合試験において、導通抵抗が高く、半田の濡れ性が十分でないため、電子部品チップが基板に確実に接合されていなかった。これは、硬化剤が十分に配合されていなことによると思われる。 On the other hand, in Comparative Examples 1 to 4, the insulation resistance value after completion of the high-temperature and high-humidity test was reduced to 10 4 Ω or 10 5 Ω. In Comparative Example 4, in the solder joint test, the conduction resistance was high and the solder wettability was not sufficient, so that the electronic component chip was not securely joined to the substrate. This seems to be because the curing agent is not sufficiently blended.
Claims (6)
The metal having the oxide film on the surface is a solder bump fixed to an electronic component. After the epoxy adhesive composition epoxy is brought into contact with the solder bump, the solder bump is melted by heating and then cured. The joining method according to claim 4, wherein the electronic component is joined to the member by a solder bump.
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