JP2007005429A - Circuit pattern forming method and apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent circuit malfunction such as short circuit caused by a satellite of liquid droplets, in a circuit pattern forming method for forming a circuit pattern by the formation of a liquid discharge head. <P>SOLUTION: In an apparatus for forming a circuit pattern 11 by a liquid discharge head 10, a pattern forming solution is discharged while controlling a relative position between the liquid discharge head 10 and a base member 1, such that a scanning direction of the liquid discharge head 10 is coincident with a longitudinal direction of each line segment pattern of the circuit pattern 11 in the formation. For example, when the circuit pattern 11 having line segment patterns A to D in four directions is formed, a satellite located in front of the scanning direction is prevented from arriving at the outside of the pattern by scanning the discharge head while rotating a rotation stage 7, such that the longitudinal direction of the respective line segment pattern is coincident with the scanning direction of the liquid discharge head 10. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a circuit pattern forming method and apparatus for forming a circuit pattern by a liquid ejection method.

  Conventionally, a subtractive method is generally used for circuit pattern formation on a circuit board. However, in recent years, a liquid ejection method such as an ink jet recording method that is relatively easy to cope with a variety of products and a small amount of production is used. A method for forming a circuit pattern by discharging a pattern forming solution onto a substrate has been proposed.

  For example, Patent Document 1 discloses an apparatus that forms a desired pattern on a substrate by relatively moving a substrate and a liquid ejector and ejecting droplets during the relative movement. In this apparatus, as shown in FIG. 12, a substrate (base material) 201 is mounted on an X direction moving table 202 and a Y direction moving table 203, and a droplet discharge device 205 fixed to an arm 204 is relative to the substrate 201. When the pattern is formed, the pattern forming ink 206 is ejected from the droplet ejector 205 toward the substrate 201 while moving the X direction moving table 202 and the Y direction moving table 203. Thus, a circuit pattern 207 having a desired shape is formed.

  However, in the above apparatus, it is necessary to form one circuit pattern at a time while controlling the moving table in the X and Y directions, and it takes a lot of time to form all circuit patterns. Therefore, in order to shorten the formation time, Patent Document 2 uses a multi-nozzle head in which a large number of nozzles for discharging droplets are arranged. In the multi-nozzle head, as shown in FIG. 13A, a plurality of nozzles 101 are arranged in a line over a length L in one liquid discharge head 100, and each nozzle 101 is selectively used. It is possible to discharge droplets. The pattern formation using the multi-nozzle head is performed as follows.

In the case of forming the pattern 110 as shown in FIG. 13B, when a liquid droplet is ejected while the liquid ejection head 100 scans from the left to the right in the figure, the nozzle as shown in FIG. A part 111 of the pattern 110 can be formed by one scan for a range having the same length as the length L of the column. As described above, the method using the multi-nozzles can significantly reduce the formation time of all the patterns as compared with the method of forming all the patterns to be formed on the substrate one by one.
JP 62-181490 A JP 2004-342918 A

  In general, in a liquid discharge head such as an ink jet recording head, it is known that when a droplet is discharged from a nozzle, a small droplet called a satellite is discharged simultaneously with the main droplet. The ejection process of the ink jet recording head and the main droplet / satellite will be described in detail below.

  FIG. 14 is a sectional view showing the process of ejecting ink in the ink jet recording head. As shown in FIG. 14A, the ink is ejected from the liquid chamber 301 through the ink path 302 and ejected from the ejection port (nozzle) 303. Filled up to. The heater 304 is formed on the silicon substrate 305. The ink supplied to the liquid chamber 301 enters the ink path 302 by capillary force, and also acts to pull back the ink in the ink path 302 by negative pressure generated from a supply unit such as an ink tank. Therefore, when the recording is not performed, the both are stationary and remain stationary. At this time, the ink at the ejection port 303 forms a concave meniscus 306 by the negative pressure toward the liquid chamber 301.

  FIGS. 14B to 14F show the states of foaming, ejection, and meniscus when recording is actually performed with respect to the stationary state of FIG. When a recording operation is started and a voltage is applied to the heater 304, heat energy is generated from the heater 304, the ink in the ink path 302 is heated, and bubbles 307 are generated due to film boiling. The bubbles 307 continue to expand while the heater 304 generates heat, and the ink in the ink path 302 starts to move due to the expansion force.

  That is, the ink near the ejection port 303 breaks off the meniscus 306 and jumps out, and the ink near the liquid chamber 301 moves in a direction to return to the liquid chamber 301 (see FIG. 14B).

  When the voltage application to the heater 304 is stopped in a state where the ink is largely ejected from the ejection port 303, the bubble 307 contracts and the ink near the ejection port 303 is largely drawn into the ink path 302. At this time, the ejected ink is separated from the ink drawn into the ink path 302 and flies out from the ejection port 303. The flying ink becomes a main droplet 308 and a satellite 309 which is a group of small ink droplets following the main droplet 308, and these land on the recording medium (see FIG. 14C).

  After the defoaming, the meniscus 306 drawn into the ink path 302 by the capillary force moves again toward the ejection port 303, and the ink path 302 is refilled with ink (see FIG. 14D).

  The ink meniscus does not stop immediately even if it reaches the position in the vicinity of the discharge port, which was in the initial state, and does not stop immediately, but protrudes slightly outside the discharge port 303 (see FIG. 14E).

  When the ink is projected to a certain extent, it vibrates so that it is pulled again into the discharge port 303 by the surface tension of the ink and the negative pressure into the tank, and the vibration gradually attenuates and finally returns to a stationary state (FIG. 14). (Refer to (f)).

  In one recording operation, only one drop of the main droplet 308 is discharged, but one or more droplets of the satellite 309 are discharged. In addition, it is known that the size of the satellite 309 and the distance between the main droplet 308 and the distance from the main droplet 308 are different for each ejection port 303, and that there is a difference for each operation even in ejection from the same ejection port.

  In the circuit pattern forming method described above with reference to FIG. 13, there is a possibility that a malfunction of the circuit due to this satellite occurs, which will be described in detail below with reference to FIG. FIG. 15 shows the landing position relationship between the main droplet 103 and the satellite 104 when a droplet of the pattern forming solution is discharged from the nozzle 101 of the liquid discharge head 100 during scanning. As shown in b), droplets are ejected while the liquid ejection head 100 and the substrate 102 are moved relatively to form a pattern. FIG. 15C shows the shape of a droplet formed on the substrate 102 by one ejection operation. In the relative movement in FIG. 15, the base material 102 is fixed, and the liquid ejection head 100 is moved from the left to the right in the figure.

  As shown in FIG. 15A, when a liquid droplet is ejected from the nozzle 101 during scanning of the liquid ejection head 100, the liquid droplet head 100 moves in the right direction, so that the main droplet 103 moves in the lower right direction. To fly. Then, as shown in FIG. 15B, one or more satellites 104 are formed as the main droplet 103 is discharged, and fly in the lower right direction like the main droplet 103. Since the satellite 104 is formed later than the main droplet 103, as shown in FIG. 15C, the landing position on the substrate 102 is slightly shifted to the right side (forward in the scanning direction) from the main droplet 103. It becomes the position. Conversely, when the scanning direction is leftward, the satellite 104 lands on the left side of the main droplet 103. The distance D between the landing positions of the main droplet 103 and the satellite 104 varies depending on the scanning speed of the head, the ejection speed of each droplet, the volume of each droplet, the component of the droplet, the distance from the nozzle to the substrate, and the like. To do.

  Next, a process of forming a pattern by continuously discharging droplets will be described with reference to FIG. 16A to 16D show the case where the scanning direction of the head and the longitudinal direction of the pattern are parallel, and FIG. 16E shows the case where they are orthogonal to each other. FIG. 16A shows a state in which the first discharged droplet has landed on the pattern formation region 120. Although the ejection operation is performed once, satellites are formed as the main droplets are ejected as described above, so that the landing state is a plurality of landing droplets of the main droplet 103 and the satellite 104 as illustrated. FIG. 16B shows a state where the second droplet has landed. In the second drop, the main drop 105 and satellite 106 land in the same manner as the first drop, but the second drop main drop 105 lands so as to overlap the first drop satellite 104. As shown in FIG. 16C, when the distance between the landing positions of the first main droplet 103 and the satellite 104 is further away, the second main droplet 105 is the first satellite. No overlap with 104. In that case, the third and subsequent main droplets land on the first satellite 104. Then, as shown in FIG. 16D, in the state where the discharge operation is repeated and landed over the entire pattern forming region 120, the ink is landed on the right end of the pattern forming region 120, that is, the end portion in the head scanning direction. The satellite 108 accompanying the main droplet 107 lands outside the pattern formation region 120.

  As shown in FIG. 16E, when the head scanning direction and the pattern longitudinal direction are orthogonal, a pattern is formed at a time by discharging droplets from a plurality of arranged nozzles. However, the satellite 109 of each droplet will land outside the pattern formation region 120.

  FIG. 17 explains a problem that may occur when an actual conductive pattern (circuit pattern) is formed. When the circuit pattern 110 of FIG. 13 is enlarged, the circuit pattern 110 is ejected and landed. Many satellites 113 formed with the main droplet 112 land outside the circuit pattern 110. As described above, the distance between the landing distances of the main droplet 112 and the satellite 113 varies from near to far. Depending on the landing state of the satellite 113, two patterns are electrically connected and the short-circuit portion 114 is connected. As a result, a malfunction occurs in the circuit operation of the circuit board.

  The present invention has been made in view of the above-mentioned unsolved problems of the prior art, and provides a circuit pattern forming method and apparatus capable of avoiding a circuit failure caused by a satellite.

  In order to achieve the above object, the circuit pattern forming method of the present invention is characterized by discharging the pattern forming solution from the nozzle of the liquid discharge head while scanning the liquid discharge head relative to the substrate. In a circuit pattern forming method for forming a circuit pattern on a substrate, the circuit pattern is divided into a plurality of line segment patterns, and the longitudinal direction of each of the plurality of line segment patterns is stored in a storage means; Forming the line segment pattern by causing the scanning direction of the liquid ejection head to coincide with the longitudinal direction, and the portion where the two line segment patterns are connected is the formation of one of the line segment patterns It is a starting end.

  The circuit pattern forming apparatus of the present invention discharges a pattern forming solution from the nozzle while causing a liquid discharge head having a nozzle for discharging droplets to the base material to scan relative to the base material. Accordingly, in the circuit pattern forming apparatus for forming a circuit pattern on the base material, a storage means for storing the longitudinal direction of each of the plurality of line segment patterns constituting the circuit pattern, and the longitudinal direction of the line segment pattern is the base direction. Means for controlling the relative position of the substrate and the liquid ejection head so as to coincide with the scanning direction of the liquid ejection head relative to the material.

  By incorporating the satellite generated in the scanning direction into the line segment pattern being formed, the disturbance of the pattern due to the satellite can be prevented, and a good circuit pattern free from short circuit or insulation failure can be efficiently formed.

  FIG. 1A is a schematic perspective view showing a circuit pattern forming apparatus according to an embodiment. A base material 1 for forming a circuit pattern to form a circuit board is fixed on a holding table 2. The substrate 1 has a planar shape such as a film shape, a sheet shape, or a plate shape, and is made of a thermoplastic resin film such as a polyester film, an aromatic polyamide film, or a polyimide film, or a glass fiber, a polyester fiber, or an aromatic material. A sheet made by impregnating and curing a thermoplastic resin or epoxy resin on a woven or non-woven fabric made of a group polyamide fiber, and a glass epoxy laminated board used for a normal circuit board.

  A liquid discharge head 10 that discharges a conductive solution (pattern forming solution) for forming a circuit pattern has a plurality of nozzles that are discharge openings in a row, and is placed in the carriage 3 together with a tank into which the solution is injected. It is attached. The number of nozzles of the liquid discharge head 10 is not plural, and a liquid discharge head having only one nozzle may be used. The liquid discharge head 10 can reciprocately scan along the slider 5 supported by the support column 4. The holding table 2 is installed on a rotary stage 7 which is a stage rotating means on the linear motion stage 6, and the solution is applied to a desired position on the substrate 1 by the operation of the linear motion stage 6 and the scanning of the liquid discharge head 10. Can be discharged.

The solution for forming the circuit pattern in the present embodiment contains conductive fine particles. For example, Ag or SnO ₂ metal colloid is used, but the present invention is not limited to these. Absent. In addition, from the viewpoint of uniformity and stability of the formed circuit pattern, the conductive fine particle diameter is preferably in the range of several tens to several hundreds of nm.

  As shown in FIG. 1B, the circuit pattern 11 to be formed is divided into linear line segment patterns. For example, a circuit pattern 11 constituted by a combination of four types of line segment patterns is divided into a line segment pattern A (A direction pattern) extending left and right, a line segment pattern B (B direction pattern) extending in a diagonally downward direction, and upper and lower Is divided into a line segment pattern C (C direction pattern) extending in the right direction and a line segment pattern D (D direction pattern) extending in the right direction.

  For example, in the circuit pattern 21 having the shape shown in FIG. 2A, the circuit pattern 21 is divided into linear line segment patterns 21 to 24 in the A to D directions at locations (edge portions) 21a where the pattern direction changes. That is, as shown in FIG. 2B, the circuit pattern 21 is divided into line segment patterns of an A direction pattern 22, a B direction pattern 23, a C direction pattern 24, and a D direction pattern 25. It should be noted that the edge portion 21a should be handled as follows.

  2C and 2D are enlarged views of the periphery of the edge portion 21a between the line segment patterns 22 and 23. FIG. In the figure, the pattern forming solution is landed for easy understanding. As shown in FIG. 2 (c), the droplet Q landing on the edge portion 21a has a bidirectional pattern of an end portion of the A direction pattern 22 and an end portion of the B direction pattern 23 as shown in FIG. However, if this droplet Q is overlapped with both patterns, two droplets are overlapped and landed when formed, and the pattern becomes locally thick. Therefore, it is necessary to divide the droplet Q corresponding to the edge portion 21a so as to belong to only one of the line segment patterns.

FIG. 3 is a diagram illustrating a method for forming each edge portion 21 a of the circuit pattern 21. As shown in FIG. 5A, the spot where the droplet Q ₁ corresponding to the edge portion between the A direction pattern and the B direction pattern is landed is treated as the formation start end of the B direction pattern to be formed next, (b The point where the droplet Q ₂ corresponding to the edge portion between the B direction pattern and the C direction pattern is landed is set as the formation start end of the C direction pattern. Similarly, C-direction pattern and location to land the droplets Q ₃ corresponding to the edge portion between the D direction pattern formation start end of the D direction pattern as shown in (c) of FIG. 3, D as (d) The spot where the droplet Q ₄ corresponding to the edge portion between the direction pattern and the A direction pattern is landed is treated as the formation start end of the A direction pattern. That is, the droplet Q shown in FIG. 2 is divided so as to be the formation start end of the B direction pattern 23.

  In this way, it is possible to effectively prevent the satellite from landing outside the pattern, and to avoid circuit problems such as a short circuit due to the satellite.

  Next, control of the apparatus shown in FIG. 1 will be described.

  As shown in FIG. 4, the control unit (stage control unit) of the circuit pattern forming apparatus is a base material 1 from, for example, a host device (a computer that serves as a data supply source such as a circuit pattern and serves as a data processing apparatus). Pattern data 12 to be formed above is stored in the pattern data storage unit 14a via the communication unit 13 of the present apparatus. Further, the direction-specific pattern storage unit 14b, which is a storage unit, divides the pattern data stored in the pattern data storage unit 14a into line segment patterns by the method described above, and stores each divided line segment pattern for each longitudinal direction. . The formation data storage unit 14c stores detailed data for actually forming a pattern based on the longitudinal direction data stored (stored) in the direction-specific pattern storage unit 14b.

  The CPU 15 controls all components in the apparatus, the stage control unit 16 outputs operation commands to the linear motion stage 6 and the rotary stage 7, and the carriage control unit 17 scans the carriage 3 of the liquid ejection head 10. The drive signal generator 18 controls and generates and outputs a drive signal for discharging droplets from the liquid discharge head 10.

  FIG. 5 is a flowchart for explaining a circuit pattern forming process according to the first embodiment, and FIG. 6 is a diagram showing a process of forming a pattern.

  In step S1 of FIG. 5, the circuit pattern 21 to be formed as shown in FIG. 6A is divided as shown in FIG. 5B by the above-described method, and the divided line segment patterns 22 to 25 are divided. Are stored in the direction-specific pattern storage unit 14b (step S2).

  In step S3, the formation (drawing) direction when forming (drawing) each of the line segment patterns 22 to 25 is determined. In this embodiment, as indicated by arrows in FIG. 6B, the A direction pattern 22 is from left to right, the B direction pattern 23 is from upper left to lower right, the C direction pattern 24 is from top to bottom, and the D direction pattern 25. Is formed from the lower left to the upper right.

  In step S4, each line segment pattern and formation direction data necessary for actual formation (drawing) is stored in the formation (drawing) data storage unit 14c based on the processing results performed in steps S1 to S3.

  In steps S5 to S7, the pattern to be formed (drawn) is repeated a total of four times from the A direction pattern to the D direction pattern, and the essential points will be described below.

  In step S5, a line segment pattern to be formed is selected. The rotary stage 7 is rotated so that the longitudinal direction of the pattern coincides with the scanning direction of the liquid ejection head 10 (step S6). Here, it is assumed that the A direction pattern is first formed.

  In step S7, only the line segment pattern to be formed (A direction pattern at this stage) is formed. FIG. 6C is an enlarged view when formed on the A-direction pattern 22 and represents the vicinity of the R portion of FIG. 6B. At this stage, the satellite 22b formed along with the main droplet 22a discharged and landed at the end portion in the forming direction has landed outside the A direction pattern 22.

  In step S8, it is determined whether or not the formation of line segment patterns 22 to 25 in all directions A to D is completed. If not completed, the process is repeated from the process of selecting the line segment pattern formed in step S5.

  Returning to step S5, a line segment pattern that has not yet been formed is selected. Here, description will be made assuming that the pattern to be formed is selected in the order of the B direction, the C direction, and the D direction. FIG. 6D shows a state in which the longitudinal direction of the B direction pattern 23 coincides with the scanning direction of the liquid ejection head 10 in step S6 and the B direction pattern 23 is formed in step S7. The first main droplet 23 a that has landed on the B-direction pattern 23 lands on the satellite 22 b that has landed outside the A-direction pattern 22. Similarly, the satellite 23b that has landed outside the B direction pattern 23 is hidden by the overlapping of the main droplets when the C direction pattern 24 is formed. When the formation of the D direction pattern 25 that is the fourth direction is completed, the formation of all patterns is completed.

  In this embodiment, the case where the selection of the line segment pattern to be formed is selected in order from the A direction to the D direction has been described. However, the order is not limited to this order. No problem. For example, in the case where the A direction pattern is formed after the B direction pattern is formed, as shown in FIG. 6E, the main droplet ejected and landed at the end of formation of the A direction pattern 22 formed later. The satellite 22b formed along with 22a is landed so as to overlap the first main droplet 23a of the B-direction pattern 23 formed previously. Therefore, regardless of the order in which the line segment patterns in each direction are formed, the satellite at the location where the line segment pattern is connected is hidden by the main droplet of the connected line segment pattern.

  Finally, when all the formed circuit patterns are fixed, the circuit board is completed. However, in order to obtain a circuit board having better characteristics, it is necessary to perform baking with a separately prepared baking apparatus. By baking at a temperature at which the metal colloid used as the conductive fine particles is sufficiently dissolved, the metal colloid is dissolved to form a metal bond, so that a circuit board with improved pattern conductivity can be formed.

  According to this embodiment, since the circuit pattern is not disturbed by the satellite, it is possible to form a good circuit pattern in which a circuit failure such as a short circuit does not occur.

  FIG. 7 is a flowchart for explaining a pattern formation (drawing) process according to the second embodiment. FIG. 8 is a diagram for explaining data processing for discharging a pattern forming solution from pattern data to be formed (drawn). FIG.

  In step S11, the circuit pattern 21 to be formed as shown in FIG. 8A is divided as shown in FIG. 8B by the method described above, and the longitudinal direction of each of the divided line segment patterns 22 to 25 is detected. Each direction is stored in the direction-specific pattern storage unit 14b (step S12).

  Next, in step S13, for each line segment pattern 22-25, as shown in FIG. 8C, the midpoints 32-35 in the longitudinal direction are detected, and each line segment pattern 22-25 is changed to (d). Split as shown. That is, the A direction pattern 22 is a left pattern 41 and a right pattern 42 that are divided patterns with an intermediate point 32 as a boundary, and the B direction pattern 23 is an upper left pattern 43 and a lower right pattern 44 that are divided patterns with an intermediate point 33 as a boundary. The C direction pattern 24 is divided into an upper pattern 45 and a lower pattern 46 which are divided patterns with the intermediate point 34 as a boundary, and the D direction pattern 25 is divided into an upper right pattern 47 and a lower left pattern 48 which are divided patterns with the intermediate point 35 as a boundary. Divided. The intermediate point described here is for the purpose of dividing each line segment pattern into two, and does not necessarily have to be a position for bisecting.

  Moreover, about the formation direction, it forms in the direction which goes to the midpoints 32-35 of each line segment pattern. For example, in the A direction pattern 22, the left pattern 41 is formed from left to right, which is the direction toward the intermediate point 32, and the right pattern 42 is formed from right to left.

  In step S14, each pattern obtained by dividing each line segment pattern necessary for the actual formation into two and the formation direction thereof are stored in the formation (drawing) data storage unit 14c based on the processing results performed in steps S11 to S13. .

  Next, a process of forming a pattern by discharging a pattern forming solution will be described with reference to FIG. In step S15, a line segment pattern to be formed is selected. Here, first, the A direction pattern is selected. Next, in step S <b> 16, the rotary stage 7 is driven so that the longitudinal direction of the A direction pattern 22 coincides with the reciprocating scanning direction of the liquid ejection head 10, as shown in FIG. Then, in step S17, as shown in FIG. 9B, when the liquid ejection head 10 performs forward scanning, it is formed from the left end of the A direction pattern 22 to the intermediate point 32, that is, the left pattern 41 of the A direction pattern 22. A pattern P1 is formed. Next, in step S18, as shown in FIG. 9C, in the backward scanning of the liquid ejection head 10, from the right end of the A direction pattern 22 to the intermediate point 32, that is, to the right pattern 42 of the A direction pattern 22. A formation pattern P2 is formed.

  Here, the pattern formation process in the vicinity of the intermediate point 32 when step S17 and step S18 are performed will be described with reference to FIG. FIG. 10A is a schematic cross-sectional view enlarging the vicinity of the intermediate point 32 of FIG. 9B, and droplets ejected to form the formation pattern P <b> 1 by forward scanning of the liquid ejection head 10. The satellite P1b generated as a result of this is landed in the right pattern 42 slightly beyond the midpoint 32. Next, as shown in FIG. 10B, the droplet P2a ejected to form the formation pattern P2 by the backward scanning of the liquid ejection head 10 overlaps the satellite P1b that has landed first. To land on. Further, as shown in FIG. 10C, the satellite P2b formed with the droplet P2a ejected in the vicinity of the intermediate point 32 lands on the already formed formation pattern P1. As a result, the satellites formed respectively on the forward path and the return path land on the pattern.

  In step S19, it is determined whether or not the formation of the A to D line segment patterns 22 to 25 (divided patterns 41 to 48) is completed. If not completed, the process returns to step S15, and the line segment to be formed next is determined. Repeat from the process of selecting a pattern.

  Since only the formation of the A direction pattern 22 has been completed at the present stage, the processing when the processing from step S15 is performed again will be described with reference to FIG. The line segment pattern to be formed next selected in step S15 will be described as a B direction pattern.

  As shown in FIG. 11A, the rotary stage 7 is driven so that the longitudinal direction of the B direction pattern 23 coincides with the reciprocating scanning direction of the liquid ejection head 10 (step S16). Then, as shown in FIG. 11B, during the forward scanning of the liquid ejection head 10, a formation pattern P3 from the left end portion of the B direction pattern 23 to the intermediate point 33 is formed (step S17). Next, as shown in FIG. 11C, the formation pattern P4 from the right end of the B direction pattern 23 to the intermediate point 33 is formed by the backward scanning of the liquid ejection head 10 (step S18).

  Thereafter, the same processing as described above is performed, and finally a formation pattern P for all line segments is formed as shown in FIG. In step S19, it is determined that all pattern formation has been completed, and the pattern formation processing is terminated. Note that the order in which the line segment patterns are selected is not limited to the order selected in this description.

  Finally, by baking with a baking apparatus, the metal colloid dissolves to form a metal bond, so that a circuit board with improved pattern conductivity can be formed.

It is a figure explaining the circuit pattern formation method and apparatus by one Embodiment. It is a figure explaining the division | segmentation of a pattern. It is a figure explaining formation of an edge part. It is a block diagram which shows the control part of a circuit pattern formation apparatus. 3 is a flowchart illustrating a pattern formation procedure according to the first embodiment. FIG. 6 is a diagram for explaining data processing of pattern formation data according to the first embodiment. 10 is a flowchart illustrating a pattern formation procedure according to the second embodiment. FIG. 10 is a diagram for explaining data processing of pattern formation data according to a second embodiment. 6 is a diagram illustrating a pattern formation process according to Embodiment 2. FIG. It is a figure explaining the landing position of the main droplet and satellite by Example 2. FIG. 6 is a diagram illustrating a pattern formation process according to Embodiment 2. FIG. It is a figure explaining a prior art example. It is a figure explaining the pattern formation using a multi-nozzle head and a multi-nozzle head. It is a figure which shows the discharge process of a droplet. It is a figure which shows the discharge and landing position of a droplet. It is a figure which shows the positional relationship of a main droplet and a satellite. It is a figure which shows the circuit malfunction resulting from a satellite.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Base material 5 Slider 6 Linear motion stage 7 Rotation stage 10 Liquid discharge head 14a Pattern data storage part 14b Direction-specific pattern storage part 14c Formation data storage part 15 CPU
16 Stage controller 17 Carriage controller 18 Drive signal generator

Claims (5)

In a circuit pattern forming method of forming a circuit pattern on the substrate by discharging a pattern forming solution from a nozzle of the liquid discharge head while scanning the liquid discharge head relative to the substrate,
Dividing the circuit pattern into a plurality of line segment patterns, and storing each longitudinal direction of the plurality of line segment patterns in a storage means;
Forming the line segment pattern by making the scanning direction of the liquid ejection head coincide with the stored longitudinal direction, and
The circuit pattern forming method, wherein a portion where the two line segment patterns are connected is a formation start end of one of the line segment patterns. A circuit pattern is formed on the substrate by discharging a pattern forming solution from the nozzle while scanning a liquid discharge head having a nozzle for discharging droplets onto the substrate relative to the substrate. In the circuit pattern forming apparatus,
Storage means for storing a longitudinal direction of each of a plurality of line segment patterns constituting the circuit pattern; and the base direction so that the longitudinal direction of the line segment pattern coincides with the scanning direction of the liquid ejection head relative to the substrate. And a means for controlling the relative position between the material and the liquid discharge head.   The circuit pattern forming apparatus according to claim 2, wherein the line segment pattern is formed on the base material by performing forward scanning and backward scanning in a scanning direction of the liquid ejection head.   4. The circuit pattern forming apparatus according to claim 2, further comprising a stage rotating unit configured to rotate the base material so that the longitudinal direction coincides with a scanning direction of the liquid ejection head. 5.   A circuit board having a circuit pattern formed by the circuit pattern forming method according to claim 1.

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