JP2007003659A - Optical connector - Google Patents

Optical connector Download PDF

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JP2007003659A
JP2007003659A JP2005181656A JP2005181656A JP2007003659A JP 2007003659 A JP2007003659 A JP 2007003659A JP 2005181656 A JP2005181656 A JP 2005181656A JP 2005181656 A JP2005181656 A JP 2005181656A JP 2007003659 A JP2007003659 A JP 2007003659A
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waveguide
film
optical
support base
optical connector
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JP4661392B2 (en
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Toru Nakashiba
徹 中芝
Shinji Hashimoto
眞治 橋本
Hiroyuki Yagyu
博之 柳生
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Panasonic Electric Works Co Ltd
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Matsushita Electric Works Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide an optical connector that is easy to form and that is capable of fully securing an optical coupling efficiency between some other optical transmission structure and an optical waveguide. <P>SOLUTION: The optical connector of the present invention is equipped with: a U-shaped placing section 1 which is provided with a flat part 11 for placing a part of a film-like waveguide F capable of optically coupling with some other optical transmission structure and which is provided with a vertical part 12 erected from both ends of the flat part 11 across the short side direction of the film-like waveguide F; a supporting base section 2 which is provided with a film-like-waveguide mounting part 21 for mounting the placing section 1 on the way from one end to the other end in a top view; and a cover section 3 which is provided with a projected part 31 for pressing the film-like waveguide F to the supporting base section 2 and which is also connected thereto, near the end, on some other optical transmission structure side, of at least the film-like waveguide mounting part 21. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、光ファイバ等の光伝送構造体と光導波路とを光結合させるための光コネクタに関するものである。   The present invention relates to an optical connector for optically coupling an optical transmission structure such as an optical fiber and an optical waveguide.

近年、通信インフラストラクチャの急速な広帯域化、コンピュータ等の情報処理能力の飛躍的な向上に伴い、非常に高速な情報伝送路を有する情報処理回路のニーズが高まっている。このような背景のもと、電気信号の伝送速度限界を突破する一つの手段として光信号による伝送が考えられており、プリント基板のような回路基板に光回路なるものを混載させた光電気混載配線板が提案されており、光回路を構成する光配線としては、例えば光導波路が採用されている。   In recent years, with the rapid widening of communication infrastructure and the dramatic improvement in information processing capability of computers and the like, there is an increasing need for information processing circuits having very high-speed information transmission paths. Under such circumstances, transmission by optical signal is considered as one means to break the transmission speed limit of electric signal, and opto-electric hybrid mounting in which an optical circuit is mixed on a circuit board such as a printed circuit board. A wiring board has been proposed, and an optical waveguide, for example, is employed as an optical wiring constituting the optical circuit.

なお、光ファイバ等の光伝搬構造体と光導波路とを光結合させる従来の光結合方法としては、例えば、光導波路が形成された導波路基板の端面から円柱状の光結合部(円柱形状部)を突設させ、光ファイバの一端部を保持したフェルールの先端面を光結合部の先端面と付き合わした形でフェルールを配置し、フェルールと光結合部とを囲む円筒状のスリーブをフェルール及び光結合部に装着するものを挙げることができる(例えば、特許文献1参照。)。
特開平08−313758号公報
In addition, as a conventional optical coupling method for optically coupling a light propagation structure such as an optical fiber and an optical waveguide, for example, a cylindrical optical coupling portion (cylindrical portion) is formed from an end surface of a waveguide substrate on which the optical waveguide is formed. ), And the ferrule is arranged in such a manner that the front end surface of the ferrule holding one end of the optical fiber is brought into contact with the front end surface of the optical coupling portion. The thing attached to an optical coupling part can be mentioned (for example, refer patent document 1).
Japanese Patent Laid-Open No. 08-313758

ところが、上述のような光結合方法においては、導波路基板の端面に円柱形状部のような光結合部を形成する際に、十分な光結合効率を得るためにその形状をミクロンオーダーで高精度に加工する必要があり、非常に高度な加工技術を要するという問題があった。また、導波路基板の材質、構成に応じて加工条件の最適化が必要となる等の問題があった。   However, in the optical coupling method as described above, when an optical coupling portion such as a cylindrical portion is formed on the end face of the waveguide substrate, the shape is highly accurate on the order of microns in order to obtain sufficient optical coupling efficiency. Therefore, there is a problem that a very advanced processing technique is required. In addition, there is a problem that optimization of processing conditions is required according to the material and configuration of the waveguide substrate.

本発明は上記問題点を改善するためになされたものであり、形成が容易であるとともに、他の光伝搬構造体と光導波路との光結合効率を十分に確保することができる光コネクタを提供することを目的とするものである。   The present invention has been made to remedy the above problems, and provides an optical connector that can be easily formed and can sufficiently ensure the optical coupling efficiency between another optical propagation structure and an optical waveguide. It is intended to do.

上述の目的を達成するために、本発明の請求項1に係る光コネクタは、光伝送構造体と光導波路とを光結合する光コネクタにおいて、前記光導波路は、他の光伝送構造体と光結合可能なフィルム状導波路であり、該フィルム状導波路の一部を積載する平坦部を有するとともに前記平坦部の両端からフィルム状導波路の短手方向を挟んで立設した立設部を有するコ字状の積載部と、平面視において一方の端部から他方の端部にわたって途中に前記積載部を搭載するフィルム状導波路搭載部を有する支持台部と、少なくともフィルム状導波路搭載部の前記他の光伝送構造体側の端部近傍で前記フィルム状導波路を前記支持台部に押し付ける凸部を備えるとともに前記支持台部と連結する蓋部と、を備えている。   In order to achieve the above object, an optical connector according to claim 1 of the present invention is an optical connector for optically coupling an optical transmission structure and an optical waveguide, wherein the optical waveguide is connected to another optical transmission structure and an optical fiber. A film-like waveguide that can be coupled, and has a flat portion on which a part of the film-shaped waveguide is stacked and a standing portion that is erected from both ends of the flat portion across the short direction of the film-like waveguide A U-shaped stacking section, a support base section having a film-shaped waveguide mounting section for mounting the stacking section on the way from one end to the other end in plan view, and at least a film-shaped waveguide mounting section And a lid portion that is connected to the support base portion and includes a convex portion that presses the film-like waveguide against the support base portion in the vicinity of the end portion on the other optical transmission structure side.

また、本発明の請求項2に係る光コネクタは、請求項1に記載の光コネクタにおいて、前記支持台部は、平面視において上面にアライメントマークを備えている。   An optical connector according to a second aspect of the present invention is the optical connector according to the first aspect, wherein the support base portion includes an alignment mark on an upper surface in a plan view.

また、本発明の請求項3に係る光コネクタは、請求項1又は請求項2に記載の光コネクタにおいて、前記支持台部又は前記蓋部少なくとも一方は、側面から貫通して前記積載部の立設部まで開口した開口孔を両側面に備えている。   An optical connector according to a third aspect of the present invention is the optical connector according to the first or second aspect, wherein at least one of the support base part or the lid part penetrates from a side surface and the stacking part stands. Opening holes that open to the installation part are provided on both side surfaces.

また、本発明の請求項4に係る光コネクタは、請求項1乃至請求項3のいずれかに記載の光コネクタにおいて、前記蓋部は、平面視において少なくとも前記凹部に面する箇所に開口領域を備えている。   An optical connector according to a fourth aspect of the present invention is the optical connector according to any one of the first to third aspects, wherein the lid portion has an opening region at least at a location facing the concave portion in plan view. I have.

また、本発明の請求項5に係る光コネクタは、請求項1乃至請求項4のいずれかに記載の光コネクタにおいて、前記支持台部は、前記フィルム導波路が前記他の光伝送構造体との光結合側とは反対側の端部に向かうにつれて傾斜した第1搭載部を備えるとともに、前記蓋部は、前記第1搭載部に対応した傾斜部を備えている。   Moreover, the optical connector which concerns on Claim 5 of this invention is the optical connector in any one of Claim 1 thru | or 4 WHEREIN: As for the said support stand part, the said film waveguide is said other optical transmission structure. The first mounting portion is inclined toward the end opposite to the optical coupling side, and the lid portion includes an inclined portion corresponding to the first mounting portion.

このような構成の光コネクタは、容易に形成可能であるとともに、積載部をコ字状に形成し、更に積載部と支持台部とを別体で構成することで、光導波路であるフィルム状導波路の積載位置の微調整が平面内で容易にできるため、他の光伝搬構造体とフィルム状導波路との光結合効率を十分に確保することができるという効果を奏する。   The optical connector having such a configuration can be easily formed, the stacking portion is formed in a U-shape, and the stacking portion and the support base portion are configured separately to form a film-like optical waveguide. Since the fine adjustment of the waveguide loading position can be easily performed in the plane, it is possible to sufficiently secure the optical coupling efficiency between the other light propagation structure and the film waveguide.

本発明に係る実施形態を図1乃至図5に基づいて説明する。なお、各図において、同一の符号を付した構成は、同一の構成であることを示している。図1は積載部を示し、(a)は正面図であり、(b)は平面図である。図2は支持台部を示し、(a)は正面図であり、(b)は平面図であり、(c)は側面図であり、(d)は底面図である。図3は蓋部を示し、(a)は正面図であり、(b)は平面図であり、(c)は側面図であり、(d)は底面図である。図4は、フィルム状導波路を光コネクタに搭載した状態の一例を示し、(a)は正面図であり、(b)は平面図であり、(c)は側面図である。図5は、アライメントマークを示す説明図であり、(a)は支持台部側のものを、(b)はフィルム状導波路側のものを示す。各図において、正面図における隠れ線(破線)は、図の簡略化のため、不図示とする。また、図4における隠れ線も一部簡略化のため不図示とする。   An embodiment according to the present invention will be described with reference to FIGS. In addition, in each figure, the structure which attached | subjected the same code | symbol has shown that it is the same structure. 1A and 1B show a loading section, where FIG. 1A is a front view and FIG. 1B is a plan view. 2A and 2B show a support base, where FIG. 2A is a front view, FIG. 2B is a plan view, FIG. 2C is a side view, and FIG. 2D is a bottom view. 3A and 3B show the lid, wherein FIG. 3A is a front view, FIG. 3B is a plan view, FIG. 3C is a side view, and FIG. 3D is a bottom view. FIG. 4 shows an example of a state in which the film-like waveguide is mounted on the optical connector, where (a) is a front view, (b) is a plan view, and (c) is a side view. FIGS. 5A and 5B are explanatory views showing alignment marks, where FIG. 5A shows the support base side, and FIG. 5B shows the film waveguide side. In each figure, the hidden line (broken line) in the front view is not shown in order to simplify the figure. Also, hidden lines in FIG. 4 are not shown for simplification.

本実施形態の光コネクタは、光ファイバ等の光伝搬構造体(不図示)と光導波路とを光結合させるためのものであり、図1乃至図4に示すように、積載部1と、支持台部2と、蓋部3とを備えた構成である。なお、光コネクタを構成する各部1,2,3は、本実施形態においては、アルミで形成しているが、光伝搬構造体と接続する際に十分な剛性を有するとともに、加工容易な材料であればよく、他に例えばステンレス、真鍮といった金属や、ポリカーボネートや、アクリルや、エポキシ等のプラスチックでもよい。   The optical connector of this embodiment is for optically coupling a light propagation structure (not shown) such as an optical fiber and an optical waveguide. As shown in FIG. 1 to FIG. It is the structure provided with the base part 2 and the cover part 3. FIG. In addition, although each part 1, 2, 3 which comprises an optical connector is formed with aluminum in this embodiment, it has sufficient rigidity when connecting with a light propagation structure, and is made of a material that can be easily processed. Other than that, for example, a metal such as stainless steel or brass, a plastic such as polycarbonate, acrylic, or epoxy may be used.

ここで、光導波路は、他の光伝送構造体と光結合可能であるフィルム状導波路F(図4参照)であり、例えばエポキシ樹脂をベースとし、例えば断面が40μmの矩形、各々のピッチが250μmである8本アレイ(不図示)を備え、フィルム幅が3mm、上クラッド層(不図示)、下クラッド層(不図示)は、各々20μm厚みであり、トータル厚みが80μmの構成である。なお、フィルム状導波路Fの波長850nmでの屈折率は、コア(不図示)で1.6、クラッド(不図示)で1.4である。   Here, the optical waveguide is a film-like waveguide F (see FIG. 4) that can be optically coupled to another optical transmission structure, for example, based on an epoxy resin, for example, a rectangle having a cross section of 40 μm, and each pitch is Eight arrays (not shown) of 250 μm are provided, the film width is 3 mm, the upper cladding layer (not shown) and the lower cladding layer (not shown) are each 20 μm thick, and the total thickness is 80 μm. The refractive index of the film waveguide F at a wavelength of 850 nm is 1.6 for the core (not shown) and 1.4 for the clad (not shown).

積載部1は、図1に示すように、フィルム状導波路Fの一部を積載する平坦部11と、平坦部11の両端からフィルム状導波路Fの短手方向を挟んで例えば90°で立設した立設部12とを備えたコ字状形状をなした構成であり、例えば、平坦部11幅Xは3mm、平坦部11長さYは4mm、立設部12高さtは2mm、平坦部11厚み、立設部12厚みは0.5mmとしている。なお、積載面幅Xは、積載するフィルム状導波路Fの幅に応じて決められるが、既存の定格コネクタのサイズを考慮すると、0.5mm〜5mm程度であることが好ましい。また、積載面長さYは、ハンドリング性を考慮すると、4mm〜8mm程度であることが好ましい。   As shown in FIG. 1, the stacking unit 1 includes a flat part 11 on which a part of the film-shaped waveguide F is stacked, and 90 ° across the short-side direction of the film-shaped waveguide F from both ends of the flat part 11. For example, the flat portion 11 has a width X of 3 mm, the flat portion 11 has a length Y of 4 mm, and the standing portion 12 has a height t of 2 mm. The thickness of the flat portion 11 and the thickness of the standing portion 12 are 0.5 mm. The loading surface width X is determined according to the width of the film-like waveguide F to be loaded, but is preferably about 0.5 mm to 5 mm in consideration of the size of the existing rated connector. The loading surface length Y is preferably about 4 mm to 8 mm in consideration of handling properties.

なお、立設部12は、平坦部11の法線方向から平坦部11に向かって10°の範囲で傾けるような構成であってもよい。このように平坦部11側に向かって立設部12を傾けることで、フィルム状導波路Fの仮止めの必要も無くフィルム状導波路Fを積載部1内に安定して積載させることが可能となる。   The standing portion 12 may be configured to be inclined from the normal direction of the flat portion 11 toward the flat portion 11 within a range of 10 °. In this way, by tilting the standing portion 12 toward the flat portion 11 side, the film-like waveguide F can be stably loaded in the loading portion 1 without the need to temporarily fix the film-like waveguide F. It becomes.

支持台部2は、図2に示すように、平面視において一方の端部から他方の端部にわたってフィルム状導波路搭載部21を備えている。   As shown in FIG. 2, the support base 2 includes a film-like waveguide mounting portion 21 extending from one end to the other end in a plan view.

本実施形態においては、フィルム状導波路搭載部21は、他の光伝送構造体と光結合する側の端面側に形成された第2搭載部21bと、その反対の端面側に形成された第1搭載部21aを備えている。なお、支持台部2は、第2搭載部21bと第1搭載部21aとの間に、積載部1の平坦部11が底面となるようにして搭載する凹部21cを備えている。   In the present embodiment, the film-shaped waveguide mounting portion 21 includes a second mounting portion 21b formed on the end surface side on the side to be optically coupled to another optical transmission structure, and a second mounting portion formed on the opposite end surface side. 1 mounting portion 21a is provided. In addition, the support base part 2 is equipped with the recessed part 21c mounted so that the flat part 11 of the stacking part 1 may become a bottom face between the 2nd mounting part 21b and the 1st mounting part 21a.

フィルム状導波路Fは、図4に示すように、第2搭載部21b、凹部21cに搭載された積載部1、第1搭載部21a上に配置される。   As shown in FIG. 4, the film-shaped waveguide F is disposed on the second mounting portion 21b, the stacking portion 1 mounted in the recess 21c, and the first mounting portion 21a.

第1搭載部21aは、図2に示すように、凹部21c側から端部側に向かうにつれて滑らかに例えばS字状に傾斜し形成している。第2搭載部21bは、第1搭載部21aの凹部21c側の高さと同一高さで構成されている。第1搭載部21aの傾斜は、フィルム状導波路Fの放射損失をできる限り緩和するために設けるもので、フィルム状導波路Fの放射損失が許容できる範囲でS字状の傾斜であればよい。本実施形態においては、図3、図4に示すように、端部側では支持台部2の底面へ到達するように例えば半径R=4の円弧を2つ組み合わせ形成している。   As shown in FIG. 2, the first mounting portion 21 a is formed so as to be smoothly inclined, for example, in an S shape from the concave portion 21 c side toward the end portion side. The 2nd mounting part 21b is comprised by the same height as the height by the side of the recessed part 21c of the 1st mounting part 21a. The inclination of the first mounting portion 21a is provided in order to reduce the radiation loss of the film-shaped waveguide F as much as possible, and may be an S-shaped inclination as long as the radiation loss of the film-shaped waveguide F is allowable. . In this embodiment, as shown in FIGS. 3 and 4, for example, two arcs having a radius R = 4 are combined on the end side so as to reach the bottom surface of the support base 2.

なお、凹部21cは、平面視において積載部1の底面積よりも若干(例えば1mm〜2mm程度)広く形成されており、積載部1を搭載した際に、平坦部11が第1搭載部21a、第2搭載部21bと同一高さとなる、つまり、第1搭載部21a、第2搭載部21b及び凹部21cに配置する積載部1の平坦部11が同一高さとなるようにその深さを設定することが好ましい。なお、凹部21cの深さは、積載部1を搭載した際に、平坦部11が第1搭載部21aと第2搭載部21bとに対して、フィルム状導波路Fが上下に波打ったとしても放射損失が許容できる範囲であれば略同一高さであればよい。   The concave portion 21c is formed slightly wider (for example, about 1 mm to 2 mm) than the bottom area of the stacking portion 1 in a plan view, and when the stacking portion 1 is mounted, the flat portion 11 becomes the first mounting portion 21a, The depth is set so that it becomes the same height as the second mounting portion 21b, that is, the flat portion 11 of the stacking portion 1 arranged in the first mounting portion 21a, the second mounting portion 21b, and the recess 21c has the same height. It is preferable. The depth of the concave portion 21c is determined so that when the stacking portion 1 is mounted, the flat waveguide portion 11 corrugates up and down with respect to the first mounting portion 21a and the second mounting portion 21b. As long as the radiation loss is in an allowable range, the heights may be approximately the same.

ここで、支持台部2は、図2、図5(a)に示すように、第2搭載部21bの表面側の所望の位置にアライメントマーク23を備えている。また、フィルム状導波路Fにも、図5(b)に示すような支持台部2側のアライメントマーク23に整合するアライメントマークF1を設けておく。   Here, as shown in FIG. 2 and FIG. 5A, the support base 2 includes an alignment mark 23 at a desired position on the surface side of the second mounting portion 21b. Also, the film-like waveguide F is provided with an alignment mark F1 that matches the alignment mark 23 on the support base 2 side as shown in FIG.

積載部1の平坦部11に積載されたフィルム状導波路Fは、積載部1を凹部21cに搭載する際に、お互いのアライメントマーク23、F1が整合するように積載部1を後述する最適な位置まで微調整して移動させる。   The film-like waveguide F loaded on the flat portion 11 of the loading portion 1 is optimal for the loading portion 1 to be described later so that the alignment marks 23 and F1 are aligned with each other when the loading portion 1 is loaded in the recess 21c. Make fine adjustments to the position and move it.

本実施形態においては、図5(a)に示すように、第2搭載部21bのうち、斜線部を100μm突起させており、サイズL1=1.0mm、M1=0.23mmである。また、フィルム状導波路Fでは、図5(b)に示すように、斜線部をコア樹脂で形成してその周囲をクラッド樹脂で覆っており、サイズL2=0.7mm、M2=0.2mmである。この場合、第2搭載部21b側に合わせると、斜線部に接しないようにお互いのアライメントマーク23、F1位置を合わせれば、両アライメントマーク23、F1のM1、M2の差から、±15μmの範囲で位置決めできるようになっている。   In the present embodiment, as shown in FIG. 5A, the hatched portion of the second mounting portion 21b is projected by 100 μm, and the sizes L1 = 1.0 mm and M1 = 0.23 mm. Further, in the film-like waveguide F, as shown in FIG. 5B, the shaded portion is formed of a core resin and the periphery thereof is covered with a clad resin, and the size L2 = 0.7 mm and M2 = 0.2 mm. It is. In this case, when the alignment marks 23 and F1 are aligned with each other so as not to contact the shaded portion when aligned with the second mounting portion 21b side, a range of ± 15 μm from the difference between M1 and M2 of the alignment marks 23 and F1. It can be positioned with.

なお、支持台部2側、フィルム状導波路F側のアライメントマーク23、F1の形状は、お互いの配置関係を一致させて整合することができるものであれば、形状は特に限定するものではない。なお、支持台部2に設けたアライメントマーク23とフィルム状導波路Fに設けたアライメントマークF1とは、お互いの屈折率の違いから視認可能である。   The shapes of the alignment marks 23 and F1 on the support base 2 side and the film-like waveguide F side are not particularly limited as long as they can be aligned and matched with each other. . The alignment mark 23 provided on the support base 2 and the alignment mark F1 provided on the film-like waveguide F are visible from the difference in refractive index between each other.

また、支持台部2は、ある規格に基づいたコネクタや規格外のコネクタと接続するための嵌合穴24を第2搭載部21bの端面に備えている。   Moreover, the support base part 2 is provided with the fitting hole 24 for connecting with the connector based on a certain standard, or the connector outside a standard in the end surface of the 2nd mounting part 21b.

本実施形態においては、MTコネクタ(JIS C5981)(不図示)とフィルム状導波路Fを挟み込んだ光コネクタを光結合するため、嵌合穴24としてはガイドピン穴24を用いている。   In the present embodiment, a guide pin hole 24 is used as the fitting hole 24 in order to optically couple an MT connector (JIS C5981) (not shown) and an optical connector sandwiching the film waveguide F.

ガイドピン穴24の高さは、第2搭載部21bの高さよりもフィルム状導波路Fの下側クラッド厚み分だけ高くなるよう設定しておくことで、フィルム状導波路Fを最適な位置に自然とセットされやすくなる。なお、フィルム状導波路Fの下クラッド層は、一般にスピンコート、金型等で形成されるため厚み精度は出やすいものである。ここで、フィルム状導波路Fの最適な位置とは、他の光伝搬構造体との間で最低の損失にて光りの受け渡しができる位置をいう。   The height of the guide pin hole 24 is set to be higher than the height of the second mounting portion 21b by the thickness of the lower clad of the film-shaped waveguide F, so that the film-shaped waveguide F is positioned at an optimal position. It becomes easy to set with nature. The lower clad layer of the film-like waveguide F is generally formed by spin coating, a mold or the like, so that the thickness accuracy is easily obtained. Here, the optimal position of the film-like waveguide F refers to a position where light can be transferred to and from other light propagation structures with minimum loss.

支持台部2には、後述の蓋部3との連結(固定)に用いるための例えばM2のネジ穴25を上面のフィルム状導波路搭載部21の両側方向に4ヶ所設けており、また後述の基板4との固定に用いるための例えば直径2.5mmの貫通孔26を長手方向の両側方に4ヶ所設けている。   The support base 2 is provided with, for example, four screw holes 25 of M2 for use in connection (fixation) with the lid 3 described later, on both sides of the film waveguide mounting portion 21 on the upper surface. For example, four through holes 26 having a diameter of 2.5 mm are provided on both sides in the longitudinal direction for use in fixing to the substrate 4.

蓋部3は、図3に示すように、少なくとも支持台部2の第2搭載部21bの端部近傍に面する凸部31を備え、凸部31と第2搭載部21bの端部近傍でフィルム状導波路Fを挟みこむ。   As shown in FIG. 3, the lid portion 3 includes at least a convex portion 31 facing the vicinity of the end portion of the second mounting portion 21 b of the support base portion 2, and in the vicinity of the end portions of the convex portion 31 and the second mounting portion 21 b. The film-like waveguide F is sandwiched.

また、蓋部3は、図3に示すように、支持台部2の第1搭載部21aの傾斜に対応する形状の傾斜部32を備えている。本実施形態においては、蓋部3は、更に支持台部2のネジ穴25に対応する直径2.5mmの貫通孔33を備え、嵌合、ネジ止めにより支持台部2に固定されている。   Moreover, the cover part 3 is provided with the inclination part 32 of the shape corresponding to the inclination of the 1st mounting part 21a of the support stand part 2, as shown in FIG. In the present embodiment, the lid 3 further includes a through hole 33 having a diameter of 2.5 mm corresponding to the screw hole 25 of the support base 2 and is fixed to the support base 2 by fitting and screwing.

ここで、本実施形態においては、蓋部3は、支持台部2の凹部21cに直上の領域と支持台部2側に設けたアライメントマーク23とが見えるように開口した開口領域34を備えている。この開口領域34を設けることで、積載部1に積載したフィルム状導波路Fを凹部21cに搭載し、蓋部3と支持台部2とを仮固定した後に、フィルム状導波路Fの位置を観察しながら微調整可能である。   Here, in the present embodiment, the lid 3 includes an opening region 34 that is open so that the region directly above the recess 21c of the support base 2 and the alignment mark 23 provided on the support base 2 side can be seen. Yes. By providing the opening region 34, the film-like waveguide F loaded on the loading portion 1 is mounted in the recess 21c, and the lid portion 3 and the support base portion 2 are temporarily fixed, and then the position of the film-like waveguide F is changed. Fine adjustment is possible while observing.

また、開口領域34は、最終位置決め後のフィルム状導波路Fに対して接着剤を流し込むことができるため、フィルム状導波路Fを最適な位置で固定することができる。   Moreover, since an adhesive agent can be poured into the film-shaped waveguide F after final positioning, the opening-shaped area | region 34 can fix the film-shaped waveguide F in an optimal position.

蓋部3は、側面から貫通して開口領域34内において積載部1の立設部12まで到達する開口孔35を両側面に備えている。本実施形態においては、開口孔35は、例えばM2のネジ切孔であり、回転方向の調整を可能とするために各側面に例えば3mmずつ離間して2ヶ所ずつ備えた構成である。   The lid portion 3 is provided with opening holes 35 on both side surfaces that penetrate from the side surface and reach the standing portion 12 of the stacking portion 1 in the opening region 34. In the present embodiment, the opening hole 35 is, for example, an M2 threaded hole, and has a configuration in which two sides are provided, for example, 3 mm apart on each side surface to enable adjustment of the rotation direction.

蓋部3に設けた開口孔35から立設部12に対して到達可能な長さのネジを嵌合させて、積載部1の位置を微調整することでフィルム状導波路Fの位置を微調整することができる。なお、開口孔35は、貫通した孔であればネジ切りされていなくてもよく、この場合、良性ピンをネジの代わりに使用すればよい。   The position of the film-like waveguide F is finely adjusted by finely adjusting the position of the stacking portion 1 by fitting a screw having a length that can reach the standing portion 12 from the opening hole 35 provided in the lid portion 3. Can be adjusted. The opening hole 35 may not be threaded as long as it is a through hole. In this case, a benign pin may be used instead of a screw.

以下、フィルム状導波路Fを光コネクタに搭載する方法の一例を図4に基づいて説明する。まず、例えば所望の基板4の表面にフィルム状導波路Fを積層成形する。このとき、フィルム状導波路Fと基板4との積層成形は、Bステージ化(半硬化)されたプリプレグ(不図示)を敷き、一般的なプリント基板で使用される加熱加圧成形を用いて行った。なお、フィルム状導波路Fは、光コネクタの積載部1、第1搭載部21a、第2搭載部21bに積載する領域が必要であり、基板4表面から遊離した遊離領域を形成するために、プリプレグを除去して、この遊離領域に圧力がかからないように使用する熱板(不図示)のサイズを選択している。なお、フィルム状導波路Fは、基板4の表面に積載されるような構成の他に、前述の遊離領域さえ確保できれば、基板4内に埋め込まれた状態の構成であってもよい。   Hereinafter, an example of a method for mounting the film-like waveguide F on the optical connector will be described with reference to FIG. First, for example, a film waveguide F is laminated on the surface of a desired substrate 4. At this time, lamination molding of the film-like waveguide F and the substrate 4 is performed by using heat and pressure molding that is used for a general printed circuit board with a prepreg (not shown) that is B-staged (semi-cured). went. In addition, the film-shaped waveguide F requires areas to be stacked on the optical connector stacking unit 1, the first mounting unit 21a, and the second mounting unit 21b, and in order to form a free region free from the surface of the substrate 4, The size of the hot plate (not shown) to be used is selected so that the prepreg is removed and no pressure is applied to the free area. In addition to the configuration in which the film waveguide F is stacked on the surface of the substrate 4, the film-shaped waveguide F may be embedded in the substrate 4 as long as the above-described free region can be secured.

フィルム状導波路Fと一体化した基板4と、支持台部2とは、基板4に予め形成しておいたスルーホール41と支持台部2の貫通孔26とボルト、ナット27、42を用いて固定する。   The substrate 4 integrated with the film waveguide F and the support base 2 use a through hole 41 formed in the substrate 4 in advance, a through hole 26 of the support base 2, bolts, nuts 27 and 42. And fix.

フィルム状導波路Fの遊離領域を積載部1の平坦部11に乗せ、例えば瞬間的に固定可能な接着剤にて仮固定する。この状態の積載部1を、フィルム状導波路Fの遊離領域の端面が支持台部2の第2搭載部21b側の端面に合うように位置調整しながら凹部21cに搭載し、更に蓋部3を支持台部2に対して覆い被せてネジ37でネジ止め固定を行った。この際、ネジ止め固定は、フィルム状導波路Fの位置を微調整可能な範囲で若干緩めにしておく。フィルム状導波路Fの一方の端部(遊離領域の端部)は、図4に示すように、支持台部2と蓋部3の凸部31で挟み込まれながら、他の光伝送構造体と光結合可能に光コネクタ端部から露出されている。   The free region of the film-like waveguide F is placed on the flat portion 11 of the stacking portion 1 and temporarily fixed with an adhesive that can be fixed instantaneously, for example. The loading unit 1 in this state is mounted in the recess 21c while adjusting the position so that the end surface of the free region of the film waveguide F is aligned with the end surface of the support base 2 on the second mounting unit 21b side, and further the lid 3 The support base 2 was covered and fixed with screws 37. At this time, the fixing by screwing is slightly loosened within a range in which the position of the film waveguide F can be finely adjusted. As shown in FIG. 4, one end of the film-shaped waveguide F (the end of the free region) is sandwiched between the support 31 and the convex portion 31 of the lid 3, and another optical transmission structure. It is exposed from the end of the optical connector so that it can be optically coupled.

次に、蓋部3の表面の開口領域34から実体顕微鏡(不図示)を通して、支持台部2側、フィルム状導波路F側双方に形成したアライメントマーク23、F1を視認して、蓋部3の側面に設けたネジ切孔からネジを挿入し、双方のアライメントマーク23、F1が整合する位置に積載部1を微調整する。   Next, through the stereomicroscope (not shown) from the opening region 34 on the surface of the lid part 3, the alignment marks 23 and F1 formed on both the support base part 2 side and the film-like waveguide F side are visually recognized. A screw is inserted from a threaded hole provided on the side surface of the sheet, and the stacking unit 1 is finely adjusted to a position where the alignment marks 23 and F1 are aligned.

更に、支持台部2側、フィルム状導波路F側双方に形成したアライメントマーク23、F1自身の作製上等の誤差を考慮すると、光コネクタへ配置されたフィルム状導波路Fと、光源(不図示)及び光伝搬構造体である光ファイバ(不図示)と接続されたMTコネクタとを接合させて実際に光を通して、お互いの光結合の状態を光パワーメータ(不図示)でモニタリングしながら、フィルム状導波路Fを最適な位置へ最終調整する。   Further, in consideration of errors in the production of the alignment mark 23 formed on both the support base 2 side and the film waveguide F side, F1 itself, etc., the film waveguide F disposed on the optical connector and the light source (non- (Not shown) and an optical fiber (not shown) which is a light propagation structure and an MT connector connected to each other are actually joined, and light is actually monitored through the optical power meter (not shown). The film waveguide F is finally adjusted to an optimum position.

そして、フィルム状導波路Fは、最適な位置に調整されると、ネジ止めを仮固定状態から本固定し、蓋部3の開口領域34からクラッドと同じ材料であるUV硬化樹脂(不図示)を流し込み、超高圧水銀灯を約1000mJ照射することで硬化させてフィルム状導波路Fを最適な位置に固定する。   When the film-shaped waveguide F is adjusted to the optimum position, the screw fixing is permanently fixed from the temporarily fixed state, and the UV curable resin (not shown) which is the same material as the clad from the opening region 34 of the lid 3. Then, the film-shaped waveguide F is fixed at an optimum position by being cured by irradiating an ultrahigh pressure mercury lamp with about 1000 mJ.

なお、蓋部3に設けた開口領域34が、アライメントマーク23を視認できないような大きさである場合や、蓋部3に開口領域34を設けない場合は、支持台部2の凹部21cに積載部1を搭載した時点で、支持台部2側、フィルム状導波路F側双方に形成したアライメントマーク23、F1を視認して微調整し、その場で前述のUV硬化樹脂を凹部21cへ流し込んで硬化させれば良い。   In addition, when the opening area 34 provided in the cover part 3 is sized so that the alignment mark 23 cannot be visually recognized, or when the opening area 34 is not provided in the cover part 3, the opening area 34 is loaded in the recess 21 c of the support base part 2. At the time when the portion 1 is mounted, the alignment marks 23 and F1 formed on both the support base 2 side and the film waveguide F side are visually recognized and finely adjusted, and the aforementioned UV curable resin is poured into the recess 21c on the spot. It can be cured with.

本実施形態に係る光コネクタは、容易に形成可能であるとともに、積載部1をコ字状に形成し、更に積載部1と支持台部2とを別体で構成することで、フィルム状導波路Fの積載位置の微調整が平面内で容易にできるため、他の光伝搬構造体とフィルム状導波路Fとの光結合効率を十分に確保することができる。   The optical connector according to the present embodiment can be easily formed, the stacking section 1 is formed in a U-shape, and the stacking section 1 and the support base section 2 are configured separately to form a film-shaped guide. Since the fine adjustment of the loading position of the waveguide F can be easily performed in a plane, the optical coupling efficiency between the other light propagation structure and the film waveguide F can be sufficiently secured.

また、光コネクタと、基板と一体化されたフィルム状導波路Fとを備える光導波路部品も容易に形成可能である。   In addition, an optical waveguide component including an optical connector and a film-like waveguide F integrated with a substrate can be easily formed.

ここで、本実施形態においては、積載部1の立設部12まで開口した開口孔35は、蓋部3に設けているが、支持台部2に設けるような構成であってもよい。   Here, in the present embodiment, the opening hole 35 opened to the standing portion 12 of the stacking portion 1 is provided in the lid portion 3, but may be configured to be provided in the support base portion 2.

本実施形態に係る積載部を示し、(a)は正面図であり、(b)は平面図である。The stacking part which concerns on this embodiment is shown, (a) is a front view, (b) is a top view. 本実施形態に係る支持台部を示し、(a)は正面図であり、(b)は平面図であり、(d)は底面図である。The support stand part which concerns on this embodiment is shown, (a) is a front view, (b) is a top view, (d) is a bottom view. 本実施形態に係る蓋部を示し、(a)は正面図であり、(b)は平面図であり、(c)は側面図であり、(d)は底面図である。The cover part which concerns on this embodiment is shown, (a) is a front view, (b) is a top view, (c) is a side view, (d) is a bottom view. 本実施形態に係るフィルム状導波路を光コネクタに搭載した状態の一例を示し、(a)は正面図であり、(b)は平面図であり、(c)は側面図である。An example of the state which mounted the film-form waveguide concerning this embodiment in an optical connector is shown, (a) is a front view, (b) is a top view, (c) is a side view. 本実施形態に係るアライメントマークを示す説明図であり、(a)は支持台部側のもの、(b)はフィルム状導波路側のものを示す。It is explanatory drawing which shows the alignment mark which concerns on this embodiment, (a) is the thing of the support stand part side, (b) shows the thing of the film-form waveguide side.

符号の説明Explanation of symbols

1 積載部
2 支持台部
3 蓋部
4 基板
11 平坦部
12 立設部
21 フィルム状導波路搭載部
21a 第1搭載部
21b 第2搭載部
21c 凹部
23 アライメントマーク
31 凸部
32 傾斜部
34 開口領域
35 開口孔
DESCRIPTION OF SYMBOLS 1 Loading part 2 Supporting base part 3 Cover part 4 Board | substrate 11 Flat part 12 Standing part 21 Film-shaped waveguide mounting part 21a 1st mounting part 21b 2nd mounting part 21c Concave part 23 Alignment mark 31 Convex part 32 Inclination part 34 Opening area | region 35 Opening hole

Claims (5)

光伝送構造体と光導波路とを光結合する光コネクタにおいて、
前記光導波路は、他の光伝送構造体と光結合可能なフィルム状導波路であり、
該フィルム状導波路の一部を積載する平坦部を有するとともに前記平坦部の両端からフィルム状導波路の短手方向を挟んで立設した立設部を有するコ字状の積載部と、
平面視において一方の端部から他方の端部にわたって途中に前記積載部を搭載するフィルム状導波路搭載部を有する支持台部と、
少なくともフィルム状導波路搭載部の前記他の光伝送構造体側の端部近傍で前記フィルム状導波路を前記支持台部に押し付ける凸部を備えるとともに前記支持台部と連結する蓋部と、を備えたことを特徴とする光コネクタ。
In an optical connector that optically couples an optical transmission structure and an optical waveguide,
The optical waveguide is a film-like waveguide that can be optically coupled to another optical transmission structure,
A U-shaped stacking portion having a flat portion on which a part of the film-shaped waveguide is stacked and having a standing portion erected across the short direction of the film-shaped waveguide from both ends of the flat portion;
A support base portion having a film-like waveguide mounting portion for mounting the stacking portion in the middle from one end portion to the other end portion in plan view;
At least near the end of the film-shaped waveguide mounting portion on the side of the other optical transmission structure, including a convex portion that presses the film-shaped waveguide against the support base, and a lid that connects to the support base. An optical connector characterized by that.
前記支持台部は、平面視において上面にアライメントマークを備えた請求項1に記載の光コネクタ。 The optical connector according to claim 1, wherein the support base portion includes an alignment mark on an upper surface in a plan view. 前記支持台部又は前記蓋部少なくとも一方は、側面から貫通して前記積載部の立設部まで開口した開口孔を両側面に備えた請求項1又は請求項2に記載の光コネクタ。   3. The optical connector according to claim 1, wherein at least one of the support base and the lid is provided with opening holes on both side surfaces penetrating from a side surface and opening to a standing portion of the stacking portion. 前記蓋部は、平面視において少なくとも前記凹部に面する箇所に開口領域を備えた請求項1乃至請求項3のいずれかに記載の光コネクタ。   The optical connector according to any one of claims 1 to 3, wherein the lid portion includes an opening region at least at a location facing the concave portion in plan view. 前記支持台部は、前記フィルム導波路が前記他の光伝送構造体との光結合側とは反対側の端部に向かうにつれて傾斜した第1搭載部を備えるとともに、前記蓋部は、前記第1搭載部に対応した傾斜部を備えた請求項1乃至請求項4のいずれかに記載の光コネクタ。   The support base includes a first mounting portion that is inclined as the film waveguide heads toward an end opposite to the optical coupling side with the other optical transmission structure, and the lid includes the first mounting portion. The optical connector according to claim 1, further comprising an inclined portion corresponding to one mounting portion.
JP2005181656A 2005-06-22 2005-06-22 Optical connector Expired - Fee Related JP4661392B2 (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011203284A (en) * 2010-03-24 2011-10-13 Fujitsu Ltd Flexible optical waveguide with connector, and method for manufacturing the same
JP2014029445A (en) * 2012-07-31 2014-02-13 Sumitomo Bakelite Co Ltd Optical wiring component and method of manufacturing optical wiring component
JP2014029444A (en) * 2012-07-31 2014-02-13 Sumitomo Bakelite Co Ltd Method of positioning optical waveguide and method of manufacturing optical wiring component
WO2014084142A1 (en) * 2012-11-30 2014-06-05 住友ベークライト株式会社 Optical wiring component and electronic device

Citations (3)

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Publication number Priority date Publication date Assignee Title
JPH07318752A (en) * 1994-05-27 1995-12-08 Sumitomo Electric Ind Ltd Optical waveguide type module and production of optical waveguide type parts
JPH08240738A (en) * 1995-03-02 1996-09-17 Sumitomo Electric Ind Ltd Optical waveguide device and production therefor
JP2000002820A (en) * 1998-04-14 2000-01-07 Nippon Telegr & Teleph Corp <Ntt> Optical waveguide element for optical wiring, and manufacture thereof

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07318752A (en) * 1994-05-27 1995-12-08 Sumitomo Electric Ind Ltd Optical waveguide type module and production of optical waveguide type parts
JPH08240738A (en) * 1995-03-02 1996-09-17 Sumitomo Electric Ind Ltd Optical waveguide device and production therefor
JP2000002820A (en) * 1998-04-14 2000-01-07 Nippon Telegr & Teleph Corp <Ntt> Optical waveguide element for optical wiring, and manufacture thereof

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011203284A (en) * 2010-03-24 2011-10-13 Fujitsu Ltd Flexible optical waveguide with connector, and method for manufacturing the same
JP2014029445A (en) * 2012-07-31 2014-02-13 Sumitomo Bakelite Co Ltd Optical wiring component and method of manufacturing optical wiring component
JP2014029444A (en) * 2012-07-31 2014-02-13 Sumitomo Bakelite Co Ltd Method of positioning optical waveguide and method of manufacturing optical wiring component
WO2014084142A1 (en) * 2012-11-30 2014-06-05 住友ベークライト株式会社 Optical wiring component and electronic device
JP2014130335A (en) * 2012-11-30 2014-07-10 Sumitomo Bakelite Co Ltd Optical wiring component and electronic device
CN104871055A (en) * 2012-11-30 2015-08-26 住友电木株式会社 Optical wiring component and electronic device
EP2927721A4 (en) * 2012-11-30 2016-07-13 Sumitomo Bakelite Co Optical wiring component and electronic device

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