JP2006351872A - Radiation fin apparatus for semiconductor devices, and arithmetic processing board and signal processor using the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an arithmetic processing board and a signal processor wherein positions of respective radiation fins are optimized for the semiconductor devices on each card using the radiation fin apparatus for semiconductor devices, for cooling the semiconductor devices attached on a main body in which the airflow is arising due to air blowing. <P>SOLUTION: The radiation fin apparatus for semiconductor devices is provided with a radiation fin 2 of which rotational position can be changed to be adapted to the semiconductor devices, a sensor 3 which measures a temperature of the radiation fin 2 and a wind force of the airflow passing through the radiation fin, a driving source 5 which shifts a rotational position of the radiation fin 2, and a sensor controller 6 which determines a rotational position of the radiation fin 2 by controlling the driving source 5 depending on the output from the sensor 3. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a heat dissipating fin device for a semiconductor element that cools a semiconductor element with an air flow, and an arithmetic processing board device and a signal processing device using the same.

  In recent years, card baskets in which a plurality of cards equipped with semiconductor elements are mounted have been used as means for performing electrical signal processing using semiconductor elements. This card basket has a configuration in which a plurality of cards each mounting a semiconductor element, for example, a plurality of IC cards, can be mounted on the main body of the card basket. Since the semiconductor element mounted on the card mounted on the card basket generates heat in the functional state, it is necessary to take measures for cooling it.

On the other hand, the following techniques are known as general cooling means for semiconductor elements that generate heat.
(A) Technology that includes a plurality of fins that dissipate heat generated from a semiconductor element to the outside through an air flow, and is arranged so that the distance between the fins gradually decreases in the direction of air flow (for example, Patent Documents) 1).
(B) Technology for driving a cooling fan under the condition that the temperature of the radiating fins becomes a certain level or more (see, for example, Patent Document 2).
(C) A technology in which an ultra-small fan is provided in the vicinity of the semiconductor element and each flow path of the air flowing into the fan and the air blowing from the fan is divided to prevent mixing of the air flowing in and the air blowing (for example, (See Patent Document 3).
(D) Technology in which a radiating fin having a desired radiating characteristic is detachably attached to a package enclosing a semiconductor element (see, for example, Patent Document 4).

  Here, assuming the cooling of the semiconductor element mounted on the card mounted on the card basket, the card basket has a plurality of card mounting portions for card mounting, and the direction and position of each of these in relation to the airflow are Since a card can be inserted into each of a plurality of different card mounting portions, even when the same card is inserted, for example, the wind direction from the blower installed in the card basket differs depending on the card insertion position.

  However, the above-described known techniques (a) to (c) do not have a concept of a plurality of cards mounted on a card basket having a main body portion where airflow is generated by air blowing, and accordingly, according to the direction of the airflow (wind direction) or the like. There is no concept of optimizing the position of each radiation fin with respect to the semiconductor element for each card.

JP-A-8-17976 Japanese Utility Model Publication No. 6-80386 JP-A-5-304379 JP-A-6-125024

  The cooling means for semiconductor elements and the like in each of the above-mentioned patent documents refers to technical means for efficiently cooling a plurality of radiating fins having different positional conditions with respect to the airflow in relation to the direction of the airflow. However, there has been a problem that each of the plurality of semiconductor elements mounted on the main body portion where airflow is generated by blowing cannot be efficiently cooled.

  The present invention has been made to solve the above-described problems, and an object of the present invention is to optimize the cooling of a semiconductor element by displacing a plurality of radiating fins in accordance with the direction of airflow.

  A radiating fin device for a semiconductor element according to the present invention is a radiating fin device for a semiconductor element that cools a semiconductor element that is mounted on a main body portion where airflow is generated by blowing air, the radiating fin having a variable rotational position with respect to the semiconductor element, A sensor disposed around the radiation fin; a drive source for displacing the rotational position of the radiation fin; and a sensor control unit for controlling the drive source based on an output of the sensor to determine the rotational position of the radiation fin. Is.

  According to the present invention, it is possible to fully utilize the heat dissipating properties inherent to the radiating fins.

Embodiment 1.
An appearance of a card basket as an example of a signal processing device is shown in FIG. The card basket 11 has a configuration in which various members are attached to a main body portion 11a formed of a rectangular parallelepiped housing. A rectangular opening 50 is formed in one side surface of the main body 11a, and a large number of cards 8a, 8b, 8c, 8d,. A power switch 13 for the card basket 11 is provided in the vicinity of the opening 50.

  A blower 12 as an example of a blowing means is mounted above the large number of cards 8a, 8b, 8c, 8d... 8n, that is, on the upper surface of the main body 11a. The blower 12 sucks air from the outside of the main body portion 11a and discharges it into the main body portion 11a, thereby generating an air flow for cooling the card in the main body portion. This airflow is exhausted to the outside from an exhaust port (not shown) formed in the main body 11a.

  Cards 8a, 8b, 8c, 8d,..., 8n as an example of an arithmetic processing board device mounted on the main body 11a are composed of card boards having the same shape, size, and internal structure. FIG. 2 shows a state where any one of these cards 8a, 8b, 8c, 8d... 8n is taken out and the component mounting surface is viewed from the front. 2 is the same as any one of the cards 8a, 8b, 8c, 8d... 8n shown in FIG.

In FIG. 2, a fixture 51 shown at each of the left and right lower portions of the card substrate 8 and a guide 52 shown at the upper portion of the card substrate 8 are auxiliary parts for mounting and holding the card substrate on the main body portion 11a. It is provided on the 11a side.
A front portion of the card substrate 8 shown by a rectangle is a component mounting surface, on which a large number of IC components 10 are arranged. These IC components 10 are not cooling targets in this example. A part of the region where the large number of IC components 10 are arranged is shown in a circle as a semiconductor element radiating fin 2 for cooling the semiconductor element.

  As will be apparent from FIG. 4 to be described later, the radiating fin 2 can be rotated in any direction indicated by an arrow, and the radiating fin 2 is positioned in a position overlapping with the radiating fin 2, that is, in a direction penetrating the paper surface in FIG. A semiconductor element 9 to be cooled by the radiating fin 2 is fixed to the card substrate 8 at a hidden position.

  The configuration of the air-cooling type semiconductor element heat radiation fin device 1A will be described with reference to FIGS. The radiating fin 2 has a configuration in which a disk portion and a plurality of fins standing upright on the upper surface of the disk portion are integrally configured. A position corresponding to the center of the disk portion of the heat radiating fin 2 is rotatably supported by a shaft support portion 7 a provided at the distal end portion of the column member 7 whose base end portion is fixed to the card substrate 8. The lower disk surface of the disk portion is in slidable contact with the surface of the semiconductor element 9.

  A gear 4 is formed on the circumferential portion of the disk portion of the radiating fin 2, and a gear 53 is meshed with the gear 4. The gear 53 is directly connected to the rotating shaft of the stepping motor 5, and the stepping motor 5 is fixed to a case that houses the sensor control unit 6, and the case that houses the sensor control unit 6 is a semiconductor through a heat insulating material by a support member (not shown). It is supported by the element 9 or the card substrate 8. A temperature sensor 3 for measuring the temperature of the radiation fin 2 is attached to the radiation fin 2. In this example, the temperature sensor 3 is fixed to a position on the outer peripheral portion of the radiating fin 2, passing through the center of the disk portion and perpendicular to the fin groove direction 54.

  In such a configuration, the radiating fin 2 can be slidably contacted with the semiconductor element 9, and since the center part thereof is supported by the shaft support part 7 a, the rotational position of the radiating fin 2 is variable with respect to the semiconductor element 9 by the rotation. The gear 4 integrated with the radiating fin 2 is meshed with the gear 53, and the stepping motor 5 in which the gear 53 and the rotation shaft are directly connected is a drive source for displacing the rotational position of the radiating fin. The sensor control unit 6 is a control unit that controls the stepping motor 5 based on the output of the temperature sensor 3 to determine the rotational position of the radiation fin 2.

1 to 4 and FIG. 5 explaining the function of the sensor control unit 6, a sensor that controls the stepping motor 5 based on the output of the temperature sensor 3 to determine the rotational position of the radiating fin 2 with respect to the semiconductor element 9. Control of the control unit 6 will be described.
The power switch 13 is turned on and the card basket 11 is turned on. When the card basket 11 is turned on, power is also supplied to the cards 8a to 8n and the blower 12. The direction of the airflow generated by the rotation of the blower 12 is different for each of the cards 8a to 8n.

  After the power is turned on, the stepping motor 5 is operated by the sensor control unit 6, the radiating fin 2 is slowly rotated through the meshing of the gear 53 and the gear 4, and the temperature of the radiating fin 2 is measured by the temperature sensor 3. After the radiating fin 2 is rotated once, the radiating fin 2 is moved again and fixed at the rotational position at the lowest temperature. This rotational position is an optimal cooling position in relation to the direction of the airflow for the heat radiating fin 2.

The operation of the sensor control unit 6 that executes such control will be described.
The rotation start control circuit 19 instructs the “timing generator A” 18 to generate a step pulse for one rotation of the radiating fin 2. When the “timing generator A” 18 generates a step pulse, the stepping motor 5 is activated and the radiating fin 2 starts to rotate slowly.

  The counter 20 counts the number of step pulses. The temperature information from the temperature sensor 3 is converted into a voltage by the temperature / voltage conversion circuit 14. At the initial time, the multiplexer 15 outputs only the current state “I”, and holds the current state “I” in the minimum value holding circuit 17 through the “comparison circuit A” 16. When the holding information of the minimum value holding circuit 17 is updated, an update trigger is output, and the count value “U” at the minimum time is held in the count holding circuit 21.

  In the second and subsequent steps, the multiplexer 15 is turned off, the minimum value “A” from the minimum value holding circuit 17 is compared with the current state “I” by the “comparison circuit A” 16 and held in the minimum value holding circuit 17. The minimum value “A” is updated. Also, the minimum count value “c” of the count holding circuit 21 is updated. This is repeated until the radiating fin 2 makes one rotation.

  The rotation start control circuit 19 again instructs the “timing generator A” 18 to generate a step pulse for one rotation of the radiating fin 2. Further, an update trigger prohibiting gate is output from the rotation start control circuit 19, and the value of the count holding circuit 21 is locked. The heat dissipating fin 2 is rotated, and a stop signal is output when the count value “d” from the counter 20 matches the minimum count value “c” from the count holding circuit 21 by the “comparison circuit B” 22. "Timing generator A" 18 is stopped. As a result, the stepping motor 5 stops and the radiating fin 2 also stops. It is assumed that “timing generator A” 18 does not accept this stop signal in the first rotation.

Further, by recording voltage information for one rotation in the memory 23, it is possible to send information to the external CPU 24 and verify voltage information changes and the like when the shape of the radiation fin is changed. The heat dissipating fins 2 are rotated and fixed only once when the power is turned on.
As described above, according to the present embodiment, the original heat dissipating property of the radiating fin 2 can be fully utilized by fixing the radiating fin 2 at an optimal position.

Embodiment 2.
The second embodiment is characterized in that a servo motor is used in place of the stepping motor used as the driving source for displacing the rotational position of the radiating fin 2 in the first embodiment.

  The structure of the air-cooling type semiconductor device radiating fin device 1B will be described with reference to FIG. The semiconductor element radiating fin device 1B cools the semiconductor element 9 of the card substrate 8 illustrated in FIG. 2 as any one of the cards 8a to 8n mounted on the card basket 11 described in FIG. It is structured as a thing. In the figure, the radiation fin 2, the temperature sensor 3, the gear 4, the support member 7, the shaft support 7a, the gear 53, the groove direction 54 and the like are the same as those described in FIG. The difference is that the servo motor 25 is used in place of the stepping motor 5 as a driving source for driving the gear 53, and the rotational position of the radiation fin 2 is determined by controlling the servo motor 25 based on the output of the temperature sensor 3. The sensor control unit 26 is used as control means.

Referring to FIGS. 1 and 6 and FIG. 7 describing the function of the sensor control unit 26 as appropriate, the servo motor 25 is controlled based on the output of the temperature sensor 3 to determine the rotational position of the radiating fin 2 with respect to the semiconductor element 9. The control of the sensor control unit 26 will be described.
The power switch 13 is turned on and the card basket 11 is turned on. When the card basket 11 is turned on, power is also supplied to the cards 8a to 8n and the blower 12. The direction of the airflow generated by the rotation of the blower 12 is different for each of the cards 8a to 8n.

  After the power is turned on, the servo motor 25 is operated by the sensor control unit 26, the radiating fin 2 is slowly rotated by the driving unit 4, and the temperature of the radiating fin 2 is measured by the temperature sensor 3. The heat dissipating fins 2 are rotated and fixed at the lowest temperature position. This rotational position is an optimal cooling position in relation to the direction of the airflow for the heat radiating fin 2.

  The operation of the sensor control unit 26 that executes such control will be described. The temperature information from the temperature sensor 3 is converted into a voltage by the temperature / voltage conversion circuit 14. The voltage is transmitted to the servo motor 25 through the track and hold circuit 27 and the amplifier 28, and the heat radiating fin 2 starts rotating. In response to the timing signal output from the “timing generator B” 32, the current state “A ′” is output from the “voltage holding circuit A” 29. Further, according to the timing from the “timing generator B” 32, the previous state “I ′” is output from the “voltage holding circuit B” 30 through the delay circuit 33.

  The subtraction circuit 31 calculates (current state “a ′” − previous state “a ′”). Normally, the track & hold circuit 27 continues to rotate the radiating fin 2 while maintaining the tracking state. However, the place where the calculation result of the subtraction circuit 31 changes from negative to positive is the lowest temperature, and at that time, the hold pulse is applied. Occurs, and the track & hold circuit 27 is set in the hold state. As a result, the servo motor 25 stops. This rotational position is an optimal cooling position in relation to the direction of the airflow for the heat radiating fin 2. The heat dissipating fins 2 are rotated and fixed only once when the power is turned on. As described above, according to the present embodiment, the original heat dissipating property of the radiating fin 2 can be fully utilized by fixing the radiating fin 2 at an optimal position.

Embodiment 3.
In the third embodiment, as in the first embodiment, a stepping motor is used as a driving source for displacing the rotational position of the radiating fin 2, and an air volume sensor is provided near the radiating fin instead of the temperature sensor. It is characterized in that the heat radiation fin is fixed at an optimum position by obtaining the air volume information from the air volume sensor.

  The structure of the air-cooling type semiconductor element radiating fin device 1C will be described with reference to FIGS. The semiconductor element radiating fin device 1C cools the semiconductor element 9 of the card substrate 8 illustrated in FIG. 2 as any one of the cards 8a to 8n mounted on the card basket 11 described in FIG. It is structured as a thing. In the figure, the radiating fin 2, the gear 4, the support member 7, the shaft support 7a, the gear 53, the groove direction 54 and the like are the same as those described in FIG. The difference is that the air volume sensor 36 is used in place of the temperature sensor 3 and that the sensor as a control means for determining the rotational position of the radiating fin 2 by controlling the stepping motor 5 by obtaining the air volume information from the air volume sensor. The control unit 35 is used. The air volume sensor 36 is disposed on the card substrate 8 on the downstream side of the air flow with respect to the heat radiating fins 2 and supported by a support member (not shown).

  Referring to FIG. 1, FIG. 8, FIG. 9 and FIG. 10 explaining the function of the sensor control unit 35 as appropriate, the stepping motor 5 is controlled based on the output of the air volume sensor 36 to rotate the heat dissipating fin 2 with respect to the semiconductor element 9. Control of the sensor control unit 35 that determines the position will be described.

  The power switch 13 is turned on and the card basket 11 is turned on. When the card basket 11 is turned on, power is also supplied to the cards 8a to 8n and the blower 12. The direction of the airflow generated by the rotation of the blower 12 is different for each of the cards 8a to 8n. After the power is turned on, the stepping motor 5 is operated by the sensor control unit 35, the radiating fin 2 is slowly rotated, and the air volume is measured by the air volume sensor 36. After the radiating fin 2 is rotated once, the radiating fin 2 is moved again and fixed at the position where the maximum airflow is obtained. This rotational position is an optimal cooling position in relation to the direction of the airflow for the heat radiating fin 2.

The operation of the sensor control unit 35 that executes such control will be described.
The rotation start control circuit 19 instructs the “timing generator A” 18 to generate a step pulse for one rotation of the radiating fin 2. When the “timing generator A” 18 generates a step pulse, the stepping motor 5 is activated and the radiating fin 2 starts to rotate slowly. Further, the counter 20 counts the number of step pulses.

  The air volume information from the air volume sensor 36 is converted into a voltage by the air volume / voltage conversion circuit 37. At the initial time, the multiplexer 15 outputs only the current state “I”, and holds the current state “I” in the maximum value holding circuit 39 through the “comparison circuit C” 38. When the holding information of the maximum value holding circuit 39 is updated, an update trigger is output, and the count value “U” at the maximum time is held in the count holding circuit 21.

  In the second and subsequent steps, the multiplexer 15 is turned off, the maximum value “A ″” from the maximum value holding circuit 39 is compared with the current state “I” by the “comparison circuit C” 38, and the maximum value holding circuit 39 The maximum value “A ″” held is updated. Also, the maximum count value “C” of the count holding circuit 21 is updated. This is repeated until the radiating fin 2 makes one rotation.

  The rotation start control circuit 19 again instructs the “timing generator A” 18 to generate a step pulse for one rotation of the radiating fin 2. Further, an update trigger prohibiting gate is output from the rotation start control circuit 19, and the value of the count holding circuit 21 is locked. The radiating fin 2 is rotated, and a stop signal is output when the count value “d” from the counter 20 matches the maximum count value “c” from the count holding circuit 21 by the “comparison circuit B” 22. Then, the “timing generator A” 18 is stopped. As a result, the stepping motor 5 stops and the radiating fin 2 also stops. It is assumed that “timing generator A” 18 does not accept this stop signal in the first rotation.

  Further, by recording voltage information for one rotation in the memory 23, it is possible to verify the voltage information change and the like when the information is sent to the external CPU 24 and the shape of the radiating fin is changed. The heat dissipating fins 2 are rotated and fixed only once when the power is turned on. Thus, according to this Embodiment, the original heat dissipation of the radiation fin 2 can fully be utilized by fixing the radiation fin 2 in the optimal position.

Embodiment 4.
In the fourth embodiment, as in the second embodiment, a servo motor is used as a drive source for displacing the rotational position of the radiating fin 2 and an air volume sensor is provided near the radiating fin. It is characterized in that the information is obtained to fix the radiating fin at an optimal position.

  The configuration of an air-cooled semiconductor element radiating fin device 1D will be described with reference to FIG. The semiconductor element radiating fin device 1C cools the semiconductor element 9 of the card substrate 8 illustrated in FIG. 2 as any one of the cards 8a to 8n mounted on the card basket 11 described in FIG. It is structured as a thing. In the figure, the radiating fin 2, the gear 4, the support member 7, the shaft support 7a, the gear 53, the groove direction 54 and the like are the same as those described in FIG.

  The difference is that the air volume sensor 36 is used in place of the temperature sensor 3 and that the sensor is used as a control means for determining the rotational position of the radiating fin 2 by controlling the servo motor 25 by obtaining the air volume information from the air volume sensor. The control unit 40 is used. As shown in FIG. 9, the air volume sensor 36 is disposed on the card substrate 8 on the downstream side of the airflow with respect to the heat radiating fins 2, supported by a support member (not shown).

  Referring to FIGS. 1 and 11 and FIG. 12 describing the function of the sensor control unit 40 as appropriate, the servo motor 25 is controlled based on the output of the air flow sensor 36 to determine the rotational position of the radiating fin 2 with respect to the semiconductor element 9. Control of the sensor control unit 40 will be described.

  The power switch 13 is turned on and the card basket 11 is turned on. When the card basket 11 is turned on, power is also supplied to the cards 8a to 8n and the blower 12. The direction of the airflow generated by the rotation of the blower 12 is different for each of the cards 8a to 8n. After the power is turned on, the servo motor 25 is operated by the sensor control unit 40, the radiating fin 2 is slowly rotated by the driving unit 4, and the air volume is measured by the air volume sensor 36. The heat radiating fins 2 are rotated and fixed at the position where the maximum airflow is obtained. This rotational position is an optimal cooling position in relation to the direction of the airflow for the heat radiating fin 2.

The operation of the sensor control unit 40 that executes such control will be described.
The air volume information from the air volume sensor 36 is converted into a voltage by the air volume / voltage conversion circuit 37. The voltage is transmitted to the servo motor 25 through the track and hold circuit 27 and the amplifier 28, and the heat radiating fin 2 starts rotating. At the timing from the “timing generator B” 32, the current state “A ′” is output from the “voltage holding circuit A” 29. Further, according to the timing information from the “timing generator B” 32, the previous state “I ′” is output from the “voltage holding circuit B” 30 through the delay circuit 33.

The subtraction circuit 31 calculates (current state “a ′” − previous state “a ′”). Normally, the track & hold circuit 27 continues to rotate the radiating fin 2 while maintaining the tracking state, but the place where the calculation result of the subtraction circuit 31 changes from positive to negative is the maximum air volume. Occurs, and the track & hold circuit 27 is set in the hold state. As a result, the servo motor 25 stops. This rotational position is an optimal cooling position in relation to the direction of the airflow for the heat radiating fin 2. The heat dissipating fins 2 are rotated and fixed only once when the power is turned on. As described above, according to the present embodiment, the original heat dissipating property of the radiating fin 2 can be fully utilized by fixing the radiating fin 2 at an optimal position.
Can.

Embodiment 5.
In the present embodiment, the heat dissipating fins are configured to be rotatable with the wind force from the air blowing means with respect to the semiconductor element, so that the rotational positions of the heat dissipating fins are displaced with the wind force, and the rotational positions of the heat dissipating fins after the displacement are fixed with the fixing means Fix it.
The configuration of an air-cooled semiconductor element radiating fin device 1E will be described with reference to FIG. The semiconductor element radiating fin device 1E cools the semiconductor element 9 of the card substrate 8 illustrated in FIG. 2 as any one of the cards 8a to 8n mounted on the card basket 11 described in FIG. It is structured as a thing. In the figure, the radiating fins 34 are provided in place of the radiating fins 2, and are made lightweight so that they can be easily rotated by the airflow generated in the blower 12.

  The gear 4, the support member 7, the shaft support 7a, the gear 53, the groove direction 54, and the like are the same as those described in FIG. The difference is that the temperature sensor 3 and the air volume sensor 36 are not used, and the brake 55 is provided directly connected to the gear 53. An electromagnetic brake can be used as the brake 55.

With reference to FIG. 1 and FIG. 13, the operation of the semiconductor device radiating fin device 1E will be described.
The power switch 12 is turned on and the card basket 11 is turned on. When power is turned on to the basket 11, power is also supplied to the cards 8 a to 8 n and the blower 12. The direction of the airflow generated by the rotation of the blower 12 is different for each of the cards 8a to 8n. After the power is turned on, the blower 12 rotates and airflow is generated. The light radiating fin 34 is swung by the air flow and the rotational position of the light radiating fin 34 is naturally displaced to the optimum position where the air flow passes through the fin. Thereafter, the brake 55 is operated, and the lightweight heat radiation fin 34 is fixed to the rotated position after the displacement. The lightweight radiating fin 34 moves and fixes after being displaced only once when the power is turned on. As described above, according to the present embodiment, the original heat dissipating property of the radiating fin 34 can be fully utilized by fixing the lightweight radiating fin 34 at an optimal position.

It is the perspective view which showed the state which mounted the card substrate in the card basket. It is the front view which showed the arrangement | positioning state of the various members in a card substrate. FIG. 3A is a plan view of the semiconductor radiating fin device, and FIG. 3B is a side view of the semiconductor radiating fin device. It is a principal part side view of a card substrate and a semiconductor fin apparatus. FIG. It is a block diagram of the control part which displaces the rotation position of a radiation fin. 6A is a plan view of the semiconductor radiating fin device, and FIG. 6B is a side view of the semiconductor radiating fin device. It is a block diagram of the control part which displaces the rotation position of a radiation fin. FIG. 8A is a plan view of the semiconductor radiating fin device, and FIG. 8B is a side view of the semiconductor radiating fin device. It is a top view explaining the radiation fin and air volume sensor on a card board. It is a block diagram of the control part which displaces the rotation position of a radiation fin. FIG. 11A is a plan view of the semiconductor radiating fin device, and FIG. 11B is a side view of the semiconductor radiating fin device. It is a block diagram of the control part which displaces the rotation position of a radiation fin. FIG. 13A is a plan view of the semiconductor radiating fin device, and FIG. 13B is a side view of the semiconductor radiating fin device, each of which illustrates a configuration in which the rotational position of the radiating fin is displaced using wind power. It is.

Explanation of symbols

2 Radiation fin, 3 Temperature sensor, 5 Stepping motor, 6, 26, 35, 40 Sensor control part, 9 Semiconductor element, 25 Servo motor, 36 Air flow sensor.

Claims (7)

A radiating fin device for a semiconductor element that cools a semiconductor element that is mounted on a main body where airflow is generated by blowing air,
A heat dissipating fin whose rotational position is variable with respect to the semiconductor element, a sensor disposed around the heat dissipating fin, a drive source for displacing the rotational position of the heat dissipating fin, and controlling the drive source based on the output of the sensor A heat dissipation fin device for a semiconductor element, comprising a sensor control unit for determining a rotational position of the heat dissipation fin.   The radiating fin device for a semiconductor element according to claim 1, wherein the driving source is a stepping motor.   2. The heat dissipating fin device for a semiconductor element according to claim 1, wherein the drive source is a servo motor.   2. The radiating fin device for a semiconductor element according to claim 1, wherein the sensor is an air volume sensor, and the rotational position of the radiating fin is determined by obtaining air volume information from the air volume sensor. A radiating fin device for a semiconductor element that cools a semiconductor element that is mounted on a main body where airflow is generated by blowing air,
A heat dissipating fin device for a semiconductor element, comprising: a heat dissipating fin whose position is variable with respect to the semiconductor element by wind force from the air blowing means; An arithmetic processing board device including a semiconductor element as a cooling target, a heat dissipating means for cooling the semiconductor element, and a substrate provided with the semiconductor element and the heat dissipating means,
6. The arithmetic processing board device according to claim 1, wherein the heat dissipating means comprises the heat dissipating fin device for a semiconductor element according to any one of claims 1 to 5. In the signal processing device in which the arithmetic processing board device and the air blowing means are attached to the main body,
A signal processing apparatus comprising a plurality of arithmetic processing board devices according to claim 6 attached to the main body.

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