JP2006351763A - Method for deciding component arrangement position - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for deciding component arrangement positions by which component mounting accuracy can be improved while improving a tact time. <P>SOLUTION: A component mounting device is provided with a plurality of mounting heads respectively corresponding to a plurality of component supplies. It is calculated whether a rotation amount of a component is minimized to which component supply a component cassette is arranged on the basis of a mounting angle of the component for each mounting target component included in a component type regarding each component type. The method includes a step (S11) for making an angle table, in which the number of components when the rotation amount is minimized is totalized, for each component supply part; and a step (S12) for deciding the component supply part as the arrangement position of the component cassette of the component type, when the component supply part where the rotation amount is minimized is uniquely determined for each component type. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a component arrangement position determination method, and more particularly to a component arrangement position determination method in a component mounting apparatus that mounts a component such as an electronic component on a substrate.

Conventionally, various methods for optimizing the mounting order of components when mounting components on a printed circuit board by a component mounting apparatus have been proposed. Among such methods for optimizing the mounting order, there is a method for optimizing the mounting order so as to reduce the production time (tact time) per substrate (see, for example, Patent Document 1). .
JP 2002-50900 A

  However, in order to reduce the tact time, it is necessary to reduce the weight of the mounting head for sucking, moving, and mounting components. However, if the weight of the mounting head is reduced, the suction mechanism of the component must be simplified, and the suction force of the component is reduced. For this reason, when a component is rotated using such a lightened mounting head, the component adsorbed at the time of component rotation is displaced, and the component mounting position accuracy on the board is lowered. There's a problem.

  Conversely, in order to improve the component mounting position accuracy, a mounting head having a large component suction force may be used, but such a mounting head is heavy because of a large component suction mechanism. For this reason, there is a problem that the mounting head itself cannot be moved at a high speed and the tact time is increased.

  The present invention has been made to solve the above-described problem, and an object of the present invention is to provide a component placement position determination method that can improve the component mounting accuracy while improving the tact time.

  In order to achieve the above object, a component placement position determining method according to the present invention is a method for determining a placement position of a component cassette in a component mounting apparatus for mounting a component on a board, wherein the component mounting apparatus A plurality of component supply units are provided in which the stored component cassettes are arranged and the supply angles of the components from the component cassettes are different from each other, and among the plurality of component supply units, the components are adsorbed from the component cassette by the mounting head. The method further includes a determining step of determining a component supply portion that minimizes the amount of rotation of the component by the mounting head until mounting on the board as the component cassette arrangement position.

  According to this configuration, the arrangement of the component cassettes is determined so that the amount of rotation when the components are mounted on the board is minimized. For this reason, component mounting accuracy can be improved. In addition, since the time required for component rotation is reduced, the tact time of the component can be improved.

  For example, the component mounting apparatus further includes a plurality of mounting heads respectively corresponding to the plurality of component supply units, and the determining step includes component types of components mounted on the board, their mounting angles, and the number of components. If an angle table creation step for creating an angle table, which is a table showing the relationship between the angle table, and a component supply unit that minimizes the rotation amount for each component type is uniquely determined based on the angle table, the component The first part cassette placement position determination step for determining the supply unit as the part cassette placement position of the relevant part type, and a series of operations for one time in the repetition of a series of operations of picking up, moving and mounting parts by the mounting head In the case where the component supply unit is not uniquely determined, the number of tasks by the plurality of mounting heads is based on the angle table. As becomes equal, selecting at least one component supply unit, it may be characterized in that it comprises a second component cassettes arrangement position determining step of determining the arrangement position of the component cassette of the component type.

  The arrangement position of the component cassette is determined so that the number of tasks by the plurality of mounting heads is equalized. For this reason, it is possible to improve the component mounting accuracy while improving the tact time of the component.

  The determining step is based on the angle table creating step of creating an angle table that is a table showing the relationship between the component type of the component mounted on the board, its mounting angle, and the number of components, and the angle table. A first component cassette arrangement position determining step for determining, for each component type, a component supply unit having a minimum amount of rotation that is determined as a component cassette arrangement position of the component type. For the component type for which the component supply unit is not uniquely determined, at least one component supply unit is selected from the component supply unit having the maximum number of components with the smallest amount of rotation based on the angle table, and the component type And a second component cassette arrangement position determining step for determining.

  The present invention can be realized not only as a component placement position determination method including such characteristic steps, but also as a component placement position determination device using the characteristic steps included in the component placement position determination method. Or as a program that causes a computer to execute the characteristic steps included in the component placement position determination method. Needless to say, such a program can be distributed via a recording medium such as a CD-ROM (Compact Disc-Read Only Memory) or a communication network such as the Internet.

  According to the present invention, it is possible to provide a component arrangement position determination method capable of improving the tact time and improving the component mounting accuracy.

Hereinafter, a component mounting system 10 according to an embodiment of the present invention will be described with reference to the drawings.
(Embodiment 1)
FIG. 1 is an external view showing the overall configuration of the component mounting system 10 according to the first embodiment of the present invention.

  This component mounting system 10 is a production line for mounting electronic components while sending a board 20 from upstream to downstream, and is based on a plurality of component mounting apparatuses 120 and 200 and various databases at the start of production. Then, the mounting conditions such as the placement position of the component cassette, the number of beams to be used and the mounting order of the electronic components are optimized, and the obtained NC (Numeric Control) data is downloaded to the component mounting apparatuses 120 and 200 for setting and control. And an optimization device 300.

  The component mounting apparatus 120 includes four sub-equipments (sub-equipment 130a, 132a, 130b, 132b) that perform component mounting in cooperation with each other (or in an alternate operation). The sub-equipment 130a includes a component supply unit 124a that includes an array of component cassettes 123 that store component tapes, and a plurality of suction nozzles (hereinafter simply referred to as “ Multi-mounting head 121 having a nozzle ”), a beam 122 to which multi-mounting head 121 is attached, and a component for inspecting two-dimensionally or three-dimensionally the suction state of a component sucked by multi-mounted head 121 A recognition camera 126 and the like are provided. The sub-equipment 132a, 130b and 132b have the same configuration as the sub-equipment 130a. The sub-equipment 132b includes a tray supply unit 128 that supplies tray components, but the tray supply unit 128 and the like may not be provided depending on the sub-equipment.

  Here, the “component tape” is a plurality of components of the same component type arranged on a tape (carrier tape), and is supplied in a state of being wound around a reel (supply reel) or the like. It is mainly used to supply a relatively small size component called a chip component to a component mounter.

  Specifically, the component mounting apparatus 120 is a mounting machine having the functions of both a component mounting machine called a high-speed mounting machine and a component mounting machine called a multi-function mounting machine. A high-speed mounting machine is a facility characterized by high productivity that mainly mounts electronic parts of □ 10 mm or less at a speed of about 0.1 seconds per point. A multi-function mounting machine is a large model of □ 10 mm or more. It is equipment for mounting electronic parts, odd-shaped parts such as switches and connectors, and IC parts such as QFP (Quad Flat Package) and BGA (Ball Grid Array).

  That is, the component mounting apparatus 120 is designed to be able to mount almost all kinds of electronic components (from 0.4 mm × 0.2 mm chip resistor to 200 mm connector as components to be mounted) By arranging the required number of component mounting apparatuses 120, a component mounting system can be configured.

  Since the configuration of component mounting apparatus 200 is the same as that of component mounting apparatus 120, detailed description thereof will not be repeated.

FIG. 2 is a plan view showing a main configuration inside the component mounting apparatus 120.
The component mounting apparatus 120 includes sub-equipment arranged in the transport direction (X-axis direction) of the substrate 20 inside, and further includes sub-equipment in the front-rear direction (Y-axis direction) of the component mounting apparatus 120. A total of four sub-equipment 130a, 132a, 130b, and 132b are provided. The sub-equipment (130a and 132a, 130b and 132b) arranged side by side in the X-axis direction is independent from each other, and different mounting operations can be performed at the same time. Further, the sub-equipment (130a and 132b, 132b and 130b) is also independent of each other, and different mounting operations can be performed at the same time. On the other hand, the sub-equipment (130a and 130b, 132a and 132b) arranged to face each other in the front-rear direction (Y-axis direction) performs a mounting operation on one board in cooperation with each other. Hereinafter, the sub facilities 130a and 130b are collectively referred to as “left sub facility 120c”, and the sub facilities 132a and 132b are collectively referred to as “right sub facility 120d”. That is, in each of the left sub-equipment 120c and the right sub-equipment 120d, the two multi mounting heads 121 perform component mounting work on one substrate 20 in cooperation.

  Each sub-equipment 130a, 132a, 130b, 132b includes a beam 122, a multi-mounting head 121, and component supply units 124a, 125a, 124b, 125b for the sub-equipment 130a, 132a, 130b, 132b. Yes. In addition, the component mounting apparatus 120 is provided with a pair of rails 129 for transporting the substrate 20 between the front and rear sub-equipment.

  Note that the component recognition camera 126, the tray supply unit 128, and the like are not the main points of the present invention, and are not shown in FIG.

  The beam 122 is a rigid body that extends in the X-axis direction, and moves on a track (not shown) provided in the Y-axis direction (perpendicular to the conveyance direction of the substrate 20) while being parallel to the X-axis direction. Is something that can be done. Further, the beam 122 can move the multi-mounting head 121 attached to the beam 122 along the beam 122, that is, in the X-axis direction. The multi mounting head 121 can be moved freely in the XY plane by moving the multi mounting head 121 moving in the Y axis direction in the X axis direction. In addition, a plurality of motors such as a motor (not shown) for driving them are provided in the beam 122, and electric power is supplied to these motors and the like via the beam 122.

  FIG. 3 is a schematic diagram showing the positional relationship between the multi-mounting head 121 and the component cassette 123.

  The multi-mounting head 121 can mount a plurality of suction nozzles 121a to 121b, and ideally, electronic components for the maximum number of suction nozzles can be simultaneously supplied from each of the component cassettes 123 (by one up and down movement). ) Can be adsorbed.

  The multi mounting head 121 can move along the beam 122, and this movement is driven by a motor (not shown). Further, when the electronic component is sucked and held, or when the held electronic component is mounted on the substrate 20, the vertical movement and rotation are also driven by the motor.

  4 and 5 are diagrams for explaining component mounting by the component mounting apparatus 120. FIG. 4 and 5, only the left sub-equipment 120c is shown, but the right sub-equipment 120d is also subjected to the same operation to perform component mounting. For this reason, illustration is abbreviate | omitted in FIG. 4 and FIG.

  As shown in FIG. 4, the multi-mounting head 121 of the sub-equipment 130 b performs “suction” of the component from the component supply unit 124 b, “recognition” of the suctioned component by the component recognition camera 126, and the recognized component board 20. The component is mounted on the board 20 by alternately repeating the three operations “mounting” on the board.

  Similarly, the multi-mounting head 121 of the sub-equipment 130a similarly mounts components on the substrate 20 by repeating three operations of “suction”, “recognition”, and “mounting” alternately.

  When the two multi-mounting heads 121 perform “mounting” of components at the same time, in order to prevent the multi-mounting heads 121 from colliding with each other, the two multi-mounting heads 121 perform component operation on the substrate 20 while performing a cooperative operation. Implement it. Specifically, as shown in FIG. 5A, when the multi mounting head 121 of the sub facility 130b is performing the “mounting” operation, the multi mounting head 121 of the sub facility 130a performs the “adsorption” operation. And perform a “recognition” operation. On the contrary, as shown in FIG. 5B, when the multi mounting head 121 of the sub facility 130a is performing the “mounting” operation, the multi mounting head 121 of the sub facility 130b performs the “adsorption” operation and “ Perform “recognition” action. As described above, the “mounting” operation is alternately performed by the two multi mounting heads 121, thereby preventing the multi mounting heads 121 from colliding with each other. Ideally, if the “adsorption” operation and the “recognition” operation by the other multi mounting head 121 are completed while the “mounting” operation by one multi mounting head 121 is being performed, When the “mounting” operation by the multi mounting head 121 is completed, it is possible to move to the “mounting” operation by the other multi mounting head 121 without delay, and the production efficiency can be improved.

  FIG. 6 is a block diagram showing a configuration example of the optimization apparatus 300 according to Embodiment 1 of the present invention, that is, the optimization apparatus 300 shown in FIG. The optimization device 300 is a computer that performs processing such as optimization of the mounting order of components on the substrate 20 and optimization of the supply position of components to each component mounting device for each component mounting device. 301, a display unit 302, an input unit 303, a memory unit 304, an optimization program storage unit 305, a communication I / F (interface) unit 306, a database unit 307, and the like.

  The optimization apparatus 300 is realized by a general-purpose computer system such as a personal computer executing the optimization program according to the present invention, and is not connected to the component mounting apparatus 120, but is a stand-alone simulator (component mounting). It also functions as an order optimization tool. Note that this optimization device may be provided inside the component mounter.

  The arithmetic control unit 301 is a CPU (Central Processing Unit), a numerical processor, or the like, and loads and executes a necessary program from the optimization program storage unit 305 to the memory unit 304 according to an instruction from an operator, and the execution result. The components 302 to 307 are controlled according to

  The display unit 302 is a CRT (Cathode-Ray Tube), an LCD (Liquid Crystal Display), or the like, and the input unit 303 is a keyboard, a mouse, or the like. These optimization devices are controlled by the arithmetic control unit 301. 300 is used for dialogue between the operator and the operator.

  The communication I / F unit 306 is a LAN (Local Area Network) adapter or the like, and is used for communication between the optimization apparatus 300 and the component mounting apparatus 120 or the like. The memory unit 304 is a RAM (Random Access Memory) or the like that provides a work area for the arithmetic control unit 301.

  The database unit 307 includes input data (mounting point data 307a, component library 307b, mounting device information 307c, etc.) used for optimization processing by the optimization device 300, mounting point data generated by optimization, component placement data, and the like. Is a hard disk or the like.

  7 to 9 are diagrams illustrating examples of the mounting point data 307a, the component library 307b, and the mounting apparatus information 307c, respectively.

  The mounting point data 307a is a collection of information indicating mounting points of all components to be mounted. As shown in FIG. 7, one mounting point pi includes a component type ci, an X coordinate xi, a Y coordinate yi, a mounting angle θi, and control data φi. Here, “component type” corresponds to a component name in the component library 307b shown in FIG. 8, and “X coordinate” and “Y coordinate” are coordinates of a mounting point (coordinates indicating a specific position on the board). Yes, the “mounting angle” is the rotation angle of the component at the time of component mounting, and the “control data” is constraint information related to mounting of the component (type of usable suction nozzle, maximum moving speed of the multi mounting head 121, etc. ). NC (Numeric Control) data to be finally obtained is an arrangement of mounting points that minimizes the line tact.

  The component library 307b is a library in which unique information about all component types that can be handled by the component mounting apparatus 120 and the like is collected. As shown in FIG. 8, the component size and tact (constant) for each component type are collected. And the other constraint information (a type of suction nozzle that can be used, a recognition method by the component recognition camera 126, a maximum speed ratio of the multi-mounting head 121, and the like). In the drawing, the external appearance of the components of each component type is also shown for reference.

  The mounting apparatus information 307c is information indicating the apparatus configuration for each of the sub-equipment constituting the production line, the above-described restrictions, and the like, and as shown in FIG. 9, the type of the multi mounting head 121, that is, the multi mounting head 121. The head information related to the number of suction nozzles, etc., the nozzle information related to the types of suction nozzles that can be mounted on the multi mounting head 121, the cassette information related to the maximum number of component cassettes 123, etc. It consists of tray information related to the number of trays and the like.

  An optimization program storage unit 305 illustrated in FIG. 6 is a hard disk or the like that stores various optimization programs that realize the functions of the optimization apparatus 300. The optimization program is a program that optimizes the mounting order of components and the supply position of components to the component mounting apparatus, and is functionally (as a processing unit that functions when executed by the arithmetic control unit 301), and the mounting order. An optimization unit 305a, a component placement optimization unit 305b, and the like are included.

  The mounting order optimizing unit 305a obtains the mounting order of components so that the mounting time of components on the board 20 is minimized based on various data stored in the database unit 307.

  The component placement optimization unit 305b determines the placement position of the component cassette 123 on the component supply units 124a, 125a, 124b, and 125b. The processing executed by the component placement optimization unit 305b will be described later.

  Next, the operation of the optimization apparatus 300 configured as described above will be described. FIG. 10 is a flowchart showing a component mounting order optimization process and a component placement optimization process to the component supply unit executed by the optimization apparatus 300.

  In the following description, the optimization process for the left sub-equipment 120c will be described, but the same optimization process is performed for the right sub-equipment 120d. First, the component arrangement optimizing unit 305b creates an angle table to be described later based on the mounting point data 307a (S11).

  FIG. 11 is a diagram illustrating an example of a positional relationship between the component supply units 124a and 124b included in the left sub-equipment 120c and the substrate 20 after component mounting. Here, as an example, two parts 402 and 404 of part type A, one part 406 of part type B, three parts 408, 410 and 412 of part type C, and part 414 of part type D are included. It is assumed that it is mounted on one substrate 20. Note that the mounting angle θi indicated in the mounting point data 307a is an angle formed between a component sucked from the component cassette 123 arranged in the component supply unit 124a and a component after being mounted on the board 20. Show. For example, as shown in FIG. 12, when parts of type A (hereinafter referred to as “part A” as appropriate (the same applies to other parts)) are arranged in the parts cassette 123, Since the mounting angle of the component 402 faces the same direction as the component A arranged in the component cassette 123, the mounting angle θi is 0 °. On the other hand, the mounting angle of the component 404 of the component type A is opposite to the component A arranged in the component cassette 123, so the mounting angle θi is 180 °.

  FIG. 13 is a diagram illustrating an example of an angle table created based on the mounting point data 307a of the component mounted on the board 20 illustrated in FIG. The angle table is a table showing the relationship between the component type of components mounted on one board 20, the mounting angle, and the number of components. Here, the mounting angle θi is classified into two types of angles of 0 ° and 180 °. For example, looking at component A, it is shown that there is one component with a mounting angle θi of 0 ° and one component with a mounting angle θi of 180 °.

  The attachment angle θi is classified as follows. FIG. 14 is a diagram schematically showing the mounting angle from 0 ° to 360 °. Of these, the ranges indicated by the arrows 420 (270 ° <θi ≦ 360 ° and 0 ° ≦ θi ≦ 90 °) are classified as 0 ° in the angle table. Further, it is assumed that the range indicated by the arrow 422 (90 ° <θi ≦ 270 °) is classified as 180 ° in the angle table. For example, a part having a mounting angle θi of 45 ° as shown in FIG. 15 is classified as 0 ° in the angle table. That is, a component classified as 0 ° on the angle table means that the rotation angle at the time of component mounting is smaller when the component cassette 123 is arranged in the component supply unit 124a. The classified parts mean that the rotation angle at the time of component mounting is smaller when the component cassette 123 is arranged in the component supply unit 124b.

  Next, the component arrangement optimizing unit 305b selects a component classified into only 0 ° or a component classified into only 180 ° in the angle table, and arranges the component cassette of the component based on the classified angle. The position is determined (S12). For example, in the angle table shown in FIG. 13, the mounting angle of the component B is one at 0 ° and there is no one at 180 °. For this reason, it is determined that the component cassette 123 of the component B is arranged in the component supply unit 124a. Similarly, although there are three parts C with a mounting angle of 0 °, there is no one with 180 °. For this reason, it is determined that the component cassette 123 of the component C is arranged in the component supply unit 124a. Further, as for the component D, there is one with a mounting angle of 180 °, but there is no one with 0 °. For this reason, it is determined that the component cassette 123 of the component D is arranged in the component supply unit 124b. Regarding the component A, there are one each having a mounting angle of 0 ° and one of 180 °. Therefore, the part cassette placement position is not determined in this step.

  Next, the component placement optimizing unit 305b makes the number of tasks in the sub-equipment 130a equal to the number of tasks in the sub-equipment 130b for the components that have not been placed in the component cassette in the process of S12. The arrangement of the component cassettes is determined (S13). Here, the “task” means a series of operations in one repetition of a series of operations of picking, moving, and mounting parts by the multi-mounting head 121, and “number of tasks” means the number of times of the series of operations. means.

  Here, assuming that the number of suction nozzles of the multi mounting heads 121 provided in the sub-equipment 130a and 130b is equal, making the number of tasks equal means that the number of parts mounted by the sub-equipment 130a and the sub-equipment are as much as possible. This means that the number of parts mounted by 130b is made equal. According to the process of S12, it is determined that four parts are mounted by the sub-equipment 130a and one part is mounted by the sub-equipment 130b. Therefore, the component arrangement optimizing unit 305b determines to arrange the component cassette 123 of the component A in the component supply unit 124b so that the components are mounted by the sub-equipment 130b having a small number of mounting points.

  As a result of the above processing, the arrangement of the component cassettes 123 as shown in FIG. 16 is determined. That is, the arrangement of the parts cassette 123 is determined so that the parts B and C are mounted by the sub-equipment 130a and the parts A and D are mounted by the sub-equipment 130b. As a result, the number of tasks in the sub facility 130a and the sub facility 130b becomes substantially equal.

  In addition, as shown in FIG. 16, when a component is attracted from the component cassette 123 of the component A and the component is mounted at the position of the component 402 of the substrate 20, it may be necessary to rotate the component.

  Finally, the mounting order optimization unit 305a optimizes the mounting order of components on the board 20 based on the determined arrangement position of the component cassette 123 (S14). Various methods for optimizing the component mounting order have been proposed so far and are not the main points of the present application, and therefore, detailed description thereof will not be repeated here.

As described above, according to the present embodiment, the arrangement position of the component cassette is determined so that it is not necessary to rotate the component as much as possible when the component is mounted. In addition, the arrangement positions of the component cassettes are determined so that the tact numbers of the two sub-equipment are almost equal. For this reason, it is possible to improve the component mounting accuracy while improving the tact time of the component.
(Embodiment 2)
In the first embodiment, the arrangement of the component cassettes 123 is determined with priority given to equalizing the number of tasks in the two sub-equipment in the process of S13 of FIG. In the second embodiment, the placement of the component cassette 123 is determined with priority given to improving the mounting position accuracy of the component on the substrate 20.

  The component mounting system 10 according to the second embodiment is the same as that shown in the first embodiment. However, the component mounting system 10 according to the second embodiment is partially different from the first embodiment in the processing executed by the optimization apparatus 300.

  FIG. 17 is a flowchart illustrating the component mounting order optimization process and the component placement optimization process to the component supply unit executed by the optimization apparatus 300.

  In the following description, the optimization process for the left sub-equipment 120c will be described as in the first embodiment, but the same optimization process is performed for the right sub-equipment 120d. The angle table creation process (S11) and the parts cassette arrangement process (S12) are the same as the processes shown in the first embodiment. Therefore, detailed description thereof will not be repeated here.

  For example, when the description is made using the same specific example as in the first embodiment, the arrangement of the component cassettes 123 for components B, C, and D is determined in the process of S12.

  Next, the component placement optimizing unit 305b determines the placement of the component cassette that minimizes the rotation amount of the suction nozzle 121a of the multi-mounting head 121 for the components that have not been placed in the processing of S12. (S21). That is, for component A, there is one each having a mounting angle of 0 ° and 180 °, and therefore component cassette 123 of component A is arranged in both component supply unit 124a and component supply unit 124b. The decision is made. As a result of the above, the arrangement of the component cassettes 123 as shown in FIG. 18 is determined. That is, the arrangement of the parts cassette 123 is determined so that the parts B and C are mounted by the sub-equipment 130a, the part D is mounted by the sub-equipment 130b, and the part A is mounted by the sub-equipment 130a and 130b. . As described above, by arranging the component A in both the component supply units 124a and 124b, when the components 402 and 404 are mounted on the board 20, they can be mounted without rotating the components.

Thereafter, a component mounting order optimization process (S14) is performed.
As described above, according to the present embodiment, the arrangement position of the component cassette is determined so that it is not necessary to rotate the component as much as possible when the component is mounted. For this reason, component mounting accuracy can be improved. In addition, since the time required for component rotation is reduced, the tact time of the component can be improved.

  The component mounting system 10 according to the first and second embodiments of the present invention has been described above, but the present invention is not limited to these embodiments.

  For example, the description has been made on the assumption that a component mounting apparatus that performs component mounting on a single substrate in an alternate operation is not limited to this, and component cassettes can be arranged in different directions. Any other component mounting device may be used as long as it is a component mounting device. FIG. 19 is an external view of such a component mounting apparatus as viewed from the front obliquely. In the drawing, the component mounting apparatus 500 is partially cut away to show the inside.

  The component mounting apparatus 500 can be incorporated into a component mounting system. The component mounting apparatus 500 is an apparatus that mounts an electronic component on a board received from the upstream and sends a circuit board, which is a mounting board on which the electronic component is mounted, to the downstream. A multi-mounting head 510 that transports and mounts electronic components on a substrate, an XY robot 513 that moves the multi-mounting head 510 in a horizontal plane direction, and a component supply unit 515 that supplies components to the multi-mounting head 510. . An operation unit 516 for operating the component mounting apparatus 500 is provided on the front surface of the component mounting apparatus 500. An operation unit (not shown) is also provided on the back surface of the component mounting apparatus 500.

  Specifically, this component mounting apparatus 500 is a mounting machine that can mount various electronic components from minute components to connectors on a board. □ Large electronic components of 10 mm or more, and irregular shaped components such as switches and connectors , A mounting machine capable of mounting IC components such as QFP (Quad Flat Package) and BGA (Ball Grid Array).

FIG. 20 is a plan view showing the main internal configuration of the component mounting apparatus 500.
The component mounting apparatus 500 further conveys the two substrates 20a and 20b, and a nozzle station 519 on which a replacement nozzle that can be interchangeably attached to the multi-mounting head 510 to accommodate various types of component types. Rails 521, a mounting table (not shown) on which the transported boards 20a and 20b are mounted and electronic components are mounted, and the sucked and held electronic components are recovered if they are defective. And a parts collection device 523.

  Also, the component supply unit 515 is provided before and after the component mounting apparatus 500, and partitions the component supply units 515a, 515b and 515c for supplying electronic components stored in a tape shape according to the size of the component. And a component supply unit 515d for supplying an electronic component stored in the attached plate.

  According to the method shown in the second embodiment, the optimization apparatus 300 arranges a component cassette in any of the component supply units 515a to 515c of the component mounting apparatus 500 so that the rotation of the component at the time of component mounting is minimized. That's fine.

  In the first embodiment, the component cassette is arranged only in one component supply unit for the component (component A) for which the component cassette has not been arranged in the processing of S12. You may make it arrange | position a parts cassette in a part.

  Furthermore, in the second embodiment, the component cassette is arranged in both the component supply units for the component (component A) for which the component cassette has not been arranged in the process of S12. Alternatively, the parts cassette may be arranged only in the area. In that case, the component supply unit in which the component cassette is arranged is selected so that the component is not rotated as much as possible when the component is mounted. That is, even if the mounting accompanied by the rotation of the component occurs, the component cassette may be arranged in the component supply unit on the side where the rotation is minimized.

  Furthermore, the component mounting apparatus 120 may have the function of the optimization apparatus 300, and the component mounting apparatus 120 itself may determine the optimal arrangement of the component cassettes.

  The present invention can be applied to an electronic component mounting system for mounting components on a substrate.

1 is an external view showing a configuration of an entire component mounting system according to a first exemplary embodiment of the present invention. It is a top view which shows the main structures inside a component mounting apparatus. It is a schematic diagram which shows the positional relationship of a multi mounting head and a component cassette. It is a figure for demonstrating the component mounting by a component mounting apparatus. It is a figure for demonstrating the component mounting by a component mounting apparatus. It is a block diagram which shows one structural example of the optimization apparatus in Embodiment 1 of this invention. It is a figure which shows an example of mounting point data. It is a figure which shows an example of a component library. It is a figure which shows an example of mounting apparatus information. It is a flowchart which shows the optimization process of the component mounting order which the optimization apparatus performs, and the component arrangement | positioning optimization process to a component supply part. It is a figure which shows an example of the positional relationship of the two component supply parts contained in the left sub-facility, and the board | substrate after component mounting. It is a figure for demonstrating the mounting angle of components. It is a figure which shows an example of the angle table produced based on the mounting point data of the components mounted in a board | substrate. It is a figure for demonstrating the creation process of an angle table. It is a figure for demonstrating the creation process of an angle table. It is a figure which shows an example of arrangement | positioning of the determined components cassette. It is a flowchart which shows the optimization process of the component mounting order which the optimization apparatus performs, and the component arrangement | positioning optimization process to a component supply part. It is a figure which shows an example of arrangement | positioning of the determined components cassette. It is the external view which looked at the component mounting apparatus from diagonally forward. It is a top view which shows the main internal structures of the component mounting apparatus shown in FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Component mounting system 20, 20a, 20b Board | substrate 120, 200, 500 Component mounting apparatus 120c Left sub-equipment 120d Right sub-equipment 121 Multi mounting head 121a, 121b Adsorption nozzle 122 Beam 123 Component cassette 124a, 124b, 125a, 125b, 515, 515a, 515b, 515c Component supply unit 126 Component recognition camera 128 Tray supply unit 129 Rail 130a, 130b, 132a, 132b Sub-equipment 300 Optimization device 301 Calculation control unit 302 Display unit 303 Input unit 304 Memory unit 305 Optimization program storage unit 305a Mounting order optimization unit 305b Component placement optimization unit 306 Communication I / F unit 307 Database unit 307a Mounting point data 307b Component library 307c Mounting device information 402 04,406,408,414 parts 420, 422 arrow 510 gang pickup head 513 XY robot 516 operating section 519 nozzle station 521 Rail 523 parts collection device

Claims (9)

A method for determining an arrangement position of a component cassette in a component mounting apparatus for mounting a component on a board,
The component mounting apparatus includes a plurality of component supply units in which component cassettes in which components are stored are arranged, and supply angles of components from the component cassettes are different from each other.
Among the plurality of component supply units, the component cassette is arranged so that the rotation amount of the component by the mounting head is minimized until the component is sucked from the component cassette by the mounting head and mounted on the substrate. A component placement position determination method comprising a determination step of determining a position. The determining step includes
An angle table creation step for creating an angle table that is a table showing the relationship between the component type of the component mounted on the board, its mounting angle, and the number of components;
A component cassette arrangement position determining step for determining, based on the angle table, a component supply unit that minimizes the rotation amount for each component type as an arrangement position of a component cassette of the component type. Item 2. The component placement position determination method according to Item 1. In the component cassette arrangement position determination step, when a component supply unit that minimizes the rotation amount is uniquely determined for each component type based on the angle table, the component supply unit is arranged with the component cassette of the component type. The part placement position determination method according to claim 2, wherein the part placement position determination method is performed. The component mounting apparatus further includes a plurality of mounting heads respectively corresponding to the plurality of component supply units,
The determining step includes
An angle table creation step for creating an angle table that is a table showing the relationship between the component type of the component mounted on the board, its mounting angle, and the number of components;
When a component supply unit that minimizes the rotation amount is uniquely determined for each component type based on the angle table, a first component cassette that determines the component supply unit as the arrangement position of the component cassette of the component type An arrangement position determining step;
When a series of operations in a repetition of a series of operations of picking, moving, and mounting a component by a mounting head is used as a task, for a component type whose component supply unit is not uniquely determined, based on the angle table, A second component cassette arrangement position determining step of selecting at least one component supply unit and determining an arrangement position of the component cassette of the component type so that the number of tasks by the plurality of mounting heads is equalized. The component arrangement position determination method according to claim 1, wherein the component arrangement position is determined. The determining step includes
An angle table creation step for creating an angle table that is a table showing the relationship between the component type of the component mounted on the board, its mounting angle, and the number of components;
When a component supply unit that minimizes the rotation amount is uniquely determined for each component type based on the angle table, a first component cassette that determines the component supply unit as the arrangement position of the component cassette of the component type An arrangement position determining step;
For a component type for which the component supply unit is not uniquely determined, at least one component supply unit is selected from the component supply units having the maximum number of rotations based on the angle table. The component placement position determination method according to claim 1, further comprising: a second component cassette placement position determination step for determining a placement position of the component cassette. The determining step includes
An angle table creation step for creating an angle table that is a table showing the relationship between the component type of the component mounted on the board, its mounting angle, and the number of components;
When a component supply unit that minimizes the rotation amount is uniquely determined for each component type based on the angle table, a first component cassette that determines the component supply unit as the arrangement position of the component cassette of the component type An arrangement position determining step;
For a component type for which the component supply unit is not uniquely determined, a plurality of component supply units are selected based on the angle table so that the rotation amount is minimized, and the arrangement position of the component cassette of the component type is determined. The component placement position determination method according to claim 1, further comprising: a second component cassette placement position determination step. An apparatus for determining a placement position of a component cassette in a component mounting apparatus for mounting a component on a board,
The component mounting apparatus includes a plurality of component supply units in which component cassettes in which components are stored are arranged, and supply angles of components from the component cassettes are different from each other.
Among the plurality of component supply units, the component cassette is arranged so that the rotation amount of the component by the mounting head is minimized until the component is sucked from the component cassette by the mounting head and mounted on the substrate. A component arrangement position determining device comprising: a component arrangement determining unit that determines a position. A program of a method for determining an arrangement position of a component cassette in a component mounting apparatus for mounting a component on a board,
The component mounting apparatus includes a plurality of component supply units in which component cassettes in which components are stored are arranged, and supply angles of components from the component cassettes are different from each other.
Among the plurality of component supply units, the component cassette is arranged so that the rotation amount of the component by the mounting head is minimized until the component is sucked from the component cassette by the mounting head and mounted on the substrate. A program for causing a computer to execute a determination step for determining a position. A component mounting apparatus for mounting components on a board,
A plurality of component supply units in which component cassettes in which components are stored are arranged, and supply angles of components from the component cassettes are different from each other;
Among the plurality of component supply units, the component cassette is arranged so that the rotation amount of the component by the mounting head is minimized until the component is sucked from the component cassette by the mounting head and mounted on the substrate. A component mounting apparatus comprising: a position and a component arrangement determining unit that determines a position.

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