JP2006349306A - Cooler for electronic equipment, and electronic equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To allow an operation as a circulation type cooler even when an attitude of electronic equipment is varied three-dimensionally in any way to cool an electronic element. <P>SOLUTION: A heat pipe 5 constitutes a closed loop comprising an evaporation part 6 fixed to an imaging element 4, a condensation part 10 fixed to a corner of a camera casing 2, a vapor phase path 7, and a liquid phase path 8. A gas flow passage 11 is formed in the condensation part 10 to circulate hollow portions of three hollow plane plates, and condensation areas 13, 14 are arranged in an area surrounded by the annular gas flow passage 11 and an area of enveloping gas flow passage 11. A working fluid brought into a gas phase by heat from the imaging element 4 in the evaporation part 6 flows into the gas flow passage 11 through the vapor phase path 7, comes from the gas flow passage 11 into at least one of the condensation areas 13, 14, even when the posture of an electronic equipment varied three-dimensionally in any way, and is liquefied while radiating the heat to a casing 2 wall face, and a liquid therein flows liquid phase path ports 17, 18 by the action of gravity to be returned to the evaporation part 6 through the liquid phase path 8. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a cooling device for electronic devices and an electronic device.

  As one of means for cooling a semiconductor element such as an image pickup element, a heat pipe using capillary pumped loops (CPL) is known. This heat pipe connects an evaporation part and a condensation part to a gas phase path and It connects with a liquid phase path and is comprised so that a working fluid may be circulated inside. The working fluid that has become a liquid phase in the condensing unit reaches the evaporation unit through the liquid phase path, receives heat from a heat source (imaging device), becomes a gas, and the working fluid that has become a gas phase passes through the gas phase path. It reaches the condensing part, releases heat, and returns to the liquid again. During the operation described above, in the condensing unit, the working fluid flowing in from the gas phase channel port is reduced from the gas phase to the liquid phase while passing through a plurality of capillaries called wicks connecting the gas phase channel port and the liquid phase channel port, and the liquid acts by gravity. To return to the liquid phase port. Therefore, the state in which the extending direction of the wick leading from the gas phase path port to the liquid phase path port faces the direction of gravity operates the heat pipe most efficiently.

  Imaging devices such as cameras are often used at various angles and postures. In order to operate the heat pipe even if the angle and orientation change, the conventional apparatus of Patent Document 1 is provided with two liquid phase path ports sandwiching the gas phase path port, and from the gas phase path port to the liquid phase path port on a flat plate. For example, it is formed radially so that a plurality of wicks leading to the wick extend in many directions (see, for example, Patent Document 1).

Japanese Patent Laying-Open No. 2004-19079 (Page 4, FIG. 5)

  In the apparatus of Patent Document 1, if any of the plurality of wicks that lead from the gas phase path port to the liquid phase path port faces the direction of gravity, the heat pipe operates efficiently. However, in the apparatus of Patent Document 1, when any wick is in a horizontal state not facing the direction of gravity, there is a problem that it does not operate or the efficiency is remarkably reduced.

(1) A cooling device for electronic equipment according to claim 1 of the present invention cools the working fluid vaporized in the evaporating unit, the evaporating unit that vaporizes the working fluid by the heat generated in the object to be cooled, and the heat. A circulatory type having a condensing part liquefied, a gas phase path for transferring the working fluid vaporized in the evaporation part to the condensing part, and a liquid phase path for transferring the working fluid liquefied in the condensing part to the evaporation part In the cooling device, the condensing unit has a triangular pyramid as a whole and has at least a three-surface structure that is hollow inside and substantially orthogonal to each other, and a gas phase path is connected to the structure. A working fluid inlet and a working fluid outlet to which a liquid phase path is connected. A first flow path through which the working fluid supplied from the working fluid inlet flows is communicated with the hollow interior of each component. The working flow supplied to the first flow path is provided around the first flow path. Condensation zone to condense is provided a second flow path for transferring toward the working fluid condensed in the condensation zone to the working fluid outlet, characterized in that provided on the condensation region.
(2) The invention according to claim 2 is the electronic device cooling device according to claim 1, wherein a plurality of minute protrusions for radiating the working fluid flowing in from the first flow path are formed in a matrix in the condensation region. It is characterized by being.
(3) The invention of claim 3 is the electronic device cooling apparatus of claim 1 or 2, wherein the liquid phase passage and the second passage have a capillary structure.
(4) An electronic device according to a fourth aspect includes a housing that accommodates various electronic components and an electronic substrate therein, and the electronic device cooling device according to any one of the first to third aspects provided in the housing. The condensing part of the cooling device for electronic devices is disposed in contact with the wall surface of the corner in the housing.

  According to the electronic device cooling device of the present invention, the electronic device can be cooled by operating as a circulation type cooling device regardless of how the posture of the electronic device changes three-dimensionally.

  Hereinafter, a cooling device for an electronic apparatus and an electronic camera according to an embodiment of the present invention will be described with reference to FIGS. 1 to 6, the same components are denoted by the same reference numerals, and directions are represented by XYZ orthogonal coordinates.

  FIG. 1 is an overall configuration diagram schematically showing an internal configuration of an electronic camera according to an embodiment of the present invention. FIG. 2 is a perspective view of the internal configuration of the electronic camera according to the embodiment as viewed from the back side of the camera. FIG. 3 is an enlarged perspective view showing the condensing part of the cooling device shown in FIG. 2 in an enlarged manner. FIG. 4 is an enlarged view illustrating an evaporation unit of the cooling device according to the embodiment. FIG. 5 is a perspective view showing the condensing unit shown in FIG. 3 in a simplified manner. 1 to 5, the −Z direction in which gravity acts is referred to as a vertically downward direction, and the opposite + Z direction is referred to as a vertically upward direction.

  Referring to FIG. 1, an electronic camera 1 includes a lens barrel 3 provided in a camera housing 2 and an imaging element 4 on which a subject light L incident on the housing 2 through the lens barrel 3 forms an image on a light receiving surface. And a heat pipe 5 for cooling the imaging device 4. The image sensor 4 is a well-known CCD image sensor, CMOS image sensor, or the like, and converts an optical image formed on the light receiving surface into an electrical signal and outputs the electrical signal.

  The heat pipe (cooling device) 5 is transmitted with heat generated by the image sensor 4, and an evaporator 6 that vaporizes the working fluid with the heat, and a condenser that cools and liquefies the working fluid vaporized by the evaporator 6. 10, a gas phase path 7 that is a pipe that transfers the working fluid vaporized in the evaporator 6 to the condenser 10, and a liquid that is a pipe that transfers the working fluid liquefied in the condenser 10 to the evaporator 6. A circulation type cooling device having a phase path 8. The evaporation unit 6 is attached to a surface opposite to the light receiving surface of the image sensor 4. The condenser 10 is disposed in close contact with the inner wall surface of the corner of the housing 2 in order to cool the working fluid by efficiently radiating heat to the camera housing 2.

Hereinafter, the overall configuration of the heat pipe 5 and the structure of the condensing unit 10 that is the most characteristic of the present invention will be described in detail with reference to FIGS.
First, the structure of the evaporation unit 6 will be described with reference to FIGS. The evaporation unit 6 is configured so that the flat portion of the flat plate-like evaporation unit main body 6A is brought into close contact with the back surface of the image pickup device 4 and heat generated by the image pickup device 4 is efficiently transferred to the evaporation unit 6. Inside the evaporation section 6, a plurality of capillary wicks 6c extend in a direction connecting the gas phase channel port 6a and the liquid phase channel port 6b, and the gas phase channel port 6a and the liquid phase channel port 6b communicate with each other by the wick 6c. is doing.

  The structure of the condensing part 10 is demonstrated with reference to FIG. 2, FIG. As shown in FIG. 2, the condensing unit 10 includes a condensing unit body 10A in which three hollow flat plates 10x, 10y, and 10z that are orthogonal to each other are integrated, and the appearance as a whole exhibits a triangular pyramid. It is disposed at the upper left front corner of the housing 2. That is, in the condensing unit 10, the hollow flat plates 10x, 10y, and 10z are fixed to the front plate 2x, the side plate 2y, and the upper plate 2z of the camera housing 2, respectively. The hollow portions of the three hollow flat plates 10x, 10y, and 10z communicate with each other.

  As shown in FIG. 3, the condensing unit 10 is formed with a gas passage 11 that circulates through substantially the center of the hollow portions of the three hollow flat plates 10x, 10y, and 10z. In the hollow portion of each of the hollow flat plates 10x, 10y, 10z, a region surrounded by the annular gas passage 11 is an inner condensation region 13, and a region surrounding the gas passage 11 is an outer condensation region 14. As shown in FIG. 3, in the inner condensation region 13 and the outer condensation region 14, a large number of minute columnar protrusions 13a and 14a are formed in a matrix at a predetermined interval. Thereby, the surface area of the hollow part of 10 A of condensation part main bodies becomes large, and the thermal radiation effect | action to the inner wall face of the housing 2 becomes large. Further, the cylindrical protrusions 13a and 14a become resistant to the flow of the liquefied working fluid, and the time for liquefaction can be increased.

  Further, in the three hollow flat plates 10x, 10y, and 10z, inner liquid passages 15 are formed at the three ridge lines of the inner condensation region 13, and the outer liquid passage 16 is formed at the three ridges and the outer edge of the outer condensation region 14. Is formed. The outer liquid passage 16 formed at the outer edge of the outer condensation region 14 has an annular shape that is substantially similar to the gas passage 11. Both the inner liquid passage 15 and the outer liquid passage 16 have a mesh structure (mesh shape) that generates capillary force.

  In short, the condensing unit 10 has a structure shown in a simplified manner in FIG. That is, the inner condensing region 13 includes a region where the columnar protrusions 13a are formed by patterning on each of the hollow flat plates 10x, 10y, and 10z, and an inner liquid passage 15 formed at three ridge lines, and gas is present throughout the region. And a structure through which liquid can pass. Similarly, the outer condensing region 14 includes a region where the cylindrical protrusions 14a are formed by patterning on the hollow flat plates 10x, 10y, and 10z, and an outer liquid passage 16 formed on three ridge lines and an annular outer edge. And has a structure through which gas and liquid can pass over the entire region. As a result, the annular gas passage 11 is sandwiched between the region where the cylindrical protrusion 13a is formed by patterning and the region where the cylindrical protrusion 14a is formed by patterning. 13 and the outer condensation region 14.

  Further, the gas passage 11 is provided with a gas phase passage port 12 connected to the gas phase passage 7. In FIG. 3, the gas-phase passage port 12 is provided at substantially the center of the hollow flat plate 10 z, but may be provided at any position in the gas passage 11. Further, the inner liquid passage 15 is provided with an inner liquid phase passage port 17 connected to the liquid phase passage 8. The inner liquid phase passage port 17 is provided at the intersection of the three hollow flat plates 10x, 10y, and 10z in the drawing, but may be provided at any position in the inner liquid passage 15. The outer liquid passage 16 is provided with an outer liquid phase passage port 18 connected to the liquid phase passage 8. In FIG. 3, the outer liquid phase passage port 18 is provided at the corner of the outer edge portion of the hollow flat plate 10 x, but may be provided at any position in the outer liquid passage 16. Note that the liquid phase path 8 is formed by integrating the pipe line from the inner liquid phase path opening 17 and the pipe line from the outer liquid phase path opening 18 into one pipe line, and is connected to the liquid phase path port 6 b of the evaporation unit 6. .

  Referring again to FIG. 2, in the evaporation unit 6, the gas phase path port 6 a and the liquid phase path port 6 b communicate with each other by a plurality of branched wicks 6 c, and referring to FIG. 3, The passage port 12 and the inner liquid phase passage port 17 communicate with each other through the inner condensation region 13, and the gas phase passage port 12 and the outer liquid phase passage port 18 communicate with each other through the outer condensation region 14. That is, a closed loop is formed by the wick 6 c of the evaporation unit 6, the gas phase path 7, the inner condensation region 13 and the outer condensation region 14 of the condensation unit 10, and the liquid phase channel 8. The working fluid sealed in the closed loop is, for example, water, various alcohols, ethyl ether, ethylene glycol, or fluorinate.

  In the evaporation section 6, a plurality of branched wicks 6c are formed in the evaporation section body 6A in a groove shape. The wick 6c is produced, for example, by forming a plurality of grooves on one of two flat plates and attaching the other flat plate in close contact with the groove forming surface. The wick 6c of the evaporation unit 6 is not limited to the groove structure, and a mesh structure, a porous structure, or a fine uneven structure similar to the inner condensation region 13 and the outer condensation region 14 of the condensation unit 10 can also be used.

  As described above, in the condensing unit 10, the gas passage 11, the inner condensing region 13, and the outer condensing region 14 are formed. The inner condensing region 13 and the outer condensing region 14 are, for example, formed with fine irregularities on one of two thin flat copper plates using lithography, etching, etc., that is, patterning formation of the cylindrical protrusions 13a and 14a is performed. In addition, a rod-like mesh material is attached to the three ridge lines and the annular outer edge, and finally, the other flat copper plate is attached. Further, since the liquid phase path 8 needs to generate a capillary force, as shown in FIG. 4, the liquid phase path 8 is formed by an aggregate of capillaries having a capillary structure in which thin fibers or thin wires are bundled in a pipe. However, a mesh structure, a porous structure, etc. can also be used.

Next, the effect of the heat pipe 5 by this Embodiment is demonstrated.
Referring to FIGS. 2 and 4, the heat generated in the imaging device 4 is transmitted to the liquid-phase working fluid present in each wick 6 c of the evaporation unit 6, and the liquid is evaporated and vaporized by the heat. As a result, the image sensor 4 is cooled. The working fluid that has become a gas phase is collected at the gas phase passage opening 6 a and is guided to the condensing unit 10 through the gas phase passage 7.

  The vapor-phase working fluid that has reached the condensing unit 10 enters the annular gas passage 11 from the gas-phase passage port 12 and passes through the inner condensing region 13 and the outer condensing region 14. 2y, liquefying while dissipating heat to the upper plate 2z. The liquid droplets generated by liquefaction in the inner condensation region 13 return to the inner liquid passage 15 by gravity. Similarly, droplets generated by liquefaction in the outer condensation region 14 also return to the outer liquid passage 16 by the gravitational action. The liquid-phase working fluid that has flowed back to the inner liquid passage 15 and the outer liquid passage 16 is collected by the capillary force into the inner liquid-phase passage port 17 and the outer liquid-phase passage port 18, respectively, and passes through the liquid-phase passage 8 to the evaporation unit 6. It is guided.

  The heat release-liquefaction process by the inner condensing region 13 and the outer condensing region 14 can be roughly divided into two types depending on the direction in which the working fluid flows. FIGS. 6A and 6B are enlarged perspective views showing an enlargement of the condensing part of the cooling device according to the embodiment, in which FIG. 6A shows a first heat release-liquefaction process, and FIG. 6B shows a second heat release-liquefaction process. It is. FIG. 6A shows a heat dissipation-liquefaction process in a posture in which the intersecting portion of the three hollow flat plates 10x, 10y, and 10z is located at the most vertically upper position in the condensing unit 10. This posture is a so-called lateral position photographing posture in which the corner of the camera housing 2 to which the condensing unit 10 is fixed is positioned most vertically upward and the hollow flat plate 10z is horizontal.

  Since a part of the outer condensing region 14, that is, the surface region Ax of the hollow flat plate 10x and the surface region Ay of the hollow flat plate 10y are positioned vertically below the gas passage 11, these surface regions Ax and Ay are indicated by white arrows. The working fluid flows most efficiently in the -Z direction shown. In the inner condensation region 13 and the outer condensation region 14 that are vertically lower than the gas passage 11, the working fluid flows though the efficiency is lowered. Therefore, in the posture of the condensing unit 10 in FIG. 6A, a series of processes of heat release-liquefaction-reflux is performed in the inner condensation region 13 and the outer condensation region 14 of the hollow flat plates 10x, 10y.

  FIG. 6B shows a heat dissipation-liquefaction process in a posture in which the intersection of the three hollow flat plates 10 x, 10 y, 10 z is positioned at the lowest position in the condenser 10. This posture is a downward photographing posture in which the corner of the camera housing 2 to which the condensing unit 10 is fixed is located at the lowest vertical position and the hollow flat plate 10x is horizontal.

  A part of the inner condensing region 13, that is, the surface region Cy of the hollow flat plate 10 y and the surface region Cz of the hollow flat plate 10 z are positioned vertically below the gas passage 11. The working fluid flows most efficiently in the -Z direction shown. Further, the working fluid also flows in the surface regions Dy and Dz of the outer condensing region 14 on the vertically lower side from the gas passage 11 although efficiency is lowered. Therefore, in the posture of the condensing unit 10 in FIG. 6B, a series of processes of heat release-liquefaction-reflux is performed in a part of the inner condensation region 13 and the outer condensation region 14 of the hollow flat plates 10y, 10z.

  As described with reference to FIGS. 6A and 6B, the heat pipe 5 of this embodiment has the inner condensation region 13 vertically below the gas passage 11 regardless of the posture of the electronic camera 1 in three dimensions. And a portion of at least one of the outer condensation regions 14 will be located. In other words, in the inner condensing region 13 and the outer condensing region 14, there is always a steeply inclined surface of 45 ° or more with respect to the horizontal plane with respect to the position of the gas passage 11. Therefore, the heat pipe 5 can be operated with high efficiency. As a result, the image sensor 4 of the electronic camera 1 is sufficiently cooled regardless of the direction in which the electronic camera 1 is rotated, and a high-quality image can be obtained.

  The present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the spirit of the present invention. For example, between the hollow flat plates 10x, 10y, and 10z of the condensing unit 10 and the front plate 2x, the side plate 2y, and the upper plate 2z of the camera housing 2, the heat dissipation target members for absorbing heat from the condensing unit 10 respectively. May be interposed. If this heat radiation target member is made of aluminum or copper having good thermal conductivity, the heat radiation efficiency of the condensing part 5 is improved. Further, in the present embodiment, the hollow flat plates 10x, 10y, and 10z are orthogonal to each other. However, the hollow flat plates 10x, 10y, and 10z may have an angle other than a right angle depending on the housing to which the hollow flat plates 10x, 10y, and 10z are fixed. Further, instead of the image sensor 4, a semiconductor element such as an IC or LSI may be a cooling target of the heat pipe 5, or an imaging element or a semiconductor element of an electronic device other than the electronic camera may be a cooling target of the heat pipe 5.

  Regarding the correspondence between the claims and the constituent elements according to the embodiment, the constituent body is one of the hollow flat plates 10x, 10y, 10z, the first flow path is the gas passage 11, and the condensing region is the inner condensing region. The second flow path corresponds to the inner liquid passage 15 and the outer liquid passage 16, respectively. In addition, the above description is an example to the last, and when interpreting invention, it is not limited or restrained at all by the correspondence of the description matter of said embodiment, and the description matter of a claim.

It is a whole block diagram which shows typically the internal structure of the electronic camera which concerns on embodiment of this invention. It is the perspective view which looked at the internal structure of the electronic camera which concerns on embodiment of this invention from the camera back side. It is an expansion perspective view which expands and shows the condensation part of the cooling device shown in FIG. It is an enlarged view which expands and shows the evaporation part of the cooling device shown in FIG. It is a perspective view which simplifies and shows the condensation part shown in FIG. It is an expansion perspective view which expands and shows the condensation part of the cooling device concerning an embodiment of the invention, (a) is the 1st heat dissipation-liquefaction process, (b) is the figure which shows the 2nd heat dissipation-liquefaction process. It is.

Explanation of symbols

1: Electronic camera 2: Camera housing 4: Image sensor 5: Heat pipe 6: Evaporating section 7: Gas phase path 8: Liquid phase path 10: Condensing section 10A: Condensing section body 10x, 10y, 10z: Hollow flat plate 11: Gas passage 12: Gas phase passage 13: Inner condensation region 14: Outer condensation region 15: Inner liquid passage 16: Outer liquid passage 17: Inner liquid phase passage 18: Outer liquid phase passage

Claims (4)

The heat generated in the object to be cooled is transmitted, and the evaporator vaporizes the working fluid with the heat;
A condensing unit for cooling and liquefying the working fluid vaporized in the evaporation unit;
A gas phase path for transferring the working fluid vaporized in the evaporation section to the condensation section;
A circulation type cooling device having a liquid phase path for transferring the working fluid liquefied in the condensing unit to the evaporation unit,
The condensing part has at least a three-surface structure in which the overall appearance shape is a triangular pyramid, the inside is hollow and substantially orthogonal to each other,
The component is provided with a working fluid inlet to which the gas phase path is connected and a working fluid outlet to which the liquid phase path is connected.
A first flow path through which the working fluid supplied from the working fluid inlet flows is provided in communication with the hollow interior of each component,
A condensing region for condensing the working fluid supplied to the first flow path is provided around the first flow path,
A cooling device for electronic equipment, wherein a second flow path for transferring the working fluid condensed in the condensing region toward the working fluid outlet is provided in the condensing region. In the cooling device for electronic devices of Claim 1,
The cooling apparatus for electronic equipment, wherein a plurality of minute protrusions for radiating the working fluid flowing from the first flow path are formed in a matrix in the condensation region. In the cooling device for electronic devices according to claim 1 or 2,
The liquid phase path and the second flow path have a capillary structure, and the electronic device cooling apparatus. A housing that houses various electronic components and an electronic board inside,
The electronic apparatus cooling device according to any one of claims 1 to 3 provided in the housing.
The said condensation part of the cooling device for electronic devices is arrange | positioned in contact with the wall surface of the corner part in a housing, The electronic device characterized by the above-mentioned.

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