JP2006344288A - Manufacturing method of optical information recording medium, and optical information recording medium - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To suppress occurrence of errors by suppressing electrification of a substrate to the minimum when dispensing an adhesive layer solution. <P>SOLUTION: The manufacturing method of an optical information recording medium includes: a substrate manufacturing process; a recording layer forming process; an edge cleaning process; a reflecting film forming process; and an adhesion process. Then, before going into the adhesion process and when discharging the adhesive layer solution 58a from a discharge nozzle 74, a neutralizing blow 82 (ionized air) is arranged to blow on an area including the discharge nozzle 74 and the substrate 10 through a neutralizing blow device 80, and the maximum static charge voltage of the substrate 10 is made to 7kV or lower when dispensing the adhesive layer solution 58a. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a method for manufacturing an optical information recording medium and an optical information recording medium, in which an information recording layer is formed on a substrate, and information can be recorded and / or reproduced by irradiation with laser light.

  In general, as an optical information recording medium (optical disc) capable of recording information only once by a laser beam, there are a write-once type CD (so-called CD-R), a DVD-R, etc., and a conventional CD (compact disc). Compared to production, it has the advantage that a small amount of CD can be supplied to the market quickly and at a reasonable price, and the demand is increasing with the recent spread of personal computers and the like.

  A typical structure of a CD-R type optical information recording medium is a recording layer made of an organic dye on a transparent disk-shaped substrate having a thickness of about 1.2 mm, a light reflecting layer made of a metal such as gold, and a resin. These protective layers are laminated in this order (see, for example, JP-A-6-150371).

  Also, the DVD-R type optical information recording medium has a structure in which two disc-shaped substrates (thickness of about 0.6 mm) are bonded with each information recording surface facing inward, and the amount of recorded information It has the feature that there are many.

  Information writing (recording) on these optical information recording media is performed by irradiating laser light, and the irradiated portion of the dye recording layer absorbs the light to locally increase the temperature, A chemical change (eg, pit generation) occurs and information is recorded by changing its optical properties.

  On the other hand, reading (reproduction) of information is usually performed by irradiating a laser beam having the same wavelength as that of the recording laser beam, and a portion where the optical characteristics of the dye recording layer are changed (recording portion by generating pits). Information is reproduced by detecting a difference in reflectance from a non-changed part (unrecorded part).

  Conventionally, in order to prevent dust and dust from adhering to the optical information recording medium due to static electricity generated in the manufacturing process of the optical information recording medium, an antistatic agent or static elimination is performed.

  For example, in Patent Document 1, in an optical disc having a recording layer on one side of a resin transparent substrate and a hard coat layer on the other side, the hard coat layer is made of a cured film of an actinic ray curable resin, and An example in which an organic compound layer made of a film containing an organic antistatic agent is provided between a resin transparent substrate and a hard coat layer has been proposed. In this case, it can be formed by a spin coating method with excellent mass productivity, and exhibits an effect of preventing dust adsorption on the surface under both high humidity conditions and low humidity conditions, and also has surface smoothness and optical properties. It is possible to provide an optical disc having a hard coat layer that retains uniform uniformity and further sufficient scratch resistance.

  In Patent Document 2, an ultraviolet curable resin that is shaken off when the optical disk substrate is rotated in a state where an ultraviolet curable resin for forming a protective film is supplied to the surface of the optical disk substrate is collected by a resin tray, and a resin paint tray is obtained. An example has been proposed in which the ultraviolet curable resin recovered in (2) is reused after being filtered by a second filter. In particular, an example is disclosed in which the protective film formed of an ultraviolet curable resin is a protective film formed on a recording film or a reflective film, or a charging protective film formed on a laser light irradiation surface of an optical disk substrate. .

  Also, in Patent Document 3, conventionally, a static eliminator is installed on the spindle so that the static electricity charged when the optical disk is accumulated on the spindle can be removed, and the optical disk accumulated on the spindle is set to 5000V. Examples have been proposed in which static elimination is possible to the following.

  Furthermore, conventionally, a technique has been proposed in which an information recording layer in an optical information recording medium is uniformly formed to suppress the occurrence of errors.

  For example, in Patent Document 4, in a method for manufacturing an information recording medium having a dye recording layer capable of recording information on a substrate, clean air is circulated while rotating the substrate on which the dye recording layer is formed at high speed. A lid having a circular opening at the center is placed in the opening at the top of the apparatus rotating the substrate at a high speed, and the intake for taking in clean air is narrowed. It is disclosed that clean air is uniformly distributed to the dye recording layer and dried, and the film thickness of the dye recording layer is made uniform in a short drying time to improve the throughput of the information recording medium.

  In Patent Document 5, in a method of manufacturing an information recording medium having a dye recording layer capable of recording information on a substrate, a dye solution for forming a dye recording layer is applied on the substrate while rotating the substrate. In this case, the thickness of the discharge nozzle for discharging the dye solution is formed to a thickness of at least 0.3 mm, thereby suppressing the occurrence of defective formation of the recording layer and improving the yield of the information recording medium. Is disclosed.

  Patent Document 6 discloses a method for manufacturing a heat mode type optical information recording medium having a dye recording layer capable of recording information on a substrate by irradiation with laser light, and the dye recording layer while rotating the substrate. When the dye solution for forming the coating is applied on the substrate, the time from the start of the application of the dye solution to the time when the valve is fully opened is 0.1 seconds or more to prevent the dispersion of the dye solution. In other words, it is disclosed to prevent appearance defects and improve the yield of optical information recording media.

  In Patent Document 7, in a method for producing a heat mode type optical disc having a dye recording layer capable of recording information by irradiation of laser light on a substrate, and having a light reflection layer on the dye recording layer, When the dye solution for forming the dye recording layer is applied on the substrate while rotating the substrate, when the dye solution is applied to the inner peripheral side of the substrate, by increasing the number of rotations of the substrate, Suppressing the occurrence of errors is disclosed.

  In Patent Document 8, a dye recording layer is formed in a manufacturing method of a heat mode type optical disc having a dye recording layer capable of recording information by irradiation of laser light on a substrate and a light reflecting layer thereon. By forming a dye recording layer on the substrate while humidifying the processing atmosphere to be used with water having a resistance ratio of 0.15 MΩ or more, the film thickness of the dye application surface is made uniform and no error occurs. It is disclosed that the formation of the surface (dye recording layer) can be achieved more efficiently and the storage stability is also improved.

JP-A-6-318341 JP-A-8-7347 JP 2002-279702 A JP 2001-110100 A JP 2001-1110099 A JP 2000-215528 A JP 2000-155994 A JP 2000-021018

  By the way, the conventional concept of static elimination is that in Patent Documents 1 and 2, an antistatic film is formed as a protective film on the optical information recording medium itself, and in Patent Document 3, an optical information recording medium in the manufacturing process or a completed process is completed. When the optical information recording medium is stocked by the spindle, the spindle is neutralized. In other words, the conventional static elimination is a technology mainly intended to prevent static electricity from being generated when a large number of optical information recording media are stocked.

  Therefore, in Patent Documents 1 and 2, for example, dust or dust may adhere to the optical information recording medium due to generation of static electricity during the manufacturing process until the antistatic film is formed. The same applies to Patent Document 3, and static electricity is generated when processing is actually performed on the substrate of the optical information recording medium, and there is a possibility that dust, dust, or the like may adhere to the optical information recording medium.

  In particular, the information recording layer forming process as shown in Patent Documents 4 to 8 has a problem that it is easily affected by static electricity generated on the substrate of the optical information recording medium.

  That is, for example, when an adhesive layer is formed to bond the substrate and another substrate after forming a dye-type information recording layer on the substrate, a solution for the adhesive layer (hereinafter referred to as an adhesive layer solution) is used. It is performed by dropping (dispensing) on the substrate and spin coating. At this time, the surface of the substrate may not be sufficiently wet with the dispensed adhesive layer solution, and droplets may roll or scatter. There remains a problem that this remains as a defect, and as a result, an undesired situation of an error occurs. This is because the adhesive layer solution is splashed off due to the substrate being charged. If the charge on the substrate is low, the dispensed adhesive layer solution will adhere to the substrate and will not be splashed away, but if the charge on the substrate is high, it will be splashed and scattered around without being wet. Become.

  When the adhesive layer solution is dispensed, the substrate is charged by the charge of the substrate itself, by the charge of the adhesive layer solution, or by the charge of the spindle table on which the substrate is installed. Some are caused by the rotation of the substrate during dispensing of the adhesive layer solution. Among these, the charge generated by the rotation of the substrate during the dispensing of the adhesive layer solution has the greatest influence.

  The present invention has been made in consideration of such problems, and when forming an adhesive layer to be bonded to another substrate on the substrate, the substrate is subjected to spin coating for forming the adhesive layer. It is an object of the present invention to provide an optical information recording medium manufacturing method and an optical information recording medium capable of minimizing charging and suppressing occurrence of errors.

  An optical information recording medium manufacturing method according to the present invention is an optical information recording medium manufacturing method in which an information recording layer is formed on a substrate, and information can be recorded and / or reproduced by laser light irradiation. A step of forming an adhesive layer for bonding the substrate and another substrate on the formed information recording layer by spin coating, wherein the step performs charge removal during the spin coating. To do.

  As a result, the charging of the substrate during spin coating can be minimized, and the occurrence of errors can be suppressed.

  And in the said manufacturing method, it is preferable that the maximum charged voltage of the board | substrate in the said spin coat is 7 kV or less.

  In the step, the adhesive layer may be formed by dispensing an adhesive layer solution (adhesive layer solution) on the substrate and spin-coating the substrate. In this case, when the adhesive layer solution is dispensed on the substrate, it may be possible to apply static elimination blow. Thus, since static elimination is performed when the adhesive layer solution is dispensed, scattering of the adhesive layer solution during dispensing of the adhesive layer solution can be suppressed, and the occurrence of errors can be suppressed.

  Next, an optical information recording medium according to the present invention is manufactured by the above-described method for manufacturing an optical information recording medium according to the present invention. As a result, when an adhesive layer for bonding to another substrate is formed on the substrate, charging to the substrate during spin coating for forming the adhesive layer can be minimized, and an error can be generated. Can be suppressed.

  As described above, according to the method for manufacturing an optical information recording medium and the optical information recording medium according to the present invention, the adhesive layer is formed when the adhesive layer for bonding to another substrate is formed on the substrate. Therefore, the charge on the substrate during spin coating can be minimized, and the occurrence of errors can be suppressed.

  DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of an optical information recording medium manufacturing method and an optical information recording medium according to the present invention applied to, for example, a DVD-R and a CD-R using a dye recording layer will be described below with reference to FIGS. explain.

  The manufacturing method according to the present embodiment is a manufacturing method applied to a DVD-R using a dye-type information recording layer. As shown in FIG. 1, a substrate manufacturing step S1, a recording layer forming step S2, , An edge cleaning step S3, a reflective film forming step S4, and an adhesion step S5.

  The substrate production step S1 is a step of producing a substrate by, for example, an injection molding machine, a compression molding machine or an injection compression molding machine, and a resin material such as polycarbonate is injection molded, compression molded or injection compression molded, and is shown in FIG. As shown in the drawing, the substrate 10 on which the concave and convex portions (pregroove 12) representing information such as tracking grooves or address signals is formed on one main surface is manufactured.

  Examples of the material of the substrate 10 include acrylic resins such as polycarbonate and polymetal methacrylate, vinyl chloride resins such as polyvinyl chloride and vinyl chloride copolymers, epoxy resins, amorphous polyolefins, and polyesters. You may use them together. Among the above materials, polycarbonate is preferable from the viewpoint of moisture resistance, dimensional stability, price, and the like.

  The groove depth D of the pregroove 12 is preferably in the range of 0.01 to 0.3 μm, and the half width is preferably in the range of 0.2 to 0.9 μm. In particular, in the case of corresponding to a blue-violet laser, the pregroove 12 preferably has the following range.

  That is, the upper limit of the track pitch of the pregroove 12 is preferably 500 nm or less, more preferably 420 nm or less, still more preferably 370 nm or less, and particularly preferably 330 nm or less. Further, the lower limit is preferably 50 nm or more, more preferably 100 nm or more, further preferably 200 nm or more, and particularly preferably 260 nm or more.

  The upper limit of the width (half width) of the pregroove 12 is preferably 250 nm or less, more preferably 200 nm or less, further preferably 170 nm or less, and particularly preferably 150 nm or less. Further, the lower limit is preferably 23 nm or more, more preferably 50 nm or more, further preferably 80 nm or more, and particularly preferably 100 nm or more.

  The upper limit of the groove depth D of the pregroove 12 is preferably 150 nm or less, more preferably 100 nm or less, still more preferably 70 nm or less, and particularly preferably 50 nm or less. Further, the lower limit is preferably 5 nm or more, more preferably 10 nm or more, further preferably 20 nm or more, and particularly preferably 28 nm or more.

  The upper limit of the angle of the pregroove 12 is preferably 80 ° or less, more preferably 70 ° or less, further preferably 60 ° or less, and particularly preferably 50 ° or less. Further, the lower limit value is preferably 20 ° or more, more preferably 30 ° or more, and further preferably 40 ° or more.

  Each of the upper limit value and the lower limit value related to the pregroove 12 described above can be arbitrarily combined.

  The values of these pregrooves 12 can be measured with an AFM (atomic force microscope). The angle of the pregroove 12 refers to the surface of the substrate 10 before the groove is formed, where the groove depth of the pregroove 12 is D, and an inclined portion having a depth of D / 10 from the surface. This is an angle formed by a straight line connecting the deepest portion of the groove 12 to the inclined portion having a height of D / 10 and one surface of the substrate 10 (for example, the bottom surface of the pregroove 12).

  In order to produce the substrate 10 having such groove-shaped pregrooves 12, it is necessary that the stamper used at the time of injection molding is formed by high-precision mastering. For this mastering, it is preferable to use a DUV (wavelength of 330 nm or less, deep ultraviolet) laser or cutting by EB (electron beam).

  An undercoat layer is preferably formed on the surface of the substrate 10 on the side on which the information recording layer is formed for the purpose of improving the flatness, improving the adhesive force, and preventing the information recording layer from being deteriorated.

  Examples of the material for the undercoat layer include polymethyl methacrylate, acrylic acid / methacrylic acid copolymer, styrene / maleic anhydride copolymer, polyvinyl alcohol, N-methylol acrylamide, styrene / vinyl toluene copolymer, chlorosulfone. Polymer materials such as chlorinated polyethylene, nitrocellulose, polyvinyl chloride, chlorinated polyolefin, polyester, polyimide, vinyl acetate-vinyl chloride copolymer, ethylene-vinyl acetate copolymer, polyethylene, polypropylene, polycarbonate; silane coupling agents And the like.

  The undercoat layer is formed by preparing a solution by dissolving or dispersing the above materials in an appropriate solvent, and then applying this solution to the surface of the substrate by a coating method such as spin coating, dip coating, or extrusion coating. be able to. The thickness of the undercoat layer is in the range of 0.005 to 20 μm, and preferably in the range of 0.01 to 10 μm.

  Next, the recording layer forming step S3 is a step of forming the information recording layer 14 on one main surface of the substrate 10 as shown in FIG. The information recording layer 14 formed in this step is a concept including a layer in which information that can be read by a laser beam is recorded or a layer in which such information can be recorded, and more specifically, The concept includes a pit, a dye recording layer, a phase change recording layer, and the like. Note that the pit is a recess formed in the substrate and does not actually constitute a layer, but in this specification, the information recording layer 14 also includes a pit. That is, in the case of the ROM configuration, the area where the pits are located in the substrate 10 is the information recording layer 14.

  The information recording layer 14 is preferably a dye-type information recording layer 14 capable of recording information only once with a laser beam. The dye-type information recording layer 14 preferably contains a dye having absorption in the recording wavelength region. Examples of the dye include cyanine dyes, oxonol dyes, metal complex dyes, azo dyes, and phthalocyanine dyes, and oxonol dyes and phthalocyanine dyes are particularly preferable.

  JP-A-4-74690, JP-A-8-127174, 11-53758, 11-334204, 11-334205, 11-334206, 11-334207 The dyes described in JP-A No. 2000-43423, JP-A No. 2000-108513, JP-A No. 2000-158818, and the like are also preferably used.

  The information recording layer 14 is prepared by dissolving a dye in a suitable solvent together with a binder or the like to prepare a dye solution, and then coating the dye solution on one main surface of the substrate 10 to form a coating film. It is formed by drying. In that case, it is preferable that the temperature of the surface which apply | coats a pigment | dye solution is the range of 10-40 degreeC. More preferably, the upper limit is 35 ° C. or lower, further preferably 30 ° C. or lower, and particularly preferably 27 ° C. or lower. Moreover, as a lower limit, it is 15 degreeC or more, It is more preferable that it is 20 degreeC or more, It is especially preferable that it is 23 degreeC. Thus, when the to-be-coated surface temperature of the board | substrate 10 exists in the above-mentioned range, generation | occurrence | production of a coating nonuniformity and a coating failure can be prevented, and the thickness of a coating film can be made uniform. In addition, said upper limit value and lower limit value can be combined arbitrarily, respectively.

  Here, the information recording layer 14 may be a single layer or a multilayer. In the case of a multilayer structure, the information recording layer 14 is formed by performing the coating process a plurality of times.

  The concentration of the dye in the dye solution is in the range of 0.01 to 15% by weight, preferably in the range of 0.1 to 10% by weight, more preferably in the range of 0.5 to 5% by weight, most preferably 0. .5-3 weight range.

  Examples of solvents for the dye solution include esters such as butyl acetate, ethyl lactate, and cellosolve acetate; ketones such as methyl ethyl ketone, cyclohexanone, and methyl isobutyl ketone; chlorinated hydrocarbons such as dichloromethane, 1,2-dichloroethane, and chloroform; and dimethylformamide Amides; Hydrocarbons such as cyclohexane; Ethers such as tetrahydrofuran, ethyl ether, dioxane; Alcohols such as ethanol, n-propanol, isopropanol, n-butanol diacetone alcohol; 2,2,3,3-tetrafluoro-propanol, etc. Fluorinated solvents; glycol ethers such as ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, propylene glycol monomethyl ether; .

  The above solvents can be used alone or in combination of two or more in consideration of the solubility of the dye used. In the dye solution, various additives such as an antioxidant, a UV absorber, a plasticizer, and a lubricant may be added according to the purpose.

  Examples of the coating method include a spray method, a spin coating method, a dip method, a roll coating method, a blade coating method, a doctor roll method, and a screen printing method.

  At the time of application, the temperature of the dye solution is preferably in the range of 23 to 50 ° C, more preferably in the range of 24 to 40 ° C.

  The thickness of the information recording layer 14 formed in this way is preferably 300 nm or less, more preferably 250 nm or less, and more preferably 200 nm or less on the groove 12a (projection on the substrate 10). Is more preferable, and 180 nm or less is particularly preferable. The lower limit is preferably 30 nm or more, more preferably 50 nm or more, further preferably 70 nm or more, and particularly preferably 90 nm or more.

  In addition, the thickness of the information recording layer 14 is preferably 400 nm or less, more preferably 300 nm or less, and further preferably 250 nm or less on the land 12b (a concave portion in the substrate 10). The lower limit is preferably 70 nm or more, more preferably 90 nm or more, and further preferably 110 nm or more.

  Furthermore, the lower limit of the ratio of the thickness of the information recording layer 14 on the groove 12a to the thickness of the information recording layer 14 on the land 12b is preferably 0.4 or more, and more preferably 0.5 or more. More preferably, it is more preferably 0.6 or more, and particularly preferably 0.7 or more. The upper limit value is preferably less than 1, more preferably 0.9 or less, further preferably 0.85 or less, and particularly preferably 0.8 or less.

  When the dye solution contains a binder, examples of the binder include natural organic polymer materials such as gelatin, cellulose derivatives, dextran, rosin, and rubber; hydrocarbon resins such as polyethylene, polypropylene, polystyrene, and polyisobutylene. , Polyvinyl chloride, polyvinylidene chloride, vinyl resins such as polyvinyl chloride / polyvinyl acetate copolymer, acrylic resins such as polymethyl acrylate and polymethyl methacrylate, polyvinyl alcohol, chlorinated polyethylene, epoxy resin, butyral And synthetic organic polymers such as resins, rubber derivatives, and initial condensates of thermosetting resins such as phenol / formaldehyde resins.

  When a binder is used in combination as the material of the information recording layer 14, the amount of the binder used is in the range of 0.01 times to 50 times (mass ratio) with respect to the dye, preferably 0.1 times. The amount is in the range of 5 to 5 times (mass ratio).

  Further, the information recording layer 14 can contain various anti-fading agents in order to improve the light resistance of the information recording layer 14. As the anti-fading agent, a singlet oxygen quencher is generally used. As the singlet oxygen quencher, those described in publications such as known patent specifications can be used.

  Specific examples thereof include JP-A Nos. 58-175893, 59-81194, 60-18387, 60-19586, 60-19587, and 60-35054. 60-36190, 60-36191, 60-44554, 60-44555, 60-44389, 60-44390, 60-54892, JP-A-60-47069, JP-A-63-209995, JP-A-4-25492, JP-B-1-38680, and JP-A-6-26028, German Patent 350399, and Examples include those described in Journal of Chemical Society of Japan, October 1992, page 1141.

  The amount of the anti-fading agent such as a singlet oxygen quencher used is in the range of 0.1 to 50% by weight, preferably in the range of 0.5 to 45% by weight, more preferably 3 with respect to the amount of the pigment. It is in the range of -40% by weight, particularly preferably in the range of 5-25% by weight.

  In the above-described example, the solvent coating method in the case where the information recording layer 14 is a dye-type information recording layer has been described. However, the information recording layer 14 is formed by a deposition method such as vapor deposition, sputtering, or CVD according to the physical properties of the recording material. Can also be formed.

  For example, when a phase change metal compound is used as the recording material, it is preferable to form the information recording layer using such a film forming method. Here, any of SbTe, AgSbTe, InAgSbTe, or the like may be used as the phase change metal compound.

  In this embodiment, a spin coater 20 as shown in FIG. 4 is used for applying the dye solution. That is, the substrate 10 put into the spin coater 20 is coated with the dye solution 31 on one main surface thereof, rotated at high speed to make the thickness of the dye solution 31 uniform, and then subjected to a drying process. Is done. As a result, the information recording layer 14 is formed on one main surface of the substrate 10 as shown in FIG.

  As shown in FIG. 4, the substrate 10 put into the spin coater 20 is mounted on the rotary table 22 and held horizontally by a fixture (not shown). Next, a predetermined amount of the dye solution 31 supplied from the pressurized tank 24 is adjusted by the discharge adjusting valve 26, and is dispensed (dropped) through the discharge nozzle 28 to the inner peripheral side on the substrate 10.

  As described above, the discharge nozzle 28 has a front end surface of the discharge nozzle 28 and an outer side or an inner side within a range of 1 mm or more from the front end surface, or both of the wall surfaces are made of a fluorine compound. 31 is less likely to adhere, and it is difficult to cause pigment precipitation or deposits due to drying, so that the coating can be smoothly formed without any defects such as coating film defects.

  The rotary table 22 can be rotated at high speed by a drive motor 30. The dye solution 31 dispensed on the substrate 10 is cast on the surface of the substrate 10 in the outer circumferential direction by the rotation of the turntable 22 and reaches the outer peripheral edge of the substrate 10 while forming a coating film.

  In this embodiment, before entering the recording layer forming step S2 and when discharging the dye solution 31 from the discharge nozzle 28, the discharge blow 46 (ionized air) is discharged through the discharge blow device 44 as shown in FIG. It is preferable to apply to the region including the nozzle 28 and the substrate 10 so that the maximum voltage of the substrate 10 when the dye solution 31 is dispensed is 7 kV or less. Needless to say, the neutralization blow process before entering the recording layer forming step S2 may be omitted.

  Thereby, the charge to the board | substrate 10 at the time of dispensing of the pigment | dye solution 31 can be suppressed to the minimum. In this case, the scattering of the dye solution 31 discharged from the discharge nozzle 28 to the substrate 10 can be suppressed, and the occurrence of errors can be suppressed.

  Here, preferable conditions in the recording layer forming step S2 will be described. First, as described above, the charged voltage of the substrate 10 is 7 kV or less, preferably 4 kV or less, more preferably 3 kV or less, still more preferably 2 kV or less, and particularly preferably 1 kV or less.

The discharge pressure of the dye solution 31 is preferably 0.1 kg / cm ² or more and 3 kg / cm ² . More preferably 0.3 kg / cm ² or more, and ^{2kg / cm 2, 0.5kg / cm} 2 or more, 1.5 kg / cm ² being most preferred. If the pressure is too high, not only the dye solution 31 is used much, but also the dye solution is scattered, and the probability of occurrence of surface defects and errors increases. On the other hand, if it is too low, the shape of the innermost peripheral edge of the information recording layer 14 is disturbed.

  The diameter of the discharge nozzle 28 is preferably 0.1 to 0.8 mm, more preferably 0.2 to 0.6 mm. If the diameter is too large, a turbulent flow is generated in the flow of the dye solution 31, and the shape of the innermost peripheral edge of the information recording layer 14 is disturbed. On the other hand, if it is too small, the amount of the dye solution 31 is insufficient, and sufficient application of the dye solution 31 cannot be performed.

When the diameter of the discharge nozzle 28 is narrow, it is preferable to increase the discharge pressure. In this case, the product of the diameter and the pressure (mm · kg / cm ² ) is preferably 0.2 to 2.4, more preferably 0.3 to 1, and most preferably 0.4 to 0.6.

  The discharge time of the dye solution 31 is preferably 0.1 to 2 seconds. More preferably, it is 0.2 to 1.5 seconds, and most preferably 0.3 to 1.0 seconds. If the time is too long, not only a large amount of the dye solution 31 is used, but also the probability of occurrence of surface defects and errors due to the disturbance of the shape of the innermost peripheral edge of the information recording layer 14 and the scattering of the dye solution 31 increases. On the other hand, if the time is too short, sufficient application of the dye solution 31 cannot be performed.

  The rotation speed of the substrate 10 at the start of discharging the dye solution 31 is preferably 50 rpm to 1500 rpm. More preferably, it is 100-1000 rpm, Most preferably, it is 200-700 rpm. If the rotational speed is too slow, the shape of the innermost peripheral edge of the information recording layer 14 is disturbed. If the speed is too fast, the probability of occurrence of planar defects and errors due to the scattering of the dye solution 31 increases.

  Drying is performed after the dye solution 31 is dispensed. At this time, it is preferable to rotate the substrate 10 for the purpose of drying. The rotation speed of the substrate 10 is preferably 1000 rpm or more and 10,000 rpm or less. More preferably, it is 2000-8000 rpm, Most preferably, it is 3000-7000 rpm. If the rotation speed is too slow, drying will be slow and productivity will be reduced. On the other hand, if the speed is too high, not only the rotation drive unit (motor, bearing, etc.) is accelerated, but also the dye solution 31 that has been shaken off scatters inside a coating cup (not shown) of the spin coater 20, thereby causing a planar shape. The probability of occurrence of defects and errors increases.

  The discharge amount of the dye solution 31 is preferably 0.05 cc or more and 3 cc or less. More preferably, it is 0.15 cc or more and 1 cc or less, and most preferably 0.2 cc or more and 0.6 cc or less. When the discharge amount is too small, film formation is insufficient, and when it is too large, the dye solution 31 is scattered, and the probability of occurrence of surface defects and errors increases.

  Next, the edge cleaning step S3 is a step of cleaning the outer peripheral edge and the inner peripheral edge (edge portion) of the substrate 10 on which the information recording layer 14 is formed. For example, an edge cleaner 32 shown in FIG. 5 is used. .

  This edge cleaner 32 holds a substrate 10 and rotates it, a drive motor 36 that rotates the rotary table 34 in one direction, and a discharge nozzle 38 for outer periphery (for discharging cleaning liquid (solvent)). Nozzle) and a discharge nozzle 40 for the inner periphery.

  The discharge nozzles 38 and 40 are maintained at angles θ1 and θ2 of about 45 ° with respect to the vertical direction n when the direction along the central axis m of the substrate 10 is defined as a vertical direction (indicated by a dashed line n). ing. A filtration filter (not shown) is attached in the middle of the cleaning liquid piping.

  When the discharge nozzles 38 and 40 come to a predetermined discharge position, as shown in FIGS. 6A and 6B, the cleaning liquid 42 is discharged from the discharge nozzles 38 and 40. In this case, as shown in FIG. 6A. In addition, the cleaning liquid 42 is discharged from the discharge nozzle 38 for the outer periphery toward the outer peripheral edge portion 10 a of the substrate 10 from above in the substrate 10. Further, as shown in FIG. 6B, the cleaning liquid 42 is discharged from the inner peripheral discharge nozzle 40 toward the inner peripheral edge portion 10b of the substrate 10 from the upper side of the substrate 10, and by the discharge of these cleaning liquids 42, As shown in FIG. 7, the information recording layer 14 (shown by a broken line) in the outer peripheral edge portion 10a and the inner peripheral edge portion 10b of the substrate 10 is removed.

  In this embodiment, before entering the edge cleaning step S3 and when discharging the cleaning liquid 42 from the discharge nozzles 38 and 40, the discharge blower 52 is discharged through the discharge blower 50 as shown in FIG. In addition, it is preferable to apply to the region including the substrate 10 so that the maximum charged voltage of the substrate 10 in this edge cleaning is 7 kV or less. Of course, you may make it abbreviate | omit the static elimination blow process before entering into edge cleaning process S3.

  As a result, the charging of the substrate 10 in the edge cleaning step S3 can be minimized, the splash of the cleaning liquid 42 discharged from the discharge nozzles 38 and 40 can be suppressed from being scattered on the information recording layer 14, and an error can be generated. Can be suppressed.

  Here, preferable conditions in the edge cleaning step S3 will be described. First, as described above, the charged voltage of the substrate 10 is 7 kV or less, preferably 4 kV or less, more preferably 3 kV or less, still more preferably 2 kV or less, and particularly preferably 1 kV or less.

  The cleaning liquid 42 may be anything as long as the information recording layer 14 is not dissolved and the substrate 10 is not dissolved, but diacetone alcohol, dibutyl ether, and 2,2,3,3-tetrafluoro-1-propanol are preferable, and among them, diacetone alcohol is preferable. Most preferred.

  The cleaning start timing is preferably 1 second or more and 4 hours or less after the information recording layer 14 is formed, and more preferably 5 seconds or more and 2 hours or less. When the cleaning start timing is late, the cleaning performance is deteriorated. Conversely, when the cleaning is started earlier, the shape of the edge portion (the outer peripheral edge portion and the inner peripheral edge portion of the information recording layer 14 after the cleaning) is deteriorated.

  The discharge nozzle 38 for the outer periphery has an angle θ1 formed between the axis of the discharge nozzle 38 and the vertical direction n when the direction in which the tip (discharge port) of the discharge nozzle 38 faces the outermost periphery of the substrate 10 is a positive angle. It is installed so as to be ˜60 °, preferably 10˜45 °. The inner circumferential discharge nozzle 40 has an angle θ2 between 0 to 60 ° between the axis of the discharge nozzle 40 and the vertical direction n when the direction in which the tip of the discharge nozzle 40 faces the center of the substrate 10 is a positive angle. Preferably, it is installed so that it may become 10-45 degrees. The distance between the discharge ports of the discharge nozzles 38 and 40 and the substrate 10 is 0.3 to 5 mm, preferably 0.5 to 3 mm, and more preferably 0.7 to 2 mm. If the angles θ1 and θ2 formed by the axes of the discharge nozzles 38 and 40 and the vertical direction n are set to negative angles or the positive angles are set too large, the shape of the edge portion is disturbed.

  The number of the outer peripheral discharge nozzles 38 and the inner peripheral discharge nozzles 40 is preferably one or more and four or less, more preferably one or two, respectively. If there are too many discharge nozzles, the amount of the cleaning liquid 42 increases, which is disadvantageous in terms of cost. In addition, an unstable flow may occur at the start of discharge, and this may be splashed and scattered on the information recording layer 14 to cause a surface defect or error. The probability of occurrence of defects and errors increases.

The discharge pressure of the cleaning liquid 42, 0.3 kg / cm ² or more, preferably 3 kg / cm ^2. More preferably, it is 0.5 kg / cm ² or more and 2 kg / cm ² , and 0.7 kg / cm ² or more and 1.7 kg / cm ² is most preferable. If the pressure is too high, not only a large amount of the cleaning liquid 42 is used, but also splashing occurs, and the probability of occurrence of surface defects and errors increases. On the other hand, if it is too low, the shape of the edge portion is disturbed.

  The diameter of the discharge nozzles 38 and 40 is preferably 0.1 to 0.8 mm, more preferably 0.2 to 0.6 mm. If the diameter is too large, a turbulent flow is generated in the flow of the cleaning liquid 42, and the shape of the edge portion is disturbed. On the other hand, if it is too small, the amount of the cleaning liquid 42 is insufficient and sufficient cleaning cannot be performed.

When the diameters of the discharge nozzles 38 and 40 are narrow, it is preferable to increase the discharge pressure. In this case, the product of the diameter and the pressure (mm · kg / cm ² ) is preferably 0.2 to 2.4, more preferably 0.3 to 1, and most preferably 0.4 to 0.6.

  The discharge time of the cleaning liquid 42 is preferably 0.1 to 1 second. More preferably, it is 0.2 to 0.8 seconds, and most preferably 0.3 to 0.6 seconds. If the time is too long, not only a large amount of the cleaning liquid 42 is used, but also the probability of occurrence of surface defects and errors due to the disorder of the shape of the edge portion and the scattering of the splashes increases. On the other hand, if the time is too short, sufficient cleaning cannot be performed.

  The rotation speed of the substrate 10 at the start of discharging the cleaning liquid 42 is preferably 1000 rpm to 10,000 rpm. More preferably, it is 2000-8000 rpm, Most preferably, it is 3000-6000 rpm. If the rotational speed is too slow, the shape of the edge portion is disturbed. On the other hand, if it is too fast, the probability of occurrence of surface defects and errors due to splashing of the droplets increases.

  Drying is performed after edge cleaning. At this time, it is preferable to rotate the substrate 10 for the purpose of drying (swing-off rotation). The rotation speed of the substrate 10 is preferably 3000 rpm or more and 10,000 rpm or less. More preferably, it is 4000-8000 rpm, Most preferably, it is 5000-7000 rpm. If the rotation speed is too slow, drying will be slow and productivity will be reduced. On the other hand, if the speed is too high, not only the rotation drive unit is damaged (motor, bearing, etc.), but also the sprayed cleaning liquid 42 scatters inside the coating cup (not shown) of the edge cleaning machine 32, thereby causing surface defects. And the probability of occurrence of errors increases.

  The discharge amount of the cleaning liquid 42 is preferably 0.2 cc or more and 3 cc or less. More preferably, it is 0.4 cc or more and 2 cc or less, and most preferably 0.6 cc or more and 1.5 cc or less. If the discharge amount is too small, cleaning is insufficient, and if it is too large, splashing of the droplets occurs, and the probability of occurrence of surface defects and errors increases.

  Next, as shown in FIG. 8, the reflective film forming step S <b> 4 is a step of forming the light reflecting layer 54 on the entire surface excluding the outermost peripheral portion and the innermost peripheral portion in one main surface of the substrate 10. The device is used.

  The light-reflecting substance that is the material of the light-reflecting layer 54 is a substance having a high reflectance with respect to laser light. Examples thereof include Mg, Se, Y, Ti, Zr, Hf, V, Nb, Ta, Cr, and Mo. W, Mn, Re, Fe, Co, Ni, Ru, Rh, Pd, Ir, Pt, Cu, Ag, Au, Zn, Cd, Al, Ga, In, Si, Ge, Te, Pb, Po, Sn , Bi and other metals and metalloids or stainless steel. These substances may be used alone or in combination of two or more. Or you may use as an alloy.

  Among these, Cr, Ni, Pt, Cu, Ag, Au, Al, and stainless steel are preferable. Particularly preferred is Au, Ag, Al or an alloy thereof, and most preferred is Au, Ag or an alloy thereof.

  Next, in the bonding step S5, as shown in FIG. 9, the dummy substrate 56 is bonded to one main surface of the substrate 10 (the surface on which the information recording layer 14 and the light reflecting layer 54 are formed) via the bonding layer 58. It is a process. Through this process, the optical information recording medium 100 is completed. As a material of the adhesive layer 58, an adhesive 60 or an adhesive 62 can be used. The dummy substrate 56 is made of the same material and the same size as the substrate 10 described above. The pregroove 12 formed on the substrate 10 is not formed on the dummy substrate 56.

  As the adhesive 60 used for bonding the substrate 10 and the dummy substrate 56, for example, a UV curable resin, an EB curable resin, a thermosetting resin or the like is preferably used, and in particular, a UV curable resin is preferably used. .

  When a UV curable resin is used as the adhesive 60, a solution may be prepared by dissolving the UV curable resin as it is or in an appropriate solvent such as methyl ethyl ketone or ethyl acetate, and supplying the solution from the dispenser to the substrate surface. In order to prevent warpage of the produced optical information recording medium 100, it is preferable that the UV curable resin as the adhesive 60 has a small curing shrinkage rate. Examples of such UV curable resins include UV curable resins such as “SD-640” manufactured by Dainippon Ink and Chemicals, Inc.

  For example, a predetermined amount of the adhesive 60 is applied onto the bonding surface of the substrate 10, the dummy substrate 56 is placed thereon, and then the adhesive 60 is uniformly applied between the substrate 10 and the dummy substrate 56 by spin coating. It is preferable to make it harden | cure after extending so that it may become.

  The thickness of the adhesive layer 58 made of the adhesive 60 is preferably in the range of 0.1 to 100 μm, more preferably in the range of 0.5 to 50 μm, and still more preferably in the range of 10 to 30 μm.

  In addition, as the adhesive layer 58 used for bonding the dummy substrate 56, an acrylic, rubber-based, or silicon-based pressure-sensitive adhesive 62 can be used. From the viewpoint of transparency and durability, an acrylic-based adhesive can be used. The adhesive 62 is preferable. The acrylic pressure-sensitive adhesive 62 is mainly composed of 2-ethylhexyl acrylate, n-butyl acrylate, etc., and has a short chain alkyl acrylate or methacrylate, such as methyl acrylate, ethyl acrylate, methyl methacrylate, etc. in order to improve cohesion. It is preferable to use a copolymer of acrylic acid, methacrylic acid, acrylamide derivative, maleic acid, hydroxylethyl acrylate, glycidyl acrylate, or the like that can be a cross-linking point with a crosslinking agent. The glass transition temperature (Tg) and the crosslinking density can be changed by appropriately adjusting the mixing ratio and type of the main component, the short chain component, and the component for adding a crosslinking point.

  Examples of the crosslinking agent used in combination with the pressure-sensitive adhesive 62 include isocyanate-based crosslinking agents. Examples of the isocyanate-based crosslinking agent include tolylene diisocyanate, 4,4′-diphenylmethane diisocyanate, hexamethylene isocyanate, xylylene diisocyanate, naphthylene-1,5-diisocyanate, o-toluidine isocyanate, isophorone diisocyanate, triphenylmethane triisocyanate, and the like. Isocyanates, products of these isocyanates with polyalcohols, and polyisocyanates formed by condensation of isocyanates can be used. Commercially available products of these isocyanates include Coronate L, Coronate HL, Coronate 2030, Coronate 2031, Millionate MR, Millionate HTL manufactured by Nippon Polyurethane; Takenate D-102 and Takenate D-110N manufactured by Takeda Pharmaceutical Co., Ltd. , Takenate D-200, Takenate D-202; Death Module L, Death Module IL, Death Module N, Death Module HL;

  The adhesive 62 may be uniformly applied on the bonding surface of the substrate 10 and may be cured after placing the dummy substrate 56 thereon, or may be preliminarily placed on one side of the dummy substrate 56. A fixed amount may be uniformly applied to form a pressure-sensitive adhesive coating film, and the pressure-sensitive adhesive coating film may be bonded to the bonding surface of the substrate 10 and then cured.

  The thickness of the adhesive layer 58 made of the pressure-sensitive adhesive 62 is preferably in the range of 0.1 to 100 μm, more preferably in the range of 0.5 to 50 μm, and still more preferably in the range of 10 to 30 μm.

  In this embodiment, a spin coater 64 as shown in FIG. 10 is used for application of an adhesive layer solution 58a such as adhesive 60 and adhesive 62 (hereinafter simply referred to as adhesive layer solution 58a). used.

  That is, the substrate 10 put into the spin coater 64 is mounted on a rotary table 68 that is rotationally driven by a drive motor 66 and held horizontally by a fixture (not shown). Next, a predetermined amount of the adhesive layer solution 58 a supplied from the pressurized tank 70 is adjusted by the discharge adjustment valve 72, and dispensed (dropped) through the discharge nozzle 74 to the inner peripheral side on the substrate 10.

  After the adhesive layer solution 58a is applied on the substrate 10, the substrate 10 is rotated at a high speed to make the thickness of the adhesive layer solution 58a uniform, and then the ultraviolet ray is irradiated to cure the adhesive layer solution 58a. The adhesive layer 58 is used. The dummy substrate 56 (see FIG. 9) is bonded before or after the substrate 10 is spun. In the case of spinning, bubbles are likely to enter the adhesive layer 58, and therefore it is preferable to bond them in a vacuum. As a result, as shown in FIG. 9, the dummy substrate 56 is bonded to one main surface of the substrate 10 via the adhesive layer 58.

  In the present embodiment, before entering the bonding step S5 and when discharging the adhesive layer solution 58a from the discharge nozzle 74, the discharge blow 82 (ionized air) is supplied through the discharge blow device 80 as shown in FIG. It is preferable to apply to the region including the discharge nozzle 74 and the substrate 10 so that the maximum voltage of the substrate 10 when the adhesive layer solution 58a is dispensed is 7 kV or less. Of course, you may make it abbreviate | omit the static elimination blow process before entering adhesion process S5.

  As a result, charging of the substrate 10 during dispensing of the adhesive layer solution 58a can be minimized. In this case, scattering of the adhesive layer solution 58a discharged from the discharge nozzle 74 to the substrate 10 can be suppressed, and the occurrence of errors can be suppressed.

  Here, the preferable conditions in the bonding step S5 will be described. First, as described above, the charged voltage of the substrate 10 is 7 kV or less, preferably 4 kV or less, more preferably 3 kV or less, still more preferably 2 kV or less, and particularly preferably 1 kV or less.

The discharge pressure of the adhesive layer solution 58a is preferably 0.1 kg / cm ² or more and 3 kg / cm ² . More preferably 0.3 kg / cm ² or more, and ^{2kg / cm 2, 0.5kg / cm} 2 or more, 1.5 kg / cm ² being most preferred. If the pressure is too high, not only the adhesive layer solution 58a is used much, but also the adhesive layer solution 58a is scattered, which increases the probability of occurrence of surface defects and errors. On the other hand, if it is too low, the shape of the innermost peripheral edge of the adhesive layer 58 is disturbed.

  The diameter of the discharge nozzle 74 is preferably 0.2 to 1.5 mm, more preferably 0.4 to 1.0 mm. If the diameter is too large, a turbulent flow occurs in the flow of the adhesive layer solution 58a, and the shape of the innermost peripheral edge of the adhesive layer 58 is disturbed. On the other hand, if it is too small, the amount of the adhesive layer solution 58a is insufficient, and sufficient application of the adhesive layer solution 58a cannot be performed.

When the diameter of the discharge nozzle 74 is narrow, it is preferable to increase the discharge pressure. In this case, the product of the diameter and the pressure (mm · kg / cm ² ) is preferably 0.2 to 3, more preferably 0.3 to 2, and most preferably 0.5 to 1.5.

  The discharge time of the adhesive layer solution 58a is preferably 0.1 to 2 seconds. More preferably, it is 0.2 to 1.5 seconds, and most preferably 0.3 to 1.0 seconds. If the time is too long, not only the adhesive layer solution 58a is used much, but also the shape of the innermost periphery of the adhesive layer 58 is disturbed, and the probability of occurrence of surface defects and errors due to the scattering of the adhesive layer solution 58a increases. . On the other hand, if the time is too short, sufficient application of the adhesive layer solution 58a cannot be performed.

  The number of rotations of the substrate 10 at the start of discharge of the adhesive layer solution 58a is preferably 5 rpm to 500 rpm. More preferably, it is 10-200 rpm, Most preferably, it is 20-100 rpm. If the rotational speed is too slow, the shape of the innermost peripheral edge of the adhesive layer 58 is disturbed. If the speed is too fast, the probability of occurrence of surface defects and errors due to scattering of the adhesive layer solution 58a increases. In the application of the adhesive layer solution 58a, the substrate 10 may be rotated, but the discharge nozzle 74 may be rotated along the inner periphery of the substrate 10.

  It is preferable to rotate the substrate 10 after the adhesive layer solution 58a is dispensed (swing-off rotation). The rotation speed of the substrate 10 is preferably 1000 rpm or more and 10,000 rpm or less. More preferably, it is 2000-8000 rpm, Most preferably, it is 3000-7000 rpm. If the swing-off rotation speed is too slow, the productivity is lowered. On the other hand, if the speed is too high, not only the rotation drive unit (motor, bearing, etc.) is accelerated, but also the adhesive layer solution 58a that has been shaken off scatters inside the coating cup (not shown) of the spin coater 64. The probability of occurrence of defects and errors increases.

  The discharge amount of the adhesive layer solution 58a is preferably 0.3 cc or more and 5 cc or less. More preferably, it is 0.5 cc or more and 3 cc or less, and most preferably 1 cc or more and 2 cc or less. If the discharge amount is too small, film formation is insufficient, and if it is too large, the adhesive layer solution 58a is scattered, and the probability of occurrence of surface defects and errors increases. In addition, the material cost of the adhesive layer solution 58a is increased.

  Here, one experimental example is shown. In this experimental example, for Examples 1 to 3 and Comparative Examples 1 and 2, the maximum charged voltage at the time of cleaning, the maximum error at a radius of 24 mm, the maximum error at a radius of 24 mm after 48 hours at a temperature of 60 ° C. and a humidity of 85%. And the yield due to defects was measured.

  Examples 1 to 3 and Comparative Examples 1 and 2 were produced as follows. First, the substrate 10 had a diameter of 120 mm, an inner diameter of 15 mm, a thickness of 0.6 mm, a groove depth of the pregroove 12 of 135 nm, and a groove width of the pregroove 12 of 300 nm.

  1.3 g of an oxonol dye represented by the following chemical formula was prepared in 100 cc of tetrafluoropropanol, and the transmission density OD was 0.78 (measured at a wavelength of 570 nm) by spin coating.

  In spin coating, the number of revolutions at the time of dispensing of the dye solution 31 was set to 300 rpm, and then gradually increased to 1800 rpm to obtain the above-described film thickness.

  In edge cleaning, as shown in FIG. 5, the discharge nozzles 38 for the outer periphery and the discharge nozzles 40 for the inner periphery are divided into 45 ° angles θ1 and θ2 between the axes of the discharge nozzles 38 and 40 and the vertical direction n. It installed so that it might become. The inner diameter of the discharge ports of the discharge nozzles 38 and 40 is 0.5 mm. As the cleaning liquid 42, diacetone alcohol was used. Then, the rotary table 34 was rotated 4000 rpm, and the cleaning liquid 42 was discharged for 3 seconds to clean the edge portions (the outer peripheral edge portion 10a and the inner peripheral edge portion 10b of the substrate 10).

  As the light reflecting layer 54, an Ag film having a thickness of 130 nm was formed by sputtering.

  As the adhesive layer solution 58a for forming the adhesive layer 58, the above-mentioned adhesive “SD-640” manufactured by Dainippon Ink & Chemicals, Inc. was used. Then, the substrate 10 is rotated at 50 rpm, the adhesive layer solution 58a is dispensed on the inner peripheral portion of the substrate 10 by one turn, and the dummy substrate 56 is gently placed there, and then the substrate 10 is rotated at 3000 rpm for 2 seconds. Then, the adhesive layer solution 58a was spread. After stopping the rotation, ultraviolet rays were irradiated to obtain an adhesive layer 58 having a thick film of 40 μm.

  The dummy substrate 56 is the same as the substrate 10.

  As shown in FIG. 11, the breakdown of Examples 1 to 3 and Comparative Examples 1 and 2 is that Example 1 does not perform the process of applying the static elimination blow before forming the adhesive layer, and ends from the start of the adhesive layer formation. The process of applying static elimination blow was performed. In Example 2, a process of applying static elimination blow before forming the adhesive layer was performed, and further, a process of applying static elimination blow from the start to the end of the adhesive layer formation was performed. In Example 3, a process of applying static elimination blow before forming the adhesive layer was performed, and further, a process of applying static elimination blow until the adhesive layer solution 58a was discharged in forming the adhesive layer.

  In Comparative Example 1, the process of applying the static elimination blow was performed before forming the adhesive layer, and the process of applying the static elimination blow from the start to the end of the adhesive layer formation was not performed. In Comparative Example 2, the process of applying static elimination blow before the formation of the adhesive layer was not performed, and further, the process of applying static elimination blow from the start to the end of the adhesive layer formation was not performed.

  The maximum charged voltage as a measurement item was measured using a probe-type charged voltmeter. The maximum error at a point of 24 mm radius and the maximum error at a point of 24 mm radius after 48 hours at a temperature of 60 ° C. and a humidity of 85% were measured as follows. In Examples 1 to 3 and Comparative Examples 1 and 2, using an OMT2000 (Pulstec) evaluation machine, the wavelength of the laser beam is 780 nm (pickup to NA 0.5), the linear velocity is 1.2 m / sec, EFM modulation The signal was recorded with a recording power of 7 mW. Thereafter, a signal was reproduced with a laser output of 0.5 mW using a laser beam having the same wavelength as the recording laser beam, and an error (block error: BLER) was measured. In particular, the maximum error rate at a point of a radius of 24 mm after a lapse of 48 hours at a temperature of 60 ° C. and a humidity of 85% is useful for confirming storage stability.

  The yield due to defects was NG for defects with a contrast of 100 μm or more.

  The result of the experimental example is shown in FIG. First, Examples 1 to 3 were 1.2 kV, 1.5 kV, and 1.5 kV for the maximum voltage at the time of application of the adhesive layer solution 58a, and good results were obtained. In Comparative Examples 1 and 2, the voltage was 8 kV and 11 kV, which was higher than that in Examples 1 to 3.

  The maximum error at a point of a radius of 24 mm was 50, 80, 90 in Examples 1 to 3, and good results were obtained. Comparative example 1 and 2 are 120 and 200, and it turns out that there are many errors compared with Examples 1-3.

  The maximum error at a point of a radius of 24 mm after a lapse of 48 hours at a temperature of 60 ° C. and a humidity of 85% was 55, 85, and 90 in Examples 1 to 3, and the increase rate of the error was low and good results were obtained. That is, it can be seen that Examples 1 to 3 have high storage stability. On the other hand, Comparative Examples 1 and 2 are 130 and 300, indicating that the rate of increase in errors is high and that there are many errors as compared with Examples 1 to 3.

  The yields due to defects were 95%, 99%, and 98% in Examples 1 to 3, and good results were obtained. The comparative examples 1 and 2 are 93% and 87%, and it turns out that a yield is a little low compared with Examples 1-3.

  Note that the optical information recording medium manufacturing method and the optical information recording medium according to the present invention are not limited to the above-described embodiments, and various configurations can be adopted without departing from the gist of the present invention. .

It is process drawing which shows the manufacturing method which concerns on this Embodiment. It is sectional drawing which abbreviate | omits and shows a board | substrate produced at a board | substrate preparation process. In a recording layer formation process, it is sectional drawing which abbreviate | omits and shows the state which formed the information recording layer in one main surface of a board | substrate. It is a schematic block diagram which shows the spin coat apparatus and static elimination blower which are used in a recording layer formation process. It is a schematic block diagram which shows the edge cleaning machine and static elimination blower which are used in an edge cleaning process. FIG. 6A is a cross-sectional view showing a state in which the information recording layer on the outer peripheral edge of the substrate has been cleaned with a discharge nozzle for the outer periphery, and FIG. 6B shows the state of the inner peripheral edge of the substrate with the discharge nozzle for the inner periphery. It is sectional drawing which abbreviate | omits and shows the state which wash | cleaned the information recording layer. It is sectional drawing which abbreviate | omits and shows the state which cleaned the edge part of the information recording layer in the edge cleaning process. It is sectional drawing which abbreviate | omits and shows the state which formed the light reflection film in one main surface of a board | substrate in a reflective film formation process. FIG. 10 is a cross-sectional view showing a partially omitted state in which an optical information recording medium is completed by bonding a dummy substrate to one main surface of a substrate via an adhesive layer in an adhesion step. It is a schematic block diagram which shows the spin coat apparatus and static elimination blower which are used in an adhesion process. It is a table | surface figure which shows the breakdown of Examples 1-3, the comparative examples 1 and 2, and the result of an experiment example.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Board | substrate 12 ... Pre-groove 14 ... Information recording layer 20, 64 ... Spin coater 28, 38, 40, 74 ... Discharge nozzle 31 ... Dye solution 44, 50, 80 ... Static elimination blow apparatus 46, 52, 82 ... Static elimination blow 54 ... Light reflecting layer 56 ... Dummy substrate 58 ... Adhesive layer 58a ... Adhesive layer solution 100 ... Optical information recording medium

Claims (5)

In an optical information recording medium manufacturing method in which an information recording layer is formed on a substrate and information can be recorded and / or reproduced by irradiation with a laser beam.
Forming an adhesive layer on the information recording layer formed on the substrate by spin coating for bonding the substrate and another substrate;
In the manufacturing method of an optical information recording medium, the step includes performing static elimination during the spin coating. In the manufacturing method of the optical information recording medium of Claim 1,
The method of manufacturing an optical information recording medium, wherein the maximum charged voltage of the substrate during the spin coating is 7 kV or less. In the manufacturing method of the optical information recording medium of Claim 1 or 2,
In the method, the adhesive layer is formed by dispensing an adhesive layer solution on the substrate and spin-coating the substrate. In the manufacturing method of the optical information recording medium of Claim 3,
A method for producing an optical information recording medium, wherein a neutralization blow is applied when the adhesive layer solution is dispensed on the substrate.   The optical information recording medium manufactured by the manufacturing method of the optical information recording medium of any one of Claims 1-4.

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