JP2006343130A - Integrally molded conductive probe and its signal transmission method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an integrally molded conductive probe and its signal transmission method. <P>SOLUTION: An integrally molded elastic body is used as a probe for transmitting an electronic signal, conductive contact sections where the coil outer diameter varies from small to large and that have a fine elastic force are disposed on the outer periphery between two ends of the probe, an elastic section having an elastic recovery force is formed between the two conductive contact sections, and strings where the coil outer diameter is converted from large to small and from small to large are separately disposed on the outer periphery of a predetermined position of the elastic body. When the probe is applied to electronic signal transmission by this, the coil of the probe is compressed into a high density contact form, the electronic signal is passed by the probe having an integral structure form, the probe manufacturing cost is not only significantly reduced, but also the elastic force of the probe itself increases, the resistive decreases, and the inductance effect is removed. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a technical field of a kind of test probe, and more particularly to an integrally formed conductive probe and a signal transmission method thereof.

  Currently, probes are widely applied as test media in various test areas such as printed circuit board tests, wafer tests, IC package tests, communication products, and liquid crystal panel tests. In addition, probes at this stage have evolved into fine electronic devices, and the probe size standard has become increasingly fine and has the advantages of conductivity and low resistance. If the function is added, it can be used as a connection contact point for a transmission / reception antenna of a wireless communication product such as a mobile phone, a charger and a connector of various electronic products. In the future, probes will not only be used for testing functions, but will occupy an indispensable position in the area of electronic devices.

  However, with regard to the technical area of the current test probe, the product structure generally has the disadvantages that the component composition is complicated, the outer volume is large, and the electric resistance value is large. An example will be described.

  FIG. 1 shows a so-called “low resistance probe structure”, and the main components thereof are an operation space in which one end is an inwardly contracted side and the other end is a stoppered side and is located between the stopper side and the inwardly contracted side. From the stopper side of the gold plating sleeve 91, the gold plating needle 92 which is inserted into the working space 911 from the stopper side of the gold plating sleeve 91 and exposed from the inwardly contracted side of the gold plating sleeve 91, from the stopper side A gold-plated spring 93 that is inserted into the working space 911 and contacts the gold-plated needle 92 and a tin-plated seat 94 having a bottom groove are included. The bottom groove of the seat 94 is filled with solder, the seat 94 is inserted into the working space 911 from the stopper side of the gold plating sleeve 91, the bottom groove contacts the gold plating spring 93, and the bottom The seat 94 is joined to the gold plating spring 93 by melting the solder of the groove, and the seat 94 is joined to the gold plating sleeve 91 by melting of the tin plated on the seat 94. Thus, a low resistance probe structure is obtained. It is configured.

  In the known structure described above, a noble metal layer having a low resistance value is plated on the outer layer of each constituent element of the probe, and a gold-plated needle is provided with a concave groove, and the solder in the concave groove is melted to form a gold-plated spring and The purpose of the low resistance value is achieved by the above-described coupling means and the structure in which these components are coupled together. However, such a structure has many components, which increases the manufacturing and assembly costs. Also, since a metal layer is plated on the outside of each component and joined by soldering, it requires extra labor and processing costs. The outer volume of the probe also increases, which is disadvantageous for precision testing. Further, the coupling of parts such as a seat body and a gold plating sleeve by a well-known soldering method can achieve the purpose of lowering the electric resistance value, but has a drawback that the inductance effect is large. This will be described later.

  FIG. 2 shows another known test or contact probe structure. It includes two sets of contact end needle units 81, the concentric double cylinders of which they are in contact with an object to be measured or connected to a measurement contact device, and a terminal needle unit 82 is connected to the contact end needle. It is located at the opposite end of the unit 81 and is used for contact with a device under test or connection with a measurement contact device. Further, the elastic unit 83 is provided between the inner wall of the contact end needle unit 81 and the end needle unit 82, and is compressed during a test to be used for buffering the probe and to provide elasticity. Among them, the probe is manufactured by a mold method.

  Although the number of components in FIG. 2 is relatively small and the installation space occupied during application is relatively small, it is not the best structural design. The processing cost of manufacturing, assembling and plating of the component parts is not low, and when an electronic signal is transmitted with a probe, there are too many parts through which the signal passes, and the electric resistance value becomes high, which is a drawback of the technique of FIG. It is. In addition, the structure of FIG. 2 has a drawback that the inductance effect is large during use. The cause will be described later.

  Please refer to FIG. In the process of testing with the probe, the electronic signal inevitably passes through the spring component, and generally, when the spring component in the probe is compressed, the coil is in a loose form, so when passing through the electronic signal the coil It flows along the path of the spiral structure, and the electrical resistance value and the path length are not directly proportional, but the large inductance effect affects the signal transmission efficiency and quality, and therefore needs to be improved .

  In view of this, the present invention is provided to remedy the disadvantages of using the above-described known probe structures for testing.

  The main object of the present invention is to provide a kind of integrally formed conductive probe and its signal transmission method, which manufactures a probe used for electronic signal transmission at the time of testing by an integral molding method, and greatly manufactures and processes it. It shall be possible to reduce the cost and reduce the installation space during the test.

  Another object of the present invention is to reduce the electric resistance value generated when testing with a probe by the simplest means, and to reliably eliminate the inductance effect.

According to a first aspect of the present invention, there is provided a signal transmission method for an integrally formed conductive probe, wherein the probe is placed in an interface mechanism that requires transmission of an electronic signal, and the probe is formed as an integrally molded elastic body, so that a plurality of spirals are formed. The coil of the probe is compressed and exhibits a close contact shape when the electronic transmission process is performed when the conductive connection portion protruding at the two ends contacts the signal start end and the signal end and the electronic transmission process is performed. The signal transmission method for an integrally formed conductive probe is characterized in that the probe is provided for the passage of an electronic signal in the form of an integral structure, thereby reducing the electrical resistance and further eliminating the inductance effect.
According to a second aspect of the present invention, in the signal transmission method for the integrally formed conductive probe according to the first aspect, the conductive connecting portions at the two ends of the probe are wound so that the circular diameter of the coil is smaller than that of the outer end. The signal transmission method of the integrally formed conductive probe is characterized in that it has a speaker mouth-like structure and the conductive contact portion has a slight elasticity.
According to a third aspect of the present invention, in the signal transmission method of the integrally formed conductive probe according to the first or second aspect, the structure of the coil of the conductive contact portion is in the form of close contact or in the form of elastic relaxation. This is a signal transmission method for an integrally formed conductive probe.
According to a fourth aspect of the present invention, in the signal transmission method for the integrally formed conductive probe according to the first or second aspect, one or a plurality of coil outer diameters change from large to small and from small to large in a predetermined portion of the middle stage of the probe. This is a signal transmission method for an integrally formed conductive probe, characterized in that the above-described spring portion is provided to improve the shortage of elasticity of the precision probe.
According to a fifth aspect of the present invention, there is provided a signal transmission method for an integrally formed conductive probe according to claim 4, wherein the spring portion is formed in a dense contact concentration form or an elastic relaxation form. The transmission method.
According to a sixth aspect of the present invention, there is provided an integrally formed conductive probe including an elastic body, wherein a coil circle diameter is changed from small to large at two outer ends of the elastic body to form a substantially speaker-like shape and to have a microelasticity. A contact portion is formed, and an elastic portion having an elastic recovery force is formed between the two conductive contact portions, and the coil outer diameter is changed from a large to a small, and further from a small to a large at a predetermined portion of the elastic portion. Thus, one or a plurality of spring portions are formed, thereby completing a probe for electronic signal transmission by integral molding, greatly reducing the probe manufacturing cost, and improving the elastic force of the probe itself, The integrally formed conductive probe is characterized in that the electrical resistance is reduced and the inductance effect is eliminated.
A seventh aspect of the present invention is the integrally formed conductive probe according to the sixth aspect, wherein the coil of the conductive contact portion is in a close contact form or in a relaxed form having elasticity. A molded conductive probe is used.
According to an eighth aspect of the present invention, in the integrally formed conductive probe according to the sixth aspect of the present invention, the integrally formed conductive film is characterized in that the spring portions are in a concentrated form in close contact with each other or in a relaxed form having elasticity. It is a probe.

  The integrally formed conductive probe of the present invention greatly reduces probe manufacturing costs, improves the elasticity of the probe itself, reduces electrical resistance, and eliminates inductance effects. The present invention solves the problem that a completely traditional probe is composed of a plurality of parts and has a relatively large electric resistance and inductance effect when used, or requires complicated electroplating processing, and reduces the electric resistance. , Remove the inductance effect, and improve industrial technology reliably.

  As shown in FIGS. 4 to 9, according to the integrally formed conductive probe and the signal transmission method thereof according to the present invention, the elastic body 10 is formed by spirally winding a metal wire rod having conductivity. Conductive portions 11, 11 'are integrally formed at the two ends, and the spiral of the two conductive portions 11, 11' changes in diameter from small to large from the outer end, and a speaker-like connecting portion at one end 111 is formed, and it has a function of fine elasticity, or the coil has an equal diameter structure, and the coil is in close contact with each other when it is formed by winding each of the conductive connecting portions 11 and 11 ′. Alternatively, the structure is a relaxed structure having elasticity, and the structural change of the elastic relaxation or dense contact is determined as necessary. Next, an elastic portion 12 having an elastic recovery force is formed between the two conductive contact portions 11 and 11 '. The elastic portion 12 has a spring structure and generates an elastic recovery force after compression.

  When the above-described probe structure is applied to electronic signal transmission, as shown in FIG. 8, the probe is placed in an interface mechanism that requires transmission of an electronic signal, such as a chip test probe card, The two connecting portions 11 and 11 'at the two ends of the probe come into contact with a signal start end 21 (for example, a predetermined portion of the probe card substrate) and a signal end point 22 (for example, a solder bump bonded to the back surface of the IC substrate). When the electronic signal transmission process is performed, the coil structure of the entire elastic body 10 has a completely dense integrated form after compression, and thus the electronic signal passes quickly (see FIG. 9), and the electrical resistance is reliably reduced. The effect of eliminating the inductance effect is achieved, and the conductive contact portion 11 that contacts the signal terminal 22 has a coil structure, and the conductive contact portion 11 structure itself also has a fine elasticity characteristic. The pressure at the time of contact with the part is relaxed and reduced, and the bad influence formed on the solder bumps during a long time high temperature test can be reduced.

  Further, as shown in FIGS. 10-14, the structural changes of the embodiments of the present invention are appropriately modified as needed for use, i.e. providing the elastic portion 12 when the probe size is relatively large. The elastic recovery force to be satisfied satisfies the need, and the structure of the elastic part 12 is a single long shape and is not modified in structure, but it is necessary to reduce the probe size to be relatively precise and small. When the elastic recovery force generated is insufficient for the usage requirement, a plurality of connecting portions 13 and 13 ′ are provided between the elastic portions 12, and the connecting portions 13 and 13 ′ generate subsistence of a slight elasticity to The situation of insufficient elasticity is prevented. The so-called connecting portions 13 and 13 ′ are local elastic structures in which the outer diameter of the coil changes from large to small and further from small to large, and the connecting portion 13 has a structure in which the coils are densely contacted, or It has a relaxed structure, and the change in relaxation or dense contact is determined as necessary, and the number of turns at the time of formation of any of the connecting parts 11, 11 ′, the elastic part 12, or the connecting parts 13, 13 ′ is changed. Can be appropriately increased or decreased depending on the total length after compression when a probe is used.

It is combination sectional drawing of a known probe. It is a combination sectional view of another known probe. It is a state display figure of a spring when a known probe performs electronic signal transmission. It is an external view of 1st Example of this invention. It is an external view after compression of the 1st example of the present invention. It is an external view of 2nd Example derived from 1st Example of this invention. It is a product external appearance display figure of 3rd Example of this invention. It is sectional drawing of the Example which actually used this invention for the probe card. It is a state display figure at the time of electronic signal transmission of the present invention. It is a product external view of 4th Example of this invention. It is an external view of 5th Example derived from 4th Example of this invention. It is an external view of 5th Example of this invention. It is an external view of 6th Example of this invention. It is an external view after compression of 6th Example of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Wire 10 Elastic body 11, 11 'Conduction part 111 Connection part 12 Elastic part 13, 13' Connection part 21 Signal start 22 Signal termination

Claims (8)

  In the signal transmission method of the integrally molded conductive probe, the probe is placed in an interface mechanism that requires transmission of an electronic signal, the probe is formed as an integrally molded elastic body, and includes a coil that has a plurality of spiral shapes, When the electronic transmission process is performed when the conductive projecting portions projecting at the two ends are in contact with the signal start end and the signal end, the probe coil is compressed to form a close contact form, and the probe is an integral structure. A signal transmission method for an integrally formed conductive probe, characterized in that it is used for the passage of an electronic signal with a form, thereby reducing the electrical resistance and further eliminating the inductance effect.   2. The signal transmission method for an integrally formed conductive probe according to claim 1, wherein a speaker mouth-like structure is formed in which the conductive connecting portions at the two ends of the probe are wound so that the circular diameter of the coil is smaller than that of the outer end. A signal transmission method for an integrally formed conductive probe, characterized in that the conductive contact portion has a slight elasticity.   3. The signal transmission method for an integrally formed conductive probe according to claim 1 or 2, wherein the structure of the coil of the conductive portion is in the form of close contact or in the form of elastic relaxation. Signal transmission method of molded conductive probe.   In the signal transmission method of the integrally formed conductive probe according to claim 1 or 2, one or a plurality of spring portions in which the outer diameter of the coil changes from large to small and small to large are provided in a predetermined portion of the probe middle stage. A signal transmission method for an integrally formed conductive probe, characterized in that the drawback of lack of elasticity of a precision probe is improved.   5. The signal transmission method for an integrally formed conductive probe according to claim 4, wherein the spring portion is in a concentrated contact gathering form or an elastic relaxation form.   The integrally formed conductive probe includes an elastic body, and the outer diameter of the elastic body changes from a small circle diameter to a large coil diameter to form a substantially speaker-like form, and a conductive portion having a slight elasticity is formed. An elastic part having an elastic recovery force is formed between the two conducting parts, and one or more of the coil outer diameter is changed from a large to a small and further from a small to a large in a predetermined part of the elastic part. A plurality of spring parts are formed, thereby completing a probe for electronic signal transmission by integral molding, greatly reducing the probe manufacturing cost, improving the elasticity of the probe itself, reducing the electrical resistance, and reducing the inductance An integrally formed conductive probe characterized in that the effect is removed.   7. The integrally formed conductive probe according to claim 6, wherein the coil of the conductive contact portion is in a close contact form or in a relaxed form having elasticity. 7. The integrally formed conductive probe according to claim 6, wherein the spring part has a concentrated form in which the spring portions are in close contact with each other or a loosely shaped form having elasticity.

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