JP2006337829A - Driving ic and display device having same mounted thereon - Google Patents

Driving ic and display device having same mounted thereon Download PDF

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JP2006337829A
JP2006337829A JP2005164163A JP2005164163A JP2006337829A JP 2006337829 A JP2006337829 A JP 2006337829A JP 2005164163 A JP2005164163 A JP 2005164163A JP 2005164163 A JP2005164163 A JP 2005164163A JP 2006337829 A JP2006337829 A JP 2006337829A
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terminal
driving
terminals
terminal surface
area
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Takashi Matsui
隆司 松井
Motoji Shioda
素二 塩田
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Sharp Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/0401—Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H01L2224/0601—Structure
    • H01L2224/0603—Bonding areas having different sizes, e.g. different heights or widths
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a driving IC which can be mounted with high electric reliability. <P>SOLUTION: A driving IC 4 has a plurality of bump electrode terminals 10 for input and a plurality of bump electrode terminals 11 for output. A terminal group of the bump electrode terminals 11 for output includes a plurality of inside terminals 12 which are linearly arrayed in parallel with one side of the driving IC 4 and have first terminal faces respectively, and a plurality of outside terminals 13 which are linearly arrayed on the outside of an array of the inside terminals 12 in parallel with the array of the inside terminals 12 and have second terminal faces having larger areas than the first terminal faces. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は駆動用ＩＣ及びそれが実装された表示装置に関する。   The present invention relates to a driving IC and a display device on which the driving IC is mounted.

一般的に液晶表示装置等に代表される表示装置には複数の駆動用集積回路（駆動用ＩＣ）が異方性導電接着剤により実装されている。近年、表示装置の高精細化が進むにつれて、駆動用ＩＣに対しても高精細化が強く求められるようになってきている。高精細な駆動用ＩＣとして、例えば特許文献１等には、二列に配列された出力端子を有する駆動用ＩＣが開示されている。   In general, a plurality of driving integrated circuits (driving ICs) are mounted on a display device represented by a liquid crystal display device or the like with an anisotropic conductive adhesive. In recent years, with the progress of higher definition of display devices, higher definition has been strongly demanded for driving ICs. As a high-definition driving IC, for example, Patent Document 1 discloses a driving IC having output terminals arranged in two rows.

図５は二列に配列された出力端子を有する従来の駆動用ＩＣ１００の底面図である。   FIG. 5 is a bottom view of a conventional driving IC 100 having output terminals arranged in two rows.

図５に示すように、矩形状の駆動用ＩＣ１００は複数の入力端子１０１と複数の出力端子１０２とを有する。複数の入力端子１０１は矩形状に形成された駆動用ＩＣ１００の一方の長辺に沿って一列に配列されている。一方、複数の出力端子１０２は他方の長辺に沿って二列に配列されている。駆動用ＩＣ１００では、出力端子１０２のうち内側の端子列の端子面と外側の端子列の端子面とは同一形状（同一面積）である。
特開２００４−２５２４６６号公報 As shown in FIG. 5, the rectangular driving IC 100 includes a plurality of input terminals 101 and a plurality of output terminals 102. The plurality of input terminals 101 are arranged in a line along one long side of the driving IC 100 formed in a rectangular shape. On the other hand, the plurality of output terminals 102 are arranged in two rows along the other long side. In the driving IC 100, the terminal surface of the inner terminal row and the terminal surface of the outer terminal row of the output terminals 102 have the same shape (same area).
JP 2004-252466 A

しかしながら、駆動用ＩＣ１００を表示装置等に実装した場合、出力端子１０２のうち外側の端子列の接続不良が生じる可能性が高いという問題がある。   However, when the driving IC 100 is mounted on a display device or the like, there is a problem that there is a high possibility that a connection failure of the outer terminal row of the output terminals 102 will occur.

本発明は、係る点に鑑みてなされたものであり、その目的とするところは、高い電気的信頼性で実装可能な駆動用ＩＣを提供することにある。   The present invention has been made in view of the above points, and an object of the present invention is to provide a driving IC that can be mounted with high electrical reliability.

本発明者らは、誠意研究の結果、出力端子のうち外側の端子列に印加される圧力が低くなるために外側の端子列の接続不良が起こりやすくなること、及びその傾向が整合比が小さくなるにつれて増大することを見出した。また、外側の端子列の端子面の面積を大きくすることにより接続不良を抑制することを見出し、本発明を成すに至った。   As a result of sincerity research, the present inventors have found that since the pressure applied to the outer terminal row of the output terminals is low, poor connection of the outer terminal row is likely to occur, and the tendency is that the matching ratio is small. It has been found that it increases with time. Further, it has been found that connection failure is suppressed by increasing the area of the terminal surface of the outer terminal row, and the present invention has been achieved.

本発明に係る駆動用ＩＣは、複数の入力端子及び複数の出力端子を有する矩形状である。本発明に係る駆動用ＩＣは、異方性導電接着剤等により表示装置等に実装され、表示装置等を駆動するためのものである。   The driving IC according to the present invention has a rectangular shape having a plurality of input terminals and a plurality of output terminals. The driving IC according to the present invention is mounted on a display device or the like with an anisotropic conductive adhesive or the like, and drives the display device or the like.

本発明に係る駆動用ＩＣでは、複数の入力端子及び複数の出力端子のうち少なくとも一方の端子群が複数の第１端子及び複数の第２端子を有する。複数の第１端子は駆動用ＩＣの一辺に対して各々平行に一直線状に配列されている。複数の第１端子の各々は第１端子面を有する。複数の第２端子は第１端子の列よりも外側（上記一辺寄り）に設けられている。複数の第２端子は第１端子の列に対して並行に一直線状に配列されている。複数の第２端子の各々は第１端子面よりも大きな面積の第２端子面を有する。   In the driving IC according to the present invention, at least one of the plurality of input terminals and the plurality of output terminals includes a plurality of first terminals and a plurality of second terminals. The plurality of first terminals are arranged in a straight line parallel to one side of the driving IC. Each of the plurality of first terminals has a first terminal surface. The plurality of second terminals are provided on the outer side (closer to the one side) than the row of the first terminals. The plurality of second terminals are arranged in a straight line parallel to the row of first terminals. Each of the plurality of second terminals has a second terminal surface having a larger area than the first terminal surface.

本発明に係る駆動用ＩＣのように、駆動用ＩＣの外側（上記一辺寄り）に設けられた第２端子の第２端子面の面積を大きくすることにより、実装された場合に第２端子の接続不良の発生を効果的に抑制することができる。従って、本発明に係る駆動用ＩＣは高い電気的信頼性で実装可能である。   Like the driving IC according to the present invention, the area of the second terminal of the second terminal provided outside the driving IC (near the one side) is increased to increase the area of the second terminal when mounted. The occurrence of poor connection can be effectively suppressed. Therefore, the driving IC according to the present invention can be mounted with high electrical reliability.

本発明に係る駆動用ＩＣでは、複数の出力端子の端子群のみが第１端子の列と第２端子の列とを有していてもよい。この場合、整合比が６０％より大きい場合には、第２端子面の面積が第１端子面の面積の７／５以上であり、整合比が５０％以上６０％以下である場合には、第２端子面の面積が第１端子面の面積の７／３以上であることが好ましい。尚、本明細書において、「整合比」とは、複数の入力端子の端子面の総面積の複数の出力端子の端子面の総面積に対する比である。   In the driving IC according to the present invention, only the terminal group of the plurality of output terminals may have a first terminal row and a second terminal row. In this case, when the matching ratio is larger than 60%, the area of the second terminal surface is 7/5 or more of the area of the first terminal surface, and when the matching ratio is 50% or more and 60% or less, The area of the second terminal surface is preferably 7/3 or more of the area of the first terminal surface. In the present specification, the “matching ratio” is a ratio of the total area of the terminal surfaces of the plurality of input terminals to the total area of the terminal surfaces of the plurality of output terminals.

本発明に係る駆動用ＩＣでは、第１端子面と第２端子面とは、各々一辺が駆動用ＩＣの一辺に対して平行な矩形状であり、第２端子面の駆動用ＩＣの一辺に対して直交する方向に延びる他辺が第１端子面の同他辺（第１端子面の駆動用ＩＣの一辺に対して直交する方向に延びる他辺）よりも長くてもよい。この構成にすることによって、第２端子面の面積を第１端子面の面積よりも大きくすることができる。   In the driving IC according to the present invention, each of the first terminal surface and the second terminal surface has a rectangular shape in which one side is parallel to one side of the driving IC. The other side extending in the direction orthogonal to the first terminal surface may be longer than the other side of the first terminal surface (the other side extending in the direction orthogonal to one side of the driving IC on the first terminal surface). With this configuration, the area of the second terminal surface can be made larger than the area of the first terminal surface.

複数の出力端子の端子群が第１端子の列と第２端子の列とを有していてもよい。その場合、整合比が６０％より大きい場合には、第２端子面の駆動用ＩＣの一辺に対して直交する方向に延びる他辺の長さが第１端子面の同他辺（第１端子面の駆動用ＩＣの一辺に対して直交する方向に延びる他辺）の長さの７／５以上であり、整合比が５０％以上６０％以下である場合には、第２端子面の他辺（第２端子面の駆動用ＩＣの一辺に対して直交する方向に延びる他辺）の長さが第１端子面の他辺（第１端子面の駆動用ＩＣの一辺に対して直交する方向に延びる他辺）の長さの７／３以上であることが好ましい。   The terminal group of the plurality of output terminals may include a first terminal row and a second terminal row. In this case, when the matching ratio is larger than 60%, the length of the other side extending in the direction orthogonal to one side of the driving IC on the second terminal surface is equal to the other side (first terminal of the first terminal surface). If the matching ratio is 50% or more and 60% or less, the length of the second terminal surface is not less than 7/5 of the length of the other surface extending in the direction orthogonal to one side of the surface driving IC. The length of the side (the other side extending in the direction orthogonal to one side of the driving IC on the second terminal surface) is orthogonal to the other side of the first terminal surface (one side of the driving IC on the first terminal surface) It is preferably 7/3 or more of the length of the other side extending in the direction.

本発明に係る駆動用ＩＣでは、第１端子の各々と第２端子の各々とが駆動用ＩＣの一辺に沿って千鳥状に配置されていることが好ましい。そうすることによって、第１端子及び第２端子への配線（特に第２端子への配線）が容易となる。   In the driving IC according to the present invention, it is preferable that each of the first terminals and each of the second terminals is arranged in a staggered manner along one side of the driving IC. By doing so, wiring to the first terminal and the second terminal (particularly wiring to the second terminal) is facilitated.

本発明に係る表示装置は本発明に係る駆動用ＩＣが実装されたものである。本発明に係る表示装置は、例えば、液晶表示装置、有機エレクトロルミネッセンス表示装置、無機エレクトロルミネッセンス表示装置、プラズマ表示装置、フィールドエミッション表示装置等であってもよい。   The display device according to the present invention is mounted with the driving IC according to the present invention. The display device according to the present invention may be, for example, a liquid crystal display device, an organic electroluminescence display device, an inorganic electroluminescence display device, a plasma display device, a field emission display device, or the like.

上述のように本発明に係る駆動用ＩＣは高い電気的信頼性で実装可能である。このため、本発明に係る駆動用ＩＣが実装された表示装置は高い電気的信頼性を有する。   As described above, the driving IC according to the present invention can be mounted with high electrical reliability. For this reason, the display device on which the driving IC according to the present invention is mounted has high electrical reliability.

以上説明したように、本発明によれば、実装工程における第２端子の接続不良を抑制することができるので、例えば表示装置等に高い電気的信頼性で実装することができる駆動用ＩＣを実現することができる。   As described above, according to the present invention, since the connection failure of the second terminal in the mounting process can be suppressed, for example, a driving IC that can be mounted on a display device or the like with high electrical reliability is realized. can do.

以下、本発明の実施形態について、図面を参照しながら詳細に説明する。   Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

（実施形態１）図１は本実施形態１に係る液晶表示装置１の要部の構成を模式的に表す平面図である。   (Embodiment 1) FIG. 1 is a plan view schematically showing a configuration of a main part of a liquid crystal display device 1 according to Embodiment 1. FIG.

液晶表示装置１は、大小一対の基板６ａ、６ｂと、一対の基板６ａ、６ｂの間に封入された液晶層（図示せず）とを有する。大きい方の基板６ｂは表示回路基板（アクティブマトリクス基板）である。大きい方の基板６ｂと小さい方の基板６ａとが重畳する領域が表示領域２を構成しており、表示領域２からはみ出した基板６ｂの部分はＩＣ実装領域３を構成している。駆動用ＩＣ４はこのＩＣ実装領域３にベアチップ実装されている。詳細には、駆動用ＩＣ４には突起状のボンディング用バンプ電極端子（以下、「バンプ電極端子」と略称する。）が設けられている。このバンプ電極端子が液晶パネル側の表示回路基板上のボンディング用電極パッド（以下、「電極パッド」と略称する）にフェイスダウンボンディング接続されている。   The liquid crystal display device 1 includes a pair of large and small substrates 6a and 6b and a liquid crystal layer (not shown) sealed between the pair of substrates 6a and 6b. The larger substrate 6b is a display circuit substrate (active matrix substrate). A region where the larger substrate 6 b and the smaller substrate 6 a overlap constitutes the display region 2, and the portion of the substrate 6 b that protrudes from the display region 2 constitutes the IC mounting region 3. The driving IC 4 is bare-chip mounted in the IC mounting area 3. Specifically, the driving IC 4 is provided with a protruding bonding bump electrode terminal (hereinafter abbreviated as “bump electrode terminal”). The bump electrode terminals are face-down bonded to a bonding electrode pad (hereinafter abbreviated as “electrode pad”) on the display circuit board on the liquid crystal panel side.

ＩＣ実装領域３には、データ信号線（図示せず）、走査信号線（図示せず）に入力する信号、電源等を外部回路から供給するためのフレキシブル配線基板（以下、「ＦＰＣ基板」と略称する）５が接続されている。また、ＩＣ実装領域３には、各信号線（データ信号線、走査信号線等）に接続された複数の電極パッド（図示せず）と、駆動用ＩＣ４に信号及び電源を入力するための複数の入力配線（図示せず）と、これらの入力配線の信号出力端に電気的に接続された複数の電極パッド（図示せず）と、入力配線の信号入力端に電気的に接続された複数のＦＰＣ入力端子（図示せず）とがそれぞれ形成されており、ＦＰＣ基板５はＦＰＣ入力端子に電気的に接続されている。   In the IC mounting area 3, a flexible wiring board (hereinafter referred to as “FPC board”) for supplying a signal input to a data signal line (not shown), a scanning signal line (not shown), a power source, etc. from an external circuit. (Abbreviated) 5 is connected. In the IC mounting area 3, a plurality of electrode pads (not shown) connected to each signal line (data signal line, scanning signal line, etc.) and a plurality for inputting signals and power to the driving IC 4 are provided. Input wirings (not shown), a plurality of electrode pads (not shown) electrically connected to signal output terminals of these input wirings, and a plurality of electrodes electrically connected to signal input terminals of the input wirings FPC input terminals (not shown) are respectively formed, and the FPC board 5 is electrically connected to the FPC input terminals.

図２は駆動用ＩＣ４の背面図である。   FIG. 2 is a rear view of the driving IC 4.

図２に示すように、駆動用ＩＣ４の背面側には、ＩＣ実装領域３上の信号線に接続された電極パッド（図示せず）及び入力配線の各信号出力端に接続された電極パッド（図示せず）にそれぞれ対応するように、複数のバンプ電極端子１０、１１が設けられている。一方、表示回路基板６ｂのＩＣ実装領域３と駆動用ＩＣ４との間には、導電性微粒子が絶縁性接着剤中に分散混入された異方性導電接着剤（ＡＦＣ、図示せず）が介在している。このＡＦＣにより、駆動用ＩＣ４は表示回路基板６ｂに機械的に固定されると共に、ＡＦＣに分散混入された導電性微粒子により駆動用ＩＣ４のバンプ電極端子１０、１１と表示回路基板６ｂ上に設けられた電極パッド（図示せず）とが電気的に接続される。   As shown in FIG. 2, on the back side of the driving IC 4, an electrode pad (not shown) connected to a signal line on the IC mounting region 3 and an electrode pad (connected to each signal output end of the input wiring) A plurality of bump electrode terminals 10 and 11 are provided so as to correspond to each other (not shown). On the other hand, an anisotropic conductive adhesive (AFC, not shown) in which conductive fine particles are dispersed and mixed in an insulating adhesive is interposed between the IC mounting region 3 and the driving IC 4 of the display circuit board 6b. is doing. The driving IC 4 is mechanically fixed to the display circuit board 6b by the AFC, and is provided on the bump electrode terminals 10 and 11 of the driving IC 4 and the display circuit board 6b by conductive fine particles dispersed and mixed in the AFC. An electrode pad (not shown) is electrically connected.

以下、図２を参照しながら駆動用ＩＣ４のバンプ電極端子１０、１１の構造について詳細に説明する。駆動用ＩＣ４には、入力端子としての入力用バンプ電極端子１０と、出力端子としての出力用バンプ電極端子１１とが設けられている。入力用バンプ電極端子１０は駆動用ＩＣ４の一方の長辺に沿って一直線状に配列されている。一方、出力用バンプ電極端子１１は上記一方の長辺に対向する他方の長辺に沿って二列に相互に平行に一直線状に（マトリクス状に）配列されている。このように、出力用バンプ電極端子１１を二列に配列することによって、単位面積あたりに設けることができる出力用バンプ電極端子１１の数量を多くすることができる。このため、高精細な駆動用ＩＣ４を実現することができる。   Hereinafter, the structure of the bump electrode terminals 10 and 11 of the driving IC 4 will be described in detail with reference to FIG. The driving IC 4 is provided with an input bump electrode terminal 10 as an input terminal and an output bump electrode terminal 11 as an output terminal. The input bump electrode terminals 10 are arranged in a straight line along one long side of the driving IC 4. On the other hand, the output bump electrode terminals 11 are arranged in a straight line (in a matrix) in two rows along the other long side opposite to the one long side. Thus, by arranging the output bump electrode terminals 11 in two rows, the number of output bump electrode terminals 11 that can be provided per unit area can be increased. Therefore, a high-definition driving IC 4 can be realized.

出力用バンプ電極端子１１は第１の出力用バンプ電極端子１２と第２の出力用バンプ電極端子１３とを含む。第１の出力用バンプ電極端子１２は駆動用ＩＣ４の一辺に対して各々平行に一直線状に配列されている。第２の出力用バンプ電極端子１３は第１の出力用バンプ電極端子１２よりも外側に（他方の長辺寄りに）各々第１の出力用バンプ電極端子１２の列に並行に一直線状に配列されている。以下、内側に配列された第１の出力用バンプ電極端子１２を内側端子１２と略称し、外側に配列された第２の出力用バンプ電極端子１３を外側端子１３と略称する。   The output bump electrode terminal 11 includes a first output bump electrode terminal 12 and a second output bump electrode terminal 13. The first output bump electrode terminals 12 are arranged in a straight line parallel to one side of the driving IC 4. The second output bump electrode terminals 13 are arranged outside the first output bump electrode terminal 12 (near the other long side) in a straight line parallel to the row of the first output bump electrode terminals 12. Has been. Hereinafter, the first output bump electrode terminals 12 arranged on the inner side are abbreviated as inner terminals 12, and the second output bump electrode terminals 13 arranged on the outer side are abbreviated as outer terminals 13.

本実施形態１では内側端子１２の端子面（第１端子面）よりも外側端子１３の端子面（第２端子面）の面積が大きくなるように内側端子１２及び外側端子１３が形成されている。尚、本明細書において、「端子面」とは表示回路基板６ｂに設けられた電極パッドと対向し、導電性微粒子を介して電極パッドと電気的に接続される面をいう。   In the first embodiment, the inner terminal 12 and the outer terminal 13 are formed such that the area of the terminal surface (second terminal surface) of the outer terminal 13 is larger than the terminal surface (first terminal surface) of the inner terminal 12. . In the present specification, the “terminal surface” refers to a surface that faces an electrode pad provided on the display circuit board 6b and is electrically connected to the electrode pad via conductive fine particles.

具体的には、図２に示すように内側端子１２と外側端子１３との各々は一辺（詳細には短辺）が駆動用ＩＣ４の長辺に対して平行な矩形状である。駆動用ＩＣ４の短辺に対して平行な短辺の長さは内側端子１２、外側端子１３共にｈで共通である。駆動用ＩＣ４の長辺に対して平行な内側端子１２の長辺の長さがａであり、外側端子１３の長辺の長さがｂである。長さｂは長さｂよりも短い。   Specifically, as shown in FIG. 2, each of the inner terminal 12 and the outer terminal 13 has a rectangular shape in which one side (specifically, the short side) is parallel to the long side of the driving IC 4. The length of the short side parallel to the short side of the driving IC 4 is the same for both the inner terminal 12 and the outer terminal 13. The length of the long side of the inner terminal 12 parallel to the long side of the driving IC 4 is a, and the length of the long side of the outer terminal 13 is b. The length b is shorter than the length b.

例えば、図５に示すような内側端子の端子面と外側端子の端子面とが同一形状・同一面積である従来の駆動用ＩＣ１００を異方性導電接着剤により液晶表示装置に実装する場合、内側端子よりも外側端子の方が接続の電気的信頼性が低くなる傾向にある。具体的には、内側端子よりも外側端子の方がトラップ数が少なくなる傾向にある。   For example, when the conventional driving IC 100 having the same shape and the same area as the terminal surface of the inner terminal and the terminal surface of the outer terminal as shown in FIG. 5 is mounted on the liquid crystal display device with an anisotropic conductive adhesive, The electrical reliability of the connection tends to be lower at the outer terminal than at the terminal. Specifically, the number of traps tends to be smaller at the outer terminal than at the inner terminal.

尚、本明細書において「トラップ数」とは、駆動用ＩＣのバンプ電極端子と表示回路基板６ｂ上に設けられた電極パッドとにより捕捉される導電性微粒子の個数のことをいう。具体的には、異方性導電接着剤を用いて駆動用ＩＣを実装し、バンプ電極端子と電極パッドとにより捕捉された導電性微粒子の個数を電子顕微鏡によりカウントする（例えば、１００カ所カウントする）。その結果から捕捉された一対のバンプ電極端子と電極パットにより捕捉された導電性微粒子の個数の平均値（Ａｖｅ．）及びばらつき（σ）を計算する。そして、得られた平均値（Ａｖｅ．）からばらつき（σ）を三倍した値を差し引いた値（Ａｖｅ．−３σ）をトラップ数とする。   In this specification, the “number of traps” refers to the number of conductive fine particles captured by the bump electrode terminals of the driving IC and the electrode pads provided on the display circuit board 6b. Specifically, a driving IC is mounted using an anisotropic conductive adhesive, and the number of conductive fine particles captured by the bump electrode terminals and the electrode pads is counted with an electron microscope (for example, 100 places are counted). ). From the result, the average value (Ave.) and variation (σ) of the number of conductive fine particles captured by the pair of bump electrode terminals and electrode pads captured are calculated. Then, a value (Ave.−3σ) obtained by subtracting a value obtained by triple the variation (σ) from the obtained average value (Ave.) is set as the number of traps.

図３は駆動用ＩＣ１００を異方性導電接着剤により液晶表示装置に実装した場合のトラップ数（Ａｖｅ．−３σ）と整合比との関係を表すグラフである。尚、図３中１２で示す実線データが内側端子１２のデータであり、１３で示す実線データが外側端子１３のデータである。   3 is a graph showing the relationship between the number of traps (Ave.−3σ) and the matching ratio when the driving IC 100 is mounted on a liquid crystal display device using an anisotropic conductive adhesive. Note that the solid line data indicated by 12 in FIG. 3 is the data of the inner terminal 12, and the solid line data indicated by 13 is the data of the outer terminal 13.

図３に示すように、整合比が５０％以上９０％以下の全範囲において内側端子１２よりも外側端子１３の方がトラップ数が少ない傾向にある。すなわち、外側端子１３の方が内側端子１２よりも接続の電気的信頼性が低い傾向にある。また、内側端子１２に関しては整合比が小さい値であっても、整合比が大きい場合とほぼ同様のトラップ数であるが、外側端子１３に関しては整合比が小さくなるにつれてトラップ数が少なくなる傾向にある。特にその傾向は整合比が６０％以下の範囲で顕著である。   As shown in FIG. 3, the outer terminal 13 tends to have a smaller number of traps than the inner terminal 12 in the entire range where the matching ratio is 50% or more and 90% or less. That is, the outer terminal 13 tends to have lower electrical reliability than the inner terminal 12. Moreover, even if the matching ratio is small for the inner terminal 12, the number of traps is almost the same as when the matching ratio is large. However, for the outer terminal 13, the number of traps tends to decrease as the matching ratio decreases. is there. In particular, this tendency is remarkable when the matching ratio is 60% or less.

しかしながら、本実施形態１に係る駆動用ＩＣ４では、外側端子１３の端子面の面積が内側端子１２の端子面の面積よりも大きくなるように外側端子１３及び内側端子１２が形成されている。一般的に、外側端子１３による単位面積あたりのトラップ数は外側端子１３の端子面の面積とは相関せず、ほぼ一定である。このため、外側端子１３の端子面の面積を大きくすることによって外側端子１３のトラップ数を多くすることができる。従って、外側端子１３の端子面の面積を内側端子１２の端子面の面積よりも大きくすることによって外側端子１３の接続の電気的信頼性を向上することができる。   However, in the driving IC 4 according to the first embodiment, the outer terminal 13 and the inner terminal 12 are formed such that the area of the terminal surface of the outer terminal 13 is larger than the area of the terminal surface of the inner terminal 12. In general, the number of traps per unit area by the outer terminal 13 does not correlate with the area of the terminal surface of the outer terminal 13 and is substantially constant. For this reason, the number of traps of the outer terminal 13 can be increased by increasing the area of the terminal surface of the outer terminal 13. Therefore, the electrical reliability of the connection of the outer terminal 13 can be improved by making the area of the terminal surface of the outer terminal 13 larger than the area of the terminal surface of the inner terminal 12.

尚、整合比が６０％より大きい場合には、外側端子１３の端子面の面積が内側端子１２の端子面の面積の７／５以上であることが好ましい。言い換えれば、駆動用ＩＣ４の短辺方向に延びる外側端子１３の長辺の長さｂが駆動用ＩＣ４の短辺方向に延びる内側端子１２の長辺の長さａの７／５以上であることが好ましい。図３に示すように、整合比が６０％以上の範囲では外側端子１３のトラップ数は内側端子１２のトラップ数の７５％〜８５％程度である。このため、外側端子１３の端子面の面積を内側端子１２の端子面の面積の７／５以上とすることで外側端子１３のトラップ数を内側端子１２のトラップ数と同程度またはそれ以上にすることができる。   When the matching ratio is larger than 60%, the area of the terminal surface of the outer terminal 13 is preferably 7/5 or more of the area of the terminal surface of the inner terminal 12. In other words, the long side length b of the outer terminal 13 extending in the short side direction of the driving IC 4 is 7/5 or more of the long side length a of the inner terminal 12 extending in the short side direction of the driving IC 4. Is preferred. As shown in FIG. 3, the number of traps of the outer terminal 13 is about 75% to 85% of the number of traps of the inner terminal 12 when the matching ratio is 60% or more. For this reason, by setting the area of the terminal surface of the outer terminal 13 to 7/5 or more of the area of the terminal surface of the inner terminal 12, the number of traps of the outer terminal 13 is set to be equal to or greater than the number of traps of the inner terminal 12. be able to.

同様に、整合比が５０％以上６０％以下である場合には、外側端子１３の端子面の面積が内側端子１２の端子面の面積の７／３以上であることが好ましい。言い換えれば、駆動用ＩＣ４の短辺方向に延びる外側端子１３の長辺の長さｂが駆動用ＩＣ４の短辺方向に延びる内側端子１２の長辺の長さａの７／３以上であることが好ましい。図３に示すように、整合比が５０％以上６０％以下の範囲では外側端子１３のトラップ数は内側端子１２のトラップ数の４０％〜７５％程度である。このため、外側端子１３の端子面の面積を内側端子１２の端子面の面積の７／３以上とすることで外側端子１３のトラップ数を内側端子１２のトラップ数と同程度またはそれ以上にすることができる。   Similarly, when the matching ratio is 50% or more and 60% or less, the area of the terminal surface of the outer terminal 13 is preferably 7/3 or more of the area of the terminal surface of the inner terminal 12. In other words, the long side length b of the outer terminal 13 extending in the short side direction of the driving IC 4 is 7/3 or more of the long side length a of the inner terminal 12 extending in the short side direction of the driving IC 4. Is preferred. As shown in FIG. 3, the number of traps of the outer terminal 13 is about 40% to 75% of the number of traps of the inner terminal 12 when the matching ratio is in the range of 50% to 60%. For this reason, by setting the area of the terminal surface of the outer terminal 13 to 7/3 or more of the area of the terminal surface of the inner terminal 12, the number of traps of the outer terminal 13 is made equal to or greater than the number of traps of the inner terminal 12. be able to.

上述のように、どのような整合比においても外側端子１３の端子面と内側端子１２の端子面との面積が同一である場合のトラップ数は外側端子１３の方が内側端子１２よりも少なくなる。このため、本実施形態１のように外側端子１３の端子面の面積を内側端子１２の端子面の面積よりも大きくすることによって、どのような整合比の駆動用ＩＣ４においても外側端子１３の接続の電気的信頼性を向上する効果が得られる。中でも、外側端子１３のトラップ数が少なくなる整合比の小さい範囲において特に大きな効果が得られる。   As described above, the number of traps in the outer terminal 13 is smaller than that in the inner terminal 12 when the area of the terminal surface of the outer terminal 13 and the terminal surface of the inner terminal 12 is the same at any matching ratio. . For this reason, by connecting the area of the terminal surface of the outer terminal 13 larger than the area of the terminal surface of the inner terminal 12 as in the first embodiment, the connection of the outer terminal 13 is possible in the driving IC 4 of any matching ratio. The effect of improving the electrical reliability is obtained. In particular, a particularly large effect is obtained in a range where the matching ratio is small where the number of traps of the outer terminal 13 is small.

（実施形態２）実施形態２に係る液晶表示装置は実装された駆動用ＩＣのバンプ電極端子の構成を除いて実施形態１に係る液晶表示装置１と同様の構成を有する。ここでは実施形態１とは異なる駆動用ＩＣのバンプ電極端子部分について説明する。尚、本実施形態２の説明において、図１は共通に参照する。また、実質的に同じ機能を有する構成要素を共通に参照符号で説明し、説明を省略する。   (Embodiment 2) The liquid crystal display device according to Embodiment 2 has the same configuration as that of the liquid crystal display device 1 according to Embodiment 1 except for the configuration of the bump electrode terminals of the mounted driving IC. Here, a bump electrode terminal portion of the driving IC different from that of the first embodiment will be described. In the description of the second embodiment, FIG. 1 is referred to in common. In addition, components having substantially the same function are described with common reference numerals, and description thereof is omitted.

図４は実施形態２における駆動用ＩＣ２０の背面図である。   FIG. 4 is a rear view of the driving IC 20 in the second embodiment.

駆動用ＩＣ２０も、実施形態１に係る駆動用ＩＣ４と同様に、一列に配列された入力用バンプ電極端子１０と二列に配列された出力用バンプ電極端子１１とを有する。出力用バンプ電極端子１１は内側端子１２と外側端子１３とにより構成されている。また、外側端子１３の端子面の面積が内側端子１２の端子面の面積よりも大きくなるように外側端子１３及び内側端子１２が形成されている。従って、外側端子１３の接続の電気的信頼性を実現することができる。   Similarly to the driving IC 4 according to the first embodiment, the driving IC 20 includes input bump electrode terminals 10 arranged in a row and output bump electrode terminals 11 arranged in two rows. The output bump electrode terminal 11 includes an inner terminal 12 and an outer terminal 13. Further, the outer terminal 13 and the inner terminal 12 are formed so that the area of the terminal surface of the outer terminal 13 is larger than the area of the terminal surface of the inner terminal 12. Therefore, the electrical reliability of the connection of the outer terminal 13 can be realized.

本実施形態２では、内側端子１２の各々と外側端子１３の各々とが駆動用ＩＣ２０の長辺に沿って千鳥状に配置されている。このため、駆動用ＩＣ２０では、出力用バンプ電極端子１１への配線（特に外側端子１３への配線）が容易である。   In the second embodiment, each of the inner terminals 12 and each of the outer terminals 13 are arranged in a staggered manner along the long side of the driving IC 20. Therefore, in the driving IC 20, wiring to the output bump electrode terminal 11 (particularly wiring to the outer terminal 13) is easy.

例えば、図２に示す駆動用ＩＣ４では隣接する内側端子１２の間を経由させて外側端子１３へ配線しなければならないため、外側端子１３への配線を細く且つ折れ曲げ形状にしなければならない。一方、図４に示す本実施形態２に係る駆動用ＩＣ２０では、外側端子１３が隣接する内側端子１２の間に配置されている。このため、外側端子１３への配線を比較的太く、且つ直線状にすることができる。   For example, in the driving IC 4 shown in FIG. 2, the wiring to the outer terminal 13 must be routed between the adjacent inner terminals 12. Therefore, the wiring to the outer terminal 13 must be thin and bent. On the other hand, in the driving IC 20 according to the second embodiment illustrated in FIG. 4, the outer terminal 13 is disposed between the adjacent inner terminals 12. For this reason, the wiring to the outer terminal 13 can be made relatively thick and straight.

尚、上述した実施形態１及び２では、出力用バンプ電極端子１１が二列に配列されており、入力用バンプ電極端子１０は一列に配列されている。本発明はこの構成に限定されるものではなく、例えば入力用バンプ電極端子１０を二列に配列し、出力用バンプ電極端子１１を一列に配列してもよい。また、入力用バンプ電極端子１０及び出力用バンプ電極端子１１の双方を二列に配列してもよい。   In the first and second embodiments described above, the output bump electrode terminals 11 are arranged in two rows, and the input bump electrode terminals 10 are arranged in one row. The present invention is not limited to this configuration. For example, the input bump electrode terminals 10 may be arranged in two rows and the output bump electrode terminals 11 may be arranged in one row. Further, both the input bump electrode terminals 10 and the output bump electrode terminals 11 may be arranged in two rows.

実施形態１及び２では、内側端子よりも外側端子の方が駆動用ＩＣの短辺に並行な長辺の長さが長くなるように、内側端子及び外側端子が形成されている。本発明はこの構成に限定されるものではない。内側端子の端子面よりも外側端子の端子面の面積が大きければよく、例えば、内側端子よりも外側端子の方が駆動用ＩＣの長辺に平行な短辺の長さが長くなるように、内側端子及び外側端子を形成してもよい。また、内側端子の端子面よりも外側端子の端子面の面積が大きければ、内側端子、外側端子の端子面の形状は矩形に限定されない。例えば、端子面の形状は角部が面取り又はＲ面取りされた矩形、楕円形、円形、多角形等であってもよい。   In the first and second embodiments, the inner terminal and the outer terminal are formed so that the outer terminal is longer than the inner terminal in the long side parallel to the short side of the driving IC. The present invention is not limited to this configuration. As long as the area of the terminal surface of the outer terminal is larger than the terminal surface of the inner terminal, for example, the length of the short side parallel to the long side of the driving IC is longer than that of the inner terminal. An inner terminal and an outer terminal may be formed. Moreover, if the area of the terminal surface of the outer terminal is larger than the terminal surface of the inner terminal, the shape of the terminal surface of the inner terminal and the outer terminal is not limited to a rectangle. For example, the shape of the terminal surface may be a rectangle with a chamfered or rounded chamfer, an ellipse, a circle, a polygon, or the like.

以上説明したように、本発明に係る駆動用ＩＣは、高い電気的信頼性で実装することができるため、液晶表示装置、有機エレクトロルミネッセンス表示装置、無機エレクトロルミネッセンス表示装置、プラズマ表示装置、フィールドエミッション表示装置等の表示装置等に有用である。   As described above, since the driving IC according to the present invention can be mounted with high electrical reliability, the liquid crystal display device, the organic electroluminescence display device, the inorganic electroluminescence display device, the plasma display device, the field emission, and the like. This is useful for a display device such as a display device.

実施形態１に係る液晶表示装置１の要部の構成を模式的に表す平面図である。3 is a plan view schematically showing the configuration of a main part of the liquid crystal display device 1 according to Embodiment 1. FIG. 駆動用ＩＣ４の背面図である。It is a rear view of driving IC4. 駆動用ＩＣ１００を異方性導電接着剤により液晶表示装置に実装した場合のトラップ数（Ａｖｅ．−３σ）と整合比との関係を表すグラフである。It is a graph showing the relationship between the number of traps (Ave.-3σ) and the matching ratio when the driving IC 100 is mounted on a liquid crystal display device with an anisotropic conductive adhesive. 実施形態２における駆動用ＩＣ２０の背面図である。6 is a rear view of a driving IC 20 in Embodiment 2. FIG. 従来の駆動用ＩＣ１００の底面図である。It is a bottom view of the conventional driving IC100.

符号の説明Explanation of symbols

１ 液晶表示装置
２ 表示領域
３ ＩＣ実装領域
４、２０ 駆動用ＩＣ
５ ＦＰＣ基板
６ａ、６ｂ 基板
１０ 入力用バンプ電極端子
１１ 出力用バンプ電極端子
１２ 内側端子
１３ 外側端子
1 Liquid crystal display device
2 display area
3 IC mounting area
4, 20 Driving IC
5 FPC board
6a, 6b substrate
10 Bump electrode terminal for input
11 Bump electrode terminal for output
12 Inner terminal
13 Outer terminal

Claims (6)

複数の入力端子及び複数の出力端子を有する矩形状の駆動用ＩＣであって、
上記複数の入力端子及び複数の出力端子のうち少なくとも一方の端子群は、上記駆動用ＩＣの一辺に対して各々平行に一直線状に配列され、各々第１端子面を有する複数の第１端子と、該第１端子の列よりも上記一辺寄りに、各々該第１端子の列に対して並行に一直線状に配列され、各々上記第１端子面よりも大きな面積の第２端子面を有する複数の第２端子とを有する駆動用ＩＣ。 A rectangular driving IC having a plurality of input terminals and a plurality of output terminals,
At least one terminal group of the plurality of input terminals and the plurality of output terminals is arranged in a straight line parallel to one side of the driving IC, and has a plurality of first terminals each having a first terminal surface; A plurality of second terminal surfaces which are arranged in a straight line parallel to the first terminal row and closer to the one side than the first terminal row, each having a larger area than the first terminal surface. A driving IC having a second terminal. 請求項１に記載された駆動用ＩＣにおいて、
上記複数の出力端子の端子群のみが上記第１端子の列と上記第２端子の列とを有し、
上記複数の入力端子の端子面の総面積の上記複数の出力端子の端子面の総面積に対する比である整合比が６０％より大きい場合には、上記第２端子面の面積が上記第１端子面の面積の７／５以上であり、
上記整合比が５０％以上６０％以下である場合には、上記第２端子面の面積が上記第１端子面の面積の７／３以上である駆動用ＩＣ。 The driving IC according to claim 1,
Only the terminal group of the plurality of output terminals has the first terminal row and the second terminal row,
When the matching ratio, which is the ratio of the total area of the terminal surfaces of the plurality of input terminals to the total area of the terminal surfaces of the plurality of output terminals, is greater than 60%, the area of the second terminal surface is the first terminal. 7/5 or more of the surface area,
When the matching ratio is 50% or more and 60% or less, the driving IC in which the area of the second terminal surface is 7/3 or more of the area of the first terminal surface. 請求項１に記載された駆動用ＩＣにおいて、
上記第１端子面と上記第２端子面とは、各々一辺が上記駆動用ＩＣの一辺に対して平行な矩形状であり、上記第２端子面の上記駆動用ＩＣの一辺に対して直交する方向に延びる他辺が上記第１端子面の同他辺よりも長い駆動用ＩＣ。 The driving IC according to claim 1,
Each of the first terminal surface and the second terminal surface has a rectangular shape in which one side is parallel to one side of the driving IC, and is orthogonal to one side of the driving IC on the second terminal surface. A driving IC in which the other side extending in the direction is longer than the other side of the first terminal surface. 請求項３に記載された駆動用ＩＣにおいて、
上記複数の出力端子の端子群のみが上記第１端子の列と上記第２端子の列とを有し、
上記複数の入力端子の端子面の総面積の上記複数の出力端子の端子面の総面積に対する比である整合比が６０％より大きい場合には、上記第２端子面の上記駆動用ＩＣの一辺に対して直交する方向に延びる他辺の長さが上記第１端子面の同他辺の長さの７／５以上であり、
上記整合比が５０％以上６０％以下である場合には、上記第２端子面の他辺の長さが上記第１端子面の他辺の長さの７／３以上である駆動用ＩＣ。 The driving IC according to claim 3,
Only the terminal group of the plurality of output terminals has the first terminal row and the second terminal row,
When the matching ratio, which is the ratio of the total area of the terminal surfaces of the plurality of input terminals to the total area of the terminal surfaces of the plurality of output terminals, is greater than 60%, one side of the driving IC on the second terminal surface The length of the other side extending in the direction orthogonal to the length of the other side of the first terminal surface is 7/5 or more,
When the matching ratio is 50% or more and 60% or less, the driving IC in which the length of the other side of the second terminal surface is 7/3 or more of the length of the other side of the first terminal surface. 請求項１に記載された駆動用ＩＣにおいて、
上記第１端子の各々と上記第２端子の各々とが上記駆動用ＩＣの一辺に沿って千鳥状に配置されている駆動用ＩＣ。 The driving IC according to claim 1,
A driving IC in which each of the first terminals and each of the second terminals are arranged in a staggered manner along one side of the driving IC. 請求項１に記載された駆動用ＩＣが実装された表示装置。   A display device on which the driving IC according to claim 1 is mounted.
JP2005164163A 2005-06-03 2005-06-03 Driving ic and display device having same mounted thereon Pending JP2006337829A (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101587874B (en) * 2008-05-22 2012-03-14 瀚宇彩晶股份有限公司 Chip with drive integrated circuit and corresponding liquid crystal display
CN103345882A (en) * 2013-06-24 2013-10-09 句容骏成电子有限公司 COB product twisting and detecting pneumatic integrated device
WO2020124820A1 (en) * 2018-12-18 2020-06-25 武汉华星光电半导体显示技术有限公司 Display panel

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JPH0653413A (en) * 1992-07-29 1994-02-25 Nec Corp Semiconductor integrated circuit
JPH1012620A (en) * 1996-06-26 1998-01-16 Denso Corp Bump electrode for flip chip
JPH11183922A (en) * 1997-12-25 1999-07-09 Citizen Watch Co Ltd Integrated circuit
JPH11340352A (en) * 1998-05-22 1999-12-10 Matsushita Electric Ind Co Ltd Mounting structure
JP2004252466A (en) * 2003-02-20 2004-09-09 Samsung Electronics Co Ltd Driving ic and display device equipped with same

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0653413A (en) * 1992-07-29 1994-02-25 Nec Corp Semiconductor integrated circuit
JPH1012620A (en) * 1996-06-26 1998-01-16 Denso Corp Bump electrode for flip chip
JPH11183922A (en) * 1997-12-25 1999-07-09 Citizen Watch Co Ltd Integrated circuit
JPH11340352A (en) * 1998-05-22 1999-12-10 Matsushita Electric Ind Co Ltd Mounting structure
JP2004252466A (en) * 2003-02-20 2004-09-09 Samsung Electronics Co Ltd Driving ic and display device equipped with same

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101587874B (en) * 2008-05-22 2012-03-14 瀚宇彩晶股份有限公司 Chip with drive integrated circuit and corresponding liquid crystal display
CN103345882A (en) * 2013-06-24 2013-10-09 句容骏成电子有限公司 COB product twisting and detecting pneumatic integrated device
WO2020124820A1 (en) * 2018-12-18 2020-06-25 武汉华星光电半导体显示技术有限公司 Display panel

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