JP2006331950A - Ceramic heater, heating apparatus, and image processing apparatus - Google Patents

Ceramic heater, heating apparatus, and image processing apparatus Download PDF

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JP2006331950A
JP2006331950A JP2005156252A JP2005156252A JP2006331950A JP 2006331950 A JP2006331950 A JP 2006331950A JP 2005156252 A JP2005156252 A JP 2005156252A JP 2005156252 A JP2005156252 A JP 2005156252A JP 2006331950 A JP2006331950 A JP 2006331950A
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insulating substrate
filler
heating
heater
resin film
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Takaaki Karibe
孝明 苅部
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Toshiba Lighting and Technology Corp
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Harison Toshiba Lighting Corp
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<P>PROBLEM TO BE SOLVED: To realize a ceramic heater wherein good fixing characteristic can be obtained without lowering the sliding characteristic and the durability of apparatus is improved. <P>SOLUTION: Heating resistors 121, 122, made of such as silver-palladium, which are heated by energization; and power supply electrodes 14, 15, made of such as silver, silver-platinum, which supplies power, wherein the resistance value per unit area is low and a large heat generation phenomenon by energization is hard to occur are formed on one side of a long flat plate-shaped insulating substrate 11 having a high thermal conductivity such as aluminum nitride. An overcoat layer 18 is formed on the heating resistors 121, 122 to protect electrically, mechanically, chemically with for example glass covering them. In the other side of the insulating substrate 11 where the heating resistors 121, 122 are formed, a filler is contained in imide resins such as polyimide, polyisoimide, polyamide-imide, and the content of this filler gradually decreases from the insulating substrate 11 to the surface, to form a resin coating layer 21 which surface is a sliding plane. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

この発明は、情報機器、家電製品や製造設備などの小型機器類に装着されて用いられる薄型の面状ヒータおよびこの面状ヒータを実装したプリンタ、複写機やファクシミリなどの加熱装置ならびにこの加熱装置を用いた画像処理装置に関する。   The present invention relates to a thin sheet heater that is used by being mounted on small equipment such as information equipment, home appliances, and manufacturing equipment, a heating device such as a printer, a copying machine, and a facsimile machine equipped with the sheet heater, and the heating device. The present invention relates to an image processing apparatus using the.

従来のセラミックヒータでは、窒化アルミニウム等の高熱伝導特性を有する長尺平板状の絶縁基板の発熱抵抗体が形成された面の反対面を摺動面とすることが知られている。(例えば、特許文献1)
特開2000−29334公報
In a conventional ceramic heater, it is known that a surface opposite to a surface on which a heating resistor of a long flat insulating substrate having high thermal conductivity such as aluminum nitride is formed is a sliding surface. (For example, Patent Document 1)
JP 2000-29334 A

上記した特許文献1の技術は、耐久性、摺動性の面から摺動面樹脂皮膜層には20μm以下のガラスかフッ素樹脂を用いるとしている。樹脂皮膜層が樹脂で薄い場合、摺動動作により樹脂皮膜層が磨耗劣化し、厚い場合、熱伝導が悪く良好なトナー定着性が得られない、という問題がある。また、熱伝導特性に効果が出る程度にフィラーを含有させた場合、樹脂皮膜層の表面が粗くなり摺動性が阻害される、という問題があった。   In the technique of Patent Document 1 described above, glass or fluorine resin of 20 μm or less is used for the sliding surface resin film layer in terms of durability and slidability. When the resin film layer is thin with resin, there is a problem that the resin film layer is worn and deteriorated by sliding operation, and when it is thick, heat conduction is poor and good toner fixing property cannot be obtained. In addition, when a filler is contained to such an extent that the heat conduction characteristics are effective, there is a problem that the surface of the resin film layer becomes rough and the slidability is hindered.

この発明の目的は、摺動性を阻害させずに良好な定着性を得られるとともに、装置の耐久性を向上させたセラミックヒータおよびこれを用いた加熱装置を提供することにある。   An object of the present invention is to provide a ceramic heater and a heating apparatus using the same, which can obtain good fixability without impeding slidability and improve the durability of the apparatus.

上記した課題を解決するために、この発明のセラミックヒータは、窒化アルミニウム等の高熱伝導特性を有する長尺平板状の絶縁基板と、前記絶縁基板の一面に形成された発熱抵抗体と、前記発熱抵抗体に電力を供給するために形成された給電用電極部と、前記発熱抵抗体を覆うように配置されたオーバーコート層と、前記発熱抵抗体が形成された前記絶縁基板の裏面に、フィラーを含有し、該フィラー密度を前記絶縁基板面の近傍に比べ離れるほど低くなるように異ならせて形成したイミド系の樹脂皮膜層とを具備したこと特徴とする。   In order to solve the above-described problems, a ceramic heater according to the present invention includes a long flat plate-like insulating substrate having high thermal conductivity such as aluminum nitride, a heating resistor formed on one surface of the insulating substrate, and the heat generation. A power supply electrode portion formed to supply power to the resistor, an overcoat layer disposed to cover the heating resistor, and a filler on the back surface of the insulating substrate on which the heating resistor is formed And an imide-based resin film layer formed so as to be different from the vicinity of the insulating substrate surface so that the filler density is lower.

この発明によれば、フィラーを含有させた場合でも、樹脂皮膜層の表面でのフィラーの含有量が少ないことから樹脂皮膜層の表面は滑らかな状態にあり摺動性の向上を図ることができ、フィラーが含有されていることから熱伝導性も図ることができる。   According to the present invention, even when a filler is contained, since the filler content on the surface of the resin film layer is small, the surface of the resin film layer is in a smooth state, and slidability can be improved. Since the filler is contained, thermal conductivity can also be achieved.

以下、この発明の実施形態について、図面を参照しながら詳細に説明する。
図1はこの発明のセラミックヒータに関する一実施形態について説明するための構成図、図2は図1の背面図、図3は図1のx−x’断面図である。
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
1 is a block diagram for explaining an embodiment of the ceramic heater of the present invention, FIG. 2 is a rear view of FIG. 1, and FIG. 3 is a sectional view taken along line xx ′ of FIG.

図1において、11は、耐熱、電気絶縁性材料例えば酸化アルミニウム、窒化アルミニウム、窒化珪素などの電気絶縁性を有する高剛性のセラミック等の基材で高い熱伝導性の短冊状絶縁基板である。121,122は、絶縁基板11の表面側の長手方向に沿って平行に形成された銀パラジウムをはじめとする銀系材料や、ルテニウム系、炭素系等などの抵抗体ペーストを高温で焼成し所定の抵抗値を有する厚膜からなる帯状の発熱抵抗体、13は発熱抵抗体121,122それぞれ一端の一部を重層した銀系の導体ペーストを焼成して形成した接続部である。14は発熱抵抗体121の他端を重層形成したAg/Pd合金などを主体とする良導電体膜からなる給電用の電極、15は発熱抵抗体122の他端を重層形成したAg/Pd合金などを主体とする良導電体膜からなる給電用の電極である。16,17は電極14,15と発熱抵抗体121,122はそれぞれ接続部13と同材料で同様に焼成して一体形成された接続部である。電極14,15を残した発熱抵抗体121,122および接続部13,16,17上には、されたガラス等、電気的、機械的、化学的な保護を行うオーバーコート層18が形成される。   In FIG. 1, reference numeral 11 denotes a highly heat conductive strip-shaped insulating substrate made of a heat-resistant, electrically insulating material such as a highly rigid ceramic having electrical insulating properties such as aluminum oxide, aluminum nitride, and silicon nitride. Reference numerals 121 and 122 denote silver-based materials such as silver-palladium formed in parallel along the longitudinal direction on the surface side of the insulating substrate 11, and resistor pastes such as ruthenium-based and carbon-based materials, which are baked at a high temperature. A heating element 13 in the form of a thick film having a resistance value of 13 is a connecting part formed by firing a silver-based conductor paste in which a part of one end of each of the heating resistors 121 and 122 is layered. Reference numeral 14 denotes a power feeding electrode made of a good conductor film mainly composed of an Ag / Pd alloy or the like in which the other end of the heating resistor 121 is formed as a multilayer. It is an electrode for electric power feeding which consists of a good conductor film | membrane which mainly has etc. Reference numerals 16 and 17 denote electrodes 14 and 15 and heating resistors 121 and 122, which are connection parts integrally formed by firing the same material as the connection part 13 in the same manner. On the heating resistors 121 and 122 and the connection portions 13, 16, and 17 that leave the electrodes 14 and 15, an overcoat layer 18 that is electrically, mechanically, and chemically protected is formed. .

図1の絶縁基板11の裏面状態を示す図2の21は、樹脂皮膜層である。この樹脂皮膜層21は、絶縁基板11のほぼ前面に、ポリイミド、ポリイソイミド、ポリアミドイミド等イミド系樹脂にフィラーを添加して形成されるものである。フィラー材としては珪素、アルミニウム、ホウ素何れかかもしくはこれらを混合した窒化物または酸化物が考えられる。   2 in FIG. 2 showing the back surface state of the insulating substrate 11 in FIG. 1 is a resin film layer. The resin film layer 21 is formed by adding a filler to an imide-based resin such as polyimide, polyisoimide, or polyamideimide, almost on the front surface of the insulating substrate 11. As the filler material, silicon, aluminum, boron, or a nitride or oxide obtained by mixing them can be considered.

図3に示すように、樹脂皮膜層21はフィラーを絶縁基板11面の近傍に比べて樹脂皮膜層21の表面側の方のフィラー密度が低くなるよう形成する。つまり、絶縁基板11側から表面側にかけて漸次フィラーの含有量を増やす、いわゆるグラデーションの状態にしている。   As shown in FIG. 3, the resin film layer 21 is formed so that the filler density on the surface side of the resin film layer 21 is lower than that in the vicinity of the surface of the insulating substrate 11. That is, it is in a so-called gradation state in which the filler content is gradually increased from the insulating substrate 11 side to the surface side.

このように構成することにより、フィラーを含有させた場合でも、樹脂皮膜層の表面でのフィラーの含有量が少ないことから樹脂皮膜層21の表面は滑らかな状態にあり摺動性の向上を図ることができ、フィラーが含有されていることから熱伝導性も図ることができる。   By comprising in this way, even when a filler is contained, since the content of the filler on the surface of the resin film layer is small, the surface of the resin film layer 21 is in a smooth state to improve the slidability. In addition, since the filler is contained, thermal conductivity can be achieved.

図4は、この発明のセラミックヒータの他の実施形態について説明するための、上記実施形態の図3に相当する断面図である。この実施形態は、樹脂皮膜層41のフィラーを絶縁基板11面側に比べて表面側にいくほどフィラー密度が段階的に低くなるように複数の樹脂被覆層41a〜41dを形成したものである。つまり、絶縁基板11側から表面側にかけての被覆層41a〜41dのフィラー含有量は、41a>41b>41c>41dの関係となっている。   FIG. 4 is a cross-sectional view corresponding to FIG. 3 of the above embodiment for explaining another embodiment of the ceramic heater of the present invention. In this embodiment, a plurality of resin coating layers 41a to 41d are formed so that the filler density gradually decreases as the filler of the resin film layer 41 is moved to the surface side as compared to the surface side of the insulating substrate 11. That is, the filler content of the coating layers 41a to 41d from the insulating substrate 11 side to the surface side has a relationship of 41a> 41b> 41c> 41d.

このように、この実施形態でも、フィラーの含有量を樹脂皮膜層21の表面に行くほど段階的に少なくしたことから、樹脂皮膜層21の表面は滑らかな状態にあり摺動性の向上を図るとともに、熱伝導性も図ることができる。   As described above, also in this embodiment, since the filler content is gradually reduced toward the surface of the resin film layer 21, the surface of the resin film layer 21 is in a smooth state, and the slidability is improved. In addition, thermal conductivity can be achieved.

次に、この発明のセラミックヒータのもう一つの他の実施形態について説明する。この実施形態は、樹脂皮膜層のフィラー材質とフィラー粒径を限定するものである。なすわち、フィラー材質は珪素、アルミニウム、ホウ素何れかもしくはそれら混合の窒化物または酸化物で、フィラー粒径は樹脂皮膜層の1/3以下とした。   Next, another embodiment of the ceramic heater according to the present invention will be described. In this embodiment, the filler material and filler particle size of the resin film layer are limited. That is, the filler material was a nitride or oxide of silicon, aluminum, boron, or a mixture thereof, and the filler particle size was 1/3 or less of the resin film layer.

例えば、樹脂皮膜層厚は5〜15μmとすると、フィラー粒径はその1/3以下である。樹脂皮膜層が薄すぎると厚み方向の密度分布が得られず、厚すぎると形成された樹脂皮膜層の特定箇所に膨らみなど欠陥が発生しやすくなりなる。しかしながら、フィラー粒径を樹脂皮膜層の1/3以下とすることでより均一な成膜を実現でき、樹脂皮膜層表面の摺動性の向上を図ることができる。   For example, if the resin film layer thickness is 5 to 15 μm, the filler particle size is 1/3 or less. If the resin film layer is too thin, a density distribution in the thickness direction cannot be obtained. If the resin film layer is too thick, defects such as bulges are likely to occur in specific portions of the formed resin film layer. However, when the filler particle size is 1/3 or less of the resin film layer, more uniform film formation can be realized, and the slidability of the resin film layer surface can be improved.

次に、図5を参照し、上記したセラミックヒータを加熱装置200に実装した場合の、この発明の加熱装置の一実施形態について説明する。図中ヒータ100については、図1〜図3で説明したセラミックヒータであり、同一部分には同一の符号を付してその説明は省略する。   Next, an embodiment of the heating device of the present invention when the ceramic heater described above is mounted on the heating device 200 will be described with reference to FIG. The heater 100 in the figure is the ceramic heater described with reference to FIGS. 1 to 3, and the same portions are denoted by the same reference numerals and description thereof is omitted.

図5において、201は回転軸202で回転自在に回転される加圧ローラで、その表面に耐熱性弾性材料たとえばシリコーンゴム層203が嵌合してある。加圧ローラ201の回転軸202と対向してヒータ100が、並置して図示しない基台内に取り付けられている。   In FIG. 5, reference numeral 201 denotes a pressure roller which is rotated by a rotating shaft 202, and a heat resistant elastic material such as a silicone rubber layer 203 is fitted on the surface of the pressure roller. The heater 100 is mounted in parallel in a base (not shown) so as to face the rotating shaft 202 of the pressure roller 201.

ヒータ100の周囲にはポリイミド樹脂等の耐熱性のシートからなるエンドレスのロール状の定着フィルム204が循環自在に巻装されており、発熱抵抗体121,122が形成された絶縁基板11の反対面の樹脂皮膜層21の表面は、この定着フィルム204を介して加圧ローラ201のシリコーンゴム層203と弾接している。   Around the heater 100, an endless roll-shaped fixing film 204 made of a heat-resistant sheet such as polyimide resin is circulated, and is opposite to the insulating substrate 11 on which the heating resistors 121 and 122 are formed. The surface of the resin film layer 21 is in elastic contact with the silicone rubber layer 203 of the pressure roller 201 through the fixing film 204.

また、シリコーンゴム層203には、サーミスタ205が摺動可能に当接された状態で配置される。サーミスタ205は、例えば図6に示す回路構成により通電され発熱温度が調整される。すなわち、商用電源61を温度制御回路62の制御端子に接続されたソリッドステートリレー63を介してセラミックヒータ100の電極14,15に通電されると、直列接続された発熱抵抗体121,122に電流が流れて発熱する。発熱抵抗体121,122の発熱により絶縁基板11も温度上昇する。この熱は、定着フィルム204を介してシリコーンゴム層203、サーミスタ205の感温部に伝わり、感温部の抵抗値を変化させる。サーミスタ205の抵抗値の変化を、絶縁基板11の裏面側に形成された配線導体を介して出力させ、これを温度制御回路62に入力して設定温度にあるか否かを判定する。温度が設定温度より低い場合はソリッドステートリレー63にオン信号を出力し、設定温度より高い場合はソリッドステートリレー63にオフ信号を出力する。   Further, the thermistor 205 is slidably disposed on the silicone rubber layer 203. The thermistor 205 is energized by, for example, the circuit configuration shown in FIG. That is, when the commercial power supply 61 is energized to the electrodes 14 and 15 of the ceramic heater 100 via the solid state relay 63 connected to the control terminal of the temperature control circuit 62, the current is supplied to the heating resistors 121 and 122 connected in series. Flows and generates heat. Due to the heat generated by the heating resistors 121 and 122, the temperature of the insulating substrate 11 also rises. This heat is transmitted to the temperature sensitive parts of the silicone rubber layer 203 and the thermistor 205 via the fixing film 204, and changes the resistance value of the temperature sensitive part. A change in the resistance value of the thermistor 205 is output via a wiring conductor formed on the back side of the insulating substrate 11, and this is input to the temperature control circuit 62 to determine whether the temperature is at the set temperature. When the temperature is lower than the set temperature, an ON signal is output to the solid state relay 63, and when the temperature is higher than the set temperature, an OFF signal is output to the solid state relay 63.

このように、発熱抵抗体121,122に加える電力を制御することによって、発熱抵抗体121,122の温度調整が可能となる。なお、温度制御回路62はソリッドステートリレー63のオン・オフ制御について述べたが、他にパルス幅変調制御方式等による温度調整でも構わない。   In this way, by controlling the power applied to the heating resistors 121 and 122, the temperature of the heating resistors 121 and 122 can be adjusted. Although the temperature control circuit 62 has been described with respect to the on / off control of the solid state relay 63, temperature control by a pulse width modulation control method or the like may be used.

そして、セラミックヒータ100は電極13,14に電力が供給されると、発熱抵抗体121,122にそれぞれ電流が流れ、発熱抵抗体121,122は長手方向にほぼ均一の発熱温度分布を呈することになる。この実施形態では、例えば発熱抵抗体121,122抵抗値を25Ωとし、100Vの電圧を印加することにより4Aの電流が流れ、400Wの発熱量を得ることが可能となる。   In the ceramic heater 100, when power is supplied to the electrodes 13 and 14, current flows through the heating resistors 121 and 122, respectively, and the heating resistors 121 and 122 exhibit a substantially uniform heating temperature distribution in the longitudinal direction. Become. In this embodiment, for example, when the resistance values of the heating resistors 121 and 122 are set to 25Ω and a voltage of 100 V is applied, a current of 4 A flows and a heating value of 400 W can be obtained.

通常は、上述したように基板11の裏面側に設けたサーミスタ205がセラミックヒータ100の温度を検出して温度制御回路62を通じてソリッドステートリレー63をオン・オフ制御し所定の温度に制御している。   Normally, as described above, the thermistor 205 provided on the back side of the substrate 11 detects the temperature of the ceramic heater 100 and controls the solid state relay 63 on / off through the temperature control circuit 62 to control it to a predetermined temperature. .

再び図5の加熱装置200において、ヒータ100は電極14,15に接触したりん青銅板等に銀メッキを施した弾性が付与された図示しないコネクタを通じて通電され、発熱抵抗体121,122で発生させた熱が絶縁基板11、樹脂皮膜層21と伝わり、樹脂皮膜層21上に設けられた定着フィルム204面とシリコーンゴム層203との間で、トナー像T1がまず定着フィルム204を介してヒータ100により加熱溶融され、少なくともその表面部は融点を大きく上回り完全に軟化溶融する。この後、加圧ローラ201の用紙排出側では複写用紙Pがヒータ100から離れ、トナー像T2は自然放熱して再び冷却固化し、定着フィルム204も複写用紙Pから離反される。   In the heating apparatus 200 shown in FIG. 5 again, the heater 100 is energized through a connector (not shown) in which the phosphor bronze plate or the like in contact with the electrodes 14 and 15 is subjected to silver plating and is given elasticity, and is generated by the heating resistors 121 and 122. Heat is transferred to the insulating substrate 11 and the resin film layer 21, and the toner image T 1 is first transferred between the surface of the fixing film 204 provided on the resin film layer 21 and the silicone rubber layer 203 via the fixing film 204. And at least its surface part greatly exceeds the melting point and is completely softened and melted. Thereafter, on the paper discharge side of the pressure roller 201, the copy paper P is separated from the heater 100, the toner image T2 is naturally radiated and cooled and solidified again, and the fixing film 204 is also separated from the copy paper P.

このように、トナー像T1は一旦完全に軟化溶融された後、加圧ローラ201の用紙排出側で再び冷却されることから、トナー像T2の凝縮力は非常に大きくなものとなっている。   As described above, the toner image T1 is once completely softened and melted and then cooled again on the paper discharge side of the pressure roller 201, so that the condensing force of the toner image T2 is very large.

この加熱装置200では、ヒータ100の絶縁基板11から離れるほどにフィラーの含有量が低い樹脂皮膜層21を用いたことにより、定着フィルムとの摺動性の阻害の防止や良好な定着性が得られるとともに、耐久性を向上させることができる。   In the heating device 200, the use of the resin film layer 21 having a filler content that decreases with distance from the insulating substrate 11 of the heater 100 prevents the slidability with the fixing film from being hindered and provides good fixing properties. In addition, the durability can be improved.

次に、図7を参照して、この発明に係る定着ヒータ、この定着ヒータを用いた定着装置を搭載した複写機を例とした、この発明の画像形成装置について説明する。図中、定着装置200の部分は、上記した説明と同じであり、同一部分には同一の符号を付し、その説明は省略する。   Next, with reference to FIG. 7, an image forming apparatus according to the present invention will be described, taking as an example a copier equipped with a fixing heater according to the present invention and a fixing device using the fixing heater. In the figure, the part of the fixing device 200 is the same as described above, and the same reference numerals are given to the same parts, and the description thereof is omitted.

図7において、301は複写機300の筐体、302は筐体301の上面に設けられたガラス等の透明部材からなる原稿載置台で、矢印Y方向に往復動作させて原稿P1を走査する。   In FIG. 7, reference numeral 301 denotes a casing of the copying machine 300, and 302 an original placing table made of a transparent member such as glass provided on the upper surface of the casing 301, which scans the original P <b> 1 by reciprocating in the arrow Y direction.

筐体301内の上方向には光照射用のランプと反射鏡とからなる照明装置302が設けられており、この照明装置302により照射された原稿P1からの反射光源が短焦点小径結像素子アレイ303によって感光ドラム304上スリット露光される。なお、この感光ドラム304は矢印方向に回転する。   An illuminating device 302 including a light irradiation lamp and a reflecting mirror is provided in the upper direction in the housing 301, and a reflected light source from the document P1 irradiated by the illuminating device 302 is a short focus small diameter imaging element. A slit exposure is performed on the photosensitive drum 304 by the array 303. The photosensitive drum 304 rotates in the direction of the arrow.

また、305は帯電器で、例えば酸化亜鉛感光層あるいは有機半導体感光層が被覆された感光ドラム304上に一様に帯電を行う。この帯電器305により帯電された感光ドラム304には、結像素子アレイ303によって画像露光が行われた静電画像が形成される。この静電画像は、現像器306による加熱で軟化溶融する樹脂等からなるトナーを用いて顕像化される。   Reference numeral 305 denotes a charger that uniformly charges, for example, a photosensitive drum 304 coated with a zinc oxide photosensitive layer or an organic semiconductor photosensitive layer. An electrostatic image subjected to image exposure by the imaging element array 303 is formed on the photosensitive drum 304 charged by the charger 305. This electrostatic image is visualized using toner made of a resin that softens and melts when heated by the developing device 306.

カセット307内に収納されている複写用紙Pは、給送ローラ308と感光ドラム304上の画像と同期するタイミングをとって上下方向で圧接して回転される対の搬送ローラ309によって、感光ドラム304上に送り込まれる。そして、転写放電器310によって感光ドラム304上に形成されているトナー像は複写用紙P上に転写される。   The copy paper P stored in the cassette 307 is rotated by a pair of conveying rollers 309 that are rotated in pressure contact with each other in synchronization with the feeding roller 308 and the image on the photosensitive drum 304. Sent to the top. The toner image formed on the photosensitive drum 304 is transferred onto the copy paper P by the transfer discharger 310.

その後、感光ドラム304上から離れた用紙Pは、搬送ガイド311によって定着装置200に導かれて加熱定着処理された後に、トレイ312内に排出される。なお、トナー像が転写された後、感光ドラム304上の残留トナーはクリーナ313を用いて除去される。   Thereafter, the paper P that is separated from the photosensitive drum 304 is guided to the fixing device 200 by the conveyance guide 311 and subjected to a heat fixing process, and then is discharged into the tray 312. After the toner image is transferred, residual toner on the photosensitive drum 304 is removed using a cleaner 313.

定着装置200は複写用紙Pの移動方向と直交する方向に、この複写機300が複写できる最大判用紙の幅(長さ)に合わせた有効長、すなわち最大判用紙の幅(長さ)より長い発熱抵抗体121,122を延在させて定着ヒータ100の加圧ローラ201が設けられている。   The fixing device 200 is longer in the direction orthogonal to the moving direction of the copy paper P than the effective length corresponding to the width (length) of the maximum size paper that can be copied by the copier 300, that is, longer than the width (length) of the maximum size paper. A pressure roller 201 of the fixing heater 100 is provided by extending the heating resistors 121 and 122.

そして、定着ヒータ100と加圧ローラ201との間を送られる用紙P上の未定着トナー像T1は、発熱抵抗体121,122の熱を受け溶融して複写用紙P面上に文字、英数字、記号、図面等の複写像を現出させる。   Then, the unfixed toner image T1 on the paper P sent between the fixing heater 100 and the pressure roller 201 is melted by receiving heat from the heating resistors 121 and 122, and characters and alphanumeric characters on the copy paper P surface. A copy image such as a symbol or a drawing is displayed.

この実施形態では、定着フィルムとの摺動性の阻害の防止や良好な定着性が得られるとともに、耐久性を向上させるセラミックヒータよる定着装置200を用いた複写機300を実現できる。   In this embodiment, it is possible to realize a copying machine 300 using a fixing device 200 using a ceramic heater that can prevent the hindrance to sliding with the fixing film and obtain good fixing properties and improve durability.

なお、この発明は上記した実施形態に限定されるものではない。例えば、オーバーコート材は相対する定着フィルムの材質やその他条件によって変える必要があるため特定はできないが、定着フィルムが樹脂の場合、オーバーコート層はガラス、定着フィルムが金属の場合オーバーコート層は樹脂を組み合わせるのが望ましい。この樹脂は一般的に摺動性に優れるとされる材料、ポリアミド(PA)、ポリアセタール(POM)、ポリテトラフルオロエチレン(PTFE)、およびポリフェニレンサルファイド、エラストマー系、ポリオレフィン系、フッ素等があり、基本的にはどれを使用しても良いが耐熱性から弾性に富むPI(ポリイミド)、PAI(ポリアミドイミド)等のイミド系が好ましいが、硬度が低すぎると樹脂被膜の方が削れてしまうため、3H以上の硬度は必要である。   The present invention is not limited to the embodiment described above. For example, the overcoat material needs to be changed depending on the material of the fixing film and other conditions, but it cannot be specified. If the fixing film is a resin, the overcoat layer is glass, and if the fixing film is a metal, the overcoat layer is It is desirable to combine. This resin includes materials that are generally excellent in slidability, such as polyamide (PA), polyacetal (POM), polytetrafluoroethylene (PTFE), polyphenylene sulfide, elastomer, polyolefin, fluorine, etc. Any of these may be used, but PI (polyimide) and PAI (polyamideimide), which are rich in elasticity from heat resistance, are preferred, but if the hardness is too low, the resin film will be scraped off, A hardness of 3H or higher is necessary.

また、発熱抵抗体は便宜的に2本折り返す構成としているが、発熱抵抗体構成は特に限定するものではない。   Moreover, although the heating resistor is configured to be folded back twice for convenience, the heating resistor configuration is not particularly limited.

セラミックヒータの用途としては、複写機等の画像形成装置の定着用に用いたが、これに限らず、家庭用の電気製品、業務用や実験用の精密機器や化学反応用の機器等に装着して加熱や保温の熱源としても使用できる。   Ceramic heaters are used for fixing image forming devices such as copiers, but are not limited to this, and are installed in household electrical products, precision instruments for business use and experiments, and chemical reaction equipment. It can also be used as a heat source for heating and heat insulation.

次に、特許請求の範囲に記載された技術的思想のほかに、上記した実施形態によって把握される技術思想をその効果とともに以下に説明する。   Next, in addition to the technical idea described in the claims, the technical idea grasped by the above-described embodiment will be described below together with the effects thereof.

(1) 窒化アルミニウム等の高熱伝導特性を有する長尺平板状の絶縁基板と、前記絶縁基板の一面に形成された発熱抵抗体と、前記発熱抵抗体の両端部に形成された給電用電極部と、前記発熱抵抗体を覆うように配置された保護層と、前記発熱抵抗体と前記絶縁基板面で相対する面に形成されたフィラーと、前記フィラー密度が前記絶縁基板面の近傍に比べて膜表面部の方が低くなるように厚み方向に前記フィラーの密度が異なるイミド系の樹脂皮膜層とを具備し、前記フィラー材質は、珪素、アルミニウム、ホウ素のいずれか1つかもしくは混合された窒化物もしくは酸化物であり、最大粒径が樹脂皮膜層厚の1/3以下であることを特徴とするセラミックヒータ。   (1) A long flat plate-like insulating substrate having high thermal conductivity such as aluminum nitride, a heating resistor formed on one surface of the insulating substrate, and a feeding electrode unit formed at both ends of the heating resistor A protective layer disposed to cover the heating resistor, a filler formed on a surface facing the heating resistor and the insulating substrate surface, and the filler density compared to the vicinity of the insulating substrate surface An imide-based resin film layer having a different filler density in the thickness direction so that the surface portion of the film is lower, and the filler material is one of silicon, aluminum, boron, or a mixed nitride A ceramic heater, wherein the maximum particle size is 1/3 or less of the resin film layer thickness.

このように、フィラーを最大粒径が樹脂皮膜層厚の1/3以下としたことで、隣り合うフィラー間隔が適当となり良好な熱伝導効果を得ることができる。また、樹脂皮膜層表面に凹凸の影響が抑えられ摺動性の高いヒータを実現することができる。   Thus, when the maximum particle size of the filler is 1/3 or less of the resin film layer thickness, the interval between adjacent fillers becomes appropriate, and a good heat conduction effect can be obtained. Moreover, the influence of unevenness on the surface of the resin film layer is suppressed, and a heater having high slidability can be realized.

(2) 窒化アルミニウム等の高熱伝導特性を有する長尺平板状の絶縁基板と、前記絶縁基板の一面に形成された発熱抵抗体と、前記発熱抵抗体の両端部に形成された給電用電極部と、前記発熱抵抗体を覆うように配置された保護層と、前記発熱抵抗体と前記絶縁基板面で相対する面に形成されたフィラーと、前記フィラー密度が前記絶縁基板面の近傍に比べて膜表面部の方が低くなるように厚み方向に前記フィラーの密度が異なるイミド系の樹脂皮膜層とを具備し、前記イミド系樹脂皮膜層の膜厚は、5〜15μmであることを特徴とするセラミックヒータ。   (2) A long flat plate-like insulating substrate having high thermal conductivity such as aluminum nitride, a heating resistor formed on one surface of the insulating substrate, and a feeding electrode portion formed at both ends of the heating resistor A protective layer disposed to cover the heating resistor, a filler formed on a surface facing the heating resistor and the insulating substrate surface, and the filler density compared to the vicinity of the insulating substrate surface An imide-based resin film layer having a different density of the filler in the thickness direction so that the film surface portion is lower, and the film thickness of the imide-based resin film layer is 5 to 15 μm. Ceramic heater.

このように、イミド系樹脂の樹脂皮膜層厚を5〜15μmとすることで、所望の厚み方向の密度分布が得られるとともに、厚すぎによる特定箇所の膨れなど欠陥の発生を防止することが可能となる。   Thus, by setting the resin film layer thickness of the imide-based resin to 5 to 15 μm, it is possible to obtain a desired density distribution in the thickness direction, and it is possible to prevent the occurrence of defects such as swelling of specific portions due to being too thick. It becomes.

この発明のセラミックヒータに関する一実施形態について説明するための構成図。The block diagram for demonstrating one Embodiment regarding the ceramic heater of this invention. 図1の裏面の構成図。The block diagram of the back surface of FIG. 図1のx−x’断面図。X-x 'sectional drawing of FIG. この発明のセラミックヒータに関する他の実施形態について説明するための構成図。The block diagram for demonstrating other embodiment regarding the ceramic heater of this invention. この発明の加熱装置に関する一実施形態について説明するための説明図。Explanatory drawing for demonstrating one Embodiment regarding the heating apparatus of this invention. 図1に用いる温度調整について説明するための回路構成図。The circuit block diagram for demonstrating the temperature adjustment used for FIG. この発明の画像形成装置に関する一実施形態について説明するための説明図。BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an explanatory diagram for explaining an embodiment of an image forming apparatus according to the present invention;

符号の説明Explanation of symbols

11 絶縁基板
121,122 発熱抵抗体
13 接続部
14,15 電極
16,17 接続部
18 オーバーコート層
21,41,41a〜41d 樹脂皮膜層
100 セラミックヒータ
200 加熱装置
300 画像形成装置
DESCRIPTION OF SYMBOLS 11 Insulation board | substrate 121,122 Heat generating resistor 13 Connection part 14,15 Electrode 16,17 Connection part 18 Overcoat layer 21,41,41a-41d Resin film layer 100 Ceramic heater 200 Heating apparatus 300 Image forming apparatus

Claims (3)

窒化アルミニウム等の高熱伝導特性を有する長尺平板状の絶縁基板と、
前記絶縁基板の一面に形成された発熱抵抗体と、
前記発熱抵抗体に電力を供給するために形成された給電用電極部と、
前記発熱抵抗体を覆うように配置されたオーバーコート層と、
前記発熱抵抗体が形成された前記絶縁基板の裏面に、フィラーを含有し、該フィラー密度を前記絶縁基板面の近傍に比べ離れるほど低くなるように異ならせて形成したイミド系の樹脂皮膜層とを具備したこと特徴とするセラミックヒータ。
A long plate-like insulating substrate having high thermal conductivity such as aluminum nitride;
A heating resistor formed on one surface of the insulating substrate;
A feeding electrode portion formed to supply power to the heating resistor;
An overcoat layer disposed so as to cover the heating resistor;
An imide-based resin film layer formed on the back surface of the insulating substrate on which the heat generating resistor is formed, containing a filler, and the filler density is changed so as to become lower as it is farther from the vicinity of the insulating substrate surface; A ceramic heater comprising:
加熱ローラと、
前記加熱ローラに対向配置された発熱抵抗体が圧接された請求項1記載のヒータと、
前記ヒータと前記加圧ローラとの間を移動可能に設けられた定着フィルムとを具備したことを特徴とする加熱装置。
A heating roller;
The heater according to claim 1, wherein a heating resistor disposed to face the heating roller is pressed.
A heating device comprising a fixing film movably provided between the heater and the pressure roller.
媒体に形成された静電潜像にトナーを付着させてこのトナーを用紙に転写して所定の画像を形成する形成手段と、
画像が形成された用紙を加圧ローラにより定着フィルムを介して前記定着ヒータに圧接しながら通過させることによって、トナーを定着するようにした請求項2記載の定着装置とを具備したことを特徴とする画像形成装置。

Forming means for attaching a toner to an electrostatic latent image formed on a medium and transferring the toner to a sheet to form a predetermined image;
3. A fixing device according to claim 2, wherein the toner is fixed by passing a sheet on which an image is formed through a fixing film through a fixing film while being pressed against the fixing heater. Image forming apparatus.

JP2005156252A 2005-05-27 2005-05-27 Ceramic heater, heating apparatus, and image processing apparatus Withdrawn JP2006331950A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110238951A (en) * 2019-07-11 2019-09-17 安徽苏立电气科技有限公司 A kind of semi-automatic provisions for grouting and its application method of ceramic heater
WO2023032008A1 (en) 2021-08-30 2023-03-09 日環科学株式会社 Immunostimulatory formulation, and cosmetic, food, feed additive, and quasi-drug containing said immunostimulatory formulation

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110238951A (en) * 2019-07-11 2019-09-17 安徽苏立电气科技有限公司 A kind of semi-automatic provisions for grouting and its application method of ceramic heater
WO2023032008A1 (en) 2021-08-30 2023-03-09 日環科学株式会社 Immunostimulatory formulation, and cosmetic, food, feed additive, and quasi-drug containing said immunostimulatory formulation

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