JP2006328411A - Method for producing polyimide film - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for producing an oriented high strength polyimide film in which mechanical properties, particularly Young modulus, are improved by high orientation. <P>SOLUTION: A method for producing the polyimide film comprises the following steps; a solution (1) of a polyamic acid is prepared, the solution (1) is allowed to flow on a supporting article to give a film, the film together with the supporting article is immersed in a solution obtained by dissolving dicyclohexylcarbodiimide into at least one solvent selected from the solvent used in the solution (1), whereby there is formed a gel like film wherein at least a part of the polyamic acid is converted into polyisoimide, the produced film is separated from the supporting article, and biaxially stretched and subjected to heat treatment. The fundamental approach of the method is to conduct imidization after stretching the gel like film. The gel like film is formed by introducing the polyamic acid solution into a solution of a condensation agent, and swelled by a solvent upon stretching. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a method for producing a polyimide film having highly improved mechanical properties.

  Fully aromatic polyimide is widely used industrially because of its excellent heat resistance and mechanical properties, and in particular, its film occupies an important position as a base material for thin-layer electronic components including electronic packaging applications. In recent years, a polyimide film having a smaller thickness has been demanded due to a strong demand for downsizing of electronic components. However, having a high rigidity as the thickness decreases is an indispensable condition for practical use or handling of the film. Although a wholly aromatic polyimide film has a rigid structure, for example, it cannot always be said that a high Young's modulus is realized compared to a wholly aromatic polyamide film, even a polyimide film with the highest Young's modulus on the market At present, it remains at the level of 9 GPa.

  As a method of realizing a high Young's modulus with a wholly aromatic polyimide film, (1) the molecular skeleton constituting the polyimide has a rigid and highly linear chemical structure, and (2) the polyimide is molecularly oriented by a physical method. That is possible. The chemical structure of (1) is made from various combinations of pyromellitic acid or 3,3 ′, 4,4′-biphenyltetracarboxylic acid as the acid component, paraphenylenediamine, benzidine or their nuclear substitutes as the amine component. Consideration has been made. Among these, polyparaphenylenepyromellitimide has the highest theoretical elastic modulus (see Non-Patent Document 1) and is the most promising material as a high Young's modulus film material because it is inexpensive. However, despite the potential, so far, only extremely brittle polyparaphenylene pyromellitic imide films have been obtained, and it has not been realized as a balanced high Young's modulus film. .

As a method for overcoming this, Patent Document 1 proposes a method by chemically cyclizing a polyamic acid solution obtained by the reaction of paraphenylenediamine and pyromellitic anhydride. The Young's modulus of the phenylenepyromellitimide film is at most 8.5 GPa.
In Patent Document 2, a dope obtained by adding a large amount of acetic anhydride to a polyamic acid solution obtained by the reaction between a nucleus-substituted paraphenylenediamine and pyromellitic anhydride is cast, dried at low temperature under reduced pressure, and then heat-treated. It is described that a film having a Young's modulus of 20.1 GPa can be obtained. However, since this method requires a drying process for several hours at a low temperature, it is an industrially unrealistic technique, and even when this technique is applied to polyparaphenylenepyromellitimide, mechanical measurement is impossible. Since it is described that only a weak film can be obtained, the effect is limited. Therefore, a technology for realizing a high Young's modulus film that can be widely applied to rigid aromatic polyimides is incomplete, and a polyparaphenylene pyromellitic imide film having a particularly high Young's modulus and practical toughness is not known.

On the other hand, as a method for stretching and orienting polyimide, Non-Patent Document 2 discloses a polyamic acid solution, which is a precursor of polyparaphenylene pyromellitic imide, and then dried, and the resulting polyamic acid film was uniaxially stretched in a solvent. Later, a method of imidization was proposed, and Polymer Preprint Japan, Vol. 9 (1992) 3752 proposes a method in which a precursor polyamide ester having a long chain (10 to 18 carbon atoms) ester group introduced into a polymer chain is subjected to wet orientation and then imidized by heating. . Neither of them describes biaxial stretching balanced in the plane.
Therefore, an in-plane balanced high Young's modulus polyparaphenylene pyromellitic imide film is not yet known.
JP-A-1-282219 JP-A-6-172529 Tashiro et al., Textile Society Journal, Volume 43, Item 78 (1987) Polymer Papers Vol. 65, no. 5, PP282-290

  An object of the present invention is to provide a polyimide film having improved mechanical properties, in particular, Young's modulus, due to high orientation, which could not be realized by conventional techniques.

  Another object of the present invention is to provide a high Young's modulus polyparaphenylenepyromellitimide film.

  Still another object of the present invention is to provide a method for producing the above film of the present invention.

  Still other objects and advantages of the present invention will become apparent from the following description.

According to the present invention, the above objects and advantages of the present invention are as follows.
(1) A solution of polyamic acid in a solvent is prepared, wherein the polyamic acid has a p-phenylenediamine component of more than 80 mol% and not more than 100 mol% and an aromatic diamine component different from p-phenylenediamine of 0 mol% or more. It is substantially composed of a diamine component composed of less than 20 mol% and a tetracarboxylic acid component composed of more than 0 mol% and less than 20 mol% of an aromatic tetracarboxylic acid component having a pyromellitic acid content exceeding 80 mol% and different from pyromellitic acid And the solvent comprises at least one selected from the group consisting of N, N-dimethylformamide, N, N-dimethylacetamide, N-methylpyrrolidone and 1,3-dimethylimidazolidinone;
(2) A film obtained by casting the solution prepared in the step (1) on a support in an isoimidated solution obtained by dissolving dicyclohexylcarbodiimide in at least one selected from the above solvents. To form a gel film in which at least part of the polyamic acid is converted to polyisoimide;
(3) The obtained gel-like film is separated from the support, washed as necessary, then biaxially stretched, and then (4) the obtained biaxially stretched film is washed as necessary to remove the solvent. After that, it is subjected to heat treatment to form a biaxially oriented polyimide film.
This is achieved by a method for producing a polyimide film (hereinafter sometimes referred to as a first production method).

In addition, according to the present invention, the above object and advantage of the present invention are secondly,
(1) A solution of polyamic acid in a solvent is prepared, wherein the polyamic acid has a p-phenylenediamine component of more than 80 mol% and not more than 100 mol% and an aromatic diamine component different from p-phenylenediamine of 0 mol% or more. A diamine component consisting of less than 20 mol%, an aromatic tetracarboxylic acid component of which pyromellitic acid exceeds 80 mol% and different from pyromellitic acid consists of a tetracarboxylic acid component consisting of 0 mol% or more and less than 20 mol%, and The solvent comprises at least one selected from the group consisting of N, N-dimethylformamide, N, N-dimethylacetamide, N-methylpyrrolidone and 1,3-dimethylimidazolidinone;
(2) A film obtained by casting the solution prepared in the above step (1) on a support in a mixed solvent of at least one selected from the above solvents, acetic anhydride and an organic amine compound, and the support Soaking together to form a gel film in which at least a portion of the polyamic acid is converted to polyimide or polyisoimide;
(3) The obtained gel-like film is separated from the support, washed as necessary, then biaxially stretched, and then (4) the obtained biaxially stretched film is washed as necessary to remove the solvent. After that, it is subjected to heat treatment to form a biaxially oriented polyimide film.
This is achieved by a method for producing a polyimide film (hereinafter sometimes referred to as a second production method).

  First, the polyimide film of the present invention will be described.

The diamine component which comprises a polyimide is p-phenylenediamine and an aromatic diamine different from it.
As aromatic diamine components different from p-phenylenediamine, for example, m-phenylenediamine, 1,4-diaminonaphthalene, 1,5-diaminonaphthalene, 1,8-diaminonaphthalene, 2,6-diaminonaphthalene, 2,7 -Diaminonaphthalene, 2,6-diaminoanthracene, 2,7-diaminoanthracene, 1,8-diaminoanthracene, 2,4-diaminotoluene, 2,5-diamino (m-xylene), 2,5-diaminopyridine, 2,6-diaminopyridine, 3,5-diaminopyridine, 2,4-diaminotoluenebenzidine, 3,3′-diaminobiphenyl, 3,3′-dichlorobenzidine, 3,3′-dimethylbenzidine, 3,3 ′ -Dimethoxybenzidine, 2,2'-diaminobenzophenone, 4,4'-diaminobenzof Non, 3,3′-diaminodiphenyl ether, 4,4′-diaminodiphenyl ether, 3,4′-diaminodiphenyl ether, 3,3′-diaminodiphenylmethane, 4,4′-diaminodiphenylmethane, 4,4′-diaminodiphenylmethane, 3,4'-diaminodiphenylsulfone, 4,4'-diaminodiphenylsulfone, 3,3'-diaminodiphenylsulfide, 3,4'-diaminodiphenylsulfide, 4,4'-diaminodiphenylsulfide, 4,4'- Diaminodiphenyl thioether, 4,4′-diamino-3,3 ′, 5,5′-tetramethyldiphenyl ether, 4,4′-diamino-3,3 ′, 5,5′-tetraethyldiphenyl ether, 4,4′- Diamino-3,3 ′, 5,5′-tetramethyldiphenylmethane, 1,3-bis 3-aminophenoxy) benzene, 1,3-bis (4-aminophenoxy) benzene, 1,4-bis (3-aminophenoxy) benzene, 1,4-bis (4-aminophenoxy) benzene, 2,6- Bis (3-aminophenoxy) pyridine, 1,4-bis (3-aminophenylsulfonyl) benzene, 1,4-bis (4-aminophenylsulfonyl) benzene, 1,4-bis (3-aminophenylthioether) benzene 1,4-bis (4-aminophenylthioether) benzene, 4,4′-bis (3-aminophenoxy) diphenylsulfone, 4,4′-bis (4-aminophenoxy) diphenylsulfone, bis (4-amino) Phenyl) amine bis (4-aminophenyl) -N-methylamine bis (4-aminophenyl) -N-phenyl Minbis (4-aminophenyl) phosphine oxide, 1,1-bis (3-aminophenyl) ethane, 1,1-bis (4-aminophenyl) ethane, 2,2-bis (3-aminophenyl) propane, 2 , 2-bis (4-aminophenyl) propane, 2,2-bis (4-amino-3,5-dimethylphenyl) propane, 4,4′-bis (4-aminophenoxy) biphenyl, bis [4- ( 3-aminophenoxy) phenyl] sulfone, bis [4- (4-aminophenoxy) phenyl] sulfone, bis [4- (4-aminophenoxy) phenyl] ether, bis [4- (4-aminophenoxy) phenyl] methane Bis [3-methyl-4- (4-aminophenoxy) phenyl] methane, bis [3-chloro-4- (4-aminophenoxy) phenyl Methane, bis [3,5-dimethyl-4- (4-aminophenoxy) phenyl] methane, 1,1-bis [4- (4-aminophenoxy) phenyl] ethane, 1,1-bis [3-methyl- 4- (4-aminophenoxy) phenyl] ethane, 1,1-bis [3-chloro-4- (4-aminophenoxy) phenyl] ethane, 1,1-bis [3,5-dimethyl-4- (4) -Aminophenoxy) phenyl] ethane, 2,2-bis [4- (4-aminophenoxy) phenyl] propane, 2,2-bis [3-methyl-4- (4-aminophenoxy) phenyl] propane, 2, 2-bis [3-chloro-4- (4-aminophenoxy) phenyl] propane, 2,2-bis [3,5-dimethyl-4- (4-aminophenoxy) phenyl] propane, 2,2-bis [ -(4-aminophenoxy) phenyl] butane, 2,2-bis [3-methyl-4- (4-aminophenoxy) phenyl] butane, 2,2-bis [3,5-dimethyl-4- (4- Aminophenoxy) phenyl] butane, 2,2-bis [3,5-dibromo-4- (4-aminophenoxy) phenyl] butane, 1,1,1,3,3,3-hexafluoro-2,2- Bis (4-aminophenyl) propane, 1,1,1,3,3,3-hexafluoro-2,2-bis [3-methyl-4- (4-aminophenoxy) phenyl] propane and the like and their halogens Aromatic nucleus substitutes with atoms or alkyl groups are exemplified.

The diamine component consists of p-phenylenediamine alone or a combination of p-phenylenediamine and a different aromatic diamine as described above. In the latter combination, p-phenylenediamine is based on the total diamine component in a proportion of more than 80 mol%, preferably more than 90 mol%, ie less than 20 mol%, preferably 10 mol% of different aromatic diamines. Less than.
Moreover, the tetracarboxylic acid component which comprises a polyimide is pyromellitic acid and aromatic tetracarboxylic acid different from it.

  As aromatic tetracarboxylic acid components different from pyromellitic acid, for example, 1,2,3,4-benzenetetracarboxylic dianhydride, 2,3,5,6-pyridinetetracarboxylic dianhydride, 2,3 , 4,5-thiophenetetracarboxylic dianhydride, 2,2 ′, 3,3′-benzophenone tetracarboxylic dianhydride, 2,3 ′, 3,4′-benzophenone tetracarboxylic dianhydride, 3 , 3 ′, 4,4′-benzophenonetetracarboxylic dianhydride, 3,3 ′, 4,4′-biphenyltetracarboxylic dianhydride, 2,2 ′, 3,3′-biphenyltetracarboxylic dianhydride Anhydride, 2,3,3 ′, 4′-biphenyltetracarboxylic dianhydride, 3,3 ′, 4,4′-p-terphenyltetracarboxylic dianhydride, 2,2 ′, 3,3 '-P-terphenyltet Carboxylic dianhydride, 2,3,3 ′, 4′-p-terphenyltetracarboxylic dianhydride, 1,2,4,5-naphthalenetetracarboxylic dianhydride, 1,2,5,6 -Naphthalene tetracarboxylic dianhydride, 1,2,6,7-naphthalene tetracarboxylic dianhydride, 1,4,5,8-naphthalene tetracarboxylic dianhydride, 2,3,6,7-naphthalene Tetracarboxylic dianhydride, 2,3,6,7-anthracene tetracarboxylic dianhydride, 1,2,5,6-anthracene tetracarboxylic dianhydride, 1,2,6,7-phenanthrene Tetracarboxylic dianhydride, 1,2,7,8-phenanthrenetetracarboxylic dianhydride, 1,2,9,10-phenanthrenetetracarboxylic dianhydride, 3,4,9,10 -Perylenetetracarboxylic acid di- Water, 2,6-dichloronaphthalene-1,4,5,8-tetracarboxylic dianhydride, 2,7-dichloronaphthalene-1,4,5,8-tetracarboxylic dianhydride, 2,3 , 6,7-tetrachloronaphthalene-1,4,5,8-tetracarboxylic dianhydride, 1,4,5,8-tetrachloronaphthalene-2,3,6,7-tetracarboxylic dianhydride Bis (2,3-dicarboxyphenyl) ether dianhydride, bis (3,4-dicarboxyphenyl) ether dianhydride, bis (2,3-dicarboxyphenyl) methane dianhydride, bis (3 4-dicarboxyphenyl) methane dianhydride, bis (2,3-dicarboxyphenyl) sulfone dianhydride, bis (3,4-dicarboxyphenyl) sulfone dianhydride, 1,1-bis (2,3 -Dicarboxyl Enyl) ethane dianhydride, 1,1-bis (3,4-dicarboxyphenyl) ethane dianhydride, 2,2-bis (2,3-dicarboxyphenyl) propane dianhydride, 2,2-bis (3,4-dicarboxyphenyl) propane dianhydride, 2,6-bis (3,4-dicarboxyphenoxy) pyridine dianhydride, 1,1,1,3,3,3-hexafluoro-2, Examples include 2-bis (3,4-dicarboxyphenyl) propane dianhydride, bis (3,4-dicarboxyphenyl) dimethylsilane dianhydride, and the like.

The tetracarboxylic acid component is composed of pyromellitic acid alone or a combination of pyromellitic acid and a different aromatic tetracarboxylic acid as described above. In the latter combination, pyromellitic acid is based on the total tetracarboxylic acid component in a proportion of more than 80 mol%, preferably more than 90 mol%, i.e. less than 20 mol% aromatic tetracarboxylic acid, preferably It consists of less than 10 mol%.
The film of the present invention comprising a diamine component comprising a p-phenylenediamine component comprising 100 mol% and a polyimide comprising 100 mol% of a pyromellitic acid component exhibits a more preferable Young's modulus.
The polyimide imide group fraction of the polyimide film of the present invention is preferably 95% or more. If the imide group fraction is less than 95%, the hydrolysis resistance of the polyimide film decreases. The imide group fraction is defined in the examples.

The polyimide film of the present invention has practically excellent characteristics of an unprecedented high Young's modulus and an excellent balance of Young's modulus in the film plane. That is, two orthogonal directions in which the Young's modulus exceeds 10 GPa exist in the film plane. Preferably, two orthogonal directions with Young's modulus exceeding 12 GPa exist in the film plane.
In order to overcome the brittleness of polyparaphenylene pyromellitic imide which has such a high Young's modulus and is conventionally known, the present inventors can solve the problem by imparting a special microstructure to the polyimide film. I came to find. That is, in the polyimide film of the present invention, preferably, the following relational expressions (1), (2) and (3) are established between the refractive index nz in the direction perpendicular to the film surface and the film density d.
1.61>nz> 1.55 (1)
1.57>d> 1.46 (2)
2.0d-1.33>nz> 1.5d-0.77 (3)

nz is a measure of the orientation of polyimide molecules, and a decrease in this indicates an increase in plane orientation. If nz is 1.61 or more, the orientation is insufficient and the Young's modulus is low, and if it is 1.55 or less, the orientation becomes excessive and the film has a low elongation. Density d is a measure related to the crystallinity of polyimide and the density of microstructure. When d exceeds 1.57, the toughness of the film is insufficient, and when it is less than 1.46, the crystallinity is insufficient and the water absorption increases. It lacks dimensional stability. It is known that a general polymer can obtain a high density by increasing the orientation. Surprisingly, in the case of the polyimide film of the present invention, when the nz is lowered by the orientation and the density d is lower, a polyimide film having both high strength and high Young's modulus can be realized. In the range where nz exceeds 2.0d-1.33, the orientation is insufficient for crystallinity and the film becomes brittle. In the range where nz is less than 1.5d-0.77, the crystallinity is insufficient for orientation. Water absorption increases and dimensional stability is lacking.
At this time, if d exceeds 1.57, the toughness of the film is insufficient, and if it is less than 1.46, the crystallinity is insufficient, the water absorption increases, and the dimensional stability is lacking.
The polyimide film of the present invention preferably has a tensile strength in one direction of 0.3 GPa or more. More preferably, the tensile strength in one direction is 0.4 GPa or more.

  As a result of studying a technique of highly stretching and molecularly orienting an aromatic polyimide having a rigid structure, the present inventors found that a gel body prepared by chemically treating a precursor amic acid by a specific method was near room temperature. Because of its high stretchability at low temperatures, it is possible to obtain a polyimide film with a well-balanced in-plane mechanical property with significantly improved Young's modulus by heat treatment after stretching the gel body in a swollen state. I found it. By applying this gel preparation method and gel stretching method to polyparaphenylene pyromellitic imide, polyparaphenylene has a balanced high Young's modulus and practical strength and toughness, both of which have not been achieved previously. The inventors have found that pyromellitic imide can be obtained and have reached the present invention.

  Next, the method for producing the polyimide film of the present invention will be described in detail.

  The 1st manufacturing method of this invention consists of following process (1)-(4).

(1) A solution of polyamic acid in a solvent is prepared, wherein the polyamic acid has a p-phenylenediamine content of more than 80 mol% and 100 mol% or less, and an aromatic diamine component different from p-phenylenediamine is 0 mol% or more and 20 A diamine component comprising less than mol%, a tetracarboxylic acid component comprising pyromellitic acid exceeding 80 mol% and an aromatic tetracarboxylic acid component different from pyromellitic acid comprising from 0 mol% to less than 20 mol%, and The solvent comprises at least one selected from the group consisting of N, N-dimethylformamide, N, N-dimethylacetamide, N-methylpyrrolidone and 1,3-dimethylimidazolidinone;
(2) A film obtained by casting the solution prepared in the step (1) on a support in an isoimidization solution obtained by dissolving dicyclohexylcarbodiimide in at least one selected from the above solvents. To form a gel film in which at least part of the polyamic acid is converted to polyisoimide;
(3) The obtained gel-like film is separated from the support, washed as necessary, then biaxially stretched, and then (4) the obtained biaxially stretched film is washed as necessary to remove the solvent. Then, it is subjected to a heat treatment to form a biaxially oriented polyimide film.

In step (1), a solution of polyamic acid in a solvent is prepared. The polyamic acid is composed of the diamine component and the tetracarboxylic acid component as described above. Examples of the aromatic diamine different from p-phenylenediamine constituting the diamine component and the aromatic tetracarboxylic acid different from pyromellitic acid can include the same specific examples as described above for the polyimide. The diamine component of the polyamic acid is composed of p-phenylenediamine alone or a combination of p-phenylenediamine and a different aromatic diamine as described above. In the latter combination, p-phenylenediamine is based on the total diamine component in a proportion of more than 80 mol%, preferably more than 90 mol%, ie less than 20 mol%, preferably 10 mol% of different aromatic diamines. Less than.
The tetracarboxylic acid component of the polyamic acid is composed of pyromellitic acid alone or a combination of pyromellitic acid and a different aromatic tetracarboxylic acid as described above. In the latter combination, pyromellitic acid is based on the total tetracarboxylic acid component in a proportion of more than 80 mol%, preferably more than 90 mol%, i.e. less than 20 mol% aromatic tetracarboxylic acid, preferably It consists of less than 10 mol%.

Moreover, when manufacturing polyamic acid, these diamines and acid anhydrides are preferably used in a molar ratio of diamine to acid anhydride of 0.90 to 1.10, more preferably 0.95 to 1.05. It is preferable.
It is preferable that the terminal of this polyamic acid is sealed. When sealing with an end-capping agent, examples of the end-capping agent include phthalic anhydride and substituted products thereof, hexahydrophthalic anhydride and substituted products thereof, succinic anhydride and substituted products thereof, and amine components. Aniline and its substituted form are mentioned.
As the solvent, N, N-dimethylformamide, N, N-dimethylacetamide, N-methylpyrrolidone and 1,3-dimethylimidazolidinone are used. These solvents can be used alone or in combination of two or more.
According to the step (1), a solution of polyamic acid in a solvent having a solid content concentration of preferably 0.5 to 30% by weight, more preferably 2 to 15% by weight is prepared.

Next, in the step (2), the film obtained by casting the solution prepared in the above step (1) on the support is immersed in the isoimidization solution together with the support.
In order to cast the solution obtained in the above step (1) onto a support, any film forming method such as a generally known wet and dry wet molding method may be used. Examples of the film forming method include a die extrusion method, casting using an applicator, and a method using a coater. A metal belt, a casting drum, or the like can be used as a support when the polyamic acid is cast. It can also be cast on an organic polymer film such as polyester or polypropylene and introduced directly into the condensing agent solution. These steps are preferably performed in a low humidity atmosphere. The isoimidization solution is prepared by dissolving dicyclohexylcarbodiimide in at least one solvent selected from the same solvents as used in step (1).

The concentration of hexylcarbodiimide in the isoimidization solution is not specified, but is preferably 0.5% by weight or more and 99% by weight or less for allowing the reaction to proceed sufficiently. The reaction temperature is not particularly specified, but a temperature not lower than the freezing point and not higher than the boiling point of the isoimidization solution can be used.
In this step (2), a gel-like film in which at least a part of the polyamic acid is converted to polyisoimide is formed. When the isoimide group fraction of the gel film is 90% or more, a high stretch ratio is obtained, which is preferable.
It can be said that the first production method has one of the greatest features in obtaining a homogeneous and highly swollen unstretched gel-like film rich in stretchability in this step (2).

In the step (3), the unstretched gel film obtained in the step (2) is separated from the support and then subjected to biaxial stretching. Biaxial stretching may be performed after the unstretched film is separated from the support and then washed, or may be performed without washing. For the washing, for example, the same solvent as that used in the step (1) is used.
Stretching can be performed at a magnification of 1.1 to 6.0 times in the longitudinal and lateral directions. Although extending | stretching temperature is not specifically limited, What is necessary is just a grade which a solvent volatilizes and a drawability does not fall, for example, -20 degreeC-+80 degreeC is preferable. Note that the stretching may be performed by either sequential or simultaneous biaxial stretching. The stretching may be performed in a solvent, in air, in an inert atmosphere, or at a low temperature.
The gel film subjected to biaxial stretching in the step (3) preferably has a degree of swelling of 300 to 5,000%. Thereby, a high draw ratio can be obtained. If it is 300% or less, the stretchability is insufficient, and if it is 5,000% or more, the gel strength is lowered and handling becomes difficult.

Finally, in step (4), the biaxially stretched film obtained in step (3) is subjected to a heat treatment to form a biaxially oriented polyimide film.
Examples of the heat treatment method include hot air heating, vacuum heating, infrared heating, microwave heating, heating by contact using a hot plate or a hot roll, and the like. At this time, it is preferable to advance imidization by increasing the temperature stepwise.
As a result, an imide group fraction exceeding 95% can be realized while suppressing orientation relaxation.

  In addition, the solvent can be removed by washing the biaxially stretched film before the heat treatment. For washing, for example, a lower alcohol such as isopropanol, a higher alcohol such as octyl alcohol, an aromatic hydrocarbon such as toluene and xylene, an ether solvent such as dioxysan, and a ketone solvent such as acetone and methyl ethyl ketone can be dissolved. Can be mentioned.

  Next, the 2nd manufacturing method of this invention is demonstrated. The second production method includes the following steps (1) to (4).

(1) A solution of polyamic acid in a solvent is prepared, wherein the polyamic acid has a p-phenylenediamine content of more than 80 mol% and 100 mol% or less, and an aromatic diamine component different from p-phenylenediamine is 0 mol% or more and 20 A diamine component comprising less than mol%, a tetracarboxylic acid component comprising pyromellitic acid exceeding 80 mol% and an aromatic tetracarboxylic acid component different from pyromellitic acid comprising from 0 mol% to less than 20 mol%, and The solvent comprises at least one selected from the group consisting of N, N-dimethylformamide, N, N-dimethylacetamide, N-methylpyrrolidone and 1,3-dimethylimidazolidinone;
(2) A film obtained by casting the solution prepared in the step (1) on a support in a solution obtained by dissolving acetic anhydride and an organic amine compound in at least one selected from the above solvents. Dipping together with the support to form a gel film in which at least a portion of the polyamic acid is converted to polyimide or polyisoimide;
(3) The obtained gel-like film is separated from the support, washed as necessary, then biaxially stretched, and then (4) the obtained biaxially stretched film is washed as necessary to remove the solvent. Then, it is subjected to a heat treatment to form a biaxially oriented polyimide film.

Step (1) is the same as step (1) of the first production method.
Next, in step (2), the film obtained by casting the solution prepared in (1) above on the support is immersed in a solution obtained by dissolving acetic anhydride and organic amine together with the support. To do. As a solvent for preparing this solution, at least one solvent selected from the same solvents as used in step (1) is used.

  The organic amine compound used serves as a reaction catalyst for acetic anhydride and polyamic acid. For example, tertiary aliphatic amines such as trimethylamine, triethylamine, tributylamine, diisopropylethylamine, triethylenediamine; N, N-dimethylaniline, 1,8 -Aromatic amines such as bis (N, N-dimethylamino) naphthalene, pyridine and its derivatives, picoline and its derivatives, lutidine, quinoline, isoquinoline, 1,8-diazabicyclo [5.4.0] undecene, N, N -Heterocyclic compounds such as dimethylaminopyridine can be used. Of these, pyridine and picoline are preferred from the economical viewpoint. Triethylenediamine and N, N-dimethylaminopyridine are preferably used in combination with acetic anhydride because an extremely high imide group fraction can be realized and a gel film having high resistance to water can be obtained. In this case, the amount of the organic amine compound with respect to acetic anhydride is not particularly defined, but is 0.5 mol% or more, more preferably 10 mol% or more.

The concentration of acetic anhydride in the mixed solution is not particularly specified, but is preferably 0.5% by weight or more and 99% by weight or less in order to sufficiently proceed the reaction. More preferably, it is 30 to 99 weight%. The reaction temperature is not particularly specified, but a temperature not lower than the freezing point and not higher than the boiling point in the mixed solution can be used.
In the second production method, acetic anhydride and polyamic acid are reacted in the presence of a catalyst of an organic amine compound in a solvent capable of dissolving the polyamic acid in this step (2), thereby being highly uniform and highly swollen. It can be said that it has one of the greatest features in obtaining an unstretched gel film.

Next, in the second production method, step (3) and step (4) are sequentially performed, and these steps are the same as step (3) and step (4) of the first production method.
As described above, the biaxially oriented polyimide film obtained by the first production method and the second production method has a high Young's modulus polyimide film with a molecular chain strongly oriented in the film plane and excellent in-plane balance. The value of Young's modulus measured in two directions perpendicular to each other exceeds 10 Gpa, more preferably 12 Gpa, and the film has improved strength by forming a special microstructure by stretching orientation. Even if such a high Young's modulus polyimide film is a thin film having a thickness of 10 μm or less due to its high rigidity, it can be suitably used for electronic applications, for example, a support for an electrical wiring board on which copper thin films are laminated. It can also be used as a support for flexible circuit boards, TAB (tape automated bonding) tapes, and LOC (lead-on-chip) tapes. It can also be used as a base film for magnetic recording tape.

Hereinafter, the method of the present invention will be described in more detail with reference to examples. However, these examples do not limit the scope of the present invention.
The logarithmic viscosity of the polyamic acid was measured at 35 ° C. with a polymer concentration in NMP of 0.5 g / 100 ml. The degree of swelling was calculated from the ratio of the weight of the swollen state to the dried state. That is, when the weight in the dry state is W1 and the weight at the time of swelling is W2, the degree of swelling = (W2 / W1-1) × 100
Calculated as Further, the measurement of the strength and elongation was performed by using a 50 mm × 10 mm sample at a pulling speed of 5 mm / min and measured by Orientec UCT-1T.

The isoimide group fraction and the imide group fraction were determined as follows from a peak intensity ratio measured by a transmission method using a Fourier transform infrared spectrometer (Nicolet Magna 750).

Isoimide group fraction (%) = (A ₉₂₀ / A ₁₀₂₄ ) /11.3×100
A ₉₂₀ : Absorption intensity of peak derived from ₉₂₀ cm ⁻¹ isoimide bond of sample A ₁₀₂₄ : Absorption intensity imide group fraction (%) of peak derived from ₁₀₂₄ cm ⁻¹ benzene ring of sample = (A ₇₂₀ / A ₁₀₂₄ ) /5.1× 100
A ₇₂₀ : Absorption intensity of peak derived from ₇₂₀ cm ⁻¹ imide bond of sample A ₁₀₂₄ : Absorption intensity of peak derived from ₁₀₂₄ cm ⁻¹ benzene ring of sample

Example 1
910 ml of N-methyl-2-pyrrolidone (NMP) dehydrated with molecular sieves in a nitrogen atmosphere was placed in a reaction vessel equipped with a thermometer / stirring device and a raw material inlet, and after 19.9 g of paraphenyldiamine was further added, And then cooled in an ice bath. To this cooled diamine solution, 40.1 g of pyromellitic dianhydride anhydride was added and allowed to react for 1 hour. After reacting at room temperature for 2 hours, 0.011 g of aniline was added and reacted for another 30 minutes. The logarithmic viscosity of the obtained polyamic acid solution was 4.12.
This amic acid solution was cast on a glass plate using a doctor blade having a thickness of 1.5 mm, introduced into a dicyclohexylcarbodiimide (DCC) bath composed of an N-methyl-2-pyrrolidone solution having a DCC concentration of 28 wt%, and solidified for 8 minutes. Then, it was peeled from the glass plate and reacted for 12 minutes to obtain a gel film. The gel film had an isoimide group fraction of 98%, and no imide group could be detected.

After immersing the polyimide precursor in NMP, which is a swelling solvent, at room temperature for 15 minutes, the film was fixed with a chuck and simultaneously biaxially stretched in two orthogonal directions at a magnification of 2 or 3 times. After stretching, the film was immersed in isopropanol, and the swelling solvent and the like were extracted from the imide precursor.
The stretched film was frame fixed and then dried at 200 ° C. Further, heat treatment imidization was performed stepwise, and the temperature was finally raised to 450 ° C. to obtain a polyparaphenylene pyromellitic imide film. The resulting polyparaphenylenepyromellitimide film has a thickness of 7.0 μm, tensile modulus of 20.3 GPa and 21.7 GPa in the orthogonal stretching direction, tensile strength of 0.37 GPa and 0.37 GPa, and elongation of respectively 2.6% and 2.7%. The refractive index nz in the thickness direction was 1.599 and the density was 1.523 g / cm ³ . The imide group fraction was 99%.

Examples 2-5
A polyimide film was obtained in the same manner as in Example 1 except for the simultaneous biaxial stretching ratio and the final heat treatment temperature. The results are shown in Table 1.

Example 6
A polyamic acid solution was prepared using the same method as in Example 1.
This polyamic acid solution was cast on a glass substrate using a doctor blade having a thickness of 1.0 mm, introduced into a dehydration condensation bath consisting of 800 ml of NMP, 600 ml of acetic anhydride, and 300 ml of pyridine, and gelled by immersion for 10 minutes. Then, it peeled from the glass substrate and obtained the gel-like film. The gel film had an imide group fraction of 43% and an isoimide group fraction of 35%.
The obtained gel film was immersed in NMP at room temperature for 15 minutes, and then fixed at both ends with a chuck, and simultaneously biaxially stretched at a speed of 5 mm / sec in a biaxial direction at room temperature at a rate of 1.9 times. The degree of swelling of the gel film at the start of stretching was 1,810%.
The stretched gel film was fixed to a frame, and the temperature was increased stepwise between 160 ° C. and 450 ° C. using a hot air circulation oven, followed by drying and heat treatment to obtain a polyimide film. The thickness of the obtained polyimide film was 9 μm, the tensile elastic modulus measured in two orthogonal directions in the plane was 17.9 GPa and 16.0 GPa, the tensile strength was 0.39 GPa and 0.35 GPa, and the elongation was 5.1%. And 4.9%. Further, the refractive index nz in the thickness direction was 1.573 and the density was 1.508 g / cm ³ . The imide group fraction was 99%.

Examples 7 and 8
A polyimide film was obtained in the same manner as in Example 6 except for the final heat treatment temperature. The results are shown in Table 1.

Example 9
A polyamic acid solution was prepared using the same method as in Example 1.
This polyamic acid solution was cast on a PET film using a doctor blade having a thickness of 0.6 mm, introduced into a bath composed of 100 ml of acetic anhydride, 25 g of triethylenediamine and 800 ml of N-methyl-2-pyrrolidone, and allowed to react and solidify for 10 minutes. It was. Thereafter, the film was peeled from the PET film and further reacted for 10 minutes for a total of 20 minutes to obtain a gel film. No peak derived from the amide bond was observed, and the imide group fraction was 99%. The obtained gel-like film was immersed in NMP at room temperature for 15 minutes, then both ends were fixed with a chuck, and simultaneously biaxially stretched at a rate of 5 mm / sec, 1.2 times in the biaxial direction at room temperature. The degree of swelling of the gel film at the start of stretching was 1,600%.

The stretched gel-like film was fixed to a frame and dried at 200 ° C. for 20 minutes using a hot air circulating oven, and then the temperature was gradually raised to 450 ° C. to obtain a polyimide film. The thickness of the obtained polyimide film was 9 μm, the tensile modulus measured in two in-plane orthogonal directions was 13.8 GPa and 16.9 GPa, the elongation was 13.1% and 10.0%, and the tensile strength was 0.00. 37 GPa and 0.40 GPa. The refractive index nz in the thickness direction was 1.555, and the density was 1.490 g / cm ³ . The imide group fraction was 99%. Examples 10 and 11
A polyimide film was obtained in the same manner as in Example 9 except for the ratio of simultaneous biaxial stretching. The results are shown in Table 1.

Comparative Example 1
A gel film was prepared in the same manner as in Example 3, dried at 250 ° C. for 20 minutes without stretching, and further heat treated at 200 ° C. for 20 minutes to obtain a polyimide film.
The thickness of the film was 6 μm, the tensile modulus measured in two orthogonal directions in the plane was 8.22 GPa and 7.9 GPa, the elongation was 7.6% and 7.2%, and the tensile strength was 0.16 GPa and 0.00. It was 16 GPa. The refractive index nz in the thickness direction was 1.665, and the density was 1.588 g / cm ³ . The imide group fraction was 100%.

Claims (10)

(1) A solution of polyamic acid in a solvent is prepared, wherein the polyamic acid has a p-phenylenediamine component of more than 80 mol% and not more than 100 mol% and an aromatic diamine component different from p-phenylenediamine of 0 mol% or more. It is substantially composed of a diamine component composed of less than 20 mol% and a tetracarboxylic acid component composed of more than 0 mol% and less than 20 mol% of an aromatic tetracarboxylic acid component having a pyromellitic acid content exceeding 80 mol% and different from pyromellitic acid And the solvent comprises at least one selected from the group consisting of N, N-dimethylformamide, N, N-dimethylacetamide, N-methylpyrrolidone and 1,3-dimethylimidazolidinone;
(2) A film obtained by casting the solution prepared in the step (1) on a support in an isoimidated solution obtained by dissolving dicyclohexylcarbodiimide in at least one selected from the above solvents. To form a gel film in which at least part of the polyamic acid is converted to polyisoimide;
(3) The obtained gel-like film is separated from the support, washed as necessary, then biaxially stretched, and then (4) the obtained biaxially stretched film is washed as necessary to remove the solvent. After that, it is subjected to heat treatment to form a biaxially oriented polyimide film.
A method for producing a polyimide film characterized by the above.   The method according to claim 1, wherein in step (2), the isoimide group fraction of the gel film is 90% or more.   The method according to claim 1, wherein the gel film subjected to biaxial stretching in step (3) has a degree of swelling of 300 to 5,000%.   The method according to claim 1, wherein the heat treatment in the step (4) is carried out at a temperature of 300 to 550 ° C under a constant length or tension. (1) A solution of polyamic acid in a solvent is prepared, wherein the polyamic acid has a p-phenylenediamine component of more than 80 mol% and not more than 100 mol% and an aromatic diamine component different from p-phenylenediamine of 0 mol% or more. A diamine component consisting of less than 20 mol%, an aromatic tetracarboxylic acid component of which pyromellitic acid exceeds 80 mol% and different from pyromellitic acid consists of a tetracarboxylic acid component consisting of 0 mol% or more and less than 20 mol%, and The solvent comprises at least one selected from the group consisting of N, N-dimethylformamide, N, N-dimethylacetamide, N-methylpyrrolidone and 1,3-dimethylimidazolidinone;
(2) A film obtained by casting the solution prepared in the step (1) on a support in a solution obtained by dissolving acetic anhydride and an organic amine compound in at least one selected from the above solvents. Dipping together with the support to form a gel film in which at least a portion of the polyamic acid has been converted to polyimide or polyisoimide;
(3) The obtained gel-like film is separated from the support, washed as necessary, then biaxially stretched, and then (4) the obtained biaxially stretched film is washed as necessary to remove the solvent. After that, it is subjected to heat treatment to form a biaxially oriented polyimide film.
A method for producing a polyimide film characterized by the above.   The method according to claim 5, wherein in the step (2), a combination of the imide group fraction and the isoimide group fraction of the gel film is 20% to 100%.   The method according to claim 5, wherein the gel film subjected to biaxial stretching in the step (3) has a degree of swelling of 300 to 5,000%.   The method according to claim 5, wherein the heat treatment in the step (4) is carried out at a temperature of 300 to 550 ° C under a constant length or tension.   The method according to claim 5, wherein the organic amine compound used in step (2) is pyridine or picoline. The method according to claim 5, wherein the organic amine compound used in step (2) is triethylenediamine or 4-dimethylaminopyridine.