JP2006326811A - Manufacturing method of metal bond grinding wheel - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a metal bond grinding wheel having high hardness and sharpness. <P>SOLUTION: The medal bond grinding wheel is manufactured by sintering metal bond including 35 to 60 mass% of Sn in the whole 100 mass% of the metal bond mainly constituted of Cu, and mixing material 1 including super abrasive grain by an electrical discharge plasma sintering method. The sintering of the mixing material 1 is carried out by using an electrical discharge plasma sintering device 10. Therefore, the metal bond grinding wheel having high hardness and sharpness can be obtained. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a method for producing a metal bond grindstone.

  Currently, in order to improve the sharpness of the metal bond grindstone, a mixed material containing a metal bond containing Sn as much as possible with respect to the metal bond containing Cu as a main component and superabrasive grains is sintered, and the material structure A metal bond grindstone with high hardness and high Young's modulus is used. However, the general content of Sn in the metal bond is about 10 to 25% by mass (mass percent). This is because a commonly used hot press sintering method or the like results in a brittle grindstone due to the coarsening of the particle size of the metal bond.

On the other hand, in the manufacturing method of the superabrasive grindstone described in Patent Document 1 below, the Sn content is further increased to 18 to 55% by mass in order to further improve the sharpness. This superabrasive grindstone is obtained by forming and sintering an abrasive grain layer containing Cu as a main component and having a high Sn content and an Al alloy sintered body serving as a base metal at a time.
JP-A-8-243926

  However, if the sintering is simply performed, the particle size of the metal bond constituting the abrasive grain layer becomes coarse, so that there is a problem that the hardness of the obtained grindstone is lowered. Further, as the Sn content increases, Sn is eluted only by sintering, resulting in a non-uniform composition. For this reason, there exists a problem that the performance of a grindstone will become unstable, the holding power of an abrasive grain will become low, and a sharpness will worsen.

  The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a method for producing a metal bond grindstone having high hardness and good sharpness.

  The method for producing a metal bond grindstone according to the present invention comprises a mixed material containing a metal bond containing 35 to 60% by mass of Sn in 100% by mass of the total amount of the metal bond mainly composed of Cu, and superabrasive grains. It is characterized by sintering by a discharge plasma sintering method.

  In this metal bond grindstone manufacturing method, a pulse voltage is applied between metal bonds in a short time. Thereby, the mixed material can be uniformly sintered in a short time while the particle size of the metal bond remains small. For this reason, a metal bond grindstone with high hardness is obtained. Moreover, even if the metal bond which has Cu as a main component contains Sn with a high content rate of 35-60 mass% by applying a pulse voltage and sintering is performed for a short time, Sn does not elute. Sintering is stable. For this reason, the sharpness of the metal bond grindstone containing this metal bond and superabrasive grains improves.

  Moreover, it is also preferable that sintering of the mixed material by a discharge plasma sintering method is performed in the temperature range of 200-1000 degreeC.

  Thereby, the metal bond grindstone with a high content rate of Sn is obtained.

  ADVANTAGE OF THE INVENTION According to this invention, the manufacturing method of a metal bond grindstone with high hardness and a good sharpness is provided.

  Hereinafter, with reference to an accompanying drawing, a suitable embodiment of a manufacturing method of a metal bond grindstone concerning the present invention is described in detail. In addition, the same code | symbol shall be used for the same element and the overlapping description is abbreviate | omitted. Further, the dimensional ratios in the drawings do not necessarily match those described.

  First, the metal bond grindstone obtained by this manufacturing method is demonstrated. A metal bond grindstone is obtained by sintering a mixed material containing metal bonds and superabrasive grains. The metal bond contains Cu (copper) as a main component and contains Sn (tin) in an amount of 35 to 60% by mass in 100% by mass of the total amount of metal bonds. Here, when the Sn content in the total amount of metal bonds is smaller than 35% by mass, the resulting metal bond grindstone has a low abrasive grain holding power and poor sharpness. Moreover, when the content rate of Sn is larger than 60 mass%, the metal bond grindstone obtained becomes easy to become weak. In addition, as for the content rate of Sn, it is more preferable to exist in the range of 35-50 mass%. Examples of the superabrasive grains include diamond and CBN (cubic boron nitride).

  Next, the structure of the discharge plasma sintering apparatus 10 used in this manufacturing method is demonstrated using FIG. FIG. 1 shows a schematic configuration diagram of a discharge plasma sintering apparatus 10. The discharge plasma sintering apparatus 10 is an apparatus that sinters the mixed material 1 by a discharge plasma sintering (ie, Spark Plasma Sintering: SPS) method. In the discharge plasma sintering method, a pulse voltage is applied to the pressurized mixed material 1 in a vacuum atmosphere to heat a metal bond included in the mixed material 1 and discharge plasma generated between the metal bonds. This is a sintering method in which sintering is performed in a short time.

  First, the discharge plasma sintering apparatus 10 is provided with a lower punch electrode 16 and an upper punch electrode 17. The lower punch electrode 16 and the upper punch electrode 17 are arranged to face each other. The lower punch electrode 16 and the upper punch electrode 17 have conductivity. Each of the lower punch electrode 16 and the upper punch electrode 17 is connected to a power supply device 18. Therefore, a pulse voltage for generating discharge plasma in the mixed material 1 is applied by the power supply device 18, and a voltage is applied to the mixed material 1 through the lower punch 14 and the upper punch 15 described later. Each of the lower punch electrode 16 and the upper punch electrode 17 is connected to a pressurizing device 19. For this reason, the pressure for compressing the mixed material 1 is applied by the pressurizing device 19, and the mixed material 1 is compressed through the lower punch 14 and the upper punch 15 described later. Each of the power supply device 18 and the pressurizing device 19 is connected to the control device 20. The control device 20 controls the voltage of the power supply device 18 and the pressure of the pressurizing device 19.

  The lower punch 14 and the upper punch 15 are respectively inserted into the cylindrical sintering die 13 from both ends. That is, the lower punch 14 and the upper punch 15 are connected via the sintering die 13. The inner diameter of the through hole of the cylindrical sintered die 13 is the same as the outer shape of the lower punch 14 and the upper punch 15.

  The discharge plasma sintering apparatus 10 is provided with a vacuum apparatus (not shown) for making the inside of the apparatus 10 a vacuum atmosphere.

  Next, the manufacturing method of a metal bond grindstone is demonstrated. First, the inside of the apparatus 10 is kept in a vacuum atmosphere by the above vacuum apparatus. Next, a predetermined amount of the mixed material 1 is put into the through hole of the sintering die 13. Then, the lower punch 14 and the upper punch 15 are inserted and fitted into the sintering die 13 from both ends. A set of the mixed material 1, the sintering die 13, the lower punch 14, and the upper punch 15 integrated in this way is disposed between the lower punch electrode 16 and the upper punch electrode 17.

  Next, pressure is applied to the mixed material 1 from both sides through the lower punch electrode 16 and the upper punch electrode 17 from the pressurizing device 19. Further, a pulse voltage of a predetermined voltage is applied to the mixed material 1 from the power supply device 18 through the lower punch electrode 16 and the upper punch electrode 17. In addition, the inside of the apparatus 10 at the time of applying this voltage is temperature-adjusted and exists in the temperature range of 200-1000 degreeC. A more appropriate temperature in the apparatus 10 varies depending on the composition of the metal bond that the mixed material 1 has. When a voltage is applied to the metal bond of the mixed material 1, the surface of the metal bond is activated and is easily sintered in a short time. As a result of this sintering, a homogeneous metal bond grindstone is obtained.

  Next, the operation and effect of the method for producing a metal bond grindstone according to this embodiment will be described.

  In the method for manufacturing a metal bond grindstone according to this embodiment, a pulse voltage is applied between metal bonds in a short time by a discharge plasma sintering method using a discharge plasma sintering apparatus. Thereby, the mixed material 1 can be uniformly sintered in a short time while the particle size of the metal bond remains small. For this reason, a metal bond grindstone with high hardness is obtained. Further, sintering is performed in a short time by applying a pulse voltage. For this reason, even if the metal bond which has Cu as a main component contains Sn with the high content rate of 35-60 mass%, the stable sintering of the mixed material 1 can be performed, without eluting Sn. The metal bond grindstone obtained as a result of this sintering has a high abrasive grain holding power. As a result, the sharpness of the metal bond grindstone is improved.

  Moreover, sintering of the mixed material 1 by a discharge plasma sintering method is performed in the atmosphere of a 200-1000 degreeC temperature range. For this reason, a metal bond grindstone with high Sn content is obtained.

  As mentioned above, the invention made by the present inventor has been specifically described based on the embodiment. However, the present invention is not limited to the above embodiment, and various modifications are possible. For example, if the metal bond which has Cu as a main component contains 35-60 mass% of Sn in 100 mass% of whole quantity, you may contain another element further.

1 is a schematic configuration diagram of a discharge plasma sintering apparatus according to the present embodiment.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Mixed material, 10 ... Discharge plasma sintering apparatus, 13 ... Sintering die, 14 ... Lower punch, 15 ... Upper punch, 16 ... Lower punch electrode, 17 ... Upper punch electrode, 18 ... Power supply device, 19 ... Pressurization Device, 20 ... control device.

Claims (2)

  Sintering a mixed material containing a metal bond containing 35 to 60% by mass of Sn in 100% by mass of the total amount of the metal bond containing Cu as a main component and superabrasive grains by a discharge plasma sintering method. A manufacturing method of a featured metal bond grindstone.   The method for producing a metal bond grindstone according to claim 1, wherein the sintering of the mixed material by the discharge plasma sintering method is performed in a temperature range of 200 to 1000 ° C.

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