JP2006326723A5 - - Google Patents

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JP2006326723A5
JP2006326723A5 JP2005151339A JP2005151339A JP2006326723A5 JP 2006326723 A5 JP2006326723 A5 JP 2006326723A5 JP 2005151339 A JP2005151339 A JP 2005151339A JP 2005151339 A JP2005151339 A JP 2005151339A JP 2006326723 A5 JP2006326723 A5 JP 2006326723A5
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Japan
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atomic
pores
metal
anodic oxidation
valve metal
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JP2005151339A
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Japanese (ja)
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JP2006326723A (en
JP4681938B2 (en
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Publication of JP2006326723A5 publication Critical patent/JP2006326723A5/ja
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図2は、本発明におけるナノ構造体の製造方法の一例を示す工程図である。基板21または下地層22上に2層以上のAlまたはAl合金層(23,24)を形成し、陽極酸化により細孔25を形成する。その後、細孔内に金属・半導体・酸化物等の内包物26を充填し、上記陽極酸化皮膜の上層24のみ選択的に除去する事により、突起物27の長さの均一なナノ細線を有するナノ構造体を得ることができる。
前記陽極酸化により孔が形成される材料が、Alを50atmic%以上100atomic%以下含有する金属または合金であることが好ましい。
FIG. 2 is a process diagram showing an example of a method for producing a nanostructure in the present invention. Two or more Al or Al alloy layers (23, 24) are formed on the substrate 21 or the base layer 22, and the pores 25 are formed by anodic oxidation. Thereafter, the inclusions 26 of metal, semiconductor, oxide, etc. are filled in the pores, and only the upper layer 24 of the anodic oxide film is selectively removed, so that nanowires with uniform lengths of the protrusions 27 are obtained. Nanostructures can be obtained.
The material in which the holes are formed by the anodic oxidation is preferably a metal or alloy containing Al in the range of 50 atomic% to 100 atomic%.

このとき、Alに対してバルブ金属M(M=Ti、Zr、Hf、Nb、Ta、Mo、W、Crのいずれかの少なくとも1種類)を含有する様に添加するが、合金がアモルファス相の領域となると、陽極酸化により形成される細孔の垂直性、直線性が低下する等して、Al膜の陽極酸化皮膜と同様のポーラス状皮膜を再現性良く得ることが困難になる。故に、添加するバルブ金属の種類にもよるが概ね5〜50atomic%の範囲でバルブ金属を添加するのが好ましい。 In this case, valve metal M with respect to Al is added so as to contain (M = Ti, Zr, Hf , Nb, Ta, Mo, W, or at least one of Cr), an alloy of amorphous phase In the region, it becomes difficult to obtain a porous film similar to the anodic oxide film of the Al film with good reproducibility because the verticality and linearity of the pores formed by anodic oxidation are lowered. Therefore, it is preferable to add the valve metal in a range of approximately 5 to 50 atomic%, although it depends on the type of the valve metal to be added.

JP2005151339A 2005-05-24 2005-05-24 Method for producing nanostructure Expired - Fee Related JP4681938B2 (en)

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JP2005151339A JP4681938B2 (en) 2005-05-24 2005-05-24 Method for producing nanostructure

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JP2005151339A JP4681938B2 (en) 2005-05-24 2005-05-24 Method for producing nanostructure

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JP2006326723A JP2006326723A (en) 2006-12-07
JP2006326723A5 true JP2006326723A5 (en) 2008-02-14
JP4681938B2 JP4681938B2 (en) 2011-05-11

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Families Citing this family (15)

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Publication number Priority date Publication date Assignee Title
JP5094208B2 (en) * 2006-08-24 2012-12-12 キヤノン株式会社 Manufacturing method of structure
KR20080053571A (en) * 2006-12-11 2008-06-16 광주과학기술원 Method for analysing nano-structure using electron microscope
EP2079095B1 (en) * 2008-01-11 2012-01-11 UVIS Light AB Method of manufacturing a field emission display
JP5099836B2 (en) * 2008-01-30 2012-12-19 株式会社高松メッキ Manufacturing method of electron gun
US8048546B2 (en) * 2009-12-16 2011-11-01 Hitachi Global Storage Technologies Netherlands B.V. Perpendicular magnetic recording disk with ordered nucleation layer and method for making the disk
US20170267520A1 (en) 2010-10-21 2017-09-21 Hewlett-Packard Development Company, L.P. Method of forming a micro-structure
US9751755B2 (en) 2010-10-21 2017-09-05 Hewlett-Packard Development Company, L.P. Method of forming a micro-structure
WO2012054045A1 (en) * 2010-10-21 2012-04-26 Hewlett-Packard Development Company, L.P. Method of forming a nano-structure
WO2012054042A1 (en) 2010-10-21 2012-04-26 Hewlett-Packard Development Company, L.P. Method of forming a nano-structure
WO2012054043A1 (en) 2010-10-21 2012-04-26 Hewlett-Packard Development Company, L.P. Nano-structure and method of making the same
JP5824399B2 (en) * 2012-03-30 2015-11-25 富士フイルム株式会社 Resin mold for nanoimprint and manufacturing method thereof
KR20220022668A (en) * 2020-08-19 2022-02-28 (주)포인트엔지니어링 Mold using anodized oxide layer, Mold apparatus including thereof, Product and Method for manufacturing the product using thereof
KR102469788B1 (en) * 2021-02-22 2022-11-23 (주)포인트엔지니어링 Metal Product and Method for Manufacturing the Product
US20240218547A1 (en) * 2021-05-07 2024-07-04 Point Engineering Co., Ltd. Metal structure and method for manufacturing same
CN116623133B (en) * 2023-05-12 2023-11-24 中南大学 Preparation method of metal needle point array type plasma photocatalyst

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05211029A (en) * 1992-01-31 1993-08-20 Ricoh Co Ltd Electron emission element and its manufacture
JP3729449B2 (en) * 2001-05-11 2005-12-21 キヤノン株式会社 Structure and device having pores
JP4383796B2 (en) * 2003-08-07 2009-12-16 キヤノン株式会社 Nanostructure and manufacturing method thereof
JP4434658B2 (en) * 2003-08-08 2010-03-17 キヤノン株式会社 Structure and manufacturing method thereof

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