JP2006319066A - Light emitting diode array - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a structure of a one side electrode-type light emitting diode array with which lifting of a semiconductor chip is prevented and measurement evaluation of a stable electric characteristic can be obtained. <P>SOLUTION: Spaces are secured in both ends in the long side direction of the semiconductor chip by making bonding pads 2 dense in the center of the long side direction of the semiconductor chip 10. Needle pads 4 which additionally make the bonding pad probe the needle at the time of making the probe needle probe the bonding pad 2 for measurement are arranged in the spaces. The position of the probe pad 4 is decided in such a way that the center of the probe pad 4 comes to a second region B opposite to a first region A where the bonding pads 2 exist when a region on the upper face of the semiconductor chip is divided into two regions A and B by a straight line passing a center of a short side. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a structure of a one-side electrode type light emitting diode array.

  Conventionally, a one-side electrode type light emitting diode array has a structure in which light emitting portions for forming light emitting dots are arranged in a line and bonding pads serving as electrodes are arranged in a line (see, for example, Patent Document 1).

  An example of the structure of a conventional one-side electrode type light emitting diode array is shown in FIG.

  As shown in the drawing, a plurality of light emitting portions (light emitting diode portions) 11 are formed in a line at a constant pitch along the long side direction on one long side 15a side of the upper surface of the semiconductor chip 15 having a rectangular shape. Has been. A plurality of bonding pads 12 corresponding to the light emitting portion 11 are formed in a row along the long side direction on the other long side 15 b side of the upper surface of the semiconductor chip 15. Then, the corresponding light emitting section 11 and bonding pad 12 are connected by a wiring pattern 13 as a metal wiring.

  In short, the light emitting portion 11 exists on one side of the semiconductor chip 15, and the bonding pad 12 exists on the opposite side of the semiconductor chip short side direction through the wiring pattern 13 from the light emitting portion 11.

  When measuring and evaluating the electrical characteristics of the light-emitting diode array, a probe needle for measurement (hereinafter abbreviated as “probe for measurement”) is raised on the bonding pad 12 of the semiconductor chip 15 so that the probe is touched. Measuring. The electrical property measurement evaluation is, for example, measurement and evaluation of light emission output, forward voltage, reverse current, and the like.

Although not directly related to the present invention, there is a technique for providing a dimension reference along the long side direction and the width direction of a semiconductor chip by providing a first dummy pattern and a second dummy pattern next to the bonding pad. It is known (see, for example, Patent Document 2).
JP 2003-078173 A JP-A-7-266617

  However, in the structure of the one-side electrode type light emitting diode array shown in FIG. 2, the region on the upper surface of the semiconductor chip is divided into two regions, a first region A and a second region B, with a straight line L passing through the center of the short side as a boundary. When considered, the bonding pad 12 exists only in the first region A and does not exist in the second region B. Therefore, when the measurement probe needle is brought into contact with the bonding pad 12, only one side of the entire semiconductor chip 15, that is, the first region A side where the bonding pad 12 exists is pressed with the measurement probe needle. Become. Therefore, an unbalanced force is applied to the semiconductor chip 15 around the center in the short side direction during measurement of electrical characteristics, and in an extreme case, one side of the semiconductor chip is lifted. For this reason, the contact between the needle and the bonding pad 12 becomes a point contact or becomes an unstable contact state such as being separated. As a result, it is difficult to accurately measure and evaluate the electrical characteristics, particularly the forward voltage.

  Accordingly, an object of the present invention is to solve the above-mentioned problems, prevent an unstable contact state such as lifting of a semiconductor chip, and a structure of a one-sided electrode type light-emitting diode array that can obtain measurement and evaluation of stable electrical characteristics Is to provide.

  In order to achieve the above object, the present invention is configured as follows.

  In the light-emitting diode array according to the first aspect of the present invention, a plurality of light-emitting portions are formed in a row at regular pitch intervals along the long-side direction on one long side of the upper surface of the rectangular semiconductor chip. In addition, a plurality of bonding pads corresponding to the light emitting portions are formed in a row along the long side direction on the other long side of the upper surface of the semiconductor chip, and the corresponding light emitting portions and bonding pads In a one-sided electrode type light-emitting diode array connected by metal wiring between them, the bonding pads are arranged so as to be densely centered in the long-side direction of the semiconductor chip with respect to the light-emitting portion. A space is provided, and in this space, a needle stand pad is provided for additional contact when the probe needle is brought into contact with the bonding pad for measurement. When the area of the upper surface of the semiconductor chip is divided into two areas by a straight line passing through the center of the short side of the area on the upper surface of the semiconductor chip, a needle stand is provided in the second area opposite to the first area where the bonding pad exists. It is characterized in that it is determined that the center of the pad will come.

  According to a second aspect of the present invention, in the light emitting diode array according to the first aspect, the bonding pad exists over the entire first region and a part of the second region when viewed in the short side direction of the semiconductor chip, and the needle holder The use pad is characterized in that the center is in the second region and exists from a part of the second region to a part of the first region.

  According to a third aspect of the present invention, in the light-emitting diode array according to the first or second aspect, the position of the needle stand pad is set to a position that functions as a position sensor pad for detecting a position where the semiconductor chip is to be disposed. It is characterized by that.

<Key points of the invention>
In the present invention, when measuring and evaluating the electrical characteristics of an LED array chip, in the case of a one-side electrode type light emitting diode array, the probe needle for measurement is concentrated only on one side at the time of measurement. Solves the problem that the tip of the tip that is not in contact with the probe needle is lifted up, causing the probe needle for measurement to be in poor contact with the electrode, making it impossible to accurately measure the electrical voltage such as forward voltage. It is for the purpose.

  As means for achieving this object, in the present invention, the semiconductor chip is prevented from being lifted in a region opposite to the region where the electrode (bonding pad) to be contacted by the measuring probe needle exists as much as possible in the short side direction of the semiconductor chip. For this purpose, a bonding pad (needle stand pad) is provided for causing the tip pressing needle to touch and press. That is, the position of the needle stand pad is a second region opposite to the first region where the bonding pad exists when the region on the upper surface of the semiconductor chip is divided into two regions by a straight line passing through the center of the short side. Determine the center of the needle holder pad.

  The present invention has a configuration in which a needle stand pad is provided on the opposite side of the bonding pad as much as possible in the short side direction of the semiconductor chip, whereas Patent Document 2 discloses that the bonding pads are arranged side by side (long side direction). A dummy pattern is provided, which is greatly different from the present invention in this respect.

  In the present invention, in the one-side electrode type light emitting diode array, the bonding pads are concentrated in the center in the long side direction, and the semiconductor chip which is a sample to be measured and evaluated in the space at both ends in the long side direction produced thereby is stabilized. The needle stand pad is provided so that the center comes to the position where it is pressed, that is, the position opposite to the bonding pad when viewed in the short side direction of the semiconductor chip. Therefore, according to the present invention, when measuring electrical characteristics, particularly when measuring the forward voltage, the semiconductor chip is prevented from being lifted by applying a needle pressure to the needle pad in addition to the bonding pad. As a result, the posture of the semiconductor chip is stabilized. For this reason, the measurement probe needle can reliably contact the bonding pad, and a stable measurement value can be obtained.

  Hereinafter, the present invention will be described based on the illustrated embodiments.

  In this embodiment, in the one-side electrode type light emitting diode array structure, bonding pads that are electrically connected to the light emitting portion by the wiring pattern are arranged so as to be densely arranged at the center in the long side direction of the semiconductor chip. A structure for providing a needle stand pad that is electrically separated from the light emitting portion at the portion where the needle for probe card position sensor and the sample (semiconductor chip) pressing in the space at both ends in the vacant long side direction is inserted. is there.

  FIG. 1 shows a light emitting diode array structure in an embodiment of the present invention.

  As in the prior art, a plurality of light emitting portions (light emitting diode portions) 1 are formed in a row at a constant pitch along the long side direction on one long side 5a side of the upper surface of the rectangular semiconductor chip 5. Has been. A plurality of bonding pads 2 corresponding to the light emitting portion 1 are formed in a line along the long side direction on the other long side 5 b side of the upper surface of the semiconductor chip 5. Then, the corresponding light emitting section 1 and bonding pad 2 are connected by a wiring pattern 3 as a metal wiring.

  However, unlike the case of FIG. 2 of the prior art, the bonding pads 2 are arranged so as to be densely arranged at the center in the long side direction of the semiconductor chip 5 with respect to the light emitting portion 1. Space is secured at both ends in the side direction. Further, in this space, a needle stand pad 4 that is additionally contacted when the probe needle for measurement is brought into contact with the bonding pad 2 for electrical property measurement evaluation is electrically separated from the light emitting unit 1. It is provided.

  The position of the needle stand pad 4 is determined by the presence of the bonding pad 2 when the region on the upper surface of the semiconductor chip is divided into two regions, a first region A and a second region B, by a straight line L passing through the center of the short side. It is determined that the center of the needle stand pad 4 comes to the second region B opposite to the first region A.

  Accordingly, when the measurement probe needle is caused to contact the bonding pad 2 for measurement and evaluation of electrical characteristics, the needle holder pad 4 is additionally touched and pressed. For this reason, even when measuring the electrical characteristics, particularly when measuring the forward voltage, the measurement probe needle can reliably come into contact with the bonding pad 2 to obtain a stable measurement value.

  In the embodiment of FIG. 1, the bonding pad 2 is present over the entire first region A and part of the second region B as viewed in the short side direction of the semiconductor chip 10, and the needle stand pad 4 is The center is located in the second region B and extends from a part of the second region to a part of the first region. However, the bonding pad 2 may be entirely present in the first region A, and the needle stand pad 4 may be entirely present in the second region B.

  Further, in the case of this embodiment, the above-described needle holder pad 4 is provided at a position where the needle holder pad 4 functions as a position sensor pad for detecting a position where the semiconductor chip 10 is to be arranged. Therefore, it is not necessary to provide a dedicated position sensor pad.

<Specific example>
Specifically, a light emitting diode array was produced as follows.

  The semiconductor chip 10 has a long side dimension of 6400 μm and a short side dimension of 500 μm. On the surface of the semiconductor chip 10, 64 sets of the light emitting portion 1, the bonding pad 2, and the wiring pattern 3 that electrically connects them were present. At both ends of the semiconductor chip 10 in the long side direction, a needle stand pad (bonding pad) 4 functioning as a position sensor pad and a sample pressing pad of the present invention was present.

  Next, the position of each pattern will be described. The lower left part of the semiconductor chip 10 in FIG. 1 is defined as coordinates (0, 0).

  In the light emitting unit 1, the patterns at both ends are centered on the coordinates (50, 420) (6350, 420), and the 64 patterns are adjacent to each other in the long side direction of the semiconductor chip 10 so that the adjacent dimension is 100 μm. Deploy. The dimensions are designed to be 70 μm in the long side direction and 60 μm in the short side direction.

  The bonding pad 2 is arranged so that the patterns at both ends are centered on the coordinates (365, 150) (6035, 150), and the 64 patterns are arranged so that the adjacent dimension is 90 μm in the long side direction of the semiconductor chip. The dimensions were designed to be 70 μm in the long side direction and 260 μm in the short side direction. Each light emitting unit 1 and the bonding pad 2 were electrically connected through a wiring pattern 3.

  Two needle stand pads 4 are arranged so that the coordinates (100, 280) (6300, 280) are at the center. The dimension of the needle stand pad 4 was designed to be 100 μm in both the long side direction and the short side direction.

  With this configuration, the posture of the semiconductor chip at the time of measurement evaluation can be stabilized and the electrical characteristics of the LED array chip can be correctly measured and evaluated by touching and pressing the needle pad 4 together with the bonding pad 2. It was.

It is a figure which shows the structure of the one side electrode type light emitting diode array by this invention. It is a figure which shows the structure of the conventional one side electrode type light emitting diode array.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Light emitting part 2 Bonding pad 3 Wiring pattern 4 Needle stand pad 5 Semiconductor chip 5a One long side 5b The other long side 11 Light emitting part 12 Bonding pad 13 Wiring pattern 15 Semiconductor chip 15a One long side 15b The other long side

Claims (3)

Along the long side direction on one long side of the top surface of the semiconductor chip having a rectangular shape, a plurality of light emitting portions are formed in a line at regular pitch intervals, and
On the other long side of the upper surface of the semiconductor chip, along the long side direction, a plurality of bonding pads corresponding to the light emitting part are formed in a line,
In the one side electrode type light emitting diode array in which the corresponding light emitting portion and the bonding pad are connected by metal wiring,
A space is secured at both ends in the long side direction of the semiconductor chip by arranging the bonding pads so as to be densely centered in the long side direction of the semiconductor chip with respect to the light emitting part,
In this space, a needle stand pad is provided for additional contact when the probe is contacted with the bonding pad for measurement.
When the area of the upper surface of the semiconductor chip is divided into two areas by a straight line passing through the center of the short side, the position of the needle stand pad is changed to a second area opposite to the first area where the bonding pad exists. A light-emitting diode array characterized in that the center of a needle stand pad is set. The light emitting diode array of claim 1,
When viewed in the short side direction of the semiconductor chip, the bonding pad exists over the entire first region and a part of the second region, and the needle holder pad is centered in the second region and is one part of the second region. A light-emitting diode array that exists from a part to a part of a first region. The light-emitting diode array according to claim 1 or 2,
A light-emitting diode array, wherein the position of the needle stand pad is set to a position that functions as a position sensor pad for detecting a position where a semiconductor chip is to be disposed.

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