JP2006315032A - Winding mechanism for solder wire manufacturing device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a winding mechanism for a solder wire manufacturing device capable of winding a solder wire around a spool in a traversing manner while preventing the solder wire from being damaged or entangled. <P>SOLUTION: A conductive plate 5 is arranged below a die of a longitudinal extrusion press machine 1, and conduction is performed between the die and the conductive plate when a solder wire 4 which is extruded from the die and naturally dropped is brought into contact with the conductive plate. A take-up device 7 has a winding motor 8 to turn a spool 14 and a traverse motor 9 to traverse the spool 14 via a traversing ball screw 11, and winds the solder wire 4 around the spool 14. A detection circuit and a control circuit are provided in a control box 6. The detection circuit detects the conduction time between the die and the conductive plate 5 which is changed corresponding to the winding diameter of the spool 14, and the control circuit is capable of adjusting the rotational speed of the winding motor 8 according to the result of detection. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to solder wire manufacturing in which lead (Pb), tin (Sn), indium (In), and other alloy solders used for joining electric circuits and the like are wound on a winding spool while being processed into a wire shape. The present invention relates to a winding mechanism in the apparatus.

  Generally, when processing lead (Pb), tin (Sn), and indium (In) based alloy solder called soft solder into a wire shape, as shown in FIG. 2, a vertical extrusion press The machine 1 is formed into a predetermined thickness by extruding the heated alloy solder 2 from the die 3. In this case, the solder wire 4 pushed out from the die 3 is naturally dropped and stacked in a spiral shape on a flat bat container 15 having a shallow bottom. Then, in the subsequent process, a method is adopted in which the solder wire extruded in the previous process is re-wound from its terminal portion to a shipping spool.

  However, when the solder wires 4 that have fallen naturally are simply spirally stacked on the bat container 15, the weight of the solder wires 4, the behavior of the solder wires 4 during the spiral, and the vertical extrusion press 1. The solder wire 4 is entangled due to vibration during extrusion from the wire, causing deformation and scratches in the solder wire 4 when winding the spool, and in some cases, the winding operation itself is difficult. Sometimes it makes things. Therefore, in practice, when the solder wires 4 are spirally stacked on the bat container 15, a protective sheet called a spacer is inserted for every fixed extrusion amount (the number of spirals) so as to reduce the occurrence of entanglement. I have to.

  As one method for preventing such a situation from occurring, a tension mechanism having a dancer roller as described in Patent Document 1 below is used to wind up an extremely fine bonding wire. Can be considered. Thus, FIG. 3 shows an example in which such a tension mechanism is employed in a solder wire winding mechanism. According to this configuration, the solder wire 4 extruded from the die 3 of the vertical extrusion press 1 is subjected to a tension load by the winding control detection device 16 and wound around the spool 14 attached to the take-up device 7. To be taken.

JP-A-6-293471

  By the way, in the case of the conventional method described with reference to FIG. 2, the solder wire extruded from the vertical extrusion press is spirally stacked on the bat container, and the solder wire on the bat container is shipped. Since it was divided into a process of winding on a spool, one worker was required for each process, which was extremely problematic in terms of cost. Therefore, as described with reference to FIG. 3, it is considered that a tension mechanism used in a general wire winding mechanism is employed and the solder wire extruded from the vertical extrusion press is directly wound on the spool. However, in such a case, as shown in FIG. 4, the solder wire 4 does not fall vertically from the die 3 of the vertical extrusion press 1, and the solder wire is caused by friction with the outlet portion of the die 3. There is a problem that the side surface of 4 is scratched or disconnected.

  The present invention has been made to solve such a problem, and the object of the present invention is to wind the spool around the spool without damaging or breaking the solder wire and without entanglement. It is providing the winding mechanism in the solder wire manufacturing apparatus which can be directly wound in the shape.

  In order to achieve the above object, the winding mechanism in the solder wire manufacturing apparatus of the present invention is such that the solder wire that has been naturally dropped by being pushed out of the die can be brought into contact with the lower position of the die of the vertical extrusion press. A conductive plate that is placed in contact with the die by contacting with the solder wire, and a take-up means for winding the solder wire around the spool by rotating the removably attached spool while traversing the spool; Detecting means capable of detecting a conduction time between the conductive plate and the die; and controlling a rotation speed of the spool with respect to an extrusion speed of the vertical extrusion press in response to a change in the conduction time detected by the detection means. And obtaining control means.

  The present invention is a solder wire manufacturing apparatus that processes lead (Pb), tin (Sn), and indium (In) based alloy solder into a solder wire by a vertical extrusion press, and applies excessive tension or slack. The solder wire can be pushed out from the die of the vertical extrusion press machine in a natural fall state without being damaged, so the solder wire is not damaged or disconnected at the outlet of the die, and it is spooled without entanglement On the other hand, it can be wound up in a thread form.

  An embodiment of the present invention will be described with reference to FIG. The vertical extrusion press 1 is configured to apply heated lead (Pb), tin (Sn), indium (In) based alloy solder 2 to the die 3 shown in FIG. 2 (not shown in FIG. 1). The solder wire 4 is processed. A conductive plate 5 is disposed at a position where the solder wire 4 naturally falls from the die 3. The control box 6 includes a detection circuit for detecting a short circuit between the die 3 and the conductive plate 5 and a control circuit for controlling the rotation of a winding motor 8 described later.

  The take-up device 7 is rotated by a winding motor 8, a traverse motor 9 that is rotated in synchronization with the winding motor 8, a guide pulley 10 that guides the traveling solder wire 4, and the traverse motor 9. The traverse ball screw 11, the temporary stop sensor 12 that detects a state in which the solder wire 4 is not sent out for some reason, and the tension is applied to the solder wire 4, and the end of the solder wire 4 by detecting the rotation of the guide pulley 10. And a winding end detection sensor 13 for detecting The spool 14 is detachably attached to the take-up device 7 and is rotated by a take-up motor 8. The traverse ball screw 11 is rotated by a traverse motor 9 to traverse the bobbin 14 together with the take-up motor 8 and align and wind the solder wire 4 around the spool 14.

  Next, the operation will be described. First, the vertical extrusion press 1 is started, and when the extruded solder wire 4 is extruded to a predetermined length, the operation of the vertical extrusion press 1 is temporarily stopped. Then, the operator attaches the tip of the extruded solder wire 4 to the spool 14 and then restarts the vertical extrusion press 1. Therefore, the solder wire 4 naturally falls due to its own weight, and the lowermost part that sags in a curved shape comes into contact with the conductive plate 5. As a result, the die 3 and the conductive plate 5 are short-circuited, so that the detection circuit in the control box 6 detects this, and the winding circuit 8 is rotated by the control circuit to wind the solder wire 4 around the spool 14. Let me take it.

  At this time, the winding motor 8 starts rotating from an extremely low speed and is accelerated until the solder wire 4 is separated from the conductive plate 5. However, when the solder wire 4 is separated from the conductive plate 5, the winding motor 8 is gradually decelerated. When the solder wire 4 comes into contact with the conductive plate 5 again, the solder wire 4 is accelerated. Such an operation is repeated until the extrusion of the solder wire 4 is completed. During this time, the traverse motor 9 is rotated in synchronization with the winding motor 8 by the control circuit in the control box 6, and the traverse ball screw is rotated. 11, the winding motor 8 and the spool 14 are traversed so that the solder wire 4 is aligned and wound around the spool 14.

  At the end of extrusion, when the solder wire 4 is not separated from the die 3 or when the extrusion of the solder wire 4 is stopped due to an unexpected cause, the solder wire 4 comes into contact with the temporary stop sensor 12. Yes. And if the detection circuit in the control box 6 detects the conduction | electrical_connection signal by the contact, a control circuit will stop rotation of the winding motor 8 and the traverse motor 9. FIG. Also, if the solder wire 4 is cut during the manufacturing or if the end of the solder wire 4 is dropped at the end of extrusion, the rotation of the guide pulley 10 is stopped when the solder wire 4 has passed. Therefore, the rotation of the winding motor 8 and the traverse motor 9 is stopped by the detection signal of the winding end detection sensor 13 that monitors the rotation.

  In addition, since the winding diameter of the bobbin 14 increases as the solder wire 4 is wound up, it is necessary to gradually reduce the rotational speed of the winding motor 8 with respect to the extrusion processing speed. In such a case, paying attention to the fact that the amount of sag of the solder wire 4 changes, the detection circuit in the control box 6 can detect the time during the contact between the solder wire 4 and the conductive plate 3. Based on the detection result, the control circuit changes the acceleration amount of the winding motor 8.

It is the schematic which showed embodiment of this invention. It is a figure for demonstrating the conventional handling method of the solder wire in case the solder wire winding mechanism is not provided. It is the schematic for demonstrating the general method in the case of making it equip with a solder wire winding mechanism. FIG. 4 is a partially enlarged view of FIG. 3.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Vertical extrusion press 2 Solder alloy 3 Dies 4 Solder wire 5 Conductive plate 6 Control box 7 Take-up device 8 Take-up motor 9 Traverse motor 10 Guide pulley 11 Traverse ball screw 12 Pause sensor 13 Take-up end detection sensor 14 Spool 15 Bat container 16 Reeling control detection device

Claims (1)

  A conductive plate which is disposed at a lower position of a die of a vertical extrusion press so that the solder wire which is pushed out of the die and naturally falls can come into contact therewith, and is electrically connected to the die by contacting with the solder wire; A take-up means for rotating the spool attached in a detachable manner while traversing and winding the solder wire around the spool; a detecting means capable of detecting a conduction time between the conductive plate and the die; and the detecting means And a control means capable of controlling the rotation speed of the spool with respect to the extrusion speed of the vertical extrusion press in response to the change in the conduction time detected by .