JP2006314573A - Board storage unit and game machine equipped with the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To efficiently radiate the heat of an electronic circuit part while facilitating confirmation of the presence of fraudulence in the electronic circuit part. <P>SOLUTION: A first heat conductive member 36 with heat conductivity is held between a first heat conductive pattern 21a and a second heat conductive pattern 32c respectively in contact with the heat conductive member, and a first heat conductive member 37 with heat conductivity is held between a semi-conductor 35 and the second heat conductive pattern 32c respectively in contact with the conductive member. Accordingly, the heat conducted to the first heat conductive pattern 21a is conducted to the second heat conductive pattern 32c via the first heat conductive member 36, and the heat conducted to the semi-conductor 35 is conducted to the second heat conductive pattern 32c via the first heat conductive member 37. A second heat conductive member 38 is held between the second heat conductive pattern 32c and a base member 24 respectively in contact with the second heat conductive member. Accordingly, the heat conducted to the second heat conductive pattern 32c is conducted to the base member 24 via the second heat conductive member 38. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a board storage unit attached to a gaming machine.

  A gaming machine such as a slot machine or a pachinko machine includes a circuit board on which an electronic circuit component such as a semiconductor is mounted, and a game execution process is performed by the circuit board. Specific information such as a serial number is displayed on the surface of the electronic circuit component so that it can be immediately detected even if the electronic circuit component is illegally replaced. Further, the circuit board is enclosed in a transparent substrate storage case, thereby preventing an illegal act such as causing the circuit board to malfunction.

  Since the heat generation amount of the electronic circuit component increases as the processing capacity increases, the electronic circuit component may be damaged by the heat, or the performance of the electronic circuit component may be deteriorated. For this reason, it is common to attach a heat radiating member called a heat sink to a part with a large calorific value.

However, in recent pachinko machines, due to the increase in the size of liquid crystal panels and the accompanying complexity of game processing, it is not sufficient to dissipate electronic circuit components simply by attaching a heat sink, and more efficient heat dissipation is required. It has been. For this reason, for example, Patent Document 1 proposes that a thermally conductive resin be interposed between the electronic circuit component and the heat sink.
JP 2004-49292 A

  However, when attaching a heat conductive resin or heat sink to an electronic circuit component, since these are directly attached to the surface of the electronic circuit component, the information displayed on the surface of the electronic circuit component is once attached. Cannot be visually recognized, and for example, even if an illegal act such as exchanging electronic components illegally is performed, the discovery of the illegal act is delayed. In order to solve this, for example, it is conceivable to form a heat dissipation pattern on the circuit board using, for example, copper foil. However, since the circuit board is enclosed in the case, it is not possible to efficiently dissipate heat.

  The present invention provides a board storage unit capable of efficiently radiating heat from an electronic circuit component while easily checking whether or not an electronic circuit component is fraudulent, and a gaming machine including the board storage unit.

  In the board storage unit of the present invention, a heat conductive material is embedded in a mounting position of an electronic circuit component mounted on one surface side so as to be exposed on both sides of the one surface side and the other surface side. A circuit board on which a first heat transfer pattern for heat transfer is formed by the material and a heat conductive material are embedded so as to be exposed inside and outside, and the second heat transfer for heat transfer by the heat conductive material. A substrate storage case in which a pattern is formed and the circuit board is stored, and a heat conductive base member that is fixed to the inside or the back of the gaming machine and attaches the substrate storage case so that the second heat transfer pattern is separated A heat conductive first heat transfer member disposed so as to be in contact with each of the first heat transfer pattern and the second heat transfer pattern exposed on the other surface side, the second heat transfer pattern, and the Arranged in contact with each base member The is that a thermal conductivity of the second heat transfer member.

  In addition, it is preferable to provide the first heat transfer member so as to contact each of the electronic circuit component mounted on the other surface side and the second heat transfer pattern.

  Further, it is preferable that a portion of the base member to which the substrate storage case is attached is separated from an attachment location of the base member of the gaming machine.

  A gaming machine according to the present invention is provided with the board storage unit according to any one of claims 1 to 3.

  A heat conductive first heat transfer member in contact with at least one of the first heat transfer pattern of the circuit board and a second heat transfer pattern formed on the base member for mounting the substrate storage case; Since the heat conductive second heat transfer member sandwiched between the heat pattern and the base member is provided, it is possible to visually recognize the information displayed on the surface of the electronic circuit component, and whether or not there is fraud Confirmation can be facilitated. In addition, since it is possible to dissipate heat from the electronic circuit components without forming a hole in the board storage case, it is possible to prevent an illegal act of inserting a foreign object into the board storage case and causing the circuit board to malfunction. Furthermore, since the heat of the electronic circuit component is directly radiated, the heat of the electronic circuit component can be efficiently radiated.

  Since the first heat transfer member is arranged in contact with each of the electronic circuit component and the second heat transfer pattern formed on the base member, the heat of the electronic circuit component is dissipated without forming a hole in the substrate storage case. Therefore, it is possible to prevent a fraudulent act of causing a circuit board to malfunction by inserting a foreign substance into the board storage case. Furthermore, since the heat of the electronic circuit component is directly radiated, the heat of the electronic circuit component can be efficiently radiated.

  Since the portion of the base member to which the board storage case is attached is separated from the base member attachment portion of the gaming machine, a space for radiating the heat of the electronic circuit component to the outside can be provided, and the heat dissipation of the electronic circuit component can be efficiently performed. It can be performed.

  As shown in FIG. 1, a game board 3 is provided on the front side of a main body 2 a of a pachinko machine (game machine) 2. The front of the game board 3 is a game area. A symbol display device 4 for displaying a winning or losing is provided at a substantially central portion of the game board 3. Further, around the symbol display device 4, there are provided a start winning port 5, a normal winning port 6, a passing winning port 7, an attacker 8, an out port 9, and the like. The pachinko ball launched into the game area enters one of the start winning port 5, the normal winning port 6, the passing winning port 7, and the out port 9. When a winning occurs at the start winning opening 5, the symbol display device 4 is activated. When the winning symbol is displayed on the symbol display device 4, the attacker 8 moves and the winning opening provided in the back of the attacker 8 is opened.

  As shown in FIG. 2, a back mechanism plate 2c is provided on the back side of the main body 2a, and the back mechanism plate 2c has a game execution process (a lottery for determining winning or losing, winning ball payout control, etc.). A main control board (circuit board) 21 is attached. The main control board 21 is fixed to the pachinko machine 2 by the board storage unit 22.

  The substrate storage unit 22 includes a substrate storage case 22 and a base member 24. A main control board 21 is stored in the board storage case 22. The substrate storage case 22 is formed of a transparent resin. For this reason, the main control board 21 can be visually recognized from the outside through the board storage case 22.

  The base member 24 is made of a heat conductive metal such as magnesium. The base member 24 is attached to the back mechanism plate 2c. A substrate storage case 22 is detachably attached to the base member 24.

  In addition to the main control board 21, the sub mechanism board 2 c performs an effect execution process (image display control, sound output control, lamp lighting control, etc.) on the symbol display device 9. Is provided.

  As shown in FIG. 3, the base member 24 is formed by bending a plate-like member, and includes a pair of flanges 24a formed at both ends thereof and a case attaching portion 24b to which the substrate storage case 22 is attached. . The flange 24a is provided with a hole through which the fixture 24c is inserted. When the fixture 24c is attached to the main body 2a via the flange 24a, the base member 24 is fixed to the main body 2a. When the base member 24 is attached, the case attaching portion 24b is separated from the back mechanism plate 2c by the legs 24d at both ends thereof. Thereby, the board | substrate storage case 22 is attached in the position spaced apart from the back mechanism board 2c. The space surrounded by the base member 24 and the back mechanism plate 2c is a heat radiating space 39 for radiating heat transferred from the electronic components mounted on the main control board 21, as will be described in detail later. ing.

  The substrate storage case 22 includes a transparent upper cover 31 and a lower cover 32. The upper cover 31 is formed in a bowl shape having a rectangular opening. The upper cover 31 is attached to the case attaching portion 24 b of the base member 24 so that the longitudinal direction thereof is substantially parallel to the width direction of the pachinko machine 2. The upper cover 31 is formed with a pair of flanges 31a that are connected to the edge of the short side of the opening. The flange 31a has a hole through which the fixing tool 33 is inserted. When the fixing tool 33 is attached to the base member 24 via the flange 31a, the upper cover 31 is fixed to the base member 24.

  The lower cover 32 is formed in a bowl shape having a rectangular opening. The outer dimension of the lower cover 32 is slightly smaller than the inner dimension of the upper cover 31. The opening of the upper cover 31 faces downward on the case mounting portion 24b side, the opening of the lower cover 32 faces upward, and the locking protrusion 31b provided in the upper cover 31 in a state where the openings face each other, The upper cover 31 and the lower cover 32 are fixed by being inserted into the fitting holes 32 a of the lower cover 31. Thus, a sealed space is formed by the upper cover 31 and the lower cover 32, and the main control board 21 is accommodated in this space. The upper cover 31 and the lower cover 32 may be fixed appropriately. Further, when a caulking pin or the like is passed through the upper cover 31 and the lower cover 32 and the caulking pin is removed, the trace may remain.

  A support protrusion 32b is formed on the bottom surface of the lower cover 32, and the main control board 21 is placed on the support protrusion 32b. The main control board 21 is attached to the lower cover 32 by screwing the main control board 21 to the support protrusions 32b. It is attached to the lower cover 32. The main control board 21 is attached so as to be separated from the inner bottom surface of the lower cover 32. A plurality of electronic circuit components including a CPU (electronic circuit component) 34 and a semiconductor (electronic circuit component) 35 such as RAM and ROM are mounted on the main control board 21. The CPU 34 is mounted on the front side (one side) visible from the outside of the main control board 21. Further, the semiconductor 35 is mounted on the back surface side (other surface side) opposite to the mounting surface of the CPU 34. On the main control board 21, a metal having heat conductivity is integrally formed at the mounting position of the CPU 34, and a first heat transfer pattern 21 a for heat transfer is formed on the main control board 21 by this metal. . The first heat transfer pattern 21a is in an embedded state in which metal is exposed on both surfaces (front and back surfaces) of the circuit board 20. Heat from the CPU 34 is transferred to the first heat transfer pattern 21a.

  A metal having heat conductivity is integrally formed on a bottom surface portion of the lower cover 32 facing the base member 24, and a second heat transfer pattern 32c for heat transfer is formed on the lower cover 32 by this metal. Yes. The second heat transfer pattern 32 c is in an embedded state in which metal is exposed on both the inner and outer surfaces of the lower cover 32.

  The main control board 21 is positioned relative to the lower case 32 so that the first heat transfer pattern 21a and the second heat transfer pattern 32c face each other, and further, the semiconductor 35 and the second heat transfer pattern 32c face each other. It is positioned. And between the first heat transfer pattern 21a and the second heat transfer pattern 32c exposed on the back surface side of the circuit board 20, a heat conductive first heat transfer member 36 in contact with each is sandwiched, and the semiconductor 35 and the second heat transfer pattern Between the two heat transfer patterns 32c, a heat conductive first heat transfer member 37 in contact with each other is sandwiched. Therefore, the heat transferred to the first heat transfer pattern 21a is transferred to the second heat transfer pattern 32c via the first heat transfer member 36, and the heat transferred to the semiconductor 35 is transferred to the first heat transfer member. Heat is transferred to the second heat transfer pattern 32 c via 37.

  The depth dimension of the lower cover 32 is shorter than the dimension of the upper cover 31 in the depth direction. For this reason, when the upper cover 31 and the lower cover 32 are attached by locking the locking protrusion of the upper cover 31 and the fitting hole of the lower cover 32, the bottom surface portion of the lower cover 32 and the surface of the base member 24 are It is in a separated state. Thermally conductive second heat transfer members 38 that are in contact with each other are sandwiched between spaced apart portions of the second heat transfer pattern 32c and the base member 24. For this reason, the heat transferred to the second heat transfer pattern 32 c is transferred to the base member 24 via the second heat transfer member 38. In addition, the contact area of the second heat transfer member 38 is larger than the area of the second heat transfer pattern 32c, whereby heat can be efficiently transferred from the second heat transfer pattern 32c to the base member 24. it can.

  Since the base member 24 is formed of a heat conductive material and is separated from the main body 2a, the heat transferred to the base member 24 by the heat radiation space 39 formed thereby is radiated to the outside. Thereby, the heat radiated from the CPU 34 and the semiconductor 35 can be radiated to the outside.

  The first heat transfer members 36 and 37 and the second heat transfer member 38 are preferably made of a resin such as, for example, heat conductive silicon or heat conductive carbon black. Accordingly, the first heat transfer patterns 21a and 32a and the semiconductor 35 can be brought into close contact with each heat transfer member, and heat can be reliably transmitted. Further, as the first heat transfer patterns 21a and 32a, for example, a resin such as thermally conductive silicon or thermally conductive carbon black may be used.

  In the above embodiment, the first heat transfer member 36 in contact with the first heat transfer pattern 21a and the first heat transfer member 37 in contact with the semiconductor 35 are provided, but the first heat transfer member is provided only for one of them. May be.

  In the above embodiment, the substrate storage unit 22 of the present invention is applied to the pachinko machine 2, but may be applied to a slot machine. Hereinafter, an embodiment in which the present invention is applied to the slot machine 40 shown in FIG. 4 will be described, but the same members as those in the above embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted.

  The slot machine 40 includes a storage box 41 and a front door 42. The storage box 41 is formed in a box shape whose front surface is an opening. The front door 42 is attached to the storage box 41 by a hinge 43. Thereby, the inside of the storage box 41 is covered by the front door 42 so as to be freely opened and closed. The storage box 41 is partitioned into two upper and lower levels, and various devices are stored therein, such as a reel unit in the upper level and a hopper device in the lower level. In addition, a substrate storage unit 44 is attached to the upper wall 41a of the upper portion of the storage box 41.

  As shown in FIG. 5, the substrate storage unit 44 includes a substrate storage case 22 that stores the main control substrate 21 and a base member 45. The base member 45 is formed by bending a plate-like member like the base member 24, and includes a pair of flanges 45a formed at both ends thereof and a case attachment portion 45b to which the substrate storage case 22 is attached. . The flange 45a is provided with a hole through which the fixture 45c is inserted. When the fixture 45c is attached to the storage box 41 via the flange 45a, the base member 45 is fixed to the wall 41a of the storage box 41. When the base member 45 is attached, the case attaching portion 45b is separated from the wall 41a by the legs 45d at both ends thereof. Thereby, the board | substrate storage case 22 is attached in the position spaced apart from the wall 41a. A space surrounded by the base member 45 and the wall 41a is a heat radiating space 46 that radiates heat transferred from the electronic components mounted on the main control board 21. And in this embodiment, without providing the 2nd heat transfer member 38, the heat radiation hole 45e formed by notching and bending two places of the case attaching part 45b in a substantially U shape is provided. . The cutout pieces 45f formed thereby are bent to the side opposite to the attachment side of the substrate storage case 22. Thereby, the heat transferred to the second heat transfer pattern 32c can be dissipated from the heat radiation hole 45e to the heat radiation space 46, and the space (area) for heat radiation can be increased. The number of the heat radiation holes 45e may be an appropriate number, but the heat radiation effect can be enhanced as the number is increased. Further, the place where the substrate storage unit 44 is attached may be an appropriate place in the storage box 41.

  In the above embodiment, a pachinko machine has been described as an example of a gaming machine, but the present invention can also be applied to other gaming machines such as a slot machine.

It is a perspective view which shows the external appearance from the front side of a pachinko machine. It is a perspective view which shows the external appearance from the back side of a pachinko machine. It is sectional drawing of a board | substrate storage unit. It is a perspective view showing the appearance from the front side of the slot machine. It is sectional drawing of the board | substrate storage unit which provided the heat radiating hole in the base member.

Explanation of symbols

2 Pachinko machines (game machines)
2a Body 21 Main control board (circuit board)
21a CPU (electronic circuit component)
22 substrate storage unit 23 substrate storage case 24 base member 31 upper cover 32 lower cover 34 CPU (electronic circuit component)
35 Semiconductor (electronic circuit components)
36, 37 First heat transfer member 38 Second heat transfer member 40 Slot machine (game machine)

Claims (4)

A heat conductive material is embedded in the mounting portion of the electronic circuit component mounted on the one surface side so as to be exposed on both sides of the one surface side and the other surface side, and the heat conductive material is used for heat transfer. 1 a circuit board on which a heat transfer pattern is formed;
A board storage case in which a heat conductive material is embedded so as to be exposed inside and outside, a second heat transfer pattern for heat transfer is formed by the heat conductive material, and the circuit board is stored;
A thermally conductive base member fixed to the inside or the back of the gaming machine and attaching the substrate storage case so that the second heat transfer pattern is spaced apart;
A thermally conductive first heat transfer member disposed so as to be in contact with each of the first heat transfer pattern and the second heat transfer pattern exposed on the other surface side;
The board | substrate storage unit provided with the heat conductive 2nd heat transfer member arrange | positioned so that each of the said 2nd heat transfer pattern and the said base member may be contact | connected.   2. The board storage unit according to claim 1, wherein the first heat transfer member is provided so as to be in contact with each of the electronic circuit component mounted on the other surface side and the second heat transfer pattern.   3. The substrate storage unit according to claim 1, wherein a portion of the base member to which the substrate storage case is attached is separated from an attachment location of the base member of the gaming machine. A gaming machine comprising the board storage unit according to any one of claims 1 to 3.

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