JP2006310592A - Integrated circuit transfer table - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an IC transfer table keeping its insulating property over an extended time period. <P>SOLUTION: The member with an IC chip contacted is formed by a ceramics. Specifically, a steel table body 2, a ceramic absorption plate 3, and a positioning plate 4 are assembled. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an IC transfer table suitable for mounting and transferring an IC chip.

  Conventionally, an IC chip formed in a rectangular parallelepiped shape is known. This IC chip is also referred to as a bare chip or simply a chip, and various types such as TCP (Tape Carrier Package), COG (Chip On Glass), and COF (Chip On Film) in various optical panels such as a liquid crystal display panel. It is used as an electronic component for various products.

  By the way, in a mounting process for mounting an IC chip, for example, a COG process for mounting an IC chip on an optical panel, the IC chip stored in the chip tray is mounted on an IC transfer table waiting at an initial position by a suction arm. Then, after the IC chip mounted on the IC transfer table is transferred to the position where the crimping head is disposed in a state where the connection surface on which the IC chip terminals are arranged is sucked and held, the IC chip is sucked to the crimping head. In addition, the IC chip is transferred from the IC transfer table to the pressure bonding head by releasing the suction state of the IC chip by the IC transfer table, and then the IC transfer table is returned to the initial position, and the optical panel is moved by the panel transfer table. Transfer to the bottom of the crimping head, and then lower the crimping head It adapted to implement an IC chip in a predetermined position of the optical panel and.

  Since the conventional IC transfer table requires rigidity and insulation in order to attract and hold the IC chip, it is made of steel such as carbon steel for machine structure (S45C) and the surface is insulated by radiant treatment. And what formed the protective film which has corrosion resistance is used.

  However, in the conventional IC transfer table, when scratches or foreign matter adhere to the connection surface of the IC chip, if the IC mounting surface is cleaned with a solvent, the protective film is peeled off and contacts the contact surface of the IC chip. There is a problem that the metal surface may be exposed at the part to be damaged, and the IC chip may be electrically destroyed.

  The conventional IC transfer table is used by reprocessing the protective film, and it takes time to manage the state of the protective film, which is not easy to use.

  Further, when the protective coating is reprocessed, the IC transfer table attached to the transfer device must be replaced, and readjustment of the transfer device such as adjustment of the mounting position of the IC transfer table is required.

  Therefore, there is a need for an IC transfer table that can maintain insulation for a long period of time.

  The present invention has been made in view of this point, and an object of the present invention is to provide an IC transfer table capable of maintaining insulation for a long period of time.

  In order to achieve the above-described object, the IC transfer table according to claim 1 of the present invention is characterized in that an IC chip formed in a rectangular parallelepiped shape is mounted to transfer the IC chip. The member that abuts on is formed of ceramics.

  In the IC transfer table according to the present invention, a table body having a plate mounting surface, a flat plate shape, one surface being an IC mounting surface for sucking and holding the contact surface of the IC chip, the IC mounting table A suction plate attached to the table main body so that the back surface of the plate faces the plate mounting surface; and a flat rectangular plate that is disposed on the suction plate and has the suction plate A positioning plate attached to the table body, and the table body communicates with the vacuum forming path disposed inside and the vacuum forming path on the plate mounting surface. The suction plate has a suction hole with one end connected to the IC mounting surface and the other end connected to the communication port. The IC chip is arranged so that one side surface of the IC chip is brought into contact with one side surface thereof, and the upper surface of the positioning plate is in a state where the IC chip is mounted on the IC mounting surface. In this case, it is preferable that a lower position than the upper surface of the IC chip is held.

  The positioning plate is preferably disposed on the upstream side of the IC mounting surface in the transfer direction, and a mounting recess for mounting the positioning plate is formed on the suction plate. preferable.

  According to the IC transfer table of the present invention, the insulating property can be maintained for a long time by ceramics.

  The present invention will be described below with reference to embodiments shown in the drawings.

  1 to 3 show the main part of an embodiment of an IC transfer table according to the present invention, FIG. 1 is a schematic front view showing the main part of the overall configuration, FIG. 2 is a plan view of FIG. FIG. 3 is an enlarged side view of FIG.

  As shown in FIGS. 1 to 3, the IC transfer table 1 of this embodiment includes a table body 2, a suction plate 3, and a positioning plate 4.

  The table body 2 is formed in a substantially L-shaped flat plate having a long left and right direction in FIGS. 1 and 2 orthogonal to the transfer direction indicated by the thick arrow in FIG. The left side is a mounting portion 5 to a transfer device (not shown). As shown in FIG. 2, the mounting portion 5 is formed with a pair of positioning holes 6 for use in positioning to the transfer device so as to penetrate in the thickness direction shown in the vertical direction of FIG. . Further, on each side of each positioning hole 6 in the left-right direction in FIG. 2, through-holes penetrating in the thickness direction into which mounting bolts used for mounting to the transfer device, specifically hexagon socket head bolts (not shown), are inserted. 7 are formed. Further, counterbores 8 for embedding the bolt heads of the mounting bolts are formed on the lower surface side of each through hole 7 in FIG. Therefore, the table main body 2 of the IC transfer table 1 is attached to the upper surface side of FIG.

  The right side of the table body 2 in FIGS. 1 and 2 is a mounting portion 10 for the IC chip 9, and the upper surface of the mounting portion 10 is thicker than the upper surface of the mounting portion 5. Is formed thinly. The top surface of the mounting portion 10 is a flat plate mounting surface 11.

  As shown in FIGS. 1 and 2, a hole 13 for forming a vacuum forming path 12 is formed in the table body 2 so as to communicate with the right side surface from the left side surface in FIGS. 1 and 2. The right end of the hole 13 is closed by a plug 14. Further, one end of a vacuum hose (not shown) is connected to the left end portion of the punching hole 13, and the other end of the vacuum hose is connected to a vacuum pump via a valve. The state of the formation path 12 can be switched between a negative pressure state and an atmospheric pressure state. Further, the plate attachment surface 11 is formed with a communication port 15 that communicates with the vacuum forming path 12. Note that the shape and size of the communication port 15 can be set according to the necessity of the design concept or the like.

  The table body 2 is made of steel, more specifically, carbon steel for machine structure (S45C). In addition, as a raw material of the table main body 2, it can select and use as needed from the various metals which have rigidity, such as a design concept. The table body 2 is subjected to a plating process for improving corrosion resistance and aesthetics.

  A suction plate 3 is attached to the plate attachment surface 11 of the table body 2. The suction plate 3 is attached by suction plate mounting bolts 16 composed of two hexagon socket head bolts, and the bolt heads are embedded in the suction plate 3 by using hexagon socket head bolts. .

  The suction plate mounting bolt 16 can be selected from various types of bolts. However, it is possible to reliably and easily interfere with the IC chip 9 by preventing the bolt head from protruding from the upper surface of the suction plate 3. It is preferable in the sense that it can be prevented.

  Accordingly, the suction plate 3 is formed with two bolt mounting holes (not shown) having counterbores for embedding the bolt heads of the two suction plate mounting bolts 16, and the plate mounting surface of the table body 2. 11, a female screw (not shown) for screwing the two suction plate mounting bolts 16 is formed.

  The suction plate 3 is formed in a simple flat plate shape having a flat rectangular shape as a whole. The upper surface of the suction plate 3 is an IC mounting surface 17 on which the IC chip 9 is mounted. The rear surface of the IC mounting surface 17 is in contact with the plate mounting surface 11 of the table body 2. .

  A plurality of, in the present embodiment, three suction holes 18 are arranged along the left-right direction at substantially the center of the IC mounting surface 17. These suction holes 18 are formed so as to penetrate the suction plate 3 in the thickness direction shown in the vertical direction of FIG. 1, and the upper end is connected to the IC mounting surface 17 and the other end is attached to the plate of the table body 2. It is connected to a communication port 15 formed on the surface 11. Further, each suction hole 18 has a length in the longitudinal direction which is the length of the long side of the IC chip 9 so that the openings on the upper side of all the suction holes 18 can face the connection surface of the IC chip 9 used for transfer. It is formed shorter than this. Furthermore, it is more preferable that each suction hole 18 has an opening on the lower side of all the suction holes 18 disposed inside the communication port 15. In addition, in order to show the suction hole 18 clearly, each suction hole 18 is shown with the continuous line in FIG. In addition, the planar shape and number of the suction holes 18 can be changed as necessary according to the design concept and the like.

  A mounting recess 19 for mounting the positioning plate 4 is formed on the upper side of FIG. 2 from the formation position of the suction hole 18 in the IC mounting surface 17 as shown in FIG. The mounting recess 19 is formed from the left side to the right side of the suction plate 3. The mounting recess 19 may be a groove. Moreover, the recessed part 19 for attachment should just be provided as needed, such as a design concept. However, by providing the mounting recess 19, the stepped portion 20 connecting the mounting recess 19 and the IC mounting surface 17 moves in the transfer direction when the positioning plate 4 is attached to the suction plate 3, specifically the upstream side in the transfer direction. Since the positioning can be performed, it is preferable to provide the mounting recess 19 in the sense that the assembly work of the IC transfer table 1 can be easily performed.

  The adsorption plate 3 is made of ceramics made of alumina, which is excellent in rigidity, insulation, corrosion resistance, wear resistance and heat resistance, and strong against chemical action of acidic and basic substances. The IC mounting surface 17 excluding the mounting recess 19 is a precise smooth surface by lapping or the like because the connection surface (suction part) of the IC chip 9 is in contact.

  The ceramic material may be any material that has excellent rigidity, insulation, corrosion resistance, wear resistance, heat resistance and chemical resistance, and can be selected from various materials such as alumina, zirconia, silicon nitride and silicon carbide. can do.

  Further, when the IC chip 9 is sucked and held on the IC mounting surface 17 between the plate mounting surface 11 of the table body 2 and the back surface of the suction plate 3, outside air enters the vacuum forming path 12 from the communication port 15. A gasket for preventing vacuum leakage may be provided.

  The positioning plate 4 is attached to the mounting recess 19 of the suction plate 3. The positioning plate 4 is formed in a simple shape of a flat horizontally long flat plate. Further, the positioning plate 4 is attached to the table body 2 with the suction plate 3 sandwiched between them by positioning plate mounting bolts 21 made of two countersunk screws. It is embedded in the positioning plate 4.

  Therefore, the positioning plate 4 is formed with two bolt mounting holes having counterbores for embedding the bolt heads of the two positioning plate mounting bolts 21.

  The positioning plate mounting bolt 21 can be selected from various types of bolts. However, the configuration in which the bolt head does not protrude from the upper surface of the positioning plate 4 reliably and easily prevents interference with the crimping head. It is preferable in the sense that it can be.

  Further, the suction plate 3 is fastened together by screwing the tip of the positioning plate mounting bolt 21 to the table body 2, and the suction plate 3 substantially includes the suction plate mounting bolt 16 and the positioning plate mounting bolt 21. A total of four bolts are attached to the table body 2.

  That is, the suction plate 3 is formed with two insertion holes through which the two positioning plate mounting bolts 21 are inserted, and the two positioning plate mounting bolts 21 are screwed into the plate mounting surface 11 of the table body 2. Bolt holes (not shown) for wearing are formed.

  The positioning plate 4 can be attached to and detached from the mounting recess 19 of the suction plate 3 by attaching and detaching the two positioning plate mounting bolts 21 and the two suction plate mounting bolts 16 are further attached and detached. Thus, the suction plate 3 can be attached to and detached from the plate mounting surface 11 of the table body 2.

  The positioning plate 4 is attached to the IC mounting surface 17 at a lower portion of one long side located on the lower side of FIG. 2 among two opposing long sides shown on the upper side and the lower side of FIG. Positioning in the transfer direction is performed by abutting against a stepped portion 20 that connects the concave portion 19 for use. Then, the upper part of the side surface on one long side located on the lower side of FIG. 2 is brought into contact with the side surface on one long side of the IC chip 9, whereby the IC chip 9 mounted on the IC mounting surface 17. Positioning on the upstream side in the transfer direction is performed.

  That is, as shown in FIG. 3, the side surface on the long side of the positioning plate 4 is a receiving surface 22 that receives the side surface of the IC chip 9.

  The positioning plate 4 is provided with mounting holes for the suction plate mounting bolts 16 so that the two opposite long side surfaces located on the upper and lower sides of FIG. Has been. As a result, the two side surfaces of the positioning plate 4 can be used as the receiving surfaces 22, respectively, so that the life of the positioning plate 4 can be extended.

  Therefore, in the IC transfer table 1 of this embodiment, both the suction plate 3 and the positioning plate 4 that are members with which the IC chip 9 abuts are formed of ceramics.

  Next, the operation of the present embodiment having the above-described configuration will be described.

  According to the IC transfer table 1 of the present embodiment, since the suction plate 3 and the positioning plate 4 as members against which the IC chip 9 abuts are formed of ceramics, there is no problem with the IC mounting surface 17 and the receiving surface 22 due to the solvent. Can be cleaned without any problems. As a result, it is possible to reliably prevent the connection surface of the IC chip 9 from being scratched or having foreign matter attached thereto.

  Further, according to the IC transfer table 1 of the present embodiment, since the suction plate 3 and the positioning plate 4 as members against which the IC chip 9 abuts are formed of ceramics, the IC mounting surface 17 and the receiving surface 22 are made of a solvent. Even if it is cleaned, abnormalities such as peeling of the protective coating on the conventional IC transfer table do not occur, and rigidity, insulation, corrosion resistance, wear resistance, heat resistance and chemical resistance can be ensured for a long period of time.

  Therefore, according to the IC transfer table 1 of this embodiment, insulation can be maintained for a long time.

  Furthermore, according to the IC transfer table 1 of the present embodiment, maintenance such as reprocessing of the protective film in the conventional IC transfer table is not required, so that the usability is improved and the running cost can be reduced.

  Further, according to the IC transfer table 1 of the present embodiment, it is not necessary to replace the IC transfer table accompanying the reprocessing of the protective film in the conventional IC transfer table, so the readjustment of the accuracy of the transfer device at the time of conventional replacement Is no longer required, and maintenance and management of the transfer device can be easily performed.

  Further, according to the IC transfer table 1 of the present embodiment, since it is formed by assembling the table main body 2, the suction plate 3 and the positioning plate 4, the suction plate 3 and the positioning plate which are parts where the IC chip 9 abuts. 4 may be a simple shape of a flat rectangular plate. Then, by simplifying the shapes of the suction plate 3 and the positioning plate 4, the suction plate 3 and the positioning plate 4 can be easily formed by ceramic mixing. Furthermore, by forming the table body 2 from steel, the vacuum forming path 12 that is difficult to process with ceramics can be easily formed.

  In addition, according to the IC transfer table 1 of the present embodiment, the suction plate 3 and the positioning plate 4 have a simple shape of a flat rectangular plate, so that the processing of the suction holes 18 and the like can be easily performed on ceramics. Can do.

  Further, according to the IC transfer table 1 of the present embodiment, since the positioning plate 4 is attached to the IC mounting surface 17 of the suction plate 3, the plate mounting surface 11 of the table body 2 and the suction plate around the communication port 15. The contact area with the back surface of 3 can be increased. As a result, when the IC chip 9 is sucked and held on the IC mounting surface 17, the outside air passes through the communication port 15 from the contact portion between the plate mounting surface 11 of the table body 2 and the back surface of the suction plate 3, and the vacuum forming path 12. It is possible to reliably prevent a so-called vacuum leak that enters the space. On the other hand, when the suction plate 3 is directly attached to the table body 2, the suction hole 18 and the side surface of the positioning plate 4 on the lower side in FIG. 2 are close to each other, and the opening of the communication port 15 is the suction plate. 3 and the positioning plate 4 are straddled, so that a vacuum leak is likely to occur.

  Further, according to the IC transfer table 1 of the present embodiment, since the positioning plate 4 is disposed on the upstream side of the IC mounting surface 17 in the transfer direction, the IC chip 9 is sucked and held in the transfer direction. Even if the IC chip 9 tries to move to the upstream side in the transfer direction due to an acceleration applied momentarily when moving, the IC chip 9 can be reliably received by the receiving surface 22 of the positioning plate 4. it can. That is, it is possible to prevent the IC chip 9 mounted on the IC mounting surface 17 from dropping from the transfer table when the IC transfer table 1 is operated.

  Further, according to the IC transfer table 1 of the present embodiment, the mounting recess 19 for mounting the positioning plate 4 is formed in the suction plate 3, so that the positioning plate 4 can be mounted on the IC mounting surface 17 of the suction plate 3. The mounting position can be easily positioned.

  That is, the positioning plate 4 can be easily attached to the suction plate 3.

  The present invention can be used as a table that requires insulation and wear resistance.

  In addition, this invention is not limited to embodiment mentioned above, A various change is possible as needed. For example, by using a static eliminating blower in combination with the IC transfer table, it is possible to further obtain an effect of preventing electrical damage to the IC chip.

The typical front view showing the important section of the embodiment of the IC transfer table concerning the present invention Plan view of FIG. Expanded side view of FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 IC transfer table 2 Table main body 3 Suction plate 4 Positioning plate 9 IC chip 11 Plate mounting surface 12 Vacuum forming path 15 Communication port 17 IC mounting surface 18 Suction hole 19 Mounting recess 20 Step portion 22 Receiving surface

Claims (4)

In an IC transfer table for mounting and transferring an IC chip formed in a rectangular parallelepiped shape,
An IC transfer table, wherein a member with which the IC chip abuts is formed of ceramics. A table body having a plate mounting surface;
Formed in a flat plate shape, one surface is an IC mounting surface for attracting and holding the contact surface of the IC chip, and the IC mounting surface is attached to the table main body so as to face the plate mounting surface. A suction plate,
A flat rectangular plate, and a positioning plate disposed on the suction plate and attached to the table body via the suction plate;
The table body has a vacuum forming path disposed therein, and a communication port provided on the plate mounting surface so as to communicate with the vacuum forming path,
The suction plate has a suction hole with one end connected to the IC mounting surface and the other end connected to the communication port;
The positioning plate is disposed so that one side surface of the IC chip is in contact with one side surface thereof, and the IC chip is mounted on the IC mounting surface on the upper surface of the positioning plate. 2. The IC transfer table according to claim 1, wherein the IC transfer table is formed so as to hold a position lower than an upper surface of the IC chip in a state.   The IC transfer table according to claim 2, wherein the positioning plate is disposed upstream of the IC mounting surface in the transfer direction.   The IC transfer table according to claim 2 or 3, wherein a mounting recess for mounting the positioning plate is formed on the suction plate.

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