JP2006309175A - In-mold molding label and molded product using the same - Google Patents
In-mold molding label and molded product using the same Download PDFInfo
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- JP2006309175A JP2006309175A JP2006073758A JP2006073758A JP2006309175A JP 2006309175 A JP2006309175 A JP 2006309175A JP 2006073758 A JP2006073758 A JP 2006073758A JP 2006073758 A JP2006073758 A JP 2006073758A JP 2006309175 A JP2006309175 A JP 2006309175A
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- resin
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- mold molding
- heat seal
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- Granted
Links
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- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
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Landscapes
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
Description
本発明は、印刷面の仕上がりが高精細であるインモールド成形に用いるラベルに関する。また本発明は、該ラベルを貼着したラベル付き成形品に関する。 The present invention relates to a label used for in-mold molding with a high-definition printed surface finish. Moreover, this invention relates to the molded article with a label which stuck this label.
従来から、ラベルが貼着した樹脂成形体を一体成形によって製造する方法として、インモールド成形法が知られている。この方法は、金型の内壁に予めラベルを装着しておき、ポリエチレン樹脂やポリプロピレン樹脂などの成形用樹脂を溶融して該金型内に直接供給し、射出成形、中空成形、差圧成形または発泡成形などで成形するとともにラベルを貼着するものであり、例えば、特許文献１、特許文献２に開示されている。この様なインモールド成形用ラベルとしては、グラビア印刷された樹脂フィルム、オフセット多色印刷された合成紙が例えば、特許文献３、特許文献４に開示さあれており、或いは、アルミニウム箔の裏面に高圧法低密度ポリエチレン、エチレン・酢酸ビニル共重合体などをラミネートし、その箔の表面にグラビア印刷したアルミニウムラベルなどが知られている。 Conventionally, an in-mold molding method is known as a method of manufacturing a resin molded body with a label attached thereto by integral molding. In this method, a label is attached to the inner wall of a mold in advance, and a molding resin such as polyethylene resin or polypropylene resin is melted and directly supplied into the mold, and injection molding, hollow molding, differential pressure molding or It is formed by foam molding or the like and is attached with a label. For example, it is disclosed in Patent Document 1 and Patent Document 2. As such an in-mold molding label, a gravure-printed resin film, an offset multicolor-printed synthetic paper are disclosed in, for example, Patent Document 3 and Patent Document 4, or on the back surface of an aluminum foil. A high pressure method low density polyethylene, an ethylene / vinyl acetate copolymer, etc. are laminated, and an aluminum label or the like obtained by gravure printing on the foil surface is known.
しかしながら、これらのインモールド成形用ラベルを用いてインモールド成形により加飾されたラベル貼合成形品を製造する方法においては、ラベルのヒートシール層樹脂として高圧法低密度ポリエチレンを用いたものは、成形品の素材が高密度ポリエチレン成形品の場合はラベルと成形品の密着性が強固で良好であるが成形品の素材がポリプロピレンやポリスチレン等の他素材である場合は、ラベルと成形品の密着性が低く、輸送途中にラベルが成形品より剥がれてしまうといった欠点があった。ラベルと成形品の密着性を強固とするには、成形品と同素材の樹脂をラベルのヒートシール層として用いたラベルを各々用意する必要があり、ラベルの在庫管理が複雑化するといった問題や、成形品の成形温度が低いと成形品とラベルに十分な密着強度が得られず、それ故成形品の成形温度を高く設定する必要があり成形品の成形温度が極端に限定され生産性が低下するといった問題も指摘されている。
さらにラベルに印刷を施す際、例えばグラビア印刷で印刷層表面に網点印刷した場合、印刷層の表面が粗過ぎるとインキ抜けが多く発生し、印刷外観が著しく低下するといった問題があった。
However, in the method of producing a label-attached composite product decorated by in-mold molding using these in-mold molding labels, the one using high-pressure low-density polyethylene as the heat seal layer resin of the label is If the material of the molded product is a high-density polyethylene molded product, the adhesion between the label and the molded product is strong and good, but if the material of the molded product is another material such as polypropylene or polystyrene, the adhesion between the label and the molded product There is a drawback that the label is peeled off from the molded product during transportation. In order to strengthen the adhesiveness between the label and the molded product, it is necessary to prepare each label using a resin of the same material as the molded product as a heat seal layer for the label. If the molding temperature of the molded product is low, sufficient adhesion strength between the molded product and the label cannot be obtained. Therefore, it is necessary to set the molding temperature of the molded product high, and the molding temperature of the molded product is extremely limited, resulting in increased productivity. The problem of a decline is also pointed out.
Further, when printing on the label, for example, when halftone printing is performed on the surface of the printing layer by gravure printing, there is a problem that if the surface of the printing layer is too rough, a lot of ink is lost and the printed appearance is remarkably deteriorated.
本発明は、成形品の素材を問わずラベルと成形品の密着が強固で、また広範囲の成形品成形条件に対応可能で、且つ印刷の仕上がり性に優れたインモールド成形用ラベルを提供することを目的とする。 The present invention provides an in-mold molding label that has strong adhesion between a label and a molded product regardless of the material of the molded product, can cope with a wide range of molding conditions, and has excellent printing finish. With the goal.
本発明者らは、上記問題に鑑みて鋭意研究を重ねた結果、ラベルのヒートシール層が特定の表面開口率である多孔質表面であり、且つ印刷層に網点印刷した際のドットスキップが特定率以下の平滑な表面とすることで、ヒートシール層には成形品樹脂が成形時の圧力でヒートシール層の表面開口部に入り込む投錨効果が得られる為、成形品の素材を問わずラベルと成形品との密着が強固であり、さらに広範囲の成形品成形条件でラベルの貼合が可能であり、且つ印刷層の印刷仕上がり性が優れるとの知見を得て本発明を完成するに至った。
即ち本発明は、ヒートシール層と印刷層を含む少なくとも２層の樹脂フィルムからなるインモールド成形用ラベルであって、該ヒートシール層が熱可塑性樹脂（Ａ）と無機微細粉末（Ｂ）及び／又は有機フィラー（Ｂ’）を含有した少なくとも１軸方向に延伸された表面開孔率が６〜３０％の多孔質層であり、且つ該印刷層が網点印刷した際のドットスキップが５％以下であり、ベック平滑度が６５０〜２００００秒以下であることを特徴とするインモールド成形用ラベルを提供するものである。
As a result of intensive studies in view of the above problems, the inventors of the present invention have a porous surface where the heat seal layer of the label has a specific surface opening ratio, and dot skipping when halftone printing is performed on the printing layer. By making the surface smooth with a specific rate or less, the heat seal layer has a throwing effect that allows the molded product resin to enter the surface opening of the heat seal layer with the pressure during molding. And the molded product is strong, the label can be bonded under a wide range of molded product molding conditions, and the printing finish of the printed layer is excellent, resulting in the completion of the present invention. It was.
That is, the present invention is an in-mold label comprising at least two resin films including a heat seal layer and a print layer, wherein the heat seal layer comprises a thermoplastic resin (A), an inorganic fine powder (B) and / or Or a porous layer containing an organic filler (B ′) and extending in at least one axial direction and having a surface area ratio of 6 to 30%, and the dot skip when the printed layer is halftone printed is 5% The present invention provides an in-mold molding label characterized in that the Beck smoothness is 650 to 20000 seconds or less.
本発明により、印刷面の仕上がり性に優れ、且つ印刷が高精細であるインモールド成形が可能であり、成形品の素材を問わずラベルと成形品との密着が強固であり、さらに広範囲の成形品成形条件でラベルの貼合が可能であり、かつ、インモールド成形後の成形品の外観も良好であるインモールド成形用ラベル及びそれを用いた成形品が得られた。 According to the present invention, in-mold molding with excellent print surface finish and high-definition printing is possible, the adhesion between the label and the molded product is strong regardless of the material of the molded product, and a wider range of molding A label for in-mold molding and a molded article using the same were obtained, in which the label can be bonded under the product molding conditions and the appearance of the molded product after in-mold molding is good.
本発明のインモールド成形用ラベルについてさらに詳細に説明する。
・ヒートシール層
［１］熱可塑性樹脂（Ａ）
本発明のヒートシール層に用いられる熱可塑性樹脂素材としては、ポリプロピレン系樹脂、高密度ポリエチレン、中密度ポリエチレン、直鎖線状低密度ポリエチレンなどの結晶性ポリオレフィン系樹脂、エチレン・酢酸ビニル共重合体、エチレン・アクリル酸共重合体、エチレン・アクリル酸アルキルエステル共重合体、エチレン・メタクリル酸アルキルエステル共重合体（アルキル基の炭素数は１〜８）、エチレン・メタクリル酸共重合体の金属塩、ポリ４−メチル−１−ペンテン、エチレン−環状オレフィン共重合体等の結晶性ポリオレフィン系樹脂、ポリエチレンテレフタレート樹脂、ポリ塩化ビニル樹脂、ナイロン−６、ナイロン−６，６、ナイロン−６，１０、ナイロン−６，１２等のポリアミド系樹脂、ＡＢＳ樹脂、アイオノマー樹脂等のフィルムを挙げることができるが、好ましくはポリプロピレン系樹脂、高密度ポリエチレン、ポリエチレンテレフタレート樹脂等の融点が１３０〜２８０℃の範囲の熱可塑性樹脂であり、これらの樹脂は２種以上混合して用いることもできる。
The in-mold label according to the present invention will be described in more detail.
Heat seal layer [1] Thermoplastic resin (A)
Examples of the thermoplastic resin material used in the heat seal layer of the present invention include polypropylene resins, high density polyethylene, medium density polyethylene, crystalline polyolefin resins such as linear linear low density polyethylene, ethylene / vinyl acetate copolymers, Ethylene / acrylic acid copolymer, ethylene / acrylic acid alkyl ester copolymer, ethylene / methacrylic acid alkyl ester copolymer (the alkyl group has 1 to 8 carbon atoms), ethylene / methacrylic acid copolymer metal salt, Crystalline polyolefin resin such as poly-4-methyl-1-pentene, ethylene-cycloolefin copolymer, polyethylene terephthalate resin, polyvinyl chloride resin, nylon-6, nylon-6,6, nylon-6,10, nylon -6,12 polyamide resin, ABS resin, ionomer Examples of the resin include films such as resins, preferably polypropylene resins, high-density polyethylene, polyethylene terephthalate resins and the like, which are thermoplastic resins having a melting point in the range of 130 to 280 ° C., and these resins are mixed in two or more kinds. Can also be used.
これらの中でも、耐薬品性や生産コスト等の観点より、結晶性ポリオレフィン系樹脂を用いることが好ましく、ポリプロピレン系樹脂、高密度ポリエチレンを用いることがより好ましい。結晶性ポリオレフィン系樹脂は、結晶性を示すものであり、その結晶化度は、通常２０％以上が好ましく、３５〜７５％がより好ましい。結晶性を示すものを用いれば、延伸により樹脂フィルム表面に空孔（開口）が十分に形成されるため好ましい。該結晶化度はＸ線回折、赤外線スペクトル分析等の方法によって測定することができる。
ポリプロピレン系樹脂としては、プロピレンを単独重合させたアイソタクティック重合体またはシンジオタクティック重合体を用いることが好ましい。また、エチレン、１−ブテン、１−ヘキセン、１−ヘプテン、４−メチル−１−ペンテン等のα−オレフィンとプロピレンとを共重合させた様々な立体規則性を有するプロピレンを主成分とする共重合体を使用することもできる。共重合体は２元系でも３元系以上の多元系でもよく、またランダム共重合体でもブロック共重合体でもよい。
本発明のヒートシール層としての樹脂フィルムにおける熱可塑性樹脂（Ａ）の含有量は、通常２０〜５０重量％、好ましくは２５〜５０重量％、特に好ましくは３５〜５０重量％である。熱可塑性樹脂（Ａ）の含有量が５０重量％を超えると、所望の表面開口率が得られずにインモールド成形で成形品とラベル密着改善が不十分になる傾向がある。逆に２０重量％未満だと、延伸が困難になる傾向がある。
Among these, from the viewpoint of chemical resistance and production cost, it is preferable to use a crystalline polyolefin resin, and it is more preferable to use a polypropylene resin or high density polyethylene. The crystalline polyolefin resin exhibits crystallinity, and the crystallinity thereof is usually preferably 20% or more, and more preferably 35 to 75%. It is preferable to use a material exhibiting crystallinity because the pores (openings) are sufficiently formed on the surface of the resin film by stretching. The crystallinity can be measured by methods such as X-ray diffraction and infrared spectrum analysis.
As the polypropylene resin, it is preferable to use an isotactic polymer or a syndiotactic polymer obtained by homopolymerizing propylene. Copolymers mainly composed of propylene having various stereoregularities obtained by copolymerizing propylene with α-olefins such as ethylene, 1-butene, 1-hexene, 1-heptene and 4-methyl-1-pentene. Polymers can also be used. The copolymer may be a binary system or a ternary or higher multi-element system, and may be a random copolymer or a block copolymer.
The content of the thermoplastic resin (A) in the resin film as the heat seal layer of the present invention is usually 20 to 50% by weight, preferably 25 to 50% by weight, particularly preferably 35 to 50% by weight. When the content of the thermoplastic resin (A) exceeds 50% by weight, the desired surface opening ratio cannot be obtained, and the intimate improvement of the molded product and the label tends to be insufficient. Conversely, when it is less than 20% by weight, stretching tends to be difficult.
［２］無機微細粉末（Ｂ）、有機フィラー（Ｂ’）
本発明のヒートシール層に用いられる無機微細粉末及び／又は有機フィラーの種類は特に限定されない。無機微細粉末としては、重質炭酸カルシウム、軽質炭酸カルシウム、焼成クレー、タルク、硫酸バリウム、珪藻土、酸化マグネシウム、酸化亜鉛、酸化チタン、酸化珪素などが挙げられ、またこれらは脂肪酸等で表面処理されていても良い。なかでも、重質炭酸カルシウム、焼成クレー、タルクが、安価で成形性が良く好ましい。
本発明のヒートシール層としての樹脂フィルムにおける無機微細粉末（Ｂ）の含有量は、通常５０〜８０重量％、好ましくは５０〜７５重量％、特に好ましくは５０〜６５重量％である。無機微細粉末（Ｂ）の含有量が８０重量％を超えると、延伸が困難になる傾向がある。逆に５０重量％未満だと、所望の表面開口率が得られずにインモールド成形で成形品とラベル密着改善が不十分になる傾向がある。
[2] Inorganic fine powder (B), organic filler (B ′)
The kind of the inorganic fine powder and / or organic filler used in the heat seal layer of the present invention is not particularly limited. Examples of inorganic fine powders include heavy calcium carbonate, light calcium carbonate, calcined clay, talc, barium sulfate, diatomaceous earth, magnesium oxide, zinc oxide, titanium oxide, and silicon oxide. These are surface-treated with fatty acids. May be. Of these, heavy calcium carbonate, calcined clay, and talc are preferable because they are inexpensive and have good moldability.
The content of the inorganic fine powder (B) in the resin film as the heat seal layer of the present invention is usually 50 to 80% by weight, preferably 50 to 75% by weight, and particularly preferably 50 to 65% by weight. When the content of the inorganic fine powder (B) exceeds 80% by weight, stretching tends to be difficult. On the other hand, if it is less than 50% by weight, the desired surface opening ratio cannot be obtained, and there is a tendency that in-mold molding does not sufficiently improve the adhesion between the molded product and the label.
有機フィラー（Ｂ’）としては、ポリエチレンテレフタレート、ポリブチレンテレフタレート、ポリアミド、ポリカーボネート、ポリエチレンナフタレート、ポリスチレン、メラミン樹脂、ポリエチレンサルファイト、ポリイミド、ポリエチルエーテルケトン、ポリエーテルエーテルケトン、ポリフェニレンサルファイト、ポリ−４−メチル−１−ペンテン、ポリメチルメタクリレート、環状オレフィンの単独重合体や環状オレフィンとエチレンとの共重合体等で、融点が１２０〜３００℃、ないしはガラス転移温度が１２０〜２８０℃を有するものなどが挙げられる。上記の無機微細粉末及び／又は有機フィラーの中から１種を選択してこれを単独で使用してもよいし、２種以上を組み合わせて使用してもよい。 As the organic filler (B ′), polyethylene terephthalate, polybutylene terephthalate, polyamide, polycarbonate, polyethylene naphthalate, polystyrene, melamine resin, polyethylene sulfite, polyimide, polyethyl ether ketone, polyether ether ketone, polyphenylene sulfite, poly- 4-methyl-1-pentene, polymethylmethacrylate, a cyclic olefin homopolymer, a copolymer of cyclic olefin and ethylene, etc., having a melting point of 120 to 300 ° C. or a glass transition temperature of 120 to 280 ° C. Etc. One of these inorganic fine powders and / or organic fillers may be selected and used alone, or two or more may be used in combination.
［３］分散剤（Ｃ）
本発明のヒートシール層には、必要により分散剤を添加することが可能であり、例えば、酸変性ポリオレフィン、シラノール変性ポリオレフィンなどを例示することができる。この中でも酸変性ポリオレフィンを用いることが好ましい。酸変性ポリオレフィンとしては、無水マレイン酸をランダム共重合もしくはグラフト共重合した無水カルボン酸基含有ポリオレフィン、あるいはメタクリル酸、アクリル酸などの不飽和カルボン酸をランダム共重合もしくはグラフト共重合したカルボン酸基含有ポリオレフィン、グリシジルメタクリレートをランダム共重合もしくはグラフト共重合したエポキシ基含有ポリオレフィンなどが挙げられる。具体例としては、無水マレイン酸変性ポリプロピレン、無水マレイン酸変性ポリエチレン、アクリル酸変性ポリプロピレン、エチレン・メタクリル酸ランダム共重合体、エチレン・グリシジルメタクリレートランダム共重合体、エチレン・グリシジルメタクリレートグラフト共重合体、グリシジルメタクリレート変性ポリプロピレンなどが挙げられ、なかでも好ましくは無水マレイン酸変性ポリプロピレンおよび無水マレイン酸変性ポリエチレンである。
[3] Dispersant (C)
If necessary, a dispersant can be added to the heat seal layer of the present invention, and examples thereof include acid-modified polyolefin and silanol-modified polyolefin. Among these, it is preferable to use acid-modified polyolefin. The acid-modified polyolefin includes a carboxylic anhydride group-containing polyolefin obtained by random copolymerization or graft copolymerization of maleic anhydride, or a carboxylic acid group containing random copolymerization or graft copolymerization of an unsaturated carboxylic acid such as methacrylic acid or acrylic acid. Examples thereof include polyolefin and epoxy group-containing polyolefin obtained by random copolymerization or graft copolymerization of glycidyl methacrylate. Specific examples include maleic anhydride modified polypropylene, maleic anhydride modified polyethylene, acrylic acid modified polypropylene, ethylene / methacrylic acid random copolymer, ethylene / glycidyl methacrylate random copolymer, ethylene / glycidyl methacrylate graft copolymer, glycidyl. Examples include methacrylate-modified polypropylene, among which maleic anhydride-modified polypropylene and maleic anhydride-modified polyethylene are preferable.
無水マレイン酸変性ポリプロピレンおよび無水マレイン酸変性ポリエチレンの具体例としては、三菱化学（株）のモディックＡＰ[P513V]（商品名）やモディックＡＰ[M513]（商品名）、三洋化成工業（株）のYumex1001、1010（商品名）やYumex2000（商品名）、三井・デュポンポリケミカル（株）のＨＰＲ[VR101]（商品名）が挙げられる。
酸変性ポリオレフィンの酸変性率は、０．０１〜２０％が好ましく、０．０５〜１５％がより好ましく、０．１〜１０％がさらに好ましい。 酸変性率が０．０１％未満では、表面処理した無機微細粉末の熱可塑性樹脂中への分散効果が不十分になる傾向があり、２０％を超えると酸変性ポリオレフィンの軟化点が低くなりすぎて熱可塑性樹脂との混合が困難になる傾向がある。
Specific examples of maleic anhydride-modified polypropylene and maleic anhydride-modified polyethylene include: Modic AP [P513V] (trade name), Modic AP [M513] (trade name) of Mitsubishi Chemical Corporation, Sanyo Chemical Industries, Ltd. Examples include Yumex1001, 1010 (trade name), Yumex2000 (trade name), and HPR [VR101] (trade name) from Mitsui DuPont Polychemical Co., Ltd.
The acid modification rate of the acid-modified polyolefin is preferably 0.01 to 20%, more preferably 0.05 to 15%, and still more preferably 0.1 to 10%. If the acid modification rate is less than 0.01%, the dispersion effect of the surface-treated inorganic fine powder in the thermoplastic resin tends to be insufficient, and if it exceeds 20%, the softening point of the acid-modified polyolefin becomes too low. Therefore, mixing with thermoplastic resin tends to be difficult.
・印刷層
本発明の印刷層は、少なくとも熱可塑性樹脂を含む層である。印刷層の素材としては、特に限定されず、ヒートシ−ル層の項で前述した熱可塑性樹脂（Ａ）、無機微細粉末（Ｂ）及び／又は有機フィラー（Ｂ’）、分散剤（Ｃ）等を任意に配合して所望の平滑な表面とすることが可能で、特に好ましい配合としては、熱可塑性樹脂にはポリプロピレン系樹脂としてのプロピレン単独重合体またはプロピレン共重合体、ポリエチレン系樹脂としての高密度ポリエチレンの両者を組み合わせた配合が好ましく使用できる。
プロピレン単独重合体またはプロピレン共重合体と高密度ポリエチレンの配合比率としては４対６から６対４が好ましく、５対５が更に好ましい。プロピレン単独重合体またはプロピレン共重合体の比率が多過ぎると印刷層の平滑度が高過ぎて印刷物の耐擦過性が劣る傾向にあり、また高密度ポリエチレンの配合比が多過ぎると印刷層の平滑度が低過ぎてドッドスキップ不良が発生しやすい。
-Print layer The print layer of this invention is a layer containing a thermoplastic resin at least. The material for the printing layer is not particularly limited, and is the thermoplastic resin (A), inorganic fine powder (B) and / or organic filler (B ′), dispersant (C), etc. described above in the section of the heat seal layer. Can be arbitrarily blended to obtain a desired smooth surface, and as a particularly preferred blend, a thermoplastic resin includes a propylene homopolymer or propylene copolymer as a polypropylene resin, and a high level as a polyethylene resin. A combination of both density polyethylenes can be preferably used.
The blending ratio of propylene homopolymer or propylene copolymer and high density polyethylene is preferably 4 to 6 to 6 to 4, and more preferably 5 to 5. If the proportion of propylene homopolymer or propylene copolymer is too large, the smoothness of the printed layer tends to be too high and the scratch resistance of the printed matter tends to be inferior. If the blending ratio of high-density polyethylene is too large, the printed layer is smooth. The degree is too low to easily cause a dod skip defect.
本発明の印刷層は、網点柄を印刷した際のドットスキップ（網点の一部が印刷層に転写しない現象）が５％以下であることが好ましく、０〜３％であることがより好ましい。また該印刷層のベック平滑度（ＪＩＳ−Ｐ−８１１９）としては６５０〜２００００秒であることが好ましく、７００〜５０００秒であることがより好ましい。ベック平滑度が６５０秒未満であると、例えば、グラビア印刷で網点柄を印刷した際のドットスキップ（網点の一部が印刷面に転移しない現象）が５％を越えて印刷外観が著しく低下する為実用上問題となる。また２００００秒を越えると印刷物の耐擦過性が不足しインキが脱落する傾向にあり実用上問題となる。
また、本発明では、印刷層の表面に、鏡面または梨地等の加工が施されたロールで加熱圧着処理することで、印刷層を目的とする平滑度にすることもできる。
The printed layer of the present invention preferably has a dot skip (a phenomenon in which part of the halftone dots are not transferred to the printed layer) of 5% or less when printing a halftone dot pattern, more preferably 0 to 3%. preferable. Further, the Beck smoothness (JIS-P-8119) of the printed layer is preferably 650 to 20000 seconds, and more preferably 700 to 5000 seconds. If the Beck smoothness is less than 650 seconds, for example, the dot skip (a phenomenon in which part of the halftone dots do not transfer to the printing surface) exceeds 5% when printing a halftone dot pattern by gravure printing, and the printed appearance is remarkable. Since it falls, it becomes a problem in practical use. On the other hand, if it exceeds 20000 seconds, the scratch resistance of the printed matter is insufficient and the ink tends to fall off, which is a practical problem.
Further, in the present invention, the desired smoothness of the printed layer can be achieved by subjecting the surface of the printed layer to a thermocompression-bonding treatment with a roll having a mirror surface or a satin finish.
・任意成分
本発明の樹脂フィルムでは、任意成分として目的とするヒートシール性や印刷性等を阻害しない範囲で公知の他の樹脂用添加剤を任意に添加することができる。該添加剤としては、脂肪酸アミドなどのスリップ剤、アンチブロッキング剤、染料、可塑剤、離型剤、酸化防止剤、難燃剤、紫外線吸収剤等を挙げることができる。
・コア層、中間層
本発明の樹脂フィルムでは、印刷時の寸法安定性、ラベルの金型内への供給性、熱収縮防止性などの面からヒートシール層と印刷層の間にコア層または中間層を設けても良く、例えば、印刷層／コア層／ヒートシール層、印刷層／コア層／中間層／ヒートシール層、印刷層／中間層／コア層／中間層／ヒートシール層といった構成を例示することが出来る。
-Arbitrary component In the resin film of this invention, the well-known other additive for resin can be arbitrarily added in the range which does not inhibit the target heat seal property, printability, etc. as an arbitrary component. Examples of the additive include slip agents such as fatty acid amides, antiblocking agents, dyes, plasticizers, mold release agents, antioxidants, flame retardants, and ultraviolet absorbers.
-Core layer, intermediate layer In the resin film of the present invention, the core layer or the intermediate layer between the heat seal layer and the printed layer from the viewpoints of dimensional stability during printing, label supply into the mold, heat shrinkage prevention, etc. An intermediate layer may be provided, for example, a configuration of a print layer / core layer / heat seal layer, a print layer / core layer / intermediate layer / heat seal layer, or a print layer / intermediate layer / core layer / intermediate layer / heat seal layer. Can be illustrated.
・ラベル全厚み
本発明の樹脂フィルムであるラベルの全厚みは、３０〜２５０μｍが好ましく、さらに好ましくは３５〜１５０μｍである。２５０μｍを超えると剛度が高すぎてラベルを金型へ固定することが困難となる傾向があり好ましくない。また、２５μｍ未満では剛度が低く過ぎて枚葉でのオフセット印刷性が劣るといった欠点やインモールド成形時にシワが発生するといった問題が発生する。
・樹脂フィルムの製造
本発明のインモールド成形用ラベルの樹脂フィルムは、当業者間で公知の種々の方法を組み合わせることによって製造することができる。いかなる方法により製造された樹脂フィルムであっても、本発明の構成要件を満たすものである限り本発明の範囲内に包含される。
-Total thickness of label The total thickness of the label which is the resin film of this invention has preferable 30-250 micrometers, More preferably, it is 35-150 micrometers. If it exceeds 250 μm, the rigidity is too high and it tends to be difficult to fix the label to the mold. On the other hand, when the thickness is less than 25 μm, the rigidity is too low and the offset printability on a sheet is inferior, and the problem that wrinkles occur during in-mold forming occurs.
-Manufacture of resin film The resin film of the label for in-mold molding of the present invention can be manufactured by combining various methods known among those skilled in the art. Any resin film produced by any method is included within the scope of the present invention as long as it satisfies the constituent requirements of the present invention.
本発明のインモールド成形用ラベルを構成する樹脂フィルムは少なくとも１軸方向に延伸されているものが好ましく、さらに２軸方向に延伸されていてもよい。例えば、コア層として無機微細粉末（Ｂ）を０〜４０重量％、好ましくは３〜３３重量％含有する結晶性ポリオレフィン系樹脂フィルムを該樹脂の融点より低い温度で１方向に延伸して得られる１軸方向に配向した樹脂フィルムに、ヒートシール層として熱可塑性樹脂（Ａ）２０〜５０重量％および無機微細粉末（Ｂ）と有機フィラー（Ｂ’）合計８０〜５０重量％からなる樹脂組成物に、分散剤（Ｃ）を前記熱可塑性樹脂（Ａ）と無機微細粉末（Ｂ）及び／又は有機フィラー（Ｂ’）の合計１００重量部に対して通常０．０１〜１００重量部を含有する樹脂組成物の溶融フィルムをコア層の片面に積層し、さらに印刷層として熱可塑性樹脂（Ａ）からなる結晶性ポリオレフィン系樹脂フィルムをヒートシール層とは反対側のコア層面に積層し、次いで前記延伸方向と直角方向にこの積層フィルムを延伸することにより、最外層は横１軸方向に配向し、コア層が２軸方向に配向した積層構造物の樹脂フィルムが得られる。好ましい製造方法は各々の樹脂フィルムを積層した後にまとめて延伸する工程を含むものである。別個に延伸して積層する場合に比べると簡便であり製造コストも安くなる。 The resin film constituting the in-mold molding label of the present invention is preferably stretched in at least a uniaxial direction, and may be further stretched in a biaxial direction. For example, a crystalline polyolefin resin film containing 0 to 40% by weight, preferably 3 to 33% by weight of inorganic fine powder (B) as a core layer is obtained by stretching in one direction at a temperature lower than the melting point of the resin. A resin composition comprising 20 to 50% by weight of a thermoplastic resin (A) as a heat seal layer and a total of 80 to 50% by weight of inorganic fine powder (B) and organic filler (B ′) as a resin film oriented in a uniaxial direction. The dispersant (C) usually contains 0.01 to 100 parts by weight with respect to 100 parts by weight in total of the thermoplastic resin (A) and the inorganic fine powder (B) and / or the organic filler (B ′). A molten film of the resin composition is laminated on one side of the core layer, and a crystalline polyolefin resin film made of a thermoplastic resin (A) is further laminated on the core layer side opposite to the heat seal layer as a printing layer. , Followed by stretching the laminate film in the stretching direction perpendicular to the direction, the outermost layer is oriented in the transverse uniaxial direction, the resin film of the laminate structure in which the core layer is oriented in two axial directions can be obtained. A preferred production method includes a step of stretching the resin films and then stretching them together. Compared with the case of separately stretching and laminating, it is simpler and the manufacturing cost is reduced.
延伸には、公知の種々の方法を使用することができる。
延伸の具体的な方法としては、ロール群の周速差を利用したロール間延伸、テンターオーブンを利用したクリップ延伸などを挙げることができる。
ロール間延伸によれば、延伸倍率を任意に調整して、任意の剛性、不透明度、光沢度のフィルムを得ることが容易であるので好ましい。延伸倍率は特に限定されるものではなく、本発明の樹脂フィルムの使用目的と、用いる樹脂の特性を考慮して決定する。通常は２〜１１倍であり、好ましくは３〜１０倍、更に好ましくは４〜７倍である。
テンターオーブンを利用したクリップ延伸の場合は４〜１１倍であり、好ましくは５〜１０倍である。面積延伸倍率としては、２〜８０倍であり、好ましくは３〜６０倍、より好ましくは４〜５０倍である。面積倍率が２倍未満では、樹脂フィルム表面に所定の表面開口率が得られず、インモールド成形時に成形品とラベルで十分な密着が得られなくなる傾向がある。
Various known methods can be used for stretching.
Specific methods of stretching include stretching between rolls utilizing the peripheral speed difference of the roll group, clip stretching using a tenter oven, and the like.
The roll-to-roll stretching is preferable because it is easy to obtain a film having any rigidity, opacity and glossiness by arbitrarily adjusting the stretching ratio. The draw ratio is not particularly limited, and is determined in consideration of the intended use of the resin film of the present invention and the characteristics of the resin used. Usually, it is 2 to 11 times, preferably 3 to 10 times, more preferably 4 to 7 times.
In the case of clip stretching using a tenter oven, it is 4 to 11 times, preferably 5 to 10 times. The area stretch ratio is 2 to 80 times, preferably 3 to 60 times, and more preferably 4 to 50 times. When the area magnification is less than 2 times, a predetermined surface opening ratio cannot be obtained on the surface of the resin film, and there is a tendency that sufficient adhesion cannot be obtained between the molded product and the label during in-mold molding.
本発明のインモールド成形用ラベルのヒートシール層は、熱可塑性樹脂（Ａ）と無機微細粉末（Ｂ）及び／又は有機フィラー（Ｂ’）を所定の割合で混合し、押出し等の方法により製膜する。その後、熱可塑性樹脂（Ａ）としてのポリプロピレン系樹脂の融点より１〜６０℃低い温度、より好ましくは３〜５５℃低い温度、で１軸方向または２軸方向に延伸を行うことにより、無機微細粉末（Ｂ）及び／又は有機フィラー（Ｂ’）を核として樹脂フィルム内部には微細な空孔（ボイド）を有し、フィルム表面には微細な亀裂（表面開口）を有した多孔質な表面が得られる。
またヒートシール層の延伸温度がポリプロピレン系樹脂の融点を越えると、所望の表面開口率が得られず、成形品と接着が低下する為好ましくない。
ヒートシール層の面積延伸倍率としては、２〜８０倍であり、好ましくは３〜６０倍、より好ましくは４〜５０倍である。面積倍率が２倍未満では、樹脂フィルム表面に所定の表面開口率が得られず、インモールド成形時に成形品とラベルで十分な密着が得られなくなる傾向がある。
このような方法により製造した本発明の樹脂フィルムにおけるヒートシール層は、以下の手法により測定される最外層の表面開口率が６〜３０％、好ましくは７％〜２９％である。表面開口率が６％未満ではインモールド成形時に成形品とラベルに十分な投錨効果が得られず成形品とラベルの密着強度が低下し好ましくない。また表面開口率が３０％を越えてはラベルの表面強度が低すぎて容易に表面で材料破壊が起こるため高い密着強度が得られず実用上問題となる。
The heat seal layer of the in-mold molding label of the present invention is produced by a method such as extrusion by mixing a thermoplastic resin (A), an inorganic fine powder (B) and / or an organic filler (B ′) at a predetermined ratio. Film. Thereafter, the inorganic fine particles are stretched uniaxially or biaxially at a temperature 1 to 60 ° C., more preferably 3 to 55 ° C. lower than the melting point of the polypropylene resin as the thermoplastic resin (A). A porous surface having fine voids (voids) inside the resin film with powder (B) and / or organic filler (B ′) as the core, and fine cracks (surface openings) on the film surface Is obtained.
On the other hand, when the stretching temperature of the heat seal layer exceeds the melting point of the polypropylene resin, a desired surface opening ratio cannot be obtained and adhesion to a molded product is lowered, which is not preferable.
The area stretch ratio of the heat seal layer is 2 to 80 times, preferably 3 to 60 times, and more preferably 4 to 50 times. When the area magnification is less than 2 times, a predetermined surface opening ratio cannot be obtained on the surface of the resin film, and there is a tendency that sufficient adhesion cannot be obtained between the molded product and the label during in-mold molding.
In the heat seal layer in the resin film of the present invention produced by such a method, the surface opening ratio of the outermost layer measured by the following method is 6 to 30%, preferably 7% to 29%. When the surface opening ratio is less than 6%, a sufficient anchoring effect cannot be obtained between the molded product and the label during in-mold molding, and the adhesion strength between the molded product and the label is lowered, which is not preferable. On the other hand, when the surface opening ratio exceeds 30%, the surface strength of the label is too low and material destruction easily occurs on the surface, so that high adhesion strength cannot be obtained, which is a practical problem.
表面開口率は、本発明における樹脂フィルムの表面を電子顕微鏡で観察した領域の空孔（開口）が占める面積割合を示す。
具体的には、樹脂フィルム試料より任意の一部を切り取り、観察試料台に貼り付け、その観察面に金ないしは金−パラジウム等を蒸着して電子顕微鏡（例えば、日立製作所（株）製の走査型顕微鏡：Ｓ−２４００）を使用して観察しやすい任意の倍率（例えば、５００倍〜３０００倍に拡大）にて表面の空孔を観察する。さらに観察した領域を写真等に撮影し、空孔をトレーシングフィルムにトレースして塗りつぶした図を画像解析装置（ニレコ（株）製：型式ルーゼックスIIＤ）で画像処理を行い、空孔の面積率を樹脂フィルム表面の開口率とする。
また、本発明のインモールド成形用ラベルのヒートシール層を構成する樹脂フィルム層の透気度（ＪＩＳ−Ｐ−８１１７）は２００００秒以内であることが好ましく、さらに好ましくは１５０００秒以内である。透気度が２００００秒を越えると中空成形用のインモールドラベルとした場合にエアー抜けによるブリスターの改善効果が期待できなくなる。
The surface opening ratio indicates an area ratio occupied by pores (openings) in a region where the surface of the resin film in the present invention is observed with an electron microscope.
Specifically, an arbitrary part of the resin film sample is cut out and attached to an observation sample stage, and gold or gold-palladium is vapor-deposited on the observation surface to scan an electron microscope (for example, manufactured by Hitachi, Ltd.). Surface vacancies are observed at an arbitrary magnification (for example, enlarged to 500 to 3000 times) that is easy to observe using a scanning microscope (S-2400). Further, the observed area was photographed, and the holes were traced on the tracing film, and the painted area was processed with an image analyzer (Model: Luzex IID). The area ratio of the holes Is the opening ratio of the resin film surface.
The air permeability (JIS-P-8117) of the resin film layer constituting the heat seal layer of the in-mold molding label of the present invention is preferably within 20000 seconds, and more preferably within 15000 seconds. When the air permeability exceeds 20000 seconds, the effect of improving blisters due to air leakage cannot be expected when an in-mold label for hollow molding is used.
・印刷
これらのインモールド成形用ラベルは、コロナ放電処理や、フレームプラズマ処理等の表面加工を施すことにより、印刷を施す印刷層の表面の印刷性を改善しておくことが好ましい。印刷は、グラビア印刷、オフセット印刷（油性、ＵＶ）、フレキソ印刷、レタープレス（ＵＶ）、スクリーン印刷、インクジェット印刷、電子写真印刷等を施して、バーコード、製造元、販売会社名、キャラクター、商品名、使用方法などを記入する。
印刷されたラベルは打抜加工により必要な形状寸法のラベルに分離される。このインモールド成形用ラベルは、通常はカップ状成形品の側面を取巻くブランクとして、中空成形では瓶状成形品の表側及び／又は裏側に貼着されるラベルとして製造される。
Printing These in-mold molding labels are preferably subjected to surface treatment such as corona discharge treatment or flame plasma treatment to improve the printability of the surface of the printing layer to be printed. For printing, gravure printing, offset printing (oil-based, UV), flexographic printing, letter press (UV), screen printing, inkjet printing, electrophotographic printing, etc., barcode, manufacturer, sales company name, character, product name , Fill in usage.
The printed label is separated into labels having a necessary shape and dimension by punching. This label for in-mold molding is usually produced as a blank that surrounds the side surface of a cup-shaped molded product, and as a label that is attached to the front side and / or back side of a bottle-shaped molded product in hollow molding.
・成形品
このインモールド成形用ラベルは、該ラベルを差圧成形金型の下雌金型の内面にラベルの印刷面が接するように設置した後、吸引により金型内壁に固定させ、次いで成形品成形材料用の樹脂シートの溶融物が下雌金型の上方に導かれ、常法により差圧成形され、ラベルが成形品外壁に一体に融着されたラベル貼合成形品が成形される。差圧成形は、真空成形、圧空成形のいずれも採用できるが、一般には両者を併用し、かつプラグアシストを利用した差圧成形が好ましい。
また本発明のインモールド成形用ラベルラベルは、溶融樹脂パリソンを圧空により金型内壁に圧着するダイレクトブロー成形やプリフォームを用いた延伸ブロー成形に、又は射出装置で金型内に溶融樹脂を注入し冷却固化するインジェクション成形に好適に使用できる。中でも本発明のインモールド成形用ラベルラベルは、ダイレクトブロー成形、インジェクション成形に好適である。
このようにして製造されたラベルが貼着一体化した成形品は、ラベルが金型内で固定された後に、ラベルと樹脂成形品が一体に成形されるので、ラベルの変形もなく、成形品とラベルの密着強度が強固であり、ブリスターもなく、ラベルにより加飾された外観が良好な成形品が得られる。成形品としては、例えばボトル、容器などが挙げられる。
-Molded product This in-mold molding label is placed on the inner wall of the lower female die of the differential pressure molding die so that the printing surface of the label is in contact, and then fixed to the inner wall of the die by suction, and then molded. The melt of the resin sheet for the product molding material is guided to the upper part of the lower female mold, is subjected to differential pressure molding by a conventional method, and a label-attached composite product in which the label is integrally fused to the outer wall of the molded product is molded. . As the differential pressure forming, either vacuum forming or pressure forming can be adopted, but in general, differential pressure forming using both of them and utilizing plug assist is preferable.
The in-mold molding label label of the present invention is used for direct blow molding in which the molten resin parison is pressed against the inner wall of the mold by compressed air, stretch blow molding using a preform, or injecting the molten resin into the mold with an injection device. And can be suitably used for injection molding for solidification by cooling. Among these, the label for in-mold molding of the present invention is suitable for direct blow molding and injection molding.
The molded product in which the label produced in this way is bonded and integrated, after the label is fixed in the mold, the label and the resin molded product are integrally molded, so there is no deformation of the label and the molded product. And the label has a strong adhesion strength, no blister, and a molded product with a good appearance decorated with a label is obtained. Examples of the molded product include bottles and containers.
以下に本発明における実施例、比較例および試験例を挙げて本発明の特徴をさらに具体的に説明する。
以下の実施例に示す材料、使用量、割合、処理内容、処理手順等は、本発明の趣旨を逸脱しない限り適宜変更することができる。したがって、本発明は以下に示す具体例などにより何等限定されるものではない。以下の実施例および比較例で使用する材料を表１にまとめて示す。なお、表中のＭＦＲはメルトフローレートを意味する。
・物性の測定方法と評価方法
実施例及び比較例における物性の測定と評価は、以下に示す方法によって実施した。
The features of the present invention will be described more specifically with reference to the following examples, comparative examples and test examples.
The materials, amounts used, ratios, processing details, processing procedures, and the like shown in the following examples can be changed as appropriate without departing from the spirit of the present invention. Therefore, the present invention is not limited to the following specific examples. Table 1 summarizes the materials used in the following examples and comparative examples. In addition, MFR in a table | surface means a melt flow rate.
Measurement method and evaluation method of physical properties Measurement and evaluation of physical properties in Examples and Comparative Examples were carried out by the following methods.
・物性の測定
（イ）表面開口率：樹脂フィルムの表面を電子顕微鏡で観察した領域の空孔（開口）が占める面積割合を示す。
具体的には、樹脂フィルム試料より任意の一部を切り取り、観察試料台に貼り付け、その観察面に金ないしは金−パラジウム等を蒸着して電子顕微鏡（例えば日立製作所（株）製の走査型顕微鏡：Ｓ−２４００）を使用して観察しやすい任意の倍率（例えば５００倍〜３０００倍に拡大）にて表面の空孔を観察することができる。さらに観察した領域を写真等に撮影し、空孔をトレーシングフィルムにトレースして塗りつぶした図を画像解析装置（ニレコ（株）製：型式ルーゼックスIIＤ）で画像処理を行い、空孔の面積率を樹脂フィルム表面の開口率とした。
（ロ）透気度：ＪＩＳ−Ｐ−８１１７に準拠して測定した。
（ハ）ベック平滑度：ＪＩＳ−Ｐ−８１１９に準拠して測定した。
（ニ）ＭＦＲ：ＪＩＳ−Ｋ−７２１０に準拠して測定した。
-Measurement of physical properties (a) Surface aperture ratio: Indicates the area ratio occupied by pores (openings) in the region of the surface of the resin film observed with an electron microscope.
Specifically, an arbitrary part of the resin film sample is cut out and attached to an observation sample stage, and gold or gold-palladium is vapor-deposited on the observation surface to scan an electron microscope (for example, a scanning type manufactured by Hitachi, Ltd.). Surface vacancies can be observed at an arbitrary magnification (for example, enlarged to 500 to 3000 times) that can be easily observed using a microscope (S-2400). Further, the observed area was photographed, and the holes were traced on the tracing film, and the painted area was processed with an image analyzer (Model: Luzex IID). The area ratio of the holes Was defined as the opening ratio of the resin film surface.
(B) Air permeability: measured in accordance with JIS-P-8117.
(C) Beck smoothness: measured according to JIS-P-8119.
(D) MFR: Measured according to JIS-K-7210.
以下の手順に従って本発明の樹脂フィルム（実施例１〜８）および比較用の樹脂フィルム（比較例１〜４）を製造した。表１に各樹脂フィルムの製造にあたって使用した材料の種類を示し、表２で各配合量（重量％）と延伸条件および各層の厚みを示した。
（実施例１）
表２に記載の配合物［ａ］を２６０℃に設定された押出機で溶融混練して押出成形し、冷却装置にて７０℃まで冷却して単層の無延伸シートを得た。
この無延伸シートを表２に記載の延伸温度（１）に加熱した後、縦方向にロール間で５倍に延伸し、縦一軸延伸フィルムを得た。次いで配合物［ｂ］を２５０℃に設定された押出機で溶融混練して、前記縦一軸延伸された樹脂フィルムの片面に積層した後、更に配合物［ｃ］と配合物［ｄ］をそれぞれ別の押出機を用い２５０℃で溶融混練して前記で積層した反対面に配合物［ｄ］が外側になるように積層して、配合物［ｂ］／配合物［ａ］／配合物［ｃ］／配合物［ｄ］（印刷層／コア層／中間層／ヒートシール層）の積層物とした。更に次いで前記積層物を表２に記載の延伸温度（２）に加熱してテンター延伸機を用いて横方向に８倍延伸し、１軸／２軸／１軸／１軸に延伸された４層の樹脂フィルムを得た。
Resin films (Examples 1 to 8) of the present invention and comparative resin films (Comparative Examples 1 to 4) were produced according to the following procedure. Table 1 shows the types of materials used in the production of each resin film, and Table 2 shows the blending amounts (% by weight), stretching conditions, and thicknesses of the respective layers.
Example 1
The compound [a] shown in Table 2 was melt-kneaded with an extruder set at 260 ° C., extruded and cooled to 70 ° C. with a cooling device to obtain a single-layer unstretched sheet.
The unstretched sheet was heated to the stretching temperature (1) shown in Table 2, and then stretched 5 times between rolls in the longitudinal direction to obtain a longitudinally uniaxially stretched film. Next, the compound [b] was melt-kneaded with an extruder set at 250 ° C. and laminated on one side of the longitudinally uniaxially stretched resin film, and then the compound [c] and the compound [d] were further added, respectively. Using another extruder, the mixture was melt-kneaded at 250 ° C. and laminated so that the compound [d] was on the opposite side, and the compound [b] / the compound [a] / the compound [ c] / formulation [d] (printing layer / core layer / intermediate layer / heat seal layer). Next, the laminate was heated to a stretching temperature (2) shown in Table 2 and stretched 8 times in the transverse direction using a tenter stretching machine, and stretched to 1 axis / 2 axes / 1 axis / 1 axis. A layered resin film was obtained.
（実施例２〜５及び比較例１）
実施例１において、配合物［ｄ］の配合を表２記載のものに変更した以外は、実施例１に記載と同様の方法で樹脂フィルムを得た。
（実施例６〜８）
実施例１において、配合物［ｂ］の配合を表２記載のものに変更した以外は、実施例１に記載と同様の方法で樹脂フィルムを得た。
（比較例２）
実施例４において、延伸温度（２）を表２記載の温度に変更した以外は、実施例４に記載と同様の方法で樹脂フィルムを得た。
（比較例３〜４）
実施例１において、配合物［ｂ］の配合を表２記載のものに変更した以外は、実施例１に記載と同様の方法で樹脂フィルムを得た。
(Examples 2 to 5 and Comparative Example 1)
A resin film was obtained in the same manner as described in Example 1, except that the formulation [d] was changed to that shown in Table 2 in Example 1.
(Examples 6 to 8)
A resin film was obtained in the same manner as described in Example 1, except that the formulation [b] was changed to that shown in Table 2 in Example 1.
(Comparative Example 2)
In Example 4, a resin film was obtained in the same manner as described in Example 4 except that the stretching temperature (2) was changed to the temperature described in Table 2.
(Comparative Examples 3-4)
A resin film was obtained in the same manner as described in Example 1, except that the formulation [b] was changed to that shown in Table 2 in Example 1.
印刷：上記で作成した樹脂フィルムを熊谷理機工業（株）製グラビア印刷試験機を使用して、インキは大日精化工業（株）製ＣＳＵＰ（商品名）を用い、網点率１０％柄の版胴でＡ４サイズに断裁した基材を成形品とラベルが貼着される面とは反対の面に印刷を行った。印刷適性としては以下項目を評価して実施した。
ドットスキップ：ルーペを使用して印刷層にインキが転写しなかった網点１００個中ドット個数を数えて以下の基準で評価した。
○：０〜３個：ドットスキップが目視できず、実用上問題ないレベル
△：４〜５個：ドットスキップが肉眼で目立ち、実用上問題となるレベル
×：６個以上：ドットスキップが非常に目立ち、実用上問題があるレベル
Printing: Using the gravure printing tester manufactured by Kumagaya Riiki Kogyo Co., Ltd. for the resin film prepared above, the ink is CUP (trade name) manufactured by Dainichi Seika Kogyo Co., Ltd., and the dot rate is 10%. The base material cut to A4 size with the plate cylinder was printed on the surface opposite to the surface on which the molded product and the label were attached. The following items were evaluated for printability.
Dot skip: Using a loupe, the number of dots in 100 dots that were not transferred to the printing layer was counted and evaluated according to the following criteria.
◯: 0 to 3 pieces: level where dot skip cannot be visually observed and practically no problem Δ: 4 to 5 pieces: level where dot skip is noticeable to the naked eye and causes practical problems ×: 6 or more: dot skip is very high Conspicuous and practically problematic level
耐擦過適性：スガ試験機（株）製の学震型摩擦試験機を使用し、印刷された表面同士を２００ｇの荷重をかけて１０００回擦り、擦過後のインキ脱落状態を以下の基準で評価した。
○：インキが脱落せず良好なレベル
△：インキの脱落が見られ実用上問題あるレベル
×：インキ脱落が多く絵柄が見えず実用上使用ができないレベル
次いで該印刷が施された延伸樹脂フィルムを打ち抜き加工して、横７０ｍｍ、縦９０ｍｍのインモールド成形用ラベルを得た。
Scratch resistance: Suga Test Instruments Co., Ltd.'s Gakusei Seismic friction tester is used, and the printed surfaces are rubbed 1000 times with a load of 200 g, and the ink drop-off state after the scratch is evaluated according to the following criteria. did.
○: Ink does not fall off at a good level △: Ink has fallen out and has a problem in practical use ×: Ink has fallen off and the pattern cannot be seen and cannot be used practically Next, the stretched resin film on which the printing has been applied Punching was performed to obtain an in-mold forming label having a width of 70 mm and a length of 90 mm.
インモールド成形：
１）（株）新潟鐵工所製の射出成形機（ＮＶ５０ＳＴ／型締め５０トン、縦型配置式）を使用し、製品の成形品のサイズが横１３０ｍｍ、縦１５０ｍｍ、肉厚１ｍｍの平板となる射出成形用割型を用い、下部固定盤側に取り付けられた雌型の金型表面に印刷面側が金型と接するようにラベルを固定し、次いで割型を型締めした後、２３０℃に設定した射出装置よりポリプロピレン（日本ポリプロ（株）製、「ノバテックＰＰ、ＭＡ３、ＭＦＲ１１［２３０℃、２．１６ｋｇ荷重］」）を７４５ｋｇｆ／ｃｍ2 の圧力でゲート部より型内に注入し溶融樹脂を冷却固化させるとともにラベルを融着させた後、型開きをしてラベルが貼着した平板状のＰＰ製射出成形品を得た。
In-mold molding:
1) Using an injection molding machine (NV50ST / clamping 50 tons, vertical arrangement type) manufactured by Niigata Seiko Co., Ltd., a product with a molded product size of 130 mm wide, 150 mm long, 1 mm thick Using a split mold for injection molding, a label is fixed to the surface of a female mold attached to the lower fixed platen side so that the printing surface is in contact with the mold, and then the mold is clamped and then heated to 230 ° C. Polypropylene ("Novatech PP, MA3, MFR11 [230 ° C, 2.16 kg load]") manufactured by Nippon Polypro Co., Ltd. is injected into the mold from the gate part at a pressure of 745 kgf / cm 2 from the set injection device. Was cooled and solidified, and the label was fused, and then the mold was opened to obtain a flat-plate injection molded product made of PP to which the label was adhered.
２）成形品の素材を直鎖状低密度ポリエチレン（日本ポリエチレン（株）製、「ノバテックＬＬ、ＵＪ９９０、ＭＦＲ３５［１９０℃、２．１６ｋｇ荷重］」）に変更し、射出装置の温度を２２０℃と１８０℃の２条件で前記と同様に成形しラベルが貼着したＰＥ製射出成形品を得た。
３）さらに成形品の素材をポリスチレン（ＰＳジャパン（株）製、「ＨＩＰＳ、４３３、ＭＦＲ２１［２００℃、５ｋｇ荷重］」）に変え、射出装置の温度を２３０℃とし同様の方法でラベルが貼着したＰＳ製射出成形品を得た。
2) The material of the molded product was changed to linear low density polyethylene (Nippon Polyethylene Co., Ltd., “Novatech LL, UJ990, MFR35 [190 ° C., 2.16 kg load]”), and the temperature of the injection device was 220 ° C. And an injection-molded PE product molded in the same manner as described above and attached with a label under two conditions of 180 ° C.
3) Furthermore, the material of the molded product is changed to polystyrene (manufactured by PS Japan Co., Ltd., “HIPS, 433, MFR21 [200 ° C., 5 kg load]”), the temperature of the injection device is set to 230 ° C., and the label is attached in the same manner. A PS injection molded product was obtained.
４）（株）プラコー製のダイレクト中空成形機（Ｖ−５０型）を使用し、ぺんてる（株）製の自動ラベル供給装置を用いて、打ち抜き加工したインモールド成形用ラベル（横６２ｍｍ、縦１２４ｍｍ）を、ブロー成形用割型（容量４００ｍｌ）の一方に真空を利用して印刷面側が金型と接するように固定した後、ペット（日本ユニペット（株）製、「ＲＤ３８３、融点２３５℃、密度１．４０ｇ／ｃｍ3 」）のパリソンを２５０℃で溶融押出し、次いで割型を型締めした後、４．９ｋｇ／ｃｍ2 の圧空をパリソン内に供給し、パリソンを膨張させて型に密着させて容器状とすると共にインモールド用ラベルと融着させ、次いで該型を冷却した後、型開きをしてラベルが貼着したポリエチレンテレフタレート（ＰＥＴ）製ダイレクト中空容器を取り出した。 4) In-mold molding label (62 mm wide, 124 mm long) punched using a direct hollow molding machine (model V-50) manufactured by Plako Co., Ltd. and using an automatic label feeder manufactured by Pentel Co., Ltd. ) Is fixed to one side of a blow mold (capacity 400 ml) using a vacuum so that the printing surface side is in contact with the mold, and then PET (made by Nippon Unipet Co., Ltd., “RD383, melting point 235 ° C., A parison with a density of 1.40 g / cm 3 ”) was melt extruded at 250 ° C., and then the split mold was clamped, then 4.9 kg / cm 2 of compressed air was supplied into the parison, and the parison was expanded to adhere to the mold The container is made into a container shape and fused with an in-mold label, and then the mold is cooled, then the mold is opened and a polyethylene terephthalate (PET) direct hollow container to which the label is attached is formed. Ri issued.
ラベルと成形品の密着強度：
上記で作成した成形品に貼着したラベルを１５ｍｍ幅に切り取り、ラベルと成形品との間の接着強度を、島津製作所製の引張試験機「オートグラフ、ＡＧＳ−Ｄ形」を用い、３００ｍｍ／分の引張速度で、Ｔ字剥離することにより求めた。ラベル使用上の判断基準は次の通りである。
○：４００（ｇ／１５ｍｍ）以上であり、接着が強固で実用上全く問題がないレベル
△：２００以上〜４００未満（ｇ／１５ｍｍ）であり、やや接着性が弱く成形品の形状によっては衝撃で剥がれてしまいやや実用上問題となるレベル
×：２００未満（ｇ／１５ｍｍ）であり、容易にラベルが剥がれてしまうため実用上問題であるレベル
各試験結果を表３にまとめて示した。
Adhesive strength between label and molded product:
The label affixed to the molded product created above is cut to a width of 15 mm, and the adhesive strength between the label and the molded product is set to 300 mm / mm using a tensile tester “Autograph, AGS-D type” manufactured by Shimadzu Corporation. It was determined by peeling T-shaped at a tensile rate of minutes. The criteria for label usage are as follows.
○: 400 (g / 15 mm) or more, adhesion is strong, and there is no practical problem at all. Δ: 200 or more to less than 400 (g / 15 mm), slightly weak adhesion and impact depending on the shape of the molded product Is a level that is slightly problematic in practical use x: less than 200 (g / 15 mm), and the level that is practically problematic because the label is easily peeled. Table 3 summarizes the test results.
本発明により、印刷面の仕上がりが高精細であるインモールド成形が可能となり、かつ、インモールド成形後の成形品の外観も良好であるインモールド成形用ラベル及びそれを用いた成形品がえられた。
本発明の該ラベルは、溶融した熱可塑性樹脂を射出成形して、或いは溶融した熱可塑性シートを真空成形もしくは圧空成形してラベルを貼合した成形品を製造するインモールド成形に用いるラベルであり、樹脂を成形する産業分野で好適に用いられる。
INDUSTRIAL APPLICABILITY According to the present invention, in-mold molding with a high-definition printed surface finish is possible, and an in-mold molding label with a good appearance after molding in-mold and a molded article using the same are obtained. It was.
The label of the present invention is a label used for in-mold molding for producing a molded product obtained by injection-molding a molten thermoplastic resin, or vacuum-molding or pressure-molding a molten thermoplastic sheet and bonding the label. It is suitably used in the industrial field for molding resins.
Claims (10)
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Cited By (7)
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| JP2009223119A (en) * | 2008-03-18 | 2009-10-01 | Yupo Corp | Label for in-mold molding and injection-molded object with label |
| JP2009244591A (en) * | 2008-03-31 | 2009-10-22 | Tokushu Paper Mfg Co Ltd | In-mold label |
| WO2011046126A1 (en) | 2009-10-14 | 2011-04-21 | 株式会社ユポ・コーポレーション | Label for in-mold molding, in-mold molded article and method for molding same |
| JP2012215799A (en) * | 2010-12-22 | 2012-11-08 | Yupo Corp | Label for in-mold molding and resin molding with label |
| JP2013214075A (en) * | 2013-05-08 | 2013-10-17 | Yupo Corp | Label for in-mold molding and injection-molded product with label |
| US9102126B2 (en) | 2010-06-30 | 2015-08-11 | Yupo Corporation | Readily removable film, label for in-mold molding, molded resin article having label attached thereto, wallpaper, glue label, and container having label attached thereto |
| JPWO2021193852A1 (en) * | 2020-03-27 | 2021-09-30 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2009223119A (en) * | 2008-03-18 | 2009-10-01 | Yupo Corp | Label for in-mold molding and injection-molded object with label |
| JP2009244591A (en) * | 2008-03-31 | 2009-10-22 | Tokushu Paper Mfg Co Ltd | In-mold label |
| WO2011046126A1 (en) | 2009-10-14 | 2011-04-21 | 株式会社ユポ・コーポレーション | Label for in-mold molding, in-mold molded article and method for molding same |
| JP2011102973A (en) * | 2009-10-14 | 2011-05-26 | Yupo Corp | Label for in-mold molding, in-mold molded article and method for molding the same |
| US9633580B2 (en) | 2009-10-14 | 2017-04-25 | Yupo Corporation | Label for in-mold molding, in-mold molded article and method for molding same |
| US9102126B2 (en) | 2010-06-30 | 2015-08-11 | Yupo Corporation | Readily removable film, label for in-mold molding, molded resin article having label attached thereto, wallpaper, glue label, and container having label attached thereto |
| JP2012215799A (en) * | 2010-12-22 | 2012-11-08 | Yupo Corp | Label for in-mold molding and resin molding with label |
| JP2013214075A (en) * | 2013-05-08 | 2013-10-17 | Yupo Corp | Label for in-mold molding and injection-molded product with label |
| JPWO2021193852A1 (en) * | 2020-03-27 | 2021-09-30 | ||
| WO2021193852A1 (en) * | 2020-03-27 | 2021-09-30 | 株式会社ユポ・コーポレーション | Thermal label |
| JP7303939B2 (en) | 2020-03-27 | 2023-07-05 | 株式会社ユポ・コーポレーション | thermal label |
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