JP2006297830A - Inkjet recording head and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an inkjet recording head constituted such that a stress due to a linear expansion difference between a liquid discharge substrate and a supporting member is not applied to the liquid discharge substrate in fixing the liquid discharge substrate and the supporting member, and also to provide a manufacturing method of the head. <P>SOLUTION: The inkjet recording head 1 has: an orifice plate 105 where a plurality of discharge ports 106 are formed; a recording element substrate 100 having an energy generating section to discharge ink according to an electrical signal, and an ink supply port 104 communicating with the discharge ports 106 and formed therein; and a supporting member 300 which supports the recording element substrate 100 with its bonding surface 300b and has an ink supply path 307 to supply ink in communication with the ink supply port 104 of the recording element substrate 100. Only areas A and B being a part of a facing surface 100b facing the orifice plate 105 of the recording element substrate 100 are bonded to the bonding surface 300b of the supporting member 300. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an inkjet recording head used in an inkjet recording apparatus that performs a recording operation by discharging a liquid such as ink, and a method for manufacturing the inkjet recording head.

  FIG. 8 shows a configuration of a general inkjet recording head of a type that ejects vertically from the surface of the heat acting portion. FIG. 8A is an exploded perspective view, and FIG. 8B is an assembled view. FIG. 9 is a diagram for explaining a cross-sectional structure of the ink jet recording head shown in FIG. Fig.9 (a) is a partially expanded sectional view in the DD line of FIG.8 (b).

  As shown in FIGS. 8A, 8B, and 9, a general inkjet recording head has a configuration including a liquid discharge substrate 1100, an electric wiring substrate 1200, and a support member 1300.

  In the liquid discharge substrate 1100, an ink supply port 1104 is opened in the shape of an elongated hole in the center of a silicon substrate, and a plurality of heating resistors 1108 are formed on both sides of the ink supply port 1104 at substantially equal intervals on this substrate. Are lined up. A substrate on which such a heating resistor 1108 is formed is called a heater board 1101. Ink is supplied from an ink supply port 1104 of the heater board 1101. Wiring (not shown) for supplying power to the heating resistor 1108 is routed outside the heater board 1101 and connected to external extraction electrode pads installed at both ends on the heater board 1101. . Then, an orifice plate 1105 having a plurality of discharge ports 1106 is attached on such a heater board 1101, and further, bumps 1103 serving as electrodes are formed on the electrode pads to complete the liquid discharge substrate 1100.

  As the electric wiring board 1200, for example, a flexible wiring board is used, and a copper foil 1203 is bonded onto the base film 1201 with an adhesive 1202 and patterned, and the copper foil 1203 is used as a lead wire. And it has the electrode terminal 1204 which electrically connects the bump 1103 of the liquid discharge substrate 1100, and the contact part 1211 for inputting the driving power and the electric signal from the printer main body, and other than the electrode terminal 1204 is covered with a cover film. Yes.

  The support member 1300 supports the entire area of the opposing surface 1106b facing the surface 1106a where the discharge ports of the liquid discharge substrate 1100 are arranged so that the ink supply port 1104 of the liquid discharge substrate 1100 communicates with the ink supply port 1302 of the support member 1300. The bonding surface 1300b of the member 1300 is bonded using an adhesive 1107. In addition, the electric wiring board 1200 can be connected substantially horizontally to the electrode portion of the liquid discharge board 1100, and the electric wiring board 1200 is bonded and fixed with an adhesive 1205.

As a method of connecting the external extraction electrode pad of the liquid discharge substrate 1100 and the electric wiring substrate wiring, generally, an electrode portion (bump 1103) of the liquid discharge substrate 1100 and a wiring lead 1204 which is an electrode terminal of the electric wiring substrate 1200 are used. The electrodes are electrically connected and fixed by metal bonding with ultrasonic and heat (inner lead bonding). Then, as shown in FIG. 9, the electrode portion (bump 1103) of the liquid discharge substrate 1100 and the bonding portion of the electrode terminal 1204 of the electric wiring substrate 1200 are coated with an adhesive 1400a on the electrode terminal 1204 and around the liquid discharge substrate. By sealing with 1400b, it is insulated from the surroundings and fixed. The adhesive 1107 used for fixing the liquid discharge substrate 1100 and the support member 1300 is generally an adhesive such as a thermosetting resin, and the liquid discharge substrate 1100 made of a material such as Si and the material such as a resin member. There is known a method in which the supporting member 1300 is bonded and fixed by thermal curing.
JP 2001-130001 A

  However, the above-described inkjet recording head has the following problems.

  That is, when the liquid discharge substrate and the support member are fixed using an adhesive such as a thermosetting resin, heat is applied to the surface facing the surface where the discharge ports of the liquid discharge substrate are arranged and the joint portion of the support member. Cure is necessary. By this thermal cure, stress of linear expansion due to heat is applied to both the liquid discharge substrate and the support member. The stress due to linear expansion after curing of the adhesive is applied to the support member toward the inside of the opening of the liquid ejection substrate. The stress due to the linear expansion is also applied to the liquid discharge substrate on the cured adhesive. However, there is a difference in linear expansion between the liquid discharge substrate and the support member. As a result, stress remains in the orifice plate on the opening of the liquid discharge substrate, and the orifice plate surface is distorted, which may adversely affect the discharge.

  Accordingly, the present invention provides an inkjet recording head having a configuration in which stress caused by a linear expansion difference between the liquid ejection substrate and the support member is not applied to the liquid ejection substrate and the method of manufacturing the inkjet recording head when the liquid ejection substrate and the support member are fixed. The purpose is to provide.

  The ink jet recording head of the present invention includes an orifice plate having a plurality of ejection openings and energy generating means for ejecting ink in response to an electrical signal, and recording in which an ink supply opening communicating with the ejection openings is formed. In a recording element comprising: an element substrate; and a support member that supports the recording element substrate at a bonding surface and includes a flow path that supplies ink in communication with an ink supply port of the recording element substrate. A part of the facing surface of the substrate facing the orifice plate is bonded to the bonding surface of the support member.

  According to the present invention, by adhering only a part of the opposing surface of the recording element substrate to the bonding surface of the support member, the other non-adhesion areas are free from the support member, and the adhesive is cured. The structure is less susceptible to the effects of linear expansion at times. Therefore, it is possible to prevent the stress caused by the linear expansion difference between the liquid discharge substrate and the support member from remaining on the liquid discharge substrate, and to provide a highly reliable ink jet recording head.

  Hereinafter, the basic configuration and operation of the embodiment of the recording apparatus of the present invention will be described with reference to the drawings. Further, in this specification, “print” (sometimes referred to as “record”) is not only for forming significant information such as characters and figures, but also for human beings regardless of significance. Regardless of whether or not it has become obvious so that it can be perceived, an image, a pattern, a pattern, or the like is widely formed on a print medium, or the medium is processed.

  Here, “print medium” (sometimes referred to as “recording medium”) includes not only paper used in general printing apparatuses, but also widely, cloth, plastic film, metal plate, glass, ceramics, It shall also refer to materials that can accept ink, such as wood and leather.

Furthermore, “ink” (sometimes referred to as “liquid”) is to be interpreted widely as the definition of “print” above, and is applied to a print medium so that images, patterns, patterns, etc. Or liquid processing that can be subjected to ink processing (e.g., solidification or insolubilization of the colorant in the ink applied to the print medium) and includes all liquids used for recording.
(First embodiment)
FIG. 1 shows a partial external perspective view of the ink jet recording head of this embodiment. FIG. 1A is a partial external perspective view showing a state in which the support member supports and fixes the liquid discharge substrate before the electric wiring substrate is attached, and FIG. 1B is a view of the liquid discharge substrate. It is a top view showing the opposing surface which opposes the surface supported by a supporting member, ie, the discharge port surface where a discharge port is located in a line.

2 is a partial external perspective view of the ink jet recording head with the electric wiring board attached thereto, and FIG. 3 is a partial cross-sectional view taken along line EE in FIG.
[Inkjet recording head]
The ink jet recording head 1 of the present embodiment is a bubble jet side shooter type that performs recording using an electrothermal transducer that generates thermal energy for causing film boiling in ink in response to an electrical signal. A liquid discharge substrate 100 having an orifice plate 105 in which an ink supply port 104 is formed and a plurality of discharge ports 106 are formed in parallel, and the ink supply port 104 of the liquid discharge substrate 100. The ink supply path 302 is formed, and includes a support member 300 that supports the liquid discharge substrate 100 and an electric wiring substrate 200 made of a flexible wiring substrate.
[Liquid discharge substrate]
The liquid discharge substrate 100 of the present embodiment is made of a silicon substrate, and an elongated hole-shaped ink supply port 104 is formed at the center.

  The facing surface 106b, which is the surface of the liquid discharge substrate 100 that faces the side on which the orifice plate 105 is provided, has regions A, B, C, and D. That is, the peripheral portion of the ink supply port 104 on the facing surface 106b is a region A or B that is bonded to the bonding surface 300b of the support member 300 that fixes the liquid discharge substrate 100 (hatching in FIG. 1B). Part) and regions C and D which are regions that are not bonded to the bonding surface 300b. In this embodiment, the regions A and B are formed to extend in the short direction of the ink supply port 104, and the regions C and D are formed to extend in the longitudinal direction. In the present embodiment, the regions to be bonded are described as the regions A and B. However, the present invention is not limited to this, and for example, the region to be bonded is one of the regions A and B, or One of the areas C and D, and further, a part of the peripheral portion of the ink supply port 104 is used as an adhesive area without being limited to the method of dividing the areas A, B, C, and D. There may be.

A plurality of heating resistors 108 are arranged on both sides of the ink supply port 104 at substantially equal intervals on the substrate of the liquid discharge substrate 100. A substrate on which such a heating resistor 108 is formed is called a heater board 101. Ink is supplied from an ink supply port 104 of the heater board 101. Wiring (not shown) for supplying power to the heating resistor 108 is routed outside the heater board 101, and external lead electrode pads (not shown) installed at both ends on the heater board 101. Connected. These wirings are generally protected by a nitride insulating film (SiN) having a thickness of several hundreds to several thousands. Then, an orifice plate 105 having a plurality of discharge ports 106 formed by photolithography technology is pasted on such a heater board 101, and further, bumps 103 serving as electrodes are formed on the electrode pads 102. Thus, the liquid discharge substrate 100 as shown in FIG. 3 is completed. The bump 103 is, for example, a gold bump of about 5 to 30 μm formed by a stud bump method.
[Electric wiring board]
As described above, a flexible wiring board is used for the electric wiring board 200. A copper foil 203 is bonded to the base film 201 with an adhesive 202 and patterned, and the copper foil 203 is used as a lead wire. The cover film 206 covers the electrode terminals (not shown) that electrically connect the bumps 103 of the liquid ejection substrate 100 and the contact portions 211 for inputting driving power and electric signals from the printer main body. The base film 201 and the cover film 206 are, for example, resist films with a thickness of 25 μm. The electrode terminal is, for example, gold plated on a copper foil having a thickness of 30 μm. The adhesives 202 and 207 have a thickness of 10 μm, for example.
[Support member]
The support member 300 is formed with an ink supply path 302 for supplying ink to the ink supply port 104 of the liquid discharge substrate 100, and a bonding surface 300 b for supporting the liquid discharge substrate 100 is formed. Yes. The electric wiring board 200 is bonded and fixed to a wiring holding surface 300 c that is the upper surface of the outer peripheral wall of the storage portion 301 that stores the liquid discharge substrate 100. The joint surface 300b forms the bottom surface of the storage portion 301, and is formed at a position recessed with respect to the wiring holding surface 300c.

The electrode portion (bump 103) of the liquid discharge substrate 100 and the electrode terminal of the electric wiring substrate 200 are metal-bonded (inner lead bonding) using ultrasonic waves and heat, and the both electrodes are electrically connected and fixed. Yes. After the electrode terminal and the bump 103 are electrically connected, the electrode terminal 204 and the periphery of the liquid discharge substrate 100, that is, the storage portion 301 are sealed with an adhesive. As a result, the bonding portion where the electrode terminal and the bump 103 are electrically connected is insulated and covered. As the adhesive, for example, a thermosetting adhesive is used. In FIG. 1, the adhesive is not shown in order to clarify the configuration.
[Bonding of liquid discharge substrate and support member]
The liquid discharge substrate 100 and the support member 300 are bonded together by connecting the facing surface 100 b of the liquid discharge substrate 100 and the bonding surface 300 b of the support member 300 with an adhesive 107.

  Here, in the present embodiment, the adhesive 107 is not applied to the entire surface of the facing surface 100b of the liquid discharge substrate 100 and bonded to the bonding surface 300b, but in the regions A and B of the facing surface 100b. It is applied only to the adhesive. That is, the entire surface of the facing surface 106 b is not fixed to the support member 300 by bonding, but only a part of the liquid discharge substrate 100 is bonded and fixed.

  In this way, an orifice having an opening such as the ink supply port 104 and a plurality of ejection ports 106 formed in parallel is formed by adhering only a part rather than adhering the entire surface. The liquid ejection substrate 100 provided with the plate 105 has a configuration free from the support member 300 in the regions C and D extending in the longitudinal direction of the ink supply port 104.

  When the liquid discharge substrate 100 and the support member 300 are fixed using an adhesive such as a thermosetting resin, thermal curing is required for the facing surface 100b of the liquid discharge substrate 100 and the bonding surface 300b of the support member 300. It is. By this thermal cure, stress of linear expansion due to heat is applied to both the liquid discharge substrate 100 and the support member 300. The stress due to the linear expansion after the adhesive is cured is applied to the support member 300 toward the inside of the ink supply port 104 of the liquid ejection substrate 100. Further, the stress due to the linear expansion is also applied to the liquid discharge substrate 100 on the cured adhesive. Since there is a difference in linear expansion between the liquid discharge substrate 100 and the support member 300, stress remains in the orifice plate 105 disposed on the ink supply port 104 of the liquid discharge substrate 100, and the surface of the orifice plate 105 is distorted. Arise.

  However, since the ink jet recording head 1 of the present embodiment is free from the support member 300 in the regions C and D, the liquid discharge substrate 100 is not easily affected by linear expansion during curing, and thus the liquid discharge The orifice plate 105 provided on the substrate 100 is also less susceptible to the effects of linear expansion during curing.

  As described above, according to the present embodiment, when the adhesive that supports and fixes the liquid ejection substrate 100 and the support member 300 is cured, the stress caused by the difference in linear expansion between the liquid ejection substrate 100 and the support member 300 is applied to the liquid ejection substrate. Therefore, it is possible to provide the inkjet recording head 1 with high reliability.

By the way, the inside of the accommodating part 301 is sealed with a thermosetting adhesive as mentioned above. Therefore, in the present embodiment, the adhesive is not applied to the regions C and D. However, when this thermosetting adhesive enters the regions C and D, the linear expansion during the curing of the adhesive is caused. It becomes impossible to make a configuration that is not easily affected. Therefore, when the surfaces corresponding to the regions C and D of the opposing surface 100b and the regions C and D of the bonding surface 300b are subjected to water repellent treatment, the infiltration of the thermosetting adhesive around the liquid discharge substrate 100 can be prevented. It becomes possible to provide a more reliable ink jet recording head. Examples of the water repellent include CTX-105 (trade name: manufactured by Asahi Glass Co., Ltd.), KP-801 (trade name: manufactured by Shin-Etsu Chemical Co., Ltd.), and defender (trade name: manufactured by Dainippon Ink & Chemicals, Inc.). ), Teflon AF (trade name: manufactured by DuPont) and the like.
(Second Embodiment)
4A to 4B show the manufacturing process of the ink jet recording head of this embodiment. FIG. 4C is a partial cross-sectional view taken along line FF in FIG. The basic configuration of the ink jet recording head 10 of the present embodiment is the same as that of the ink jet recording head 1 described in the first embodiment, and thus detailed description thereof is omitted. In the description of the present embodiment, the same reference numerals used in the first embodiment are used for members similar to those in the first embodiment.

  FIG. 4A is a partial external perspective view of the ink jet recording head 10 in a state before the liquid ejection substrate 100 is mounted on the support member 300. Protrusions 303 are formed on the joint surface 300 b of the support member 300 and in the vicinity of the four corners of the ink supply path 302.

  In the first embodiment, only the regions A and B are adhesively bonded, and the regions C and D are made free with respect to the support member 300, so that the liquid discharge substrate 100 and the support member 300 can be used when the adhesive is cured. In this configuration, the stress caused by the difference in linear expansion is prevented from remaining on the liquid discharge substrate 100.

  On the other hand, in the present embodiment, only the four corners of the facing surface 100b of the liquid discharge substrate 100 are supported by the end surfaces 303a of the four protrusions 303 formed, and the liquid discharge substrate 100 has the outer peripheral side surface that is a part thereof. The support member 300 is bonded and fixed. Therefore, the region other than the bonded portion is free from the support member 300. By adopting such a configuration, in the present embodiment, as in the first embodiment, when the adhesive is cured, the stress caused by the difference in linear expansion between the liquid discharge substrate 100 and the support member 300 is applied to the liquid discharge substrate. 100 is prevented from remaining.

  In the case of this embodiment, since the liquid discharge substrate 100 is supported on the protrusion 303, as shown in FIG. 4C, a gap portion in which ink can be interposed between the opposing surface 100b and the bonding surface 300b. R is formed. In other words, in the case of this embodiment, the outer peripheral side surface, which is a part of the liquid discharge substrate 100, is bonded and fixed to the support member 300, so that stress due to linear expansion is not applied from the support member 300 to the liquid discharge substrate 100. In addition, even when heat is applied to both the support member 300 and the liquid ejection substrate 100 due to the formation of the gap R, the thermal conductivity of the ink interposed in the gap R is higher than that of the resin member or air. Therefore, the heat dissipation effect is excellent, and the effect of linear expansion deformation is reduced.

  The adhesive 400b used for fixing the outer peripheral portion of the liquid discharge substrate 100 has a hardness after curing in order to prevent the adhesive 400b from flowing into the gap portion R formed between the facing surface 100b and the bonding surface 300b. It is more desirable to use a hard adhesive (see FIG. 4C).

  Similarly to the first embodiment, the water repellent treatment may be performed on the facing surface 100b and the bonding surface 300b located in the gap R.

Furthermore, as a similar configuration regarding the positional relationship between the liquid ejection substrate 100 and the support member 300 according to the present embodiment, instead of providing the projection 303 on the support member 300, as shown in FIG. The elastic body 304 may be sandwiched between them. The elastic body 304 is made of a material having low thermal conductivity such as rubber, and an opening 305 is formed so that the ink supply port 104 of the liquid discharge substrate 100 and the ink supply path 302 of the support member 300 communicate with each other. . The elastic body 304 is not limited to the shape in which the opening 305 is formed. For example, the elastic body 304 may be provided at four locations near the four corners of the ink supply path 302 like the protrusions 303. Also, the material is not limited to rubber, and it is not particularly limited as long as it is elastic and uses a resin having low thermal conductivity. In this case, the liquid discharge substrate 100 is bonded and fixed to the support member 300 on the outer peripheral side surface that is a part of the liquid discharge substrate 100, and is supported by the support member 300 in the region S via the elastic body 304. The Rukoto.
(Third embodiment)
FIG. 6 shows a partial external perspective view of the ink jet recording head of this embodiment.

  In the first and second embodiments described above, the inkjet recording head using one liquid ejection substrate has been described. In the present embodiment, an inkjet recording head using a plurality of liquid ejection substrates will be described.

  The ink jet recording head 20 of the present embodiment has a configuration including a plurality of liquid discharge substrates, but the basic configuration is the same as that of the ink jet recording head 1 described in the first embodiment. Description is omitted. In the description of the present embodiment, the same reference numerals used in the first embodiment are used for members similar to those in the first embodiment.

  As described in the first embodiment, each liquid ejection substrate 100 according to the present embodiment is not coated with an adhesive on the entire surface 100b of the liquid ejection substrate 100 and bonded to the bonding surface 300b. It is applied and bonded only to the regions A and B of the facing surface 100b. That is, the entire surface of the facing surface 106b is not bonded and fixed to the support member 300, but only a part of the liquid discharge substrate 100 is bonded and fixed (see FIG. 1B). In this way, a liquid discharge substrate including an orifice plate 105 having an opening such as the ink supply port 104 and a plurality of discharge ports 106 formed in parallel is configured by adhering only a part thereof. Reference numeral 100 denotes a configuration in which the regions C and D extending in the longitudinal direction of the ink supply port 104 are free with respect to the support member 300. That is, the inkjet recording head 20 of the present embodiment is also configured to be less susceptible to the effects of linear expansion during the curing of the adhesive that bonds the liquid ejection substrate 100 and the support member 300, as in the first embodiment. .

  In the present embodiment, as shown in FIG. 6, a plurality of liquid ejection substrates 100 are arranged in the storage unit 301. In addition, as described above, each liquid discharge substrate 100 has only a part of the facing surface 100b bonded to the support member 300. For this reason, regions C and D that are not fixed by adhesion (see FIG. 1B) may be mixed with ink of the adjacent liquid discharge substrate 100 due to leakage of ink from the ink supply port 104. . Therefore, in the case of a configuration including a plurality of liquid discharge substrates 100, after each liquid discharge substrate 100 is bonded and fixed to the support member 300, as shown in FIG. Each liquid discharge substrate 100 can be made independent by filling the liquid. In other words, it is possible to prevent the ink from leaking from the ink supply port 104 and mixing with the ink of the adjacent liquid discharge substrate 100, so that the inkjet recording head 20 can be multicolored. A material having low thixotropic properties (high fluidity) is desirable for the filler 500b.

  In the present embodiment, the inkjet recording head 20 including the three liquid discharge substrates 100 has been described as an example. However, the number of the liquid discharge substrates 100 is not limited to three, and may be two. Needless to say, it may be four or more.

FIG. 2 is a partial external perspective view of the ink jet recording head according to the first embodiment of the present invention and a plan view of a surface supported by a support member of a liquid discharge substrate. FIG. 2 is a partial external perspective view of the ink jet recording head according to the first embodiment with an electric wiring board attached thereto. FIG. 3 is a partial cross-sectional view of the ink jet recording head taken along line EE in FIG. 2. It is a figure explaining the manufacturing process of the inkjet recording head of the 2nd Embodiment of this invention, and a partial cross section figure. It is sectional drawing which shows the other structural example in the inkjet recording head of the 2nd Embodiment of this invention. FIG. 10 is a partial external perspective view of an ink jet recording head using a plurality of liquid discharge substrates in a third embodiment of the present invention. It is a partial external perspective view of the inkjet recording head in the 3rd Embodiment of this invention formed by filling a storage part with a filler. It is a figure which shows the structure of the conventional general inkjet recording head of the type discharged vertically from the heat action part surface. It is a figure explaining the cross-sectional structure of the inkjet recording head shown in FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Inkjet recording head 100 Liquid discharge board | substrate 100b Opposite surface 104 Ink supply port 105 Orifice plate 106 Discharge port 300 Support member 300b Joining surface 307 Ink supply path A, B, C, D area | region

Claims (10)

A recording element substrate having an orifice plate in which a plurality of ejection openings are formed and an energy generating means for ejecting ink in response to an electrical signal, and having an ink supply port communicating with the ejection openings; and the recording element In an inkjet recording head comprising a support member that supports a substrate at a bonding surface and has a flow path that supplies ink in communication with the ink supply port of the recording element substrate.
An ink jet recording head, wherein a part of an opposing surface of the recording element substrate facing the orifice plate is bonded to the joint surface of the support member.   2. The ink jet recording head according to claim 1, wherein at least one side of an outer periphery of the ink supply port formed in a rectangular shape among the opposing surfaces is bonded to the bonding surface.   The inkjet recording head according to claim 2, wherein at least a short side of the ink supply port formed in a rectangular shape is bonded. A recording element substrate having an orifice plate in which a plurality of ejection openings are formed and an energy generating means for ejecting ink in response to an electrical signal, and having an ink supply port communicating with the ejection openings; and the recording element In an inkjet recording head comprising a support member that supports a substrate and has a flow path that supplies ink in communication with the ink supply port of the recording element substrate.
An ink jet recording head, wherein a protrusion is formed on a joint surface of the support member, and a part of a facing surface of the recording element substrate facing the orifice plate is bonded onto the protrusion.   The ink jet recording head according to claim 4, wherein a predetermined interval in which ink can be interposed is formed between the facing surface and the bonding surface.   6. The ink jet recording head according to claim 1, wherein a water repellent treatment is applied to a region of the opposing surface and the bonding surface that are not bonded to each other. A recording element substrate having an orifice plate in which a plurality of ejection openings are formed and an energy generating means for ejecting ink in response to an electrical signal, and having an ink supply port communicating with the ejection openings; and the recording element In an inkjet recording head comprising a support member that supports a substrate and has a flow path that supplies ink in communication with the ink supply port of the recording element substrate.
The recording element substrate is supported on the bonding surface by an elastic body sandwiched between a facing surface of the recording element substrate facing the orifice plate and a bonding surface of the support member, and the recording element substrate An ink jet recording head, wherein a part of the side surface of the ink-jet recording apparatus is bonded to the support member.   The elastic body is sandwiched only between a part of the facing surface and the joint surface, and a water repellent treatment is applied to a region of the facing surface and the joint surface where the elastic body does not exist, The ink jet recording head according to claim 7.   The inkjet recording head according to claim 8, wherein a plurality of the recording element substrates are arranged in parallel, and the recording element substrates are partitioned by a resin filler. A recording element substrate having an orifice plate in which a plurality of ejection openings are formed and an energy generating means for ejecting ink in response to an electrical signal, and having an ink supply port communicating with the ejection openings; and the recording element In a method for manufacturing an ink jet recording head, comprising: a support member that supports a substrate at a bonding surface and has a flow path that supplies ink in communication with the ink supply port of the recording element substrate;
A method of manufacturing an ink jet recording head, comprising: adhering a part of an opposing surface of the recording element substrate facing the orifice plate to the joint surface of the support member.

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