JP2001205812A - Ink-jet printer head and its manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an ink-jet printer head in which an orifice plate and a diaphragm are bonded by a strength not causing ink bleeding to a bonding part, and its manufacturing method. SOLUTION: Individual wiring electrodes 21, resistance heating parts 22, a common electrode 23, an ink feed groove 24 and an ink feed hole 25 are formed on a chip substrate of this printing head 20. Moreover, a seal diaphragm 26 and partition diaphragms 27 which surround each of the resistance heating parts 22 from three directions are formed, and seal diaphragms 31 and 32 having uneven end faces are formed to sides opposite to three edges not facing an ink feed path 29 of the ink feed groove 24. Projecting parts are formed when baking is carried out to corner parts between an upper face and uneven end faces shaped like comb teeth and formed by these partition diaphragms 27 and the seal diaphragms 26, 31 and 32. The orifice plate 33 is bonded onto the projecting parts, whereby the projecting parts are buried in an adhesive layer to exert a anchoring effect. The orifice plate 33 and the diaphragms are tightly bonded accordingly.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an ink jet printer head capable of reliably bonding an orifice plate to a partition at any position with the same bonding strength, and a method of manufacturing the same.

[0002]

2. Description of the Related Art Conventionally, an ink jet printer has been used. In the printing method of the ink jet printer, ink droplets are ejected from ink ejection nozzles of an ink jet printer head, and the ink droplets are absorbed by a recording material such as paper or cloth to print (print) characters and images. It is what you do. This printing method is a printing method that generates less noise, does not require special fixing processing, can perform high-speed printing, and can perform full-color printing.

[0003] In the case of full-color printing, usually, three subtractive primary colors, yellow (yellow), magenta (red dye name) and cyan (greenish blue), are added to three color inks.
Printing is performed using four colors of ink to which black (black) used for black portions of characters and images is added. That is, a nozzle row dedicated to each color is arranged in the print head, and four color inks of yellow, magenta, cyan, and black are discharged from these nozzle rows while controlling the discharge amount of each color. Full-color printing is performed by mixing and absorbing each ink in one pixel of the material.

In a print head of an ink jet printer that discharges ink droplets from the above nozzles, an electromechanical transducer such as a piezo element is used to apply pressure due to mechanical deformation to a finely formed ink pressurizing chamber. A piezo-type inkjet printer head that ejects droplets from minute nozzles with this instantaneous pressure, and a resistive heating element is arranged in a fine ink pressurizing chamber, and an electric pulse is given to this There is a thermal-type ink jet printer head that heats and foams the ink and discharges the ink using the growth power of the air bubbles.

FIG. 6A is a plan view showing an ink ejection surface of a roof shooter type ink jet printer head (hereinafter, simply referred to as a print head) in such a thermal type, and FIG. It is a rear view. Also,
(c) is an enlarged view showing the inside by removing the orifice plate in a portion enclosed by a dashed line a in FIG. (a), and FIG. (d) is a cross section taken along the line AA ′ in FIG. It is an arrow view.

A print head 1 shown in FIG. 1A is a print head having four nozzle rows 2 on one silicon chip substrate. Each of the four nozzle rows 2 has a number of orifices 3. From these orifices 3, a yellow ink (Y), a magenta ink (M), a cyan ink (C), or a black ink is provided for each nozzle row 2. (Bk) is configured to be ejected.

As shown in FIGS. 1A to 1D, in a print head 1, a drive circuit 5 is formed on the upper surface of a chip substrate 4 by an LSI forming technique, and an ink supply groove 6 is formed by, for example, wet etching. An ink supply hole 7 communicating with the ink supply groove 6 and opening on the back surface of the chip substrate 4 penetrates the chip substrate 4.

Between the above-mentioned drive circuit 5 and the ink supply groove 6, for example, 64 heat generating portions 8 of the heat generating resistor are formed by a thin film forming technique such as a photolithographic technique, depending on the design policy.
Many such as 128, 256, etc. are formed. Further, a common electrode 9 and an individual wiring electrode 11 are connected as wiring electrodes to these heat generating portions 8, and the circuit electrode terminals 5-1 of the drive circuit 5 are connected to the individual wiring electrodes 11.
Electrode terminals 12 for connection to the outside are formed at upper and lower ends of the upper surface.

[0009] On these, a partition 13 (13-1, 1-1) is formed on the entire surface except for the connection electrode terminals 12 described above.
3-2, 13-3) are stacked. The partition wall 13 forms a seal partition wall 13-1 on the left side of the ink supply groove 6 for blocking ink from the outside, and on the other hand, the individual wiring electrode 1
A seal partition 13-2 for blocking ink from the outside is formed on the drive circuit 1 and the drive circuit 5, and the seal partition 13-2 of the individual wiring electrode 11 further extends between the heat generating portions 8 between the heat generating portions 8. The partition wall 13-3 is formed.

If the individual partition electrode 13 of the partition 13 and the seal partition 13-2 on the drive circuit 5 are formed as a comb body, the partition 13-3 extends between the heat generating portions 8 from here.
The part has a shape corresponding to the teeth of a comb. At the base between the teeth of the comb, the heat generating portions 8 are arranged, and fine ink pressurizing chambers 14 having a U-shaped cross section are formed by the number of the heat generating portions 8. An ink flow path 15 is formed between the ink pressurizing chamber 14 and the ink supply groove 6.

The one seal partition 13-1 is provided on three sides not facing the ink flow path 15 of the ink supply groove 6 (FIG. 6B,
In (c), only the left side is shown, and the remaining upper and lower sides are not shown).

Further, an orifice plate 16 is laminated on these components, and a large number of the orifices 3 are drilled at positions of the orifice plate 16 which face the heat generating portions 8 as shown in FIG. The four nozzle rows 2 shown in FIG.

With such a shape, the print heads 1 are completed on a number of chip substrates 4 formed on a silicon wafer (not shown). Finally, the silicon wafer is cut using a dicing saw or the like, separated into individual chip substrates 4, die-bonded to a mounting substrate, and connected to terminals to complete the print head 1 in practical units.

In the print head 1, ink supplied from an external ink cartridge or the like to the ink supply hole 7 is supplied to the ink pressurizing chamber 14 via the ink supply groove 6 and the ink flow path 15, and when printing, The heating section 8 is selectively energized according to the print information, instantaneously generates heat, causing a film boiling phenomenon in the ink, and the pressure of the film bubbles causes ink droplets to be ejected from the orifice 3 corresponding to the heating section 8. Are printed dots having a diameter approximately twice as large as that of the print dots, and land on a paper surface (not shown). As a result, an image is formed on the sheet surface.

[0015]

By the way, in the roof shooter type print head 1 described above, an orifice plate 16 is surface-bonded on a partition 13 with an adhesive, and the adhesive strength of the orifice plate 16 is evaluated. In order to test the adhesive strength of the orifice plate 16 by producing a test printhead 1 as described above and performing a peel strength test (peeling strength test) on the printhead 1, the following problems occurred.

That is, a comb-shaped partition wall portion composed of a seal partition wall 13-2 and a partition partition wall 13-3 which form the ink pressurizing chamber 14 by surrounding the heat generating portion 8 from three sides, and a common ink for these portions. It has been measured that the adhesive strength with the orifice plate 16 is different between the opposite side of the common groove 6 and the side wall of the seal partition 13-1, which is arranged to protrude on both sides of the common groove 6, and has a straight side surface.

In this actual measurement, before forming the orifice 3, that is, in a state where the orifice plate 16 is not yet opened and the inside of the print head 1 is sealed from the outside,
When the pressure of this ink injection was increased by injecting ink into the print head 1 from the ink supply hole 7, FIG.
No leakage of ink from the bonding portion with the orifice plate 16 was observed in the comb-shaped partition portion around the ink pressurizing chamber 14 indicated by the arrow B1. In this case, a situation arises in which the endurance of the ink is seen between the seal partition 13-1 and the orifice plate 16, and the durability of the print head 1 is questioned.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned conventional circumstances,
It is an object of the present invention to provide an ink jet printer head in which the partition walls in other parts are also bonded to the orifice plate with the same adhesive strength as the partition walls around the ink pressurizing chamber and a method of manufacturing the same.

[0019]

According to the first aspect of the present invention, there is provided an ink jet printer head having a plurality of energy generating elements which are arranged in a predetermined direction on a substrate and generate pressure energy for discharging a liquid. And a partition partition that is formed on the substrate and forms a pressurized chamber for applying pressure to the liquid by each of the energy generating elements.
An orifice plate provided with an orifice for discharging ink provided so as to overlap with the partition wall, an ink flow path for supplying ink to the pressurizing chamber, and an ink flow path communicating with the ink flow path from the back surface of the substrate; An ink supply groove for supplying ink to the flow path, and a seal partition that is provided continuously on a side of the ink supply groove that does not face the ink flow path and maintains a predetermined distance between the orifice plate and the substrate. An ink jet print head in which the seal partition and the partition and the orifice plate are fixed with an adhesive, wherein at least the end face of the seal partition facing the ink supply groove has a non-linear shape or The seal partition is configured to be partially adhered to the orifice plate.

The adhesive is, for example, a thermoplastic polyimide-based adhesive. For example, as described in claim 3, the seal partition and the partition partition are made of photosensitive polyimide, and a protrusion is formed at a corner that forms a boundary between an end surface and an upper surface. It is formed by being buried in a plastic polyimide adhesive.

Next, according to a fourth aspect of the present invention, there is provided a method of manufacturing an ink jet printer head, comprising: a plurality of energy generating elements arranged in a predetermined direction on a substrate for generating pressure energy for discharging a liquid; A partition wall standing on the substrate and forming a pressurized chamber for applying a pressure to the liquid by each of the energy generating elements, and an orifice provided on the partition wall and having an orifice for ink ejection provided to overlap with the partition wall; A plate, an ink flow path for supplying ink to the pressurizing chamber, an ink supply groove communicating with the ink flow path and supplying ink to the ink flow path from the back surface of the substrate, and the ink in the ink supply groove. A seal partition which is provided continuously on a side not facing the flow path and maintains a gap between the orifice plate and the substrate at a predetermined interval; and A method for manufacturing an ink jet print head in which a cutting partition and the orifice plate are fixed by an adhesive, wherein at least an ink supply groove of the sealing partition is formed using photosensitive polyimide to form the sealing partition and the partition partition. A patterning step of forming opposing end faces to form a non-linear shape or forming the seal partition so as to partially adhere to the orifice plate, and the seal partition patterned by the patterning step; and A curing step of forming projections at corners that are boundaries between side surfaces and upper surfaces of the partition walls and the seal partition by baking the partition walls to be fixed on the substrate, and forming the projections by the curing step. An orifice is formed on the formed seal partition and the partition partition via a thermoplastic polyimide. Placing the rate,
A bonding step of bonding the orifice plate to the seal partition and the partition partition while causing an anchoring effect to be buried in the thermoplastic polyimide by the protrusion with heat and pressure, and .

[0022]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a top view schematically showing a partially cutaway view of an ink jet printer head (hereinafter, simply referred to as a print head) according to a first embodiment when viewed from an orifice plate side. The print head 20 shown in the figure is partially formed on a chip substrate in the same manufacturing process as the print head 1 shown in FIGS. 6 (a) to 6 (d).

That is, in FIG.
Is a drive circuit on the right side of the figure, a plurality of individual wiring electrodes 21 connected to the electrode terminals of the drive circuit, a resistance heating section 22 having one end connected to each of the individual wiring electrodes 21, A common electrode 23 commonly connected to the other end,
An ink supply groove 24 extending in parallel with the direction in which the plurality of resistance heating portions 22 are arranged and formed at a depth of approximately 1/3 to 1/2 of the upper part of the chip substrate. An ink supply hole 25 opened on the back surface of the communicating chip substrate; a seal partition 26 formed on the drive circuit and the individual wiring electrode 21; and the resistance heating portion 22 and the resistance heating portion using the seal partition 26 as a comb body. A partition wall 27 extending in a comb-like shape between the nozzles 22, an ink pressurizing chamber 28 having a U-shaped cross section formed by the seal partition 26 and the partition bulkhead 27, the ink pressurizing chamber 28 and the ink supply An ink flow path 29 is formed between the groove 24.

These drive circuits, individual wiring electrodes 21, resistance heating portions 22, common electrodes 23, ink supply grooves 24, ink supply holes 25, seal partitions 26, partition partitions 27, ink pressurizing chambers 28, and ink channels 29 The configuration of FIG.
The drive circuit 5, the individual wiring electrode 11, the heat generating portion 8, the common electrode 9, the ink supply groove 6, the ink supply hole 7, the seal partition 13-2, the partition partition 13-3, and the ink shown in FIG. The configuration of the pressurizing chamber 14 and the ink flow path 15 is almost the same. Although not shown in FIG. 1, FIGS.
The circuit electrode terminal 5-1 and the connection electrode terminal 12 shown in FIG.
The same electrode terminals as described above are formed.

However, it is significantly different from the cases of FIGS. 1A to 1D, and in this example, the side of the ink supply groove 24 which does not face the ink flow path 29 (the upper and lower sides in FIG. 1, but the upper side in FIG. 1). (Not shown, not shown) The end faces of the seal partition walls 31 and 32, which are continuously provided in three directions, directly facing the ink supply groove 24, that is, on the inside of the print head 20 instead of the outside. Are formed in a comb-like shape similar to the ink pressurizing chamber 28.

As a result, the portions of the seal partitions 31 and 32 facing the ink supply groove 24 and the orifice plate 33 laminated thereon are formed with the seal partition 26 and the partition partition 27 around the ink pressurizing chamber 28. Is very strongly bonded as well as The orifice plate 33 is provided with an orifice 34 at a position corresponding to the resistance heating section 22.

FIGS. 2 (a), 2 (b) and 2 (c) show the above-mentioned seal partition 26.
FIG. 2 (a) is a view for explaining not only the partition wall 27 but also other partitions, that is, the state of strong adhesion between the seal partition walls 31 and 32 and the orifice plate 33 which directly face the ink supply groove 24. FIG. 1 is an enlarged view taken along the line CC ′ of FIG.
FIG. 2B is an enlarged view of a section taken along the line DD 'in FIG. 1, and FIG. 2C is an enlarged view of the section taken along the line EE' of FIG.

FIG. 2A shows a chip substrate 35, a resistance heating section 22, a partition wall 27, an ink pressurizing chamber 28, an orifice plate 33,
And the orifice 34. The partition wall 27 and the orifice plate 33 are adhered through a thermoplastic polyimide.

FIG. 2 (b) also shows a chip substrate 35,
A resistance heating portion 22 formed on the chip substrate 35;
The individual wiring electrode 21 and the common electrode 2 connected to both ends thereof
3, the seal partition 26, the orifice plate 33 and the orifice 34 are shown. The seal partition 26 and the orifice plate 33 are adhered via a thermoplastic polyimide 36.

FIG. 2C also shows the chip substrate 3.
5 and end portions 31-1 and 32-1 of the seal partition wall 31 and seal partition wall 32, which are formed on the chip substrate 35, and which form comb-shaped end surfaces, and the orifice plate 33, respectively. I have. The seal partition 31 and the orifice plate 33 are adhered via a thermoplastic polyimide 36.

The orifice plate 33 has a size of, for example, 13 μm.
It is made of a polyimide film having a thickness of about m, and a very thin thermoplastic polyimide 36 is applied as an adhesive to the lower surface in advance. The orifice plate 33 is attached to the side of the adhesive material made of the thermoplastic polyimide 36 by the partition wall 2.
7, placed on the partition wall 27, the seal partition wall 26, and the seal partition walls 31 and 32 toward the seal partition wall 26 and the seal partition walls 31 and 32, and the adhesive is applied when heat and pressure are applied for a predetermined time. Complete.

The thermoplastic polyimide 36 is softened from about 200 ° C., which is the glass transition point, and is subjected to pressure to form a partition wall 27, a seal partition 26, and a seal partition 3.
Pasted on 1 and 32. Then, the temperature is lowered to be solidified and fixed on and adhered to each of the partition walls.

At this time, in each case of FIGS. 2 (a), (b) and (c), the partition wall 27, the seal partition 26, and the seal partition 3
Protrusions 37, 38, and 39 formed by shrinkage in the firing step are formed at the corners that form the boundaries between the steep side surfaces of the combs 1 and 32 and the upper surface thereof. The protrusions 37, 38 and 39 are made of thermoplastic polyimide 3
6, the adhesive wraps around the protrusions 37, 38 and 39 by the softening of the adhesive consisting of 6 and the external pressure.
It is as if the projections 37, 38, and 39 are anchored with the adhesive buried in the adhesive.

The projections 37, 38 and 39
Is buried in the thermoplastic polyimide 36, and the partition walls (partition partition 27, seal partition 26, ends 31-1 and 32-1 of seal partitions 31 and 32) and the orifice plate 33 are extremely firmly connected to each other. By bonding, a bonding strength of more than the mere adhesion caused by the attraction between chemical molecules by the thermoplastic polyimide 36 is realized.

That is, not only the partition wall 27 and the seal partition wall 26 around the ink pressurizing chamber 28 but also the ink supply groove 2
4, the seal partition walls 31 and 32 also have a side end 31-1.
And the orifice plate 33 is very firmly adhered to the portions 32-1.

FIGS. 3 (a) and 3 (b) are views schematically showing steps of forming the above-mentioned projections 37, 38 and 39. FIG. Same figure
(a) and (b) show only the main part, and the resistance heating part 22, the individual wiring electrode 21, and the common electrode 23 shown in FIGS. 1 and 2 (a) and (b).
And the like are omitted.

First, the pre-stage shape of the partition is patterned. FIG. 3A shows the front-stage shape 41 of the seal partitions 31 and 32 and the partition partition 27. This front stage shape 4
A photosensitive polyimide is used for the partition material 1. First, the above-described drive circuit, which is not shown, the individual wiring electrodes 21,
Common electrode 23 and ink flow path 29 of ink supply groove 24
The photosensitive polyimide is formed on the entire surface of the peripheral chip substrate 35 not facing the above by a spin coater.

Next, a photomask on which the pattern of the pre-stage shape 41 is formed in advance is placed on the photosensitive polyimide film, and the photosensitive polyimide film is developed by an exposure device. Thereafter, the photosensitive polyimide film in a portion that has not been cured by exposure is removed by shower cleaning, thereby patterning the partition wall of the former stage 41 shown in FIG. 3A.

However, the front stage 41 shown in FIG.
Is not a polyimide, but has a monomer called polyamic acid whose internal structure is merely a hardening reaction by photodevelopment so as not to be dissolved by the above shower cleaning. In order to crosslink this monomer to form a polymer, that is, a polyimide, the print head intermediate in the course of the manufacturing process is put into a baking apparatus and baked at a high temperature of 350 ° C. or more. That is, the internal structure of the monomer is crosslinked to form a polyimide.

The above-described photomask is patterned so that the dimensions and thickness after shrinking by baking have the desired dimensions and thickness of the partition walls. FIG. 3B shows the end portions 31-1 and 32-1 of the seal partition walls 31 and 32 and the partition partition wall 27 completed by the above-described firing. As shown in FIG. 3B, the baffle material is changed from the former shape 41 shown in FIG. 3A by baking to the partitions shown in FIG.
2 (see reference line F shown by a two-dot chain line in FIGS. 3A and 3B) when contracting to end portions 31-1 and 32-1 and partition wall 27. Protrusion 39 on the corner formed
And 37 are formed. Similarly, a projection 38 shown in FIG. 2B is formed on the seal partition 26 on the ink pressurizing chamber 28 side.

If the shape of the seal partition walls 31 and 32 is straight, as in the case of the seal partition wall 13-1 shown in FIGS. 6C and 6D, the boundary between the end surfaces and the upper surface is formed. No clear projections as shown in FIG. 3 (b) are formed at the corners forming. Therefore, the seal partition wall 1 shown in FIGS.
If the end face is linear as in 3-1 even if thermoplastic polyimide is used for bonding the orifice plate, an anchoring effect cannot be obtained.

As in the present embodiment, at least the inner end faces of the seal partition walls 31 and 32 are not straightened, but are formed in a comb-like irregular shape like the partition wall around the ink pressurizing chamber, so that firing is performed. The process makes it possible to form clear protrusions, and furthermore, by using thermoplastic polyimide as an adhesive at the time of bonding the orifice plate 33, an effect of anchoring into the adhesive by the above-mentioned protrusions is exerted, and ink pressurization is performed. The orifice plate 33 is provided not only around the chamber but also at least inside the other partition walls.
And adhere firmly.

It should be noted that the shape in which the side sections of the seal partitions 31 and 32 have a comb-like cross section is not limited to the end faces inside the heads of the seal partitions 31 and 32 as described above, but may be formed outside the head. It may be formed on the end face. Then, the orifice plate 33 is firmly bonded not only at the inner end of the partition but also at the side end of the partition over the entire periphery of the chip substrate 35.

The shape of the cross section at the side end of the seal partition walls 31 and 32 is the same as that of the end 31-1 or 32-1.
The shape is not limited to the shape of a comb as described above, but may be a non-linear shape, that is, a shape having irregularities.

FIGS. 4A and 4B show such a seal partition wall 3.
FIG. 4A is a diagram showing an example in which a flat cross section of a side end portion of 1 or 32 forms a non-linear shape other than the comb tooth shape, and FIG. 4A shows an acute peak 42 and a sharp valley 43; (B) shows an end face in which a flat cross section in which a smooth peak portion 44 and a gentle valley portion 45 are formed repeatedly forms a gentle waveform. Is shown.

Incidentally, in the case of the non-linear shape due to the repetition of the irregularities shown in FIGS. 4A and 4B or the non-linear shape of the comb teeth shown in FIG.
The side end of 2 does not necessarily need to be formed so as to be steep from top to bottom.

That is, as shown in FIG. 4C, the upper upper side surface 46 to be bonded to the orifice plate 33 is
It is formed in a non-linear shape consisting of a peak 47 and a valley 48 to a depth of about 1/2, and the lower side 49 of the lower half of the other half.
May be formed in a linear shape.

Even when formed in this manner, the corners of the upper surface of the seal partition wall 31 or 32, which are joined to the orifice plate 33,
The projections 39 shown in FIG. 2C can be formed at the time of firing, so that also in this case, strong adhesion between the seal partition 31 or 32 and the orifice plate 33 can be achieved by the anchoring effect.

Further, the shape of the side surface of the seal partition wall 31 or 32 is not limited to the above-described non-linear shape, and the point is that the upper surface of the seal partition wall 31 or 32 is not a flat surface with no change. Any shape may be used as long as more corners are formed between the steep vertical surface and the upper surface. As a result, a larger number of projections are formed at the corners by baking, so that when they are bonded to the orifice plate, the same anchoring effect as in the case of FIG. Can be demonstrated.

FIG. 5 shows that although the side surface has the same linear shape as the conventional one, the upper surface adhered to the orifice plate is not a flat surface with no change as in the conventional case, but has many vertical surfaces inside. It is a figure which shows the example formed. still,
Since the configuration in the vicinity of the ink pressurizing chamber 28 is the same as that in the case of FIG. 1, the numbering and description are omitted in FIG.

As shown in FIG. 5, the seal partition walls 31 'and 32' have an inner end side surface directly facing the ink supply groove 24, and the side surface has a straight cross section. , A large number of independent chambers 51 are formed. As a result, a large number of corners corresponding to the number of the independent cavities 51 are formed as boundaries between the inner wall, that is, the vertical surface of the independent cavities 51 and the upper surfaces of the seal partition walls 31 ′ and 32 ′. At the corners, as described above, the same projections 39 as those shown in FIG. 2C are formed in the firing step. That is, a number of protrusions 39 are formed on the seal partitions 31 'and 32'.

Thus, even in the shape of the present embodiment, an anchoring effect similar to or greater than that of FIG. 1 is exhibited when bonding to the orifice plate 33, and extremely strong bonding, which has not been seen in the prior art, is achieved. , Seal partition walls 31 and 3
2 and formed between the orifice plate 33.

Incidentally, In each of the above embodiments, a thermal type ink jet printer head has been described, but it is needless to say that the present invention can be applied to a piezo type ink jet printer head.

[0054]

As described above in detail, according to the present invention, the shape of the end face of the seal partition other than the periphery of the ink pressurizing chamber, which has conventionally been low in adhesive strength, is formed so that the cross section becomes non-linear. Therefore, in the baking process for fixing the partition on the chip substrate, a large number of projections can be formed at the corners of the sealing partition and the side surface of the bonding surface with the orifice plate, whereby the seal partition and the orifice plate can be formed. An anchoring effect by the projection can be exerted at the bonding portion with the projection. Therefore, the orifice plate can be firmly and uniformly bonded on the partition wall using a commonly used thermoplastic polyimide-based adhesive without using a special adhesive. An inkjet printer head can be provided.

[Brief description of the drawings]

FIG. 1 is a top view schematically showing a configuration of an ink jet printer head according to a first embodiment, with a portion cut away from an orifice plate side.

FIGS. 2 (a), (b), and (c) show a state of strong adhesion between an orifice plate and other partitions as well as partitions around an ink pressurizing chamber of an ink jet printer head according to the first embodiment. FIG.

FIGS. 3A and 3B are diagrams schematically showing a process of forming a projection of a partition wall of the ink jet printer head according to the first embodiment.

FIGS. 4A and 4B are diagrams showing examples in which a flat cross section of a side end portion of a seal partition other than a peripheral portion of an ink pressing portion forms a non-linear shape other than a comb tooth shape, and FIG. FIG. 4 is a view showing an example in which the end face of the seal partition does not have to form the same plane section from top to bottom.

FIG. 5 is a top view schematically showing a configuration of an ink jet printer head according to a second embodiment, with a part cut away from an orifice plate side.

6A is a plan view showing an ink ejection surface of a conventional thermal roof shooter type ink jet printer head, FIG. 6B is a rear view thereof, and FIG. 6C is a square surrounded by a broken line a in FIG. FIG. 4D is an enlarged view showing the inside with a portion of the orifice plate removed, and FIG. 5D is a sectional view taken along the line AA ′ of FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Print head 2 Nozzle row 3 Orifice 4 Chip board 5 Drive circuit 5-1 Circuit electrode terminal 6 Ink supply groove 7 Ink supply hole 8 Heat generation part 9 Common electrode 11 Individual wiring electrode 12 Connection electrode terminal 13 Partition 13-1 and 13 -2 Seal partition 13-3 Partition partition 14 Ink pressurizing chamber 15 Ink flow path 16 Orifice plate 20 Inkjet printer head (print head) 21 Individual wiring electrode 22 Resistance heating section 23 Common electrode 24 Ink supply groove 25 Ink supply hole 26 Seal Partition wall 27 Partition partition wall 28 Ink pressurizing chamber 29 Ink flow path 31, 32 Seal partition wall 31-1, 32-1 End 33 Orifice plate 34 Orifice 35 Chip substrate 36 Thermoplastic polyimide 37, 38, 39 Projecting part 41 Precedent shape 42 , 44,47 Yamabe 43,45,4 Valleys 46 upper side 49 bottom side 51 independently empty bunches

Claims (4)

[Claims] 1. A plurality of energy generating elements arranged in a predetermined direction on a substrate to generate pressure energy for discharging a liquid, and a plurality of energy generating elements erected on the substrate and formed on the liquid by the energy generating elements. A partition wall for forming a pressurized chamber for applying pressure, an orifice plate provided with an orifice for ink ejection provided to overlap the partition wall, and an ink flow path for supplying ink to the pressurized chamber. An ink supply groove that communicates with the ink flow path and supplies ink from the back surface of the substrate to the ink flow path; and the orifice plate and the substrate that are connected to a side of the ink supply groove that does not face the ink flow path. And an orifice plate which is fixed to the orifice plate by an adhesive. An ink jet print head, wherein at least an end face of the seal partition facing the ink supply groove has a non-linear shape, or wherein the seal partition has a shape partially adhered to an orifice plate. head. 2. The ink jet printer head according to claim 1, wherein said adhesive is a thermoplastic polyimide adhesive. 3. The seal partition wall and the partition partition wall are made of photosensitive polyimide, and a protrusion is formed at a corner that forms a boundary between an end surface and an upper surface, and the protrusion is formed in the thermoplastic polyimide adhesive. 2. The ink jet printer head according to claim 1, wherein the ink jet printer head is buried in the ink jet printer. 4. A plurality of energy generating elements arranged in a predetermined direction on a substrate to generate pressure energy for discharging a liquid, and a plurality of energy generating elements erected on the substrate and formed on the liquid by the energy generating elements. A partition wall for forming a pressurized chamber for applying pressure, an orifice plate provided with an orifice for ink ejection provided to overlap the partition wall, and an ink flow path for supplying ink to the pressurized chamber. An ink supply groove that communicates with the ink flow path and supplies ink from the back surface of the substrate to the ink flow path; and the orifice plate and the substrate that are connected to a side of the ink supply groove that does not face the ink flow path. And an orifice plate which is fixed to the orifice plate by an adhesive. A method of manufacturing a print head, comprising: forming a seal partition and a partition partition using a photosensitive polyimide such that at least an end face of the seal partition facing an ink supply groove is formed in a non-linear shape or the seal is formed. A patterning step of forming a partition wall so as to partially adhere to the orifice plate; and baking the seal partition wall and the partition partition wall patterned by the patterning step so as to be fixed on the substrate. A curing step of forming a projection at a corner that is a boundary between the side wall and the top surface of the partition wall and the seal partition, and on the seal partition and the partition wall where the protrusion is formed by the curing step, An orifice plate is placed via a thermoplastic polyimide, and the orifice plate is sealed with the seal partition and the partition. On the wall, the production method of the ink jet printer head and having a bonding step of bonding while causing the anchoring effect of buried in the thermoplastic in the polyimide by the protrusions in the heat and pressure, the.