JP2006294097A - Method and device for polishing thin-film magnetic head, and method for manufacturing thin-film magnetic head - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method and a device for polishing a thin-film magnetic head, capable of surely adjusting accurate MRH and accurately and surely adjusting MRH or both of TH and NH, and a method for manufacturing the thin-film magnetic head. <P>SOLUTION: A surface opposite the polished surface of a bar member having a plurality of magnetic head elements arrayed at least in a row is fixed to a polishing fixture. In a plurality of different positions along the longitudinal direction of the bar member, the polished surface of the bar member is polished in a state where a first load of a direction perpendicular to the polished surface of the bar member and a second load of a direction opposite to the first load are applied to the polishing fixture. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a thin film magnetic head polishing method and apparatus, and a thin film magnetic head manufacturing method.

  When a thin film magnetic head having a magnetoresistive effect (MR) read head element is manufactured, a polishing process for adjusting the height (MR height, MRH) of the MR head element is performed after the wafer process is completed.

  The polishing process for adjusting the MRH is performed by polishing the air bearing surface (ABS) of the bar member obtained by cutting the wafer for each row so that the plurality of thin film magnetic heads are arranged in a row. The MRH of the magnetic head is adjusted collectively. In order to adjust the MRH between the thin film magnetic heads in each bar member and the MRH between the thin film magnetic heads in the plurality of bar members to an accurate value, an RLG (Resistance) for detecting the polished height is usually used. Each bar member is provided with a plurality of polishing control sensors made of resistive films called “Lapping Guides”, and polishing is controlled in accordance with electrical signals from these polishing control sensors (for example, Patent Document 1). .

  When performing MRH adjustment using such a polishing control sensor, in particular, in order to enable control of MRH for each thin film magnetic head in the bar member, the bar member is attached to each thin film magnetic head via a polishing jig. Polishing is performed while pressing in the direction of the polishing member (for example, Patent Document 2).

Japanese Patent Laid-Open No. 02-095572 JP 2002-157723 A

  The polishing method described in Patent Document 2 merely presses the polishing jig bonded to the surface opposite to the polishing surface of the bar member in the direction of the polishing member. Even if it is performed for each magnetic head, it is difficult to correct the positional deviation of each thin film magnetic head so as to obtain an accurate MRH.

  In a composite thin film magnetic head in which an MR read head element and an inductive write head element (in-plane (horizontal) magnetic recording write head element or perpendicular magnetic recording write head element) are stacked on each other, only MRH is adjusted. Even if the polishing is performed as much as possible, the throat height (TH) of the magnetic pole gap in the in-plane magnetic recording write head element and the neck height (NH) in the perpendicular magnetic recording head element are not necessarily adjusted correctly. That is, even when the driving is performed so that the MRH is correctly obtained, TH or NH may require a different driving amount, and in this case, the stacking direction of the bar member (direction perpendicular to the longitudinal direction) Unless the correction regarding is performed, both MRH and TH or NH cannot be driven correctly.

  Accordingly, the present invention is intended to solve the above-mentioned problems of the prior art, and an object of the present invention is to provide a thin film magnetic head polishing method and apparatus capable of reliably adjusting to an accurate MRH, and a thin film magnetic head. It is to provide a manufacturing method.

  Another object of the present invention is to provide a thin film magnetic head polishing method and apparatus capable of accurately and reliably adjusting both MRH and TH or NH, and a thin film magnetic head manufacturing method.

  According to the present invention, the surface opposite to the polishing surface of the bar member in which the plurality of magnetic head elements are arranged in at least one row is fixed to the polishing jig and is different from each other along the longitudinal direction of the bar member. The polishing surface of the bar member at a plurality of positions in a state where the first load in the direction perpendicular to the polishing surface of the bar member and the second load in the direction opposite to the first load are respectively applied to the polishing jig. A method for polishing a thin film magnetic head is provided.

  The first load in the direction perpendicular to the polishing surface and the second load in the opposite direction are used for polishing at a plurality of different positions along the longitudinal direction of the polishing jig to which the bar member is fixed. Applied to the jig. That is, as in the prior art, the load is applied in two directions, ie, the polishing surface direction and the opposite direction, instead of simply pressing the jig in one direction called the polishing surface direction. For example, at a certain position, for example, a first load is applied in the direction of the polishing surface, and at a position adjacent thereto, for example, a second load is applied in the opposite direction. Therefore, the variation in the distance between the polishing surface and the polishing member existing along the longitudinal direction of the bar member can be accurately and reliably corrected, and this correction can be performed for each thin film magnetic head element or thin film magnetic head element. This can be done for each group. As a result, high-precision polishing, and therefore MRH adjustment can be performed for each thin film magnetic head element or each thin film magnetic head element group.

  The first load and the second load are preferably applied to the polishing jig at a plurality of different positions on a single straight line parallel to the longitudinal direction of the bar member.

  It is also preferable to apply the first load and the second load to the polishing jig at a plurality of different positions on two different straight lines parallel to the longitudinal direction of the bar member. This makes it possible to correct variations in the distance between the polishing surface and the polishing member that exist along the stacking direction of the bar members.

  The first load and the second load are applied in the vicinity of the surface opposite to the surface on which the bar member of the polishing jig is fixed, in the vicinity of the surface on which the bar member is fixed, or on the surface on which the bar member is fixed. It is also preferable to apply at an intermediate position with the surface opposite to this surface.

  It is also preferable that the first load or the second load is a load having a value equal to each other at a plurality of positions or a load having a value different from each other.

  It is preferable to control the first load and the second load according to the measured resistance values of the plurality of polishing resistance films formed on the bar member.

  The third load in the direction parallel to the polishing surface and perpendicular to the longitudinal direction of the bar member, and the third load, at a plurality of different positions along the longitudinal direction of the bar member. It is preferable that the fourth load in the opposite direction is further applied to the polishing jig. A third load in a direction parallel to the polishing surface and perpendicular to the longitudinal direction of the bar member and a fourth load in the opposite direction at a plurality of different positions along the longitudinal direction of the bar member Therefore, the variation in the distance between the polishing surface and the polishing member existing along the stacking direction of the bar member can be accurately and reliably corrected, and this correction can be performed for each thin film magnetic head element. Alternatively, it can be performed for each thin film magnetic head element group. As a result, both MRH and TH or NH can be adjusted with high accuracy, and this can be performed for each thin film magnetic head element or each thin film magnetic head element group.

  It is preferable to control the third load and the fourth load according to the measured resistance values of the plurality of polishing resistance films formed on the bar member.

  It is also preferable that the third load or the fourth load is a load having a value equal to each other at a plurality of positions or a load having a value different from each other.

  Use a solid non-slit polishing jig as the polishing jig, or enter a slit having slits perpendicular to the longitudinal direction of the bar member at a plurality of different positions along the longitudinal direction of the bar member It is also preferable to use a polishing jig.

  Each magnetic head element is preferably composed of an MR read head element and an inductive write head element (in-plane (horizontal) magnetic recording write head element or perpendicular magnetic recording write head element) stacked on each other.

  According to the present invention, a number of magnetic head elements made of thin films are formed on a wafer, and bar members obtained by cutting the wafer are polished by the above-described polishing method. Each of the polished bar members is a magnetic head. There is provided a method of manufacturing a thin film magnetic head that is cut and separated into individual thin film magnetic heads having elements.

  According to the present invention, the polishing member to which the surface opposite to the polishing surface of the bar member, in which the plurality of magnetic head elements are arranged in at least one row, is fixed, and the polishing surface of the bar member is pressed. The first load in the direction perpendicular to the polishing surface of the bar member and the first load in the direction opposite to the first load at a plurality of different positions along the longitudinal direction of the bar member during polishing and the polishing plate applied There is provided a polishing apparatus for a thin film magnetic head comprising first load applying means for applying two loads to a polishing jig.

  The first load in the direction perpendicular to the polishing surface and the second load in the opposite direction are used for polishing at a plurality of different positions along the longitudinal direction of the polishing jig to which the bar member is fixed. Applied to the jig. That is, as in the prior art, the load is applied in two directions, ie, the polishing surface direction and the opposite direction, instead of simply pressing the jig in one direction called the polishing surface direction. For example, at a certain position, for example, a first load is applied in the direction of the polishing surface, and at a position adjacent thereto, for example, a second load is applied in the opposite direction. Therefore, the variation in the distance between the polishing surface and the polishing member existing along the longitudinal direction of the bar member can be accurately and reliably corrected, and this correction can be performed for each thin film magnetic head element or thin film magnetic head element. This can be done for each group. As a result, high-precision polishing, and therefore MRH adjustment can be performed for each thin film magnetic head element or each thin film magnetic head element group.

  The first load applying means is means for applying the first load and the second load to the polishing jig at a plurality of different positions on one straight line parallel to the longitudinal direction of the bar member. It is preferable.

  The first load application means applies the first load and the second load to the polishing jig at a plurality of different positions on two different straight lines parallel to the longitudinal direction of the bar member. It is preferable that This makes it possible to correct variations in the distance between the polishing surface and the polishing member that exist along the stacking direction of the bar members.

  Means for applying the first load and the second load to the vicinity of the surface opposite to the surface to which the bar member of the polishing jig is fixed; the bar member of the polishing jig; Is preferably applied to the vicinity of the fixed surface, or applied to an intermediate position between the surface to which the bar member of the polishing jig is fixed and the surface opposite to this surface.

  It is also preferable that the first load applying unit is a unit that applies a load having an equal value or a load having different values at a plurality of positions as the first load or the second load.

  The first load applying means is preferably means for controlling the first load and the second load according to the measured resistance values of a plurality of polishing resistance films formed on the bar member.

  During polishing of the bar member, a third load in a direction parallel to the polishing surface and perpendicular to the longitudinal direction of the bar member at a plurality of different positions along the longitudinal direction of the bar member, and the third load It is preferable to further comprise second load applying means for further applying a fourth load in the opposite direction to the polishing jig. A third load in a direction parallel to the polishing surface and perpendicular to the longitudinal direction of the bar member and a fourth load in the opposite direction at a plurality of different positions along the longitudinal direction of the bar member Therefore, the variation in the distance between the polishing surface and the polishing member existing along the stacking direction of the bar member can be accurately and reliably corrected, and this correction can be performed for each thin film magnetic head element. Alternatively, it can be performed for each thin film magnetic head element group. As a result, both MRH and TH or NH can be adjusted with high accuracy, and this can be performed for each thin film magnetic head element or each thin film magnetic head element group.

  The second load applying means is preferably means for controlling the third load and the fourth load according to the measured resistance values of the plurality of polishing resistance films formed on the bar member.

  It is also preferable that the second load applying means is means for applying loads having the same value or different values at a plurality of positions as the third load or the fourth load.

  The polishing jig is a solid non-slit polishing jig, or has slits having slits perpendicular to the longitudinal direction of the bar member at a plurality of different positions along the longitudinal direction of the bar member. A polishing jig is also preferable.

  It is also preferred that each magnetic head element comprises an MR read head element and an inductive write head element (in-plane (horizontal) magnetic recording write head element or perpendicular magnetic recording write head element) stacked on each other.

  According to the present invention, variation in the distance between the polishing surface and the polishing member existing along the longitudinal direction of the bar member can be accurately and reliably corrected, and this correction can be performed for each thin film magnetic head element or thin film. This can be done for each magnetic head element group. As a result, high-precision polishing, and therefore MRH adjustment can be performed for each thin film magnetic head element or each thin film magnetic head element group.

  FIG. 1 is a process diagram schematically illustrating a manufacturing process of a thin film magnetic head according to the present invention. The overall manufacturing process of the thin film magnetic head according to the present invention will be schematically described below with reference to FIG.

First, a wafer process is performed. In this wafer process, a number of thin film magnetic head elements such as a tunnel magnetoresistive effect (TMR) head element and a giant magnetoresistive effect (GMR) head are formed on a wafer made of a ceramic material such as AlTiC (Al ₂ O ₃ —TiC). Thin film magnetic head element including magnetoresistive effect (MR) read head element and inductive write head element (in-plane (horizontal) magnetic recording write head element or perpendicular magnetic recording write head element) such as an element and for detecting the polishing amount A plurality of resistance wrapping guides (RLG) are formed by thin film technology (step S1).

  Next, a processing process is performed. In this processing process, the wafer is first cut into a plurality of blocks, and each block is further cut to obtain a plurality of bar members (step S2). In each bar member, a plurality of thin film magnetic head elements and a plurality of RLGs are arranged in a row.

  Next, after performing necessary processing, for example, processing such as grooves and rails, the ABS of each bar member is polished to control the characteristics of the thin film magnetic head element (step S3). This polishing is polishing for adjusting MRH and TH or NH using RLG, and is performed using the polishing method and polishing apparatus of the present invention described later.

  Next, after performing crown adjustment of the bar member and touch polishing for further finishing the state of the lapping surface, the bar member is cut to obtain individual thin film magnetic heads (magnetic head sliders) (step S4).

  2A and 2B are diagrams showing a layer structure of an example of a thin film magnetic head finally manufactured according to the present invention, in which FIG. 2A is a cross-sectional view seen from the ABS direction, and FIG. 2B is a BB line of FIG. It is sectional drawing.

As shown in the figure, for example, permalloy (NiFe) or the like is formed on a substrate (wafer) 10 made of Altic (Al ₂ O ₃ —TiC) or the like via an insulating layer 11 made of alumina (Al ₂ O ₃ ) or the like. A lower shield and electrode layer 12, for example, a shield gap layer 13 made of alumina or the like, and an upper shield and electrode layer 14 made of, for example, permalloy or the like are sequentially laminated. In the shield gap layer 13, an MR laminate 16 such as a TMR laminate or a GMR laminate is formed so as to be exposed to the ABS 15 through a coating film. An MR read head element is constituted by the lower shield and electrode layer 12, the shield gap layer 13, the upper shield and electrode layer 14, the MR laminate 16, and the like.

An auxiliary magnetic pole layer 18 made of, for example, permalloy or the like is laminated on the upper shield and the electrode layer 14 via a separation layer 17 made of, for example, alumina, and the like, for example, made of alumina, silicon oxide (SiO ₂ ), or the like. A thin film coil 20 made of, for example, copper (Cu) surrounded by the gap layers 19a, 19b and 19c is formed.

  On the gap layer 19 c, the magnetic pole part 22 a and the yoke part 22 b of the main magnetic pole layer 22 made of, for example, permalloy are formed via the seed layer 21. The tip of the magnetic pole portion 22a is often formed of a material having a saturation magnetic flux density greater than that of permalloy. The yoke portion 22b is magnetically connected to the auxiliary magnetic pole layer 18 via a connecting portion 23 located rearward when viewed from the ABS 15.

  An overcoat layer 24 made of alumina or the like is formed on the thin film coil 20 and the main magnetic pole layer 23, for example.

  As can be seen from FIG. 2, this thin film magnetic head includes an MR read head element and a perpendicular magnetic recording write head element that is stacked thereon and generates a recording magnetic field in a direction perpendicular to the surface of the recording medium. This is a composite thin film magnetic head.

  FIG. 3 schematically shows a configuration in which a bar member is attached to a polishing apparatus and actually polished as one embodiment of the present invention, and (A) is viewed from a direction perpendicular to the longitudinal direction of the bar member. A front view and (B) are the side views seen from the longitudinal direction of the bar member. 4A and 4B show only the portion of the polishing jig to which the bar member is fixed, FIG. 4B is a side view, FIG. 4C is an explanatory view of a connecting portion with a load transmission body, and FIG. FIG.

  For the sake of simplicity, as shown in FIGS. 3 and 4, the direction parallel to the longitudinal direction of the bar member is the X-axis direction, the direction perpendicular to the longitudinal direction of the bar member, and the polished surface of the bar member The direction perpendicular to the Y axis direction is the direction perpendicular to the longitudinal direction of the bar member and the direction parallel to the polished surface of the bar member is the Z axis direction. Further, the positive direction of the X axis is one direction (right direction in FIG. 3A), the positive direction of the Y axis is away from the polishing plate (upward direction in FIG. 3A), the Z axis The positive direction is defined as one direction (the front side in FIG. 3A). This direction also applies to the already described FIG.

  3A and 3B, and FIGS. 4A, 4B, and 4C, 30 is a bar member to be polished, 31 is a rotating polishing plate with which the polishing surface 30a of the bar member 30 abuts, 32 is a rotating shaft of the polishing plate 31, 33 is a polishing jig in which the surface 30b opposite to the polishing surface 30a of the bar member 30 is fixed by bonding or the like, 34 is a bottom portion of the polishing jig 33 (bar member fixing) It is a holder member that firmly holds both ends in the X-axis direction at the end portion close to the surface. By this holder member 34, the polishing jig 33 and the bar member 30 fixed thereto are fixed to the polishing apparatus. However, it is substantially fixed in the X-axis direction and the Z-axis direction and has a degree of freedom only in the Y-axis direction.

  In the present embodiment, the polishing jig 33 has slits 33a in a direction perpendicular to the X-axis direction at a plurality of different positions along the X-axis direction. In the present embodiment, these slits 33a are opened toward the positive direction of the Y axis, but may be opened toward the negative direction of the Y axis.

  The polishing jig 33 is divided by the slits 33a into a plurality of strips 33b whose bottoms are connected, and has a comb shape. Each strip 33b is provided for each thin film magnetic head element or group of thin film magnetic head elements of the bar member 30.

  One end of a Y-axis load transmitting body 35 for applying a load in the positive or negative direction of the Y axis is connected to the top of each strip 33b of the polishing jig 33 (the top in the positive direction of the Y axis). Has been. The other end of the Y-axis load transmission body 35 is connected to the actuator 36. The actuator 36 is composed of, for example, a cylinder that uses fluid pressure such as hydraulic pressure, water pressure, and air pressure, or a plunger that uses an electromagnet, and generates a positive or negative load on the Y axis. As shown in FIG. 4C, one end of the Y-axis load transmitting body 35 and the top of the strip 33b of the polishing jig 33 are formed by stripping the ball portion 35a formed at one end of the Y-axis load transmitting body 35. It connects by fitting in the spherical hole 33c formed in the top part of the part 33b. For this reason, the load in the positive or negative direction of the Y axis transmitted by the Y axis load transmitting body 35 is applied to the strip portion 33b.

  Further, a pair of Z-axis loads for applying a load in the positive or negative direction of the Z-axis is slightly below the top of each strip 33b of the polishing jig 33 (the top in the positive direction of the Y-axis). One ends of the transmission bodies 37a and 37b are connected so as to press against each other. The other ends of these Z-axis load transmission bodies 37a and 37b are connected to actuators 38a and 38b, respectively. Each of the actuators 38a and 38b is composed of, for example, a cylinder using fluid pressure such as hydraulic pressure, water pressure, air pressure, or a plunger using an electromagnet, and generates loads in the positive and negative directions of the Z axis, respectively. . Accordingly, a load in the positive or negative direction of the Z-axis is applied slightly below the top of the strip 33b by the pressing of the Z-axis load transmitting body 37a or 37b.

  The load in the positive or negative direction of the Z-axis is configured to be applied slightly below the top of the strip 33b ′ by a single Z-axis load transmitting body 37 ′ as shown in FIG. 4 (D). May be.

  The plurality of actuators 36 and the actuators 38a and 38b are electrically connected to a load and polishing control circuit 39, and load values in the X-axis direction and the Z-axis direction are controlled according to the load control signal. A polishing amount signal corresponding to the polishing amount from a plurality of RLGs provided on the bar member 30 is applied to the load and polishing control circuit 39, and each actuator is controlled and polished according to the polishing amount signal. The amount is controlled.

More specifically, in the present embodiment, the bar member 30 has a magnetic head element region HEAD _{RGN in} which the MR read head element 40 and the perpendicular magnetic recording write head element 41 are laminated, and the MR read head element 40. RLG region RLG _W-RGN having an RLG region RLG _R-RGN having a read element surface RLG42 formed in substantially the same laminated plane and a write element surface RLG43 formed in substantially the same laminated plane as the perpendicular magnetic recording write head element 41. Are formed in plural. Both ends of the read element surface RLG 42 are electrically connected to the electrode pad 45 via the lead conductor 44, and both ends of the write element surface RLG 43 are electrically connected to the electrode pad 47 via the lead conductor 46. These electrode pads 45 and 47 are electrically connected to the load and polishing control circuit 39 by lead wires 48 and 49, respectively, when the bar member 30 is fixed to the polishing jig 33. As a result, a polishing amount signal corresponding to the resistance values at both ends of the read element surface RLG 42 and the write element surface RLG 43 is input to the load and polishing control circuit 39. In FIG. 3, the write element surface RLG is further formed in the RLG region RLG _R-RGN , and the read element surface RLG is further formed in the RLG region RLG _W-RGN , but these are not connected to the electrode pads. Not used. These need not be formed.

In this embodiment, as shown in FIG. 5A, the magnetic head element region HEAD _RGN , RLG region RLG _R-RGN, and RLG region RLG _W-RGN are RLG _R-RGN and HEAD _RGN on the bar member 30. , RLG _W-RGN and HEAD _RGN . As a modification of this embodiment, as shown in FIG. 5 (B), on the bar member, RLG _R-RGN , HEAD _RGN , HEAD _RGN , RLG _W-RGN , HEAD _RGN , and HEAD _RGN are arranged repeatedly. Anyway.

  Hereinafter, the operation and effects of the polishing apparatus of this embodiment will be described.

  As shown in FIG. 6A, a large number of thin film magnetic head elements are formed on the wafer 10 by thin film technology. However, in recent wafer processes, a plurality of wafers are not exposed in one shot. It is common to expose with shots. However, a slight misalignment always occurs in the shot arrangement of an exposure apparatus such as a stepper or a scanner. That is, even when the same exposure apparatus is used and the same alignment mark is used, different positional deviations occur on the respective lamination planes. In addition, when different alignment marks are used, the positional deviation becomes large. In addition, when different exposure apparatuses are used for the respective planes of lamination, since the habits of alignment, shot arrangement, lens distortion, etc. for each apparatus are different, the arrangement accuracy of elements deteriorates. In addition, even when the bar member itself is bent, the arrangement accuracy of the elements deteriorates.

  As shown in an enlarged view in FIG. 6B, a positional deviation 63 in the Y-axis direction occurs between the shot areas 60 and 62 and the shot area 61 even in the same stack plane. ing. Further, as shown in FIG. 7, even if the magnetic head elements are formed at the same position in the same shot region 62, the MR read head element 62a and the perpendicular magnetic recording write head element 62b having different lamination planes are used. The distances Da and Db from the ABS 64 are different from each other in the amount of follow-up by polishing. That is, the MR read head element 62a is displaced by (Da−Db) in the positive direction of the Y axis with respect to the perpendicular magnetic recording write head element 62b. In the shot region 61, the perpendicular magnetic recording write head element is displaced in the positive direction of the Y axis with respect to the MR read head element. In the shot area 60, there is no deviation between the two. This deviation also occurs when the bar member itself is bent.

  In the present embodiment, a load in the positive direction or the negative direction of the Y axis is applied from the actuator 36 to each of the strip portions 33b of the polishing jig 33 with respect to the positional deviation of the elements in the same stacking plane. Even at the boundary between the shot region 62 and the shot region 61, the bar member 30 is deformed and polished so that the positional deviation in the Y-axis direction is accurately corrected. The load in the positive direction of the Y axis and the load in the negative direction applied to each of the plurality of strip portions 33b may be equal to or different from each other. Although there are various methods for controlling the load in the Y-axis direction, in this embodiment, the resistance values of the read element surface RLG42 on the bar member 30 are compared, and the strip portions 33b are set so that they are equal to each other. The load in the positive direction and the load in the negative direction applied to the Y axis are adjusted. Specifically, a load is applied in the negative direction of the Y axis when the resistance value is small, and a load is applied in the positive direction of the Y axis when the resistance value is large. As a result, it becomes possible to correctly control the polishing follow-up amount.

  As shown in FIG. 9A, for example, even when the bar member 30 is bent in the Y-axis direction and the arrangement of the elements is shifted, the load 90 at each position is increased in the positive and negative directions of the Y-axis. This deflection can be accurately corrected by controlling each of them. FIG. 9A is a cross-sectional view taken along plane A in FIG.

  In addition, in the present embodiment, the load in the positive or negative direction of the Z axis is applied to each of the strip portions 33b of the polishing jig 33 from the actuators 38a and 38b with respect to the positional deviation of the elements between different stacked planes. Since this is applied, the bar member 30 is deformed and polished so that the positional deviation in the Y-axis direction is accurately corrected. Actual polishing is performed with both a load in the Y-axis direction and a load in the Z-axis direction applied. The polishing direction may be any direction on the XY plane, and may be a linear direction or a rotational direction. The positive load and the negative load applied to the plurality of strip portions 33b may be the same or different from each other. Although there are various methods for controlling the load in the Z-axis direction, in this embodiment, the read element surface RLG42 and the write element surface RLG43 of the bar member 30 provided so as to be positioned in the same strip portion 33b are mutually connected. The Z-axis positive load and negative load applied to each strip 33b are adjusted so as to be equal. Specifically, when the resistance value of the read element surface RLG42 is larger than the resistance value of the write element surface RLG43, a load is applied in the negative direction of the Z axis, and in the opposite case, a load is applied in the positive direction of the Z axis. When both are equal, either no load is applied in the positive direction and the negative direction of the Z-axis, or an equal load is applied. As a result, it becomes possible to correctly control the polishing follow-up amount.

  As shown in FIG. 9B, for example, even when the bar member 30 is bent in the Z-axis direction and a positional deviation in the Y-axis direction occurs between the lamination planes, the load 91 at each position is changed to the Z-axis. This deflection can be accurately corrected by controlling each in the positive and negative directions. FIG. 9B is a cross-sectional view taken along plane B in FIG.

  The bar member 30 having the configuration of the present embodiment was prepared, and MRH and NH were adjusted by actually performing polishing by the polishing method of the present embodiment and the polishing method in which no load in the Z-axis direction was applied. The number of bar members is 10 for 240 elements.

  The MRH adjustment target is 0.1 μm, the resistance film height design value on the read element surface RLG at that time is 0.3 μm, the NH adjustment target is 0.15 μm, and the resistance film height design on the write element surface RLG at that time The design and process of the magnetic head element and RLG were set so that the value was 0.3 μm. Further, the RLG design and process were set so that the relationship between the height of each RLG and the resistance value was as shown in FIG. As described above, the arrangement of the magnetic head element and the RLG is as shown in FIG.

Based on such conditions, after forming a magnetic head element including a number of MR read head elements and perpendicular magnetic recording write head elements, a read element surface RLG, and a write element surface RLG on the wafer, the bar member 30 is formed. Cut out. The surface of the cut bar member 30 opposite to the ABS was adhered to the polishing jig 33, and the terminal pads of the read element surface RLG and the write element surface RLG were connected to the load and polishing control circuit. In this case, two magnetic head element regions HEAD _RGN , one RLG region RLG _R-RGN, and one RLG region RLG _W-RGN of the bar member 30 are positioned on one strip portion 33a of the polishing jig 33. Set.

  The polished surface of the bar member 30 mounted on the polishing jig 33 in this manner was polished with a diamond rotating abrasive plate having a mean particle size of 0.1 μm and grinding oil with a rotating rotary plate made of tin (following in the height direction). ) In this case, the rotation direction was determined so that the diamond abrasive grains hit the polishing surface from the negative direction of the Z axis.

  While monitoring the resistance values of the read element surface RLG42 and the write element surface RLG43, the load in the Y-axis direction is controlled by one actuator 36, and simultaneously the load in the Z-axis direction is controlled by the two actuators 38a and 38b. I did it. Actually, the resistance values of all the reading element surfaces RLG42 on the bar member 30 are compared, and the load in the positive direction and the negative direction in the Y axis applied to each strip portion 33b so that they are equal to each other. And adjusted. Specifically, a load was applied in the negative direction of the Y axis when the resistance value was small, and a load was applied in the positive direction of the Y axis when the resistance value was large. At the same time, the load in the positive direction of the Z-axis applied to each strip 33b so that the reading element surface RLG42 and the writing element surface RLG43 of the bar member 30 provided so as to be positioned in the same strip 33b are equal to each other. And negative load were adjusted. Specifically, when the resistance value of the read element surface RLG42 is larger than the resistance value of the write element surface RLG43, a load is applied in the negative direction of the Z axis, and in the opposite case, a load is applied in the positive direction of the Z axis. When both were equal, the load was not applied to the positive direction and the negative direction of the Z axis, or equal load was applied.

  Polishing was terminated when the average resistance value of each read element surface RLG42 reached 210Ω.

  The cross section of each magnetic head element of the bar member 30 after polishing was observed with a scanning electron microscope (SEM), and the average values and distribution of MRH and NH were determined. The results are shown in Table 1.

  From Table 1, even when the load control in the Z-axis direction is not performed and only the load in the Y-axis direction is controlled, the load on the Y-axis is controlled in both the positive direction and the negative direction. It can be seen that the average value is correctly controlled to the target value. Further, in the present embodiment in which load control in the Z-axis direction is also performed, not only MRH but also the average value of NH is correctly controlled to the target value, which is a vertical that requires highly accurate NH. This is a very important advantage for a magnetic recording type write magnetic head element.

  FIG. 11 is a front view showing only a portion of a polishing jig to which a bar member is fixed as another embodiment of the present invention.

  This embodiment is different from the embodiment of FIG. 3 only in the holder member 114 for fixing the polishing jig 113 to the polishing apparatus, and the other configurations and operational effects are substantially the same as those of the embodiment of FIG. It is. Therefore, in FIG. 11, the same reference numerals are used for the same components as in FIG.

  The holder member 114 of the present embodiment is inserted in the X-axis direction at the bottom portion (end portion in the negative direction of the Y axis) of the polishing jig 113 and holds the polishing jig 113 firmly. By this holder member 114, the polishing jig 113 and the bar member 30 fixed thereto are fixed to the polishing apparatus. However, it is substantially fixed in the X-axis direction and the Z-axis direction and has a degree of freedom only in the Y-axis direction.

  FIG. 12 is a front view showing only a portion of a polishing jig to which a bar member is fixed as still another embodiment of the present invention.

  In the present embodiment, there is no holder member, and the polishing jig 123 is only different from that in the embodiment of FIG. 3, and other configurations and operational effects are substantially the same as those in the embodiment of FIG. 3. Accordingly, in FIG. 12, the same reference numerals are used for the same components as in FIG.

  The polishing jig 123 of this embodiment is directly fixed to the polishing apparatus without a holder member. Also in this case, it is substantially fixed with respect to the X-axis direction and the Z-axis direction, and has a degree of freedom only in the Y-axis direction.

  FIG. 13 shows, as still another embodiment of the present invention, (A) a front view, (B) a side view, and (C) a connection with a load transmission body, showing only a portion of a polishing jig to which a bar member is fixed. It is explanatory drawing of a part.

  This embodiment is different from the embodiment of FIG. 3 only in the structure of the Y-axis load transmitting body 135 for applying a load in the positive or negative direction of the Y-axis to the polishing jig 133 and its connection position. The other configurations and operational effects are almost the same as those of the embodiment of FIG. Therefore, in FIG. 13, the same reference numerals are used for the same components as in FIG.

  A through hole along the Z-axis is located at the bottom (end in the negative direction of the Y-axis) of the polishing jig 133 and below each slit 133a between the strips 133b (in the negative direction of the Y-axis). 133c is formed, and a part of the Y-axis load transmission body 135 for applying a load in the positive direction or the negative direction of the Y-axis is inserted therethrough. The upper end (the end in the positive direction of the Y axis) of the Y axis load transmitting body 135 is connected to the actuator 36. As shown in FIG. 13C, a ball portion 135a is formed in the middle portion of the Y-axis load transmitting body 135 inserted through the through hole 133c of the polishing jig 133, and this is formed in the through hole 133c. The polishing jig 133 and the Y-axis load transmission body 135 are connected by being fitted into the formed spherical hole 133d. Therefore, a positive or negative load on the Y axis transmitted by the Y axis load transmitting body 135 is applied to the polishing jig 133.

  As a modification of this embodiment, the holder member 34 is a holder member having a structure as shown in the embodiment of FIG. 11, or the holder jig is not provided as in the embodiment of FIG. 12, and the polishing jig is directly polished. You may attach to an apparatus.

  FIG. 14 is a front view showing only a portion of a polishing jig to which a bar member is fixed as still another embodiment of the present invention.

  In the present embodiment, the connection position of the Y-axis load transmitting body 135 for applying a load in the positive or negative direction of the Y axis to the polishing jig 143 is only different from that in the embodiment of FIG. The configuration and operational effects of are substantially the same as those of the embodiment of FIG. Therefore, in FIG. 14, the same reference numerals are used for the same components as in FIG.

  A through hole 143c along the Z axis is formed at the bottom of the polishing jig 143 (the end in the negative direction of the Y axis) and below the strip 143b (in the negative direction of the Y axis). A part of the Y-axis load transmitting body 135 for applying a load in the positive direction or the negative direction of the Y axis passes through the inside. The upper end (the end in the positive direction of the Y axis) of the Y axis load transmitting body 135 is connected to the actuator 36 as in the embodiment of FIG. As in the case of the embodiment of FIG. 13, a ball portion is formed in the middle portion of the Y-axis load transmitting body 135 inserted through the through hole 143c of the polishing jig 143, and this is formed in the through hole 143c. The polishing jig 143 and the Y-axis load transmission body 135 are connected by being fitted into the spherical hole. For this reason, the load in the positive or negative direction of the Y axis transmitted by the Y axis load transmitting body 135 is applied to the polishing jig 143.

  As a modification of this embodiment, the holder member 34 is a holder member having a structure as shown in the embodiment of FIG. 11, or the holder jig is not provided as in the embodiment of FIG. 12, and the polishing jig is directly polished. You may attach to an apparatus.

  FIG. 15 shows, as still another embodiment of the present invention, (A) a front view, (B) a side view, and (C) a connecting portion with a load transmission body, showing only a portion of a polishing jig to which a bar member is fixed. It is explanatory drawing of.

  In the present embodiment, the structure of the Y-axis load transmitting body 155 itself for applying a load in the positive or negative direction of the Y-axis to the polishing jig 153 and the connection position thereof are different from those in the embodiment of FIG. The other configurations and operational effects are almost the same as those of the embodiment of FIG. Accordingly, in FIG. 15, the same reference numerals are used for the same components as in FIG.

  A through hole 153c along the Z axis is formed in an intermediate portion (intermediate portion in the Y-axis direction) of each strip portion 153b of the polishing jig 153, and the inside thereof is formed in the positive or negative direction of the Y axis. A part of the Y-axis load transmission body 155 for applying a load is inserted. The upper end (the end in the positive direction of the Y axis) of this Y axis load transmitting body 155 is connected to the actuator 36. As shown in FIG. 15C, a ball portion 155a is formed in an intermediate portion of the Y-axis load transmitting body 155 inserted through the through hole 153c of the polishing jig 153, and this is formed in the through hole 153c. The polishing jig 153 and the Y-axis load transmission body 155 are connected by being fitted in the spherical hole 153d. For this reason, a positive or negative load on the Y axis transmitted by the Y axis load transmitting body 155 is applied to the polishing jig 153.

  As a modification of this embodiment, the holder member 34 is a holder member having a structure as shown in the embodiment of FIG. 11, or the holder jig is not provided as in the embodiment of FIG. 12, and the polishing jig is directly polished. You may attach to an apparatus.

  FIG. 16 shows, as still another embodiment of the present invention, (A) a front view, (B) a side view, and (C) a connection with a load transmission body, showing only a portion of a polishing jig to which a bar member is fixed. It is explanatory drawing of a part.

  In this embodiment, Y-axis load transmission bodies for applying a load in the positive or negative direction of the Y-axis to the polishing jig 163 are arranged in two rows parallel to the Y-axis direction, and in the Z-axis direction. 3 is different from the embodiment of FIG. 3 only in that there is no structure for applying the load, and other configurations and operational effects are substantially the same as those of the embodiment of FIG. Accordingly, in FIG. 16, the same reference numerals are used for the same components as in FIG.

  As shown in FIG. 16A, a mechanism for applying a load in the Z-axis direction to the polishing jig 163 is not provided, and instead, the top of each strip 163b of the polishing jig 163 ( One end of two Y-axis load transmission bodies 165a and 165b for applying a load in the positive or negative direction of the Y-axis is connected to the top of the Y-axis in the positive direction. These Y-axis load transmission bodies 165a and 165b are arranged at different positions in the stacking direction, that is, along the Z-axis, and their other ends are connected to two actuators (not shown). These actuators are composed of, for example, a cylinder using fluid pressure such as hydraulic pressure, water pressure, and air pressure, or a plunger using an electromagnet, and generate a positive or negative load on the Y axis independently of each other. One end of each of the Y-axis load transmission bodies 165a and 165b and the top of the strip 163b of the polishing jig 163 are formed at one end of the Y-axis load transmission body 165a, for example, as shown in FIG. The ball part 165aa is connected by fitting into a spherical hole 163c formed at the top of the strip part 163b. For this reason, the positive or negative load of the Y axis transmitted by the Y axis load transmitting body 165 is applied to the strip portion 163b. In addition, in the present embodiment, since the Y-axis load transmission bodies 165a and 165b are arranged along the Z-axis direction, it is possible to prevent element misalignment between different stacked planes by making the loads different from each other. The bar member 30 is deformed and polished so that the positional deviation in the Y-axis direction at each position in the Z-axis direction is accurately corrected. There are various methods for controlling the load in the Y-axis direction by the Y-axis load transmitting bodies 165a and 165b. In this embodiment, the resistance values of the read element surface RLG42 on the bar member 30 are compared, and these are mutually compared. The Y-axis positive direction applied to each strip 163b from the Y-axis load transmitting body 165b positioned on the substrate side of the bar member 30 (lamination surface side of the read head element, negative Z-axis side) so as to be equal Adjust the load and negative load. Specifically, a load is applied in the negative direction of the Y axis when the resistance value is small, and a load is applied in the positive direction of the Y axis when the resistance value is large. Further, the Y-axis load transmitting body 165a applied to the same strip portion 163b and the read element surface RLG42 of the bar member 30 provided so as to be positioned in the same strip portion 163b are equal to each other. The load by 165b is adjusted. Specifically, when the resistance value of the read element surface RLG42 is larger than the resistance value of the write element surface RLG43, the loads of the Y-axis load transmission bodies 165a and 165b are adjusted so that the load is applied in the negative direction of the Z-axis. In the opposite case, the loads on the Y-axis load transmitting bodies 165a and 165b are adjusted so that the load is applied in the positive direction of the Z-axis. When both are equal, it adjusts so that the load from Y axis load transmission bodies 165a and 165b may become equal mutually. As a result, it becomes possible to correctly control the polishing follow-up amount.

  FIGS. 17A and 17B are (A) a front view and (B) a side view showing only a portion of a polishing jig to which a bar member is fixed as still another embodiment of the present invention.

  This embodiment is different from the embodiment of FIG. 16 only in the holder member 174 for fixing the polishing jig 173 to the polishing apparatus, and the other configuration and operation effects are almost the same as those of the embodiment of FIG. It is. Accordingly, in FIG. 17, the same reference numerals are used for the same components as in FIG.

  The holder member 174 of this embodiment is inserted in the X-axis direction at the bottom portion (end portion in the negative direction of the Y-axis) of the polishing jig 173 and holds the polishing jig 173 firmly. By this holder member 174, the polishing jig 173 and the bar member 30 fixed thereto are fixed to the polishing apparatus. However, it is substantially fixed in the X-axis direction and the Z-axis direction and has a degree of freedom only in the Y-axis direction.

  18A and 18B are (A) a front view and (B) a side view showing only a portion of a polishing jig to which a bar member is fixed as still another embodiment of the present invention.

  In the present embodiment, there is no holder member, and the polishing jig 183 is only different from that in the embodiment of FIG. 16, and the other configurations and operational effects are almost the same as those in the embodiment of FIG. Accordingly, in FIG. 18, the same reference numerals are used for the same components as in FIG.

  The polishing jig 183 of the present embodiment is directly fixed to the polishing apparatus without a holder member. Also in this case, it is substantially fixed with respect to the X-axis direction and the Z-axis direction and has a degree of freedom only in the Y-axis direction.

  FIG. 19 is a front view and a side view (B) showing only a portion of a polishing jig to which a bar member is fixed as still another embodiment of the present invention.

  This embodiment is different from the embodiment of FIG. 18 only in the structure of the polishing jig 193 itself, and the other configurations and functions and effects are substantially the same as those of the embodiment of FIG. Accordingly, in FIG. 19, the same reference numerals are used for the same components as in FIG.

  The polishing jig 193 of the present embodiment is not formed with slits, and thus has a solid configuration that is not divided into strips, and directly to the polishing apparatus without a holder member. Fixed. Also in this case, it is substantially fixed with respect to the X-axis direction and the Z-axis direction and has a degree of freedom only in the Y-axis direction.

  20A and 20B are (A) a front view and (B) a side view showing only a portion of a polishing jig to which a bar member is fixed as still another embodiment of the present invention.

  This embodiment is different from the embodiment of FIG. 19 in that the Y-axis load transmitting body 205 for applying a load in the positive or negative direction of the Y axis to the polishing jig 203 is arranged in one row. Other configurations and operational effects are almost the same as those of the embodiment of FIG. Accordingly, in FIG. 20, the same reference numerals are used for the same components as in FIG.

  The configuration in which the Y-axis load transmission body 205 is in one row is the same as that in the embodiment of FIG. Even in the configuration of the present embodiment, the load in the positive direction or the negative direction of the Y axis is applied to each position of the polishing jig 203 with respect to the positional deviation of the elements in the same stacking plane. The bar member 30 is deformed and polished so that the positional deviation in the axial direction is accurately corrected. As a result, it becomes possible to correctly control the polishing follow-up amount.

  FIG. 21 is a front view and a side view schematically showing a configuration when a bar member is attached to a polishing apparatus and actually polished as another embodiment of the present invention, and FIG. FIG. 3 is a diagram for explaining how to arrange the magnetic head element region and the RLG region on the bar member.

  This embodiment is different from the embodiment of FIG. 3 only in the configuration of the RLG formed on the bar member 210, and the other configurations and operational effects are substantially the same as those in the embodiment of FIG. Accordingly, in FIG. 21, the same reference numerals are used for the same components as in FIG.

In the present embodiment, the bar member 210 has a magnetic head element region HEAD _{RGN in} which the MR read head element 40 and the perpendicular magnetic recording write head element 41 are stacked, and substantially the same stack plane as the MR read head element 40. A plurality of RLG regions RLG _RW-RGN having both the formed read element surface RLG 42 and the write element surface RLG 43 formed in substantially the same stacked plane as the perpendicular magnetic recording write head element 41 are formed. Both ends of the read element surface RLG 42 are electrically connected to the electrode pads 225 and 226 via the lead conductor 44, and both ends of the write element surface RLG 43 are electrically connected to the electrode pads 226 and 227 via the lead conductor 46. Has been. The electrode pads 225 to 227 are electrically connected to the load and the polishing control circuit 39 by lead wires 228 to 230 when the bar member 210 is fixed to the polishing jig 33, respectively. As a result, a polishing amount signal corresponding to the resistance values at both ends of the read element surface RLG 42 and the write element surface RLG 43 is input to the load and polishing control circuit 39.

In this embodiment, as shown in FIG. 22A, the magnetic head element region HEAD _RGN and the RLG region RLG _RW-RGN are arranged alternately on the bar member 30, that is, by repeating RLG _RW-RGN and HEAD _RGN. Has been. As a modified aspect of the present embodiment, as shown in FIG. 22 (B), it may be arranged on the bar member by repeating RLG _RW-RGN , HEAD _RGN , HEAD _RGN , or FIG. 22 (C). As shown in FIG. 4, the RLG _RW-RGN , HEAD _RGN , HEAD _RGN , HEAD _RGN , and HEAD _RGN may be repeatedly arranged on the bar member.

  As a further modification of the present embodiment, the holder member 34 is a holder member having a structure as in the embodiment of FIG. 11, or no holder member is used as in the embodiment of FIG. You may attach to a grinding | polishing apparatus. Furthermore, you may use the grinding | polishing jig | tool, actuator, and load transmission body which were comprised like embodiment of FIGS. 13-20.

  In the embodiment and the modification described above, the perpendicular magnetic recording write head element is used as the inductive write head element. However, the present invention can be applied even when an in-plane (horizontal) magnetic recording write head element is used as the inductive write head element. It is clear that the same applies.

  All the embodiments described above are illustrative of the present invention and are not intended to be limiting, and the present invention can be implemented in other various modifications and changes. Therefore, the scope of the present invention is defined only by the claims and their equivalents.

It is process drawing which shows the manufacturing process of the thin film magnetic head in this invention very roughly. 1 is a cross-sectional view showing a layer structure of an example of a thin film magnetic head finally manufactured according to the present invention. FIG. 1 is a front view and a side view schematically showing a configuration when a bar member is attached to a polishing apparatus and actually polished as one embodiment of the present invention. It is the front view which shows only the part of the grinding | polishing jig | tool which fixed the bar member in embodiment of FIG. 3, the side view, explanatory drawing of the connection part with a load transmission body, and the side view of a change aspect. FIG. 4 is a diagram for explaining how to arrange a magnetic head element region and an RLG region on a bar member in the embodiment of FIG. 3 and its modification. It is a figure explaining the position shift of the shot arrangement | sequence in a wafer process. It is a figure explaining the position shift between different lamination planes in a wafer process. It is a perspective view for demonstrating a mode that the bending of a bar member is correct | amended. It is sectional drawing of the surface A and the surface B of FIG. It is a figure which shows the relationship between the height of RLG, and resistance value. It is a front view which shows only the part of the grinding | polishing jig | tool which fixed the bar member as other embodiment of this invention. FIG. 10 is a front view showing only a portion of a polishing jig to which a bar member is fixed as still another embodiment of the present invention. As still another embodiment of the present invention, it is a front view showing only a portion of a polishing jig to which a bar member is fixed, a side view, and an explanatory view of a connecting portion with a load transmission body. FIG. 10 is a front view showing only a portion of a polishing jig to which a bar member is fixed as still another embodiment of the present invention. As another embodiment of the present invention, it is a front view showing only a portion of a polishing jig to which a bar member is fixed, a side view, and an explanatory view of a connecting portion with a load transmission body. As still another embodiment of the present invention, it is a front view showing only a portion of a polishing jig to which a bar member is fixed, a side view, and an explanatory view of a connecting portion with a load transmission body. FIG. 6 is a front view and a side view showing only a portion of a polishing jig to which a bar member is fixed as still another embodiment of the present invention. FIG. 6 is a front view and a side view showing only a portion of a polishing jig to which a bar member is fixed as still another embodiment of the present invention. As still another embodiment of the present invention, there are a front view and a side view showing only a portion of a polishing jig to which a bar member is fixed. FIG. 6 is a front view and a side view showing only a portion of a polishing jig to which a bar member is fixed as still another embodiment of the present invention. FIG. 6 is a front view and a side view schematically showing a configuration when a bar member is attached to a polishing apparatus and actually polished as another embodiment of the present invention. It is a figure explaining how a magnetic head element area | region and a RLG area | region are arranged on a bar member in the embodiment of FIG. 21, and its modification.

Explanation of symbols

10 Substrate (wafer)
11 Insulating layer 12 Lower shield and electrode layer 13 Shield gap layer 14 Upper shield and electrode layer 15, 64 ABS
16 MR laminated body 17 Separation layer 18 Auxiliary magnetic pole layer 19a, 19b, 19c Gap layer 20 Thin film coil 21 Seed layer 22 Main magnetic pole layer 22a Magnetic pole part 22b Yoke part 23 Connecting part 24 Overcoat layer 30 Bar member 30a Polishing surface 30b Opposite side Surface 31 Rotating polishing plate 32 Rotating shaft 33, 113, 123, 133, 143, 153, 163, 173, 183, 193, 203 Polishing jig 33a, 133a Slit 33b, 33b ', 133b, 143b, 153b, 163b Strip portion 33c, 133c, 143c, 153d, 163c Spherical hole 34, 114, 174 Holder member 35, 135, 155, 165a, 165b, 205 Y-axis load transmitting body 35a, 135a, 155a, 165aa Ball portion 36, 38a, 38b Actuator 3 a, 37b, 37 'Z-axis load transmission member 39 loads and polishing control circuit 40,62A MR read head element 41,62b perpendicular magnetic recording write head element 42 read element surface RLG
43 Writing element surface RLG
44, 46 Lead conductor 45, 47, 225, 226, 227 Electrode pad 48, 49, 228, 229, 230 Lead wire 60, 61, 62 Shot area 63 Position shift in Y-axis direction 90, 91 Load 153c Through hole HEAD _RGN Magnetic head element region RLG _R-RGN , RLG _W-RGN , RLG _RW-RGN RLG region

Claims (33)

  A bar member on which a plurality of magnetic head elements are arranged in at least one row is fixed to a polishing jig on the surface opposite to the polishing surface, and at a plurality of different positions along the longitudinal direction of the bar member. The polishing surface of the bar member is applied in a state where a first load in a direction perpendicular to the polishing surface of the bar member and a second load in a direction opposite to the first load are applied to the polishing jig. A method of polishing a thin film magnetic head, comprising polishing.   The first load and the second load are applied to the polishing jig at a plurality of different positions on a straight line parallel to the longitudinal direction of the bar member. The method described in 1.   The first load and the second load are applied to the polishing jig at a plurality of different positions on two different straight lines parallel to the longitudinal direction of the bar member. Item 2. The method according to Item 1.   4. The method according to claim 1, wherein the first load and the second load are applied in the vicinity of a surface of the polishing jig opposite to the surface on which the bar member is fixed. The method according to item.   4. The method according to claim 1, wherein the first load and the second load are applied in the vicinity of a surface of the polishing jig on which the bar member is fixed. 5.   4. The first load and the second load are applied to an intermediate position between a surface of the polishing jig to which the bar member is fixed and a surface opposite to the surface. The method of any one of these.   The method according to claim 1, wherein the first load or the second load is a load having a value equal to each other at the plurality of positions.   The method according to any one of claims 1 to 6, wherein the first load or the second load is a load having a value different from each other at the plurality of positions.   The first load and the second load are controlled in accordance with measured resistance values of a plurality of polishing resistance films formed on the bar member. The method according to item.   The polishing of the bar member is performed at a plurality of different positions along the longitudinal direction of the bar member at a third load in a direction parallel to the polishing surface and perpendicular to the longitudinal direction of the bar member. 10. The method according to claim 1, wherein a fourth load in a direction opposite to the load of 3 is further applied to each of the polishing jigs.   11. The method according to claim 10, wherein the third load and the fourth load are controlled in accordance with measured resistance values of the plurality of polishing resistance films formed on the bar member.   The method according to claim 10 or 11, wherein the third load or the fourth load is a load having a value equal to each other at the plurality of positions.   The method according to claim 10 or 11, wherein the third load or the fourth load is a load having a value different from each other at the plurality of positions.   The method according to claim 1, wherein a solid slitless polishing jig is used as the polishing jig.   The polishing jig having a slit having slits in a direction perpendicular to the longitudinal direction of the bar member at a plurality of different positions along the longitudinal direction of the bar member is used as the polishing jig. Item 14. The method according to any one of Items 1 to 13.   The method according to claim 1, wherein each magnetic head element comprises a magnetoresistive read head element and an inductive write head element stacked on each other.   A bar member obtained by polishing a plurality of magnetic head elements made of thin films on a wafer and cutting the wafer by the polishing method according to any one of claims 1 to 16. A thin-film magnetic head manufacturing method characterized by cutting and separating each into individual thin-film magnetic heads each having a magnetic head element.   A polishing jig to which a surface opposite to the polishing surface of the bar member in which a plurality of magnetic head elements are arranged in at least one row is fixed, a polishing plate to which the polishing surface of the bar member is pressed, and polishing At a plurality of different positions along the longitudinal direction of the bar member, a first load in a direction perpendicular to the polishing surface of the bar member and a second load in a direction opposite to the first load are applied. A polishing apparatus for a thin film magnetic head, comprising: a first load applying means for applying each to a polishing jig.   The first load applying means applies the first load and the second load to the polishing jig at a plurality of different positions on a straight line parallel to the longitudinal direction of the bar member. The apparatus of claim 18, wherein the apparatus is a means for   The first load applying unit applies the first load and the second load to the polishing jig at a plurality of different positions on two different straight lines parallel to the longitudinal direction of the bar member. The device according to claim 18, wherein the device is a means for applying to the device.   The first load applying means is means for applying the first load and the second load in the vicinity of a surface opposite to a surface of the polishing jig on which the bar member is fixed. 21. Apparatus according to any one of claims 18 to 20, characterized.   The first load applying means is means for applying the first load and the second load in the vicinity of a surface of the polishing jig to which the bar member is fixed. 21. The apparatus according to any one of 1 to 20.   The first load applying means applies the first load and the second load to an intermediate position between a surface of the polishing jig to which the bar member is fixed and a surface opposite to the surface. 21. Apparatus according to any one of claims 18 to 20, characterized in that   24. The device according to claim 18, wherein the first load applying means is means for applying loads having the same value at the plurality of positions as the first load or the second load. The apparatus according to claim 1.   24. The device according to claim 18, wherein the first load applying means is means for applying loads having different values at the plurality of positions as the first load or the second load. The apparatus according to claim 1.   The first load applying means is means for controlling the first load and the second load in accordance with measured resistance values of a plurality of polishing resistance films formed on the bar member. The device according to any one of claims 18 to 25.   During polishing of the bar member, a third load in a direction parallel to the polishing surface and perpendicular to the longitudinal direction of the bar member at the plurality of different positions along the longitudinal direction of the bar member, 27. The method according to any one of claims 18 to 26, further comprising second load applying means for further applying a fourth load in a direction opposite to the third load to each of the polishing jigs. The device described.   The second load applying means is means for controlling the third load and the fourth load according to the measured resistance values of the plurality of polishing resistance films formed on the bar member. 28. The apparatus of claim 27.   29. The means according to claim 27 or 28, wherein the second load applying means is means for applying equal loads to each other at the plurality of positions as the third load or the fourth load. Equipment.   29. The means according to claim 27 or 28, wherein the second load applying means is means for applying loads having different values at the plurality of positions as the third load or the fourth load. Equipment.   The apparatus according to any one of claims 18 to 30, wherein the polishing jig is a solid slit-free polishing jig.   The polishing jig is a slit-containing polishing jig having slits in a direction perpendicular to the longitudinal direction of the bar member at a plurality of different positions along the longitudinal direction of the bar member. Item 31. The apparatus according to any one of Items 18 to 30. 135. The apparatus according to any one of claims 18 to 132, wherein each magnetic head element comprises a magnetoresistive read head element and an inductive write head element stacked on each other.

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