JP2006286604A - Metallic material for wiring connection fixture - Google Patents
Metallic material for wiring connection fixture Download PDFInfo
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- JP2006286604A JP2006286604A JP2005365616A JP2005365616A JP2006286604A JP 2006286604 A JP2006286604 A JP 2006286604A JP 2005365616 A JP2005365616 A JP 2005365616A JP 2005365616 A JP2005365616 A JP 2005365616A JP 2006286604 A JP2006286604 A JP 2006286604A
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/02—Alloys based on copper with tin as the next major constituent
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C21/00—Alloys based on aluminium
- C22C21/06—Alloys based on aluminium with magnesium as the next major constituent
- C22C21/08—Alloys based on aluminium with magnesium as the next major constituent with silicon
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C38/00—Ferrous alloys, e.g. steel alloys
- C22C38/08—Ferrous alloys, e.g. steel alloys containing nickel
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C38/00—Ferrous alloys, e.g. steel alloys
- C22C38/18—Ferrous alloys, e.g. steel alloys containing chromium
- C22C38/40—Ferrous alloys, e.g. steel alloys containing chromium with nickel
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/04—Alloys based on copper with zinc as the next major constituent
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
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Abstract
Description
本発明は、配線接続器具の金属部材の少なくとも一方が銅合金材である配線接続器具用金属材に関するものであり、特にグローの発生及び亜酸化銅の増殖を防止できる配線接続器具用金属材に関するものである。 The present invention relates to a metal material for a wiring connection device in which at least one of the metal members of the wiring connection device is a copper alloy material, and more particularly to a metal material for a wiring connection device that can prevent the occurrence of glow and the growth of cuprous oxide. Is.
配線接続器具は電気器具のコンセントや照明のスイッチなど電気的な接続部に広く用いられている。前記接続部には金属が一般的に用いられており、金属同士が接触することで電気的な接続を行う。前記接触部では従来から発熱が問題となっている。これは接触部に微小放電(グロー)が発生し、これが起因となって亜酸化銅の増殖が誘発され接触抵抗が増加し、発熱することが知見されている。 Wiring connection devices are widely used for electrical connections such as electrical appliance outlets and lighting switches. A metal is generally used for the connecting portion, and electrical connection is made by contacting the metals. Conventionally, heat generation has been a problem in the contact portion. It has been found that a minute discharge (glow) is generated at the contact portion, which causes the growth of cuprous oxide to increase the contact resistance and generate heat.
合金成分を見直すことでグロー及び亜酸化銅の増殖の起きにくい配線接続器具用銅合金が提案されている(例えば、特許文献1参照。)。 There has been proposed a copper alloy for a wiring connector that is less prone to proliferation of glow and cuprous oxide by reviewing the alloy components (see, for example, Patent Document 1).
しかし、合金成分を検討しても、グローの発生及び亜酸化銅の増殖による発熱を防止することはできなかった。本発明の目的は、グローの発生及び亜酸化銅の増殖を防止でき、電気器具のコンセントや照明のスイッチなどの配線接続器具に適した金属材を提供することにある。 However, even if the alloy components were examined, it was not possible to prevent heat generation due to the occurrence of glow and the growth of cuprous oxide. An object of the present invention is to provide a metal material that can prevent the occurrence of glow and proliferation of cuprous oxide and is suitable for wiring connection devices such as electrical appliance outlets and lighting switches.
本発明者らは配線接続器具の接触部について詳細な検討を行い、材料表面の荒さ(粗度)とグロー発生とに関連があることを見出し、この知見に基づき更に検討を重ねて、本発明を完成させるに至った。
すなわち、本発明は、
(1)金属部材同士の配線接続における前記金属部材の少なくとも一方が銅ないしは銅合金材である配線接続器具用金属材であって、前記金属部材の少なくとも一方の接続部表面の平均粗さRaが0.3μm以下、最大粗さRtが2.0μm以下である、耐グロー特性に優れることを特徴とする配線接続器具用金属材、及び
(2)平均粗さRaと最大粗さRtの比Rt/Raが10以下であることを特徴とする耐グロー特性に優れた(1)記載の配線接続器具用金属材
を提供するものである。
The present inventors have made a detailed study on the contact portion of the wiring connection device, found that there is a relationship between the roughness (roughness) of the material surface and the occurrence of glow, and further studies based on this knowledge, the present invention It came to complete.
That is, the present invention
(1) At least one of the metal members in the wiring connection between the metal members is a metal material for a wiring connection device in which copper or a copper alloy material is used, and the average roughness Ra of the surface of at least one connection portion of the metal members is A metal material for a wiring connector characterized by excellent anti-glow properties having a maximum roughness Rt of 2.0 μm or less, and (2) a ratio Rt between the average roughness Ra and the maximum roughness Rt. / Ra is 10 or less, and provides a metal material for a wiring connector according to (1), which has excellent glow resistance.
本発明の配線接続器具用金属材は、平均粗さRa及び最大粗さRtを限定し、さらに平均粗さRaと最大粗さRtの比を限定することで、グローの発生及び亜酸化銅の増殖を防止でき、発熱を抑制することを可能とし、配線接続器具に最適な金属材である。 The metal material for a wiring connector of the present invention limits the average roughness Ra and the maximum roughness Rt, and further limits the ratio of the average roughness Ra and the maximum roughness Rt, thereby generating glow and cuprous oxide. Propagation can be prevented, heat generation can be suppressed, and it is an optimal metal material for wiring connection devices.
本発明の好ましい実施の態様について、詳細に説明する。なお、本発明において、粗さの定義はJIS B 0601:2001に従う。すなわち、本発明において平均粗さRaは、前記JIS B 0601:2001の算術平均粗さのことを指し、同様に、本発明において最大粗さRtは、前記JIS B 0601:2001の粗さ曲線の最大断面高さのことを指す。 A preferred embodiment of the present invention will be described in detail. In the present invention, the definition of roughness follows JIS B 0601: 2001. That is, in the present invention, the average roughness Ra refers to the arithmetic average roughness of the JIS B 0601: 2001. Similarly, in the present invention, the maximum roughness Rt is the roughness curve of the JIS B 0601: 2001. It refers to the maximum cross-sectional height.
本発明において、金属部材同士の配線接続における前記金属部材の少なくとも一方が銅ないしは銅合金材である。
本発明において、前記金属部材の少なくとも一方の接続部(接点)表面の平均粗さRaは0.3μm以下でかつ最大粗さRtが2μm以下であり、いずれの金属部材もが平均粗さRaは0.3μm以下でかつ最大粗さRtが2μm以下であることが好ましい。
本発明において、前記平均粗さRaは0.3μm以下でかつ最大粗さRtが2μm以下である金属部材が、銅ないしは銅合金材である場合と、銅ないしは銅合金材ではない金属材(例えば、Ni合金材)の場合とが挙げられる。
前記平均粗さRaは0.3μm以下でかつ最大粗さRtが2μm以下であるのは、グロー発生が著しく低減できるからである。
粗度とは材料表面の凹凸を示す指針の一つであるが、その凹凸の先端に印加された電圧が集中して、グロー放電を起こすと考えられる。
本発明において平均粗さRaが0.3μmを超えるとグロー放電が発生しやすくなってしまう。好ましくは0.2μm以下である。
また、最大粗さRaが2μmを超えると同様にグロー放電が発生しやすくなってしまう。好ましくは1μm以下である。
なお、平均粗さRa及び最大粗さRtは小さいほど好ましい。
In the present invention, at least one of the metal members in the wiring connection between the metal members is copper or a copper alloy material.
In the present invention, the average roughness Ra of the surface of at least one connection part (contact point) of the metal member is 0.3 μm or less and the maximum roughness Rt is 2 μm or less, and any metal member has an average roughness Ra of It is preferable that it is 0.3 μm or less and the maximum roughness Rt is 2 μm or less.
In the present invention, the metal member having an average roughness Ra of 0.3 μm or less and a maximum roughness Rt of 2 μm or less is a copper or copper alloy material, and a metal material that is not a copper or copper alloy material (for example, , Ni alloy material).
The reason why the average roughness Ra is 0.3 μm or less and the maximum roughness Rt is 2 μm or less is that the occurrence of glow can be remarkably reduced.
Roughness is one of the guidelines indicating the unevenness of the material surface, and it is considered that the voltage applied to the tip of the unevenness is concentrated to cause glow discharge.
In the present invention, when the average roughness Ra exceeds 0.3 μm, glow discharge tends to occur. Preferably it is 0.2 micrometer or less.
Further, when the maximum roughness Ra exceeds 2 μm, glow discharge is likely to occur. Preferably it is 1 micrometer or less.
The average roughness Ra and the maximum roughness Rt are preferably as small as possible.
本発明において、最大粗さRtと平均粗さRaとの比Rt/Raが10以下であることが好ましい。
最大粗さRtと平均粗さRaとの比Rt/Raが10以下とするのは、グロー発生をより低減できるからである。Rt/Raが10を超えると、局所的に凹凸が大きい部位が存在することになり、その部位でグロー放電が起こりやすくなると考えられる。
本発明において好ましくはRt/Raが5以下である。なお、前記Rt/Raは小さいほど好ましい。
In the present invention, the ratio Rt / Ra between the maximum roughness Rt and the average roughness Ra is preferably 10 or less.
The reason why the ratio Rt / Ra between the maximum roughness Rt and the average roughness Ra is 10 or less is that the generation of glow can be further reduced. When Rt / Ra exceeds 10, it is considered that there is a site with locally large irregularities, and glow discharge is likely to occur at that site.
In the present invention, Rt / Ra is preferably 5 or less. In addition, the smaller Rt / Ra is more preferable.
本発明の配線接続器具用金属は接点における接触圧力と電気伝導性が求められるため、一般的に強度と導電性に優れる金属が用いられている。その中でも、ステンレスやNi合金、銅合金は強度及び導電性に優れており、好ましい。より好ましくは、引張強度が500MPa以上、導電率が30%IACS以上である。 Since the metal for wiring connection devices of the present invention is required to have contact pressure and electrical conductivity at a contact point, a metal having excellent strength and conductivity is generally used. Among them, stainless steel, Ni alloy, and copper alloy are preferable because they are excellent in strength and conductivity. More preferably, the tensile strength is 500 MPa or more, and the conductivity is 30% IACS or more.
前記のより好ましい例として、
(1)Snを0.1〜10mass%、Pを0.001〜0.5mass%、残部が銅と不可避不純物からなる銅合金、
(2)Crを0.1〜1.0mass%、Sn又はZnの少なくとも一種の元素を0.05〜5mass%、残部が銅と不可避不純物からなる銅合金、
(3)Niを1.0〜5.0mass%、Siを0.3〜1.3mass%、Mg、Sn、Znの少なくとも一種の元素を合計で0.05〜5.0mass%、残部が銅と不可避不純物からなる銅合金、又は
(4)Feを0.5〜3.0mass%、Pを0.1〜1.0mass%、残部が銅と不可避不純物からなる銅合金が挙げられる。
As a more preferred example of the above,
(1) Sn is 0.1 to 10 mass%, P is 0.001 to 0.5 mass%, and the balance is a copper alloy composed of copper and inevitable impurities,
(2) a copper alloy comprising 0.1 to 1.0 mass% of Cr, 0.05 to 5 mass% of at least one element of Sn or Zn, and the balance of copper and inevitable impurities;
(3) 1.0 to 5.0 mass% of Ni, 0.3 to 1.3 mass% of Si, 0.05 to 5.0 mass% in total of at least one element of Mg, Sn, and Zn, with the balance being copper And a copper alloy composed of unavoidable impurities, or (4) a copper alloy composed of 0.5 to 3.0 mass% Fe, 0.1 to 1.0 mass% P, and the balance consisting of copper and unavoidable impurities.
本発明の配線接続器具用金属材は、一般的な製造方法により、鋳造、熱間圧延、冷間圧延、熱処理等と繰り返して製造される。また、平均粗さRa、最大粗さRtを制御する方法として、酸・アルカリ等により表面を洗浄処理する方法、また冷間圧延工程におけるロール粗度を変えることで行う。 The metal material for a wiring connector according to the present invention is repeatedly manufactured by casting, hot rolling, cold rolling, heat treatment and the like by a general manufacturing method. Further, as a method for controlling the average roughness Ra and the maximum roughness Rt, the surface is washed with an acid / alkali or the like, and the roll roughness in the cold rolling process is changed.
以下に本発明を実施例に基づいてさらに詳細に説明するが、本発明はこれらに限定されるものではない。 The present invention will be described below in more detail based on examples, but the present invention is not limited thereto.
市販されている銅合金および非鉄材料からなる板厚0.15〜0.25mmの板材を入手し、引張強度、硬度、導電率を調査した。引張強度はJIS−5号試験片を圧延平行方向から切り出し、JIS Z 2241に準じて測定した。硬度は材料表面から、JIS Z 2244に準じて荷重100g重で測定した。導電率は幅10mm×長さ150mmの試験片を圧延平行方向から切り出し、JIS H 3200に準じて端子間距離100mmで測定した。結果を表1、表2に示す。 A plate material having a thickness of 0.15 to 0.25 mm made of a commercially available copper alloy and non-ferrous material was obtained, and the tensile strength, hardness, and conductivity were investigated. Tensile strength was measured according to JIS Z 2241 by cutting a JIS-5 test piece from the rolling parallel direction. The hardness was measured from the material surface according to JIS Z 2244 at a load of 100 g. The electrical conductivity was measured at a distance of 100 mm between terminals in accordance with JIS H 3200 by cutting out a test piece having a width of 10 mm and a length of 150 mm from the rolling parallel direction. The results are shown in Tables 1 and 2.
前記板材の表面を圧延方向と同方向(圧延と平行な方向)に種々の番手のエメリー紙(表面にSiCの砥粒が付着した研磨紙)を用いて研磨を行い、表面粗度の異なる材料を作成した。すなわち、板材は平滑な定盤上に固定しておき、#230のエメリー紙から順番に番手を上げて#4000までの8段階のエメリー紙により30回研磨し、次いで表面を洗浄した。前記研磨により、表層の亜酸化銅を除去したものと判断し、後述の評価を行った。 The surface of the plate material is polished with various count emery paper (abrasive paper with SiC abrasive grains attached to the surface) in the same direction as the rolling direction (direction parallel to the rolling), and materials having different surface roughness It was created. That is, the plate material was fixed on a smooth surface plate, the count was increased in order from # 230 emery paper and polished 30 times with 8 stages of emery paper up to # 4000, and then the surface was washed. It was judged that the cuprous oxide on the surface layer was removed by the polishing, and the evaluation described later was performed.
表面粗度の測定はJIS H 3406に準じて測定した。触針の走査は材料の圧延方向あるいはエメリー紙で研磨した方向と垂直方向に4mm行い、その測定を3回繰り返して平均値を求めた。 The surface roughness was measured according to JIS H 3406. The stylus was scanned 4 mm in the direction perpendicular to the rolling direction of the material or the direction polished with emery paper, and the measurement was repeated three times to obtain the average value.
これらの板材について、耐グロー特性及び亜酸化銅増殖特性を評価した。
図1に本発明の耐グロー特性及び亜酸化銅増殖特性の測定装置の模式図を示す。
耐グロー特性は以下の様に評価した。すなわち、直径2mmの銅線2を荷重付加器付ホルダー1に取付け、本発明例及び比較例の試料3を試料ホルダー4の上に配置し、銅線2と接触させ、スライダック8と可変抵抗器6を用いて上記銅線2及び試料3の間に流れる電流を4Aにする。次いで試料ホルダー4を振動器5により振動させ、前記銅線2と試料3の間の電圧波形をオシロスコープ7により観察した。前記銅線2と試料3の間にグロー(微小放電)が発生すると、オシロスコープ7の波形が変化するため、この波形変化が発生するまでに付加した振動数を耐グロー特性とした。
These plate materials were evaluated for glow resistance and cuprous oxide growth characteristics.
FIG. 1 shows a schematic diagram of a measuring apparatus for glow resistance and cuprous oxide growth characteristics of the present invention.
The anti-glow property was evaluated as follows. That is, the
次に、亜酸化銅増殖特性を以下のように評価した。前記グロー発生が確認されると同時に振動器5による振動を停止し、試料3を60分放置した。次いで、試料3を取り出し、前記試料3の表面に生成した亜酸化銅を集め、重量を測定した。この重量を亜酸化銅増殖量として表3乃至7に示した。結果を表3乃至7に示す。 Next, cuprous oxide growth characteristics were evaluated as follows. At the same time as the occurrence of the glow was confirmed, the vibration by the vibrator 5 was stopped, and the sample 3 was left for 60 minutes. Next, the sample 3 was taken out, the cuprous oxide produced on the surface of the sample 3 was collected, and the weight was measured. This weight is shown in Tables 3 to 7 as cuprous oxide growth. The results are shown in Tables 3-7.
表3乃至7から明らかなように、比較例のNo.85乃至120はRaあるいはRtが大きいので耐グロー特性に劣り、かつ亜酸化銅増殖量も多かった。
これに対し、No.1乃至84に示す本発明の板材は耐グロー特性に優れ、かつ亜酸化銅増殖量も少なく、優れていることがわかる。
As is apparent from Tables 3 to 7, the comparative example No. Nos. 85 to 120 have a large Ra or Rt, so that they have inferior anti-glow properties and a large amount of cuprous oxide.
In contrast, no. It can be seen that the plate materials of the present invention shown in Nos. 1 to 84 are excellent in the anti-glow property and the growth amount of cuprous oxide is small.
1 荷重付加器付ホルダー
2 銅線
3 試料
4 試料ホルダー
5 振動器
6 可変抵抗器
7 オシロスコープ
8 スライダック
1 Holder with
Claims (2)
The metal material for a wiring connector according to claim 1, wherein the ratio Rt / Ra between the average roughness Ra and the maximum roughness Rt is 10 or less, and has excellent glow resistance.
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JP2005365616A JP2006286604A (en) | 2005-03-07 | 2005-12-19 | Metallic material for wiring connection fixture |
PCT/JP2006/304257 WO2006095678A1 (en) | 2005-03-07 | 2006-03-06 | Metal material for wiring connection device |
US11/851,044 US20080069721A1 (en) | 2005-03-07 | 2007-09-06 | Metal material for a wiring connector |
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JP2005365616A JP2006286604A (en) | 2005-03-07 | 2005-12-19 | Metallic material for wiring connection fixture |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011204449A (en) * | 2010-03-25 | 2011-10-13 | Mitsubishi Electric Corp | Evaluation support device for copper alloy for wiring connection, method of evaluating copper alloy for wiring connection, and method of evaluating power source terminal board |
Families Citing this family (1)
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CN112080664A (en) * | 2020-08-28 | 2020-12-15 | 西安斯瑞先进铜合金科技有限公司 | Copper-zirconium material for motor rotor and preparation method thereof |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS613857A (en) * | 1984-06-18 | 1986-01-09 | Furukawa Electric Co Ltd:The | Copper alloy for wiring connector |
JP2714561B2 (en) * | 1988-12-24 | 1998-02-16 | 日鉱金属株式会社 | Copper alloy with good direct bonding properties |
JPH1112714A (en) * | 1997-06-25 | 1999-01-19 | Dowa Mining Co Ltd | Copper and copper base alloy excellent in direct bonding property and soldering property and production thereof |
JP3520034B2 (en) * | 2000-07-25 | 2004-04-19 | 古河電気工業株式会社 | Copper alloy materials for electronic and electrical equipment parts |
KR100491385B1 (en) * | 2001-07-04 | 2005-05-24 | 닛꼬 긴조꾸 가꼬 가부시키가이샤 | Copper alloy foil for laminated sheet |
WO2003076672A1 (en) * | 2002-03-12 | 2003-09-18 | The Furukawa Electric Co., Ltd. | High-strength high-conductivity copper alloy wire rod of excellent resistance to stress relaxation characteristics |
KR100513947B1 (en) * | 2002-03-29 | 2005-09-09 | 닛코 킨조쿠 가부시키가이샤 | A copper alloy having good pressing workability and manufacturing method therefor |
-
2005
- 2005-12-19 JP JP2005365616A patent/JP2006286604A/en not_active Withdrawn
-
2006
- 2006-03-06 WO PCT/JP2006/304257 patent/WO2006095678A1/en active Application Filing
-
2007
- 2007-09-06 US US11/851,044 patent/US20080069721A1/en not_active Abandoned
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011204449A (en) * | 2010-03-25 | 2011-10-13 | Mitsubishi Electric Corp | Evaluation support device for copper alloy for wiring connection, method of evaluating copper alloy for wiring connection, and method of evaluating power source terminal board |
Also Published As
Publication number | Publication date |
---|---|
US20080069721A1 (en) | 2008-03-20 |
WO2006095678A1 (en) | 2006-09-14 |
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