CN101124698A - Metal material for a wiring connector - Google Patents

Abstract

A metal material for wiring connection device for use in wiring connection between metal members, at least one thereof being of copper or a copper alloy material, which at least one of the metal members has a connection part surface of = 0.3 [mu]m average roughness (Ra) and = 2.0 [mu]m maximum roughness (Rt), the metal material for wiring connection device excelling in anti-glow characteristics.

Description

The wiring connector metal material

Technical field

At least one hardware that the present invention relates to wiring connector is the wiring connector metal material of copper or Cu alloy material, particularly can prevent the wiring connector metal material of the increase of aura and cuprous oxide.

Background technology

Wiring connector is widely used on the electrical connection sections such as the socket of electrical equipment or lighting switch.Above-mentioned connecting portion uses metal usually, is electrically connected by contact between the metal.At present, become problem in above-mentioned contact site heating.This is considered to be in contact site generation fine discharge (aura), and as cause, bringing out cuprous oxide increases, thereby contact resistance increases, heating.

Rethink alloying component, proposed to be difficult to cause the wiring connector copper alloy of aura and cuprous oxide increase.

But even the research alloying component, can not prevent increases the heating that causes because of producing aura and cuprous oxide.

Summary of the invention

The inventor etc. carry out detailed research to the contact site of wiring connector, and finding the rugosity (roughness) of material surface and producing aura has relation, based on this discovery, carry out further concentrated research, so that finished the present invention.

The invention provides following scheme:

(1) a kind of wiring connector metal material, the excellent of anti-aura of this metal material, and during the wiring between hardware connects, at least one above-mentioned hardware is copper or Cu alloy material, wherein, the average roughness Ra on the connecting portion surface of at least one of described hardware is that 0.3 μ m is following, maximal roughness Rt is below the 2.0 μ m; And

(2) the described wiring connector metal material of claim 1, the excellent of anti-aura of this metal material, wherein, the ratio Rt/Ra of average roughness Ra and maximal roughness Rt is below 10.

Wiring connector of the present invention passes through to limit average roughness Ra and maximal roughness Rt with metal material, the preferred ratio of further regulating average roughness Ra and maximal roughness Rt, can prevent to produce the increase of aura and cuprous oxide, thereby can suppress heating, be suitable as the metal material of the wiring connector of the socket of electrical equipment or lighting switch etc.

Consider by the reference accompanying drawing, can clear and definite above-mentioned and further feature and advantage of the present invention by following record.

Description of drawings

Fig. 1 is the ideograph that the anti-aura characteristic used in an embodiment and resistance to oxidation copper increase the determinator of characteristic.

Embodiment

For preferred implementation of the present invention, at length describe.In addition, in the present invention, the definition of roughness is according to JIS B 0601:2001.That is, in the present invention, average roughness Ra is meant the arithmetic average rugosity of above-mentioned JIS B 0601:2001, and similarly, in the present invention, maximal roughness Rt is meant the maximum cross-section height of the roughness curve of above-mentioned JIS B 0601:2001.

In the present invention, at least one the above-mentioned hardware during the wiring between the hardware connects is copper or Cu alloy material.

In the present invention, the average roughness Ra at least one connecting portion (contact) surface of above-mentioned hardware is below the 0.3 μ m and maximal roughness Rt is below the 2 μ m, and all preferred average roughness Ra of arbitrary hardware is below the 0.3 μ m and maximal roughness Rt is below the 2 μ m.

In the present invention, above-mentioned average roughness Ra is that the following and maximal roughness Rt of 0.3 μ m is that the following hardware of 2 μ m can be enumerated the situation of copper or Cu alloy material and is not the situation of the metal material (for example nickel alloy material) of copper or Cu alloy material.

Because above-mentioned average roughness Ra is below the 0.3 μ m and maximal roughness Rt is the generation that can significantly reduce aura below the 2 μ m.

Roughness is one of concavo-convex index of expression material surface, can think that the voltage that puts on this concavo-convex front end concentrates and cause glow discharge.

In the present invention, when average roughness Ra surpasses 0.3 μ m, be easy to generate glow discharge.Be preferably below the 0.2 μ m.

In addition, when maximal roughness Rt surpasses 2 μ m, be easy to generate glow discharge equally.Be preferably below the 1 μ m.

In addition, average roughness Ra and maximal roughness Rt are more little preferred more.The lower limit of average roughness Ra and maximal roughness Rt is not particularly limited, but average roughness Ra is preferably more than the 0.01 μ m usually, and in addition, maximal roughness Rt is preferably more than the 0.05 μ m usually.

In the present invention, the ratio Rt/Ra of maximal roughness Rt and average roughness Ra is preferably below 10.

The ratio Rt/Ra of maximal roughness Rt and average roughness Ra is 10 when following, can reduce the generation of aura more.Can think that if Rt/Ra is excessive, then there is concavo-convex big position in the part, causes glow discharge easily at this position.

In the present invention, preferred Rt/Ra is below 5.In addition, above-mentioned Rt/Ra is more little preferred more.The lower limit of Rt/Ra is not particularly limited, but Rt/Ra is preferably more than 2 usually.

Owing to require wiring connector of the present invention to have contact pressure and conductivity, the metal of therefore common working strength and excellent electric conductivity with contact in the metal material.Wherein, the intensity of stainless steel or nickel alloy, copper alloy and excellent electric conductivity and preferred.More preferably hot strength is more than the 500MPa, and conductivity is more than the 30%IACS.

As above-mentioned preferred example, can enumerate:

(1) containing Sn is that 0.1～10 quality %, P are the copper alloy that 0.001～0.5 quality %, remainder are made up of Cu and unavoidable impurities;

(2) containing Cr is that at least a element among 0.1～1.0 quality %, Sn or the Zn is the copper alloy that 0.05～5 quality %, remainder are made up of Cu and unavoidable impurities;

(3) containing Ni is that 1.0～5.0 quality %, Si are that at least a element among 0.3～1.3 quality %, Mg, Sn, the Zn is counted the copper alloy that 0.05～5.0 quality %, remainder are made up of Cu and unavoidable impurities with total amount; Perhaps

(4) containing Fe is that 0.5～3.0 quality %, P are the copper alloy that 0.1～1.0 quality %, remainder are made up of Cu and unavoidable impurities.

Wiring connector of the present invention can utilize common manufacture method with metal material, suitably casts repeatedly, hot rolling, cold rolling, heat treatment wait and make.In addition, as the method for control average roughness Ra, maximal roughness Rt, by being undertaken by the method on carrying out washing treatment surfaces such as acid, alkali or the roll roughness that changes in the cold rolling process.

Embodiment

Below, illustrate in greater detail the present invention based on embodiment, but the present invention is not limited thereto.

Obtain the sheet material of the commercially available thickness of slab 0.15～0.25mm that makes by copper alloy and nonferrous material, investigation hot strength, hardness, conductivity.Hot strength is to cut out the JIS-5 test film from rolling parallel direction, and measures based on JIS Z 2241.Hardness is based on JIS Z 2244 and measures with load 100g from material surface.Conductivity is the test film that cuts out width 10mm * length 150mm from rolling parallel direction, measures from 100mm with terminal pitch based on JIS H 3200.The result is shown in table 1, table 2.In addition, even same alloy is formed, its intensity, hardness, conductivity are also different, and this is because the modifier treatment or the difference of creating conditions.

Table 1

Sheet material number	Main component quality %	Intensity MPa	Hardness Hv	Conductivity %IACS
					1	Cu-0.15Sn	443	150	88
2	Cu-3.9Sn-0.15P	422	144	19
					3	Cu-3.9Sn-0.15P	655	217	17
4	Cu-5.8Sn-0.12P	688	227	14
					5	Cu-7.9Sn-0.2P	721	237	13
6	Cu-21Zn	412	141	34
					7	Cu-32Zn	482	163	28
8	Cu-32Zn	610	203	28
					9	Cu-0.55Cr	582	194	74
10	Cu-0.29Cr-0.25Sn-0.5Zn	550	184	77
					11	Cu-0.28Cr-0.8Sn-0.45Zn	528	177	55
12	Cu-0.28Cr-0.8Sn-0.45Zn	668	221	52
					13	Cu-0.3Cr-2Sn	685	226	41
14	Cu-0.21Cr-0.11Zr-0.2Zn	522	175	22
					15	Cu-2.6Ni-0.55Si-0.1Mg	567	189	75
16	Cu-2.3Ni-0.5Si-0.1Mg-0.15Sn-0.5Zn	680	225	42
					17	Cu-2.3Ni-0.5Si-0.1Mg-0.15Sn-0.5Zn	722	238	41
18	Cu-3.7Ni-0.9Si-0.1Mg-0.15Sn-0.5Zn	815	267	35
					19	Cu-2.5Ni-0.55Si	712	235	41
20	Cu-2.5Ni-0.55Si-0.5Zn	734	241	48
					201	Cu-0.25Cr-0.77Sn-0.3Zn	670	231	51
202	Cu-0.2SCr-0.77Sn-0.3Zn	693	241	51
					203	Cu-0.3Cr-0.84Sn-0.4Zn	681	235	50
204	Cu-0.3Cr-0.84Sn-0.4Zn	702	250	50

Table 2

Sheet material number	Main component quality %	Intensity MPa	Hardness Hv	Conductivity %IACS
					21	Cu-0.1Fe-0.04P	422	144	90
22	Cu-1Fe-0.5Sn-0.5Zn	534	179	55
					23	Cu-2.4Fe-0.2P	534	179	64
24	Cu-1Ni-0.05P-0.9Sn	523	175	38
					25	Cu-0.8Mg-0.05P	511	172	61
26	Cu-3.8Ti	882	288	11
					27	Cu-0.15Ag	515	173	96
28	Cu-0.15Zr	498	168	94
					29	Cu-0.2Be-1.1Ni	783	257	37
30	Cu-0.2Fe-0.05P-0.96Sn-0.1Ni-0.03B	511	172	75
					31	Cu-0.1Fe-0.1Ni-0.05P-0.11Ni-0.04B	533	179	34
32	Cu-3.1Ni-0.68Si-0.3Zn	588	196	54
					33	Cu-2.1Sn-0.1Fe-0.03P	562	188	35
34	Cu-2.1Ni-0.53Si-1Zn-0.5Sn	641	212	38
					35	Cu-25Zn-0.6Sn	882	288	22
36	AI-0.4Si-0.4Fe-0.1Cu-0.33Mn-4.2Mg-0.1Cr	320	112	18
					37	Fe-17Cr-7Ni	1823	582	4
38	Fe-18Cr-8Ni	1432	460	6
					39	Fe-36Ni	634	210	3
40	Ni	622	206	18

Use the sand paper (pouncing paper that has adhered to the abrasive particle of SiC on the surface) of variouss number, on the direction identical (with rolling parallel direction), the surface of above-mentioned sheet material is ground, make the different material of surface roughness with rolling direction.That is, sheet material is fixed on the level and smooth platform, adopts the sand paper of counting to eight grades of #4000 from the sand paper of the #230 number of raising successively, grinds 30 times, follows washing surface.By above-mentioned grinding, judge and removed the cuprous oxide on top layer, carry out evaluation described later.

The mensuration of surface roughness is measured based on JIS H 3406.The scanning of contact pilotage is to carry out 4mm on the direction vertical with the rolling direction of material or the direction of grinding with sand paper, should measure for 3 times repeatedly, obtains mean value.

For these sheet material, estimate the cuprous increase characteristic of anti-aura characteristic and resistance to oxidation.

Fig. 1 is illustrated in the ideograph of the device that uses in the mensuration of anti-aura characteristic and the cuprous increase characteristic of resistance to oxidation.

Anti-aura characteristic such as following the evaluation.Promptly, the copper cash 2 of diameter 2mm is installed on the retainer 1 that has the adapter of loading, the test portion 3 of the present invention's example and comparative example is arranged on the test portion retainer 4, make it to contact with copper cash 2, use slide transformer (autotransformer, trade name, Toshiba makes) 8 and variable resistance 6, making the electric current that flows between above-mentioned copper cash 2 and test portion 3 is 4A.Then, make 4 vibrations of test portion retainer, by the voltage waveform between oscilloscope 7 above-mentioned copper cash 2 of observation and the test portion 3 by vibrator 5.When between above-mentioned copper cash 2 and test portion 3, producing (fine discharge), because the wave form varies of oscilloscope 7 adopts vibration number (number of times) additional when producing this wave form varies to estimate anti-aura characteristic.Evaluation as anti-aura characteristic, the vibration that will add when the wave form varies of this aura generation of demonstration takes place is the situation conduct " bad " below 1000 times, will above 1000 times and be below 2000 times situation as " can ", situation conduct " very " that will be above 2000 times.

Then, the cuprous increase characteristic of following evaluation resistance to oxidation.When confirming that above-mentioned aura produces, stop the vibration of vibrator 5, test portion 3 was placed 60 minutes.Then, take out test portion 3, be collected in the cuprous oxide that generates on the surface of above-mentioned test portion 3, quality measurement.With this quality, be that the recruitment (mg) of cuprous oxide is estimated the cuprous increase of resistance to oxidation.As the evaluation of the cuprous increase of resistance to oxidation, with this cuprous oxide generation (mg) be the following situation of 200mg as " very ", will surpass 200mg and be below the 250mg the situation conduct " can ", will be above the situation conduct " bad " of 250mg.

The result is shown in table 3～7.

Table 3

No.	Sheet material number	Ra μm	Rt μm	Rt/Ra	Anti-aura characteristic * 1000 (inferior)	The cuprous increase of resistance to oxidation (mg)	Remarks
								1	1	0.12	0.82	6.83	200	153	The present invention
2	1	0.21	1.71	8.14	65	83
							3	2	0.15	1.23	8.04	128	133
4	2	0.17	1.39	8.11	46	76
							5	3	0.12	1.05	8.75	212	155
6	3	0.22	1.77	8.01	73	95
							7	4	0.19	1.52	7.97	221	157
8	4	0.23	1.84	8.18	61	80
							9	5	0.16	1.31	8.09	29	70
10	5	0.16	1.35	8.29	131	120
							11	6	0.22	1.69	7.79	172	146
12	6	0.16	1.34	8.17	87	96
							13	7	0.20	1.65	8.32	330	181
14	7	0.17	1.30	7.73	77	80
							15	8	0.14	1.11	7.93	34	76
16	8	0.18	1.44	7.84	54	82
							17	9	0.05	0.48	8.93	97	122
18	9	0.18	1.39	7.60	80	87
							19	10	0.07	0.51	7.49	419	180
20	10	0.27	1.88	7.97	29	48
							21	11	0.07	0.62	8.72	153	141
22	11	0.25	2.00	8.02	43	65
							23	12	0.07	0.52	7.91	113	128
24	12	0.30	1.92	8.02	125	99
							25	13	0.07	0.60	8.01	51	94
26	13	0.22	1.56	7.20	180	127
							27	14	0.05	0.43	7.84	127	133
28	14	0.24	1.84	7.83	238	139
							29	15	0.09	0.65	7.45	308	171
30	15	0.16	1.29	8.07	25	43

Table 4

No.	Sheet material number	Ra μm	Rt μm	Rt/Ra	Anti-aura characteristic * 1000 (inferior)	The cuprous increase of resistance to oxidation (mg)	Remarks
								31	16	0.02	0.14	7.03	343	80	The present invention
32	16	0.12	0.97	8.39	90	127
							33	17	0.06	0.52	8.01	263	165
34	17	0.13	1.09	8.56	40	62
							35	18	0.01	0.06	4.95	125	155
36	18	0.20	1.67	8.24	215	93
							37	19	0.04	0.24	6.54	38	81
38	19	0.25	1.92	7.83	54	127
							39	20	0.02	0.22	9.12	242	87
40	20	0.27	1.89	7.05	32	53
							41	21	0.11	0.92	8.37	100	111
42	21	0.21	1.65	7.88	82	88
							43	22	0.08	0.58	7.40	69	119
44	22	0.16	1.20	7.50	32	62
							45	23	0.11	0.89	7.84	33	62
46	23	0.14	1.21	8.33	37	68
							47	24	0.18	1.42	7.93	48	79
48	24	0.16	1.38	8.46	41	72
							49	25	0.20	1.57	7.95	213	89
50	25	0.14	1.16	8.15	42	73
							51	26	0.12	0.99	8.03	116	117
52	26	0.21	1.70	8.10	27	54
							53	27	0.13	1.06	8.40	131	135
54	27	0.21	1.69	7.90	127	79
							55	28	0.06	0.48	7.77	196	152
56	28	0.22	1.76	8.16	94	87
							57	29	0.01	0.05	9.33	263	149
58	29	0.28	1.87	6.75	248	156
							59	30	0.05	0.47	9.32	379	181
60	30	0.26	1.99	7.55	154	120
							601	201	0.11	1.25	11.36	221	155
602	202	0.14	1.38	9.86	123	131
							603	203	0.13	1.05	8.08	112	120
604	204	0.18	1.18	6.56	104	115

Table 5

No.	Sheet material number	Ra μm	Rt μm	Rt/Ra	Anti-aura characteristic * 1000 (inferior)	The cuprous increase of resistance to oxidation (mg)	Remarks
								61	31	0.05	0.46	9.69	162	137	The present invention
62	31	0.24	1.89	7.86	196	131
							63	32	0.03	0.25	7.44	188	161
64	32	0.18	1.38	7.78	185	140
							65	33	0.08	0.61	7.94	352	181
66	33	0.22	1.92	8.86	108	105
							67	34	0.15	1.31	8.62	190	143
68	34	0.19	1.81	9.44	102	110
							69	35	0.11	0.91	8.37	92	119
70	35	0.20	1.36	6.92	34	55
							71	36	0.18	1.49	8.08	68	106
72	36	0.28	1.85	3.83	398	162
							73	37	0.12	0.88	7.45	30	70
74	37	0.17	1.89	4.04	175	126
							75	38	0.09	0.64	6.94	42	85
76	38	0.21	1.87	4.43	64	75
							77	39	0.17	1.35	7.94	41	84
78	39	0.25	1.64	6.67	218	136
							79	40	0.20	1.56	7.97	175	147
80	40	0.28	1.92	6.77	68	93
							81	3	0.23	1.93	8.36	212	155
82	7	0.23	1.88	8.25	114	101
							83	14	0.29	1.85	6.28	114	113
84	18	0.23	1.97	8.41	123	136

Table 6

No.	Sheet material number	Ra μm	Rt μm	Rt/Ra	Anti-aura characteristic * 1000 (inferior)	The cuprous increase of resistance to oxidation (mg)	Remarks
								85	1	0.35	2.84	8.11	9.3	394	Comparative example
86	2	0.41	3.24	7.91	2.0	354
							87	4	0.35	2.54	7.31	0.7	322
88	5	0.47	3.76	7.96	2.3	320
							89	6	0.41	4.03	9.80	0.7	288
90	8	0.54	4.25	7.91	5.9	374
							91	9	0.40	4.35	11.01	2.3	361
92	10	0.59	4.71	1.02	2.1	367
							93	11	0.26	4.00	15.28	5.1	386
94	12	0.58	4.70	8.11	3.2	348
							95	13	0.56	4.48	8.06	1.5	316
96	15	0.34	2.52	7.39	5.4	350
							97	16	0.32	2.70	8.46	3.0	395
98	17	0.57	4.52	7.87	0.7	328
							99	19	0.33	2.94	8.99	0.7	302
100	20	0.48	3.88	8.04	4.5	385

Table 7

No.	Sheet material number	Ra μm	Rt μm	Rt/Ra	Anti-aura characteristic * 1000 (inferior)	The cuprous increase of resistance to oxidation (mg)	Remarks
								101	21	0.39	3.20	8.22	3.3	327	Comparative example
102	22	0.21	3.35	15.75	1.2	332
							103	23	0.22	3.36	15.23	1.0	311
104	24	0.44	2.54	5.72	3.4	328
							105	25	0.23	3.45	15.05	8.2	366
106	26	0.13	2.41	18.28	2.0	305
							107	27	0.49	3.86	7.93	6.1	375
108	28	0.23	2.90	12.55	6.1	376
							109	29	0.26	2.89	11.08	5.8	377
110	30	0.45	3.62	8.00	0.9	422
							111	31	0.36	3.11	8.53	1.8	330
112	32	0.41	3.28	8.02	3.8	404
							113	33	0.28	3.81	13.73	5.9	407
114	34	0.45	3.57	7.90	9.5	428
							115	35	0.49	3.96	8.04	8.7	410
116	36	0.29	3.92	13.60	3.8	365
							117	37	0.27	3.57	13.02	1.1	320
118	38	0.33	2.70	8.18	9.0	425
							119	39	0.64	5.16	8.04	0.7	378
120	40	0.70	5.60	8.01	1.2	340

By table 3～7 as can be known: the No.85 of comparative example～120 are because Ra or Ra and Rt are big, thereby the recruitment of cuprous oxide many or anti-aura characteristic difference and cuprous oxide recruitment are also many.

In contrast, the recruitment of the excellent of anti-aura of the sheet material of the present invention shown in No.1～84 and 601～604, and cuprous oxide as can be known is also few, is excellent sheet material.

Industrial applicibility

Wiring connector of the present invention passes through to limit average roughness Ra and maximal roughness Rt with metal material, the preferred ratio of further regulating average roughness Ra and maximal roughness Rt, can prevent the generation of aura and the increase of cuprous oxide, thereby can suppress heating, be suitable as the metal material that uses in the wiring connectors such as the socket of electrical equipment or lighting switch.

Though with the present invention that has been base description of this execution mode, but as long as we do not specify, just not the invention of wanting in which details of specification, to limit us, should on the basis of not violating the invention spirit and scope shown in claims of enclosing later, carry out wideer explanation.

Claims (7)

1. wiring connector metal material, the excellent of anti-aura of this metal material, and during the wiring between hardware connects, at least one above-mentioned hardware is copper or Cu alloy material, wherein, the average roughness Ra at least one connecting portion surface of described hardware is that 0.3 μ m is following, maximal roughness Rt is below the 2.0 μ m.

2. the described wiring connector metal material of claim 1, the excellent of anti-aura of this metal material, wherein, the ratio Rt/Ra of average roughness Ra and maximal roughness Rt is below 10.

3. claim 1 or 2 described wiring connector metal materials, wherein, hot strength is more than the 500MPa, conductivity is more than the 30%IACS.

4. claim 1 or 2 described wiring connector metal materials, wherein, above-mentioned metal material is that to contain Sn be that 0.1～10 quality %, P are the copper alloy that 0.001～0.5 quality %, remainder are made up of Cu and unavoidable impurities.

5. claim 1 or 2 described wiring connector metal materials, wherein, above-mentioned metal material is that to contain Cr be that at least a element among 0.1～1.0 quality %, Sn or the Zn is the copper alloy that 0.05～5 quality %, remainder are made up of Cu and unavoidable impurities.

6. claim 1 or 2 described wiring connector metal materials, wherein, above-mentioned metal material is that to contain Ni be that 1.0～5.0 quality %, Si are that at least a element among 0.3～1.3 quality %, Mg, Sn, the Zn is counted the copper alloy that 0.05～5.0 quality %, remainder are made up of Cu and unavoidable impurities with total amount.

7. claim 1 or 2 described wiring connector metal materials, wherein, above-mentioned metal material is that to contain Fe be that 0.5～3.0 quality %, P are the copper alloy that 0.1～1.0 quality %, remainder are made up of Cu and unavoidable impurities.