JP2006285688A - Method and device for diagnosing failure of manufacturing facility - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To predict and prevent any failure by preventing any product being processed such as a wafer from being wasted due to the sudden failure of a manufacturing device. <P>SOLUTION: The current consumption of load equipment is continuously monitored, and lifetime is determined or predicted according to whether or not the current consumption exceeds a management reference value set for each load equipment or secular change. Then, when the current consumption exceeds the management reference value, or the life prediction point of time arrives or approaches, it is announced to the outside. Also, the current consumption is monitored by converting magnetic field strength into currents by using a magnetic resistance sensor installed on the single face of the wiring conductor of the load equipment. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a failure diagnosis method and apparatus for a manufacturing facility including a load device that consumes power, such as a semiconductor manufacturing apparatus.

  According to a conventional semiconductor manufacturing apparatus, apparatus maintenance, jigs, and parts replacement are performed every certain period or every accumulated time of wafer processing, regardless of the fatigue status of the manufacturing apparatus. In addition, the film thickness and film quality after processing using the monitor wafer and measuring the time required for the processing and monitoring the time, or after processing and processing using the monitor wafer in advance. The fluctuations and abnormalities of the semiconductor manufacturing apparatus were detected by monitoring the measured values and managing the measured values.

A number of patent applications have been filed for abnormality monitoring and prediction of apparatuses including the semiconductor manufacturing apparatus described above.
For example, an alarm is issued before the consumption current flowing through the load device reaches the maximum load current, and an abnormality in the amount of current in the load device unit connected to the switchboard is detected (for example, see Patent Document 1). , Detecting an abnormality from the relative relationship with the average time, notifying the operator of a warning and predicting failure in advance (see, for example, Patent Document 2), an operation for controlling the operation of each part of the manufacturing apparatus A signal from the control unit is communicated, and an inference unit of the failure diagnosis system performs inference regarding the device abnormality in comparison with the failure diagnosis database (see, for example, Patent Document 3). A current monitoring unit monitors the current consumption of the device. A warning is issued when a preset threshold value is exceeded (for example, see Patent Document 4).
Japanese Patent Laid-Open No. 13-333526 JP-A-12-181536 JP-A-6-332528 JP-A-5-103426

However, according to the above-described prior art, when the maintenance of the apparatus and the replacement of jigs and parts are performed every certain period or every accumulated processing time of the wafer, the apparatus has nothing to do with the fatigue status of the manufacturing apparatus. The maintenance period is set for a period in which fatigue is likely to occur, so sudden equipment failure occurs, or conversely, equipment maintenance and jig / part replacement are possible even when the equipment is still fully usable. Is wasteful.
On the other hand, when using a monitor wafer, it is necessary to wait for the product wafer to be processed until the monitor wafer is processed and the measurement is completed because it is determined in advance while processing the result. In addition, since a device failure cannot be predicted during product processing, there is a risk that the device will fail during the processing batch and the remaining wafers will be wasted. Furthermore, since a wafer for monitor processing must be prepared in advance, the cost increases.

The background that the above-described method is still used is that according to the techniques disclosed in Patent Documents 1 and 4, a manufacturing apparatus such as a motor or a heater, a unit of a manufacturing apparatus, or a manufacturing chamber or a transfer robot. In addition, according to the technique disclosed in Patent Document 2, the difference between the average processing time and the current processing time of the apparatus is used to detect the data. It can be costly to prepare a database for comparison and to maintain an operating system.
Furthermore, according to the technique disclosed in Patent Document 3, as with Patent Document 2, in addition to database preparation and operating system maintenance, communication means with a monitoring control device that controls the operation of each part of the manufacturing apparatus is required. There is a problem of becoming. Even if these databases and operating systems are prepared, what is monitored by the monitoring and control device is the processing time of each device, not the load current for each part of the manufacturing device, or each major part, Therefore, the fatigue status of the entire apparatus is unknown, and therefore, it is not possible to maintain only parts that need replacement or to avoid a sudden shutdown.

  The present invention has been made in view of the above circumstances, and by monitoring the fatigue status of a manufacturing apparatus in units of parts or essential parts, a product being processed such as a wafer is wasted due to a sudden failure of the manufacturing apparatus. It is an object of the present invention to provide a manufacturing facility failure diagnosis method and apparatus that can avoid, prevent and prevent failures.

  In order to solve the above-described problems, the present invention provides a fault diagnosis method for a manufacturing facility including a load device that consumes power, the step of continuously monitoring the current consumption of the load device; And a step of performing a life judgment or a life prediction by exceeding a management reference value set for each of the load devices or by a change with time.

  In addition, the present invention has a step of notifying to the outside when the management reference value is exceeded, or when reaching or approaching the estimated life time.

  In the present invention, the consumption current is monitored by detecting the magnetic field intensity with a magnetoresistive sensor installed on a single surface of the wiring conductor of the load device and converting it to a current value. .

  Further, the present invention is a fault diagnosis apparatus for a manufacturing facility provided with load equipment that consumes power, wherein current monitoring means for continuously monitoring current consumption of the load equipment by a magnetoresistive sensor, and the current consumption The calculation means for determining the lifetime or predicting the lifetime due to the management reference value set for each of the load devices exceeding or the change with time, and approaching when the management reference value is exceeded or the prediction time point is reached And an informing means for informing the outside at a point in time.

According to the present invention, by continuously monitoring the current consumption of the load device that constitutes the manufacturing apparatus, it is possible to check the fatigue status of the load device and the abnormality of the load device that leads to a trouble. In addition, since the alarm is given when the management standard is exceeded, it is easy to respond, and the maintenance period is extended to a time when a failure is likely to occur, regardless of equipment maintenance, jigs, and parts replacement performed every predetermined period. Therefore, waste can be avoided, thereby reducing the cost required for maintenance.
Furthermore, since it is possible to predict failure, for example, processing of wafers at a dangerous level is not performed, and waste due to wafer destruction due to failure during wafer processing can be avoided, thereby reducing product manufacturing costs. It is peeled off. In addition, in order to measure the current consumption, the magnetic field strength is converted into a current value, and the semiconductor device installed without going around the conductor is used. It can be removed and used effectively.

FIG. 1 is a diagram quoted for explaining the overall configuration of an integrated monitoring system in which a fault diagnosis apparatus for manufacturing equipment according to an embodiment of the present invention is used.
In FIG. 1, Fab means a factory unit, and oxidation, diffusion, CVD, sputtering, stepper, dry etch, tester, dicer, bonder, and mold press are represented by a manufacturing process performed using a load device to be managed. Is shown. Moreover, No1-n described on the right side of each process has shown the specific load apparatus of the apparatus used by each manufacturing process. Furthermore, the terminal terminal is a terminal connected to each load device, and W / S is a workstation that connects each terminal terminal and the comprehensive monitoring system. The main configuration of the comprehensive monitoring system is as shown in FIG.

FIG. 2 is a block diagram showing the configuration of the main part of the fault diagnosis apparatus for manufacturing equipment in the comprehensive monitoring system.
As shown in FIG. 2, the fault diagnosis apparatus for manufacturing equipment according to the present invention includes a consumption current monitoring unit 2, a time series table 3 (TBL), a management reference TBL (4), a calculation unit 5, and a notification output. Part 6 is configured.

The consumption current monitoring unit 2 continuously monitors the consumption current of the load device 1 constituting the manufacturing facility such as a motor to be monitored using a magnetoresistive sensor, and accumulates the result in the time series TBL (3). At the same time, the signal is supplied to one input terminal of the calculation unit 5.
A magnetoresistive sensor 10 is shown in FIG. Here, the strength of the magnetic field measured by the magnetoresistive sensor 10 is changed to a current value, which is used as a current consumption monitoring unit of a load device constituting the manufacturing facility. Since the magnetoresistive sensor 10 is highly sensitive, it only needs to be fixed in the vicinity of the wiring as shown in FIG. Thus, in order to measure current consumption, a mechanism for converting the intensity of the magnetic field into a current value is used, and a semiconductor device that is installed without going around the conductor is used. Since a current sensor that circulates around a conductor has many restrictions on mounting conditions and cannot be easily detached, the sensor itself can be installed on a single surface by measuring the current consumption using the magnetoresistive sensor 10. By doing so, all the above-mentioned restrictions are eliminated and effective utilization is possible.

A management standard (threshold value) read from the management standard TBL (4) is supplied to the other input terminal of the arithmetic unit 5. An example of the data structure of the management standard TBL (4) is shown in FIG. Although details will be described later, an upper limit value and a lower limit value are shown as management reference values. The calculation unit 5 determines whether or not the current consumption exceeds a management reference value set for each of the load devices by a comparison calculation, and accumulates the time series TBL (3) and analyzes it with time, etc. To calculate the life of the load device or predict the life.
The notification output unit 6 notifies the operator or the like outside when the calculation result by the calculation unit 5, the management reference value is exceeded, or when the predicted time for component replacement is reached or approached.

FIG. 3 is a flowchart cited for explaining a manufacturing facility failure diagnosis method according to an embodiment of the present invention.
First, the fault diagnosis apparatus for manufacturing equipment shown in FIG. 2 uses the magnetoresistive sensor 10 to determine the current consumption of the load device 1 constituting the manufacturing equipment, such as a motor to be monitored, by the power consumption monitoring unit 2 over the long term. Continuously measure (S21). The data measured here is sequentially accumulated in time series TBL (3). At the same time, a threshold value check is performed by the calculation unit 5. That is, a comparison operation between a management reference value (α: upper limit value, β: lower limit value) set in advance in the management reference TBL (4) and a measured current γ that is an output value from the current consumption monitoring unit 2 is performed ( S22). If γ> α or γ <β as a result of the comparison calculation, the notification output unit 6 is activated to notify the operator by generating an alarm sound (S27).

  On the other hand, if α> γ> β as a result of the comparison calculation, it is further confirmed that the preset time interval T for checking the trend tendency is not reached (S24, “No”). The subsequent processing is repeated to continuously accumulate the current consumption values to be monitored in the time series TBL (3). When the time t reaches the time T for analyzing the trend (S24, “Yes”), the trend analysis is performed based on the data accumulated in the time series TBL (3) (S25). As a result of the trend analysis, the replacement timing of the parts and the like is checked (S26), and the result is notified to the operator, so that countermeasures such as parts replacement by a human system are implemented (S27). Here, the trend analysis uses commercially available package software, but the data accumulated in the time series TBL (3) is edited, the trend is displayed on a display monitor (not shown), and the human system makes a judgment. May enter.

As a specific example of the embodiment of the present invention, FIG. 4 shows a monitoring management method for a heat treatment facility such as a diffusion furnace, and FIG. 5 shows an example of a monitoring management method for a motor facility.
The heater used in the diffusion furnace becomes difficult to flow current with aging and eventually breaks. Further, the electric motor has a characteristic that the current consumption value changes to an increase due to a defect as a single motor or a change in an external load. Here, prior to the start of the operation of the diffusion furnace, a management standard for current consumption for the heater (FIG. 4) is provided and constantly monitored, and if it deviates from the management standard, a mechanism for issuing an alarm and notifying is established. In addition, the heater replacement time is calculated by accumulating and checking the trend, and it is possible to perform preventive maintenance before trouble occurs by notifying the outside via a display monitor or the like.

On the other hand, a management standard (FIG. 5) for the current consumption of the motor is provided and constantly monitored. If the standard is not met, it is possible to repair or improve the defective place by alarm notification.
Here, the cause of the deviation from the standard may be due to deterioration of the motor alone, friction coefficient increase, grease breakage, and other troubles due to increased external load, but according to the present invention, in units of parts such as motors and heaters, or By monitoring the current consumption in detail for each major part such as a manufacturing chamber or a transfer robot, it is possible to monitor the fatigue status of the entire apparatus, and it is possible to maintain only the parts that need to be replaced.

FIG. 6 shows a specific example of the management reference value when a semiconductor manufacturing apparatus such as metal sputtering is exemplified as the manufacturing facility. The management reference value shown here is included in the management reference TBL (4) shown in FIG. Here, the management reference value for the monitor measurement value is defined for each component and main part constituting the metal sputtering apparatus, its monitoring method (depending on the current consumption), and the monitor measurement value.
In FIG. 6, for example, the current is selected as the monitoring method for the vacuum pump 1 of No. 1, and the management reference value is defined as about 5 to 10 amperes. By using this, the management method shown in FIG. 5 can be applied. Further, a current is selected as a monitoring method for the heater 1 of No. 7, and the management reference value is defined as about 20 to 30 amperes. By using this, the management technique shown in FIG. 3 can be obtained.

FIG. 7 shows a sputtering apparatus as a specific example of the manufacturing facility.
The multi-chamber type sputtering apparatus shown in FIG. 7 will be described. In FIG. 7, first, a cassette (carrying container) on which a wafer is mounted is loaded from the outside into a cassette loader of a sputtering apparatus. There is a front room behind the cassette loader. Among these, the transfer robot loads wafers one by one from the cassette loader, passes through the heater, and is sent to the buffer stage. The front chamber is connected to a vacuum pump, and the degree of vacuum of the exhaust pump is controlled so that the wafers before and after processing are not released to the atmosphere. Thereafter, the wafer is sent from the buffer stage to a chamber where a predetermined process is to be performed by a transfer robot. The wafer after the first processing is once taken out to the buffer stage and subsequently sent to another chamber for the second processing. Finally, it is sent to the cassette loader for removal by the transport robot in front through the buffer stage.
Here, as shown in FIG. 6, since the monitoring method and management reference value for each component and main part are set, each heater, vacuum pump, transfer robot, substrate cooling fan, cassette loader The management method of the present invention can be applied to a shutter for determining each part. Note that the sputtering apparatus in FIG. 7 can also be used as an etching apparatus.

As described above, in a manufacturing facility having complicated mechanisms, parts, and main parts, the state of apparatus fatigue is sufficiently managed, and only parts that need replacement can be maintained by failure prediction. As a result, it is possible to prevent an unexpected apparatus shutdown and the like, which can be useful for reducing the manufacturing cost of the product.
In addition, according to the present invention, the current consumption of the manufacturing apparatus is continuously monitored via the magnetoresistive sensor, and an alarm is issued when the control reference value is about to be exceeded or exceeded. Setting is possible. Furthermore, since the fatigue state is monitored by monitoring the load current, it is easy to attach to the manufacturing facility, no modification of the apparatus is required, and no special communication control device is required to be attached to the control mechanism of the manufacturing apparatus.

It is the figure quoted in order to demonstrate the whole structure of the comprehensive monitoring system in which the failure diagnosis apparatus of the manufacturing facility concerning embodiment of this invention is utilized. It is a block diagram which shows the principal part structure of the failure diagnosis apparatus of the manufacturing facility concerning embodiment of this invention. It is the flowchart quoted in order to demonstrate the failure diagnosis method of the manufacturing facility concerning embodiment of this invention. It is a figure which shows an example of the monitoring management method of heat processing equipment, such as a diffusion furnace, concerning embodiment of this invention. It is a figure which shows an example of the monitoring management method of the motor equipment concerning embodiment of this invention. It is the figure quoted in order to demonstrate the specific example of the management reference value used in embodiment of this invention. It is a figure which shows an example of the semiconductor facility with which the failure diagnosis method of this invention is applied. It is the figure quoted in order to demonstrate the installation structure of the magnetoresistive sensor used in this invention embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Monitoring object (load apparatus), 2 ... Current consumption monitoring part, 3 ... Time series TBL, 4 ... Management reference TBL, 5 ... Calculation part, 6 ... Notification output part, 10 ... Magnetoresistive sensor

Claims (4)

A failure diagnosis method for a manufacturing facility equipped with load equipment that consumes power,
Continuously monitoring the current consumption of the load device;
The current consumption exceeds a management reference value set for each of the load devices, or performs a life judgment or a life prediction by a change with time,
A fault diagnosis method for manufacturing equipment, comprising: Informing outside when the management reference value is exceeded or when reaching or approaching the life prediction time point,
The fault diagnosis method for manufacturing equipment according to claim 1, comprising:   The monitoring of the current consumption is performed by sensing a magnetic field intensity with a magnetoresistive sensor installed on a single surface of a wiring conductor of the load device and converting it to a current value. Failure diagnosis method for manufacturing equipment. A fault diagnosis device for a manufacturing facility equipped with load equipment that consumes power,
A consumption current monitoring unit for continuously monitoring the consumption current of the load device by a magnetoresistive sensor;
A calculation unit that performs life determination or life prediction by determining whether the current consumption exceeds a management reference value set for each of the load devices or changes with time,
A notification output unit for informing the outside when the management reference value is exceeded, or when reaching or approaching the predicted time point;
A fault diagnosis apparatus for manufacturing equipment, comprising:

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