JP2006284578A - 超音波走査データを用いて物体を検査する方法およびシステム - Google Patents
超音波走査データを用いて物体を検査する方法およびシステム Download PDFInfo
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- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
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- G01N29/04—Analysing solids
- G01N29/06—Visualisation of the interior, e.g. acoustic microscopy
- G01N29/0609—Display arrangements, e.g. colour displays
- G01N29/0645—Display representation or displayed parameters, e.g. A-, B- or C-Scan
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- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/04—Analysing solids
- G01N29/06—Visualisation of the interior, e.g. acoustic microscopy
- G01N29/0654—Imaging
- G01N29/069—Defect imaging, localisation and sizing using, e.g. time of flight diffraction [TOFD], synthetic aperture focusing technique [SAFT], Amplituden-Laufzeit-Ortskurven [ALOK] technique
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- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/04—Analysing solids
- G01N29/11—Analysing solids by measuring attenuation of acoustic waves
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- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/34—Generating the ultrasonic, sonic or infrasonic waves, e.g. electronic circuits specially adapted therefor
- G01N29/341—Generating the ultrasonic, sonic or infrasonic waves, e.g. electronic circuits specially adapted therefor with time characteristics
- G01N29/343—Generating the ultrasonic, sonic or infrasonic waves, e.g. electronic circuits specially adapted therefor with time characteristics pulse waves, e.g. particular sequence of pulses, bursts
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- G01N29/44—Processing the detected response signal, e.g. electronic circuits specially adapted therefor
- G01N29/4463—Signal correction, e.g. distance amplitude correction [DAC], distance gain size [DGS], noise filtering
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- G01N2291/025—Change of phase or condition
- G01N2291/0258—Structural degradation, e.g. fatigue of composites, ageing of oils
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- G01N2291/00—Indexing codes associated with group G01N29/00
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- G01N2291/0422—Shear waves, transverse waves, horizontally polarised waves
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- G01N2291/00—Indexing codes associated with group G01N29/00
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- G01N2291/044—Internal reflections (echoes), e.g. on walls or defects
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- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/10—Number of transducers
- G01N2291/105—Number of transducers two or more emitters, two or more receivers
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- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/26—Scanned objects
- G01N2291/263—Surfaces
- G01N2291/2636—Surfaces cylindrical from inside
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Abstract
【解決手段】超音波走査データから亀裂(40)の深さを推定する方法および装置を提供する。この方法は、複数のセンサ(34、36、38)の1つからの信号をそれぞれ表す複数の振幅応答を、超音波走査データからマッピングするステップを含む。この方法は、さらに、これら複数のマッピングされた振幅応答の中で、それぞれが亀裂からの反射信号を示す標識である複数の線形応答を突き止めるステップを含む。所与の亀裂(40)からの線形応答に対応する1つまたは複数のセンサ(34、36、38)を識別する。識別されたセンサからのデータを用いて、亀裂(40)の深さを推定する。
【選択図】図1
Description
12 パイプライン
14 PIG
18 センサ
20 位置検出部
22 DAS
24 電源
26 亀裂サイズ検出部
28 出力装置
30 外表面
32 内表面
34 センサ
36 センサ
38 センサ
40 亀裂
42 伝送信号
44 センサの配向角
46 反射信号
48 伝送信号
50 反射信号
52 反射信号
54 伝送信号
56〜62 複数の反射信号
64 3つのセンサのAスコープ
70〜80 信号スパイク
82〜86 スキップ距離からの差
90 異なるAスコープ
94 時間軸
98 軸方向位置
100〜104 線形標識
106〜108 差分
112〜116 Bスコープ上の点
120 流れ図
122〜128 流れ図の各ステップ
Claims (10)
- 超音波走査データから亀裂(40)の深さを推定する方法であって、
複数のセンサ(34)の1つからの信号をそれぞれ表す複数の振幅応答を、超音波走査データからマッピングするステップと、
前記複数のマッピングされた振幅応答の中で、それぞれが前記亀裂(40)からの反射信号を示す標識である複数の線形応答を突き止めるステップと、
前記亀裂(40)からの前記線形応答に対応する1つまたは複数のセンサ(34)を識別するステップと、
前記1つまたは複数のセンサ(34)からのデータを用いて、前記亀裂(40)の深さを推定するステップとを含む方法。 - 前記複数のセンサ(34、36、38)からのデータが、センサ信号の位置、伝搬時間、入力エコー時間に関するデータを含むことを特徴とする請求項1記載の方法。
- 前記亀裂(40)からの反射信号を受信する前記複数のセンサのそれぞれからのデータを用いて、前記亀裂(40)の最大深さ推定値を計算するステップを含むことを特徴とする請求項1記載の方法。
- 前記亀裂からの反射信号を受信する前記複数のセンサ(34、36、38)のそれぞれからのデータを用いて、前記亀裂(40)の平均深さ推定値を計算するステップをさらに含むことを特徴とする請求項1記載の方法。
- 前記それぞれのセンサ(34、36、38)のスキップ距離値を用いて、前記亀裂(40)の深さを推定するステップを含むことを特徴とする請求項1記載の方法。
- 前記亀裂(40)がパイプラインの外表面(30)から発生しているか内表面(32)から発生しているかを判定するステップを含むことを特徴とする請求項1記載の方法。
- 信号が、超音波ビームの中心線を含むことを特徴とする請求項1記載の方法。
- 超音波走査データから亀裂(40)の深さを推定する装置(12)であって、
各センサの信号をそれぞれ表す複数の振幅応答を超音波走査データからマッピングし、それぞれが前記亀裂からの反射信号を示す標識である複数の線形応答を突き止めるようになされた振幅プロセッサ(22)と、
それぞれの線形応答に対応するセンサを識別し、それぞれのセンサからのデータを用いて前記亀裂の深さを推定するようになされた亀裂サイズ検出部(26)とを含む装置。 - 前記それぞれのセンサ(34、36、38)からのデータが、センサ信号の位置、伝搬時間、入力エコー時間に関するデータを含むことを特徴とする請求項8記載の装置。
- 前記亀裂サイズ検出部(26)が、前記亀裂(40)からの反射信号を受信する複数のセンサ(34、36、38)のそれぞれからのデータを用いて、前記亀裂(40)の最大深さ推定値を計算するように構成されることを特徴とする請求項8記載の装置。
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US11/094,909 | 2005-03-31 | ||
US11/094,909 US7299697B2 (en) | 2005-03-31 | 2005-03-31 | Method and system for inspecting objects using ultrasound scan data |
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JP2006284578A true JP2006284578A (ja) | 2006-10-19 |
JP5113340B2 JP5113340B2 (ja) | 2013-01-09 |
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JP2006093436A Expired - Fee Related JP5113340B2 (ja) | 2005-03-31 | 2006-03-30 | 超音波走査データを用いて物体を検査する方法およびシステム |
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US (1) | US7299697B2 (ja) |
EP (1) | EP1707956B1 (ja) |
JP (1) | JP5113340B2 (ja) |
CN (1) | CN100554874C (ja) |
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- 2006-03-30 JP JP2006093436A patent/JP5113340B2/ja not_active Expired - Fee Related
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US10393705B2 (en) | 2012-07-31 | 2019-08-27 | General Electric Company | Method and system for determination of geometric features in objects |
CN111398424A (zh) * | 2020-05-09 | 2020-07-10 | 国电锅炉压力容器检验有限公司 | 一种管道横向裂纹定位方法 |
Also Published As
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EP1707956A3 (en) | 2011-12-14 |
US20060219011A1 (en) | 2006-10-05 |
EP1707956B1 (en) | 2016-11-23 |
CN100554874C (zh) | 2009-10-28 |
JP5113340B2 (ja) | 2013-01-09 |
CN1854683A (zh) | 2006-11-01 |
EP1707956A2 (en) | 2006-10-04 |
US7299697B2 (en) | 2007-11-27 |
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