JP2006278895A - Resin applying device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a resin applying device capable of satisfactorily applying a resin between parts even for narrow gaps between parts at the time of a surface packaging. <P>SOLUTION: A guide 20 is provided at an outer circumferential part of a tip of a needle 10. The guide 20 comprising a thin wire having a diameter of not more than 350 μm and a fixing end at an outer circumferential part of the needle 10. The guide 20 is once bent to a central direction of the needle 10 and extended to the position contacting the underfill resin ejected from a nozzle, and then bent again to an axis direction (a resin ejecting direction) and extended. The underfil resin 11 ejected from the nozzle of the tip of the needle 10 is guided by the guide 20 and filled in between parts even when the tip of the needle 10 would not enter between parts. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a resin coating apparatus that fills a resin between a substrate and a semiconductor during BGA or FC mounting of the semiconductor.

  Conventionally, BGA (Ball Grid Array) and FC (Flip Chip) mounting techniques have been developed in order to surface-mount semiconductors that have multiple pins. In the BGA mounting technology, as shown in FIGS. 4A and 4B, bumps (or solder balls) 1 obtained by rolling small solder materials into balls are arranged on the back surface of the semiconductor 2 at intervals of about 50 mils. This is surface-mounted on the substrate 3. In the FC mounting technology, as shown in FIGS. 4A and 4B, lead pins are drawn in advance from a component terminal to an SMD (Surface Mount Device) 4 such as an LSI, a resistor, a capacitor, or the like. A small solder 5 is bonded in advance to the portion, gold bumps are attached, and the solder 5 is melted in a high temperature furnace and directly joined to the substrate 3 without wire connection.

By the way, in the BGA and FC mounting described above, a resin (for example, underfill resin) 11 is filled between the substrate 3 and the semiconductor 2 by the needle 10. At this time, as shown in FIG. 4 (a), there is no problem when there is a sufficient space between the parts (for example, between the semiconductor 2 and the SMD 4), but as shown in FIG. 4 (b), there is no problem between the parts. When the distance between the two was narrowed, the tip of the needle 10 for filling the resin 11 could not reach the vicinity of the substrate 3 and the resin 11 could not be applied between the components. The component interval can be up to 0.15 mm at present, but due to the above problems, the resin-coated portion has to be widened to have an interval of 0.62 mm or more. In view of this, conventionally, a technique has been proposed in which fine wires are inserted inside the needle so as to fill the resin even when the interval between the parts is narrow (see, for example, Patent Document 1 and Patent Document 2).
Japanese Utility Model Publication No. 60-071138 JP 2003-145008 A

  However, in the above prior art, when the inner diameter of the needle 10 is small, the flow of the underfill resin is greatly inhibited by the thin wire provided inside. Since the inner diameter of the needle varies depending on the amount of the underfill resin, there is a problem that the conventional technique cannot cope particularly with a small amount of the underfill resin and a small inner diameter.

  Therefore, an object of the present invention is to provide a resin coating apparatus that can satisfactorily fill a resin between components even when the interval between the components becomes narrow in surface mounting.

In order to achieve the above object, a resin coating apparatus according to the present invention is a resin coating apparatus that fills a liquid fluid between components mounted on a substrate, a discharge means that discharges the liquid fluid, and a discharge means that discharges from the discharge means. The liquid fluid is partly in contact with the liquid fluid, and the part extends along the discharge direction of the liquid fluid discharged from the discharge means, and is bent so as to be bent directly below the discharge port of the discharge means. And a guide means attached to the means.
The guide means has one end fixed to the outer peripheral surface of the discharge means and the other end extended along the discharge direction of the liquid fluid discharged from the discharge means.
The guide means is attached to the discharge means so as to be bent in a non-contact manner with respect to the discharge port of the discharge means.
The guide means is formed of a linear member having a diameter of 350 μm or less.
Further, the guide means is composed of a plurality of linear members arranged at intervals along the peripheral wall of the discharge port of the discharge means.

According to the present invention, the liquid fluid discharged from the discharge means is guided to the guide means and filled between the components mounted on the substrate without hindering the flow. Therefore, even when the interval between components is reduced in surface mounting, there is an advantage that the resin can be satisfactorily filled between the components.
Further, one end of the guide means is fixed to the outer peripheral surface of the discharge means, and the other end is extended along the discharge direction of the liquid fluid discharged from the discharge means. There is an advantage that the resin can be satisfactorily filled between the parts without hindering the flow of the liquid fluid.
Further, since the guide means is attached to the discharge means so as to be bent in a non-contact manner with respect to the discharge port of the discharge means, it is possible to apply a uniform amount of resin while suppressing the resin pool flowing from the discharge port. The advantage that it can be obtained.
Further, since the guide means is formed of a linear member having a diameter of 350 μm or less, there is an advantage that the resin can be satisfactorily filled between the components even when the interval between the components becomes narrow in surface mounting.
In addition, since the guide means is composed of a plurality of linear members arranged at intervals along the peripheral wall of the discharge port of the discharge means, the capillarity generated between the linear members makes it more effective between components. The advantage that the resin can be satisfactorily filled is obtained.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

A. Configuration of Embodiment FIG. 1 is an external view showing a resin filling state of a resin coating apparatus according to an embodiment of the present invention. Note that portions corresponding to those in FIG. 4 are denoted by the same reference numerals and description thereof is omitted. In the figure, a guide 20 is provided on the outer peripheral portion of the tip of the needle 10. The guide 20 is preferably formed of a thin wire having a diameter of 350 μm or less, has a fixed end on the outer peripheral portion of the needle 10, and once bends toward the center of the needle 10 until it touches the underfill resin discharged from the nozzle. It extends so as to bend and extend in the axial direction (resin discharge direction) again.

  The outer diameter of the needle 10 is about 0.3 mm at a minimum, and the guide 20 is guided in order to guide the gap between the parts without interfering with the flow of the underfill resin in consideration of narrowing the part interval from the current 0.65 mm. Was attached to the outer peripheral surface of the needle 10.

  According to the above-described resin coating apparatus, as shown in FIG. 1B, the underfill resin 11 discharged from the nozzle at the tip of the needle 10 is a case where the tip of the needle 10 does not enter between the parts. However, it is guided to the guide 20 and filled between the parts.

  Next, FIG. 2 is an external view showing the structure of a resin coating apparatus according to a modification of the present invention. In the modification shown in FIG. 2, two guides 20-1 and 20-2 are fixed to the outer peripheral portion at the tip of the needle 10. In this case, the capillarity of the guides 20-1 and 20-2 enables smooth filling of the underfill resin 11 between components.

  In the above-described embodiment, the bending angle of the guide 20 or the guides 20-1 and 20-2 is approximately 90 degrees. However, the present invention is not limited to this, and the underfill resin discharged from the nozzle is not limited thereto. If the flow is not obstructed, an obtuse angle (90 degrees or more) may be used as shown in FIG.

It is an external view which shows the mode of the resin filling of the resin coating device by embodiment of this invention. It is an external view which shows the structure of the resin coating apparatus by the modification of this invention. It is an external view which shows the other shape of the guide of the resin coating device of this invention. It is an external view which shows the mode of resin filling of the resin coating device by a prior art.

Explanation of symbols

1 Bump 2 Semiconductor 3 Substrate 4 SMD
5 Solder 10 Needle (Discharge means)
11 Resin (liquid fluid)
20 Guide (Guide means)
20-1, 20-2 Guide (guide means)

Claims (5)

In a resin coating apparatus that fills a liquid fluid between components mounted on a substrate,
A discharge means for discharging a liquid fluid;
A part of the liquid fluid discharged from the discharge means comes into contact, the part extends along the discharge direction of the liquid fluid discharged from the discharge means, and directly below the discharge port of the discharge means. And a guide means attached to the discharge means so as to be bent.   2. The resin coating according to claim 1, wherein the guide means has one end fixed to the outer peripheral surface of the discharge means and the other end extended along the discharge direction of the liquid fluid discharged from the discharge means. apparatus.   The resin coating apparatus according to claim 1, wherein the guide unit is attached to the discharge unit so as to be bent in a non-contact manner at a discharge port of the discharge unit.   The resin coating apparatus according to claim 1 or 2, wherein the guide means is formed of a linear member having a diameter of 350 µm or less.   5. The resin coating apparatus according to claim 4, wherein the guide means comprises a plurality of linear members arranged at intervals along the peripheral wall of the discharge port of the discharge means.

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