JP2006261608A5 - - Google Patents

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Publication number
JP2006261608A5
JP2006261608A5 JP2005080595A JP2005080595A JP2006261608A5 JP 2006261608 A5 JP2006261608 A5 JP 2006261608A5 JP 2005080595 A JP2005080595 A JP 2005080595A JP 2005080595 A JP2005080595 A JP 2005080595A JP 2006261608 A5 JP2006261608 A5 JP 2006261608A5
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JP
Japan
Prior art keywords
manufacturing apparatus
device manufacturing
chamber
load lock
pressure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2005080595A
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Japanese (ja)
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JP2006261608A (en
Filing date
Publication date
Application filed filed Critical
Priority to JP2005080595A priority Critical patent/JP2006261608A/en
Priority claimed from JP2005080595A external-priority patent/JP2006261608A/en
Priority to US11/376,240 priority patent/US20060207680A1/en
Publication of JP2006261608A publication Critical patent/JP2006261608A/en
Publication of JP2006261608A5 publication Critical patent/JP2006261608A5/ja
Withdrawn legal-status Critical Current

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Claims (10)

デバイス製造装置であって、
処理チャンバと、
中継チャンバと、
前記デバイス製造装置の外部と前記中継チャンバとの間に設けられた第１ロードロック室と、
前記中継チャンバと前記処理チャンバとの間に設けられた第２ロードロック室と、
前記処理チャンバ内の圧力を第１の圧力に調整する第１の調整機構と、
前記中継チャンバ内の圧力を前記第１の圧力と前記外部の圧力との中間の第２の圧力に調整する２の調整機構と、
を有することを特徴とするデバイス製造装置。 A device manufacturing apparatus,
A processing chamber;
A relay chamber;
A first load lock chamber provided between the outside of the device manufacturing apparatus and the relay chamber;
A second load lock chamber provided between the relay chamber and the processing chamber;
A first adjustment mechanism for adjusting the pressure in the processing chamber to a first pressure;
Two adjustment mechanisms for adjusting the pressure in the relay chamber to a second pressure intermediate between the first pressure and the external pressure;
A device manufacturing apparatus comprising: 前記第１の調整機構は、前記処理チャンバ内を第１の真空度に調整し、前記第２の調整機構は、前記中継チャンバ内を前記第１の真空度と前記外部の圧力との中間の第２の真空度に調整する、ことを特徴とする請求項１に記載のデバイス製造装置。   The first adjustment mechanism adjusts the inside of the processing chamber to a first degree of vacuum, and the second adjustment mechanism adjusts the inside of the relay chamber between the first degree of vacuum and the external pressure. The device manufacturing apparatus according to claim 1, wherein the device is adjusted to a second degree of vacuum. 前記第１の調整機構は、前記処理チャンバ内を第１のガス組成に調整し、前記第２の調整機構は、前記中継チャンバ内を前記第１のガス組成と前記外部のガス組成との中間の第２のガス組成に調整する、ことを特徴とする請求項１または２に記載のデバイス製造装置。   The first adjustment mechanism adjusts the inside of the processing chamber to a first gas composition, and the second adjustment mechanism includes an intermediate between the first gas composition and the external gas composition in the relay chamber. The device manufacturing apparatus according to claim 1, wherein the second gas composition is adjusted. 前記第１ロードロック室の容積が前記第２ロードロック室の容積よりも大きい、ことを特徴とする請求項１乃至３のいずれか１項に記載のデバイス製造装置。   4. The device manufacturing apparatus according to claim 1, wherein a volume of the first load lock chamber is larger than a volume of the second load lock chamber. 5. 複数の前記第１ロードロック室を含む、ことを特徴とする請求項１乃至４のいずれか１項に記載のデバイス製造装置。   The device manufacturing apparatus according to claim 1, comprising a plurality of the first load lock chambers. 複数の前記第２ロードロック室を含む、ことを特徴とする請求項１乃至５のいずれか１項に記載のデバイス製造装置。   The device manufacturing apparatus according to claim 1, comprising a plurality of the second load lock chambers. 容積の異なる複数の前記第１ロードロック室を含む、ことを特徴とする請求項１乃至６のいずれか１項に記載のデバイス製造装置。   The device manufacturing apparatus according to claim 1, comprising a plurality of the first load lock chambers having different volumes. 前記第１の調整機構は、前記第１ロードロック室内を排気する排気機構を含み、前記排気機構は、前記第１ロードロック室内の真空度に基づいて排気速度を切り替える、ことを特徴とする請求項１乃至７のいずれか１項に記載のデバイス製造装置。   The first adjustment mechanism includes an exhaust mechanism that exhausts the first load lock chamber, and the exhaust mechanism switches an exhaust speed based on a degree of vacuum in the first load lock chamber. Item 8. The device manufacturing apparatus according to any one of Items 1 to 7. 前記第１の調整機構は、前記第１ロードロック室内に特定のガスを供給する供給機構を含み、前記供給機構は、前記第１ロードロック室内の圧力に基づいて前記特定のガスの供給速度を切り替える、ことを特徴とする請求項１乃至８のいずれか１項に記載のデバイス製造装置。   The first adjustment mechanism includes a supply mechanism that supplies a specific gas into the first load lock chamber, and the supply mechanism controls a supply speed of the specific gas based on a pressure in the first load lock chamber. The device manufacturing apparatus according to claim 1, wherein switching is performed. 前記処理チャンバ内で被処理物に対し露光処理を行う、ことを特徴とする請求項１乃至９のいずれか１項に記載のデバイス製造装置。   The device manufacturing apparatus according to claim 1, wherein an exposure process is performed on an object to be processed in the processing chamber.
JP2005080595A 2005-03-18 2005-03-18 Device manufacturing apparatus and controlling method Withdrawn JP2006261608A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2005080595A JP2006261608A (en) 2005-03-18 2005-03-18 Device manufacturing apparatus and controlling method
US11/376,240 US20060207680A1 (en) 2005-03-18 2006-03-16 Device manufacturing apparatus and method of controlling same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005080595A JP2006261608A (en) 2005-03-18 2005-03-18 Device manufacturing apparatus and controlling method

Publications (2)

Publication Number Publication Date
JP2006261608A JP2006261608A (en) 2006-09-28
JP2006261608A5 true JP2006261608A5 (en) 2008-05-08

Family

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Family Applications (1)

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JP2005080595A Withdrawn JP2006261608A (en) 2005-03-18 2005-03-18 Device manufacturing apparatus and controlling method

Country Status (2)

Country Link
US (1) US20060207680A1 (en)
JP (1) JP2006261608A (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4963678B2 (en) * 2007-04-06 2012-06-27 キヤノン株式会社 Atmosphere replacement method
JP2011091160A (en) * 2009-10-21 2011-05-06 Ulvac Japan Ltd Substrate conveying device and substrate processing device
JP5597433B2 (en) * 2010-04-16 2014-10-01 株式会社日立ハイテクノロジーズ Vacuum processing equipment
JP5617708B2 (en) * 2011-03-16 2014-11-05 東京エレクトロン株式会社 Lid opening / closing device
KR20180045316A (en) * 2016-10-25 2018-05-04 삼성전자주식회사 Equipment front end module and semiconductor manufacturing apparatus including the same
US10388547B2 (en) * 2017-06-23 2019-08-20 Applied Materials, Inc. Side storage pods, equipment front end modules, and methods for processing substrates
KR102360219B1 (en) 2017-06-23 2022-02-08 어플라이드 머티어리얼스, 인코포레이티드 Indexable Side Storage Pod Apparatus, Heated Side Storage Pod Apparatus, Systems, and Methods

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6852194B2 (en) * 2001-05-21 2005-02-08 Tokyo Electron Limited Processing apparatus, transferring apparatus and transferring method
US20030029715A1 (en) * 2001-07-25 2003-02-13 Applied Materials, Inc. An Apparatus For Annealing Substrates In Physical Vapor Deposition Systems
KR100443121B1 (en) * 2001-11-29 2004-08-04 삼성전자주식회사 Method for processing of semiconductor and apparatus for processing of semiconductor

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