JP2006251444A - Microlens substrate and its manufacturing method, electrooptical device equipped with microlens substrate and its manufacturing method, and electronic equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To maintain excellent flatness on the surface of a microlens substrate in forming a alignment layer or the like. <P>SOLUTION: The microlens substrate is constituted of: a transparent substrate where the respective lens curved surfaces of a plurality of microlenses are formed in a lens forming area; an adhesive layer which is continuously formed from the lens forming area to a lens non-forming area on the transparent substrate, formed of resin material so as to cover the lens curved surface, and formed so that its thickness in a perpendicular direction to the transparent substrate in the lens non-forming area may be larger from the lens non-forming area to the lens forming area; and a cover substrate constituted of a transparent plate member and attached to the transparent substrate through the adhesive layer. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a technical field of a microlens substrate used in an electro-optical device such as a liquid crystal device and a manufacturing method thereof, an electro-optical device including the micro-lens substrate, and an electronic apparatus including the electro-optical device. .

  This type of microlens substrate is used as a counter substrate in, for example, a liquid crystal device constituting a light valve of a projector. This counter substrate is disposed opposite to a TFT array substrate in which an alignment film, a pixel electrode, and the like are formed in a liquid crystal device, and an electro-optical material such as liquid crystal is sandwiched between the counter substrate and the TFT array substrate. An alignment film, a counter electrode, and the like are formed on the counter substrate on the side facing the electro-optical material.

  The microlens substrate has, for example, a transparent substrate in which a plurality of concave portions each having a lens curved surface are formed in an array shape in a lens formation region, and the plurality of concave portions of the transparent substrate are filled with a transparent resin having a high refractive index. In addition, an adhesive layer is formed of the transparent resin, and a cover substrate is bonded to the transparent substrate via the adhesive layer. In the transparent substrate of the microlens substrate, there is a non-lens forming area around the lens forming area.

  The microlens substrate is formed, for example, by adhering a cover substrate to a transparent substrate via an adhesive layer on a large substrate including a large number of transparent substrates as described above, and each lens forming region has a large size. It is manufactured by cutting the substrate. In this case, the adhesive layer is formed on the non-lens forming region of each transparent substrate so that the transparent resin is surely filled into the concave portions formed in each transparent substrate over the entire large substrate. It is formed on a large substrate so that the film thickness in the direction perpendicular to the transparent substrate becomes a predetermined value.

  Here, in Patent Document 1, in the microlens substrate, the thickness of the adhesive layer in the non-effective lens region outside the effective lens region that can function as a microlens is set to a predetermined value with respect to the thickness in the direction perpendicular to the transparent substrate. In order to prevent the occurrence of uneven thickness, a technique is disclosed in which a gap material that defines the thickness of the adhesive layer is provided between the transparent substrate and the cover substrate.

JP-A-8-286640

  When a microlens substrate is used as a counter substrate and an alignment film is formed on the microlens substrate by baking, for example, the microlens substrate is heated. At this time, outgas may occur in a part of the adhesive layer located on the non-lens formation region in the transparent substrate due to the vaporization of the resin component forming the part. The amount of outgas generation is increased in the part of the adhesive layer located on the non-lens formation region in the transparent substrate from the lens formation region toward the non-lens formation region, and is exposed at the end surface of the microlens substrate. Outgassing tends to occur significantly.

  As a result, the resin forming a part of the adhesive layer located on the non-lens forming region in the transparent substrate contracts, and the film thickness of the adhesive layer changes from a predetermined value in the part. More specifically, in a part of the adhesive layer located on the non-lens formation region in the transparent substrate, the film thickness of the part decreases from the lens formation region to the non-lens formation region, and the amount of outgas generated The thickness of the portion exposed on the end face of the microlens substrate having the largest is the smallest.

  Therefore, in this way, in the part of the adhesive layer located on the non-lens forming region in the transparent substrate, unevenness occurs in the thickness of the adhesive layer, and the transparent substrate or the cover substrate is opposite to the side facing the adhesive layer. There arises a situation in which the surface shape becomes an inclined shape. When such a microlens substrate is used as the counter substrate, the surface shape of the microlens substrate on the side facing the electrooptic material is inclined, so that the thickness of the electrooptic material, that is, the counter substrate and the TFT array substrate. There arises a problem that it is difficult to set the interval of the predetermined value to a predetermined value.

  The present invention has been made in view of the above-described problems. For example, when forming an alignment film or the like, a microlens substrate capable of maintaining good flatness on the surface, a manufacturing method thereof, and the microlens It is an object to provide an electro-optical device including a substrate and an electronic apparatus including the electro-optical device.

  In order to solve the above problems, the microlens substrate of the present invention has a transparent substrate on which a lens curved surface of each of a plurality of microlenses is formed in a lens forming region, and the lens forming region on the transparent substrate, It is continuously formed in a non-lens forming region located around the lens forming region, and is formed so as to cover the lens curved surface with a resin material, and has a thickness in a direction perpendicular to the transparent substrate in the non-lens forming region. Is composed of an adhesive layer formed so as to increase from the non-lens formation region toward the lens formation region, and a transparent plate-like member, and is attached to the transparent substrate via the adhesive layer. A substrate.

  The microlens substrate of the present invention is transparent on the transparent substrate in which the lens curved surface of each of the plurality of microlenses is formed in the lens forming region, from the lens forming region of the transparent substrate to the non-lens forming region. A transparent cover substrate is bonded through an adhesive layer formed of a resin material.

  In the lens formation region of the transparent substrate, for example, a plurality of concave portions or convex portions that respectively form the lens curved surface of the microlens are formed in an array. Then, a plurality of microlenses are formed by forming an adhesive layer having a high refractive index or a low refractive index from the transparent substrate so as to be filled in the plurality of concave portions or to cover the lens curved surfaces of the plurality of convex portions, respectively. It is formed as a plano-convex lens.

  In the microlens substrate of the present invention, the thickness of a part of the adhesive layer located on the non-lens forming region in the transparent substrate is changed from the non-lens forming region to the lens forming region with a thickness in a direction perpendicular to the part of the transparent substrate. It is formed so as to become larger.

  For example, in the non-lens formation region, the shape of the surface of the transparent substrate facing the adhesive layer is such that the thickness of the transparent substrate in the direction perpendicular to the surface decreases from the non-lens formation region to the lens formation region. It is formed as an inclined shape or a staircase shape. Alternatively, in addition to or instead of the transparent substrate, the thickness of the cover substrate changes on the surface on the side facing the part located in the non-lens formation region of the transparent substrate in the same manner as the transparent substrate described above. It is good also as such a shape. Thereby, the thickness of a part of the adhesive layer positioned on the non-lens forming region in the transparent substrate can be formed so as to increase from the non-lens forming region toward the lens forming region.

  Here, when an electro-optical device is configured using a microlens substrate, for example, a functional film such as an alignment film is formed on the microlens substrate. For example, when the alignment film is formed by firing, outgas may occur due to the microlens substrate being heated and the resin components being vaporized in the adhesive layer formed of the transparent resin. The amount of outgas generated is the portion of the adhesive layer exposed at the end surface of the microlens substrate, and the portion is the largest because it is directly heated, and decreases as the portion moves from the non-lens formation region to the lens formation region. Tend to be.

  Thus, the amount of outgas generated in the adhesive layer of the microlens substrate not only changes in the direction along the surface of the transparent substrate from the end surface of the microlens substrate toward the lens formation region, but also the resin that forms the adhesive layer. It also depends on the amount of material. In the present invention, the thickness of a part of the adhesive layer located on the non-lens formation region of the transparent substrate is changed in accordance with the change in the outgas generation amount as described above. That is, as described above, in the adhesive layer, the thickness of the portion exposed to the end surface of the microlens substrate, which tends to generate the largest amount of outgas, is formed to be the smallest, and the lens forming region is formed from the portion. The thickness of the adhesive layer is formed so as to correspond to the change in the amount of outgas generation described above. Thereby, in the adhesive layer, a part of the transparent substrate located on the non-lens forming area increases the amount of the resin material forming the part along the direction from the non-lens forming area to the lens forming area. Formed.

  Therefore, when the microlens substrate is heated, the generation amount of outgas is reduced in a part of the adhesive layer located on the non-lens formation region of the transparent substrate, and transparent from the end surface of the microlens substrate toward the lens formation region. In the direction along the surface of the substrate, the amount of outgas generated can be made constant, or at least close to constant. Therefore, in a part of the adhesive layer located on the non-lens forming region of the transparent substrate, the amount of change in the thickness of the adhesive layer due to resin contraction is made constant or close to the lens forming region from the end surface of the microlens substrate. be able to. As a result, in the microlens substrate, good flatness is achieved on the surface opposite to the side facing the adhesive layer in part of the transparent substrate in the non-lens formation region or part of the cover substrate facing the part. Can be maintained.

  Furthermore, according to the microlens substrate of the present invention, when the microlens substrate is heated, the distance between the part of the transparent substrate in the non-lens formation region and the cover substrate is maintained at a predetermined value, so that the non-lens formation region is transparent. A gap material for maintaining the flatness of the surface opposite to the side facing the adhesive layer is not used in a part of the substrate or a part of the cover substrate facing the part. Therefore, when the microlens substrate is manufactured, the microlens substrate can be easily manufactured without providing an extra manufacturing process for forming the gap material.

  In addition, since the amount of outgas generated can be reduced, it is possible to form an adhesive layer with a resin material that is relatively easily generated by heating. Thereby, one resin material can be selected from various resin materials to form the adhesive layer, and the selection range of the resin material can be widened.

  In one aspect of the microlens substrate of the present invention, the transparent substrate has a thickness in a direction perpendicular to the substrate surface of the transparent substrate in the non-lens formation region from the non-lens formation region toward the lens formation region. It is formed to be smaller.

  According to this aspect, in the microlens substrate, the thickness of a part of the adhesive layer located on the non-lens formation region in the transparent substrate can be formed so as to increase from the non-lens formation region toward the lens formation region. it can.

  In the aspect in which the thickness of the transparent substrate in the non-lens forming region is changed, the transparent substrate has a surface shape on the side facing the adhesive layer in the non-lens forming region. You may comprise so that the thickness of the orthogonal | vertical direction with respect to a substrate surface may be formed as an inclined shape so that it may become small toward the said lens formation area from the said non-lens formation area.

  If comprised in this way, it will become possible to change the thickness of this part corresponding to the change of the outgas generation amount in a part of adhesive layer located on the non-lens formation area of a transparent substrate. Thereby, in a part of the adhesive layer located on the non-lens forming region of the transparent substrate, the thickness of each part of the part is set to a predetermined value, and after heating when the microlens substrate is heated. By making the value corresponding to the thickness, the amount of outgas generation is more reliably reduced, and the amount of outgas generation in the direction along the surface of the transparent substrate from the end surface of the microlens substrate toward the lens formation region. Can be made constant.

  Alternatively, in an aspect in which the thickness of the transparent substrate in the non-lens forming region changes, the transparent substrate has a surface shape on the side facing the adhesive layer in the non-lens forming region so that the surface shape of the transparent substrate in the non-lens forming region is You may comprise so that the thickness of the orthogonal | vertical direction with respect to a substrate surface may be formed in step shape so that it may become small toward the said lens formation area from the said non-lens formation area.

  Even in such a configuration, the thickness of the part of the adhesive layer located on the non-lens formation region of the transparent substrate can be changed in accordance with the change in the outgas generation amount. . In addition, the staircase shape can be easily produced as compared with the case where a part of the surface shape located in the non-lens forming region of the transparent substrate is formed as an inclined shape.

  In another aspect of the microlens substrate of the present invention, the adhesive layer has a thickness of a part of the adhesive layer located in the non-lens formation region on the transparent substrate that is less than the predetermined value from the lens formation region. It is formed so as to change toward the lens formation region.

  According to this aspect, when the microlens substrate is formed on a large substrate including a large number of transparent substrates, the thickness of a part of the adhesive layer in the microlens substrate that is located in the non-lens formation region on the transparent substrate is set to a predetermined value. By changing the value in the direction from the lens formation region to the non-lens formation region, an adhesive layer can be formed so as to more reliably cover the lens curved surface formed on each transparent substrate over the entire large substrate. it can. Further, according to this aspect, in the microlens substrate, the adhesive strength of the cover substrate or the transparent substrate in the adhesive layer can be maintained at a predetermined value, and the peeling of the transparent substrate and the cover substrate can be prevented.

  In order to solve the above problems, an electro-optical device of the present invention includes a pair of substrates including the above-described microlens substrate of the present invention (including various aspects thereof), and an electro-optical device sandwiched between the pair of substrates. A substance and a functional film formed on a surface of the microlens substrate facing the electro-optic substance.

  According to the electro-optical device of the present invention, a liquid crystal, for example, is sandwiched between the pair of substrates as an electro-optical material, and takes a predetermined alignment state. By applying a predetermined voltage to the liquid crystal for each pixel, the orientation or order of the molecular assembly in the liquid crystal is changed, and image display is performed by modulating, for example, projection light in the liquid crystal. At this time, if the substrate on the side on which the projection light is incident is the microlens substrate of the present invention described above, the projection light is condensed by the microlens formed on the microlens substrate, By making the light incident on each pixel, it is possible to improve the light use efficiency.

  On such a microlens substrate, a functional film such as an alignment film is formed on the surface facing the electro-optic material. For example, when an alignment film is formed as a functional film, it is possible to maintain good flatness on the surface even if the microlens substrate is heated during firing of the alignment film. Therefore, when the pair of substrates are bonded together after the alignment film or the like is formed, the interval between the pair of substrates, that is, the gap can be easily set to a predetermined value. As a result, in the electro-optical device, uneven display can be prevented from occurring due to uneven gaps, and high-quality image display can be performed.

  Here, when the alignment film is defective due to an error during the formation of the alignment film or during the alignment film application, a so-called alignment film regeneration process is performed in which the alignment film is peeled off and the formation is performed again. Sometimes.

  As already described, when the microlens substrate is heated and a part of the surface of the microlens substrate located on the non-lens formation region in the transparent substrate is locally inclined, There is a limit to the number of times that the reproduction process can be performed.

  On the other hand, in the electro-optical device of the present invention, even when the microlens substrate is heated, it is possible to maintain good flatness on the surface, so that the alignment film regeneration process is performed as many times as necessary without limitation. Can be done. As a result, the cost for manufacturing the electro-optical device can be reduced.

  In order to solve the above problems, an electronic apparatus according to the present invention includes the above-described electro-optical device according to the present invention.

  Since the electronic apparatus of the present invention includes the above-described electro-optical device of the present invention, a projection display device, a television, a mobile phone, an electronic notebook, a word processor, a view capable of performing high-quality image display. Various electronic devices such as a finder type or a monitor direct-view type video tape recorder, a workstation, a videophone, a POS terminal, and a touch panel can be realized. Further, as an electronic apparatus of the present invention, for example, an electrophoretic device such as electronic paper, an electron emission device (Field Emission Display and a Conduction Electron-Emitter Display), an electrophoretic device, and an apparatus using the electron emission device, DLP (Digital Light Processing) and the like can also be realized.

  In order to solve the above problems, the method for producing a microlens substrate of the present invention includes a step of forming each lens curved surface of a plurality of microlenses in a lens formation region on one surface of a transparent substrate, and bonding on the transparent substrate. A layer is continuously formed from the lens forming region to a non-lens forming region positioned around the lens forming region so as to cover the lens curved surface with a resin material, and the non-lens of the adhesive layer A step of forming a thickness in a direction perpendicular to the transparent substrate in the formation region from the non-lens formation region toward the lens formation region; and a cover substrate constituted by a transparent plate member, Adhering to the transparent substrate through an adhesive layer, and the side opposite to the side facing the adhesive layer in the transparent substrate or the cover substrate On the surface, and forming a functional film.

  According to the method for manufacturing a microlens substrate of the present invention, as in the above-described microlens substrate of the present invention, even if the microlens substrate is heated in the step of forming a functional film such as an alignment film, a non-lens Good flatness can be maintained on a part of the transparent substrate in the formation region or a part of the cover substrate facing the part on the surface opposite to the side facing the adhesive layer.

  In one aspect of the method for producing a microlens substrate of the present invention, the surface shape of the transparent substrate on the side facing the adhesive layer in the non-lens formation region is set in the vertical direction of the transparent substrate in the non-lens formation region. A step of forming an inclined shape such that the thickness decreases from the non-lens formation region toward the lens formation region.

  According to this aspect, before or after the step of forming the lens curved surface of each of the plurality of microlenses and before the step of forming the adhesive layer, a part of the transparent substrate located in the non-lens formation region The surface shape on the side facing the adhesive layer is formed as an inclined shape. More specifically, for example, the following resist is formed by photolithography on a transparent substrate, and etching is performed on a part of the surface located in the non-lens formation region of the transparent substrate by etching. By applying, the shape of the surface is formed as an inclined shape. That is, when etching a part of the surface located in the non-lens formation region of the transparent substrate, a resist whose etching rate increases in the direction from the non-lens formation region to the lens formation region in the part is used as a gradation mask. Is formed on a transparent substrate by a photolithography method. Therefore, in this aspect, it is possible to change the thickness of a part of the adhesive layer located on the non-lens formation region of the transparent substrate in accordance with the change in the outgas generation amount.

  In another aspect of the method for manufacturing a microlens substrate of the present invention, the surface shape of the transparent substrate on the side facing the adhesive layer in the non-lens formation region is defined as a vertical direction of the transparent substrate in the non-lens formation region. Forming a stepped shape so that the thickness of the lens decreases from the non-lens formation region toward the lens formation region.

  According to this aspect, a part of the surface shape located in the non-lens formation region of the transparent substrate is formed as a staircase shape by, for example, a photolithography method and an etching method. At this time, a photolithography method and an etching method are performed for each step of the staircase shape. In addition, by increasing the number of steps of the staircase shape, a part of the surface shape located in the non-lens forming region of the transparent substrate can be brought close to the inclined shape.

  Therefore, also in this aspect, it is possible to change the thickness of a part of the adhesive layer located on the non-lens formation region of the transparent substrate in accordance with the change in the outgas generation amount. In addition, the staircase shape can be easily produced as compared with the case where a part of the surface shape located in the non-lens forming region of the transparent substrate is formed as an inclined shape.

  In order to solve the above problems, an electro-optical device manufacturing method of the present invention is a method for manufacturing an electro-optical device having a pair of substrates including a microlens substrate and an electro-optical material sandwiched between the pair of substrates. In addition, the manufacturing method of the microlens substrate of the present invention described above (including various aspects thereof) is included.

  According to the method for manufacturing the electro-optical device of the present invention, since the method for manufacturing the microlens substrate of the present invention described above is included, a part of the transparent substrate in the non-lens formation region or one of the cover substrates opposed to the part. In the portion, it is possible to maintain good flatness on the surface opposite to the side facing the adhesive layer. Therefore, an electro-optical device that displays a high-quality image can be manufactured relatively easily.

  Such an operation and other advantages of the present invention will become apparent from the embodiments described below.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

<1: Microlens substrate>
First, the microlens substrate of the present invention will be described with reference to FIGS.

  Here, FIG. 1A is a schematic perspective view of a microlens substrate, and FIG. 1B is a schematic perspective view showing a configuration including the A-A ′ cross-section portion of FIG. FIG. 2A is a partially enlarged plan view showing a portion related to four microlenses in the microlens substrate of the present embodiment. FIG. 2B is a plan view of FIG. FIG. 5 is an enlarged cross-sectional view showing in more detail the configuration of a portion B0 surrounded by a dotted line of the microlens substrate.

  As shown in FIG. 1A, the microlens substrate 20 of the present embodiment includes a transparent substrate 210 made of, for example, a quartz plate, and the transparent substrate 210 bonded to the transparent substrate 210 by an adhesive layer 230 as described later. And a cover glass 200 which is a “cover substrate”.

  In the present embodiment, on the lens forming region 20a of the transparent substrate 210 shown in FIG. 2 (b), a large number of microlenses 500 arranged in a matrix in the following manner are formed. In the transparent substrate 210, a non-lens forming area 20b is provided around the lens forming area 20a. Further, FIG. 1A shows a region 20aa on the lens forming region 20a of the transparent substrate 210 and a region 20bb on the non-lens forming region 20b of the transparent substrate 210 in the microlens substrate 20.

  1B and 2B, in the transparent substrate 210, a large number of concave depressions, that is, concave portions, are formed in the lens forming region 20a in an array. In each recess, a transparent adhesive layer 230 having a higher refractive index than that of the transparent plate member 210 is formed by curing an adhesive made of, for example, a photosensitive resin material, which bonds the cover glass 200 and the transparent plate member 210 to each other. Is filled.

  As shown in FIG. 2B, the curved surface of each microlens 500 is generally defined by a transparent substrate 210 and an adhesive layer 230 having different refractive indexes. More specifically, each recess defines a lens curved surface of the microlens 500. The adhesive layer 230 is made of an epoxy resin having a refractive index higher than that of the transparent substrate 210, for example, a refractive index of 1.59. That is, the refractive index of the adhesive layer 230 is larger than each concave portion. Each microlens 500 is formed as a plano-convex lens by a part of the adhesive layer 230 filled in each recess.

  In the present embodiment, the concave portion described with reference to FIGS. 2A and 2B has a spherical curved surface or an aspherical lens surface defined by the concave portion as a lens curved surface defined by an adjacent concave portion. , May be formed in contact with each other, or may be formed so as to cross each other. If the lens curved surfaces are formed so as to intersect with each other as in the latter, each microlens 500 can have a wide effective area as a lens. Ideally, if the four lens curved surfaces intersect at the corner portion 501 (see FIG. 2A) of each microlens 500, a condensing function is given to every corner of each microlens 500. This makes it possible to maximize the light utilization efficiency.

  The adhesive layer 230 is continuously formed from the lens forming region 20a to the non-lens forming region 20b of the transparent substrate 210, as well shown in FIG. In the present embodiment, with respect to a part of the adhesive layer 230 located on the non-lens forming region 20b in the transparent substrate 210, the thickness in the direction perpendicular to the partial transparent substrate 20a is formed from the non-lens forming region 20b. It is formed so as to increase toward the region 20a. The thickness of a part of the adhesive layer 230 located on the non-lens forming area 20b of the transparent substrate 210 is set to a predetermined value d0 from, for example, 5 [μm] from the lens forming area 20a to the non-lens forming area 20b. It is formed to change.

  In this way, in order to form a part of the adhesive layer 230, the shape of the surface of the transparent substrate 210 on the side facing the adhesive layer 230 in the non-lens formation region 20b, as well shown in FIG. Are formed in a staircase shape such that the thickness of the transparent substrate 210 in the direction perpendicular to the surface decreases from the non-lens forming region 20b toward the lens forming region 20a. This staircase shape has a step length W0 in the direction from the non-lens forming region 20b to the lens forming region 20a along the surface of the microlens substrate 20, for example, about 2 [mm], and the width Wu of each step is For example, it is formed as a value substantially equal to a value obtained by dividing the length W0 of the stairs by the number of steps.

  In the present embodiment, in addition to or instead of the transparent substrate 210, the cover glass 200 has a surface on the side facing the part located in the non-lens formation region 20 b of the transparent substrate 210 in the same manner as the transparent substrate 210. The cover glass 200 may have a shape that changes in thickness.

<2: Electro-optical device>
Next, the overall configuration of an electro-optical device according to an embodiment of the invention will be described with reference to FIGS. 3 and 4. FIG. 3 is a plan view of the TFT array substrate viewed from the above-described microlens substrate side used as a counter substrate together with each component formed thereon, and FIG. 'Cross section. Here, a TFT active matrix driving type liquid crystal device with a built-in driving circuit, which is an example of an electro-optical device, is taken as an example.

  3 and 4, in the electro-optical device according to the present embodiment, the TFT array substrate 10 and the microlens substrate 20 used as the counter substrate are disposed to face each other. A liquid crystal layer 50 is sealed between the TFT array substrate 10 and the microlens substrate 20, and the TFT array substrate 10 and the microlens substrate 20 are sealed in a seal region positioned around the image display region 10a. The materials 52 are bonded to each other.

  The sealing material 52 is made of, for example, an ultraviolet curable resin, a thermosetting resin, or the like for bonding the two substrates, and is applied on the TFT array substrate 10 in the manufacturing process and then cured by ultraviolet irradiation, heating, or the like. It is. Further, a gap material 56 such as glass fiber or glass bead is dispersed in the sealing material 52 so that the distance (inter-substrate gap) between the TFT array substrate 10 and the microlens substrate 20 is a predetermined value. That is, the electro-optical device according to the present embodiment is suitable for a small and enlarged display for a projector light valve.

  A light-shielding frame light-shielding film 53 that defines the frame area of the image display region 10a is provided on the microlens substrate 20 side in parallel with the inside of the seal region where the sealing material 52 is disposed. However, part or all of the frame light shielding film 53 may be provided as a built-in light shielding film on the TFT array substrate 10 side.

  Of the peripheral regions located around the image display region 10 a, the data line driving circuit 101 and the external circuit connection terminal 102 are arranged on one side of the TFT array substrate 10 in the region located outside the seal region where the sealing material 52 is disposed. It is provided along. The scanning line driving circuit 104 is provided along one of the two sides adjacent to the one side so as to be covered with the frame light shielding film 53. The scanning line driving circuit 104 may be provided along two sides adjacent to one side of the TFT array substrate 10 provided with the data line driving circuit 101 and the external circuit connection terminal 102. In this case, the two scanning line driving circuits 104 are connected to each other by a plurality of wirings provided along the remaining one side of the TFT array substrate 10.

  In addition, vertical conduction members 106 functioning as vertical conduction terminals between the two substrates are disposed at the four corners of the microlens substrate 20. On the other hand, the TFT array substrate 10 is provided with vertical conduction terminals in a region facing these corner portions. As a result, electrical conduction can be established between the TFT array substrate 10 and the microlens substrate 20.

  In FIG. 4, on a TFT array substrate 10, a pixel switching TFT (Thin Film Transistor; hereinafter referred to as “TFT” as appropriate), a scanning line, a data line, etc. are formed on the pixel electrode 9a. In addition, an alignment film 16 is formed. On the other hand, although the detailed configuration will be described later, on the microlens substrate 20, in addition to the counter electrode 21, a lattice-shaped or striped light-shielding film 23 and an alignment film 22 are formed in the uppermost layer portion. On the TFT array substrate 10 or the microlens substrate 20, the alignment film 16 or 22 is formed of an organic material such as polyimide, for example. In the present embodiment, the alignment film is formed only on one of the TFT array substrate 10 and the microlens substrate 20, or the alignment film formed on one of these is formed of an inorganic material. Also good.

  The liquid crystal layer 50 is made of, for example, a liquid crystal in which one or several types of nematic liquid crystals are mixed, and takes a predetermined alignment state between the pair of alignment films.

  In addition to the data line driving circuit 101, the scanning line driving circuit 104, and the like, the image signal on the image signal line is sampled and supplied to the data line on the TFT array substrate 10 shown in FIGS. Sampling circuit, precharge circuit for supplying a precharge signal of a predetermined voltage level to a plurality of data lines in advance of an image signal, for inspecting the quality, defects, etc. of the electro-optical device during production or at the time of shipment An inspection circuit or the like may be formed.

  Next, the circuit configuration and operation of the electro-optical device configured as described above will be described with reference to FIG. FIG. 5 shows an equivalent circuit of various elements, wirings, and the like in a plurality of pixels formed in a matrix that forms the image display area of the electro-optical device.

  In FIG. 5, each of the plurality of pixels formed in a matrix that forms the image display region 10 a of the electro-optical device according to the present embodiment includes a pixel electrode 9 a and a TFT 30 for switching control of the pixel electrode 9 a. The data line 6 a formed and supplied with an image signal is electrically connected to the source of the TFT 30. The image signals S1, S2,..., Sn written to the data lines 6a may be supplied line-sequentially in this order, or may be supplied for each group to a plurality of adjacent data lines 6a. Good.

  Further, the gate electrode 3a is electrically connected to the gate of the TFT 30, and the scanning signals G1, G2,..., Gm are pulse-sequentially applied in this order to the scanning line 11a and the gate electrode 3a at a predetermined timing. It is comprised so that it may apply. The pixel electrode 9a is electrically connected to the drain of the TFT 30, and the image signal S1, S2,..., Sn supplied from the data line 6a is obtained by closing the switch of the TFT 30 as a switching element for a certain period. Write at a predetermined timing.

  Image signals S1, S2,..., Sn written in a liquid crystal as an example of an electro-optical material via the pixel electrode 9a are held for a certain period with the counter electrode 21 formed on the microlens substrate 20. Is done. The liquid crystal modulates light and enables gradation display by changing the orientation and order of the molecular assembly depending on the applied voltage level. In the normally white mode, the transmittance for incident light is reduced according to the voltage applied in units of each pixel, and in the normally black mode, the light is incident according to the voltage applied in units of each pixel. The light transmittance is increased, and light having a contrast corresponding to the image signal is emitted from the electro-optical device as a whole.

  In order to prevent the image signal held here from leaking, a storage capacitor 70 is added in parallel with the liquid crystal capacitor formed between the pixel electrode 9a and the counter electrode. The storage capacitor 70 is provided side by side along the scanning line 11a, and includes a capacitor electrode 300 including a fixed potential side capacitor electrode and fixed at a constant potential.

  A detailed configuration and function of the microlens substrate 20 provided in the above-described electro-optical device will be described with reference to FIGS. 6 is a plan view schematically showing the arrangement relationship of the opening region 700 in which the light shielding film 23 and the microlens 500 are arranged in the microlens substrate 20, and FIG. 7 shows a plurality of pixels in FIG. It is a figure which shows the structure of the cross section shown in detail, Comprising: It is sectional drawing for demonstrating the function of each micro lens 500. FIG.

  In FIG. 7, in the microlens substrate 20, a light shielding film 23 having a grid-like plane pattern as shown in FIG. 6 is formed on the cover glass 200. In the microlens substrate 20, a non-opening region is defined by the light shielding film 23, and a region delimited by the light shielding film 23 is an opening region 700. The light shielding film 23 is formed in a stripe shape, and the non-opening region is defined by the light shielding film 23 and various components such as the capacitor electrode 300 and the data line 6a provided on the TFT array substrate 10 side. Also good.

  Each microlens 500 is arranged so as to correspond to each pixel. More specifically, as shown in FIG. 7, in the microlens substrate 20, the microlens substrate 20 is microscopically formed in an area including at least a part of the opening area 700 and the non-opening area located around the opening area 700. A lens 500 is arranged and formed.

  In FIG. 7, a counter electrode 21 made of a transparent conductive film is formed on the cover glass 200 so as to cover the light shielding film 23, and an alignment film 22 is further formed on the counter electrode 21. In addition, a color filter may be formed in each opening region 700 on the cover glass 200.

  On the other hand, in FIG. 7, pixel electrodes 9 a are formed in regions corresponding to the respective opening regions 700 on the TFT array substrate 10. In addition, on the TFT array substrate 10, pixel switching TFTs 30, various wirings such as scanning lines 11 a and data lines 6 a for driving the pixel electrodes 9 a, and electronic elements such as storage capacitors 70 are formed in non-opening regions. Has been. With this configuration, the pixel aperture ratio in the electro-optical device can be maintained relatively large. Further, an alignment film 16 is provided on the pixel electrode 9a.

  In FIG. 7, light such as projection light incident on the microlens substrate 20 is collected by each microlens 500. In FIG. 7, the appearance of light collected by the microlens 500 is schematically shown by a one-dot chain line. Then, the light collected by each microlens 500 is transmitted through the liquid crystal layer 50 and irradiated onto the pixel electrode 9a, passes through the pixel electrode 9a, and is emitted from the TFT array substrate 10 as display light. Therefore, light that is directed to the non-opening region among the light that is incident on the microlens substrate 20 can also be incident on the opening region 700 by the light condensing function of the microlens 500, so that the effective aperture ratio in each pixel can be increased. it can. That is, it is possible to display a brighter image by increasing the light utilization efficiency.

  In the present embodiment described above, instead of providing the data line driving circuit 101 and the scanning line driving circuit 104 on the TFT array substrate 10 in the electro-optical device, for example, for driving mounted on a TAB (Tape Automated Bonding) substrate. The LSI may be electrically and mechanically connected to the external circuit connection terminal 102 via an anisotropic conductive film. Further, for example, a TN (Twisted Nematic) mode, a VA (Vertically Aligned) mode, and a PDLC (Polymer Dispersed Liquid) are respectively provided on the side on which the projection light of the microlens substrate 20 is incident and the side on which the emission light of the TFT array substrate 10 is emitted. A polarizing film, a retardation film, a polarizing plate, and the like are arranged in a predetermined direction according to an operation mode such as a (Crystal) mode and a normally white mode / normally black mode.

  In the electro-optical device described above, the microlens substrate 20 as shown in FIGS. 1 and 2 is used as the counter substrate. However, such a microlens substrate 20 can also be used as the TFT array substrate 10. It is. Alternatively, it is possible to attach the microlens substrate 20 to the TFT array substrate 10 side by simply using a glass substrate or the like formed with a counter electrode or an alignment film as the counter substrate (not the microlens substrate 20). . That is, the microlens of the present invention can be built or attached to the TFT array substrate 10 side.

<3: Manufacturing method of microlens substrate>
Next, a method for manufacturing the microlens substrate 20 according to the present embodiment will be described with reference to FIGS.

  FIG. 8 is a schematic perspective view for explaining that a plurality of microlens substrates 20 according to the present embodiment are formed at once on a large substrate. 9, 11, and 12 are process diagrams sequentially illustrating the configuration of the microlens substrate 20 in each process of the manufacturing process with respect to the cross-sectional view of FIG. Further, FIG. 10 is a schematic perspective view showing the configuration of the surface shape of the non-lens formation region 20b in the transparent substrate 210. FIG.

  First, before entering the description of the detailed manufacturing process with reference to FIGS. 9 to 12, as a premise thereof, in this embodiment, as shown in FIG. 8, the microlens substrate 20 includes a plurality of transparent substrates 210. After being manufactured on the large substrate M according to the procedure described later, it is obtained by cutting the large substrate M along the planned cutting line L1 and separately.

  Now, the manufacturing method of the microlens substrate 20 according to the present embodiment will be described with reference to FIGS. In the following, as shown in FIG. 2B, a case where the surface shape of the non-lens formation region 20b in the transparent substrate 210 is formed as a three-step staircase shape will be described.

  First, in the process of FIG. 9A, the uppermost step of the step shape formed on the surface of the non-lens formation region 20b in the transparent substrate 210 and the second step following the uppermost step shown in FIG. 2B are formed. Therefore, the first etching is performed on the transparent substrate 210 through the resist 900a by the photolithography method and the etching method. Thereafter, in the step of FIG. 9B, the surface of the non-lens formation region 20b in the transparent substrate 210 is formed by performing the second etching through the resist 900b in the same procedure as in the step of FIG. 9A. The third step of the staircase shape is formed.

  After the step of FIG. 9B, with the resist 900b removed, as shown in FIG. 10, the surface of the transparent substrate 210 that is located in the non-lens formation region 20b is formed on the surface of the transparent substrate 210. On the other hand, a staircase shape is formed such that the thickness in the vertical direction decreases from the non-lens formation region 20b toward the lens formation region 20a.

  As described above, in this embodiment, a part of the surface of the transparent substrate 210 located in the non-lens formation region 20b is etched by the procedure described with reference to FIGS. 9A and 9B. Can be easily formed as a stepped shape. In addition, by increasing the number of steps in the staircase shape, a part of the surface shape located in the non-lens formation region 20b of the transparent substrate 210 can be brought close to an inclined shape.

  After the step of FIG. 9B, in the step of FIG. 11A, an amorphous silicon film is formed on the transparent substrate 210 as a mask 902 by, for example, CVD (Chemical Vapor Deposition). The mask 902 may be a hydrofluoric acid resistant Cr film, a polysilicon film, or the like.

  Subsequently, in the mask 902, a plurality of openings 902a are formed at a position corresponding to the position where the concave portion shown in FIG. 1B or FIG. Form. Therefore, in the mask 902, the plurality of openings 902a are formed in a region corresponding to the lens forming region 20a. Each opening 902a is formed in a circular shape on the transparent substrate 210 in a plan view and has a size smaller than the concave portion formed in the transparent substrate 210 corresponding to the opening 902a.

  Subsequently, in the step of FIG. 11B, a plurality of recesses are formed by performing isotropic etching on the transparent substrate 210 through a mask 902 in which a plurality of openings 902a are formed. More specifically, the isotropic etching is preferably performed by wet etching using an etchant such as hydrofluoric acid.

  Thereafter, in the step of FIG. 11C, the mask 902 is removed by an etching process.

  In FIG. 12A, a thermosetting transparent adhesive 230 a is applied to the surface of the transparent substrate 210. The adhesive 230a is filled in each recess. Subsequently, in FIG. 12B, the cover glass 200 is pressed against the transparent substrate 210 to cure the adhesive 230 a to form the adhesive layer 230.

  Thereafter, in FIG. 12C, the light shielding film 23, the counter electrode 21, the alignment film 22, and the like are formed on the cover glass 200 as functional films. More specifically, after forming the light shielding film 23, the counter electrode 21 is formed on the upper layer side of the light shielding film 23, and the alignment film 22 is formed on the upper layer side of the counter electrode 21. The light shielding film 23 and the counter electrode 21 are formed by forming a film by sputtering, coating, or the like and performing patterning. The alignment film 22 is formed, for example, by applying polyimide obtained by chemically thermal polymerizing polyimide acid to the upper layer side of the counter electrode 21 on the cover glass 200 and firing the same.

  Thus, for example, when the alignment film 22 is formed, the microlens substrate 20 is heated, and in the adhesive layer 230 formed of the transparent resin, a residual monomer that is a component of the resin, for example, polyimide acid is vaporized, thereby causing an outgas. May occur. Here, in the microlens substrate 20, the outgas generation amount Xout is the amount of resin forming the adhesive layer 230, more specifically, the weight (A) of the resin, and the unit in the resin, as shown in the equation (1). It is defined by the residual monomer (B) per weight and the outgas generation degree (η) in the resin.

Xout = A × B × η (1)
The outgas generation degree (η) in the formula (1) is a part of the adhesive layer 230 that is located on the non-lens formation region 20b of the transparent substrate 210 and is exposed at the end face of the microlens substrate 20, The part tends to be the largest because it is heated directly. Further, in the adhesive layer 230, the outgas generation degree (η) decreases as it goes from the portion exposed at the end face of the microlens substrate 20 toward the lens formation region 20a.

  Here, FIG. 13 is a process chart illustrating the steps of a part of the manufacturing process of the microlens substrate 20 according to the comparative example of the present embodiment in order, similarly to FIGS. 9, 11, and 12.

  According to this comparative example, in FIG. 13A, the microlens substrate 20 is manufactured by adhering the cover glass 200 to the transparent substrate 210 via the adhesive layer 230 by the same procedure as in this embodiment. The In the comparative example, in the transparent substrate 210 of the microlens substrate 20, a part of the surface located in the non-lens formation region 20b is flattened, and the thickness of the transparent substrate 210 in the direction perpendicular to the surface is set to the non-lens formation region. A predetermined value is set from 20b toward the lens forming region 20a.

  In this case, in FIG. 13B, when the alignment film 22 is formed as a functional film, for example, on the cover glass 200 on the upper side of the light shielding film 23 or the counter electrode 21, the microlens substrate 20 is heated. The outgas in the adhesive layer 230 is generated as follows according to the equation (1).

  That is, as shown in Expression (1), the outgas generation amount Xout in the adhesive layer 230 also depends on the weight (A) of the resin forming the adhesive layer 230. In the adhesive layer 230, the weight (A) of the resin is constant at some portions located on the non-lens formation region 20b of the transparent substrate 210. Therefore, the outgas generation amount Xout mainly depends on the outgas generation degree (η), and becomes the largest in the portion exposed to the end surface of the microlens substrate 20 in the adhesive layer 230, and from this portion, the lens formation region 20a. As you move toward For this reason, the resin that forms a part of the adhesive layer 230 located on the non-lens formation region 20b in the transparent substrate 210 contracts, and the film thickness of the part extends from the lens formation region 20a to the non-lens formation region 20b. The thickness of the portion exposed to the end surface of the microlens substrate 20 that generates the largest amount of outgas Xout is the smallest. Therefore, in this way, in the part of the adhesive layer 230 located on the non-lens formation region 20b in the transparent substrate 210, the film thickness of the adhesive layer 230 is uneven, and the adhesive layer 230 is formed in the transparent substrate 210 or the cover glass 200. A situation occurs in which the surface shape on the opposite side to the side opposite to the surface becomes an inclined shape. In addition, in FIG.13 (b), it has shown as an example about the structure when the surface shape turns into an inclined shape in the cover glass 200 side.

  Therefore, in the electro-optical device, the surface shape of the microlens substrate 20 on the side facing the liquid crystal layer 50 is inclined, so that the thickness of the liquid crystal layer 50, that is, the microlens substrate 20 and the TFT array substrate 10. It becomes difficult to set the interval (inter-substrate gap) to a predetermined value.

  On the other hand, in the present embodiment, in correspondence with the change in the outgas generation degree (η) as described above in a part of the adhesive layer 230 located on the non-lens formation region 20b of the transparent substrate 210, The part of the thickness is changed. That is, the adhesive layer 230 is formed so that the thickness of the portion exposed to the end surface of the microlens substrate 20 that tends to have the largest outgas generation amount Xout based on the outgas generation degree (η) is the smallest. At the same time, the thickness of the adhesive layer 230 increases in accordance with the change in the outgas generation amount Xout based on the outgas generation degree (η) from the portion toward the lens forming region 20a. Thereby, in the adhesive layer 230, a part of the transparent substrate 210 located on the non-lens forming region 20b has a weight (A) of the resin forming the part from the non-lens forming region 20b to the lens forming region 20a. It forms so that it may increase along the direction to go.

  Therefore, when the microlens substrate 20 is heated, the outgas generation amount Xout is reduced in a part of the adhesive layer 230 located on the non-lens formation region 20b of the transparent substrate 210, and the lens is formed from the end surface of the microlens substrate 20. The outgas generation amount Xout can be made constant in the direction along the surface of the transparent substrate 210 toward the region 20a. Therefore, in a part of the adhesive layer 230 located on the non-lens forming region 20b of the transparent substrate 210, the amount of change in the thickness of the adhesive layer 230 due to resin shrinkage from the end surface of the microlens substrate 20 toward the lens forming region 20a. Can be made constant. As a result, in the microlens substrate 20, a part of the cover glass 200 facing a part of the transparent substrate 210 in the non-lens formation region 20b, and in addition to or instead of a part of the transparent substrate 210, the adhesive layer Good flatness can be maintained on the surface opposite to the side facing 230.

  Therefore, when the pair of substrates of the microlens substrate 20 and the TFT array substrate 10 are bonded after the functional film such as the alignment film 22 is formed, the distance between the pair of substrates 10 and 20, that is, the inter-substrate gap. Can be easily set to a predetermined value. Therefore, in the electro-optical device, it is possible to prevent display unevenness due to unevenness in the gap between the substrates, and to perform high-quality image display.

  Furthermore, in the present embodiment, when the microlens substrate 20 is heated, the distance between the part of the transparent substrate 210 in the non-lens formation region 20b and the cover glass 200 is maintained at a predetermined value, so that the non-lens formation region 20b is transparent. In part of the substrate 210 or part of the cover glass 200 facing the part, a gap material for maintaining the flatness of the surface opposite to the side facing the adhesive layer 230 is not used. Therefore, when the microlens substrate 20 is manufactured, the microlens substrate 20 can be easily manufactured without providing an extra manufacturing process for forming the gap material.

  In addition, since the outgas generation amount Xout can be reduced, it is possible to form the adhesive layer 230 by using a resin material that is relatively easily generated by heating. Accordingly, the adhesive layer 230 can be formed by selecting one resin material from various resin materials, and the selection range of the resin material can be widened.

  In addition, as described with reference to FIG. 2B, the thickness of a part of the adhesive layer 230 located on the non-lens formation region 20b of the transparent substrate 210 is greater than the predetermined value d0 from the lens formation region 20a. It is formed so as to change toward the non-lens formation region 20b. Therefore, as described with reference to FIG. 8, even when the microlens substrate 20 is formed on the large substrate M, the adhesive layer 230 is formed on each transparent substrate 210 over the entire large substrate M. It can be formed so that the recessed portion is more reliably filled. Further, in the microlens substrate 20, the adhesive strength of the cover glass 200 or the transparent substrate 210 in the adhesive layer 230 can be maintained at a predetermined value, and the cover glass 200 and the transparent substrate 210 can be prevented from peeling off.

  Furthermore, according to this embodiment, even when the microlens substrate 20 is heated when the alignment film 22 is formed, it is possible to maintain good flatness on the surface. It is possible to perform as many times as necessary without any limit.

  Here, the regeneration treatment of the alignment film 22 means that when the alignment film 22 is defective due to an error during the formation of the alignment film 22 or when the alignment film 22 is applied, the alignment film 22 is peeled off and the formation is performed again. This is the process to be performed. For example, in the comparative example, as described above, when the microlens substrate 20 is heated, the flatness on the surface deteriorates, so that the number of times that the alignment film 22 can be regenerated is limited. Therefore, in the regeneration process of the alignment film 22, if a defect occurs in the alignment film 22, it takes time to start the formation of the microlens substrate 20 itself from the beginning, and the time required for manufacturing the electro-optical device becomes complicated, resulting in a manufacturing cost. May also increase.

  On the other hand, in the present embodiment, since the regeneration process of the alignment film 22 can be performed as many times as necessary without limitation, the electro-optical device can be efficiently manufactured and the manufacturing cost can be reduced. Become.

<4: Modification>
A modification of the present embodiment described above will be described with reference to FIGS. FIG. 14 is a cross-sectional view showing one configuration of the microlens substrate according to the present modification as in FIG. 2B, and FIG. 15 shows another configuration of the microlens substrate according to the present modification. FIG. 3 is a cross-sectional view similar to FIG.

  First, as shown in FIG. 14, in the transparent substrate 210, convex portions may be formed in an array in the lens forming region 20a instead of the concave portions. In this case, the microlens 500 is formed by each of the plurality of convex portions by forming the adhesive layer 230 from a resin material having a lower refractive index than the transparent substrate 210.

  Here, at the time of manufacturing the microlens substrate 20, for example, a resist having a shape corresponding to the convex portion of the transparent substrate 210 is formed on the lens formation region 20a in the transparent substrate 210, and the resist and the transparent substrate 210 are For example, a convex portion is formed on the transparent substrate 210 by transferring the shape of the resist to the transparent substrate 210 by performing a dry etching method. Thereafter, similarly to the procedure described with reference to FIG. 9, the surface of the non-lens formation region 20 b in the transparent substrate 210 is formed in a stepped shape, for example.

  Further, as shown in FIG. 15, in the microlens substrate 20, a part of the surface of the transparent substrate 210 facing the adhesive layer 230 on the non-lens forming region 20 b of the transparent substrate 210 has a shape of the transparent substrate 210. The thickness in the direction perpendicular to the surface may be formed as an inclined shape such that the thickness decreases from the non-lens formation region 20b toward the lens formation region 20a.

  With this configuration, the thickness of the part of the adhesive layer 230 located on the non-lens formation region 20b of the transparent substrate 210 is changed in accordance with the change in the degree of outgas generation (η). It becomes possible. In this case, in the part of the adhesive layer 230 located on the non-lens formation region 20b of the transparent substrate 210, the thickness of each part of the part is set to a predetermined value as described with reference to FIG. As a value corresponding to the thickness after heating when the microlens substrate 20 is heated, the outgas generation amount Xout is more reliably reduced, and the lens is formed from the end surface of the microlens substrate 20. The outgas generation amount Xout can be made constant in the direction along the surface of the microlens substrate 20 toward the region 20a.

  Here, at the time of manufacturing the microlens substrate 20, for example, the following resist is formed on the transparent substrate 210 by a photolithography method, and is formed on a part of the surface located in the non-lens formation region 20b of the transparent substrate 210. On the other hand, the surface shape is formed as an inclined shape by etching, for example, by a dry etching method. That is, when etching a part of the surface of the transparent substrate 210 located in the non-lens formation region 20b, a resist whose etching rate increases in the direction from the non-lens formation region 20b to the lens formation region 20a in the part. Then, it is formed on the transparent substrate 210 by a photolithography method using a gradation mask.

<5: Electronic equipment>
Next, an overall configuration, particularly an optical configuration, of an embodiment of a projection color display device as an example of an electronic apparatus using the above-described electro-optical device as a light valve will be described. FIG. 16 is a schematic cross-sectional view of the projection type color display device.

  In FIG. 16, a liquid crystal projector 1100, which is an example of a projection type color display device, prepares three liquid crystal modules including a liquid crystal device having a drive circuit mounted on a TFT array substrate, and RGB light valves 100R, 100G, and The projector is configured as 100B. In the liquid crystal projector 1100, when projection light is emitted from a lamp unit 1102 of a white light source such as a metal halide lamp, light components R, G, and R corresponding to the three primary colors of RGB are obtained by three mirrors 1106 and two dichroic mirrors 1108. The light is divided into B and led to the light valves 100R, 100G and 100B corresponding to the respective colors. In particular, the B light is guided through a relay lens system 1121 including an incident lens 1122, a relay lens 1123, and an exit lens 1124 in order to prevent light loss due to a long optical path. Light components corresponding to the three primary colors modulated by the light valves 100R, 100G, and 100B are synthesized again by the dichroic prism 1112 and then projected as a color image on the screen via the projection lens 1114.

  The present invention is not limited to the above-described embodiments, and can be appropriately changed within a scope not departing from the gist or concept of the invention that can be read from the claims and the entire specification, and a microlens substrate accompanying such changes In addition, the manufacturing method thereof, the electro-optical device including the microlens substrate, and the electronic apparatus including the electro-optical device are also included in the technical scope of the present invention.

FIG. 1A is a schematic perspective view of a microlens substrate, and FIG. 1B is a schematic perspective view showing a configuration including a cross-sectional portion taken along the line A-A ′ of FIG. FIG. 2A is a partially enlarged plan view showing a portion related to four microlenses in the microlens substrate, and FIG. 2B is a dotted line of the microlens substrate in FIG. It is an expanded sectional view which shows the structure of the part B0 enclosed by in more detail. It is a top view which shows the whole structure of an electro-optical apparatus. It is H-H 'sectional drawing of FIG. 2 is an equivalent circuit of various elements, wirings, and the like in a plurality of pixel portions formed in a matrix that forms an image display region of an electro-optical device. It is a top view which shows typically the arrangement | positioning relationship of the opening area | region where a light shielding film and a microlens are arrange | positioned in a microlens board | substrate. It is sectional drawing for demonstrating the function of each micro lens about a some pixel. It is a schematic perspective view for explaining that a plurality of microlens substrates are formed at once on a large substrate. FIG. 3 is a process diagram (part 1) illustrating the configuration of the microlens substrate in each step of the manufacturing process in order with respect to the cross-sectional view of FIG. It is a schematic perspective view which shows the structure of the surface shape of the non-lens formation area in a transparent substrate. FIG. 3 is a process diagram (part 2) illustrating the configuration of the microlens substrate in each step of the manufacturing process in order with respect to the cross-sectional view of FIG. FIG. 4 is a process diagram (part 3) illustrating the configuration of the microlens substrate in each step of the manufacturing process in order with respect to the cross-sectional view of FIG. It is process drawing which shows order for a part of process of the manufacturing process of the micro lens substrate concerning a comparative example. It is sectional drawing which shows one structure of the microlens board | substrate which concerns on this modification similarly to FIG.2 (b). It is sectional drawing which shows the other structure of the micro lens board | substrate which concerns on this modification similarly to FIG.2 (b). 1 is a schematic cross-sectional view showing a color liquid crystal projector as an example of a projection type color display device which is an embodiment of an electronic apparatus of the present invention.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 20 ... Microlens board | substrate, 20a ... Lens formation area, 20b ... Non-lens formation area, 200 ... Cover glass, 210 ... Transparent substrate, 230 ... Adhesive layer, 500 ... Microlens

Claims (11)

A transparent substrate on which a lens curved surface of each of the plurality of microlenses is formed in the lens formation region;
On the transparent substrate, the non-lens is formed continuously from the lens forming region to a non-lens forming region located around the lens forming region and covering the lens curved surface with a resin material. An adhesive layer formed such that a thickness in a direction perpendicular to the transparent substrate in the formation region increases from the non-lens formation region toward the lens formation region;
A microlens substrate comprising: a cover plate that is made of a transparent plate member and is bonded to the transparent substrate via the adhesive layer.   The transparent substrate is formed so that a thickness in a direction perpendicular to a substrate surface of the transparent substrate in the non-lens formation region decreases from the non-lens formation region toward the lens formation region. The microlens substrate according to claim 1, wherein   The transparent substrate has a surface shape on the side facing the adhesive layer in the non-lens forming region, and a thickness in a direction perpendicular to the substrate surface of the transparent substrate in the non-lens forming region from the non-lens forming region. The microlens substrate according to claim 2, wherein the microlens substrate is formed in an inclined shape so as to become smaller toward the lens formation region.   The transparent substrate has a surface shape on the side facing the adhesive layer in the non-lens forming region, and a thickness in a direction perpendicular to the substrate surface of the transparent substrate in the non-lens forming region from the non-lens forming region. The microlens substrate according to claim 2, wherein the microlens substrate is formed in a stepped shape that becomes smaller toward the lens formation region.   The adhesive layer is formed such that a thickness of a part of the adhesive layer located in the non-lens formation region on the transparent substrate changes from the lens formation region to the non-lens formation region from a predetermined value. The microlens substrate according to any one of claims 1 to 4, wherein the microlens substrate is formed. A pair of substrates including the microlens substrate according to any one of claims 1 to 5;
An electro-optic material sandwiched between the pair of substrates;
An electro-optical device comprising: a functional film formed on a surface of the microlens substrate facing the electro-optical material.   An electronic apparatus comprising the electro-optical device according to claim 6. Forming a lens curved surface of each of the plurality of microlenses in a lens forming region on one surface of the transparent substrate;
On the transparent substrate, an adhesive layer is continuously formed with a resin material from the lens formation region to a non-lens formation region located around the lens formation region so as to cover the lens curved surface, and A step of forming an adhesive layer so that a thickness in a direction perpendicular to the transparent substrate in the non-lens formation region increases from the non-lens formation region toward the lens formation region;
Adhering a cover substrate composed of a transparent plate member to the transparent substrate via the adhesive layer;
Forming a functional film on a surface of the transparent substrate or the cover substrate opposite to the side facing the adhesive layer. A method of manufacturing a microlens substrate, comprising:   The surface shape of the transparent substrate on the side facing the adhesive layer in the non-lens formation region is the thickness in the vertical direction of the transparent substrate in the non-lens formation region from the non-lens formation region to the lens formation region. The method of manufacturing a microlens substrate according to claim 8, comprising a step of forming an inclined shape that becomes smaller toward the bottom.   The surface shape of the transparent substrate on the side facing the adhesive layer in the non-lens formation region is the thickness in the vertical direction of the transparent substrate in the non-lens formation region from the non-lens formation region to the lens formation region. 9. The method of manufacturing a microlens substrate according to claim 8, further comprising a step of forming a stepped shape that decreases toward the bottom. 9. A method of manufacturing an electro-optical device having a pair of substrates including a micro-lens substrate and an electro-optical material sandwiched between the pair of substrates, comprising the method of manufacturing a micro-lens substrate according to claim 8. A method for manufacturing an electro-optical device.

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