JP2006245223A - Device for fitting member to printed board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent legs of a fitting device from floating from holes of a board due to any vibration or impact when fitting a member such as a heat sink or the like. <P>SOLUTION: The device 3 is used to fit a heat sink HS with two grooves on its side to a printed board KB, and it is like a plate as a whole and includes a supporting part 11 of which both end edges can be inserted into two grooves, and a connection 12 which is extended from the supporting part 11 and connects to the printed board. The connection 12 includes at least three legs 15, 16 and 17 which can be inserted into holes 31, 32 and 33 formed in the printed board, and the legs 15 and 16 on both outsides are provided with engaging parts 15a and 16a respectively which are projected in one direction and is not slipped off after they are inserted, and furthermore, the leg 17 at the central part includes an engaging part 17a which is projected in a different direction from that of the two legs and prevents slipping off after they are inserted. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an attachment device for attaching a member such as a heat sink for cooling a power semiconductor to a printed circuit board.

  2. Description of the Related Art Conventionally, in various electronic devices, heat sinks made of aluminum alloy or the like have been used for cooling power semiconductors such as CPUs, power transistors and thyristors, or other electronic components. Such heat sinks are often attached to printed circuit boards during mounting.

  As attachment devices for fixing the heat sink to the printed circuit board, there are devices disclosed in Patent Document 1 and Patent Document 2.

  In the apparatus of Patent Document 1, a heat sink is formed by bending a metal plate such as aluminum into a U-shape in plan view, and the nails are integrally projected from the lower ends of the three wall surfaces, and the three projected nails are printed. Insert into holes provided in the substrate.

In the apparatus of Patent Document 2, a groove parallel to the end face of the heat sink is provided, and a plate-like leg member having claw portions on both sides is inserted into the groove so that the claw portion engages between the two grooves. The mounting portion provided at the lower end of the leg member is soldered to the printed circuit board.
JP-A-7-122867 JP 2000-236053 A

  However, the mounting device disclosed in Patent Document 1 has a simple structure and is suitable for a simple device having a small capacity, but is not suitable for a medium-capacity or larger device having a large capacity. Moreover, in order to fix the nail | claw inserted in the printed circuit board, a nail | claw must be bent and the number of processes increases by that much.

  Moreover, in the attachment apparatus of patent document 2, since the attachment part of the lower end part of a leg member is soldered to a printed circuit board, this can be performed in the same process as soldering of other components. However, when the attachment portion is inserted into the hole of the printed board, the leg member may be lifted or dropped from the printed board because it is merely inserted and is not prevented from coming off.

  Therefore, it must be slowly and carefully conveyed to the solder bath so as not to give vibration or impact to the printed circuit board before soldering. Or it is necessary to hold | maintain the state with a suitable jig until soldering is completed.

  For this reason, there are problems that the cycle time of the soldering process becomes long, and that the cost of the apparatus increases in order to increase the rigidity and accuracy of the conveying apparatus.

  The present invention has been made in view of the above-described problems. When a member such as a heat sink is attached to a substrate, even if soldering has not yet been performed, depending on a slight vibration or impact, the attachment device An object of the present invention is to prevent the leg portion from being lifted from the hole of the substrate and to facilitate handling during assembly.

  The apparatus according to the present invention is an attachment apparatus for attaching a member provided with two grooves facing each other in parallel on a side surface thereof to a printed circuit board, and is entirely plate-shaped, and both end edges are the two grooves. And a connecting portion extending from the supporting portion and connected to the printed circuit board. The connecting portion can be inserted into three holes provided in the printed circuit board. At least three leg portions are provided, and the two outer leg portions are provided with engaging portions that protrude in one direction and are prevented from coming off when inserted into the holes. The part is provided with an engaging part that protrudes in a direction different from the protruding direction of the engaging part of the two outer leg parts and that is prevented from coming off when inserted into the hole.

  Preferably, the support portion is provided with a convex portion protruding in the thickness direction for reinforcement at the center portion thereof.

  In addition, the two outer leg portions are provided with locking portions that serve as stoppers when the leg portions are inserted into the holes to prevent further insertion, and the leg portions in the center portion. The distance in the length direction between the engaging portion provided on the locking portion and the locking portion is set to be approximately equal to the thickness dimension of the printed circuit board.

  According to the present invention, when a member such as a heat sink is attached to the board, the legs of the mounting device may be lifted from the hole of the board due to a slight vibration or impact even if soldering is not yet performed. It becomes easy to handle during assembly.

  FIG. 1 is a perspective view showing a state in which the heat sink HS is attached to the printed circuit board KB using the mounting bracket 3 according to the present invention, and FIG. 3 is a perspective view of the mounting bracket 3, FIG. 4 is a sectional view of the mounting bracket 3 inserted into the printed circuit board KB, and FIG.

  1 and 2, the heat sink HS is an extruded product of an aluminum alloy, has a large number of fins FN, and has a rectangular parallelepiped shape as a whole. On the side surfaces on both sides of the heat sink HS, two mounting grooves MZ that are parallel and opposed to each other are provided.

  The mounting bracket 3 is formed by pressing a steel plate. The surface of the mounting bracket 3 is electroplated with, for example, lead-tin alloy or zinc in order to improve solder wettability. “Turn sheet”, “Silver top” and the like are known as materials subjected to such surface treatment.

  The mounting bracket 3 has a plate shape as a whole, and supports 11 that can be inserted into the two grooves MZ and MZ of the heat sink HS at both ends, and a connection that extends from the support 11 and connects to the printed circuit board KB. Part 12.

  Referring also to FIGS. 3 to 5, bulging portions 13 a, 13 a, 13 b, and 13 b that bulge in the thickness direction are formed on the support portion 11 at both end edges by pressing. As well shown in FIG. 3, the bulging portion 13a bulges on the back surface side of the mounting bracket 3 and the bulging portion 13b bulges on the front surface side of the mounting bracket 3, and thereby in the insertion direction into the groove MZ. On the other hand, a return is formed to prevent disconnection.

  Since the dimension in the thickness direction of these bulging parts 13a and 13b is larger than the width dimension in the width direction of each groove MZ, the bulging part is inserted when the support part 11 is inserted into the two grooves MZ. 13a and 13b strongly press against the wall surface of the groove MZ, and the frictional force prevents the groove MZ from coming out easily.

  The support portion 11 is further formed by pressing so as to extend in the longitudinal direction (longitudinal direction) at the center portion thereof, and a convex portion 14 protruding to the surface side in the thickness direction for reinforcement.

  The connecting portion 12 is provided with three legs 15, 16, and 17 that can be inserted into three holes 31, 32, and 33 provided in the printed circuit board KB. The two outer leg portions 15 and 16 are provided with engaging portions 15a and 16a that protrude in the thickness direction and that prevent the leg portions 15 and 16 from coming out when inserted into the holes 31 and 32 of the printed circuit board KB.

  The center leg portion 17 is provided with an engagement portion 17a that protrudes in the width direction and serves as a retaining when inserted into the hole 33.

  In addition, the two outer leg portions 15 and 16 are locking portions for preventing the leg portions 15 and 16 from being inserted further when they are inserted into the holes 31 and 32. 15b and 16b are provided.

  The distance in the length direction between the engaging portion 17a of the central leg portion 17 and the locking portions 15b and 16b is set substantially equal to the thickness dimension of the printed circuit board KB. The engaging portions 15a and 16a of the two outer leg portions 15 and 16 and the engaging portion 17a of the central leg portion 17 are at the same position (position in the longitudinal direction).

  Further, a positioning step portion 18a is provided at the boundary portion between the support portion 11 and the connecting portion 12 so as to contact the lower end surface of the heat sink HS so that the mounting bracket 3 is not inserted into the groove MZ any more. Yes.

  The semiconductor HD is attached to the heat sink HS with screws, and the leads (legs) of the semiconductor HD are inserted into the holes of the printed circuit board KB and soldered.

  If the specific example of the size of each part is given, the thickness of the mounting bracket 3 is about 0.5 to 0.8 mm, and the thickness of the printed circuit board KB is about 1.2 to 1.6 mm. The size of the heat sink HS is, for example, 100 mm × 150 mm × 20 mm. Since these dimensions are examples, other dimensions may be used.

  Next, a method for using the mounting bracket 3 will be described.

  First, the two mounting brackets 3 are inserted into the grooves MZ on both side surfaces of the heat sink HS, respectively. Each mounting bracket 3 is inserted until the positioning step 18a contacts the lower end surface of the heat sink HS. At this time, since the mounting bracket 3 is reinforced by the protrusions 14 extending in the vertical direction, the mounting bracket 3 is not bent or deformed. Further, since the bulging portions 13a and 13b strongly press against the wall portion of the groove MZ, the inserted mounting bracket 3 does not unexpectedly come out of the groove MZ. However, it is possible to remove the heat sink HS from the mounting bracket 3 as necessary, for example, when replacing the heat sink HS.

  And each leg part 15,16,17 is inserted in each hole 31,32,33 of printed circuit board KB. At this time, the leg portions 15 and 16 are inserted into the holes 31 and 32 so as to open slightly outward so that the engaging portions 15a and 16a do not interfere with the printed circuit board KB. Further, the leg portion 17 is inserted into the hole 33 so as to be slightly pushed laterally so that the engaging portion 17a does not interfere with the printed circuit board KB. Since the leg portions 15, 16, and 17 are metal and have an appropriate elasticity, they can be elastically deformed and inserted into the holes 31, 32, and 33.

  When the leg portions 15, 16, and 17 are inserted into the holes 31, 32, and 33, the upper surface of the printed circuit board KB comes into contact with the engaging portions 15b and 16b, and the lower surface of the printed circuit board KB is engaged with the engaging portions 15a, 16a, and 17a. (Or the upper surface thereof), thereby preventing the mounting bracket 3 from being lifted or unexpectedly pulled out from the holes 31, 32, 33 of the printed circuit board KB, and positioning (temporary positioning) between them is performed. .

  In this state, the assembly is transported to a free-flow soldering device by a transport device, for example, and soldered to the lower surface of the printed circuit board KB. At this time, even if vibration or a slight impact occurs due to the conveyance, the printed circuit board KB is sandwiched between the engaging portions 15a, 16a, and 17a and the locking portions 15b and 16b, and temporary positioning between them is performed. Therefore, the mounting bracket 3 does not lift, tilt, or come out of the holes 31, 32, 33 of the printed circuit board KB.

  By soldering, a printed pattern (not shown) on the lower surface of the printed circuit board KB and the legs 15, 16, and 17 are joined with the solder HN, and the entire heat sink HS is fixed to the printed circuit board KB.

  As described above, when the mounting bracket 3 of the present embodiment is used, when an assembly that has not been soldered is transported, it is not lifted by a slight vibration or impact, so that it can be transported quickly. . Therefore, it is possible to shorten the cycle time of the soldering process. In addition, since it is not necessary to increase the rigidity and accuracy of the transport device more than necessary, it is possible to reduce the device cost.

  Further, since the mounting bracket 3 is prevented from being lifted or tilted from the holes 31, 32, 33 of the printed circuit board KB, the number of man-hours for repair when it is lifted as before is reduced, and the product yield is also reduced. Will improve.

  Further, in the mounting bracket 3, compared with the mounting bracket in which the central leg portion 17 is not provided and only the two leg portions 15 and 16 are provided, the printed circuit board is caused by the action of the engaging portion 17a of the central leg portion 17. Temporary positioning with KB is further stabilized. Moreover, compared with the case where the convex part 14 is not provided, the convex part 14 strengthens the strength and is strong against bending and deformation.

  In the above-described embodiment, the holes 31, 32, and 33 provided in the printed circuit board KB may have an appropriate size with respect to the dimensions of the legs 15, 16, and 17. The portions of the printed circuit board KB where the legs 15, 16, 17 are soldered are for fixing the legs with solder, and are not intended for electrical wiring connection. However, for example, an appropriate wiring connection such as connecting a portion soldered to the leg portion to the ground may be used. The mounting bracket 3 can be applied to mount various members other than the heat sink HS.

  In addition, the structure, shape, dimensions, number, material, manufacturing method, surface treatment method, and the like of each part or the whole of the mounting bracket 3 can be appropriately changed in accordance with the spirit of the present invention.

  The present invention is used to attach a member such as a heat sink for cooling a power semiconductor such as a CPU, a power transistor, and a thyristor to a printed circuit board.

It is a perspective view which shows the state which attached the heat sink to the printed circuit board using the attachment apparatus which concerns on this invention. It is a perspective view which shows a mode that the attachment apparatus which concerns on this invention is inserted in the groove | channel of a heat sink. It is a perspective view of an attachment apparatus. It is sectional drawing of the state which inserted the attachment apparatus in the printed circuit board. It is sectional drawing seen from the direction of the right side surface of FIG.

Explanation of symbols

3 Mounting bracket (Mounting device)
DESCRIPTION OF SYMBOLS 11 Support part 12 Connection part 13 Bulging part 14 Convex part 15,16 Leg part (two leg parts of both outer sides)
15a, 16a Engagement part 15b, 16b Locking part 17 Leg part (leg part of center part)
17a Engagement part 31, 32, 33 hole HS heat sink (member)
MZ groove KB printed circuit board

Claims (3)

An attachment device for attaching a member provided on a side surface with two grooves facing each other in parallel to a printed circuit board,
The whole is plate-shaped,
A support part capable of inserting both end edges into the two grooves;
A connection part extending from the support part and connected to the printed circuit board;
Have
The connecting portion is provided with at least three legs that can be inserted into three holes provided in the printed circuit board,
The two outer leg portions are provided with an engaging portion that protrudes in one direction and serves as a retaining when inserted into the hole,
The center leg part is provided with an engaging part that protrudes in a direction different from the projecting direction of the engaging part of the two outer leg parts and prevents the part from coming off when inserted into the hole. Become,
An attachment device for attaching a member characterized by the above to a printed circuit board. The support part is provided with a convex part protruding in the thickness direction for reinforcement at the center part thereof,
An attachment device for attaching the member according to claim 1 to a printed circuit board. The two outer leg portions are provided with locking portions that serve as stoppers when the leg portions are inserted into the holes to prevent further insertion into the printed circuit board.
The distance in the length direction between the engaging portion provided on the leg portion at the center and the locking portion is set substantially equal to the thickness dimension of the printed circuit board.
An attachment device for attaching the member according to claim 1 or 2 to a printed board.