JP2006241238A - Composition for film formation, insulating film and electronic device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a composition for film formation, particularly a composition for film formation capable of forming an insulating film, used for electronic devices or the like, having a low dielectric constant and a relative dielectric constant hardly suffering from changes with time, an insulating film, and an electronic device comprising the same. <P>SOLUTION: The composition for film formation comprises a polymer of a compound represented by formula (I): (Y)m-X-(R)n, a coating solvent and a radical quencher. The insulating film and the electronic device are obtained using the same. In formula (I), X is a cage structure; R is a substituent group containing an acetylenic carbon-carbon triple bond or a substituent group containing an ethylenic carbon-carbon double bond; Y is a substituent group; m is an integer of at least 0; and n is an integer of at least 1. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a film-forming composition, and more particularly to an insulating film having a low relative dielectric constant used in electronic devices and the like and having a small change in relative dielectric constant with time.

  In recent years, in the field of electronic materials, with the progress of higher integration, more functions, and higher performance, circuit resistance and capacitor capacity between wirings have increased, leading to an increase in power consumption and delay time. In particular, the increase in delay time is a major factor in reducing the signal speed of the device and the occurrence of crosstalk. Therefore, in order to reduce the delay time and speed up the device, it is necessary to reduce parasitic resistance and parasitic capacitance. It has been. As a specific measure for reducing this parasitic capacitance, an attempt has been made to cover the periphery of the wiring with a low dielectric interlayer insulating film. In addition, the interlayer insulating film is required to have excellent heat resistance that can withstand post-processes such as a thin film forming process, chip connection, and pinning when manufacturing a mounting substrate, and chemical resistance that can withstand a wet process. Furthermore, in recent years, low resistance Cu wiring is being introduced from Al wiring, and along with this, planarization by CMP (Chemical Mechanical Polishing) has become common, and high mechanical strength that can withstand this process is high. It has been demanded.

Polybenzoxazole and polyimide are widely known as highly heat-resistant insulating films, but because they contain highly polar N atoms, they are satisfactory in terms of low dielectric properties, low water absorption, durability, and hydrolysis resistance. Nothing has been obtained.
In addition, many organic polymers are generally poorly soluble in organic solvents, and it is an important issue to suppress precipitation in coating solutions and the generation of bumps in insulating films. Therefore, if the polymer main chain is bent to have a bent structure, the glass transition point and the heat resistance are adversely affected, and it is not easy to achieve both.
Further, a high heat-resistant resin having a polyarylene ether as a basic main chain is known, and the relative dielectric constant is in the range of 2.6 to 2.7.

As a means for reducing the dielectric constant, it is known to use a polymer composed of a saturated hydrocarbon having a cage structure.
Patent Document 1 discloses an insulating film using a thermal polymer of an adamantane monomer containing a carbon double bond or a carbon triple bond, but the relative dielectric constant is not sufficiently satisfactory, and the future semiconductor device For speeding up, at least 2.6 or less, preferably 2.5 or less is desired.
In addition, the relative dielectric constant of the interlayer insulating film often becomes a problem that the dielectric constant increases during the CMP process or storage time, which is considered to be caused by moisture adsorbing to the high polarity component in the film. This undesirably high polarity component is often generated by the substitution of OH groups in the polymer chain due to air oxidation during the synthesis of the polymer. In addition, radicals generated in the film may be subjected to air oxidation to replace OH groups, and there is an urgent need to solve these problems.

JP 2003-292878 A

  The present invention relates to a film-forming composition for solving the above-described problems, and more particularly to an insulating film having a low dielectric constant and a small change in relative dielectric constant with time, which is used in electronic devices and the like.

The inventors of the present application have found that the above problem is solved by the following configuration.
(1)
A film-forming composition comprising a polymer of the compound represented by formula (I), a coating solvent, and a radical quencher.
(Y) m-X- (R) n Formula (I)
In formula (I),
X represents a cage structure.
R represents a substituent containing an acetylenic carbon triple bond or a substituent containing an ethylenic carbon double bond.
Y represents a substituent.
m represents an integer of 0 or more.
n represents an integer of 1 or more.
(2)
The film forming composition as described in (1) above, wherein the radical quencher is a hindered phenol compound.
(3)
The film forming composition as described in (1) or (2) above, wherein X is adamantane or diamantane.
(4)
The film forming composition as described in any one of (1) to (3) above, which comprises a pore forming agent.
(5)
The film forming composition as described in any one of (1) to (4) above, which comprises an adhesion promoter.
(6)
The film-forming composition as described in any one of (1) to (5) above, wherein the polymer of the compound represented by formula (I) does not have a nitrogen atom.
(7)
The insulating film formed using the film forming composition as described in any one of (1) to (6) above.
(8)
The electronic device which has an insulating film as described in said (7).

  Since the insulating film formed from the film forming composition of the present invention has a low relative dielectric constant and little changes with time, it can be used as an interlayer insulating film in electronic devices and the like.

Hereinafter, the present invention will be described in detail.
The film-forming composition of the present invention contains a polymer of the compound represented by formula (I), a coating solvent, and a radical quencher.
(Y) m-X- (R) n Formula (I)
In formula (I),
X represents a cage structure.
R represents a substituent containing an acetylenic carbon triple bond or a substituent containing an ethylenic carbon double bond.
Y represents a substituent.
m represents an integer of 0 or more.
n represents an integer of 1 or more.

  In the cage structure represented by X in formula (I), the volume is determined by a plurality of rings formed of covalently bonded atoms, and points located within the volume are separated from the volume without passing through the ring. It refers to molecules that cannot. For example, an adamantane structure is considered a cage structure. In contrast, a cyclic structure having a single bridge such as norbornane (bicyclo [2,2,1] heptane) is not considered a cage structure because the ring of a single bridged cyclic compound does not define volume. .

  In the present invention, the cage structure is preferably composed of 10 to 30, more preferably 10 to 20, and still more preferably 10 to 14 carbon atoms. The carbon atom here does not include a linking group substituted with a cage structure or a carbon atom of the substituent. For example, 1-methyladamantane is composed of 10 carbon atoms.

  In the present invention, the cage structure is preferably a saturated aliphatic hydrocarbon, and examples thereof include adamantane, diamantane, triamantane, tetramantane, dodecahedrane, and the like, and in particular, low dielectric constant and high mechanical strength can be obtained. Of these, adamantane or diamantane is more preferred, and diamantane is particularly preferred.

  In the formula (I), R represents an aliphatic hydrocarbon group (for example, methyl group, ethyl group, butyl group, octyl group, dodecyl group, vinyl group, ethynyl group, benzyl group, phenylethyl group, etc.), aryl group (phenyl group) 1-naphthyl group, 2-naphthyl group, etc.), and the substituent contains an acetylenic carbon triple bond or an ethylenic carbon double bond as a polymerizable group. Further, R may have another substituent, for example, a halogen atom (fluorine atom, chloro atom, bromine atom, or iodine atom), a linear, branched, or cyclic alkyl group (methyl, t-butyl). , Cyclopentyl, cyclohexyl etc.), aryl group (phenyl, 1-naphthyl, 2-naphthyl etc.), acyl group (benzoyl etc.), aryloxy group (phenoxy etc.), arylsulfonyl group (phenylsulfonyl etc.), nitro group, cyano Group, silyl group (triethoxysilyl, methyldiethoxysilyl, trivinylsilyl, etc.) and the like. These substituents may be further substituted with another substituent.

  In the formula (I), Y represents a substituent, for example, a halogen atom (a fluorine atom, a chloro atom, a bromine atom, or an iodine atom), a linear, branched, or cyclic alkyl group (methyl, t-butyl, cyclopentyl, cyclohexyl). Etc.), aryl group (phenyl, 1-naphthyl, 2-naphthyl etc.), acyl group (benzoyl etc.), aryloxy group (phenoxy etc.), arylsulfonyl group (phenylsulfonyl etc.), nitro group, cyano group, silyl group (Triethoxysilyl, methyldiethoxysilyl, trivinylsilyl, etc.).

  The molecular weight of the compound represented by formula (I) is preferably 160 to 1500, more preferably 160 to 1100, and particularly preferably 160 to 240.

  Specific examples of the compound represented by formula (I) of the present invention are shown below, but the present invention is not limited thereto.

The polymer of the compound represented by the formula (I) can be synthesized by a polymerization reaction of an ethylenic carbon double bond. For example, cationic polymerization, anionic polymerization, radical polymerization, thermal polymerization and the like known in the organic synthesis field can be used. The specific method can be referred to, for example, an experimental method of polymer synthesis by Kagaku Dojin.
Examples of the catalyst used in the polymerization reaction of the present invention include cationic acids such as H ₂ SO ₄ , H ₃ PO ₄ , HClO ₄ , CCl ₃ COOH, CF ₃ COOH, BF ₃ , Lewis acids such as AlCl ₃ , TiCl ₄ , SnCl ₂ , SnCl ₄ , SbCl ₅ , C ₂ H ₅ AlCl ₂ , Et ₂ AlCl and unpaired electrons such as water, alcohol, RCOOH, R ₂ O, RCl Cocatalysts with substances, substances that easily generate cations such as I ₂ , BF ₃ OEt ₂ , AgClO ₄ , and Ph ₃ CCl can be used.
In the case of anionic polymerization, for example, n ^- butyllithium, n ^- amyl sodium, KNH ₂ , sodium naphthalene and the like can be used.
In the case of radical polymerization, for example, radical initiators such as benzoyl peroxide, potassium persulfate, t-butyl hydroperoxide, di-t-butyl peroxide, cumene hydroperoxide, azobisisobutyronitrile can be used.
In addition, ion polymerization using a Ziegler-Natta catalyst, polymerization using a metallocene catalyst, and the like are also preferable methods.

The polymer of the compound represented by the formula (I) is also preferably synthesized by an addition polymerization reaction of an acetylenic carbon triple bond. Although the addition polymerization reaction may be carried out only by heating, it is preferable to use a transition metal catalyst from the viewpoint of shortening the reaction time and lowering the reaction temperature. As the catalyst that can be used, a transition metal catalyst is preferably used. For example, Pd-based catalysts such as Pd (PPh ₃ ) ₄ , Bis (benzonitrile) Palladium chloride, Pd (OAc) ₂ , Ziegler-Natta catalyst, metallocene catalyst, nickel acetylacetonate Ni-based catalyst and the like, W-based catalyst such as WCl _6, Mo-based catalysts such as MoCl _5, Ta catalysts such as TaCl _5, Nb-based catalyst such as NbCl _5, Rh-based catalyst, Pt-based catalysts are preferably used . Among these, a Pd-based catalyst is particularly preferable.

Solvents that can be used for the synthesis of the polymer of the compound represented by the formula (I) are those in which the raw material monomer can be dissolved at a necessary concentration and do not adversely affect the properties of the film formed from the obtained polymer. Any one can be used as long as it is present. For example, alcohol solvents such as water, methanol, ethanol and propanol, alcohol solvents such as alcohol acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, acetophenone, ethyl acetate, butyl acetate, propylene glycol monomethyl ether acetate, γ-butyrolactone, methyl benzoate Ester solvents such as dibutyl ether, anisole, etc., aromatic hydrocarbon solvents such as benzene, toluene, xylene, mesitylene, 1,3,5-triisopropylbenzene, N-methylpyrrolidinone, dimethylacetamide, etc. Amide solvents, carbon tetrachloride, dichloromethane, chloroform, 1,2-dichloroethane, chlorobenzene, 1,2-dichlorobenzene, 1,2,4-trichlorobenzene Halogen-based solvents, hexane, heptane, octane, aliphatic hydrocarbon solvents such as cyclohexane, nitromethane, nitroethane, and nitro compounds nitrobenzene and the like can be used for. These may be used alone or in admixture of two or more.
The boiling point of the organic solvent for reaction is preferably 50 ° C. or higher, more preferably 100 ° C. or higher, and particularly preferably 150 ° C. or higher.
The concentration of the reaction solution is preferably 1 to 50% by mass, more preferably 5 to 30% by mass, and particularly preferably 10 to 20% by mass.

The preferable range of the weight average molecular weight of the polymer obtained by polymerization is 1000 to 500000, more preferably 5000 to 300000, and particularly preferably 10000 to 200000.
In addition, the polymer of the compound represented by the formula (I) of the present invention preferably contains no nitrogen atom from the viewpoint of dielectric constant and hygroscopicity of the film, and in particular, a compound other than polyimide, that is, a polyimide bond. It is preferable that it is a compound which does not have.

The film-forming composition of the present invention is a radical chain for the purpose of suppressing fluctuations in relative dielectric constant over time associated with, for example, oxidative degradation of a polymer caused by the action of heat, light, mechanical force, metal ions, etc. and oxygen. It is characterized by containing a radical quencher such as a reaction terminator or a decomposer of the generated peroxide.
Examples of the radical quencher that can be used in the present invention include phenolic, amine-based, sulfur-based, and phosphorus-based compounds. Preferred are hindered phenols and hindered amines, and particularly preferred are hindered phenols.
These may be used alone or in combination of two or more.
The amount of radical quencher added in the film-forming composition is generally 0.01% to 20% by weight, preferably 0.1 to 10% by weight, more preferably 0%, based on the total solid content. 0.5 to 5% by mass.
These radical quenchers can be synthesized by a general synthesis method. Moreover, what is marketed can also be used.

  Although the specific example of a radical quencher is shown below, this invention is not limited to these.

The film-forming composition of the present invention is formed by dissolving the polymer, radical quencher, and, if necessary, other additives in a coating solvent. Examples of suitable coating solvents that can be used include, but are not limited to, alcohol solvents such as methanol, ethanol, isopropanol, 1-butanol, 2-ethoxymethanol, and 3-methoxypropanol, acetone, acetylacetone, methyl ethyl ketone, and methyl isobutyl. Ketone solvents such as ketone, 2-pentanone, 3-pentanone, 2-heptanone, 3-heptanone, cyclohexanone, ethyl acetate, propyl acetate, butyl acetate, isobutyl acetate, pentyl acetate, ethyl propionate, propyl propionate, propionic acid Butyl, isobutyl propionate, propylene glycol monomethyl ether acetate, ester solvents such as methyl lactate, ethyl lactate, γ-butyrolactone, diisopropyl ether, dibutyl ether , Ether solvents such as ethylpropyl ether, anisole, phenetol, veratrol, aromatic hydrocarbon solvents such as mesitylene, ethylbenzene, diethylbenzene, propylbenzene, 1,2-dichlorobenzene, amides such as N-methylpyrrolidinone, dimethylacetamide These solvents may be used, and these may be used alone or in admixture of two or more.
More preferred coating solvents are acetone, propanol, cyclohexanone, propylene glycol monomethyl ether acetate, methyl lactate, ethyl lactate, γ-butyrolactone, anisole, mesitylene, 1,2-dichlorobenzene, and particularly preferred is cyclohexanone, propylene glycol monomethyl ether. Acetate, γ-butyrolactone, anisole.

  In the present invention, the polymer of the compound represented by formula (I) needs to be dissolved in a coating solvent at a sufficient concentration. As a measure of solubility, it is preferably 3% by mass or more, more preferably 7% by mass or more, and particularly preferably 10% by mass or more at 25 ° C. in cyclohexanone which is a coating solvent preferably used in the production of electronic devices. It is preferable.

  The solid content concentration of the film-forming composition of the present invention is preferably 3 to 50% by mass, more preferably 7 to 35% by mass, and particularly preferably 10 to 15% by mass.

  In the present invention, the polymers may be used alone or in admixture of two or more.

Furthermore, the composition for forming a film of the present invention includes a nonionic surfactant and a fluorine-based surfactant as long as the properties of the obtained insulating film (heat resistance, dielectric constant, mechanical strength, coatability, adhesion, etc.) are not impaired. You may add additives, such as a nonionic surfactant, a silane coupling agent, and an adhesive agent.
Examples of the nonionic surfactant include octyl polyethylene oxide, decyl polyethylene oxide, dodecyl polyethylene oxide, octyl polypropylene oxide, decyl polypropylene oxide, dodecyl polypropylene oxide, and the like. Examples of the fluorine-based nonionic surfactant include perfluorooctyl polyethylene oxide, perfluorodecyl polyethylene oxide, perfluordecyl polyethylene oxide, and the like. Examples of the silane coupling agent include vinyltrimethoxysilane, vinyltriethoxysilane, vinyltriacetoxysilane, allyltrimethoxysilane, allyltriethoxysilane, divinyldiethoxysilane, trivinylethoxysilane and the like.
The addition amount of these additives has an appropriate range depending on the use of the additive or the solid content concentration of the coating liquid, but generally 0.001% to 10% by mass% in the coating liquid, More preferably, it is 0.01% to 5%, and particularly preferably 0.05% to 2%.

  The film-forming composition of the present invention preferably contains a pore-forming agent. The pore-forming agent is a substance having a function of forming pores in a film obtained from the film-forming composition. For example, by heating a film formed from a film-forming composition containing a pore-forming agent, pores formed by the pore-forming agent can be formed in the film, and a film containing pores can be obtained. .

  The pore-forming agent is not particularly limited, and a thermally decomposable polymer that decomposes by heating can be used. The polymer as the pore forming agent is preferably one that thermally decomposes at a temperature lower than the thermal decomposition temperature of the polymer constituting the film.

  Examples of the thermally decomposable polymer that can be used as a pore-forming agent include polyvinyl aromatic compounds (polystyrene, polyvinyl pyridine, halogenated polyvinyl aromatic compounds, etc.), polyacrylonitrile, polyalkylene oxides (polyethylene oxide, polypropylene oxide, etc.), Polyethylene, polylactic acid, polysiloxane, polycaprolactone, polycaprolactam, polyurethane, polymethacrylate (such as polymethyl methacrylate) or polymethacrylic acid, polyacrylate (such as polymethyl acrylate) and polyacrylic acid, polydiene (such as polybutadiene and polyisoprene) , Polyvinyl chloride, polyacetal, and amine capped alkylene oxide (from Huntsman Corp. to Jef amineTM commercially available as polyether amines), and the like.

  The polymer as the pore forming agent may be any of homopolymer, block copolymer, random copolymer and the like. Moreover, these mixtures may be sufficient. It may also be linear, branched, hyperbranched, dendritic or star-like.

  In particular, polystyrene can be suitably used as a pore forming agent. Examples include anionic polymerized polystyrene, syndiotactic polystyrene, unsubstituted and substituted polystyrene (eg, poly (α-methylstyrene)), and unsubstituted polystyrene is more preferred.

  It is also preferred that the pore-forming agent is bound to a compound that forms a film. By designing in this way, it becomes possible to form holes having a uniform size, and a reduction in mechanical strength can be reduced.

The pore forming agent may also be a granular material having a size corresponding to the size of the pores generated in the insulating film. Such a substance is preferably a substance having an average diameter of 0.5 to 50 nm, more preferably 0.5 to 20 nm. There are no restrictions on the material of the substance, and examples include hyperbranched polymer systems such as dendrimers and latex particles, particularly crosslinked polystyrene-containing latex.
Examples of these materials include Dendritech, Inc. Also available through Polymer J. (Tokyo), Vol. 17, 117 (1985), a polyamidoamine (PAMAM) dendrimer described by Tomalia et al., DSMcor
Polyimide imine polyamine (DAB-Am) dendrimer available from Poration, Frechet type polyether dendrimer (J. Am. Chem. Soc., Vol. 112, 7638 (1990), Vol. 113, 4252 (1991)) by Frechet et al. Described), parsec-type liquid crystal monodendrones, dendronized polymers and their self-assembled polymers (Nature, Vol. 391, 161 (1998), J. Am. Chem. Soc., Vol. 119, 1539 (1997). And Boltlon H series dendritic polyester (commercially available from PerstorpAB).

  The suitable mass average molecular weight of the polymer as the pore-forming agent is preferably 2000 to 100,000, more preferably 3000 to 50000, and particularly preferably 5000 to 20000.

  The addition amount of the pore-forming agent in the film-forming composition is preferably 1 to 50% by mass, more preferably 10 to 40% by mass, and particularly preferably 20 to 30% by mass with respect to the total solid content. .

The film-forming composition of the present invention preferably contains an adhesion promoter.
Representative examples of adhesion promoters used in the present invention are silanes, preferably alkoxy silanes (eg, trimethoxyvinylsilane, triethoxyvinylsilane, tetraethoxysilane, phenyltrimethoxysilane, allyltrimethoxysilane, divinyldiethoxysilane). ) And other organosilanes, acetoxysilane (for example, vinyltriacetoxysilane, 3-aminopropyltrimethoxysilane), and hydrolysates or dehydrated condensates thereof, hexamethyldisilazane [(CH ₃ ) ₃ —Si—NH— Si (CH _{3) 3],} or aminosilane couplers, for example, γ- aminopropyltriethoxysilane or chelating (e.g., from the viewpoint of forming aluminum oxide, aluminum monoethyl acetoacetate diisopropylate [((iso, _{3 H 7 O) 2 Al (} OCOC 2 H 5 CHCOCH 3))], aluminum alkoxide), and the like. You may mix and use these materials. Moreover, you may use what is marketed as an adhesion promoter.

  The addition amount of the adhesion promoter in the film-forming composition is generally 0.05% by mass to 5% by mass, preferably 0.1-2% by mass, based on the total solid content.

  After applying the film-forming composition of the present invention to a substrate by any method such as spin coating, roller coating, dip coating, or scanning, the solvent is removed by heat treatment, whereby the insulation of the present invention is achieved. A film can be formed. The method of the heat treatment is not particularly limited, but the commonly used hot plate heating, method using a furnace, light irradiation heating using a xenon lamp by RTP (Rapid Thermal Processor), etc. are applied. Can do.

In the present invention, it is particularly preferable that the polymer is cured by heat treatment after being applied on the substrate. For example, the triple bond remaining in the polymer can be insolubilized and infusible by polymerizing at the time of post-heating. The conditions for this post-heat treatment are preferably 100 to 450 ° C., more preferably 200 to 420 ° C., particularly preferably 350 to 400 ° C., preferably 1 minute to 2 hours, more preferably 10 minutes to 1.5 ° C. Time, particularly preferably in the range of 30 minutes to 1 hour.
The post-heating treatment may be performed in several times. Further, this post-heating is particularly preferably performed in a nitrogen atmosphere in order to prevent thermal oxidation by oxygen.

  The film obtained using the film forming composition of the present invention can be used for various purposes. For example, it is suitable as an insulating film for electronic components such as semiconductor devices and multichip module multilayer wiring boards. In addition to interlayer insulating films for semiconductors, surface protective films, and buffer coat films, passivation films for semiconductors, α-ray blocking films, flexographic printing It can be used as a plate cover lay film, overcoat film, flexible copper clad cover coat, solder resist film, liquid crystal alignment film, and the like.

  The following examples illustrate the invention and are not intended to limit its scope.

<Example 1>
20 g of 4,9-diethynyldiamantane, 244 mg of Pd (PPh ₃ ) _{4 and} 100 ml of 1,3,5-triisopropylbenzene were placed in a flask, and the mixture was heated and stirred at an internal temperature of 200 ° C. for 10 hours under a nitrogen stream. After cooling to room temperature, insoluble matters in the reaction solution were removed by filtration. Isopropyl alcohol was added to the obtained filtrate, and the precipitated solid was filtered. Further, the obtained solid was suspended in isopropyl alcohol, stirred, and then filtered again. 6 g of a pale yellow polymer (A) was obtained.
1.0 g of the polymer (A) and 20 mg of a commercially available radical quencher (R-7 described in the specific examples) were completely dissolved in 7.3 g of cyclohexanone at room temperature. The coating solution was filtered through a 0.2 micron tetrafluoroethylene filter and spin-coated on a silicon wafer. This coating film was baked at 400 ° C. for 60 minutes in a nitrogen-substituted furnace to obtain a film having a thickness of 0.5 μm. The relative dielectric constant after 1 hour of baking of this film was 2.42. The relative dielectric constant of the film was measured after storage in the atmosphere at room temperature for 1 week, and it was 2.42.

<Comparative Example 1>
A film made by the same method as in Example 1 was prepared except that no radical quencher was added, and the relative dielectric constant was measured. The relative dielectric constant after firing for 1 hour was 2.42, and the relative dielectric constant after 1 week at room temperature was 2.52.

Claims (8)

A film-forming composition comprising a polymer of the compound represented by formula (I), a coating solvent, and a radical quencher.
(Y) m-X- (R) n Formula (I)
In formula (I),
X represents a cage structure.
R represents a substituent containing an acetylenic carbon triple bond or a substituent containing an ethylenic carbon double bond.
Y represents a substituent.
m represents an integer of 0 or more.
n represents an integer of 1 or more.   2. The film-forming composition according to claim 1, wherein the radical quencher is a hindered phenol compound.   The film forming composition according to claim 1, wherein X is adamantane or diamantane.   The film forming composition according to claim 1, further comprising a pore forming agent.   The film forming composition according to claim 1, further comprising an adhesion promoter.   The film-forming composition according to any one of claims 1 to 5, wherein the polymer of the compound represented by formula (I) does not have a nitrogen atom.   The insulating film formed using the film forming composition in any one of Claims 1-6.   An electronic device having the insulating film according to claim 7.