JP2006234850A - Optical device and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an optical device that achieves an excellent optical coupling characteristic by reducing connection loss through improvement of optical connecting structure between an optical waveguide and optical elements and that has high positional accuracy by improving a mounting structure, and also to provide a manufacturing method of the same. <P>SOLUTION: In the optical device, there is arranged a resin layer 34 composed of a photosetting material between the optical elements 22, 23 and the optical waveguide 11 which is installed in a wiring board 10 having an opening 12 at least in a part opposing the optical elements. In the resin layer, an optical connecting part 34a is formed which optically connects the optical elements and the optical waveguide and which has a higher refractive index than that of the periphery. Also, the optical elements are mounted on the wiring board through a non-conductive film 32. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an optical device and a method for manufacturing the same, and more particularly to an optical device including at least an optical waveguide and an optical element, and an optical connection structure and a mounting structure between them, and a method for manufacturing the same.

  2. Description of the Related Art In recent years, an optical wiring technique has been introduced in an electric wiring board in an electronic device for the purpose of improving a signal transmission speed. Specifically, an optical waveguide is applied as an optical wiring in the wiring board, and is used by being laminated with an electric wiring layer. Such a wiring board configured by mixing electrical wiring and optical wiring is generally called an opto-electric mixed wiring board.

  FIG. 2 shows an example of such an opto-electric hybrid wiring board. The illustrated opto-electric hybrid wiring board 200 includes an IC chip mounting substrate 20 in which a surface emitting semiconductor laser (VCSEL) 22 and a photodiode (PD) 23 are mounted on a printed wiring board 10 on which an optical waveguide 11 is formed. Flip chip mounting is performed via the protruding electrode 31 and the solder ball 35, and an underfill material 33 is filled between the printed wiring board 10 and the IC chip 20. This opto-electric hybrid wiring board 200 is connected to an optical fiber (not shown) via a connector 40 and used as an optical device. In such an optical device, it is important to reduce connection loss between optical components.

As an improved technique related to such an optical device, for example, in Patent Documents 1 and 2, in order to realize an optical communication device with low connection loss between optical components and excellent connection reliability, an optical waveguide and an optical device A technique is described in which an element is configured to transmit an optical signal via an optical path resin-filled layer or an optical signal transmission path. Patent Document 3 describes a technique for reducing optical loss by providing a microlens in the optical path of signal light that optically couples a surface light emitting element and an optical waveguide. Furthermore, a method of reducing the loss by using a right angle conversion element is also known.
JP 2004-4426 A (Claims etc.) JP 2004-4427 A (Claims etc.) JP 2001-185752 A (Claims etc.)

  As described above, various techniques for coupling the optical waveguide and the optical element with low loss have been proposed. However, a method using a microlens or a right-angle conversion element is used for an opto-electric hybrid wiring board. In the mounting process, it is difficult to position the microlens or right angle conversion element, and when mounting the optical element, it is necessary to mount it according to the position of the separately mounted microlens or right angle conversion element. As a result, there is a problem that a large amount of man-hours are required for mounting. Furthermore, there has been a problem that foreign matter is mixed in the optical path of the signal light to inhibit transmission and cause optical loss.

  In addition, as described in the above publication, there is a technique for transmitting an optical signal between an optical waveguide and an optical element through an optical path resin-filled layer or an optical signal transmission path, but it is not sufficient. Therefore, there is a need for a technique that can achieve optical coupling with lower loss.

  Furthermore, as shown in FIG. 2, conventionally, when an optical element is mounted on a wiring board, a method using a solder ball 32 is generally adopted. In view of the fact that the solder is often used in a high temperature state and the repairability is poor, there is an increasing demand for mounting means that can be mounted without using solder and has high positional accuracy.

  Accordingly, an object of the present invention is to reduce the connection loss by improving the optical connection structure between the optical waveguide and the optical element, to realize excellent optical coupling characteristics, and to improve the position accuracy by improving the mounting structure. It is to provide a device and a manufacturing method thereof.

  As a result of intensive studies, the present inventors have provided a resin layer between the optical waveguide and the optical element, formed a predetermined optical connection portion in the resin layer, and further mounted the optical element on a non-conductive film. (NCF), it has been found that it is possible to perform optical coupling between the two with a low loss compared to the conventional, and can secure the mounting positional accuracy at a high level, The present invention has been completed.

  That is, in order to solve the above-described problem, the optical device of the present invention is a photocuring between an optical element and an optical waveguide provided in a wiring board having an opening in at least a portion facing the optical element. A resin layer made of a material is disposed, and in the resin layer, an optical connection portion having a higher refractive index than the surroundings is formed to optically connect the optical element and the optical waveguide, and the optical element is It is mounted on the wiring board through a non-conductive film. In this case, the photocurable material preferably contains two or more kinds of photopolymerization initiators or one or more kinds of dyes having absorption in the near infrared or longer wavelength region.

  In another optical device of the present invention, a resin layer made of a photocuring material and a thermosetting material is disposed between an optical waveguide provided in a wiring board and an optical element, and the resin layer includes An optical connection portion having a higher refractive index than the surroundings is formed to optically connect the optical waveguide and the optical element, and the optical element is mounted on the wiring board via a non-conductive film. It is characterized by. In this case, preferably, the photocuring material includes one or more photopolymerization initiators, and the thermosetting material includes one or more thermopolymerization initiators. Moreover, it is also preferable that the said photocurable material contains 1 or more types of pigment | dyes which have absorption in the near-infrared region or a longer wavelength region.

  In the optical device of the present invention, the optical element is preferably a light emitting element or a light receiving element.

  The optical device manufacturing method of the present invention is the above optical device manufacturing method, wherein the non-conductive film is temporarily pressure-bonded on a wiring board in which the optical waveguide is provided, at least in a region excluding the opening. Temporary crimping step, filling step of filling a region including at least the opening on the wiring board with a photo-curing material, and mounting for mounting the optical element on the non-conductive film and the filled photo-curing material A step of curing the optical connection portion by partially irradiating the photocuring material with light, and a resin for curing the entire resin layer by secondary light irradiation of the entire photocurable material. And a layer curing step.

  According to another optical device manufacturing method of the present invention, in the optical device manufacturing method, the non-conductive film is temporarily provided on a wiring board in which the optical waveguide is provided, at least in a region excluding the opening. A temporary crimping step for crimping, a mounting step for mounting the optical element on the non-conductive film, a filling step for filling a region on the wiring board including at least the opening with a photocuring material, and the photocuring An optical connection portion forming step for curing the optical connection portion by partial light irradiation on the material, and a resin layer curing step for curing the entire resin layer by secondary light irradiation on the entire photocurable material. It is characterized by including.

  According to another optical device manufacturing method of the present invention, in the optical device manufacturing method, the non-conductive film is temporarily provided on a wiring board in which the optical waveguide is provided, at least in a region excluding the opening. A temporary crimping step of crimping, a filling step of filling a region including at least the opening on the wiring board with a mixture of a photo-curing material and a thermosetting material, and the non-conductive film and the filled mixture on the wiring board A mounting step of mounting an optical element, an optical connection portion forming step of curing and forming the optical connection portion by partial light irradiation on the mixture, and a resin layer curing step of curing the entire resin layer by a heat treatment on the entire mixture It is characterized by including these.

  Furthermore, in another method of manufacturing an optical device according to the present invention, in the method of manufacturing an optical device, the nonconductive film is formed on a wiring board in which the optical waveguide is provided at least in a region excluding the opening. A temporary press-bonding step for temporary press-bonding, a mounting step for mounting the optical element on the non-conductive film, and a region on the wiring board including at least the opening are filled with a mixture of a photo-curing material and a thermosetting material. A filling step, an optical connection portion forming step for curing the optical connection portion by partial light irradiation on the mixture, and a resin layer curing step for curing the entire resin layer by a heat treatment for the entire mixture. It is characterized by.

  In the manufacturing method of the present invention, the partial light irradiation is preferably performed by light emitted from the optical element, and is also generated by light that is generated by an external light source and propagates to the optical element through the optical waveguide. It is also preferable to do this. More preferably, the partial light irradiation is simultaneously performed by light emitted from the optical element and light generated by an external light source and propagating to the optical element through the optical waveguide.

  According to the present invention, with the above-described configuration, it is possible to realize an optical device excellent in optical coupling characteristics and a method for manufacturing the optical device by reducing light loss between the optical waveguide and the optical element compared to the conventional one. It became. Further, the positional accuracy can be increased by improving the mounting structure, and the productivity can be improved.

Hereinafter, preferred embodiments of the present invention will be described in detail.
FIG. 1 shows a schematic cross-sectional view of an optical device as an example of the present invention. As shown in the figure, an optical device 100 of the present invention includes an IC chip mounting substrate 20 in which a surface emitting semiconductor laser (VCSEL) 22 and a photodiode 23 are mounted on a printed wiring board 10 in which an optical waveguide 11 is provided. Is the same as the conventional structure. In the printed wiring board 10 shown in the figure, an opening 12 is provided in a portion facing the optical elements 22 and 23, and the optical waveguide 11 is exposed to the surface of the printed wiring board 10 through the opening 12. Note that the size of the opening 12 is not necessarily the same as that of the optical elements 22 and 23 as long as an optical connecting portion 34a described later can be reliably formed.

  In the present invention, between the printed wiring board 10 and the IC chip 20, that is, between the optical waveguide 11 and the optical elements 22 and 23, a resin layer 34 made of a photocuring material or a photocuring material and a thermosetting material. In the resin layer 34, an optical connection part 34a having a refractive index higher than that of the periphery is formed. The optical connection part 34a optically connects the optical waveguide 11 and the optical elements 22 and 23. By setting the optical connecting portion 34a to have a higher refractive index than the surrounding region 34b, an optical waveguide structure having the optical connecting portion 34a as a core can be formed in the resin layer 34. And the optical elements 22 and 23 can transmit light while preventing loss of light. In addition, for the purpose of further reducing the loss of light, an arbitrary numerical aperture (NA) can be appropriately selected by adjusting the respective refractive indexes of the optical connecting portion 34a and the surrounding region 34b. It is.

  In the present invention, the resin layer 34 is made of a photocuring material, or a photocuring material and a thermosetting material, as described above. Among these, photocuring materials include (a) dichromate photosensitive resin, (b) photodecomposable photosensitive resin, (c) photodimerized photosensitive resin, and (d) photopolymerizable photosensitive resin. are categorized.

  (A) Bichromate-based photosensitive resins include natural polymers such as gelatin, glue, egg white, gum arabic, and ceramics, or synthetic polymers such as PVA (polyvinyl alcohol) and polyacrylamide, and heavy chromium. Examples include ammonium acid or potassium dichromate. In addition, (b) photodegradable photosensitive resins include aromatic diazonium salt resins, o-quinonediazide resins, and azide compound-containing resins. (C) Photodimerized photosensitive resins include cinnamic acid ester resins. Resin.

  Furthermore, (d) as a photopolymerizable photosensitive resin, a photoradical polymerization composition using a radical polymerization reaction of an unsaturated double bond, a photoaddition reaction system using an addition reaction of a thiol group to a double bond Examples thereof include a composition and a photocationic polymerization composition utilizing a ring-opening addition reaction (cationic polymerization) of an epoxy group. The photopolymerization type photosensitive resin generally includes a reactive polymer having a photopolymerizable functional group, a compound (monomer and oligomer) having a photopolymerizable functional group (preferably a (meth) acryloyl group), a photopolymerization initiator, and Optionally composed of other additives.

  Examples of the reactive polymer having a photopolymerizable functional group include alkyl acrylate (methyl acrylate, ethyl acrylate, butyl acrylate, 2-ethylhexyl acrylate, etc.) and / or alkyl methacrylate (methyl methacrylate, ethyl methacrylate, butyl methacrylate, 2- And a homopolymer or copolymer (that is, an acrylic resin) obtained from ethylhexyl methacrylate and the like and having a photopolymerizable functional group in the main chain or side chain. Such a polymer is obtained, for example, by copolymerizing one or more kinds of (meth) acrylate and (meth) acrylate (such as 2-hydroxyethyl (meth) acrylate) having a functional group such as a hydroxyl group. The polymer can be obtained by reacting with a functional group of the polymer and a compound having a photopolymerizable group, such as isocyanatoalkyl (meth) acrylate. Therefore, an acrylic resin having a photopolymerizable functional group via a urethane bond is preferable.

  Such a reactive polymer usually contains 1 to 50 mol%, particularly 5 to 30 mol%, of a photopolymerizable functional group. As this photopolymerizable functional group, an acryloyl group, a methacryloyl group, and a vinyl group are preferable, and an acryloyl group and a methacryloyl group are particularly preferable. The glass transition temperature of the reactive polymer is generally 20 ° C. or less, the number average molecular weight is usually 5000 to 1000000, preferably 10000 to 300000, and the weight average molecular weight is usually 5000 to 1000000, preferably 10,000. ~ 300,000.

  Specific examples of the compound having a photopolymerizable functional group include, for example, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, 2-ethylhexyl polyethoxy (meta ) Acrylate, benzyl (meth) acrylate, isobornyl (meth) acrylate, phenyloxyethyl (meth) acrylate, tricyclodecane mono (meth) acrylate, dicyclopentenyloxyethyl (meth) acrylate, tetrahydrofurfuryl (meth) acrylate, Acryloylmorpholine, N-vinylcaprolactam, 2-hydroxy-3-phenyloxypropyl (meth) acrylate, o-phenylphenyloxyethyl (meth) acrylate, neopentylglycol Di (meth) acrylate, neopentyl glycol dipropoxy di (meth) acrylate, hydroxypivalic acid neopentyl glycol di (meth) acrylate, tricyclodecane dimethylol di (meth) acrylate, 1,6-hexanediol di (meth) Acrylate, nonanediol di (meth) acrylate, trimethylolpropane tri (meth) acrylate, pentaerythritol tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, tris [(meth) acryloxyethyl] isocyanurate, ditrimethylolpropane (Meth) acrylate monomers such as tetra (meth) acrylate, such as ethylene glycol, propylene glycol, neopentyl glycol, 1,6-hexanediol 3-methyl-1,5-pentanediol, 1,9-nonanediol, 2-ethyl-2-butyl-1,3-propanediol, trimethylolpropane, diethylene glycol, dipropylene glycol, polypropylene glycol, 1,4 -Polyols such as dimethylolcyclohexane, bisphenol A polyethoxydiol, polytetramethylene glycol, the polyols and succinic acid, maleic acid, itaconic acid, adipic acid, hydrogenated dimer acid, phthalic acid, isophthalic acid, terephthalic acid, etc. Polyester polyols that are reaction products of these polybasic acids or acid anhydrides thereof, polycaprolactone polyols that are reaction products of the polyols and 蛩 -caprolactone, the polyols and the polybasic acids or these Acid anhydrides -Reaction product with caprolactone, polycarbonate polyol, polymer polyol, etc.) and organic polyisocyanate (for example, tolylene diisocyanate, isophorone diisocyanate, xylylene diisocyanate, diphenylmethane-4,4'-diisocyanate, dicyclopentanyl diisocyanate, hexamethylene diisocyanate 2,4,4′-trimethylhexamethylene diisocyanate, 2,2′-4-trimethylhexamethylene diisocyanate, etc.) and a hydroxyl group-containing (meth) acrylate (for example, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl ( (Meth) acrylate, 4-hydroxybutyl (meth) acrylate, 2-hydroxy-3-phenyloxypropyl (meth) acrylate, cyclohex 1,4-dimethylol mono (meth) acrylate, pentaerythritol tri (meth) acrylate, glycerin di (meth) acrylate, etc.) reaction product polyurethane (meth) acrylate, bisphenol A type epoxy resin, bisphenol F type Examples include (meth) acrylate oligomers such as bisphenol-type epoxy (meth) acrylate, which is a reaction product of bisphenol-type epoxy resin such as epoxy resin and (meth) acrylic acid. These compounds having a photopolymerizable functional group can be used alone or in combination of two or more.

  As the photopolymerization initiator, any known photopolymerization initiator can be used, but one having good storage stability after blending is desirable. Examples of such a photopolymerization initiator include 2-hydroxy-2-methyl-1-phenylpropan-1-one, 1-hydroxycyclohexyl phenyl ketone, and 2-methyl-1- (4- (methylthio) phenyl). Acetophenone such as 2-morpholinopropane-1, benzoin such as benzyldimethyl ketal, benzophenone such as benzophenone, 4-phenylbenzophenone and hydroxybenzophenone, thioxanthone such as isopropylthioxanthone and 2-4-diethylthioxanthone, acylphosphine Methylphenylglyoxylate and the like can be used as oxides and other special ones. Particularly preferably, 2-hydroxy-2-methyl-1-phenylpropan-1-one, 1-hydroxycyclohexyl phenyl ketone, 2-methyl-1- (4- (methylthio) phenyl) -2-morpholinopropane-1, Examples include benzophenone. These photopolymerization initiators may contain one or two or more kinds of known and commonly used photopolymerization accelerators such as a benzoic acid type such as 4-dimethylaminobenzoic acid or a tertiary amine type as required. Can be mixed and used. Moreover, only a photoinitiator can be used 1 type or in mixture of 2 or more types. The photopolymerization initiator is usually contained in the photopolymerization type photosensitive resin in an amount of usually 0.1 to 20% by mass, particularly 1 to 10% by mass.

  Among the photopolymerization initiators, as the acetophenone polymerization initiator, in addition to the above, for example, 4-phenoxydichloroacetophenone, 4-t-butyl-dichloroacetophenone, 4-t-butyl-trichloroacetophenone, diethoxyacetophenone, 1 -(4-Isopropylphenyl) -2-hydroxy-2-methylpropan-1-one, 1- (4-dodecylphenyl) -2-hydroxy-2-methylpropan-1-one, 4- (2-hydroxyethoxy) ) -Phenyl (2-hydroxy-2-propyl) ketone and the like, and as the benzophenone polymerization initiator, in addition to the above, benzoylbenzoic acid, methyl benzoylbenzoate, 4-benzoyl-4′-methyldiphenylsulfide, 3,3′-dimethyl-4-methoxybenzophenone, etc. It is. Examples of acylphosphine oxides include compounds such as 2,4,6-trimethylbenzoyldiphenylphosphine oxide and bis (2,6-dimethoxybenzoyl) -2,4,4-trimethyl-pentylphosphine oxide. .

  Among the acetophenone polymerization initiators, in particular, 2-hydroxy-2-methyl-1-phenylpropan-1-one, 1-hydroxycyclohexyl phenyl ketone, 2-methyl-1- (4- (methylthio) phenyl)- 2-morpholinopropane-1 is preferred. Of the above benzophenone polymerization initiators, benzophenone, benzoylbenzoic acid, and methyl benzoylbenzoate are preferred.

  Further, tertiary amine photopolymerization accelerators include triethanolamine, methyldiethanolamine, triisopropanolamine, 4,4′-dimethylaminobenzophenone, 4,4′-diethylaminobenzophenone, and ethyl 2-dimethylaminobenzoate. , Ethyl 4-dimethylaminobenzoate, ethyl 4-dimethylaminobenzoate (n-butoxy), isoamyl 4-dimethylaminobenzoate, 2-ethylhexyl 4-dimethylaminobenzoate and the like can be used. Particularly preferably, as the photopolymerization accelerator, ethyl 4-dimethylaminobenzoate, ethyl 4-dimethylaminobenzoate (n-butoxy), isoamyl 4-dimethylaminobenzoate, 2-ethylhexyl 4-dimethylaminobenzoate, etc. Is mentioned. As described above, the photopolymerization initiator is usually used by combining the above three components.

  The mass ratio of the reactive polymer in the photopolymerizable photosensitive resin: the compound having a photopolymerizable functional group: the photopolymerization initiator is usually 40 to 100: 0 to 60: 0.1 to 10, particularly 60 to 60. 100: 0 to 40: 1-10.

  Specific examples of the polymerizable monomer having one oxetane ring as the cationic polymerization compound include 3-ethyl-3-hydroxymethyloxetane, 3- (meth) allyloxymethyl-3-ethyloxetane, (3 -Ethyl-3-oxetanylmethoxy) methylbenzene, 4-fluoro- [1- (3-ethyl-3-oxetanylmethoxy) methyl] benzene, 4-methoxy- [1- (3-ethyl-3-oxetanylmethoxy) methyl Benzene, [1- (3-ethyl-3-oxetanylmethoxy) ethyl] phenyl ether, isobutoxymethyl (3-ethyl-3-oxetanylmethyl) ether, isobornyloxyethyl (3-ethyl-3-oxetanylmethyl) ) Ether, isobornyl (3-ethyl-3-oxetanylmethyl) A , 2-ethylhexyl (3-ethyl-3-oxetanylmethyl) ether, ethyldiethylene glycol (3-ethyl-3-oxetanylmethyl) ether, dicyclopentadiene (3-ethyl-3-oxetanylmethyl) ether, dicyclopentenyloxy Ethyl (3-ethyl-3-oxetanylmethyl) ether, dicyclopentenylethyl (3-ethyl-3-oxetanylmethyl) ether, tetrahydrofurfuryl (3-ethyl-3-oxetanylmethyl) ether, tetrabromophenyl (3- Ethyl-3-oxetanylmethyl) ether, 2-tetrabromophenoxyethyl (3-ethyl-3-oxetanylmethyl) ether, tribromophenyl (3-ethyl-3-oxetanylmethyl) ether, 2-tribromofe Xylethyl (3-ethyl-3-oxetanylmethyl) ether, 2-hydroxyethyl (3-ethyl-3-oxetanylmethyl) ether, 2-hydroxypropyl (3-ethyl-3-oxetanylmethyl) ether, butoxyethyl (3- Ethyl-3-oxetanylmethyl) ether, pentachlorophenyl (3-ethyl-3-oxetanylmethyl) ether, pentabromophenyl (3-ethyl-3-oxetanylmethyl) ether, bornyl (3-ethyl-3-oxetanylmethyl) ether Etc. Specific examples of the polymerizable monomer having two oxetane rings include 1,4-bis {[(3-ethyl-3-oxetanyl) methoxy] methyl} benzene, bis {[(1-ethyl) 3-oxetanyl] methyl. } Ether, 1,4-bis [(3-ethyl-3-oxetanyl) methoxy] benzene, 1,3-bis [(3-ethyl-3-oxetanyl) methoxy] benzene, 3,7-bis (3-oxetanyl) ) -5-oxa-nonane, 1,4-bis [(3-ethyl-3-oxetanylmethoxy) methyl] benzene, 1,2-bis [(3-ethyl-3-oxetanylmethoxy) methyl] ethane, 2-bis [(3-ethyl-3-oxetanylmethoxy) methyl] propane, ethylene glycol bis (3-ethyl-3-oxetanylmethyl) ether, dicyclo Pentenyl bis (3-ethyl-3-oxetanylmethyl) ether, triethylene glycol bis (3-ethyl-3-oxetanylmethyl) ether, tetraethylene glycol bis (3-ethyl-3-oxetanylmethyl) ether, tricyclodecandi Irdimethylenebis (3-ethyl-3-oxetanylmethyl) ether, 1,4-bis [(3-ethyl-3-oxetanylmethoxy) methyl] butane, 1,6-bis [(3-ethyl-3-oxetanylmethoxy) ) Methyl] hexane, polyethylene glycol bis (3-ethyl-3-oxetanylmethyl) ether, EO-modified bisphenol A bis (3-ethyl-3-oxetanylmethyl) ether, PO-modified bisphenol A bis (3-ethyl-3-oxetanyl) Methyl) ether, O-modified hydrogenated bisphenol A bis (3-ethyl-3-oxetanylmethyl) ether, PO-modified hydrogenated bisphenol A bis (3-ethyl-3-oxetanylmethyl) ether, EO-modified bisphenol F bis (3-ethyl-3- Oxetanylmethyl) ether and the like. Specific examples of the polymerizable monomer having 3 to 5 oxetane rings include trimethylolpropane tris (3-ethyl-3-oxetanylmethyl) ether, pentaerythritol tris (3-ethyl-3-oxetanylmethyl) ether, and pentaerythritol. Examples include tetrakis (3-ethyl-3-oxetanylmethyl) ether, dipentaerythritol pentakis (3-ethyl-3-oxetanylmethyl) ether, and the like.

  Examples of the glycidyl ether type epoxy compound include di- or polyglycidyl ethers of polyhydric phenols having an aromatic nucleus or alkylene oxide adducts thereof, dihydric or polyglycidyl ethers of aliphatic polyhydric alcohols or alkylene oxide adducts thereof. Examples include ether. Specifically, di- or polyglycidyl ethers of bisphenol A, bisphenol F, bisphenol S, hydrogenated bisphenol A, hydrogenated bisphenol F, hydrogenated bisphenol S, bisphenol fluorene, or alkylene oxide adducts of these phenols; ethylene glycol, Diglycidyl ethers of alkylene glycols such as propylene glycol, 1,4-butanediol, 1,6-hexanediol or alkylene oxide adducts thereof; diglycidyl ethers of polyalkylene glycols such as polyethylene glycol and polypropylene glycol; neopentyl glycol; Diglycidyl ethers of dibromoneopentyl glycol or alkylene oxide adducts of these glycols; trimethylolethane; Dimethyl or triglycidyl ethers of dimethylolpropane, glycerin or alkylene oxide adducts of these trihydric alcohols; polyaltoyl such as di, tri or tetraglycidyl ethers of pentaerythritol or polyglycidyl ethers of alkylene oxide adducts thereof; novolak type And epoxy compounds; cresol novolac resins; and compounds in which the aromatic nucleus of these compounds is halogen-substituted.

  Furthermore, as the alicyclic epoxy compound, for example, cyclohexene obtained by epoxidizing a compound having a cycloalkane ring such as cyclohexene or cyclopentene ring with an appropriate oxidizing agent such as hydrogen peroxide or peracid. Examples thereof include oxides or cyclopentene oxide-containing compounds. Specifically, 3,4-epoxycyclohexylmethyl-3 ′, 4′-epoxycyclohexanecarboxylate, 2- (3,4-epoxycyclohexyl-5,5-spiro-3,4-epoxy) cyclohexane-meta- Dioxane, bis (3,4-epoxycyclohexylmethyl) adipate, vinylcyclohexylene oxide, 4-vinylepoxycyclohexane, bis (3,4-epoxy-6-methylcyclohexylmethyl) adipate, 3,4-epoxy-6-methylcyclohexyl -3 ', 4'-epoxy-6'-methylcyclohexanecarboxylate, methylenebis (3,4-epoxycyclohexane), dicyclopentadiene diepoxide, di (3,4-epoxycyclohexylmethyl) ether of ethylene glycol, Renbis (3,4-epoxycyclohexanecarboxylate), epoxidized tetrabenzyl alcohol, lactone-modified 3,4-epoxycyclohexylmethyl-3 ′, 4′-epoxycyclohexanecarboxylate, lactone-modified epoxidized tetrahydrobenzyl alcohol, cyclohexene oxide, etc. Is mentioned. A spiro orthocarbonate compound can also be used as the cationic polymerization compound.

Examples of commercially available cationic polymerization photopolymerization initiators include UVI-6950 and UVI-6970 (bis [4- (di (4- (2-hydroxyethyl) phenyl) sulfonio) -phenyl] manufactured by Union Carbide. Sulfide], UVI-6974 (a mixture of bis [4-diphenylsulfonio] -phenyl) sulfide bishexafluoroantimonate and diphenyl-4-thiophenoxyphenylsulfonium hexafluoroantimonate), UVI-6990 (hexafluoro of UVI 6974). Salt of phosphate), Adekaoptomer SP-151, SP-170 (bis [4- (di (4- (2-hydroxyethyl) phenyl) sulfonio) -phenylsulfide], SP manufactured by Asahi Denka Kogyo Co., Ltd.), SP -150 (hexafluoro of SP-170 Sufeito), Ciba-Geigy Corp. Irgacure 261 (η ⁵ -2,4- cyclopentadien-1-yl) [(1,2,3,4,5,6-η) - (1- methylethyl) benzene] - Iron (1 +)-hexafluorophosphate (1-)), CI-2481, CI-5102, CI-2855, CI-2085CD-1010 manufactured by Nippon Soda Co., Ltd., KI85, CD-1011 manufactured by Sartomer, CD-1012 (4- (2-hydroxytetradecanyloxy) diphenyliodonium hexafluoroantimonate), DTS-102, DTS-103, NAT-103, NDS-103 ((4-hydroxy Naphthyl) -dimethylsulfonium hexafluoroantimonate), TPS-102 (triphenylsulfo) Nium hexafluorophosphate), TPS-103 (triphenylsulfonium hexafluoroantimonate), MDS-103 (4-methoxyphenyl-diphenylsulfonium hexafluoroantimonate), MPI-103 (4-methoxyphenyliodonium hexafluoroantimonate) ), BBI-101 (bis (4-tert-butylphenyl) iodonium tetrafluoroborate), BBI-102 (bis (4-tert-butylphenyl) iodonium hexafluorophosphate), BBI-103 (bis (4-tert- Phenyl) iodonium hexafluoroantimonate), Degussa K126 (bis [4- (diphenylsulfonio) -phenyl] sulfide bishexafluoro, manufactured by Degussa) Phosphite), Rhodesyl Photoinitiator 2074 manufactured by Rhodia, etc. can be used. These can be used alone or in combination of two or more.

  In the photopolymerization type photosensitive resin, a thermoplastic resin may be further added as desired. As other additives, for example, an ultraviolet absorber, an anti-aging agent, a dye, a processing aid and the like are contained. It may be.

  Thermosetting materials include silicon materials, polydimethylsiloxane (PDMS), (meth) acrylic resins, fluorinated (meth) acrylic resins, polyimide resins, fluorinated polyimide resins, epoxy resins, and polyesters. Resin, polyarylate resin, fluorine resin, and deuterated products of these resins. These materials may be used singly or as a blend, and in the case of blending, the materials to be blended may take a structure (IPN structure) in which the three-dimensional network structure of each material is interpenetrated. A component of the above material may be used as a block to form a copolymer. The thermosetting material can contain, for example, an organic peroxide as a thermal polymerization initiator (thermosetting agent). Examples of the organic peroxide include 2,5-dimethylhexane- 2,5-dihydroperoxide, 2,5-dimethyl-2,5-di (t-butylperoxy) hexyne-3, di-t-butyl peroxide, t-butylcumyl peroxide, 2,5- Dimethyl-2,5-di (t-butylperoxy) hexane, dicumyl peroxide, α, α′-bis (t-butylperoxyisopropyl) benzene, n-butyl-4,4′-bis (t- Butylperoxy) valerate, 1,1-bis (t-butylperoxy) cyclohexane, 1,1-bis (t-butylperoxy) -3,3,5-trimethylcyclohexane, t-butyl Luperoxybenzoate, benzoyl peroxide, t-butyl peroxyacetate, methyl ethyl ketone peroxide, 2,5-dimethylhexyl-2,5-bisperoxybenzoate, butyl hydroperoxide, p-menthane hydroperoxide, p-chloro Benzoyl peroxide, hydroxyheptyl peroxide, chlorohexanone peroxide, octanoyl peroxide, decanoyl peroxide, lauroyl peroxide, cumyl peroxy octoate, succinic acid peroxide, acetyl peroxide, t-butyl peroxide ( 2-ethylhexanoate), m-toluoyl peroxide, benzoyl peroxide, t-butylperoxyisobutyrate, 2,4 Dichlorobenzoyl peroxide, and the like. As the organic peroxide, at least one of them is used alone or as a mixture, and the addition amount is usually 0.1 to 10 parts by weight with respect to 100 parts by weight of the polymer.

  Here, in the present invention, when the resin layer 34 is formed only from the photocuring material, preferably, the photocuring material contains two or more kinds of photopolymerization initiators corresponding to light of different wavelengths. It is preferable to make it. By using at least two types of photopolymerization initiators and curing with at least two types of irradiation light having different wavelengths, a desired refractive index difference is formed between the optical connection portion 34a and the surrounding region 34b. It becomes possible. On the other hand, when the resin layer 34 is formed from a photocuring material and a thermosetting material, one or more photopolymerization initiators are contained in the photocuring material and at least one type of thermal polymerization is started in the thermosetting material. It is preferable to contain an agent, and in this case, the same effect can be obtained.

  In addition, it is also preferable to include one or more dyes having absorption in the near-infrared or longer wavelength region, specifically, in the wavelength region of about 780 nm or more in the photocurable material. As such a dye, for example, a so-called photothermal conversion dye that absorbs light of a specific wavelength and generates heat can be used, and a dye that is decomposed by heating and decreases in absorption at the wavelength is preferably used. it can. Specifically, examples of the photothermal conversion dye that absorbs light having a wavelength of 850 nm, generates heat, and decomposes by heating include cyanine dyes and phthalocyanine dyes.

  In the optical device 100 of the present invention, as shown in the drawing, the optical elements 22 and 23 are mounted on the printed wiring board 10 using a non-conductive film 32. According to the non-conductive film 32, a crosslinked structure is formed at the time of curing, and high adhesiveness, excellent durability, and heat resistance are obtained. Therefore, the mounting structure using the non-conductive film 32 can improve the positional accuracy and reduce the connection loss, and can also contribute to the improvement of productivity. Moreover, since solder is not used as in the prior art, there is an advantage that it is environmentally friendly.

  The non-conductive film 32 is not particularly limited, but a film formed by forming a thermosetting adhesive composition mainly composed of a polyester unsaturated compound into a film shape is preferably used. Can do.

  Such polyester unsaturated compounds are radicals such as unsaturated polyesters obtained by reacting polybasic acids and polyhydric alcohols, and compounds in which (meth) acryloxy groups are introduced into saturated copolymer polyesters soluble in solvents It is a reaction curable polyester unsaturated compound. Specifically, such polyester unsaturated compounds are two types: (1) unsaturated polyester compounds, and (2) compounds in which (meth) acryloxy groups and / or methacryloxy groups are introduced into saturated polyesters. Such polyester unsaturated compounds are usually soluble in organic solvents such as acetone, methyl ethyl ketone (MEK), ethyl acetate, cellosolve acetate, dioxane, tetrahydrofuran (THF), benzene, cyclohexanone, Solvesso 100 and the like.

  Here, the saturated copolyester soluble in the solvent is mainly composed of terephthalic acid and ethylene glycol and / or 1,4-butanediol, and 5 to 50 mol% of phthalic acid and isophthalic acid in the total acid components. 1,3-propanediol, 2,2-dimethyl-1,3-propanediol, in an amount of 5 to 50 mol% of acid components such as adipic acid, sebacic acid, dodecanoic acid and / or all alcohol components, One or more alcohol components such as 2-diethyl-1,3-propanediol, 2-ethyl-2-butyl-1,3-propanediol, 1,6-hexanediol and 1,9-nonanediol Copolymerized with

  As a method for introducing a (meth) acryloxy group into such a saturated copolymerized polyester, (1) a method of reacting an isocyanate alkyl (meth) acrylate with a hydroxyl group of the saturated copolymerized polyester, (2) an alkyl (meth) acrylate And (3) reacting an isocyanate alkyl (meth) acrylate obtained by the reaction of a diisocyanate compound and a hydroxyalkyl (meth) acrylate with a hydroxyl group of the saturated copolymerized polyester. Method.

  In the present invention, those having a number average molecular weight of 2,000 to 6,000 can be suitably used as the polyester unsaturated compound. When the number average molecular weight exceeds 6,000, sufficient fluidity cannot be obtained, and when the number average molecular weight is less than 2,000, the adhesiveness is poor. The preferred number average molecular weight of such a polyester unsaturated compound is particularly 3,000 to 5,000.

  Accordingly, when the polyester unsaturated compound is a saturated copolymer polyester having a (meth) acryloxy group introduced, a (meth) acryloxy group is introduced into the saturated copolymer polyester having a number average molecular weight of about 2,000 to 6,000. Thus, the polyester unsaturated compound according to the present invention can be obtained.

  Moreover, it is also possible to ensure good fluidity by blending a polyester unsaturated compound having a number average molecular weight in the above range with a polyester unsaturated compound having a number average molecular weight outside the above range.

In the present invention, in order to improve or adjust the physical properties (mechanical strength, adhesiveness, optical properties, heat resistance, moisture resistance, weather resistance, crosslinking speed, etc.) of the nonconductive film, It is preferable to blend a reactive compound (monomer) having an acryloxy group, a methacryloxy group or an epoxy group. As this reactive compound, acrylic acid or methacrylic acid derivatives, for example, esters and amides thereof are most common, and in addition to alkyl groups such as methyl, ethyl, dodecyl, stearyl, lauryl as ester residues, Examples include a cyclohexyl group, a tetrahydrofurfuryl group, an aminoethyl group, a 2-hydroxyethyl group, a 3-hydroxypropyl group, and a 3-chloro-2-hydroxypropyl group. Further, esters with polyfunctional alcohols such as ethylene glycol, triethylene glycol, polypropylene glycol, polyethylene glycol, trimethylolpropane, and pentaerythritol are also used. A typical amide is diacetone acrylamide. Examples of the polyfunctional crosslinking aid include acrylic acid or methacrylic acid ester such as trimethylolpropane, pentaerythritol, and glycerin. Examples of the epoxy group-containing compound include triglycidyl tris (2-hydroxyethyl) isocyanurate, neopentyl glycol diglycidyl ether, 1,6-hexanediol diglycidyl ether, allyl glycidyl ether, 2-ethylhexyl glycidyl ether, and phenyl glycidyl. Examples include ether, phenol (EO) ₅ glycidyl ether, pt-butylphenyl glycidyl ether, adipic acid diglycidyl ester, phthalic acid diglycidyl ester, glycidyl methacrylate, and butyl glycidyl ether. Moreover, the same effect can be acquired by alloying the polymer containing an epoxy group.

  These reactive compounds are used as one or a mixture of two or more, usually added in an amount of 0.5 to 80 parts by weight, preferably 0.5 to 70 parts by weight, based on 100 parts by weight of the polyester unsaturated compound. . When this compounding quantity exceeds 80 weight part, workability | operativity at the time of preparation of an adhesive agent and film forming property may be reduced.

  Moreover, an organic peroxide is mix | blended with an adhesive resin composition as a hardening | curing agent. Any organic peroxide can be used as long as it decomposes at a temperature of 70 ° C. or higher to generate radicals, but preferably has a decomposition temperature of 50 ° C. or higher with a half-life of 10 hours. The film temperature, preparation conditions, curing (bonding) temperature, heat resistance of the adherend, storage stability and the like are selected.

  Examples of usable organic peroxides include 2,5-dimethylhexane-2,5-dihydroperoxide, 2,5-dimethyl-2,5-di (t-butylperoxy) hexyne 3, and di- t-butyl peroxide, t-butylcumyl peroxide, 2,5-dimethyl-2,5-di (t-butylperoxy) hexane, dicumyl peroxide, α, α′-bis (t-butylperoxy) Isopropyl) benzene, n-butyl-4,4′-bis (t-butylperoxy) valerate, 1,1-bis (t-butylperoxy) cyclohexane, 1,1-bis (t-butylperoxy)- 3,3,5-trimethylcyclohexane, t-butyl peroxybenzoate, benzoyl peroxide, t-butyl peroxyacetate, methyl ethyl keto Peroxide, 2,5-dimethylhexyl-2,5-bisperoxybenzoate, butyl hydroperoxide, p-menthane hydroperoxide, p-chlorobenzoyl peroxide, hydroxyheptyl peroxide, chlorohexanone peroxide, octanoyl Peroxide, decanoyl peroxide, lauroyl peroxide, cumyl peroxy octoate, succinic acid peroxide, acetyl peroxide, t-butyl peroxy (2-ethylhexanoate), m-toluoyl peroxide, t -Butyl peroxyisobutyrate, 2,4-dichlorobenzoyl peroxide, etc. are mentioned. These organic peroxides may be used alone or in combination of two or more.

  Such an organic peroxide is preferably blended in an amount of 0.1 to 10 parts by weight with respect to 100 parts by weight of the polyester unsaturated compound.

  Moreover, such an organic peroxide can generally control the reaction start temperature (curing start temperature) of the composition by controlling the amount of the organic peroxide. For example, in order to obtain good fluidity of the non-conductive film, the reaction start temperature of the composition is delayed by reducing the amount of the organic peroxide, resulting in the fluidity of the composition at the start of the reaction. It is possible to improve.

  It is preferable to add a silane coupling agent as an adhesion promoter to the adhesive composition. As silane coupling agents, vinyltriethoxysilane, vinyltris (β-methoxyethoxy) silane, γ-methacryloxypropyltrimethoxysilane, vinyltriacetoxysilane, γ-glycidoxypropyltrimethoxysilane, γ-glycidoxy Propyltriethoxysilane, β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, vinyltrichlorosilane, γ-mercaptopropyltrimethoxysilane, γ-aminopropyltriethoxysilane, N-β- (aminoethyl) -γ -1 type, or 2 or more types of mixtures, such as aminopropyl trimethoxysilane, is used.

  The amount of these silane coupling agents added is usually 0.01 to 5 parts by weight per 100 parts by weight of the polyester unsaturated compound.

  In addition, a hydrocarbon resin can be added to the adhesive composition for the purpose of improving processability and bonding properties. In this case, the added hydrocarbon resin may be either a natural resin type or a synthetic resin type. In the natural resin system, rosin, rosin derivatives, and terpene resins are preferably used. For rosin, gum-based resins, tall oil-based resins, and wood-based resins can be used. As the rosin derivative, rosin obtained by hydrogenation, heterogeneity, polymerization, esterification, or metal chloride can be used. As the terpene resin, a terpene phenol resin can be used in addition to a terpene resin such as α-pinene and β-pinene. Moreover, you may use danmaru, koval, and shellac as another natural resin. On the other hand, in the synthetic resin system, petroleum resin, phenol resin, and xylene resin are preferably used. For petroleum resins, aliphatic petroleum resins, aromatic petroleum resins, alicyclic petroleum resins, copolymer petroleum resins, hydrogenated petroleum resins, pure monomer petroleum resins, coumarone indene resins can be used. . As the phenolic resin, an alkylphenol resin or a modified phenol resin can be used. As the xylene-based resin, a xylene resin or a modified xylene resin can be used.

  Although the addition amount of such a hydrocarbon resin is appropriately selected, it is preferably 1 to 200 parts by weight, more preferably 1 to 100 parts by weight with respect to 100 parts by weight of the polyester unsaturated compound.

  In addition to the above additives, an anti-aging agent, an ultraviolet absorber, a dye, a processing aid, and the like may be used in the adhesive composition as long as the object of the present invention is not impaired.

  The adhesive composition constituting the non-conductive film according to the present invention has a fluidity of 1000 Pa · s or less, particularly 50 as the viscosity at the reaction start temperature measured by shear-type viscoelasticity measurement using a parallel plate. It is preferably ~ 800 Pa · s. Therefore, it is desirable to appropriately adjust the blending amount of the polyester unsaturated compound and various additives so that such fluidity can be obtained.

  The non-conductive film according to the present invention is prepared by uniformly mixing the polyester unsaturated compound resin with the above-mentioned additives in a predetermined composition, kneading with an extruder, roll, etc., and then calender roll, T-die extrusion, inflation, etc. It is manufactured by forming a film in a predetermined shape by the film forming method. In the film formation, embossing may be performed for the purpose of preventing blocking and facilitating pressure bonding with the adherend.

  In order to bond the non-conductive film thus obtained to the adherend, a conventional method, for example, a bonding method using a hot press, a direct lamination method using an extruder or a calendar, a thermocompression bonding method using a film laminator, etc. Can be used.

  In addition, each component is uniformly dissolved in a solvent that does not affect the member (separator), applied uniformly to the surface of the member (separator), and other adherends (polyimide, copper foil, etc.) are temporarily bonded. Then, it can be bonded by thermosetting.

  The curing conditions for the non-conductive film according to the present invention depend on the type of organic peroxide used, but are usually 70 to 230 ° C., preferably 70 to 150 ° C., usually 10 seconds to 120 minutes, preferably 20 Seconds to 60 minutes. At the time of adhesion, a pressure of 20 gf to 10000 gf can be applied as a pressure per bump of the IC chip mounting substrate, and preferably 20 gf to 1000 gf.

  Further, the thickness of the non-conductive film is not particularly limited, but can be, for example, about 5 to 100 μm, and the thickness can be appropriately controlled according to the thickness of the opposing electrode.

  In the optical device 100 of the present invention, only the point that the optical connection portion 34a as described above is provided between the optical waveguide 11 and the optical elements 22 and 23, and the mounting is performed using a non-conductive film. There are no particular restrictions on the specific structure and materials of other parts.

  For example, the optical waveguide 11 according to the present invention includes not only one in which a core is formed on or between clads, but also one in which optical fibers are arranged in parallel on a substrate and formed in a waveguide shape. It is. Therefore, there are no particular restrictions on the plane and cross-sectional shape of the cladding and core. In addition, as the material of the optical waveguide 11, it is possible to use known organic materials and inorganic materials (including various photo-curing materials and thermosetting materials mentioned above) that are usually used as a core or cladding material in this field. It is preferable to have excellent transparency and low loss in the signal wavelength band to be used. Specifically, for example, various required monomers such as photocuring materials, thermosetting materials, thermoplastic materials (including solutions), oligomers (including solutions), polymer solutions, and the required properties such as transparency and heat resistance. From the viewpoint of the above, it can be appropriately selected and used. In particular, a film waveguide using an organic polymer material is preferable from the viewpoint of easy handling and processing. Since the core needs to be formed with a higher refractive index than the clad, it needs to be selected in relation to the material of each other layer.

（式中、Ｒ¹は水素原子またはメチル基を表し、Ｒ²は炭素数８〜２０のアルキル基を表す）で表される化合物、ジ（メタ）アクリルエステル、トリ（メタ）アクリルエステル、さらには、スチレン、ジビニルベンゼン等のスチレン系モノマーなどを挙げることができる。 Among the above monomers, for example, acrylic acid, methacrylic acid and their lower alcohol esters, the following general formula (1),

(Wherein R ¹ represents a hydrogen atom or a methyl group, and R ² represents an alkyl group having 8 to 20 carbon atoms), a di (meth) acryl ester, a tri (meth) acryl ester, May include styrene monomers such as styrene and divinylbenzene.

  Examples of the lower alcohol of the lower alcohol ester of acrylic acid and methacrylic acid include monohydric alcohols having 1 to 5 carbon atoms, preferably 1 to 3 carbon atoms, more preferably methanol.

Moreover, in the compound represented by the general formula (1), R ² representing a higher alkyl group having 8 to 20 carbon atoms preferably has 10 to 16 carbon atoms, more preferably 12 to 14 carbon atoms. The higher alkyl group R ² may be a single alkyl group or a mixed alkyl group, but is most preferably a mixed alkyl group having 12 and 13 carbon atoms. In this case, the ratio of the alkyl group having 12 carbon atoms and the alkyl group having 13 carbon atoms, that is, the ratio of dodecyl (meth) acrylate and tridecyl (meth) acrylate is usually 20:80 to 80:20, and particularly preferably 40:60 to 60:40.

において、ｎが１〜１５、特に１〜１０のものが好ましい。 Di (meth) acrylic esters include diesters of ethylene glycol and (meth) acrylic acid, diesters of polyethylene glycol and (meth) acrylic acid, diols having 3 to 6 carbon atoms in the alkyl chain, and (meth) acrylic acid. And a diester. Examples of tri (meth) acrylic esters include triesters of triols having 3 to 6 carbon atoms in the alkyl chain and (meth) acrylic acid. In addition, as polyethyleneglycol which comprises diester of polyethyleneglycol and (meth) acrylic acid, the following general formula (2),

In which n is 1 to 15, particularly 1 to 10.

  As a method for forming a layer by polymerizing or copolymerizing the above monomers, a curing method using heat or light is generally used, but is not particularly limited. In general, in the case of thermosetting, t-butyl hydroperoxide, di-t-butyl peroxide, lauroyl peroxide, benzoyl peroxide, dimyristyl peroxydicarbonate, t-butyl peroxyacetate, t- Polymerization initiators such as organic peroxides such as butyl peroxy (2-ethylhexanoate) and cumyl peroxy octoate, azo compounds such as azobisisobutyronitrile and azobiscyclohexanenitrile are added, and 50 to A method of polymerizing at 120 ° C. for 1 to 20 hours can be employed. In addition, as a polymerization initiator in the case of photocuring, ketal compounds such as benzyl methyl ketal and acetophenone diethyl ketal, ketone compounds such as α-hydroxyketone, Michler's ketone, α-hydroxycyclohexyl phenyl ketone, and benzophenones such as benzophenone A compound, a metallocene compound such as metallocene, a benzoin compound such as benzoin isopropyl ether, and the like are preferably used.

  In addition, together with the above monomers, one or more of phosphoric acid ester, aromatic carboxylic acid ester, aliphatic carboxylic acid, aliphatic carboxylic acid ester, glycols and glycol (meth) acrylates may be blended and used. From the point of preventing white turbidity when left for a long time under high temperature and high humidity.

  Examples of the polymer include (meth) acrylic resin ((meth) acrylic acid ester), fluorinated (meth) acrylic resin, polycarbonate (PC), polyethylene terephthalate (PET), and polybutylene terephthalate (PBT). Polyester resin (crystal, amorphous), polysilane, polyethersulfone, polynorbornene, epoxy resin, for example, bisphenol A type, novolac type epoxy resin and polyaminoamide, modified polyaminoamide, modified aromatic polyamine, modified Mixed cured products with curing agents with active hydrogen such as aliphatic polyamines, modified alicyclic polyamines, phenols, polyaryls, polyimides (PI), fluorinated polyimides, polycarbodiimides, polyetherimides, polyamideimides, polyesters Amide, polyamide (PA), polystyrene (PS), acrylonitrile-styrene copolymer (AS), methyl methacrylate-styrene copolymer (MS, MMA-St), styrene-butadiene block copolymer (SBS), acrylonitrile- Styrenic resins such as butadiene-styrene copolymer (ABS) (among others, SBS and ABS have the advantage of excellent impact resistance), polyarylene ethers such as polyphenylene ether, polyarylate (PAR), polyacetal, polyphenylene sulfide, Polysulfone, polyether ketones such as polyether ether ketone and polyether ketone ketone, polyvinyl alcohol, polyvinyl pyrrolidone, styrene-ethylene-butadiene-styrene block polymer (SEBS), fluoride Vinylidene resins, hexafluoropropylene resins, and the like can be illustrated fluorine-based resins such as hexafluoroacetone-based resin, among others, (meth) acrylic resin is preferable.

  Other transparent resins include polyvinyl chloride (PVC), cycloolefin polymer (trade name: Arton (JSR Co., Ltd.), Zeonex (Nippon Zeon Co., Ltd., etc.), polypropylene (PP), polyethylene (PE), Examples include triacetyl cellulose (TAC) resin, polyether sulfone (PES), phenol resin, polysulfone (PSF) resin, etc. Among them, styrene resins, particularly those starting from monomers or low molecular weight materials MS resin, (meth) acrylic resin, and epoxy resin.

  In addition to copolymers of acrylic acid, methacrylic acid and their lower alcohol esters and styrenic monomers, transparent resins using monomers in which some or all of the above-described monomers are replaced with fluorine atoms, etc. Can also be used. Such core and clad materials can be used alone or in admixture of two or more. In the case of an optical waveguide having a structure in which the core is sandwiched between the upper and lower clads, the upper and lower clads are preferably formed using the same material from the viewpoint of reducing transmission loss.

  As a method for manufacturing the optical waveguide 11, for example, after forming the lower clad, the core material is applied, the core is formed by mask exposure, and the upper clad is further coated on the upper surface and the side surface. Or after forming the lower cladding, the core material is applied, and the core is formed by direct drawing by irradiation with radiation such as an electron beam, ultraviolet rays, or laser light, and a method using multilayer extrusion is used. A method using a so-called imprinting method (also referred to as a hot embossing method or a nanoimprinting method) is preferable, although it can be appropriately used and is not particularly limited.

  In the imprint process, either a thermal imprint method using a thermoplastic material or a thermosetting material or a photoimprint method using a photocuring material can be suitably employed as the material for the lower cladding. . Among these, when a thermoplastic material is used, the mold is pressed at a temperature equal to or higher than the glass transition point, and then the lower clad is cooled and cured before being released from the mold. A patterned lower clad can be formed. If a thermosetting material is used, the lower clad is thermally cured after pressing and before releasing from the mold. If a photocurable material is used, the pressing and releasing from the mold are performed in the same manner. The lower clad may be photocured before. In any case, since the lower clad can be cured before releasing from the mold, a core having a desired pattern shape can be formed without causing distortion.

  The imprint method does not require the development work required for the conventional lithography method, and has an advantage that it can be efficiently manufactured with a simple process. Further, since the beam system is unnecessary, the cost of the apparatus can be suppressed, and it is possible to contribute to cost reduction in that an expensive resist material such as a chemical amplification system is unnecessary. Furthermore, since the imprint method can transfer the pattern shape as it is, it can easily obtain the three-dimensional shape as designed, and various cross-sectional shapes such as curved surfaces that cannot be handled by the conventional lithography method. In addition, there is an advantage that an optical waveguide can be formed. However, in the imprint method, a dimensional change occurs due to heat shrinkage or photocuring shrinkage. Therefore, it is necessary to design the optical waveguide by predicting the amount of change in advance according to the material to be used. Also, it should be noted that the resolution is determined by the mold and that a resin residual film may be generated in the mold.

  Further, in the present invention, as shown in the drawing, a mirror 50, an optical pin, or a slit structure corresponding to the mirror 50 is provided in the portion of the optical waveguide 11 where signal light is exchanged with the optical elements 22 and 23. It is necessary to change the traveling direction of light. The mirror 50 can be provided at a certain angle with respect to the light traveling direction, for example, in a direction of 45 °. The mirror 50 can be manufactured by a dicing method using a blade, a laser method, or the like, or may be coated with gold or the like. Further, although not shown, a hard coat or a moisture absorption preventing layer can be laminated on the surface of the optical waveguide 11 as desired.

  In the present invention, an optical element includes both a light emitting element such as a VCSEL 22 and a light receiving element such as a PD 23. In the illustrated example, the optical element is sent from the outside via an optical fiber (not shown) and a connector 40. The transmitted signal light propagates through the optical waveguide 11 and is input to the PD 23 via the mirror 50, and then converted into an electrical signal by the PD 23 and sent to the IC chip mounting substrate 20.

  Here, as shown in the figure, the IC chip mounting substrate 20 is flip-chip mounted on the printed wiring board 10 on which the optical waveguide 11 is formed via the protruding electrode 31 and the non-conductive film 32, so that the joint portion is formed. Reliability and heat resistance can be ensured. In this case, the IC chip mounting substrate 20 and the printed wiring board 10 are electrically connected via the non-conductive film 32.

  In producing the optical device of the present invention, as shown in FIGS. 3A to 3D, first, (a) after obtaining a printed wiring board 10 in which an optical waveguide 11 is provided according to a conventional method, (B) A non-conductive film 32 is temporarily pressure-bonded to a region on the printed wiring board 10 excluding at least the opening 12 (temporary pressure bonding step), and (c) at least the opening 12 on the printed wiring board 10 is included. The region is filled with a photocuring material for forming the resin layer 34 or a mixture of the photocuring material and the thermosetting material (filling step). Thereafter, (d) the IC chip mounting substrate 20 is flip-chip mounted (mounting process) on the non-conductive film 32 and the filled light curable material (or a mixture of the light curable material and the heat curable material), thereby printing. A structure in which a photocurable material (or a mixture of a photocurable material and a thermosetting material) is disposed between the wiring board 10 and the IC chip mounting substrate 20 can be formed (see FIG. 1).

  In the present invention, as shown in FIGS. 4A to 4D, (b) after the temporary pressure bonding step of the anisotropic conductive film 32, (c) an IC chip on the anisotropic conductive film 32. The mounting substrate 20 may be mounted (mounting process), and then (d) a filling process of filling a region on the wiring board including at least the opening with a photocurable material may be performed.

  Next, when the resin layer 34 is formed only from the photocuring component, the optical connection portion 34a is cured and formed by partial light irradiation on the filled photocuring material (photoconnection portion forming step), and further, the photocuring material. The entire resin layer 34 is cured by secondary light irradiation on the entire surface (resin layer curing step). Here, when hardening the whole resin layer 34, you may heat together with light irradiation as needed. When the resin layer 34 is formed of a photocuring component and a thermosetting component, the optical connecting portion 34a is cured and formed by partial light irradiation with respect to the filled photocurable material and thermosetting material mixture (optical connecting portion). Next, the entire resin layer 34 is cured by heat treatment on the entire mixture (resin layer curing step). The non-conductive film 32 is cured in a mounting process in which the IC chip mounting substrate 20 is mounted, heated, and pressurized.

  Here, the partial light irradiation for forming the optical connection portion 34 a is generated by the light emitted from the optical elements 22 and 23 or by an external light source such as a laser, and the optical elements 22 and 23 via the optical waveguide 11. This can be done with light propagating to 23. By using such a method, the optical connecting portion 34a can be accurately matched with the optical path between the optical waveguide and the optical element, and the optical connection between the two can be performed reliably and with low loss. More preferably, the optical connection portion 34a is formed by simultaneously using the light emitted from the optical element and the light generated by the external light source and propagating to the optical element via the optical waveguide 11. By using light propagating in both directions, a self-alignment effect of the optical path can be obtained, and an optical device with better connection reliability can be realized.

It is a schematic sectional drawing which shows one suitable structural example of the optical device of this invention. It is a schematic sectional drawing which shows one suitable structural example of the conventional optical device. It is explanatory drawing which shows a part of manufacturing process of the optical device of this invention. It is explanatory drawing which shows a part of manufacturing process of the other optical device of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Printed wiring board 11 Optical waveguide 12 Opening part 22 Surface emitting semiconductor laser (VCSEL)
23 Photodiode (PD)
20 IC chip mounting substrate 31 Protruding electrode 32 Non-conductive film 33 Underfill material 34 Resin layer 34a Optical connection part 34b Surrounding area 35 Solder ball 40 Connector 50 Mirror 100, 200 Optical device (photoelectric hybrid wiring board)

Claims (14)

  A resin layer made of a photo-curing material is disposed between the optical element and an optical waveguide provided in a wiring board having an opening at a portion facing at least the optical element. An optical connection portion having a higher refractive index than the surroundings is formed to optically connect the optical element and the optical waveguide, and the optical element is mounted on the wiring board via a non-conductive film. An optical device featuring.   The optical device according to claim 1, wherein the photocurable material contains two or more kinds of photopolymerization initiators.   The optical device according to claim 1, wherein the photocurable material contains one or more dyes having absorption in a near-infrared or longer wavelength region.   A resin layer made of a photo-curing material and a thermo-curing material is disposed between the optical waveguide provided in the wiring board and the optical element, and the optical waveguide and the optical element are optically connected in the resin layer. An optical device in which an optical connection portion having a higher refractive index than the surroundings is formed, and the optical element is mounted on the wiring board via a non-conductive film. The optical device according to claim 4, wherein the photocurable material includes one or more photopolymerization initiators, and the thermosetting material includes one or more thermal polymerization initiators.   The optical device according to claim 4, wherein the photocurable material contains one or more dyes having absorption in a near-infrared or longer wavelength region.   The optical device according to claim 1, wherein the optical element is a light emitting element or a light receiving element.   4. The method of manufacturing an optical device according to claim 1, wherein the non-conductive film is temporarily pressure-bonded on a wiring board in which the optical waveguide is provided, at least in a region excluding the opening. 5. Temporary crimping step, filling step of filling a region including at least the opening on the wiring board with a photo-curing material, and mounting for mounting the optical element on the non-conductive film and the filled photo-curing material A step of curing the optical connection portion by partially irradiating the photocuring material with light, and a resin for curing the entire resin layer by secondary light irradiation of the entire photocurable material. A method of manufacturing the optical device, comprising: a layer curing step.   4. The method of manufacturing an optical device according to claim 1, wherein the non-conductive film is temporarily pressure-bonded to a region excluding at least the opening on the wiring board in which the optical waveguide is provided. 5. A temporary crimping step, a mounting step of mounting the optical element on the non-conductive film, a filling step of filling a region including at least the opening on the wiring board with a photo-curing material, and the photo-curing material An optical connection portion forming step of curing and forming the optical connection portion by partial light irradiation, and a resin layer curing step of curing the entire resin layer by secondary light irradiation to the entire photocurable material. A method for manufacturing an optical device.   7. The method of manufacturing an optical device according to claim 4, wherein the non-conductive film is temporarily pressure-bonded to a region excluding at least the opening on a wiring board in which the optical waveguide is provided. A temporary press-bonding step, a filling step of filling a region including at least the opening on the wiring board with a mixture of a photocurable material and a thermosetting material, and the optical element on the non-conductive film and the filled mixture. A mounting step for mounting the optical connection portion, a light connection portion forming step for curing the optical connection portion by partial light irradiation on the mixture, and a resin layer curing step for curing the entire resin layer by heat treatment for the entire mixture, An optical device manufacturing method comprising:   7. The method of manufacturing an optical device according to claim 4, wherein the non-conductive film is temporarily pressure-bonded to a region excluding at least the opening on a wiring board in which the optical waveguide is provided. A temporary crimping step, a mounting step of mounting the optical element on the non-conductive film, and a filling step of filling a region of the wiring board including at least the opening with a mixture of a photo-curing material and a thermosetting material; An optical connection portion forming step of curing the optical connection portion by partial light irradiation on the mixture, and a resin layer curing step of curing the entire resin layer by a heat treatment on the entire mixture. A method for manufacturing an optical device.   The method for manufacturing an optical device according to claim 8, wherein the partial light irradiation is performed by light emitted from the optical element.   The method of manufacturing an optical device according to claim 8, wherein the partial light irradiation is performed by light generated by an external light source and propagating to the optical element through the optical waveguide. The partial light irradiation is performed simultaneously with light emitted from the optical element and light generated by an external light source and propagated to the optical element through the optical waveguide. The manufacturing method of the optical device of description.

Images